Power device and semiconductor device

Abstract

The invention provides a power device and a semiconductor device. The power device comprises a shell and a supporting piece, the shell comprises a top wall, an abutting piece and a bottom wall, the top wall and the bottom wall are oppositely arranged in the first direction, the abutting piece is connected between the top wall and the bottom wall, the shell is further provided with a through hole, and the through hole extends in the first direction and penetrates through the top wall, the abutting piece and the bottom wall; therefore, the fastener can pass through the through hole to fix the power device on the target installation piece. The supporting piece is connected between the top wall and the bottom wall and arranged along the periphery of the abutting piece. According to the invention, the reliability of the power device can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a power device and a semiconductor apparatus. Background Art

[0002] Power devices are composed of related power electronic components packaged according to certain functional combinations. Power devices have the advantages of high current density, high voltage resistance, high input impedance, high switching frequency and low driving power, and can be used for frequency conversion, amplification or voltage stabilization.

[0003] Power devices usually need to be mounted on target mounting parts, such as heat sinks, by fasteners. However, the fasteners will exert pressure on the part of the power device that contacts the target mounting part, making it easy for this part of the power device to crack under pressure, seriously affecting the reliability of the power device. Therefore, how to effectively improve the reliability of power devices is an urgent problem to be solved. Summary of the invention

[0004] In view of the above problems, the present application provides a power device and a semiconductor device, which can effectively improve the reliability of the power device.

[0005] In a first aspect, an embodiment of the present application provides a power device, the power device includes a housing and a support member, the housing includes a top wall, a support member and a bottom wall, the top wall and the bottom wall are arranged oppositely along a first direction, the support member is connected between the top wall and the bottom wall, and the housing is further provided with a through hole, the through hole extends along the first direction and penetrates the top wall, the support member and the bottom wall, so that a fastener can pass through the through hole to fix the power device to a target mounting member. The support member is connected between the top wall and the bottom wall and is arranged along the periphery of the support member.

[0006] In some embodiments of the first aspect, the support member is disposed around the abutment member.

[0007] In some embodiments of the first aspect, there are multiple support members, and the multiple support members are arranged at intervals along the outer circumference of the supporting member.

[0008] In some embodiments of the first aspect, the plurality of support members include a first support member, a second support member, and a third support member, a first straight line is provided between the projections of the first support member and the second support member on the bottom wall along the first direction, a second straight line is provided between the projections of the first support member and the third support member on the bottom wall along the first direction, and a third straight line is provided between the projections of the second support member and the third support member on the bottom wall along the first direction. The first straight line, the second straight line, and the third straight line form a triangle, and the projection of the abutment member on the bottom wall along the first direction is located inside the triangle.

[0009] In some embodiments of the first aspect, the bottom wall includes a substrate and a metal layer, the metal layer is arranged on the side of the substrate facing the top wall, the compressive strength of the metal layer is greater than the compressive strength of the substrate, and the support member is connected between the top wall and the metal layer.

[0010] In some embodiments of the first aspect, the top wall includes a connected main body portion and a connecting portion, the connecting portion is located at the geometric center of the top wall, the through hole extends along a first direction and passes through the connecting portion, the supporting member and the bottom wall, the supporting member is connected between the connecting portion and the bottom wall, and the supporting member is connected between the connecting portion and the bottom wall.

[0011] In some embodiments of the first aspect, a convex portion is provided on a side of the connecting portion facing the bottom wall, and the convex portion protrudes from a side surface of the main body portion facing the bottom wall along a first direction and close to the bottom wall.

[0012] In some embodiments of the first aspect, a recess is provided on a side of the connection portion facing away from the bottom wall, the recess is recessed along the first direction and close to the bottom wall, and a position of the protrusion corresponds to a position of the recess.

[0013] In some embodiments of the first aspect, a groove is formed at one end of the supporting member facing the bottom wall, and the groove is recessed along the first direction and away from the bottom wall.

[0014] In a second aspect, the present application provides a semiconductor device, comprising a heat sink, a fastener, and a power device provided by any embodiment of the first aspect, wherein the fastener passes through a through hole to fix the power device to the heat sink.

[0015] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0017] Figure 1 A schematic diagram of an assembly structure of a power device provided in some embodiments of the present application;

[0018] Figure 2 for Figure 1 Schematic diagram of the cross-section structure along AA;

[0019] Figure 3 A schematic diagram of the structure of a power device provided in some embodiments of the present application;

[0020] Figure 4 for Figure 3 Schematic diagram of the cross-section structure along BB;

[0021] Figure 5 A schematic diagram of the structure of another power device provided in some embodiments of the present application;

[0022] Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along CC.

[0023] The reference numerals in the specific implementation manner are as follows:

[0024] 100, power device; 200, fastener; 300, target mounting part;

[0025] 10. housing; 11. top wall; 111. main body; 112. connection part; 12. abutment member; 13. bottom wall; 131. substrate; 132. metal layer; 14. through hole;

[0026] 20, support member; 20a, first support member; 20b, second support member; 20c, third support member;

[0027] 30, convex part; 40, concave part; 50, groove;

[0028] L, first straight line; M, second straight line; N, third straight line;

[0029] X, first direction. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by technicians in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary and secondary relationship.

[0032] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.

[0033] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] The term "and / or" in this application is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this application generally indicates that the associated objects before and after are in an "or" relationship.

[0035] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.

[0036] The term "plurality" used in the present application refers to two or more (including two).

[0037] In the present application, the term "parallel" includes not only the absolutely parallel situation, but also the roughly parallel situation conventionally recognized in engineering; meanwhile, "vertical" includes not only the absolutely vertical situation, but also the roughly vertical situation conventionally recognized in engineering.

[0038] Power devices are composed of related power electronic components packaged according to certain functional combinations. Power devices have the advantages of high current density, high voltage resistance, high input impedance, high switching frequency and low driving power, and can be used for frequency conversion, amplification or voltage stabilization.

[0039] Power devices usually need to be mounted on target mounting parts, such as heat sinks, by fasteners. However, the fasteners will exert pressure on the part of the power device that contacts the target mounting part, making this part of the power device easily cracked under pressure, seriously affecting the reliability of the power device.

[0040] Based on the above considerations, the present application designs a power device, which includes a housing and a support member, the housing includes a top wall, a support member and a bottom wall, the top wall and the bottom wall are arranged opposite to each other along a first direction, the support member is connected between the top wall and the bottom wall, and the housing is also provided with a through hole, which extends along the first direction and penetrates the top wall, the support member and the bottom wall, so that a fastener can pass through the through hole to fix the power device to a target mounting member. The support member is connected between the top wall and the bottom wall and is arranged along the periphery of the support member.

[0041] The above technical solution introduces a support member. After the fastener passes through the through hole to fix the power device to the heat sink, part of the pressure applied by the fastener is directly transmitted to the bottom wall through the abutment member, and the other part of the pressure can be transmitted to the bottom wall through the support member. The support member can not only share part of the stress originally borne by the abutment member, but also distribute these stresses to a larger bottom wall area, so that the pressure applied by the fastener can be reasonably distributed and transmitted, so that the bottom wall can form a state of multi-point stress, effectively reducing the local stress on the bottom wall at the abutment member position, reducing the risk of cracking or deformation of the bottom wall at the abutment member position, thereby effectively improving the reliability of the power device.

[0042] In addition, since the risk of cracking or deformation of the bottom wall is reduced, the stability between the bottom wall and the target mounting part is enhanced, and the contact area between the bottom wall and the target mounting part is relatively fixed, so that the thermal interface resistance can also be improved. In addition, the setting cost of the support member is low, and the introduction of the support member has little impact on the overall cost of the power device.

[0043] Figure 1 A schematic diagram of an assembly structure of a power device provided in some embodiments of the present application, Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along AA.

[0044] like Figure 1 to Figure 2 As shown, the embodiment of the present application provides a power device 100, which includes a housing 10 and a support member 20. The housing 10 includes a top wall 11, a support member 12 and a bottom wall 13. The top wall 11 and the bottom wall 13 are arranged opposite to each other along a first direction X. The support member 12 is connected between the top wall 11 and the bottom wall 13. The housing 10 is also provided with a through hole 14, which extends along the first direction X and penetrates the top wall 11, the support member 12 and the bottom wall 13, so that a fastener 200 can pass through the through hole 14 to fix the power device 100 on the target mounting member 300. The support member 20 is connected between the top wall 11 and the bottom wall 13 and is arranged along the periphery of the support member 12.

[0045] Exemplarily, the housing 10 is a component for forming an internal environment of the power device 100. The formed internal environment can be used to accommodate circuit boards, chips and other components. Optionally, the housing 10 can be made of, but not limited to, metal or non-metal materials. For example, the metal material can be copper, aluminum or stainless steel, etc.; the non-metal material can be polyethylene, polypropylene or polyvinyl chloride, etc.

[0046] The bottom wall 13 of the housing 10 refers to a side wall of the housing 10 that contacts the target mounting component 300 after the power device 100 is mounted on the target mounting component 300. The first direction X can be understood as the arrangement direction of the power device 100 and the target mounting component 300.

[0047] The abutment 12 is abutted between the top wall 11 and the bottom wall 13 to provide a supporting force to resist the pressure applied between the top wall 11 and the bottom wall 13 by the support member 20 after the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink.

[0048] The abutment 12 can be detachably connected between the top wall 11 and the bottom wall 13, or can be integrally arranged between the top wall 11 and the bottom wall 13. The abutment 12 can be directly connected between the top wall 11 and the bottom wall 13, or can be restricted between the top wall 11 and the bottom wall 13 by other components. As an example, the connection method between the abutment 12 and the top wall 11 and the connection method between the abutment 12 and the top wall 11 can be but not limited to plugging, bolting, welding, riveting or bonding, etc.

[0049] In some examples, the abutment 12, the top wall 11 and the bottom wall 13 are integrally formed. On the one hand, there is no need to connect the abutment 12, the top wall 11 and the bottom wall 13 through an additional connection process, which simplifies the manufacturing process. At the same time, compared with connecting the abutment 12, the top wall 11 and the bottom wall 13 through an additional connection process, the abutment 12, the top wall 11 and the bottom wall 13 in an integral structure have a higher connection firmness.

[0050] The abutment 12, top wall 11 and bottom wall 13 may be made of the same material or different materials. As an example, the abutment 12, top wall 11 and bottom wall 13 are made of the same material to simplify the preparation process and help reduce costs.

[0051] Optionally, the abutting member 12 may be, but is not limited to, a columnar structure, a block structure, or a plate structure, etc. The projection shape of the abutting member 12 on the bottom wall 13 along the first direction X may be, but is not limited to, a circle, a rectangle, a triangle, or a polygon, etc.

[0052] The position of the through hole 14 corresponds to the abutment 12. In other words, the projection of the through hole 14 on the bottom wall 13 along the first direction X is located within the projection of the abutment 12 on the bottom wall 13 along the first direction X. The through hole 14 extends along the first direction X and penetrates the top wall 11, the abutment 12 and the bottom wall 13. This means that the through hole 14 extends along the first direction X and penetrates the abutment 12, and also penetrates the portion of the top wall 11 connected to the abutment 12 and the portion of the bottom wall 13 connected to the abutment 12.

[0053] For example, the fastener 200 may be, but is not limited to, a bolt, a rivet, or a snap, etc. The target mounting member 300 may be, but is not limited to, a radiator or a battery, etc.

[0054] The support member 20 is connected between the top wall 11 and the bottom wall 13 and is disposed along the periphery of the abutment member 12 , and is used to distribute and conduct the pressure applied by the fastener 200 after the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink.

[0055] The support member 20 can be detachably connected between the top wall 11 and the bottom wall 13, or can be integrally arranged between the top wall 11 and the bottom wall 13. The support member 20 can be directly connected between the top wall 11 and the bottom wall 13, or can be limited between the top wall 11 and the bottom wall 13 by other components. As an example, the connection method between the support member 20 and the top wall 11 and the connection method between the support member 20 and the top wall 11 can be but not limited to plugging, bolting, welding, riveting or bonding, etc.

[0056] In some examples, the support member 20, the top wall 11 and the bottom wall 13 are integrally formed. On the one hand, there is no need to connect the support member 20, the top wall 11 and the bottom wall 13 through an additional connection process, which simplifies the manufacturing process. At the same time, compared with connecting the support member 20, the top wall 11 and the bottom wall 13 through an additional connection process, the support member 20, the top wall 11 and the bottom wall 13 in an integral structure have a higher connection firmness.

[0057] Optionally, the support member 20 may be but is not limited to being made of metal or non-metal material. For example, the metal material may be copper, aluminum or stainless steel, etc.; the non-metal material may be polyethylene, polypropylene or polyvinyl chloride, etc.

[0058] The support member 20 and the abutment member 12 may be made of the same material or different materials. As an example, the support member 20 and the abutment member 12 are made of the same material to simplify the manufacturing process and help reduce costs.

[0059] Optionally, the support member 20 may be, but is not limited to, a columnar structure, a block structure, or a plate structure, etc. The projection shape of the support member 20 on the bottom wall 13 along the first direction X may be, but is not limited to, a circle, a rectangle, a triangle, or a polygon, etc.

[0060] In some examples, the projection shape of the support member 20 on the bottom wall 13 along the first direction X is the same as the projection shape of the abutment member 12 on the bottom wall 13 along the first direction X, so as to simplify the manufacturing process and help reduce costs.

[0061] The above technical solution introduces the support member 20. After the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink, part of the pressure applied by the fastener 200 is directly transmitted to the bottom wall 13 through the abutment 12, and the other part of the pressure can be transmitted to the bottom wall 13 through the support member 20. The support member 20 can not only share part of the stress originally borne by the abutment 12, but also distribute these stresses to a larger area of ​​the bottom wall 13, so that the pressure applied by the fastener 200 can be reasonably distributed and transmitted, so that the bottom wall 13 can form a state of multi-point stress, effectively reducing the local stress of the bottom wall 13 at the position of the abutment 12, and reducing the risk of cracking or deformation of the bottom wall 13 at the position of the abutment 12, thereby effectively improving the reliability of the power device 100.

[0062] In addition, since the risk of cracking or deformation of the bottom wall 13 is reduced, the stability between the bottom wall 13 and the target mounting member 300 is enhanced, and the contact area between the bottom wall 13 and the target mounting member 300 is relatively fixed, so that the thermal interface resistance can also be improved. In addition, the setting cost of the support member 20 is low, and the introduction of the support member 20 has little impact on the overall cost of the power device 100.

[0063] Figure 3 A schematic diagram of a power device structure provided in some embodiments of the present application is shown in FIG. Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along BB.

[0064] Continue to refer Figure 3 to Figure 4 In some embodiments, the support member 20 is disposed around the abutment member 12. In other words, the support member 20 is an annular structure surrounding the abutment member 12.

[0065] In this embodiment, the number of the supporting members 20 may be one or more, and the supporting members 20 are arranged around the supporting member 12 at least once along the circumference of the supporting member 12. The term "more" refers to two or more.

[0066] In some examples, the number of the support member 20 is one, and the support member 20 surrounds the supporting member 12 for one circle.

[0067] In some other examples, there are multiple support members 20 , each of the multiple support members 20 surrounds the abutment member 12 , and the surrounding radius of each support member 20 gradually increases in a direction away from the abutment member 12 .

[0068] The above technical solution enables the support member 20 to form an integrated force-bearing frame and is evenly distributed around the supporting member 12, which can improve the uniformity of pressure distribution and transmission applied by the support member 20 to the fastener 200, so as to further reduce the risk of cracking or deformation of the bottom wall 13 due to excessive local force, thereby further improving the reliability of the power device 100.

[0069] Figure 5 A schematic diagram of the structure of another power device provided in some embodiments of the present application, Figure 6 for Figure 5 Schematic diagram of the cross-sectional structure along CC.

[0070] Continue to refer Figure 5 to Figure 6 In some embodiments, there are multiple support members 20 , and the multiple support members 20 are arranged at intervals along the outer periphery of the supporting member 12 .

[0071] Exemplarily, the number of the supports 20 may be, but is not limited to, two, three, four or more.

[0072] In the above technical solution, multiple support members 20 are arranged at intervals along the outer periphery of the supporting member 12, which can improve the uniformity of pressure distribution and transmission applied by the support member 20 to the fastener 200 while reducing the internal space occupied by the support member 20 in the outer shell 10, thereby facilitating the layout of the circuit substrate 131, chips and other components in the outer shell 10, and helping to reduce the overall difficulty of preparing the power device 100.

[0073] In some embodiments, along the circumference of the abutment member 12 , reinforcement members are connected between adjacent support members 20 among the plurality of support members 20 to further enhance the structural strength and stability between the plurality of support members 20 .

[0074] In some embodiments, the plurality of support members 20 include a first support member 20a, a second support member 20b, and a third support member 20c, wherein there is a first straight line L between the projections of the first support member 20a and the second support member 20b on the bottom wall 13 along the first direction X, there is a second straight line M between the projections of the first support member 20a and the third support member 20c on the bottom wall 13 along the first direction X, and there is a third straight line N between the projections of the second support member 20b and the third support member 20c on the bottom wall 13 along the first direction X. The first straight line L, the second straight line M, and the third straight line N form a triangle, and the projection of the abutting member 12 on the bottom wall 13 along the first direction X is located inside the triangle.

[0075] Exemplarily, in the triangle formed by the first straight line L, the second straight line M and the third straight line N, the projection of the first support member 20a along the first direction X on the bottom wall 13, the projection of the second support member 20b along the first direction X on the bottom wall 13 and the projection of the third support member 20c along the first direction X on the bottom wall 13 are respectively the three vertices of the triangle.

[0076] The size and shape of the triangle formed by the first straight line L, the second straight line M and the third straight line N can be adjusted according to the specific application environment. It can be understood that the adjustment of the size and shape of the triangle formed by the first straight line L, the second straight line M and the third straight line N will change the supporting performance of the overall supporting structure formed by the first support member 20a, the second support member 20b and the third support member 20c, such as the structural strength or the effect of pressure distribution and conduction applied to the fastener 200.

[0077] As an example, the triangle formed by the first straight line L, the second straight line M and the third straight line N is an equilateral triangle, so that the pressure borne by the first support member 20a, the second support member 20b and the third support member 20c is more consistent, thereby improving the stability of the overall support structure formed by the first support member 20a, the second support member 20b and the third support member 20c.

[0078] In some examples, the projection shape of the abutting member 12 on the bottom wall 13 along the first direction X is a circle, and the circle is inscribed in a triangle formed by the first straight line L, the second straight line M, and the third straight line N. The forces between the abutting member 12, the first support member 20a, the second support member 20b, and the third support member 20c can be further optimized, thereby further improving the reliability of the power device 100.

[0079] The above technical solution improves the mechanical stability of the multiple support members 20 through the triangular layout design between the first support member 20a, the second support member 20b and the third support member 20c. In addition, this triangular structure can also effectively absorb and disperse vibration energy, thereby reducing the risk of damage to the power device 100 due to external vibration or impact, thereby protecting the core structure of the power device 100 from damage. In general, the triangular layout design between the first support member 20a, the second support member 20b and the third support member 20c can not only further improve the effect of pressure distribution and conduction applied to the fastener 200, but also ensure the stable operation of the power device 100 under complex working conditions and extend the service life of the power device 100.

[0080] In some embodiments, the bottom wall 13 includes a substrate 131 and a metal layer 132 , the metal layer 132 is arranged on the side of the substrate 131 facing the top wall 11 , the compressive strength of the metal layer 132 is greater than the compressive strength of the substrate 131 , and the support member 20 is connected between the top wall 11 and the metal layer 132 .

[0081] Exemplarily, the substrate 131 is usually made of a material with good electrical insulation and certain mechanical strength, such as a ceramic material (such as alumina, aluminum nitride, etc.), which has excellent thermal conductivity and insulation, and can effectively meet the heat dissipation requirements of the power device 100. The metal layer 132 can be used as a conductive layer on the bottom wall 13 as a channel for current transmission, to achieve efficient transmission of electrical signals and ensure stable operation of the circuit. For example, the chip or lead wire in the power device 100 is connected to the metal layer 132.

[0082] Optionally, the metal layer 132 may be made of, but is not limited to, copper, aluminum, gold, or nickel.

[0083] The metal layer 132 may be directly connected to the substrate 131 , or may be restricted on the substrate 131 through other components.

[0084] In some examples, the substrate 131 and the metal layer 132 are integrally formed. On the one hand, there is no need to connect the substrate 131 and the metal layer 132 through an additional connection process, which simplifies the manufacturing process. At the same time, compared with connecting the substrate 131 and the metal layer 132 through an additional connection process, the substrate 131 and the metal layer 132 in an integral structure have a higher connection firmness.

[0085] The support member 20 may be directly connected to the metal layer 132 , or may be restricted on the metal layer 132 by other components.

[0086] The compressive strength of the metal layer 132 is greater than that of the substrate 131, so that the metal layer 132 can withstand greater mechanical stress. The support member 20 is connected between the top wall 11 and the metal layer 132, so that the pressure applied by the fastener 200 can be preferentially transmitted to the metal layer 132 through the support member 20, so as to further reduce the risk of cracking or deformation of the bottom wall 13, thereby further improving the reliability of the power device 100.

[0087] In some embodiments, the top wall 11 includes a connected main body portion 111 and a connecting portion 112, the connecting portion 112 is located at the geometric center of the top wall 11, the through hole 14 extends along the first direction X and passes through the connecting portion 112, the abutment 12 and the bottom wall 13, the abutment 12 is connected between the connecting portion 112 and the bottom wall 13, and the support member 20 is connected between the connecting portion 112 and the bottom wall 13.

[0088] Exemplarily, the main body 111 is a main component of the top wall 11 , covers the top area of ​​the power device 100 , and provides necessary protection and support functions. The connecting portion 112 is mainly used to provide a connecting environment for the fastener 200 .

[0089] The connecting portion 112 may be detachably connected to the main body 111, or may be integrally provided on the main body 111. The connecting portion 112 may be directly connected to the main body 111, or may be restricted to the main body 111 by other components. As an example, the connecting portion 112 and the main body 111 may be connected by, but not limited to, plugging, bolting, welding, riveting, or bonding.

[0090] In some examples, the main body 111 and the connecting portion 112 are integrally formed. On the one hand, there is no need to connect the main body 111 and the connecting portion 112 through an additional connection process, which simplifies the manufacturing process. At the same time, compared with connecting the main body 111 and the connecting portion 112 through an additional connection process, the main body 111 and the connecting portion 112 in an integral structure have a higher connection firmness.

[0091] The connecting portion 112 is located at the geometric center of the top wall 11. After the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink, the fastener 200 will also be located at the geometric center of the top wall 11, so that the pressure applied by the fastener 200 can be evenly distributed on the top wall 11, thereby improving the force uniformity of the power device 100.

[0092] In some examples, the compressive strength of the connection portion 112 is greater than the compressive strength of the main body 111. For example, the connection portion 112 may be made of a high-strength metal material to ensure that it has sufficient bearing capacity when subjected to force.

[0093] In some embodiments, a protrusion 30 is disposed on one side of the connection portion 112 facing the bottom wall 13 . The protrusion 30 protrudes from a surface of the main body portion 111 facing the bottom wall 13 along the first direction X and close to the bottom wall 13 .

[0094] Exemplarily, a portion of the connecting portion 112 on one side toward the bottom wall 13 may protrude along the first direction X and close to the bottom wall 13 to form the protrusion 30, or the entire connecting portion 112 on one side toward the bottom wall 13 may protrude along the first direction X and close to the bottom wall 13 to form the protrusion 30.

[0095] The introduction of the protrusion 30 can not only strengthen the force-bearing structure of the top wall 11, but also optimize the force conduction path. After the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink, the top wall 11 can absorb more pressure applied by the fastener 200, thereby further reducing the pressure conducted to the bottom wall 13, so as to further reduce the risk of cracking or deformation of the bottom wall 13.

[0096] The convex portion 30 may be one or more. As an example, when there are multiple convex portions 30, the multiple convex portions 30 are arranged at intervals along the circumference of the abutment member 12, and the multiple convex portions 30 can form a reinforcing rib structure to improve the structural strength of the connecting portion 112 itself, thereby further improving the compressive resistance of the connecting portion 112.

[0097] In some examples, the abutment member 12 is connected between the protrusion 30 and the bottom wall 13 .

[0098] In some examples, the support member 20 is connected between the protrusion 30 and the bottom wall 13 .

[0099] In some embodiments, a concave portion 40 is disposed on a side of the connection portion 112 facing away from the bottom wall 13 . The concave portion 40 is recessed along the first direction X and close to the bottom wall 13 . The position of the convex portion 30 corresponds to that of the concave portion 40 .

[0100] For example, a recessed area may be formed locally in the connection portion 112 through a stamping process, and the recessed area is embodied as a concave portion 40 on the side of the connection portion 112 facing away from the bottom wall 13 , and is embodied as a convex portion 30 on the side of the connection portion 112 facing the bottom wall 13 .

[0101] In some examples, a surface of one side of the connecting portion 112 facing away from the bottom wall 13 is entirely recessed along the first direction X and close to the bottom wall 13 to form a recess 40 .

[0102] In some examples, a portion of a surface of the connection portion 112 facing away from the bottom wall 13 is recessed along the first direction X and close to the bottom wall 13 to form a recess 40 .

[0103] The above technical solution, on the one hand, can simplify the preparation process of the connection part 112 through the cooperation of the concave part 40 and the convex part 30, which helps to reduce the preparation cost of the power device 100. On the other hand, the concave part 40 can form a certain accommodation space on the side of the connection part 112 facing away from the bottom wall 13, which can be used to accommodate the fastener 200, so that after the fastener 200 passes through the through hole 14 to fix the power device 100 to the heat sink, the space occupation rate of the fastener 200 can be reduced.

[0104] In some embodiments, a groove 50 is formed at one end of the supporting member 12 facing the bottom wall 13 . The groove 50 is recessed along the first direction X and away from the bottom wall 13 .

[0105] Exemplarily, the end of the abutment 12 facing the bottom wall 13 may be understood as the end of the abutment 12 used for connecting with the bottom wall 13 .

[0106] The design of the groove 50 allows a certain gap to be formed between the supporting member 12 and the bottom wall 13. Through this structural design, the supporting member 12 can produce a slight deformation when under pressure, so that the groove 50 can absorb pressure and impact to a certain extent, reducing the force directly exerted by the supporting member 12 on the bottom wall 13, thereby reducing the risk of cracking or deformation of the bottom wall 13.

[0107] In some examples, the groove 50 is filled with an elastic member, such as silicone or rubber, to further absorb the impact energy, thereby improving the fatigue resistance of the overall structure.

[0108] According to some embodiments of the present application, the present application further provides a semiconductor device, which includes a heat sink, a fastener 200 and a power device 100 as in any of the above schemes, wherein the fastener 200 passes through the through hole 14 to fix the power device 100 on the heat sink.

[0109] Illustratively, the semiconductor equipment may be, but is not limited to, plasma etching equipment, ion implantation equipment, power management equipment of a photolithography machine, wafer processing equipment, semiconductor testing equipment, or wafer cutting, grinding and packaging equipment, etc.

[0110] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A power device, characterized in that: include: A housing, comprising a top wall, a holding member and a bottom wall, wherein the top wall and the bottom wall are arranged opposite to each other along a first direction, the holding member is connected between the top wall and the bottom wall, and the housing is further provided with a through hole, wherein the through hole extends along the first direction and penetrates the top wall, the holding member and the bottom wall, so that a fastener can pass through the through hole to fix the power device on a target mounting member; A support member is connected between the top wall and the bottom wall and is arranged along the outer periphery of the abutment member.

2. The power device according to claim 1, characterized in that: The supporting member is arranged around the abutting member.

3. The power device according to claim 1, characterized in that: There are multiple support members, and the multiple support members are arranged at intervals along the outer circumference of the supporting member.

4. The power device according to claim 3, characterized in that: The plurality of support members include a first support member, a second support member, and a third support member, wherein a first straight line is defined between projections of the first support member and the second support member on the bottom wall along the first direction, a second straight line is defined between projections of the first support member and the third support member on the bottom wall along the first direction, and a third straight line is defined between projections of the second support member and the third support member on the bottom wall along the first direction; The first straight line, the second straight line and the third straight line form a triangle, and the projection of the abutment member on the bottom wall along the first direction is located inside the triangle.

5. The power device according to claim 1, characterized in that: The bottom wall includes a substrate and a metal layer, the metal layer is arranged on a side of the substrate facing the top wall, the compressive strength of the metal layer is greater than the compressive strength of the substrate, and the support member is connected between the top wall and the metal layer.

6. The power device according to claim 1, characterized in that: The top wall includes a connected main body portion and a connecting portion, the connecting portion is located at the geometric center of the top wall, the through hole extends along the first direction and passes through the connecting portion, the abutment and the bottom wall, the abutment is connected between the connecting portion and the bottom wall, and the support member is connected between the connecting portion and the bottom wall.

7. The power device according to claim 6, characterized in that: A convex portion is provided on one side of the connecting portion facing the bottom wall, and the convex portion protrudes from a surface of one side of the main body portion facing the bottom wall along the first direction and in a direction close to the bottom wall.

8. The power device according to claim 7, characterized in that: A concave portion is provided on a side of the connecting portion facing away from the bottom wall. The concave portion is sunken along the first direction and close to the bottom wall. The position of the convex portion corresponds to the position of the concave portion.

9. The power device according to any one of claims 1 to 8, characterized in that: A groove is formed at one end of the supporting member facing the bottom wall, and the groove is recessed along the first direction and away from the bottom wall.

10. A semiconductor device, characterized in that: The invention comprises a heat sink, a fastener and a power device as claimed in any one of claims 1 to 9, wherein the fastener passes through the through hole to fix the power device on the heat sink.

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