A method and device for controlling chip pitch based on film breaking

Abstract

The present invention relates to the technical field of chip transfer packaging, and provides a chip pitch control method and device based on film breaking. The chip pitch control method includes: S1: generating a first position matrix and constructing a target matrix of chips according to the first position matrix; S2: constructing a first set of chip deformation vectors; S3: generating a second set of deformation vectors, and obtaining a unit deformation vector corresponding to each chip and a pinhole according to the quadratic spline interpolation method and the second set of deformation vectors; S4: iterating the objective function and adjusting the pinhole coordinates when iterating the objective function; S5: adjusting the number of pinholes, comparing the number of pinholes with the number of chips, and deciding to adjust the target matrix according to the comparison result and jumping to step S2 or executing step S6; S6: controlling the needle to pierce the back film based on the adjusted pinhole coordinates. The present invention optimizes the chip pitch to solve the problems of uneven chip pitch after die expansion and low transfer accuracy in subsequent transfer processes.

Description

Technical Field

[0001] The present invention relates to the technical field of chip transfer packaging, and particularly to a method and device for controlling chip spacing based on film breaking. Background Art

[0002] During daily operations, after the wafer is cut, the chip spacing is still very small. To facilitate subsequent processes, it is necessary to stretch the blue film or UV film on the back to drive the chips to disperse. This process is called die expansion. Existing die expanders use a liftable and heatable top film platform. First, the back film (blue film or UV film) is preheated to make it soft, then the back film is stretched and fixed with a die expansion ring, and finally die expansion is completed. However, due to uneven heating of the back film and uneven distribution of film stress during the rising process of the top film platform, the chip spacing after die expansion is uneven, resulting in a decrease in the transfer accuracy of subsequent transfer processes.

[0003] Therefore, there is an urgent need for a method to adjust the chip distribution on the die expansion ring to solve the problems of uneven chip spacing after die expansion and decreased transfer accuracy of subsequent transfer processes. Summary of the Invention

[0004] Aiming at the above defects, the purpose of the present invention is to provide a method and device for controlling chip spacing based on film breaking, aiming to optimize the chip spacing to solve the problems of uneven chip spacing after die expansion and low transfer accuracy of subsequent transfer processes.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A method for controlling chip spacing based on film breaking, the chip spacing control method comprising the steps of:

[0007] S1: Generating a first position matrix based on the position coordinates of each chip before film breaking, and constructing a target matrix of the chips according to the first position matrix;

[0008] S2: Constructing a first set of deformation vectors of the chips according to the first position matrix and the target matrix;

[0009] S3: Generating a second set of deformation vectors based on the position coordinates of each chip after film breaking and the first position matrix, and obtaining the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors;

[0010] S4: Iterating the objective function based on all the unit deformation vectors and the first set of deformation vectors, and adjusting the pinhole coordinates when iterating the objective function;

[0011] S5: Adjusting the number of pinholes based on the value of the objective function and a preset expected value, comparing the number of pinholes with the number of chips, and deciding to adjust the target matrix and jump to step S2 or execute step S6 according to the comparison result;

[0012] S6: Manipulate the needle to pierce the back film based on the adjusted pinhole coordinates.

[0013] Preferably, step S1 includes:

[0014] Taking the center of the die bonder ring as the coordinate origin, calculate the position coordinates of each chip before film breaking;

[0015] Mark the position coordinates of each chip to generate the first position matrix;

[0016] Calculate the average chip pitch in the X-axis direction and the Y-axis direction according to the first position matrix. Taking the coordinate origin as the center of the matrix, construct the target matrix of the chips according to the average chip pitch.

[0017] Furthermore, after step S3, it also includes judging whether the needle needs to be replaced, including:

[0018] Obtain the deformation vector corresponding to the first chip on the X-axis in the second set of deformation vectors;

[0019] If the length corresponding to the deformation vector of the first chip on the X-axis is greater than the average chip pitch in the X-axis direction or the Y-axis direction, replace the die bonder ring and replace the needle with a smaller diameter, and restart from step S1;

[0020] If the length corresponding to the deformation vector of the first chip on the X-axis is less than the average chip pitch in the X-axis direction or the Y-axis direction and greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, execute step S4;

[0021] If the length corresponding to the deformation vector of the first chip on the X-axis is not greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, replace the die bonder ring and replace the needle with a smaller diameter, and restart from step S1.

[0022] Preferably, obtaining the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors includes:

[0023] Obtain the position coordinates of each chip before film breaking and the deformation vector of each chip in the second set of deformation vectors, and use the quadratic spline interpolation method to calculate the coefficients of the spline curve in the interval between every two chips, satisfying the relationship:

[0024] ;

[0025] where, represents the deformation vector of the chip in the th row and th column of the second set of deformation vectors, represents the position before film breaking of the th row and The X-axis position coordinates of the chips in the column, 、 and represent the coefficients of the spline curve between every two chips.

[0026] Further, obtaining the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors further includes:

[0027] Obtaining the distance between the chip and the pinhole;

[0028] Calculating the displacement of the chip after membrane rupture based on the coefficients of the spline curve between every two chips and the distance between the chip and the pinhole, satisfying the relationship:

[0029] ;

[0030] Wherein, represents the displacement of the chip after membrane rupture, 、 and represent the coefficients of the spline curve between every two chips, represents the distance between the chip and the pinhole;

[0031] Combining the displacement of the chip after membrane rupture and the direction of the pinhole pointing to the chip to form a unit deformation vector.

[0032] Preferably, when iterating the objective function based on all the unit deformation vectors and the first set of deformation vectors, adjusting the pinhole coordinates includes:

[0033] Superimposing all the unit deformation vectors to obtain the total deformation vector;

[0034] Calculating the average distance between all the chips and the target matrix according to the total deformation vector and the first set of deformation vectors, satisfying the relationship:

[0035] ;

[0036] Wherein, represents the objective function, represents the total deformation vector, represents the number of chips, represents the first set of deformation vectors;

[0037] Gradually adjusting the coordinates of the pinhole until the objective function no longer changes, and recording the adjusted pinhole coordinates.

[0038] Preferably, in step S5, adjusting the number of pinholes based on the value of the objective function and a preset expected value includes:

[0039] Setting the expected value;

[0040] If the value of the objective function is not less than the expected value, increase the number of pinholes.

[0041] If the value of the objective function is less than the expected value, the number of pinholes remains unchanged.

[0042] Further, compare the number of pinholes with the number of chips, and decide to adjust the target matrix and jump to step S2 or execute step S6 according to the comparison result, including:

[0043] If the number of pinholes is less than 1% of the number of chips, execute step S6.

[0044] If the number of pinholes is not less than 1% of the number of chips, increase the chip pitch of the target matrix and restart from step S2.

[0045] A chip pitch control device based on film breaking, comprising:

[0046] A vision module for acquiring a chip image and sending it to the operation module;

[0047] An operation module for receiving the chip image from the vision module, calculating the coordinates of all chips with the center of the expansion ring as the coordinate origin, generating a first position matrix based on the position coordinates of each chip before film breaking, and constructing a target matrix of the chips according to the first position matrix;

[0048] Construct a first deformation vector set of the chips according to the first position matrix and the target matrix;

[0049] Generate a second deformation vector set based on the position coordinates of each chip after film breaking and the first position matrix, and obtain the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second deformation vector set;

[0050] Iterate the objective function based on all the unit deformation vectors and the first deformation vector set, and adjust the pinhole coordinates when iterating the objective function;

[0051] Adjust the number of pinholes based on the value of the objective function and a preset expected value, compare the number of pinholes with the number of chips, and decide to adjust the target matrix and restart the subsequent steps according to the comparison result, or send the adjusted pinhole coordinates to the moving module;

[0052] A moving module for receiving the pinhole coordinates sent by the operation module and manipulating the needle to pierce the back film based on the adjusted pinhole coordinates.

[0053] One of the above technical solutions has the following advantages or beneficial effects:

[0054] The present invention uses the quadratic spline interpolation method to smooth the new position of the chip, which can capture the non-linear characteristics of the film deformation, improve the calculation accuracy of the unit deformation vector, and contribute to achieving more precise pitch control; by iteratively optimizing the objective function, the pinhole coordinates can be continuously adjusted to find the optimal puncture position, ensuring that the chip pitch can gradually approach the ideal state and reducing the error caused by static settings; based on the evaluation of the objective function, the number of pinholes can be flexibly adjusted to avoid the problem that the requirement of controlling the chip pitch cannot be met due to the number of pinholes or the solution time of the pinhole position is greatly extended, and too many pinholes may damage the internal stress on the expansion ring, resulting in a change in the overall mechanical properties of the expansion ring and making it unusable for subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0056] Figure 1 is a flowchart of a chip pitch control method based on film breaking provided by an embodiment of the present invention;

[0057] Figure 2 is a structural schematic diagram of a chip pitch control device based on film breaking provided by an embodiment of the present invention;

[0058] Figure 3 is a structural schematic diagram of a device applying the chip pitch control method based on film breaking provided by an embodiment of the present invention;

[0059] Among them, there are an expansion ring platform 1, a vision module 2, a light source 21, an image acquisition unit 22, an operation module 3, a moving module 4, an expansion ring 5, a chip 51, a back film 52, and a needle 6. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0060] The following will describe in detail the embodiments of the present invention. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0061] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0062] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0063] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0064] The present invention can be applied to a chip pitch control device, such as Figure 3 shown, which includes an expanding ring platform 1 for placing the expanding ring 5 after film expansion, a vision module 2, an operation module 3, and a moving module 4;

[0065] The vision module 2 includes a light source 21 and an image acquisition unit 22. The light source 21 is used to emit light that can be clearly reflected by the chip 51, and the image acquisition unit 22 is used to take pictures of the chips on the wafer and is arranged above the wafer;

[0066] The operation module 3 is connected to the vision module 2. The operation module 3 is used to calculate the coordinates of the chips 51 and control the moving module 4 to achieve the film-breaking points;

[0067] The moving module 4 is used to realize camera shooting and the movement of the needle 6.

[0068] As Figure 1 shown, a preferred embodiment provided by the present invention is a chip pitch control method based on film breaking. The chip pitch control method includes the steps:

[0069] S1: Generate the first position matrix based on the position coordinates of each chip before membrane rupture, and construct the target matrix of the chips according to the first position coordinates;

[0070] In this embodiment, the dicing ring 5 is placed on the dicing ring platform 1, the light source 21 is started, and the image acquisition unit 22 is used to capture the dicing ring 5. The image is transmitted to the operation module 3. Taking the center of the dicing ring 5 as the coordinate origin, calculate the actual position coordinates of each chip ( , ), where represents the number of chip rows, represents the number of chip columns, and record the actual position coordinates of all chips as the matrix . The first position matrix is the actual position of each chip before membrane rupture. The target matrix sets the ideal positions of the chips, aiming to minimize the interference between adjacent chips. Therefore, the target matrix is calculated according to the ideal chip spacing and layout design. By setting the target spacing, the position of each chip in the target state can be calculated. Let the coordinates of each chip in the target matrix be ( , ).

[0071] S2: Construct the first set of deformation vectors of the chips according to the first position matrix and the target matrix;

[0072] The first set of deformation vectors is calculated from the difference between the first position matrix and the target matrix. Each deformation vector represents the offset between the actual position and the target position of the chip. The deformation vector pointing from the actual position to the target position of each chip ( , ), and record the first set of deformation vectors as . The deformation vectors can help determine how the chips need to be adjusted in actual operation to reach the target positions.

[0073] S3: Generate the second set of deformation vectors based on the position coordinates of each chip after membrane rupture and the first position matrix, and obtain the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors;

[0074] Send an instruction to the moving module 4 to control the needle 6 to drop at the coordinate origin position and pierce the back film 52 (blue film or UV film). After membrane rupture, the chips move due to the deformation of the film. Record the position coordinates of the chips after membrane rupture, and combine with the first position matrix to calculate the deformation vector pointing from the actual position before membrane rupture to the actual position after membrane rupture for each chip ( , ), and record the second set of deformation vectors as , the quadratic spline interpolation method is used to smooth the new position of the chip, thereby calculating the unit deformation vector. Quadratic spline interpolation is a mathematical method for constructing a smooth curve between known data points, which can capture the non-linear characteristics of the film deformation. By interpolating the new position, the influence of the film on the chip position can be described more accurately.

[0075] S4: Iterate the objective function based on all the unit deformation vectors and the first deformation vector set, and adjust the pinhole coordinates when iterating the objective function;

[0076] First, an objective function needs to be defined to measure the difference between the deformation vectors formed by all the pinholes acting on each chip and the first deformation vector set. During the iteration process, the value of the objective function will become smaller and smaller. The smaller the value of the objective function, the closer the actual position of the chip is to the target position. In this step, the value of the objective function is optimized through an iterative algorithm and the coordinates of the pinholes are continuously adjusted. Each iteration will be updated according to the current deformation vector and the target position to find the optimal pinhole position, so as to achieve the ideal distribution of the chips.

[0077] S5: Adjust the number of pinholes based on the value of the objective function and a preset expected value, compare the number of pinholes with the number of chips, and decide whether to adjust the target matrix and jump to step S2 or execute step S6 according to the comparison result;

[0078] Subsequently, an expected value is set in combination with the subsequent process flow. This expected value is used to evaluate the current value of the objective function. If the value of the objective function fails to meet the expectation, it needs to be adjusted by changing the number of pinholes. If the number of pinholes is too large, it will greatly extend the solution time of the pinhole position, and too many pinholes may damage the internal stress on the expansion ring 5, resulting in a change in the overall mechanical properties of the expansion ring 5 and making it unusable for subsequent processes. Therefore, it is necessary to decide whether to adjust the target matrix and jump to step S2 or execute step S6 according to the comparison result.

[0079] S6: Control the needle to pierce the back film based on the adjusted pinhole coordinates.

[0080] According to the adjusted pinhole coordinates, control the movement path and piercing force of the needle. By precisely controlling the position and movement of the needle, it can be ensured that the piercing process of the film is as uniform as possible, thereby reducing the inconsistency of the chip spacing. Through effective piercing operations, it can promote the controllable deformation of the film, and finally achieve the ideal arrangement of the chips on the carrier.

[0081] The present invention uses the quadratic spline interpolation method to smooth the new position of the chip, which can capture the non-linear characteristics of the film deformation, improve the calculation accuracy of the unit deformation vector, and contribute to achieving more precise pitch control; by iteratively optimizing the objective function, the pinhole coordinates can be continuously adjusted to find the optimal puncture position, ensuring that the chip pitch can gradually approach the ideal state and reducing the error caused by static settings; based on the evaluation of the objective function, the number of pinholes can be flexibly adjusted to avoid the problem that the requirement of controlling the chip pitch cannot be met due to the number of pinholes or the solution time of the pinhole position is greatly extended, and too many pinholes may damage the internal stress on the dicing ring 5, resulting in a change in the overall mechanical properties of the dicing ring 5 and making it unusable for subsequent processes.

[0082] Preferably, step S1 includes:

[0083] Taking the center of the dicing ring 5 as the coordinate origin, calculate the position coordinates of each chip before film breaking;

[0084] Mark the position coordinates of each chip to generate a first position matrix;

[0085] According to the first position matrix, calculate the average chip pitch in the X-axis direction and the Y-axis direction, and taking the coordinate origin as the center of the matrix, construct the target matrix of the chips according to the average chip pitch.

[0086] Specifically, define the center of the dicing ring 5 as the coordinate origin (0, 0). The dicing ring 5 is usually located at the center of the wafer, which can provide a stable reference point to make subsequent calculations and positioning more consistent. Obtain the pictures of the chips through the vision module 2, and the operation module 3 calculates the coordinates of the chips. The coordinates of each recorded chip are recorded in the form of (x, y), indicating its distance relative to the origin. Organize the position coordinates of all chips into a matrix (the first position matrix) for subsequent calculations and analyses. Calculate the x coordinates and y coordinates of all chips in the first position matrix respectively to obtain the average chip pitch on the X-axis and the Y-axis. Subsequently, taking the coordinate origin as the center, construct the target matrix according to the calculated average chip pitch. Each position in the target matrix represents the position where the chip should be in the ideal state. By calculating the average pitch, the accidental error of single chip position measurement can be eliminated, and the chip pitch can be better controlled to make the chip pitch more uniform.

[0087] Further, after step S3, it also includes judging whether the needle needs to be replaced, including:

[0088] Obtain the deformation vector corresponding to the first chip on the X-axis in the second deformation vector set;

[0089] If the length corresponding to the deformation vector of the first chip on the X-axis is greater than the average chip pitch in the X-axis direction or the Y-axis direction, replace the expansion ring 5 and the needle with a smaller diameter, and restart from step S1;

[0090] If the length corresponding to the deformation vector of the first chip on the X-axis is less than the average chip pitch in the X-axis direction or the Y-axis direction and greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, perform step S4;

[0091] If the length corresponding to the deformation vector of the first chip on the X-axis is not greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, replace the expansion ring 5 and the needle with a smaller diameter, and restart from step S1.

[0092] Specifically, the deformation vector of the first chip on the x-axis in the second deformation vector set is , which is usually the maximum value in the second deformation vector set. If the length corresponding to the deformation vector of the first chip on the X-axis is greater than the average chip pitch in the X-axis direction or the Y-axis direction, it is considered that the diameter of the needle 6 is too large to control the chip pitch, and the needle 6 with a smaller diameter should be replaced, the expansion ring 5 should be replaced, and restart from step S1;

[0093] If the length corresponding to the deformation vector of the first chip on the X-axis is less than the average chip pitch in the X-axis direction or the Y-axis direction and greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, it is considered that the diameter of the needle is appropriate and the next step S4 can be performed;

[0094] If the length corresponding to the deformation vector of the first chip on the X-axis is not greater than one-fifth of the average chip pitch in the X-axis direction or the Y-axis direction, it is considered that the diameter of the needle 6 is too small, the number of pinholes required to control the chip pitch is too large, it is difficult to calculate the pinhole positions and the calculation time is too long, and the needle 6 with a larger diameter should be replaced, the expansion ring 5 should be replaced, and restart from step S1; By comparing the deformation vector with the average chip pitch, the suitability of the needle diameter can be accurately judged, so as to ensure the accuracy and stability of chip processing, quickly identify and replace inappropriate needles and the expansion ring 5, and avoid processing errors and time waste caused by improper tools.

[0095] Preferably, the unit deformation vector corresponding to each chip and the pinhole obtained according to the quadratic spline interpolation method and the second deformation vector set includes:

[0096] Obtain the position coordinates of each chip before film breaking and the deformation vector of each chip in the second deformation vector set, and use the quadratic spline interpolation method to calculate the coefficients of the spline curve in the interval between every two chips, satisfying the relationship:

[0097] ;

[0098] Among them, represents the X-axis deformation vector of the chip in the th row and th column of the second set of deformation vectors, represents the X-axis position coordinate of the chip in the th row and th column before film rupture, , and represent the coefficients of the spline curve in the interval between every two chips.

[0099] Specifically, since the film deformation after a single film rupture usually appears as a ray rotating about the pinhole, all the back film deformation vectors along the positive x-axis direction starting from the origin of coordinates are taken in the second set of deformation vectors to construct the unit deformation vector. Among the deformation vectors of each chip on the X-axis and the actual position coordinates before film rupture , the coefficients of the spline curve in the interval between every two chips are calculated using the equation . The quadratic spline curve fits the film rupture deformation vector in the positive x-axis direction. The unit deformation vector is the deformation field formed by rotating the quadratic spline curve around the pinhole position. Through interpolation, a smooth change in the deformation vector between chips is obtained, avoiding sudden changes or discontinuities and ensuring the physical meaning of the data.

[0100] Furthermore, obtaining the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors further includes:

[0101] Obtaining the distance between the chip and the pinhole;

[0102] Based on the coefficients of the spline curve in the interval between every two chips and the distance between the chip and the pinhole, the displacement of the chip after film rupture is calculated, satisfying the relationship:

[0103] ;

[0104] Among them, represents the displacement of the chip after film rupture, , and represent the coefficients of the spline curve in the interval between every two chips, represents the distance between the chip and the pinhole;

[0105] The displacement of the chip after film rupture and the direction of the pinhole pointing to the chip are combined to form the unit deformation vector.

[0106] Specifically, the calculated displacement of the chip after membrane rupture is the length of the unit deformation vector. The unit deformation vector is defined as a vector with a certain magnitude in a specific direction, and it consists of two parts: the displacement information reflecting the movement degree of the chip and the direction information reflecting the deformation. The direction information is the direction from the pinhole to the chip. By substituting the distance value, the corresponding displacement can be obtained, and a smooth displacement change can be generated between each chip instead of simple linear interpolation, thus more realistically reflecting the actual deformation after membrane rupture.

[0107] Preferably, based on all the unit deformation vectors and the first deformation vector set, the objective function is iterated. When iterating the objective function, adjusting the pinhole coordinates includes:

[0108] Superimpose all the unit deformation vectors to obtain the total deformation vector;

[0109] Calculate the average distance between all the chips and the target matrix according to the total deformation vector and the first deformation vector set, satisfying the relationship:

[0110] ;

[0111] wherein, represents the objective function, represents the total deformation vector, represents the number of chips, represents the first deformation vector set;

[0112] Gradually adjust the coordinates of the pinhole until the objective function no longer changes, and record the adjusted pinhole coordinates.

[0113] Specifically, the objective function is used to measure the difference between the total deformation vector C formed by all the pinholes acting together on each chip and the first position matrix. The physical meaning of the objective function is the average distance between all the chips and the target matrix. By superimposing all the unit deformation vectors, a comprehensive deformation state can be obtained to get the total deformation vector. By calculating the difference between the total deformation vector and the first position matrix, the deviation of the current chip position can be determined. The smaller the deviation of the chip position, the closer the current deformation is to the ideal state, and the smaller the value of the objective function . When iterating the objective function, first perform initialization, move the pinhole position to a circle with the coordinate origin (the center of the expanding ring 5) as the center and the radius of the expanding ring 5 as the radius, and then perform 100 iterations. While iterating, jump the pinhole coordinates. When the objective function When the value of remains unchanged, record the pinhole coordinates at this time. This step can effectively find an optimal position by gradually adjusting the position of the pinhole and monitoring the changes in the objective function. The objective function is recalculated after each adjustment until a convergence state is reached (that is, the value of the objective function changes slightly, indicating that it is close to the optimal solution).

[0114] Preferably, in step S5, adjusting the number of pinholes based on the value of the objective function and the preset expected value includes:

[0115] Set expectations;

[0116] If the value of the objective function is not less than the expected value, the number of pinholes is increased;

[0117] If the value of the objective function is less than the expected value, the number of pinholes remains unchanged.

[0118] Specifically, the expected value is set in combination with the subsequent process flow, and can be expressed as the maximum average distance between all chips and the target matrix that is acceptable. When the objective function value reaches or exceeds the expected value, the number of pinholes is increased to meet the requirement of controlling the chip spacing; otherwise, the current number of pinholes is maintained to prevent instability caused by over-adjustment. It is automatically optimized under different conditions to ensure its responsiveness and stability, while solving the problem of insufficient performance due to fixed parameters.

[0119] Further, comparing the number of pinholes with the number of chips, and determining to adjust the target matrix according to the comparison result and jumping to step S2 or executing step S6 include:

[0120] If the number of pinholes is less than one percent of the number of chips, execute step S6;

[0121] If the number of pinholes is not less than 1% of the number of chips, the chip spacing of the target matrix is ​​increased and the process starts again from step S2.

[0122] Specifically, if the number of pinholes is less than one percent of the number of chips, the number of pinholes is normal, and the next step S6 is executed. If the number of pinholes is not less than one percent of the number of chips, the number of pinholes is too large, which greatly prolongs the time for solving the pinhole positions, and too many pinholes may destroy the internal stress on the wafer expansion ring 5, causing the overall mechanical properties of the wafer expansion ring 5 to change and cannot be used for subsequent processes. In this embodiment, the spacing of the target matrix of chips can be adjusted from 0.40 mm to 0.41 mm, and then execution starts from step S2 to make the distribution of chips more uniform.

[0123] like Figure 2 As shown, another embodiment of the present invention is a chip spacing control device based on film breaking, comprising:

[0124] A vision module, configured to acquire a chip image and send it to an operation module;

[0125] An operation module, configured to receive the chip image from the vision module, calculate the coordinates of all chips with the center of the expansion ring as the coordinate origin, generate a first position matrix based on the position coordinates of each chip before film breaking, and construct a target matrix of the chips according to the first position matrix;

[0126] Construct a first set of deformation vectors of the chips according to the first position matrix and the target matrix;

[0127] Generate a second set of deformation vectors based on the position coordinates of each chip after film breaking and the first position matrix, and obtain the unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second set of deformation vectors;

[0128] Iterate the objective function based on all the unit deformation vectors and the first set of deformation vectors, and adjust the pinhole coordinates when iterating the objective function;

[0129] Adjust the number of pinholes based on the value of the objective function and a preset expected value, compare the number of pinholes with the number of chips, and decide whether to adjust the target matrix and re-execute the subsequent steps or send the adjusted pinhole coordinates to a moving module according to the comparison result;

[0130] A moving module, configured to receive the pinhole coordinates sent by the operation module and control the needle to pierce the back film based on the adjusted pinhole coordinates.

[0131] Specifically, the chip pitch control device based on film breaking provided in this embodiment can also be implemented as the Figure 3 shown chip pitch control device. The chip pitch control device based on film breaking provided in this embodiment implements a chip pitch control method and implementation process based on film breaking. Please refer to the above embodiments and will not be elaborated here one by one.

[0132] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0133] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip spacing control method based on film breaking, characterized in that: The chip spacing control method comprises the steps of: S1: Generate a first position matrix based on the position coordinates of each chip before membrane rupture, and construct a target matrix of the chip according to the first position matrix; S2: constructing a first deformation vector set of the chip according to the first position matrix and the target matrix; S3: generating a second deformation vector set based on the position coordinates of each chip after the membrane is broken and the first position matrix, and obtaining a unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second deformation vector set; S4: iterating the objective function based on all the unit deformation vectors and the first deformation vector set, and adjusting the pinhole coordinates when iterating the objective function; S5: adjusting the number of pinholes based on the value of the objective function and the preset expected value, and comparing the number of pinholes with the number of chips, determining to adjust the target matrix according to the comparison result and jumping to step S2 or executing step S6; S6: Based on the adjusted pinhole coordinates, the needle is controlled to pierce the back film.

2. The chip spacing control method according to claim 1, characterized in that: Step S1 includes: Taking the center of the wafer expansion ring as the coordinate origin, calculate the position coordinates of each chip before breaking the film; Marking the position coordinates of each chip to generate a first position matrix; The average chip spacing in the X-axis direction and the Y-axis direction is calculated according to the first position matrix, and the coordinate origin is taken as the matrix center, and the target matrix of the chip is constructed according to the average chip spacing.

3. The chip spacing control method according to claim 2, characterized in that: After step S3, it is also necessary to determine whether the needle needs to be replaced, including: Obtain the deformation vector corresponding to the first chip on the X-axis in the second deformation vector set; If the length corresponding to the deformation vector of the first chip on the X-axis is greater than the average chip spacing in the X-axis direction or the Y-axis direction, replace the wafer expansion ring and the needle with a smaller diameter, and start again from step S1; If the length corresponding to the deformation vector of the first chip on the X-axis is smaller than the average chip spacing in the X-axis direction or the Y-axis direction and larger than one fifth of the average chip spacing in the X-axis direction or the Y-axis direction, execute step S4; If the length corresponding to the deformation vector of the first chip on the X-axis is not greater than one-fifth of the average chip spacing in the X-axis direction or the Y-axis direction, replace the wafer expansion ring and the needle with a smaller diameter, and restart from step S1.

4. The chip spacing control method according to claim 1, characterized in that: According to the quadratic spline interpolation method and the second deformation vector set, the unit deformation vector corresponding to each chip and the pinhole includes: Obtain the position coordinates of each chip before membrane rupture and the deformation vector of each chip in the second deformation vector set, and use the quadratic spline interpolation method to calculate the coefficient of the spline in the interval between every two chips to satisfy the relationship: ； in, Indicates the first Line The deformation vector of the chip of the column, Before rupture of membranes Line The X-axis position coordinates of the chip in the column, , and Represents the coefficient of the spline in every two-chip interval.

5. The chip spacing control method according to claim 4, characterized in that: The unit deformation vector corresponding to each chip and the pinhole obtained by the quadratic spline interpolation method and the second deformation vector set also includes: Get the distance between the chip and the pinhole; The displacement of the chip after the film is broken is calculated based on the coefficient of the spline in each interval between two chips and the distance between the chip and the pinhole, satisfying the relationship: ； in, Indicates the displacement of the chip after the membrane is broken. , and Represents the coefficient of the spline in every two-chip interval, Indicates the distance between the chip and the pinhole; The displacement of the chip after the membrane is broken and the direction of the pinhole pointing to the chip form a unit deformation vector.

6. The chip spacing control method according to claim 1, characterized in that: Iterating the objective function based on all the unit deformation vectors and the first deformation vector set, adjusting the pinhole coordinates when iterating the objective function includes: All unit deformation vectors are superimposed to obtain the total deformation vector; The average distance between all chips and the target matrix is ​​calculated based on the total deformation vector and the first deformation vector set, satisfying the relationship: ； in, represents the objective function, represents the total deformation vector, Indicates the number of chips, represents a first deformation vector set; Gradually adjust the coordinates of the pinhole until the objective function No longer changes, record the adjusted pinhole coordinates.

7. The chip spacing control method according to claim 1, characterized in that: In step S5, adjusting the number of pinholes based on the value of the objective function and the preset expected value includes: Set expectations; If the value of the objective function is not less than the expected value, the number of pinholes is increased; If the value of the objective function is less than the expected value, the number of pinholes remains unchanged.

8. The chip spacing control method according to claim 7, characterized in that: Comparing the number of pinholes with the number of chips, and determining to adjust the target matrix according to the comparison result and jumping to step S2 or executing step S6 include: If the number of pinholes is less than one percent of the number of chips, execute step S6; If the number of pinholes is not less than 1% of the number of chips, the chip spacing of the target matrix is ​​increased and the process starts again from step S2.

9. A chip spacing control device based on film breaking, characterized in that: include: The visual module is used to obtain chip images and send them to the computing module; The computing module is used to receive the chip image from the visual module, calculate the coordinates of all chips with the center of the wafer expansion ring as the coordinate origin, and perform the following steps: S1: Generate a first position matrix based on the position coordinates of each chip before membrane rupture, and construct a target matrix of the chip according to the first position matrix; S2: constructing a first deformation vector set of the chip according to the first position matrix and the target matrix; S3: generating a second deformation vector set based on the position coordinates of each chip after the membrane is broken and the first position matrix, and obtaining a unit deformation vector corresponding to each chip and the pinhole according to the quadratic spline interpolation method and the second deformation vector set; S4: iterating the objective function based on all the unit deformation vectors and the first deformation vector set, and adjusting the pinhole coordinates when iterating the objective function; S5: adjusting the number of pinholes based on the value of the objective function and the preset expected value, and comparing the number of pinholes with the number of chips, and deciding to adjust the target matrix according to the comparison result and jump to step S2 or send the adjusted pinhole coordinates to the mobile module; The moving module is used to receive the pinhole coordinates sent by the computing module and control the needle to puncture the back film based on the adjusted pinhole coordinates.

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