A method for observing wafer center adjacent markings

Abstract

The invention discloses a method for observing a center accessory mark of a wafer, relates to the field of wafer processing technology, and comprises the following steps: S1: the mark on the wafer is reflected onto a reflector through a light hole, the reflector reflects the light onto a left objective lens, and the mark on the right side of the Y-axis area of ​​the wafer can be observed; S2: when an electric push rod in the left objective lens is running, the moving end in the electric push rod drives a protrusion to move when it moves, the protrusion applies an extrusion force to drive an extrusion plate to move downward, the extrusion plate applies an extrusion force to drive a reset spring and push a slider on a sliding rheostat to move, so that the sliding rheostat controls the operation of a warning light to remind the reflector to adjust its angle to a position; both the left objective lens and the right objective lens are provided with a reflector or a reflecting prism, so that the light can be reflected by the reflector, enter the objective lens and be observed; so that the left and right objective lenses can simultaneously observe the mark in the "blind area" without crossing the Y-axis of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, in particular to a method for observing wafer center accessory marks. Background Art

[0002] Because the left and right alignment systems move as a whole, no matter which side of the wafer's Y-axis they move to, the objective lens on that side will be moved further away, making it impossible to observe the marks on that side of the "blind spot." These marks can only be observed through the objective lens on the opposite side. To observe the marks on the other side of the "blind spot," the entire system must be moved to the opposite side and then observed through the objective lens on that side. This solution cannot simultaneously observe the marks on both the left and right sides of the "blind spot," and the back-and-forth movement of the entire system is time-consuming. Summary of the Invention

[0003] Therefore, in order to solve the above-mentioned shortcomings, the present invention provides a method for observing a wafer center adjacent mark.

[0004] The present invention is achieved by constructing a method for observing a wafer center adjacent mark, comprising the following steps:

[0005] S1: The mark on the wafer is reflected by the light hole onto the reflector, which then reflects the light onto the left objective lens. The mark on the right side of the wafer's Y-axis area can be observed.

[0006] S2: When the electric push rod in the left objective lens is running, the moving end in the electric push rod moves, driving the bump to move. The bump exerts an extrusion force to drive the extrusion plate downward. The extrusion plate exerts an extrusion force to drive the reset spring and push the slider on the sliding rheostat to move, so that the sliding rheostat controls the warning light to operate, reminding the reflector to adjust the angle to the correct position.

[0007] S3: It can also control the elasticity of multiple sets of electromagnetic springs in the receiving plate during operation, that is, it can control the elastic force applied to the receiving plate, so that the receiving plate can be fine-tuned in the connecting plate, and the angle of the reflector can be fine-tuned by adjusting the receiving plate.

[0008] Preferably, a reflector is provided inside the left objective lens and the right objective lens, and a light hole is provided below the left objective lens and the right objective lens.

[0009] Preferably, the right objective lens has the same structure as the left objective lens.

[0010] Preferably, the reflecting mirror is rotatably connected to the left objective lens via a rotating shaft, and the other end of the reflecting mirror is rotatably connected to a receiving plate, and a plurality of sets of electromagnetic springs are fixedly connected to the outer peripheral wall of the receiving plate.

[0011] Preferably, the other end of the electromagnetic spring is fixedly connected to a connecting disk, the surface of the connecting disk is rotatably connected to the electric push rod, and the other end of the electric push rod is rotatably connected to the left objective lens.

[0012] Preferably, a protrusion is fixedly connected to the side wall of the movable end of the electric push rod, and an extrusion plate is slidably connected to the inner side wall of the electric push rod, and the extrusion plate is fixedly connected to the return spring through a sliding rod.

[0013] Preferably, the return spring is fixedly connected in the electric push rod, a sliding rheostat is fixedly connected below the sliding rod in the electric push rod, and the sliding piece on the sliding rheostat is fixedly connected to the sliding rod.

[0014] Preferably, a warning light is provided on the left objective lens, and the warning light is connected to the sliding rheostat via a cable.

[0015] Preferably, the reflector is fixedly connected to the left objective lens, and a reflective prism is fixedly connected below the light hole.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) Both the left and right objective lenses are equipped with reflective mirrors or reflective prisms, so that light can be reflected by the reflective mirrors, enter the objective lens and be observed; so that the left and right objective lenses can simultaneously observe the marks in the "blind area" without crossing the Y axis of the wafer.

[0018] (2) When the electric push rod is running, its moving end will drive the bump and the extrusion plate to move, and then push the slider on the sliding rheostat to move, thereby controlling the operating status of the warning light connected to it; the function of the warning light is to give a prompt when the angle of the reflector is adjusted to the right position to ensure the accuracy of observation.

[0019] (3) By controlling the elasticity of the electromagnetic spring during operation, that is, controlling the elastic force applied to the receiving plate, the angle of the reflector can be finely adjusted to meet the needs of high-precision observation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of the planar structure of the first embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the connection structure between the electric push rod and the reflector of the present invention;

[0022] Figure 3 1. It is a schematic structural diagram of the electric push rod of the present invention;

[0023] Figure 4 This is a schematic diagram of the internal structure of the electric push rod of the present invention;

[0024] Figure 5 It is a schematic diagram of the planar structure of the second embodiment of the present invention.

[0025] The components include: wafer 1, mark 2, left objective lens 3, rotating shaft 4, reflector 5, light hole 6, right objective lens 7, electric push rod 8, bump 9, extrusion plate 10, sliding rod 11, return spring 12, sliding rheostat 13, reflective prism 14, connecting plate 41, electromagnetic spring 42, and receiving plate 43. DETAILED DESCRIPTION

[0026] The following will be combined with the Figure 1-Figure 5 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly described. It is obvious that the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a central component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Embodiment 1;

[0030] See also Figures 1 to 4 , a method for observing the center accessory mark of a wafer of the present invention, a reflecting mirror 5 is provided in the left objective lens 3 and the right objective lens 7, and a light hole 6 is provided below the left objective lens 3 and the right objective lens 7; the reflecting mirror 5 is rotatably connected to the left objective lens 3 through a rotating shaft 4, and the left objective lens 3 can be driven to move by an external moving mechanism, and the other end of the reflecting mirror 5 is rotatably connected to a receiving plate 43, and a plurality of groups of electromagnetic springs 42 are fixedly connected to the outer peripheral wall of the receiving plate 43, and the other end of the electromagnetic spring 42 is fixedly connected to a connecting plate 41, and the surface of the connecting plate 41 is rotatably connected to an electric push rod 8, and the other end of the electric push rod 8 is rotatably connected to the left objective lens 3.

[0031] Specifically, a protrusion 9 is fixedly connected to the side wall of the moving end of the electric push rod 8, and an extrusion plate 10 is slidably connected to the inner side wall of the electric push rod 8. The extrusion plate 10 is fixedly connected to a return spring 12 through a sliding rod 11. The return spring 12 is fixedly connected to the electric push rod 8. A sliding rheostat 13 is fixedly connected to the electric push rod 8 below the sliding rod 11. The slider on the sliding rheostat 13 is fixedly connected to the sliding rod 11.

[0032] Specifically, a warning light is provided on the left objective lens 3, and the warning light is connected to the sliding rheostat 13 via a cable;

[0033] Specifically, the right objective lens 7 has the same structure as the left objective lens 3 .

[0034] Specifically, the mark on the wafer is reflected onto the reflector 5 through the light hole 6, and the reflector 5 reflects the light onto the left objective lens 3, and the mark on the right side of the Y-axis area of ​​the wafer can be observed.

[0035] Specifically, when the electric push rod 8 is controlled to operate, the moving end inside the electric push rod 8 drives the protrusion 9 to move when it moves, and the protrusion 9 applies an extrusion force to drive the extrusion plate 10 to move downward, and the extrusion plate 10 applies an extrusion force to drive the return spring 12 and push the slider on the sliding rheostat 13 to move, so that the sliding rheostat 13 controls the operation of the warning light to remind the reflector 5 to adjust the angle to the position.

[0036] Specifically, the elasticity of the multiple sets of electromagnetic springs 42 in the receiving plate 43 during operation can be controlled, and the elastic force applied to the receiving plate 43 can be controlled, so that the receiving plate 43 can be fine-tuned in the connecting plate 41, and the angle of the reflector 5 can be fine-tuned by adjusting the receiving plate 43.

[0037] Embodiment 2;

[0038] See also Figure 5 Compared with the first embodiment, the present invention provides a method for observing the center accessory mark of a wafer. The present embodiment further includes: a reflecting mirror 5 is provided in the left objective lens 3 and the right objective lens 7, and a light hole 6 is provided below the left objective lens 3 and the right objective lens 7; the reflecting mirror 5 is fixedly connected to the left objective lens 3, and a reflecting prism 14 is fixedly connected below the light hole 6. The reflecting prism 14 is used to reflect the light on the surface of the wafer, and the mark 2 near the Y axis of the wafer can be inspected.

[0039] The above shows and describes the basic principles, main features and advantages of the present invention, and the standard parts used in the present invention can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0040] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for observing a wafer center proximity mark, characterized in that: The following steps are included: S1: The mark (2) on the wafer (1) is reflected onto the reflector (5) through the light hole (6). The reflector (5) reflects the light to the left objective lens (3) and the right objective lens (7), thereby detecting the mark (2) near the Y axis of the wafer (1); in: A reflective mirror (5) is provided in the left objective lens (3), and a light hole (6) is provided below the left objective lens (3); the reflective mirror (5) rotates in the left objective lens (3) via a rotation axis (4); The other end of the reflector (5) is rotatably connected to the receiving plate (43), the outer peripheral wall of the receiving plate (43) is fixedly connected to a plurality of sets of electromagnetic springs (42), the other end of the electromagnetic spring (42) is fixedly connected to the connecting plate (41), the surface of the connecting plate (41) is rotatably connected to the electric push rod (8), and the other end of the electric push rod (8) rotates in the left objective lens (3); The side wall of the moving end of the electric push rod (8) is fixedly connected to a protrusion (9), and the inner side wall of the electric push rod (8) is slidably connected to an extrusion plate (10), the extrusion plate (10) is fixedly connected to a return spring (12) via a sliding rod (11), the return spring (12) is fixedly connected in the electric push rod (8), and a sliding rheostat (13) is fixedly connected below the sliding rod (11) in the electric push rod (8), and a slide on the sliding rheostat (13) is fixedly connected to the sliding rod (11); A warning light is provided on the left objective lens (3), and the warning light is connected to the sliding rheostat (13) via a cable; The internal structure of the right objective lens (7) is the same as that of the left objective lens (3); S2: The protrusion (9) is driven to move by the moving end of the electric push rod (8), and the protrusion (9) presses the extrusion plate (10) connected to the slide, so that the extrusion plate (10) synchronously compresses the return spring (12) through the sliding rod (11) and pushes the slide of the sliding rheostat (13), lighting the warning light and indicating that the angle of the reflector (5) is adjusted to the position; S3: By independently adjusting the elastic force of multiple sets of electromagnetic springs (42), the receiving plate (43) is fine-tuned in the connecting plate (41), thereby driving the reflector (5) connected to the receiving plate (43) to perform angle fine-tuning; Wherein, the multiple groups of electromagnetic springs (42) are distributed in a circumferential manner.

2. The method for observing a wafer center proximity mark according to claim 1, wherein: A reflective prism (14) is fixedly connected below the light hole (6), and the reflective prism (14) reflects light on the surface of the wafer (1) to detect a mark (2) near the Y axis of the wafer (1).

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