Vacuum suction nozzle, bonding head and bonding method

Abstract

The invention discloses a vacuum suction nozzle, a bonding head and a bonding method. The vacuum suction nozzle comprises a body, the interior of the body comprises a first cavity and a second cavity surrounding the first cavity, positive pressure is introduced into the first cavity, and negative pressure is introduced into the second cavity; the skin is located on the upper surface, communicated with the first cavity and the second cavity, of the body, and air holes are distributed in the area corresponding to the second cavity, so that a bulged adsorption part with the adjustable spherical surface height is formed through cooperation of positive pressure in the first cavity and negative pressure in the second cavity; and adsorbing the to-be-bonded piece into a corresponding bulged spherical shape. The chip bonding device is simple in structure, low in cost and capable of meeting the bonding requirements of various different chips, the compatibility of equipment to the chips is improved, the precision and efficiency of combined bonding of the various chips are improved, and therefore the productivity of a machine table is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a vacuum nozzle, a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] In the hybrid bonding process of chips to wafer, the source of bonding force is mainly van der Waals force. In order to prevent bubbles from being generated during chip bonding, a nozzle structure with a spherical nozzle surface is required. When bonding the chip to the wafer, the spherical nozzle structure allows the chip to be bonded to contact the wafer at one point first, and then the van der Waals force diffuses the bonding wave to complete the bonding.

[0003] Due to the influence of the front-end photolithography process, the distance between the patterns on the wafer is easily affected and becomes different, that is, the circuit size on the wafer will be slightly different. This will cause the mark on the chip in the original state to not completely correspond to the mark on the wafer when the chip is bonded, thus affecting the bonding. In this regard, the prior art uses a bonding head to deform the chip to a certain extent before bonding to compensate for the error caused by photolithography so that the marks on the chip and the wafer can correspond.

[0004] However, the nozzle of the current bonding head is of fixed height. Since different chips require different nozzle spherical heights, it is necessary to replace multiple bonding heads with different nozzle heights on the equipment each time to bond multiple chips to a wafer. This method is costly and has poor replacement consistency, which requires longer calibration time and affects the actual production capacity of the machine. In addition, the current bonding head cannot ensure that the suction part of the nozzle is always spherical, and a spherical nozzle is conducive to chip bonding.

[0005] In order to solve the above-mentioned problems existing in the prior art, the art is in urgent need of a vacuum nozzle technology with simple structure, low cost, and the ability to adapt to the bonding requirements of a variety of different chips, improve the compatibility of the equipment with chips, and improve the accuracy and efficiency of the joint bonding of multiple chips, thereby improving the machine's production capacity. Summary of the invention

[0006] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a vacuum nozzle, a bonding head, a bonding device, and a computer-readable storage medium, which have a simple structure and low cost, and can adapt to the bonding requirements of a variety of different chips, improve the compatibility of the equipment with chips, and improve the accuracy and efficiency of the joint bonding of multiple chips, thereby improving the machine's production capacity.

[0008] Specifically, the above-mentioned vacuum suction nozzle provided according to the first aspect of the present invention includes: a main body, which includes a first cavity and a second cavity surrounding the first cavity, wherein positive pressure is introduced into the first cavity and negative pressure is introduced into the second cavity; and a skin, which is located on the upper surface of the main body connected to the first cavity and the second cavity, and has air holes distributed in the area corresponding to the second cavity, so as to form a bulging spherical height-adjustable adsorption portion through the cooperation of the positive pressure in the first cavity and the negative pressure in the second cavity, so as to adsorb the bonded parts into the corresponding bulging spherical shape.

[0009] Furthermore, in some embodiments of the present invention, the parts to be bonded include a variety of different chips, and the adsorption portion adsorbs each chip corresponding to at least one of the spherical surface heights.

[0010] Furthermore, in some embodiments of the present invention, it also includes: a base, with a first hollow portion at the center thereof, the first hollow portion and the non-porous area in the skin located on the upper surface thereof constitute the first cavity, an outer chamber, which is assembled and matched by two half chambers, with a second hollow portion at the center thereof, and the size of the second hollow portion is larger than the first hollow portion, so that the outer chamber can be sleeved on the outside of the base, the space between the second hollow portion and the side wall of the base, and the pore area in the skin located on the upper surface thereof constitute the second cavity.

[0011] Furthermore, in some embodiments of the present invention, the first cavity and the second cavity are respectively connected to corresponding electromagnetic proportional valves for respectively adjusting the positive pressure and negative pressure in the first cavity and the second cavity.

[0012] Furthermore, in some embodiments of the present invention, the center of the skin is a cavity structure, and the skin thickness of the non-porous area on the upper part of the cavity structure is smaller than the skin thickness of the pore area around the cavity structure, and multiple air channels are distributed in the pore area of ​​the skin to connect the second cavity and the pores on the surface.

[0013] Furthermore, in some embodiments of the present invention, the vacuum suction nozzle also includes a controller, which is configured to: obtain a target deformation degree of the workpiece to be bonded; determine a spherical height of the bulge of the adsorption portion based on the target deformation degree; determine a preset positive pressure value in the first cavity and a preset negative pressure value in the second cavity based on the spherical height; and adjust the air pressure in the first cavity to the preset positive pressure value, and adjust the air pressure in the second cavity to the preset negative pressure value, so that the workpiece to be bonded adsorbed by the adsorption portion reaches the target deformation degree.

[0014] In addition, the above-mentioned bonding head provided according to the second aspect of the present invention includes the above-mentioned vacuum suction nozzle provided by the first aspect of the present invention, wherein the controller is configured to: determine the target deformation degree of the part to be bonded according to the patch area on the bonding target; use the vacuum suction nozzle to make the part to be bonded adsorbed by its adsorption part reach the target deformation degree; and bond the part to be bonded to the patch area from the inside out.

[0015] In addition, the above-mentioned bonding method provided according to the third aspect of the present invention includes the following steps: determining the target deformation degree of the part to be bonded according to the patch area on the bonding target; inflating the adsorption portion of the vacuum nozzle in the above-mentioned bonding head provided by the second aspect of the present invention to the target spherical height so that the adsorbed part to be bonded reaches the target deformation degree; and bonding the part to be bonded to the patch position from the inside out.

[0016] Further, in some embodiments of the present invention, the bonding target includes a wafer, and the step of determining the target deformation degree of the part to be bonded based on the patch area on the bonding target includes: acquiring an image of the bonding target and obtaining the patch area thereon; in response to the patch area being located in a first area on the wafer, determining the target deformation degree to be a first deformation degree; and in response to the patch area being located in a second area on the wafer, determining the target deformation degree to be a second deformation degree, wherein the first area is located in a flat area of ​​the wafer, the second area is located in a curved area of ​​the wafer, and the first deformation degree is less than the second deformation degree.

[0017] Furthermore, in some embodiments of the present invention, a first mark is provided on the patch area, and a second mark is provided on the component to be bonded, and the step of bonding the component to be bonded to the patch area from the inside out includes: after aligning the second mark with the first mark, moving the adsorption portion that is bulged to the target spherical height so that the center of the component to be bonded contacts the wafer point for positioning pre-bonding; and reducing the negative pressure in the second cavity in the vacuum suction nozzle to release the edge of the component to be bonded from the adsorption portion, thereby completing the bonding of the component to be bonded to the patch area from the inside out.

[0018] In addition, according to the fourth aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the above bonding method provided by the third aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0020] Figure 1 An exploded view of a vacuum nozzle provided according to some embodiments of the present invention is shown;

[0021] Figure 2 shows a side cross-sectional view of a vacuum nozzle provided according to some embodiments of the present invention;

[0022] Figure 3 It shows a schematic structural diagram of an adsorption portion provided according to some embodiments of the present invention; and

[0023] Figure 4 A flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0024] Reference numerals:

[0025] 100 Vacuum nozzle;

[0026] 110 ontology;

[0027] 120 skin;

[0028] 121 nonporous area;

[0029] 122 Stomatal region;

[0030] 130 base;

[0031] 131 First Hollow;

[0032] 132 sealing ring;

[0033] 140 half chamber;

[0034] 141 Second Hollow;

[0035] 210 first cavity;

[0036] 220 second cavity;

[0037] 300 adsorption part;

[0038] 310 airway;

[0039] 311 pores;

[0040] 320 cavity structure; and

[0041] Steps S410 to S430. DETAILED DESCRIPTION

[0042] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0045] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0046] As mentioned above, the nozzle of the current bonding head is of fixed height. Since different chips require different nozzle spherical heights, it is necessary to replace multiple bonding heads with different nozzle heights on the equipment each time to bond multiple chips to a wafer. This method is costly and has poor replacement consistency, which requires longer calibration time and affects the actual production capacity of the machine.

[0047] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a vacuum nozzle, a bonding head, a bonding device, and a computer-readable storage medium, which have a simple structure and low cost, and can adapt to the bonding requirements of a variety of different chips, improve the compatibility of the equipment with chips, and improve the accuracy and efficiency of the joint bonding of multiple chips, thereby improving the machine's production capacity.

[0048] In some non-limiting embodiments, the vacuum nozzle provided in the first aspect of the present invention can be configured in the bonding head provided in the second aspect of the present invention, and the bonding method provided in the third aspect of the present invention can be implemented based on the bonding head provided in the second aspect of the present invention.

[0049] Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, can be used to implement the bonding method provided in the third aspect of the present invention.

[0050] The working principle of the above vacuum nozzle will be described below in conjunction with some embodiments of bonding heads and bonding methods. Those skilled in the art will understand that these embodiments of bonding heads and bonding methods are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the vacuum nozzle. Similarly, the vacuum nozzle is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the configuration objects in these bonding heads and the implementation subjects of each step in the bonding method.

[0051] Please see Figure 1 , Figure 1 An exploded view of a vacuum nozzle provided according to some embodiments of the present invention is shown.

[0052] like Figure 1 As shown, in some embodiments of the present invention, the vacuum nozzle 100 may include a body 110 and a peek 120 (peek). The interior of the body 110 may include a first cavity, and a second cavity surrounding the first cavity, wherein positive pressure may be introduced into the first cavity, and negative pressure may be introduced into the second cavity. The peek 120 may be located on the upper surface of the body 110 connected to the first cavity and the second cavity, and pores may be distributed in the area corresponding to the second cavity, so as to form a bulging spherical height-adjustable adsorption portion through the cooperation of the positive pressure in the first cavity and the negative pressure in the second cavity, and adsorb the bonded part into a corresponding bulging spherical shape.

[0053] Optionally, the part to be bonded may include a chip. Since the thickness of the chip is very thin, usually in the range of 40-50 μm, the chip of this thickness is easily deformed during the suction process of the suction nozzle. Furthermore, precisely because the chip is very fragile, the vacuum suction nozzle 100 can use a softer material, such as a skin, as the suction end to contact the chip. The elastic properties of the material also make it feasible to change the height of the spherical surface of the suction part.

[0054] For more details, please see Figure 1 In some embodiments, the vacuum nozzle 100 may include a base 130, the center of which may be provided with a first hollow portion 131. Figure 2 Common understanding, Figure 2 FIG. 2 shows a side cross-sectional view of a vacuum nozzle provided according to some embodiments of the present invention. Figure 2 As shown, the first hollow portion 131 and the non-porous area 121 in the skin 120 located on the upper surface thereof can form the above-mentioned first cavity 210. Figure 1 and 2 As shown, a sealing ring 132 may be provided on the outer side of the first hollow portion 131 to ensure the airtightness of the first cavity 210 .

[0055] Continue back Figure 1 The vacuum nozzle 100 may further include an outer chamber. Optionally, the outer chamber may be assembled from two half chambers 140, a second hollow portion 141 may be provided at the center thereof, and the size of the second hollow portion 141 may be larger than the first hollow portion 131, so that the half chamber 140 may be sleeved on the outer side of the base 130. Figure 2 As shown, when the outer side walls of the skin 120 and the base 130 are wrapped by two half chambers 140 and fixedly matched, the above-mentioned second cavity 220 is formed.

[0056] Further, in some optional embodiments, the first cavity 210 can be connected to a booster pump for introducing compressed gas into the first cavity 210 so that the skin 120 in the non-porous area 121 on its upper surface bulges upward to form a bulging spherical shape. In other words, the positive pressure first cavity 210 can be used to change the shape of the middle part of the skin 120. The second cavity 220 can be connected to a negative pressure pump (such as a vacuum pump) for extracting gas from the second cavity 220 so that the skin 120 in the pore area 122 on its upper surface is close to the surface of the body 110, so that the spherical height of the vacuum nozzle 100 can change according to the size of the positive and negative air pressure. In addition, the skin 120 with pores on the upper surface of the second cavity 220 with negative pressure can absorb the bonded parts by negative pressure vacuum. In this embodiment, the spherical height of the suction portion 300 of the vacuum suction nozzle 100 can be adjusted by only calibrating the corresponding relationship between the change in the bulging deformation value of the skin 120 and the positive and negative air pressures.

[0057] Optionally, in some embodiments, corresponding electromagnetic proportional valves can be connected between the first cavity 210 and the booster pump, and between the second cavity 220 and the vacuum pump. The electromagnetic proportional valve is a valve that can change the air pressure through software control. In this embodiment, the electromagnetic proportional valve can be used to adjust the positive pressure and negative pressure in the first cavity 210 and the second cavity 220, respectively, so as to adjust the spherical height of the adsorption part. When the electromagnetic proportional valve connected to the first cavity 210 is opened, the booster pump introduces compressed gas into the first cavity 210 to increase the pressure. And the larger the opening of the electromagnetic proportional valve, the more compressed gas is introduced, the greater the positive pressure in the first cavity 210, and the higher the spherical height of the adsorption part. Conversely, the lower the spherical height of the adsorption part. When the electromagnetic proportional valve connected to the second cavity 220 is opened, the second cavity 220 can be connected to the true hole, at which time the vacuum suction nozzle 100 can adsorb the part to be bonded, and when this electromagnetic proportional valve is closed, the vacuum suction nozzle 100 can release the part to be bonded.

[0058] At this point, even if the bulging deformation value of the skin can be changed by compressed gas, the suction nozzle used to absorb the wafer is small in structure and the force of compressed gas in a closed environment is equal everywhere, and the suction nozzle still needs to absorb the chip in the end, so a vacuum air path is bound to be required on the suction nozzle to absorb the chip. It is necessary to pass positive pressure and negative pressure at the same time in a very small space. From a technological point of view, it is best to make the entire surface of the suction nozzle form a spherical shape, but in this way there is no space to arrange a negative pressure airway.

[0059] For this, see Figure 3 , Figure 3 A schematic structural diagram of an adsorption portion provided according to some embodiments of the present invention is shown.

[0060] like Figure 3As shown, in some preferred embodiments, in the adsorption portion 300 of the vacuum nozzle 100, the center of the skin 120 can be a cavity structure 320, and the skin thickness of the non-porous area 121 on the upper part of the cavity structure 320 can be smaller than the skin thickness of the pore area 122 around the cavity structure 320. As a result, the skin 120 in the non-porous area above the first cavity 210 can more easily produce a significant change in spherical height due to the change in the positive pressure in the first cavity 210, which is beneficial to accurately adjust the spherical height of the adsorption portion 300 by changing the air pressure, thereby accurately adjusting the deformation degree of the adsorbed parts to be bonded.

[0061] Continue as Figure 3 As shown, in some embodiments, a plurality of air channels 310 are distributed in the air hole area 122 of the skin 120 around the cavity structure 320, so as to connect the second cavity 220 providing negative pressure and the surface air holes 311 within a limited small space, thereby adsorbing the parts to be bonded.

[0062] Furthermore, in some embodiments, the bonding parts that can be adsorbed by the vacuum nozzle 100 may include a variety of different chips, which may have different sizes, different circuits designed thereon, different thicknesses, etc. Moreover, when the adsorption part adsorbs each chip, it may correspond to at least one spherical height, so that a plurality of spherical shapes with different tensile deformation degrees of different chips can be obtained.

[0063] In addition, in some embodiments, the vacuum nozzle 100 may further include a controller. The controller may be configured as follows: first, a target deformation degree of the part to be bonded may be obtained. Then, based on the target deformation degree, the spherical height of the bulge of the adsorption portion 300 is determined. Afterwards, based on the spherical height, a preset positive pressure value in the first cavity 210 and a preset negative pressure value in the second cavity 220 may be determined. Finally, the air pressure in the first cavity 210 may be adjusted to a preset positive pressure value, and the air pressure in the second cavity 220 may be adjusted to a preset negative pressure value, so that the part to be bonded adsorbed by the adsorption portion 300 can reach the target deformation degree.

[0064] On this basis, the present invention also provides a bonding head, which may include the above-mentioned vacuum suction nozzle 100. In addition, the controller in the bonding head may be configured to determine the target deformation degree of the part to be bonded according to the patch area on the bonding target. Then, the controller may use the vacuum suction nozzle to make the part to be bonded adsorbed by its adsorption part reach the target deformation degree. Finally, the controller may control the bonding head to bond the bonding part to the patch area from the inside out.

[0065] Next, the working principle of the vacuum nozzle 100 and the bonding head will be more comprehensively described through some embodiments of the bonding method. Figure 4 , Figure 4A flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0066] like Figure 4 As shown, in some embodiments, the bonding method may include the following steps: First, step S410 may be performed: determining a target deformation degree of the to-be-bonded component according to a patch area on a bonding target.

[0067] Specifically, in some embodiments, the bonding target may include a wafer, and the to-be-bonded piece may include a chip. The controller may capture an image of the wafer through a camera module, such as a 3D camera, and then obtain the chip bonding area on the wafer from the image.

[0068] Since the areas on the wafer surface where the chips need to be attached are different, the chips attached to different positions need to be stretched and deformed to different degrees before bonding. When the chip attachment area is located in the first area on the wafer, the target deformation degree can be determined to be the first deformation degree. When the chip attachment area is located in the second area on the wafer, the target deformation degree can be determined to be the second deformation degree, wherein the first area can be located in the flat area of ​​the wafer, the second area is located in the curved area of ​​the wafer, and the first deformation degree is less than the second deformation degree.

[0069] For example, the first area may be a relatively flat area at the center of the wafer. In this case, the chip to be bonded to the central flat area does not need to undergo a large tensile deformation, so the target deformation degree can be determined as the first deformation degree with a smaller tensile degree. The second area may be a relatively curved area at the edge of the wafer. In this case, the chip to be bonded to the edge curved area needs to undergo a large tensile deformation to fully fit the patch area at the edge area. Therefore, the target deformation degree can be determined as the second deformation degree with a larger tensile degree.

[0070] Continue as Figure 4 As shown, step S420 may be performed: the suction portion of the vacuum suction nozzle in the bonding head is inflated to a target spherical height so that the suctioned bonded component reaches a target deformation degree.

[0071] Specifically, combined Figure 1 and Figure 2 As shown, the positive and negative air pressures in the first cavity 210 and the second cavity 220 located below the adsorption part 300 in the vacuum nozzle 100 can be adjusted so that the adsorption part 300 with adjustable spherical height formed by the cooperation of the positive pressure in the first cavity 210 and the negative pressure in the second cavity 220 can reach the target spherical height corresponding to the target deformation degree. At this time, the adsorbed chip can reach the target deformation degree.

[0072] Continue as Figure 4As shown, step S430 may be performed: bonding the component to be bonded to the bonding position of the bonding target from the inside out.

[0073] Specifically, in some implementations, since various circuits can be photoetched on the wafer and chip, in order to ensure that the circuits can correspond when the two are bonded, marks are usually engraved in the blank areas of the wafer and chip, and then the position of the circuit is fed back through the marks. During bonding, you only need to identify the position of the marks on the two to know the position of the chip and the patch position on the wafer where the chip needs to be pasted to ensure that the circuit can be completely matched. Therefore, a first mark can be provided on the patch area of ​​the wafer, and a second mark can be provided on the chip to be bonded, which is used to align the wafer and the chip.

[0074] After aligning the second mark on the chip with the first mark on the wafer, move the adsorption part that is bulged to the target spherical height so that the center of the chip to be bonded makes point contact with the wafer, thereby performing positioning pre-bonding. If the chip is offset during point contact, the vacuum nozzle 100 can be moved for positioning adjustment to ensure the accuracy of bonding. When the chip is accurately positioned, the controller can reduce the negative pressure in the second cavity 220 in the vacuum nozzle 100 to gradually release the edge of the chip from the adsorption part 300, completing the bonding of the chip to be bonded to the patch area on the wafer from the inside out.

[0075] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0076] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0077] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0078] In summary, the present invention provides a vacuum nozzle, a bonding head, a bonding device, and a computer-readable storage medium, which have a simple structure and low cost, and can adapt to the bonding requirements of a variety of different chips, improve the compatibility of the equipment with chips, and improve the accuracy and efficiency of the joint bonding of multiple chips, thereby improving the machine's production capacity.

[0079] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum nozzle, characterized in that: include: A body, the interior of which includes a first cavity and a second cavity surrounding the first cavity, wherein a positive pressure is introduced into the first cavity and a negative pressure is introduced into the second cavity; as well as The skin is located on the upper surface of the body connected to the first cavity and the second cavity, and air holes are distributed in the area corresponding to the second cavity, so as to form a bulging spherical height-adjustable adsorption portion through the cooperation of the positive pressure in the first cavity and the negative pressure in the second cavity, so as to adsorb the bonded parts into the corresponding bulging spherical shape.

2. The vacuum nozzle according to claim 1, characterized in that: The parts to be bonded include a variety of different chips, and the adsorption portion adsorbs each chip corresponding to at least one of the spherical surface heights.

3. The vacuum nozzle according to claim 1, wherein: Also includes: A base, wherein a first hollow portion is provided at the center thereof, wherein the first hollow portion and a non-porous area in the skin on the upper surface thereof constitute the first cavity, The outer chamber is assembled by two half chambers, and a second hollow part is provided in the center. The size of the second hollow part is larger than the first hollow part, so that the outer chamber is sleeved on the outside of the base. The space between the second hollow part and the side wall of the base and the air hole area in the skin located on its upper surface constitute the second cavity.

4. The vacuum nozzle according to claim 1, wherein: The first cavity and the second cavity are respectively connected to corresponding electromagnetic proportional valves for respectively adjusting the positive pressure and negative pressure in the first cavity and the second cavity.

5. The vacuum nozzle according to claim 1, wherein: The center of the skin is a cavity structure, and the skin thickness of the non-porous area on the upper part of the cavity structure is smaller than the skin thickness of the pore area around the cavity structure. Multiple air channels are distributed in the pore area of ​​the skin to connect the second cavity and the pores on the surface.

6. The vacuum nozzle according to claim 1, wherein: The vacuum nozzle further comprises a controller configured to: Obtaining a target deformation degree of the parts to be bonded; Based on the target deformation degree, determining the spherical height of the adsorption portion; Based on the spherical surface height, determining a preset positive pressure value in the first cavity and a preset negative pressure value in the second cavity; as well as The air pressure in the first cavity is adjusted to the preset positive pressure value, and the air pressure in the second cavity is adjusted to the preset negative pressure value, so that the bonding component adsorbed by the adsorption portion reaches the target deformation degree.

7. A bonding head, characterized in that: The vacuum nozzle according to any one of claims 1 to 6, wherein the controller is configured to: Determining a target deformation degree of the to-be-bonded component according to a patch area on a bonding target; Using the vacuum suction nozzle, the bonding member sucked by its sucking portion reaches the target deformation degree; and The component to be bonded is bonded to the patch area from the inside out.

8. A bonding method, characterized in that: The following steps are involved: Determining a target deformation degree of the to-be-bonded component according to a patch area on a bonding target; By inflating the suction portion of the vacuum suction nozzle in the bonding head as claimed in claim 7 to a target spherical height, so that the bonded part sucked by the vacuum suction nozzle reaches the target deformation degree; and Bond the component to be bonded to the patch position from the inside out.

9. The bonding method according to claim 8, characterized in that: The bonding target includes a wafer, and the step of determining the target deformation degree of the to-be-bonded component according to the patch area on the bonding target includes: Collecting an image of the bonding target and acquiring the patch area thereon; In response to the patch area being located in a first area on the wafer, determining the target deformation degree to be a first deformation degree; and In response to the patch area being located in a second area on the wafer, the target deformation degree is determined to be a second deformation degree, wherein the first area is located in a flat area of ​​the wafer, the second area is located in a curved area of ​​the wafer, and the first deformation degree is less than the second deformation degree.

10. The bonding method according to claim 9, characterized in that: The patch area is provided with a first mark, the part to be bonded is provided with a second mark, and the step of bonding the part to be bonded to the patch area from the inside to the outside comprises: After aligning the second mark with the first mark, moving the adsorption portion to the target spherical height so that the center of the to-be-bonded component contacts the wafer point for positioning pre-bonding; and The negative pressure in the second cavity of the vacuum nozzle is reduced to release the edge of the component to be bonded from the adsorption portion, thereby completing the bonding of the component to be bonded to the patch area from the inside out.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to any one of claims 8 to 10 is implemented.

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