Substrate processing apparatus

Abstract

A substrate processing apparatus includes: a support unit configured to support a substrate and being rotatable; a chemical liquid supply nozzle configured to supply a chemical liquid to a chemical liquid supply area of the substrate; and a charging unit disposed adjacent to the substrate. The charging unit is disposed adjacent to the chemical liquid supply nozzle and is charged with an electric charge opposite to an electric charge of the chemical liquid.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0110758 filed on August 23, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] The present disclosure relates to a substrate processing device. Background Art

[0004] When manufacturing a semiconductor device or a display device, various processes such as photography, etching, ashing, ion implantation, and thin film deposition are performed. Etching is a process for removing a film formed on a substrate, and a cleaning process is a process for removing contaminants remaining on the surface of a substrate. The etching / cleaning process is divided into a wet process and a dry process according to the process progress, and the wet process is divided into an intermittent type and a rotary type. In the rotary method, a substrate is fixed to a support module capable of processing a single substrate, and thereafter a chemical substance is supplied to the substrate through a nozzle while the substrate is rotated so that the chemical substance is coated on the entire surface of the substrate by centrifugal force. Summary of the invention

[0005] The present disclosure provides a substrate processing apparatus capable of preventing contamination of a substrate by capturing droplets scattered on the substrate.

[0006] In addition, problems to be solved by the present disclosure are not limited to the above-mentioned problems, and other problems can be clearly understood by those skilled in the art from the following description.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the embodiments presented in the disclosure.

[0008] According to an embodiment of the present disclosure, a substrate processing device includes: a supporting unit configured to support a substrate and be rotatable; a chemical liquid supply nozzle configured to supply chemical liquid to a chemical liquid supply area of ​​the substrate; a collecting cup configured to provide a space for collecting the chemical liquid; and a charging unit disposed adjacent to the substrate. The charging unit is configured to capture droplets of the chemical liquid that collide with and scatter from the substrate, and the charging unit is charged with an electric charge opposite to that of the chemical liquid.

[0009] The charging unit is arranged to be spaced apart from the collecting cup in a horizontal direction perpendicular to the supporting unit. When the chemical liquid has positive charge, the charging unit is charged with negative charge, and when the chemical liquid has negative charge, the charging unit is charged with positive charge.

[0010] The charging unit includes a first body extending in a vertical direction perpendicular to the substrate, a second body connected to the first body and extending in an inclined direction relative to the first body, and a protrusion protruding from the second body toward an upper surface of the substrate.

[0011] The first body is disposed to be spaced apart from the support unit, and a length of the second body is smaller than a length of the first body.

[0012] The charging unit is arranged not to vertically overlap the substrate.

[0013] The charging unit includes a first charging unit and a second charging unit, and the second charging unit is arranged to be spaced apart from the first charging unit in a horizontal direction perpendicular to the supporting unit. The first charging unit is arranged to be symmetrical with the second charging unit with respect to the substrate. The first charging unit includes: a first body extending in a vertical direction perpendicular to the substrate; a second body connected to the first body and extending in an inclined direction relative to the first body; and a first protrusion protruding from the second body toward the upper surface of the substrate. The second charging unit includes: a third body extending in a vertical direction perpendicular to the substrate; a fourth body connected to the third body and extending in an inclined direction relative to the third body; and a second protrusion protruding from the fourth body toward the upper surface of the substrate.

[0014] At least one of the first charging unit and the second charging unit is charged with a charge opposite to that of the chemical liquid.

[0015] The collection cup includes a conductive member, and is charged with an electric charge opposite to that of the chemical liquid.

[0016] The charging unit contacts the collection cup, and includes a plurality of annular members arranged to be spaced apart from the substrate in a vertical direction perpendicular to the substrate.

[0017] The charging unit includes a first annular member and a second annular member, and a center of each of the first annular member and the second annular member coincides with a center of the base.

[0018] The first annular member has a diameter greater than the diameter of the substrate, and the second annular member has a diameter greater than the diameter of the first annular member.

[0019] The charging unit has a ring shape, and a width of the charging unit decreases in a direction away from the substrate.

[0020] The charging unit includes a plurality of holes arranged on an outer peripheral surface of the charging unit, and the plurality of holes are arranged in a matrix form in the outer peripheral surface.

[0021] According to another embodiment of the present disclosure, a substrate processing apparatus includes: a housing configured to provide a processing space; a support unit having a chuck for supporting a lower surface of a substrate in the processing space and a chuck pin formed to contact a lateral surface of the substrate, the support unit extending in a vertical direction perpendicular to the bottom surface of the housing; a chemical liquid supply nozzle configured to supply a chemical liquid to a chemical liquid supply area of ​​the substrate; a charging unit disposed adjacent to the substrate; a collection cup disposed within the housing and configured to collect the chemical liquid; and a controller configured to control the chemical liquid supply nozzle, the charging unit, and the support unit. The charging unit contacts the collection cup, the charging unit is disposed to be spaced apart from the substrate in the vertical direction, and the charging unit has an annular shape.

[0022] The chemical liquid supply nozzle moves on the substrate in a horizontal direction perpendicular to a vertical direction, and the charging unit is grounded when the chemical liquid supply nozzle is disposed on a central axis of the substrate.

[0023] The charging unit includes a first annular member and a second annular member spaced apart from each other, a diameter of the first annular member and a diameter of the second annular member being larger than a diameter of the substrate, and a diameter of the first annular member being smaller than a diameter of the second annular member.

[0024] The width of the charging unit decreases in a direction away from the substrate in a vertical direction, the charging unit includes a plurality of holes, and the plurality of holes are arranged in a matrix form in an outer peripheral surface of the charging unit.

[0025] According to another embodiment of the present disclosure, a substrate processing device includes: a housing configured to provide a processing space; a support unit having a chuck for supporting the lower surface of the substrate in the processing space and a chuck pin formed to contact the lateral surface of the substrate, the support unit extending in a vertical direction perpendicular to the bottom surface of the housing; a chemical liquid supply nozzle configured to supply chemical liquid to a chemical liquid supply area of ​​the substrate; a charging unit disposed adjacent to the substrate; a collection cup disposed in the housing and configured to collect the chemical liquid; and a controller configured to control the chemical liquid supply nozzle, the charging unit, and the support unit. The charging unit is disposed to be spaced apart from the substrate in the vertical direction and has an annular shape. When the chemical liquid supply nozzle is disposed on the lateral surface of the substrate, the charging unit is charged with an opposite charge to the chemical liquid, and when the chemical liquid supply nozzle is disposed on the central axis of the substrate, the charging unit is grounded.

[0026] The charging unit and the collection cup are charged with the same type of charge.

[0027] The charging unit includes a first annular member and a second annular member, each of which has a center coincident with a center of the substrate, a diameter of the first annular member greater than a diameter of the substrate, and a diameter of the second annular member greater than a diameter of the first annular member. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects, features and advantages of certain embodiments of the present inventive concept will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a schematic plan view of a substrate processing system according to an embodiment of the present disclosure;

[0030] Figure 2 yes Figure 1 A schematic diagram of an embodiment of a substrate processing apparatus;

[0031] Figures 3 to 5 is a diagram for explaining a charging unit of a substrate processing apparatus according to an embodiment of the present disclosure;

[0032] Figures 6 to 8 is a diagram for explaining a first charging unit and a second charging unit of a substrate processing apparatus according to an embodiment of the present disclosure;

[0033] Fig. 9 According to the embodiment Figure 2 A schematic diagram of a substrate processing device;

[0034] Fig.10 According to the embodiment Figure 2 A schematic diagram of a substrate processing device;

[0035] Fig.11 It is used to illustrate Fig.10 A view of the charging unit;

[0036] Fig.12 According to the embodiment Figure 2 A schematic diagram of a substrate processing device;

[0037] Fig.13 It is used to illustrate Fig.12 A view of the charging unit;

[0038] Fig.14 According to the embodiment Figure 2 A schematic diagram of a substrate processing device;

[0039] Fig.15 It is used to illustrate Fig.14 a view of a charging unit; and

[0040] Fig.16 According to the embodiment Figure 2Schematic diagram of substrate processing equipment. DETAILED DESCRIPTION

[0041] Throughout the disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0042] The present disclosure will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present disclosure are shown. However, the present disclosure need not be configured to be limited to the embodiments described below, and may be embodied in various other forms. The following embodiments are not provided to fully complete the present disclosure, but to fully convey the scope of the present disclosure to those skilled in the art.

[0043] Figure 1 is a schematic plan view of a substrate processing system according to an embodiment of the present disclosure.

[0044] refer to Figure 1 , the substrate processing system includes an index module 10 and a processing module 20. According to an embodiment, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction 92, a direction perpendicular to the first direction 92 when viewed from the top is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0045] The indexing module 10 transfers the substrate W from the container 80 containing the substrate W to the processing module 20, and transfers the substrate W processed by the processing module 20 back to the container 80. The longitudinal direction of the indexing module 10 is provided in the second direction 94. The indexing module 10 has a loading port 12 and an index frame 14. The loading port 12 is located on the side of the index frame 14 opposite to the processing module 20. The container 80 containing the substrate W is placed in the loading port 12. The loading port 12 may be provided in plurality, and the plurality of loading ports 12 may be arranged in the second direction 94.

[0046] The container 80 may be an airtight container such as a front opening pod (FOUP). The container 80 may be placed in the load port 12 by a transfer unit (not shown) such as an overhead conveyor, an overhead conveyor, or an automated guided vehicle or operator.

[0047] An index robot 120 is provided on the index frame 14. A guide rail 140 whose longitudinal direction is the second direction 94 may be provided inside the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 140. The index robot 120 may include a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable forward and backward, rotatable about the third direction 96, and movable in the third direction 96. A plurality of hands 122 may be provided to be separated from each other in the vertical direction, and the hands 122 may be movable forward and backward independently of each other.

[0048] The processing module 20 includes a buffer unit 200 , a transfer device 300 , a substrate processing device 400 , and a substrate processing device 500 .

[0049] The buffer unit 200 provides a space where the substrate W carried into the processing module 20 and the substrate W carried out of the processing module 20 temporarily stay. The substrate processing device 400 performs a liquid handling process of supplying liquid onto the substrate W and processes the substrate W using the liquid. The substrate processing device 500 performs a drying process of removing the liquid remaining on the substrate W. The transfer device 300 transfers the substrate W between the buffer unit 200, the substrate processing device 400, and the substrate processing device 500.

[0050] The longitudinal direction of the transmission device 300 may be provided as a first direction 92. The buffer unit 200 may be provided between the indexing module 10 and the transmission device 300. The substrate processing device 400 and the substrate processing device 500 may be provided on a lateral side of the transmission device 300. The substrate processing device 400 and the transmission device 300 may be arranged in a second direction 94. The substrate processing device 500 and the transmission device 300 may be arranged in a second direction 94. The buffer unit 200 may be located at one end of the transmission device 300.

[0051] According to one example, the substrate processing device 400 may be arranged on both sides of the transmission device 300, the substrate processing device 500 may be arranged on both sides of the transmission device 300, and the substrate processing device 400 may be closer to the buffer unit 200 than the substrate processing device 500. On one side of the transmission device 300, the substrate processing device 400 may be provided in an A×B (where A and B are natural numbers equal to or greater than 1) configuration in each of the first direction 92 and the third direction 96. On one side of the transmission device 300, the substrate processing device 500 may be provided in a C×D (where C and D are natural numbers equal to or greater than 1) configuration in each of the first direction 92 and the third direction 96. Different from the above, only the substrate processing device 400 may be provided on one side of the transmission device 300, and only the substrate processing device 500 may be provided on the other side of the transmission device 300.

[0052] Figure 2 yes Figure 1 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown.

[0053] refer to Figure 2 , the substrate processing apparatus 400 includes a housing 410, a collection cup 420, a support unit 440, a liquid supply unit 460, a lifting unit 480, a controller 40, and a charging unit 600. The controller 40 controls the operation of the liquid supply unit 460, the support unit 440, and the lifting unit 480. The housing 410 is provided in a substantially rectangular parallelepiped shape. The collection cup 420, the support unit 440, and the liquid supply unit 460 are disposed within the housing 410. According to an embodiment, the controller 40 may control the operation of the charging unit 600.

[0054] The collection cup 420 has a processing space with an open top, and the substrate W is subjected to liquid treatment in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid to the substrate W supported by the support unit 440. Various types of liquids may be provided, and the various liquids may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the collection cup 420 and the support unit 440.

[0055] According to an example, the collection cup 420 has a plurality of collection boxes 422, 424, and 426. Each of the collection boxes 422, 424, and 426 has a collection space for collecting liquid for substrate treatment. Each of the collection boxes 422, 424, and 426 is provided in a ring shape around the support unit 440. During liquid treatment, the pre-treatment liquid scattered due to the rotation of the substrate W flows into the collection space through the respective inlets 422a, 424a, and 426a of the collection boxes 422, 424, and 426. According to an example, the collection cup 420 has a first collection box 422, a second collection box 424, and a third collection box 426. The first collection box 422 is arranged around the support unit 440, the second collection box 424 is arranged around the first collection box 422, and the third collection box 426 is arranged around the second collection box 426. The second inlet 424a through which liquid flows into the second collection box 424 may be located above the first inlet 422a through which liquid flows into the first collection box 422, and the third inlet 426a through which liquid flows into the third collection box 426 may be located above the second inlet 424a.

[0056] The support unit 440 has a support plate 442 and a driving shaft 444. The upper surface of the support plate 442 may be provided in a substantially circular shape, and may have a larger diameter than the substrate W. A support pin 442a is provided at the center of the support plate 442 to support the rear surface of the substrate W, and an upper end of the support pin 442a is provided to protrude from the support plate 442 to space the substrate W a certain distance from the support plate 442. A chuck pin 442b is provided at an edge of the support plate 442.

[0057] The chuck pin 442 b is provided to protrude upward from the support plate 442, and supports a lateral portion of the substrate W so that the substrate W is not separated from the support unit 440 when the substrate W is rotated. The driving shaft 444 is driven by a driver 446, is connected to the center of the lower surface of the substrate W, and the driving shaft 444 rotates the support plate 442 around the central axis of the driving shaft 444.

[0058] According to an example, the liquid supply unit 460 has a chemical liquid supply nozzle 462, a first nozzle 464, and a second nozzle 466. The chemical liquid supply nozzle 462 supplies the chemical liquid onto the substrate W. The chemical liquid may be a liquid for removing a film or foreign matter remaining on the substrate W. The first nozzle 464 supplies the first liquid onto the substrate W. The first liquid may be a liquid that dissolves well in the second liquid. For example, the first liquid may be a liquid that dissolves better in the second liquid than in the chemical liquid. The first liquid may be a liquid that neutralizes the chemical liquid supplied to the substrate W. The first liquid may be a liquid that neutralizes the chemical liquid and dissolves better in the second liquid than in the chemical liquid at the same time.

[0059] According to an example, the first liquid may be water. The second nozzle 466 supplies the second liquid onto the substrate W. The second liquid may be a liquid that dissolves well in the supercritical fluid used in the substrate processing device 500. For example, the second liquid may be a liquid that dissolves better in the supercritical fluid used in the substrate processing device 500 than in the first liquid. According to an example, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). According to an example, the supercritical fluid may be carbon dioxide.

[0060] The chemical liquid supply nozzle 462, the first nozzle 464, and the second nozzle 466 can be supported by different arms 461, and these arms 461 can move independently. Selectively, the chemical liquid supply nozzle 462, the first nozzle 464, and the second nozzle 466 can be installed on the same arm 461 and can move simultaneously. The lifting unit 480 moves the collection cup 420 in the vertical direction. The relative height between the collection cup 420 and the substrate W changes due to the vertical movement of the collection cup 420. Therefore, the collection boxes 422, 424, and 426 for collecting the pre-treatment liquid change according to the type of liquid supplied to the substrate W, and thus the liquid can be collected separately. Different from the above description, the collection cup 420 can be fixedly installed, and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0061] The charging unit 600 may be disposed adjacent to the substrate W. The charging unit 600 may be arranged to be spaced apart from the substrate W and the supporting unit 440 in the first direction 92. The charging unit 600 may be charged with a negative charge or a positive charge. A portion of the charging unit 600 may protrude toward the substrate W. The charging unit 600 may capture droplets scattered from the substrate W. According to an embodiment, the charging unit 600 may capture droplets scattered from the center of the substrate W toward the outside of the substrate W. Therefore, the charging unit 600 may prevent the chemical liquid from being scattered from the substrate W and flowing into the center of the substrate W. The charging unit 600 may be arranged not to overlap vertically with the substrate W in the third direction 96.

[0062] The substrate processing apparatus 400 may not include a cover member (not shown). The cover member may include a structure for preventing the chemical liquid from scattering within the substrate. The cover member may be disposed above the inner portion of the substrate W to face the upper surface of the substrate W and may have a ring shape.

[0063] Now refer to Figures 3 to 8 The charging unit 600 is described in detail.

[0064] Figures 3 to 5 is a diagram for explaining a charging unit 600 of a substrate processing apparatus 400 according to an embodiment of the present disclosure.

[0065] refer to Figure 3 and Figure 4 , the charging unit 600 may include a first body 610, a second body 620, and a protrusion 630. Each of the first body 610, the second body 620, and the protrusion 630 may have a rectangular parallelepiped or cylindrical shape. The charging unit 600 may be connected to a power source 640. The power source 640 may charge the charging unit 600.

[0066] The first body 610 may be disposed in a vertical direction perpendicular to the substrate W (eg, Figure 2 The second body 620 may be connected to the first body 610 and may extend in an inclined direction relative to the first body 610. According to an embodiment, the second body 620 may extend from an end of the first body 610 in a direction inclined toward the substrate W. The protrusion 630 may protrude from the second body 620 toward the upper surface of the substrate W. The direction in which the protrusion 630 extends may be perpendicular to the direction in which the second body extends. The length of the first body 610 may be greater than the length of the second body 620. The charging unit 600 may be a collector. Figure 2 A collection cup 420 for the chemical liquid.

[0067] The charging unit 600 may be arranged in a horizontal direction (e.g. Figure 2 The first direction 92) and Figure 2 The substrate W and the support unit 440 are spaced apart. The horizontal direction may be perpendicular to the extension direction of the driving shaft 444 of the support unit 440. According to an embodiment, the charging unit 600 may be disposed adjacent to the lateral surface of the substrate W. When the chemical liquid supply nozzle 462 supplies the chemical liquid MS to the edge area of ​​the upper surface of the substrate W, the charging unit 600 may be charged with a charge opposite to the charge of the chemical liquid MS. According to an embodiment, when the chemical liquid MS discharged from the chemical liquid supply nozzle 462 has a negative charge, the charging unit 600 may be charged with a positive charge. Figure 3 and Figure 4 Unlike shown in FIG. 4 , when the chemical liquid MS discharged from the chemical liquid supply nozzle 462 has positive charge, the charging unit 600 may be charged with negative charge.

[0068] The charging unit 600 may be arranged on the left or right side in the horizontal direction relative to the substrate W and the support unit. The charging unit 600 may be movable along the lateral surface of the substrate W. According to an embodiment, the charging unit 600 may be movable from the left side to the right side in the horizontal direction relative to the substrate W and the support unit. However, the present disclosure is not limited thereto, and the charging unit 600 may be fixed at an adjacent position relative to the substrate W and the support unit.

[0069] refer to Figure 5 , when the chemical liquid supply nozzle 462 is disposed at the center or the central axis of the substrate W, the charging unit 600 may be grounded or discharged. At this time, the charging unit 600 may be in a neutral state. According to an embodiment, when the horizontal separation distance between the chemical liquid supply nozzle 462 and the charging unit 600 exceeds a preset threshold, the charging unit 600 may be grounded or discharged.

[0070] Figures 6 to 8 2 is a diagram for explaining a first charging unit and a second charging unit of a substrate processing apparatus according to an embodiment of the present disclosure.

[0071] refer to Figure 6 , Figure 7 and Figure 8 , the charging unit may include a first charging unit 600A and a second charging unit 600B. The first charging unit 600A may include a 1-1 body 610A, a 1-2 body 620A, and a first protrusion 630A, and the second charging unit 600B may include a 2-1 body 610B, a 2-2 body 620B, and a second protrusion 630B. The first charging unit 600A may be charged by connecting to a first power source 640A, and the second charging unit 600B may be charged by connecting to a second power source 640B.

[0072] The first charging unit 600A and the second charging unit 600B may be arranged in a horizontal direction (eg, Figure 2 are spaced apart from each other in the first direction 92 ). Figure 2 The substrate W and the supporting unit 440 may be disposed between the first charging unit 600A and the second charging unit 600B. According to an embodiment, the first charging unit 600A may be disposed on the left side with respect to the substrate W. The second charging unit 600B may be disposed on the right side with respect to the substrate W.

[0073] According to an embodiment, when the chemical liquid supply nozzle 462 supplies the chemical liquid MS to the left edge region of the substrate W, the first charging unit 600A adjacent to the supply region of the chemical liquid MS may be charged with a charge opposite to the charge of the chemical liquid MS. When the chemical liquid supply nozzle 462 supplies the chemical liquid MS to the left edge region of the upper surface of the substrate W, the second charging unit 600B may be grounded or discharged and thus may be in a neutral state. According to an embodiment, when the chemical liquid supply nozzle 462 supplies the chemical liquid MS to the right edge region of the substrate W, the second charging unit 600B adjacent to the supply region of the chemical liquid MS may be charged with a charge opposite to the charge of the chemical liquid MS. When the chemical liquid supply nozzle 462 supplies the chemical liquid MS to the right edge region of the upper surface of the substrate W, the first charging unit 600A may be grounded or discharged and thus may be in a neutral state.

[0074] refer to Figure 7, when the chemical liquid supply nozzle 462 is disposed at the center of the substrate W, the first charging unit 600A and the second charging unit 600B may be grounded or discharged. At this time, the first charging unit 600A and the second charging unit 600B may be in a neutral state. According to an embodiment, when the horizontal separation distance between the chemical liquid supply nozzle 462 and the first charging unit 600A exceeds a preset threshold, the first charging unit 600A may be grounded or discharged. According to an embodiment, when the horizontal separation distance between the chemical liquid supply nozzle 462 and the second charging unit 600B exceeds a preset threshold, the second charging unit 600B may be grounded or discharged. For example, when the chemical liquid supply nozzle 462 is disposed at the center of the substrate W, the first charging unit 600A and the second charging unit 600B may be grounded or discharged.

[0075] Fig. 9 yes Figure 2 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown.

[0076] refer to Fig. 9 , the substrate processing apparatus 400 may include a housing 410, a collection cup 420A, a support unit 440, a liquid supply unit 460, a lifting unit 480, a controller 40, and a charging unit. The collection cup 420A of the substrate processing apparatus 400 may include a processing space having an open top. The collection cup 420A may include a plurality of collection boxes 422, 424, and 426. Each of the collection boxes 422, 424, and 426 may include a collection space for collecting liquid used to process the substrate W. Each of the plurality of collection boxes 422, 424, and 426 may have an annular shape surrounding the support unit 440. The following will mainly describe Figure 2 The difference.

[0077] According to an embodiment, the collection cup 420A may include a conductive member. The collection cup 420A may be charged with a positive charge or a negative charge. Specifically, when the chemical liquid supply nozzle 462 supplies the chemical liquid to the edge area of ​​the substrate W, the collection cup 420A may be charged with a charge opposite to the charge of the chemical liquid. When the chemical liquid supply nozzle 462 supplies the chemical liquid to the central area of ​​the substrate W, the collection cup 420A may be grounded or discharged. At this time, the collection cup 420A may be in a neutral state. According to an embodiment, when the horizontal separation distance between the collection cup 420A and the chemical liquid supply nozzle 462 exceeds a preset threshold, the chemical liquid supply nozzle 462 may be grounded or discharged.

[0078] Fig.10 yes Figure 2 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown. Fig.11 It is used to illustrate Fig.10 A view of the charging unit. Figure 1and Figure 2 To describe Fig.10 and Fig.11 , and will briefly describe or omit the above referenced Figure 1 and Figure 2 The matter described.

[0079] refer to Fig.10 and Fig.11 , the substrate processing device 400 may include a charging unit disposed on the substrate W. The charging unit may include a plurality of annular members R10 and R20. A portion of the plurality of annular members R10 and R20 may be in contact with the collection cup 420 of the substrate processing device 400. The plurality of annular members R10 and R20 may include a first annular member R10 and a second annular member R20. According to an embodiment, the plurality of annular members R10 and R20 may be charged with positive or negative charges. The plurality of annular members R10 and R20 may be grounded or discharged. The first annular member R10 and the second annular member R20 may have a thin annular shape. The first annular member R10 and the second annular member R20 may have a charge opposite to the charge of the chemical liquid supplied from the chemical liquid supply nozzle 462.

[0080] According to an embodiment, the first annular member R10 and the second annular member R20 of the plurality of annular members R10 and R20 may be arranged to be away from each other in the vertical direction. For example, the first annular member R10 may be disposed on the second annular member R20. According to an embodiment, the diameter L1 of the first annular member R10 and the diameter L2 of the second annular member R20 may be greater than the diameter LW of the substrate W. The diameter L2 of the second annular member R20 may be greater than the diameter L1 of the first annular member R10.

[0081] The first annular member R10 and the second annular member R20 may be charged with the same charge. The first annular member R10 and the second annular member R20 may be charged with different charges. By charging the first annular member R10 and the second annular member R20 with different charges, the electrostatic attraction may be adjusted to be weak. By charging the first annular member R10 and the second annular member R20 with the same charge, the electrostatic attraction may be adjusted to be strong.

[0082] Fig.12 yes Figure 2 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown. Fig.13 It is used to illustrate Fig.12 A view of the charging unit. Figure 1 and Figure 2 To describe Fig.12 and Fig.13 , and will briefly describe or omit the above referenced Figure 1 and Figure 2 The matter described.

[0083] refer to Fig.12 and Fig.13 , the substrate processing device 400 may include a charging unit disposed on the substrate W. The charging unit may include an annular member 700A. The outer peripheral surface of the annular member 700A may contact the collection cup 420 of the substrate processing device 400. The diameter of the annular member 700A may gradually decrease in a direction away from the substrate W. According to an embodiment, the annular member 700A may be charged with a positive charge or a negative charge. The annular member 700A may be grounded or discharged. The annular member 700A may have a charge opposite to the charge of the chemical liquid supplied from the chemical liquid supply nozzle 462.

[0084] For example, the lower diameter RO1 of one annular member 700A may be greater than the upper diameter RT1 of one annular member 700A. The upper diameter RT1 of one annular member 700A having the minimum value may be smaller than the diameter LW of the substrate W. The lower diameter RO1 may be greater than the diameter LW of the substrate W. One annular member 700A may have a hollow cylindrical shape whose width gradually decreases in a direction away from the substrate W.

[0085] Fig.14 yes Figure 2 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown. Fig.15 It is used to illustrate Fig.14 A view of the charging unit. Fig.12 and Fig.13 To describe Fig.14 and Fig.15 , and will briefly describe or omit the above referenced Fig.12 and 13 Now we will mainly explain the Fig.12 and Fig.13 The difference.

[0086] refer to Fig.14 and Fig.15 , the substrate processing device 400 may include a charging unit disposed on the substrate W. The charging unit may include an annular member 700B. The outer peripheral surface of the annular member 700B may contact the collection cup 420 of the substrate processing device 400. The diameter of the annular member 700B may gradually decrease in a direction away from the substrate W. According to an embodiment, the annular member 700B may be charged with a positive charge or a negative charge. The annular member 700B may be grounded or discharged. The annular member 700B may have a charge opposite to the charge of the chemical liquid supplied from the chemical liquid supply nozzle 462.

[0087] For example, the lower diameter RO2 of an annular member 700B may be greater than the upper diameter RT2 of an annular member 700B. The upper diameter RT2 of an annular member 700B having a minimum value may be less than the diameter LW of the substrate W. The lower diameter RO2 may be greater than the diameter LW of the substrate W. An annular member 700B may have a hollow cylindrical shape whose width gradually decreases in a direction away from the substrate W. According to an embodiment, an annular member 700B may include a plurality of holes H on the outer peripheral surface of an annular member 700B. The plurality of holes H may be arranged in a matrix form. The plurality of holes H are shown as including three holes in the vertical direction in the outer peripheral surface of an annular member 700B, but the embodiment is not limited thereto.

[0088] Fig.16 yes Figure 2 A schematic diagram of an embodiment of a substrate processing apparatus 400 is shown.

[0089] refer to Fig.16 , the substrate processing apparatus 400 may include a charging unit 700C. One surface of the charging unit 700C may contact the collection cup 420 of the substrate processing apparatus 400. According to an embodiment, the charging unit 700C may be attached to both sides of the collection cup 420. The charging unit 700C may have a rectangular or regular hexagonal shape. However, the embodiment is not limited thereto, and the charging unit 700C may have a circular or other shape.

[0090] According to an embodiment, the charging unit 700C may be provided on the edge of the substrate W, and a plurality of the charging units 700C may be arranged along the inner circumferential surface of the collection cup 420. The charging unit 700C may be charged with a negative charge or a positive charge. The charging unit 700C may be grounded or discharged. The charging unit 700C may have a charge opposite to that of the chemical liquid supplied from the chemical liquid supply nozzle 462.

[0091] The present disclosure has been specifically shown and described with reference to its exemplary embodiments. The terms used herein are only for the purpose of describing the exemplary embodiments and are not intended to limit the present disclosure. Therefore, it will be understood by those skilled in the art that various changes can be made in form and details without departing from the spirit and scope of the present disclosure defined by the appended claims.

Claims

1. A substrate processing device, comprising: a support unit configured to support a substrate and to be rotatable; a chemical liquid supply nozzle configured to supply the chemical liquid to the chemical liquid supply region of the substrate; a collection cup configured to provide a space for collecting the chemical liquid; as well as a charging unit disposed adjacent to the substrate, The charging unit is configured to capture droplets of the chemical liquid that collide with the substrate and scatter, and the charging unit is charged with an electric charge opposite to that of the chemical liquid.

2. The substrate processing apparatus according to claim 1, wherein: The charging unit is arranged to be spaced apart from the collecting cup in a horizontal direction perpendicular to the supporting unit, and When the chemical liquid has a positive charge, the charging unit is charged with a negative charge, and when the chemical liquid has a negative charge, the charging unit is charged with a positive charge.

3. The substrate processing apparatus according to claim 2, wherein: The charging unit comprises: a first body extending in a vertical direction perpendicular to the base; a second body connected to the first body and extending in an inclined direction with respect to the first body; and The protrusion protrudes from the second body toward the upper surface of the base.

4. The substrate processing apparatus according to claim 3, wherein: The first body is arranged to be spaced apart from the supporting unit, and The length of the second body is smaller than the length of the first body.

5. The substrate processing apparatus according to claim 2, wherein: The charging unit is arranged not to vertically overlap the substrate.

6. The substrate processing apparatus according to claim 1, wherein: The charging unit includes a first charging unit and a second charging unit, the second charging unit being arranged to be spaced apart from the first charging unit in a horizontal direction perpendicular to the supporting unit, The first charging unit is arranged symmetrically with respect to the substrate with respect to the second charging unit, The first charging unit comprises: a first body extending in a vertical direction perpendicular to the base; a second body connected to the first body and extending in an inclined direction with respect to the first body; and a first protrusion protruding from the second body toward an upper surface of the base, and the second charging unit comprising: a third body extending in a vertical direction perpendicular to the base; a fourth body connected to the third body and extending in an inclined direction relative to the third body; and The second protrusion protrudes from the fourth body toward the upper surface of the base.

7. The substrate processing apparatus according to claim 6, wherein: At least one of the first charging unit and the second charging unit is charged with a charge opposite to that of the chemical liquid.

8. The substrate processing apparatus according to claim 1, wherein: The collection cup includes a conductive member, and is charged with an electric charge opposite to that of the chemical liquid.

9. The substrate processing apparatus according to claim 1, wherein: The charging unit contacts the collection cup, and includes a plurality of annular members arranged to be spaced apart from the substrate in a vertical direction perpendicular to the substrate.

10. The substrate processing apparatus according to claim 9, wherein: The charging unit includes a first annular member and a second annular member, and The center of each of the first annular member and the second annular member coincides with the center of the base.

11. The substrate processing apparatus according to claim 10, wherein: The diameter of the first annular member is greater than the diameter of the base, and The second annular member has a diameter greater than a diameter of the first annular member.

12. The substrate processing apparatus according to claim 8, wherein: The charging unit has a ring shape, and The width of the charging unit decreases in a direction away from the substrate.

13. The substrate processing apparatus according to claim 12, wherein: The charging unit includes a plurality of holes arranged on an outer peripheral surface of the charging unit, and The plurality of holes are arranged in a matrix form in the outer peripheral surface.

14. A substrate processing device comprising: a housing configured to provide a processing space; a supporting unit having a chuck for supporting a lower surface of a substrate in the processing space and a chuck pin formed to contact a lateral surface of the substrate, the supporting unit extending in a vertical direction perpendicular to a bottom surface of the housing; a chemical liquid supply nozzle configured to supply the chemical liquid to a chemical liquid supply region of the substrate; a charging unit disposed adjacent to the substrate; a collection cup disposed within the housing and configured to collect the chemical liquid; as well as a controller configured to control the chemical liquid supply nozzle, the charging unit, and the supporting unit, The charging unit is in contact with the collecting cup, the charging unit is disposed to be spaced apart from the substrate in the vertical direction, and the charging unit has a ring shape.

15. The substrate processing apparatus according to claim 11, wherein: The chemical liquid supply nozzle moves on the substrate in a horizontal direction perpendicular to the vertical direction, and The charging unit is grounded when the chemical liquid supply nozzle is disposed on a central axis of the substrate.

16. The substrate processing apparatus according to claim 11, wherein: The charging unit includes a first annular member and a second annular member spaced apart from each other, The diameter of the first annular member and the diameter of the second annular member are greater than the diameter of the base, and The first annular member has a diameter smaller than a diameter of the second annular member.

17. The substrate processing apparatus according to claim 11, wherein: The width of the charging unit decreases in the vertical direction in a direction away from the substrate, The charging unit includes a plurality of holes, and The plurality of holes are arranged in a matrix form in an outer peripheral surface of the charging unit.

18. A substrate processing device comprising: a housing configured to provide a processing space; a supporting unit having a chuck for supporting a lower surface of a substrate in the processing space and a chuck pin formed to contact a lateral surface of the substrate, the supporting unit extending in a vertical direction perpendicular to a bottom surface of the housing; a chemical liquid supply nozzle configured to supply the chemical liquid to a chemical liquid supply region of the substrate; a charging unit disposed adjacent to the substrate; a collection cup disposed within the housing and configured to collect the chemical liquid; as well as a controller configured to control the chemical liquid supply nozzle, the charging unit, and the supporting unit, in, The charging unit is disposed to be spaced apart from the substrate in the vertical direction and has a ring shape, and The charging unit is charged with an electric charge opposite to that of the chemical liquid when the chemical liquid supply nozzle is disposed on a lateral surface of the substrate, and is grounded when the chemical liquid supply nozzle is disposed on a central axis of the substrate.

19. The substrate processing apparatus according to claim 18, wherein: The charging unit and the collection cup are charged with the same type of charge.

20. The substrate processing apparatus according to claim 18, wherein: The charging unit includes a first annular member and a second annular member, The center of each of the first annular member and the second annular member coincides with the center of the base, The diameter of the first annular member is greater than the diameter of the base, and The second annular member has a diameter greater than a diameter of the first annular member.

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