An ion implanter with a cleaning function and its cleaning method

Abstract

The present application discloses an ion implanter with a cleaning function and a cleaning method thereof, relating to the technical field of ion implantation equipment. By optimizing and improving the structure of the ion implanter in the prior art, a cleaning component is added; the cleaning component uses air pressure and its own deformation to efficiently and conveniently stick and remove the sundries adhered to the ion implanter; achieving the technical effect that the ion implanter can efficiently and conveniently replace manual labor to complete self-cleaning.

Description

Technical Field

[0001] The present invention relates to the technical field of ion implantation equipment, and in particular, to an ion implanter with a cleaning function and a cleaning method thereof. Background Art

[0002] An ion implanter is a type of high-voltage small accelerator with the largest number of applications. It obtains the required ions from an ion source, accelerates them to obtain an ion beam, and is used for ion implantation of semiconductor materials, large-scale integrated circuits, and devices. The ion beam generated by the ion implanter is implanted into a wafer.

[0003] In order to solve the technical problems in the prior art that the process of positioning a wafer during ion implantation processing of an ion implantation device is relatively cumbersome, the positioning process is likely to squeeze and damage the wafer, and the process of removing the processed wafer is likely to cause wafer damage and contamination, the Chinese invention patent with the patent number CN202311811471.6 discloses an ion implantation device for semiconductor processing. By optimizing and improving the structure of the ion implantation carrier plate in the prior art, a floating rod-shaped block with an insulating soft pad is used to contact the side of the wafer, and fixation is achieved by extrusion; the transfer of the wafer is assisted by controlling the up and down movement of the floating rod-shaped block.

[0004] For such ion implanters with a carrier plate, a target plate, and a clamping structure, in order to reduce cross-contamination, maintain process stability, and ensure chip performance and reliability, etc., it is generally necessary to manually clean the carrier plate, the target plate, and the clamping structure regularly to maintain a high standard of the entire semiconductor manufacturing process. The manual cleaning process is cumbersome, time-consuming, and requires shutdown cleaning, which is not conducive to the efficient progress of the process.

[0005] Therefore, there is a need for an ion implanter with a cleaning function to efficiently and conveniently achieve automatic cleaning of the ion implanter, so as to ensure a high standard and low labor intensity in the wafer processing process. Summary of the Invention

[0006] By providing an ion implanter with a cleaning function in an embodiment of the present application, the technical problems in the prior art that the ion implanter cannot perform automatic self-cleaning efficiently and conveniently, and the manual cleaning has a large labor intensity, a cumbersome process, and low efficiency are solved, and the technical effect that the ion implanter can efficiently and conveniently replace manual labor to complete self-cleaning is achieved.

[0007] An embodiment of the present application provides an ion implanter with a cleaning function, including a stage, and further including a cleaning component and a gas pump device communicated with a gas storage space;

[0008] The cleaning component includes a displacement guide rail positioned on the ground, a support vertical frame longitudinally arranged and sliding along the displacement guide rail and having a telescopic rod structure, a support cross plate, and a cleaning belt assembly;

[0009] The supporting horizontal plate is a rigid rectangular plate arranged horizontally and is fixed on the side wall of the supporting vertical frame. An O-shaped annular frame is positioned at the bottom.

[0010] The cleaning belt assembly is in an overall shape of a reel, and includes two horizontally arranged overhead drums and a cleaning belt. The overhead drums are arranged horizontally and are rotatably connected to the supporting horizontal plate. The cleaning belt is a strip-shaped elastic rubber film, with one side coated with adhesive. The two ends are respectively wound and positioned on the two overhead drums, and the non-adhesive surface closely adheres to the bottom surface of the annular frame. The annular frame, the supporting horizontal plate and the cleaning belt jointly enclose a closed rectangular block-shaped air storage space.

[0011] Preferably, the supporting horizontal plate is not in direct contact with the supporting vertical frame.

[0012] A rotating column body is positioned at the top of the supporting horizontal plate.

[0013] The rotating column body is a rigid column body arranged horizontally. One end is rotatably connected to the supporting vertical frame around its own axis and rotates under the drive of a motor.

[0014] When cleaning is required, control the rotation of the rotating column body to realize the rotation or even turnover of the supporting horizontal plate.

[0015] Preferably, the cleaning assembly further includes a shifting frame and a frame shifting assembly.

[0016] The shifting frame is an O-shaped rigid frame body. The top surface contour shape and size are the same as the bottom contour shape and size of the annular frame. It is located directly below the annular frame and its height is less than 3 cm.

[0017] The frame shifting assembly is used to drive the shifting frame to approach and move away from the annular frame. It is an electric telescopic rod structure, and the number is multiple. The position near one end is fixed on the side wall of the supporting horizontal plate, and the position near the other end is fixed on the side wall of the shifting frame.

[0018] Before cleaning is required, control the movement of the shifting frame to clamp the cleaning belt that is closely attached to the annular frame.

[0019] Furthermore, the number of the platforms is multiple. A tray capable of rotating around its own axis is positioned on the ground, and multiple platforms are evenly distributed on the tray.

[0020] Furthermore, it includes a platform and a shifting component.

[0021] Three sliding blocks arranged radially and sliding are positioned on the upper surface of the platform.

[0022] Three storage grooves are provided on the platform, and the storage grooves correspond to the sliding blocks one by one.

[0023] A floating rod is placed in each storage groove; the floating rod is longitudinally arranged, slidably positioned on the sliding block, and slides along the vertical direction;

[0024] A support telescopic body is provided at the bottom of the floating rod. The support telescopic body is a telescopic rod structure, longitudinally arranged, with a wheel body at the bottom and the top fixed to the bottom of the floating rod; when clamping the wafer, the sliding block slides to drive the floating rod to move closer to and clamp the wafer;

[0025] The floating rod is a hollow rod body in the shape of a quadrangular prism, with a strip-shaped buffer pad, an internal winding drum and a limiting rod inside. A rectangular front groove is provided on the surface away from the sliding block;

[0026] A front baffle plate longitudinally arranged and in the shape of a rectangular plate is fixed on the front groove, and both sides of the front baffle plate are fixed to the side walls of the front groove;

[0027] The limiting rod is a hard round rod arranged horizontally, with the end fixed to the inner wall of the floating rod, arranged near the bottom of the front groove and below the front groove;

[0028] The buffer pad passes through the space between the limiting rod and the inner wall of the floating rod, the bottom of the front baffle plate, the top of the front baffle plate in sequence, and finally winds around the internal winding drum.

[0029] Further, the main body of the displacement assembly is a clamping jaw or a vacuum chuck.

[0030] Preferably, when performing different clamping and positioning operations, the length of the support telescopic body is flexibly adjusted to improve the utilization rate of the buffer pad.

[0031] Preferably, the cleaning assembly can clean and maintain the carrier tray, the fixed clamping sheet body and the clamping soft block.

[0032] Preferably, a gas guide block is further included;

[0033] The gas guide block is a columnar block, longitudinally arranged, with the top fixed to the bottom of the support cross plate and surrounded by a circular frame;

[0034] A ring-shaped suction groove is provided on the bottom surface of the gas guide block, and the ring-shaped suction groove is communicated with the air pump device;

[0035] A block-shaped heating body is provided at a position near the center of the bottom surface of the gas guide block. The block-shaped heating body is an electric heating wire, which plays a role in melting through the cleaning belt after heating;

[0036] An air outlet groove and a suction groove are provided on the bottom surface of the gas guide block, both of which are communicated with the air pump device and surrounded by the block-shaped heating body.

[0037] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0038] By optimizing and improving the structure of the ion implanter in the prior art, a cleaning component is added; the cleaning component uses air pressure and its own deformation to efficiently and conveniently stick and clean the sundries adhered to the ion implanter; effectively solves the technical problems that the ion implanter in the prior art cannot efficiently and conveniently perform automatic self-cleaning, and the manual cleaning has a large labor intensity, a cumbersome process and low efficiency, and further realizes the technical effect that the ion implanter can efficiently and conveniently replace manual labor to complete self-cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 FIG. is a schematic structural diagram of the cleaning component of an ion implanter with a cleaning function;

[0040] Figure 2 FIG. is a simplified overall structural diagram of an ion implanter with a cleaning function;

[0041] Figure 3 FIG. is a schematic diagram of the positional relationship of the components of the cleaning component;

[0042] Figure 4 FIG. is a schematic structural diagram of the cleaning component;

[0043] Figure 5 FIG. is a simplified diagram of the positional relationship between the displacement frame and the cleaning belt of the cleaning component;

[0044] Figure 6 FIG. is a schematic internal structure diagram of the floating rod;

[0045] Figure 7 FIG. is a schematic diagram of the connection relationship between the air pump component and each component;

[0046] Figure 8 FIG. is a schematic diagram of the positional relationship between the air guide block and the support cross plate;

[0047] Figure 9 FIG. is a simplified structural diagram of the air guide block;

[0048] Figure 10 FIG. is a schematic diagram of the deformation state of the cleaning belt;

[0049] Figure 11 FIG. is a simplified structural diagram of the cleaning belt after deformation.

[0050] In the figure:

[0051] Stage 120, sliding block 130, floating rod 140, buffer pad 141, built-in reel 142, front groove 144, limit rod 145, front baffle 146, storage groove 150, support telescopic body 160, tray 200, displacement assembly 300, air pump device 370, displacement guide rail 410, support vertical frame 420, support horizontal plate 430, annular frame 431, rotating column 440, cleaning belt assembly 450, top reel 451, cleaning belt 452, displacement frame 460, frame displacement assembly 470, air guide block 480, annular suction groove 481, block-shaped heating element 482, air outlet groove 483, suction groove 484. Detailed implementation

[0052] To facilitate the understanding of the present invention, the following will describe the present application more comprehensively with reference to the relevant drawings; the drawings show the preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0053] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention; the terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0055] Embodiment 1

[0056] As Figures 1 to 5 shown, the ion implanter with a cleaning function of the present application includes a stage 120, a cleaning assembly and an air pump device 370.

[0057] The stage 120 is used to carry and clamp the wafer to be ion implanted, and a clamping mechanism is provided on its top surface, which is a prior art and will not be elaborated herein.

[0058] The cleaning assembly is used to clean the stage 120 and other components by sticking, and includes a displacement guide rail 410 positioned on the ground for guiding, a support vertical frame 420 longitudinally arranged and sliding along the displacement guide rail 410, a support horizontal plate 430 and a cleaning belt assembly 450;

[0059] The shifting guide rail 410 is arranged on the ground, and its existence enables the supporting upright frame 420 to approach and move away from the part to be cleaned;

[0060] The supporting upright frame 420 is of an electric telescopic rod structure and is used to carry and position the supporting cross plate 430;

[0061] The supporting cross plate 430 is a hard rectangular plate arranged horizontally and is used to carry and position the cleaning belt assembly 450, and one side wall is positioned on the side wall near the top end of the supporting upright frame 420;

[0062] A circular frame 431 is positioned at the bottom of the supporting cross plate 430; the circular frame 431 is a square-shaped frame body, arranged horizontally, with the top surface fixed to the bottom of the supporting cross plate 430 and the bottom surface edge being smooth; the circular frame 431 positioned on the supporting cross plate 430 and the supporting cross plate 430 together form a rectangular block-shaped space with an open bottom;

[0063] The inner diameter of the inscribed circle of the circular frame 431 is larger than the diameter of the wafer to be processed;

[0064] The cleaning belt assembly 450 is in an overall shape of a reel and includes two overhead drums 451 and a cleaning belt 452; the overhead drum 451 is a drum with an in-built motor, arranged horizontally and the axis being perpendicular to the length direction of the supporting upright frame 420, rotatably connected to the supporting cross plate 430 and located at the top of the supporting cross plate 430; the two overhead drums 451 are parallel to each other and are respectively used for winding and unwinding the cleaning belt 452; the cleaning belt 452 is a strip-shaped elastic rubber film, always in a taut state, with one side coated with non-drying glue, and the two ends are respectively wound and positioned on the two overhead drums 451, and the non-glue surface is closely attached to the bottom surface of the circular frame 431; the circular frame 431, the supporting cross plate 430 and the cleaning belt 452 together enclose a closed rectangular block-shaped space, and for the convenience of description, this space is defined as the air storage space herein.

[0065] The air pump device 370 is a combination of an air pump, an air valve and an air pipe, is communicated with the air storage space, and can control the amount of gas in the air storage space through its own operation and thus control the expansion and contraction deformation of the cleaning belt 452.

[0066] When the ion implanter with a cleaning function in the embodiment of the present application needs to be cleaned:

[0067] After the shifting component 300 (such as a clamping jaw) clamps away the wafer on the carrier 120, the control support stand 420 is shifted to approach the carrier 120, and the support cross plate 430 is moved to directly above the carrier 120; thereafter, the air pump device 370 is controlled to operate, increasing the amount of gas in the gas storage space, thereby prompting the cleaning belt 452 to deform and closely adhere to the carrier 120 and its components thereon, and then the cleaning belt 452 is controlled to contract for sticky removal cleaning; after performing the sticky removal action multiple times, each component is reset (for more thorough cleaning, the overhead reel 451 can also be controlled to rotate before resetting to replace the cleaning belt 452 closely adhering to the annular frame 431, and then perform another sticky removal cleaning).

[0068] Preferably, the support cross plate 430 does not directly contact the support stand 420; a rotating column 440 is positioned at the top of the support cross plate 430; the rotating column 440 is a hard column arranged horizontally, and one end is rotatably connected to the support stand 420 around its own axis and rotates driven by a motor; when cleaning is required, the rotating column 440 can be controlled to rotate to achieve the rotation or even flipping of the support cross plate 430, and then sticky removal cleaning is performed on the clamping jaws, vacuum suction cups, etc. for moving the wafer.

[0069] To further expand the amount by which the cleaning belt 452 forming the gas storage space can expand, and further expand the cleaning range and cleaning effect; preferably, the cleaning component further includes a shifting frame 460 and a frame shifting component 470; the shifting frame 460 is a square-shaped hard frame, the top surface contour shape and size are the same as the bottom contour shape and size of the annular frame 431, located directly below the annular frame 431, and the height is less than 3 cm; the frame shifting component 470 is used to drive the shifting frame 460 to approach and move away from the annular frame 431, is an electric telescopic rod structure, and the number is multiple, and the position near one end is fixed on the side wall of the support cross plate 430, and the position near the other end is fixed on the side wall of the shifting frame 460; before cleaning is required, the shifting frame 460 is controlled to move to clamp the cleaning belt 452 closely adhering to the annular frame 431; when the cleaning belt 452 needs to be moved, first, the shifting frame 460 is controlled to move to release the cleaning belt 452 closely adhering to the annular frame 431.

[0070] Further, three sliding blocks 130 slidably positioned on the top of the carrier 120 are positioned on the top of the carrier 120, and a buffer pad 141 made of silica gel is provided on the surface of the sliding block 130 close to the center of the carrier 120.

[0071] Further, the number of the carriers 120 is multiple; a tray 200 capable of rotating around its own axis is positioned on the ground, and multiple carriers 120 are evenly distributed on the tray 200.

[0072] The technical solutions in the embodiments of the present application above have at least the following technical effects or advantages:

[0073] It solves the technical problems in the prior art that the ion implanter cannot perform automatic self-cleaning efficiently and conveniently, and the manual cleaning has a large labor intensity, a cumbersome process and low efficiency, and realizes the technical effect that the ion implanter can efficiently and conveniently replace manual labor to complete self-cleaning.

[0074] Embodiment 2

[0075] Since the buffer pad 141 is prone to extrusion deformation and aging under the influence of temperature after being used multiple times and needs to be replaced; in order to further improve the practicability of the present application, increase its functions and make it have the function of automatically replacing the buffer pad 141 instead of manual labor, the embodiment of the present application is further expanded and optimized on the basis of the above embodiment, specifically:

[0076] As Figure 2 and Figure 6 shown, the ion implanter of the present application includes a stage 120, a tray 200 and a displacement assembly 300;

[0077] The stage 120 is cylindrical and positioned on the top of the tray 200, and the number is multiple;

[0078] Three sliding blocks 130 arranged radially and slidably are positioned on the upper surface of the stage 120;

[0079] Three storage grooves 150 are provided on the stage 120, and the storage grooves 150 correspond to the sliding blocks 130 one by one and are arranged close to the sliding blocks 130;

[0080] A floating rod 140 is placed in each storage groove 150; the floating rod 140 is longitudinally arranged, slidably positioned on the sliding block 130, and slides along the vertical direction;

[0081] A support telescopic body 160 is provided at the bottom of the floating rod 140. The support telescopic body 160 is an electric telescopic rod structure, longitudinally arranged, with a wheel body at the bottom and fixed to the bottom of the floating rod 140 at the top; when clamping the wafer, the sliding block 130 slides to drive the floating rod 140 to move closer to and clamp the wafer;

[0082] The floating rod 140 is a hollow rod body with a quadrangular prism shape, and is internally provided with a strip-shaped buffer pad 141, an internal winding drum 142 and a limiting rod 145. A rectangular front groove 144 is provided on the surface away from the sliding block 130;

[0083] A front baffle 146 longitudinally arranged and in the shape of a rectangular plate is fixed on the front groove 144, and both sides of the front baffle 146 are fixed to the side walls of the front groove 144;

[0084] The limiting rod 145 is a hard round rod arranged horizontally, with its end fixed on the inner wall of the floating rod 140, disposed near the bottom of the front slot 144 and below the front slot 144; the distance between the limiting rod 145 and the inner wall of the floating rod 140 is 0.8 to 1 times the normal thickness of the buffer pad 141;

[0085] The buffer pad 141 sequentially passes through the space between the limiting rod 145 and the inner wall of the floating rod 140, the bottom of the front baffle 146, the top of the front baffle 146, and finally winds around the built-in reel 142; due to the existence of the limiting rod 145, the buffer pad 141 remains stationary under the action of friction;

[0086] The main body of the displacement assembly 300 is a jaw or a vacuum chuck, which is used for transfer, and is a prior art.

[0087] After the buffer pad 141 has been used for a certain period of time, the slider 130 can be controlled to slide and squeeze the floating rod 140 so that it squeezes the inner wall of the storage groove 150 to fix the floating rod 140; thereafter, the cleaning assembly can be controlled to operate, so that the cleaning belt 452 deforms and adheres to the lower half of the buffer pad 141 close to the front baffle 146; then, the cleaning assembly is controlled to move upward as a whole, prompting the buffer pad 141 to shift and thus replacing the buffer pad 141 close to the front baffle 146.

[0088] When performing clamping and positioning for different times, the length of the support telescopic body 160 can be flexibly adjusted to improve the utilization rate of the buffer pad 141.

[0089] Preferably, the structure of the displacement assembly 300 in this application is the same as the structure of the wafer transfer assembly disclosed in the Chinese invention patent with the patent number CN202311811471.6; the cleaning assembly in this application can also clean and maintain the carrier tray, the fixed clamping sheet body, and the clamping soft block.

[0090] Embodiment III

[0091] In order to further improve the cleaning effect and enhance the ability to clean dust and debris in the corners and gaps, the embodiment of this application adds a gas guide block 480 on the basis of the above embodiment, and uses the method of generating impact air flow to raise the dust and debris in the gaps such as the top surface of the carrier 120 and stick and collect them before they diffuse; specifically:

[0092] As Figures 7 to 11 shown, the gas guide block 480 is a cylindrical block, arranged longitudinally, with its top fixed at the bottom of the support cross plate 430 and surrounded by the annular frame 431; the top area of the gas guide block 480 is about one-sixth of the bottom area of the support cross plate 430;

[0093] The bottom surface of the air guiding block 480 is a flat surface, and an annular suction groove 481 is provided on the bottom surface. The annular suction groove 481 is annular and communicates with the air pump device 370, serving as a gas passage.

[0094] A C-shaped heating element 482 is provided at a position near the center of the bottom surface of the air guiding block 480. The C-shaped heating element 482 is in the shape of a C (a C-shaped), and is an electric heating wire. After heating, it serves to melt through the cleaning tape 452. An air outlet groove 483 and a suction groove 484 are provided on the bottom surface of the air guiding block 480. Both of them communicate with the air pump device 370 and are surrounded by the C-shaped heating element 482.

[0095] After performing the adhesion cleaning in the above embodiment on the cleaning target, on the premise that the cleaning tape 452 is clamped by the displacement frame 460, control the operation of the air pump device 370 so that the annular suction groove 481 adsorbs the cleaning tape 452, and then pump air into the storage space to make the cleaning tape 452 bulge; control the support cross plate 430 to move downward so that the cleaning tape 452 contacts the part to be cleaned; then control the C-shaped heating element 482 to heat and melt out a notch on the cleaning tape 452. After that, control one of the air outlet groove 483 and the suction groove 484 to intake air and the other to exhaust air, so as to form an air flow in the space below the cleaning tape 452, raise the dust and sundries at the gap, and most of the raised sundries are adhered by the cleaning tape 452; finally, reset each component to complete the cleaning.

[0096] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An ion implanter with a cleaning function, comprising a carrier (120), characterized in that: Also included is a cleaning component and an air pump device (370) in communication with the air storage space; The cleaning assembly comprises a displacement guide rail (410) positioned on the ground, a support stand (420) which is arranged longitudinally and slides along the displacement guide rail (410) and is a telescopic rod structure, a support cross plate (430) and a cleaning belt assembly (450); The supporting horizontal plate (430) is a hard rectangular plate arranged transversely, fixed on the side wall of the supporting vertical frame (420), and a U-shaped annular frame (431) is positioned at the bottom; The cleaning belt assembly (450) is in the shape of a reel as a whole, and comprises two top reels (451) parallel to each other and a cleaning belt (452); the top reel (451) is arranged horizontally and is rotatably connected to the supporting transverse plate (430); the cleaning belt (452) is a belt-shaped elastic rubber film, one side of which is coated with adhesive, and the two ends are respectively wound and positioned on the two top reels (451), and the non-adhesive surface is closely attached to the bottom surface of the annular frame (431); the annular frame (431), the supporting transverse plate (430) and the cleaning belt (452) together enclose a closed rectangular block space, which is the air storage space.

2. The ion implanter with cleaning function as claimed in claim 1, characterized in that: The supporting horizontal plate (430) does not directly contact the supporting vertical frame (420); A rotating cylinder (440) is positioned on the top of the supporting horizontal plate (430); The rotating column (440) is a hard column arranged transversely, one end of which is connected to the supporting frame (420) and rotates around its own axis, and rotates under the drive of the motor; When cleaning is required, the rotating cylinder (440) is controlled to rotate to realize the rotation or even flipping of the supporting horizontal plate (430).

3. The ion implanter with cleaning function as claimed in claim 1 or 2, characterized in that: The cleaning assembly further comprises a shift frame (460) and a frame shift assembly (470); The shift frame (460) is a U-shaped hard frame, the top surface contour shape and size are the same as the bottom contour shape and size of the annular frame (431), located directly below the annular frame (431), and the height is less than 3 cm; The frame shifting assembly (470) is used to drive the shifting frame (460) to move closer to and away from the annular frame (431), and is an electric telescopic rod structure, with a plurality of rods, a position close to one end of which is fixed to the side wall of the supporting horizontal plate (430), and a position close to the other end of which is fixed to the side wall of the shifting frame (460); Before cleaning is required, the shift frame (460) is controlled to move to clamp the cleaning belt (452) that is close to the annular frame (431).

4. The ion implanter with cleaning function as claimed in claim 1, characterized in that: The number of the carriers (120) is multiple; a tray (200) capable of rotating around its own axis is positioned on the ground, and the multiple carriers (120) are evenly distributed on the tray (200).

5. The ion implanter with cleaning function as claimed in claim 3, characterized in that: It comprises a carrier (120) and a shifting assembly (300); Three sliding blocks (130) arranged radially and sliding are positioned on the upper surface of the carrier (120); The carrier (120) is provided with three storage slots (150), and the storage slots (150) correspond to the sliding blocks (130) one by one; Each storage tank (150) is provided with a floating rod (140); the floating rod (140) is longitudinally arranged, slidably positioned on the sliding block (130), and slides along the vertical direction; A supporting telescopic body (160) is provided at the bottom of the floating rod (140). The supporting telescopic body (160) is a telescopic rod structure, which is arranged longitudinally, has a wheel body at the bottom, and a top fixed to the bottom of the floating rod (140); when clamping a wafer, the sliding block (130) slides to drive the floating rod (140) to move closer to and clamp the wafer; The floating rod (140) is a quadrangular prism-shaped hollow rod body, with a belt-shaped buffer pad (141), a built-in reel (142) and a limit rod (145) built in, and a rectangular front groove (144) is provided on the surface away from the sliding block (130); A front baffle plate (146) which is longitudinally arranged and in the shape of a rectangular plate is fixed on the front groove (144), and two sides of the front baffle plate (146) are fixed on the side walls of the front groove (144); The limiting rod (145) is a hard round rod arranged transversely, the end of which is fixed on the inner wall of the floating rod (140), and is arranged close to the bottom of the front groove (144) and below the front groove (144); The buffer pad (141) sequentially passes through between the limiting rod (145) and the inner wall of the floating rod (140), the bottom of the front baffle (146), the top of the front baffle (146), and is finally wound on the built-in reel (142).

6. The ion implanter with cleaning function as claimed in claim 5, characterized in that: The main body of the displacement component (300) is a clamping claw or a vacuum suction cup.

7. The ion implanter with cleaning function as claimed in claim 5, characterized in that: When performing different times of clamping and positioning, the length of the supporting telescopic body (160) is flexibly adjusted to thereby improve the utilization rate of the buffer pad (141).

8. The ion implanter with cleaning function as claimed in claim 5, characterized in that: The cleaning assembly can clean and maintain the carrying tray, the fixed clamping sheet and the clamping soft block.

9. The ion implanter with cleaning function as claimed in claim 5, characterized in that: Also included is an air guide block (480); The air guide block (480) is a columnar block, arranged longitudinally, with its top fixed to the bottom of the supporting horizontal plate (430) and surrounded by an annular frame (431); The bottom surface of the air guide block (480) is provided with an annular air suction groove (481), and the annular air suction groove (481) is connected to the air pump device (370); A ring-shaped heating body (482) is provided near the center of the bottom surface of the air guide block (480), and the ring-shaped heating body (482) is an electric heating wire, which plays a role of melting through the cleaning belt (452) after heating; The bottom surface of the air guide block (480) is provided with an air outlet groove (483) and an air intake groove (484), both of which are connected to the air pump device (370) and are surrounded by the ring-shaped heating body (482).

10. A method for cleaning an ion implanter, characterized in that: The ion implanter with cleaning function as claimed in claim 1 comprises the following steps: after the wafer on the carrier (120) is removed, the supporting stand (420) is controlled to move closer to the carrier (120), and the supporting horizontal plate (430) is moved to the top of the carrier (120); Thereafter, the air pump device (370) is controlled to operate, the amount of gas in the gas storage space is increased, thereby causing the cleaning belt (452) to deform and adhere closely to the carrier (120) and the components thereon, and then the cleaning belt (452) is controlled to contract to perform adhesive removal cleaning; after multiple adhesive removal actions, the components are reset.

Images