Drive package with integrated display and method of manufacturing same

Abstract

The present invention relates to a driving package having an integrated display for use as a display application or a light emitting application and a method of manufacturing the same, the driving package may include: a display part configured to include a plurality of light emitting devices forming a plurality of pixels such that an entire screen or a portion of the screen is displayed; and a driving part, the display part being located on one side of the driving part and the terminal part being located on the other side of the driving part, the driving part for driving the plurality of light emitting devices.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0104831 filed in the Korean Intellectual Property Office on August 10, 2023, the entire contents of which are incorporated into this application by reference. Technical Field

[0003] The present disclosure relates to a driver package with an integrated display and a method for manufacturing the same, and more particularly to a driver package with an integrated display configured for display applications or light-emitting applications and a method for manufacturing the same. Background Art

[0004] Typically, conventional display panels must use a large-area glass panel or a large-area backlight panel to form a large screen, which has limitations when enlarging the screen. If problems occur, such as defective pixels in certain parts, it is difficult to replace only these parts.

[0005] Conventionally, in order to solve this problem, a technology of forming a unit display panel or a unit backlight panel using micro LEDs and connecting them to each other to expand a screen has been attempted.

[0006] However, there are many problems with the unit panel connection technology. For example, as the number of connected unit display panels or unit backlight panels increases, it becomes difficult to interconnect each of the independent driver ICs or main control units MCU used to drive the pixels of the display panel or backlight panel, which causes the wiring or structure to become complicated or limits connectivity. Summary of the invention

[0007] The present disclosure is to solve multiple problems including the above problems, and aims to provide a driver package with integrated display and a method for making the same, wherein the display component and the driver component are integrated into a single package, which can be applied to small IT devices such as AR devices or VR devices, or small projectors, and each of the multiple packages can be connected to each other in a seamless and borderless form (which facilitates the expansion of the screen) to be applied to a wide range of applications such as laptops, monitors, TVs, etc., as well as large-screen display devices, backlight panels, and lighting devices. However, these issues are only exemplary and do not limit the scope of the present disclosure.

[0008] In order to solve the above problems, a driver package with integrated display according to the concept of the present disclosure may include: a display component, the display component including a plurality of light-emitting devices forming a plurality of pixels so that the entire screen or a portion of the screen is displayed; and a driving component, wherein the display component is formed on one side of the driving component and a terminal component is formed on the other side of the driving component, and the driving component is used to drive the plurality of light-emitting devices.

[0009] Further, according to the present disclosure, the display part is provided in the form of an LED chip formed by cutting an LED wafer in which micro LEDs or LEDs are formed to realize monochrome or RGB colors.

[0010] Further, according to the present disclosure, the driving component is provided in the form of a semiconductor chip formed by cutting a complementary metal oxide semiconductor (CMOS) wafer, and a driving IC circuit or a main control unit MCU circuit is formed in the CMOS wafer to control the display component.

[0011] Further, according to the present disclosure, in the driving component, at least one micro bump is formed on one side of the driving component so as to be electrically connected to each of the plurality of light emitting devices.

[0012] Further, according to the present disclosure, in the driving component, at least one through substrate via TSV is formed between the micro bump and the terminal component.

[0013] Further, according to the present disclosure, the terminal component includes at least any one of a ball grid array, a pad, or a lead frame electrically connected to an external substrate.

[0014] Further, according to the present disclosure, the first width of the display component is substantially equal to the second width of the driving component, or the border width of the display component is equal to or less than half of the first spacing of the plurality of light-emitting devices of the display component, so that the image of each screen displayed on the large screen by being arranged side by side with another driving package with an integrated display is displayed as being interconnected as a whole.

[0015] Further, according to the present disclosure, the third width of the terminal part is substantially equal to the first width or smaller than the first width.

[0016] At the same time, a manufacturing method of a driver package with integrated display may include: step a1: preparing a complementary metal oxide semiconductor CMOS wafer in which a driver IC circuit or a main control unit MCU circuit is formed; step b1: preparing an LED wafer in which a micro LED or LED is formed; step c1: combining the CMOS wafer and the LED wafer together so that the driving component of the CMOS wafer and the display component of the LED wafer are electrically connected to each other; and step d1: cutting the combined CMOS wafer and the LED wafer into unit packages.

[0017] At the same time, a manufacturing method of a driver package with integrated display may include: step a2: cutting a complementary metal oxide semiconductor (CMOS) wafer in which a driver IC circuit or a main control unit (MCU) circuit is formed into the form of a semiconductor chip; step b2: cutting an LED wafer in which a micro LED or LED is formed into the form of an LED chip; and step c2: combining the semiconductor chip and the LED chip together so that the cut semiconductor chip and the cut LED chip are electrically connected to each other.

[0018] According to some embodiments of the present disclosure described above, the display component and the driving component are integrated into a single package, which can be applied to small IT devices such as AR devices or VR devices, or small projectors, and each of the multiple packages can be connected to each other in a seamless and borderless form (which can easily expand the screen) to be applied to a wide range of applications such as notebook computers, monitors, TVs, etc., as well as large-screen display devices, backlight panels, and lighting devices. However, the scope of the present disclosure is not limited to these effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is an external perspective view of a driver package with an integrated display according to some embodiments of the present disclosure.

[0020] Figure 2 yes Figure 1 A cross-sectional view of a driver package with an integrated display.

[0021] Figure 3 It is a display Figure 1 An exploded perspective view of the components of a driver package with an integrated display.

[0022] Figure 4 is to show that by Figure 1 A usage state diagram showing a state in which driver packages with integrated displays are connected to each other to form a large screen.

[0023] Figures 5 to 9 It is a display Figure 1A cross-sectional view of an example of a step-by-step manufacturing process for a driver package with an integrated display.

[0024] Figures 10 to 13 It is a display Figure 1 A cross-sectional view of an example of another step-by-step manufacturing process for a driver package with an integrated display.

[0025] Fig.14 is a flow chart showing a method of manufacturing a driver package with an integrated display according to some embodiments of the present disclosure.

[0026] Fig.15 is a flow chart showing a method for manufacturing a driver package with an integrated display according to some other embodiments of the present disclosure. DETAILED DESCRIPTION

[0027] Hereinafter, the present disclosure will be described in detail by explaining embodiments of the present disclosure with reference to the attached drawings.

[0028] However, the present disclosure may be presented in many different forms and should not be construed as being limited to the embodiments described herein; rather, these embodiments are provided to make the present disclosure thorough and complete and to fully convey the concepts of the present disclosure to those skilled in the art. Rather, these embodiments are provided to make the present disclosure thorough and complete and to convey the inventive concepts of the present disclosure to those skilled in the art. In the accompanying drawings, the thickness or size of the layers are exaggerated for clarity.

[0029] It should be understood that when an element such as a layer, region, or substrate is referred to as being "on," "connected to," "stacked on," or "coupled to" another element, it can be directly on, connected to, stacked on, or coupled to the other element, or there can be intervening elements. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. Like reference numerals refer to like elements throughout. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0030] It should be understood that, although the terms first, second, etc. herein can be used to describe various components, parts, regions, layers and / or parts, these components, parts, regions, layers and / or parts should not be limited to these terms. These terms are only used to distinguish a component, component, region, layer and / or part from another component, component, region, layer and / or part. Therefore, the first element, component, region, layer or part discussed below can also be referred to as the second element, component, region, layer or part, without departing from the teaching of the embodiment.

[0031] Figure 1is an external perspective view of a driver package 100 with an integrated display according to some embodiments of the present disclosure, Figure 2 yes Figure 1 A cross-sectional view of a driver package 100 with integrated display, Figure 3 It is a display Figure 1 1 is an exploded perspective view of components of a driver package 100 with an integrated display.

[0032] First, if Figures 1 to 3 As shown, a driver package 100 with integrated display according to some embodiments of the present disclosure may include a display component 10 and a driver component 20 .

[0033] The display part 10 may be a part including a plurality of light emitting devices R, G, and B forming a plurality of pixels so that the entire screen or a part of the screen is displayed.

[0034] For example, the display component 10 may be formed by cutting the LED wafer LW (see Figure 6 ) formed by an LED chip LC, the LED wafer LW can be, for example, a sapphire substrate, a silicon carbide substrate, a silicon substrate, a germanium substrate, a gallium arsenide substrate, a gallium phosphide substrate, an indium phosphide substrate, a spinel substrate or a gallium nitride substrate, and micro-LEDs or LEDs with a size of 100 microns or less are formed on these substrates, thereby achieving monochrome or RGB colors.

[0035] The display part 10 may include a plurality of light emitting devices R, G, and B located on and electrically connected to the driving part 20 to receive driving power from the driving part 20 .

[0036] In a more specific example, the light emitting devices R, G and B may include flip-chip light emitting diodes LED, wherein the first and second pads are formed on the lower surface of the LED, or include a protective member (not shown) for protecting the light emitting devices R, G and B.

[0037] Here, the light emitting devices R, G and B are not limited to red LED, green LED or blue LED. Blue LED or white LED in flip chip form may also be applied, LED chips in non-flip chip form with pads formed on the upper surface thereof, or inorganic light emitting LED chips of various colors in flip chip form may also be applied, and a plurality of LED chips are configured together with a driving circuit component for driving the plurality of LED chips. These light emitting devices R, G and B may be any type of LED, such as a normal LED and a mini LED or micro LED.

[0038] That is to say, although not shown, a light-emitting device having a bonding wire connected to a terminal, or a light-emitting device having a bonding wire partially connected to the first terminal or the second terminal, or a horizontal light-emitting device, a vertical light-emitting device, etc. may also be used. However, in order to achieve miniaturization and ultra-thinness of the product, a flip chip form may be preferred.

[0039] For example, the light emitting device can be configured by epitaxially growing nitride semiconductors such as InN, AlN, InGaN, AlGaN or InGaAlN on a growing sapphire substrate or a silicon carbide substrate using a vapor growth method such as a metal organic chemical vapor deposition (MOCVD) method. In addition, in addition to the above-mentioned nitride semiconductors, semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs and AlInGaP can also be used to form light emitting devices. These semiconductors can utilize a stacked structure formed in the order of an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer. The light emitting layer (active layer) can utilize a stacked semiconductor having a multi-quantum well structure, a single quantum well structure, or a double heterostructure stacked semiconductor. In addition, a light emitting device of any wavelength can also be selected according to the purpose such as display application or light emitting application.

[0040] Here, as a growth substrate, an insulating substrate, a conductive substrate or a semiconductor substrate can be used as required. For example, the growth substrate can be sapphire, SiC, Si, MgAl2O4, MgO, LiAlO2, LiGaO2 or GaN. For the epitaxial growth of GaN material, a homogeneous GaN substrate can be used.

[0041] Furthermore, the protective member may be a light-transmitting molded member formed by molding using a light-transmitting material including at least a silicone resin or an epoxy resin.

[0042] However, the protective member is not limited to the light-transmitting mold member, and a light conversion member including a fluorescent material or quantum dots, a color filter member, an optical system, a reflective wall member, etc. may be used.

[0043] Here, the fluorescent material should basically conform to the stoichiometric ratio, and each element can be replaced by any other element in the corresponding group in the periodic table. For example, Sr can be replaced by elements such as Ba, Ca, Mg in the II alkaline earth group, and Y can be replaced by elements such as Tb, Lu, Sc, Gd in the lanthanide series. In addition, according to the required energy level, activators such as Eu can be replaced by elements such as Ce, Tb, Pr, Er, Yb, etc., and activators can be used alone or with additional co-activators to change the characteristics.

[0044] Further, quantum dots can be nano-sized particles that have optical properties resulting from quantum confinement effects and can, for example, include one or more of: Group IV elements, Group II-VI compounds, Group II-V compounds, Group III-VI compounds, Group III-V compounds, Group IV-VI compounds, Group I-III-VI compounds, Group II-IV-VI compounds, and Group II-IV-V compounds.

[0045] Quantum dots can be formed by including one or more of the following: ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, MgS, MgSe, GaAs, GaN, GaP, GaSe, GaSb, HgO, HgS, HgSe, HgTe, InAs, InN, InP, InSb, AlAs, AlN, AlP, AlSb, TlN, TlP, TlAs, TlSb, PbO, PbS, PbSe, PbTe and Ge or Si.

[0046] Furthermore, quantum dots may be composed of a core (3 to 10 nm) such as CdSe and InP and a shell (0.5 to 2 nm) such as ZnS and ZnSe, as well as a ligand structure for stabilizing the core and the shell, and may have optical properties that achieve various colors depending on their size.

[0047] Additionally, quantum dots may include monomers that may be embedded in a physical structure or other form and polymerized into a desired physical structure, such as a thin film.

[0048] More specifically, for example, in addition to the flake form, the quantum dots may be injected and solidified in a paste form with various binders, formed into other liquid forms, or formed into various fluid forms such as gel or gel state.

[0049] Furthermore, the light conversion member may include two or more phosphors and quantum dot materials having different emission wavelengths, and a mixture of the phosphors and quantum dot materials may be used.

[0050] The driving component 20 may have a display component 10 formed on one side thereof to be integrated with the driving component 20, and a terminal component 22 formed on the other side thereof to be electrically connected to an external substrate S, and the driving component 20 may be a component for driving the above-mentioned light-emitting devices R, G and B.

[0051] The driving component 20 can be in the form of a semiconductor chip SC formed by cutting a complementary metal oxide semiconductor (CMOS) wafer SW (for example, a silicon (Si) substrate, a germanium (Ge) substrate, or a gallium arsenide (GaAs) substrate), and a driving IC circuit or a main control unit (MCU) circuit is formed in the CMOS wafer for controlling the display component 10.

[0052] The driving component 20 has at least one micro bump 21 formed on one of the surfaces by a method such as chemical plating or electroplating, so as to be electrically connected to each of the light-emitting devices R, G and B, and at least one through substrate via (TSV) T is formed between the micro bump 21 and the terminal component 22.

[0053] The driving component 20 includes at least one driving circuit as a driving IC or an MCU circuit. The driving circuit can be formed into various forms of circuits for powering, controlling driving voltage, processing feedback signals, controlling driving brightness of the light emitting devices R, G and B, or calibrating the light intensity of the light emitting devices R, G and B to match the reference light intensity of other light emitting devices.

[0054] The driving part 20 may include a semiconductor substrate formed by using an integrated circuit process on a semiconductor wafer such as a silicon wafer.

[0055] Therefore, the semiconductor substrate may be formed of semiconductor materials in multiple layers, and the mutual electrical connection of the driving circuits formed on each layer may adopt a redistribution layer (RDL).

[0056] The driving component 20 may have a plurality of terminal components 22, which are formed on one side of the semiconductor substrate and are configured to receive power signals or input and output signals for signal input and signal output of the driving circuit. These terminal components 22 may be made of a material with excellent electrical conductivity (such as copper, nickel, silver and gold) and may be applied in the form of various solder balls, bumps or pads.

[0057] The terminal part 22 may include at least any one of a ball grid array electrically connected to the external substrate S, a micro pad, or a lead frame.

[0058] Therefore, if Figure 2 As shown, when explaining the working process of the driver package 100 with integrated display of the present invention, the driver package 100 with integrated display of the present invention can receive input and output signals from the external substrate S through the terminal component 22, and can input the signals to the driver IC circuit or MCU circuit of the driving component 20.

[0059] Subsequently, the output power signal from the driving IC circuit or the MCU circuit can be provided to the light-emitting devices R, G and B through the first pad (not shown) and the second pad (not shown), respectively. When the light-emitting devices R, G and B receiving the output power signal emit light, the light path can be guided by the protective member (not shown) around the light-emitting devices R, G and B, or light conversion can be performed to convert the wavelength of the light.

[0060] Therefore, by mounting the LED chip LC forming the display component 10 on a semiconductor chip SC having a driver IC circuit or an MCU circuit formed by a chip scale packaging (CSP) process, a local dimming backlight source including, for example, multiple display color control or control elements can be realized, thereby reducing the wiring length and greatly improving the light extraction efficiency.

[0061] Furthermore, by minimizing the optical path of a display or backlight, it is possible to realize a thin display or design an ultra-thin package of multi-color or monochrome LEDs with a minimized number of components.

[0062] Furthermore, by forming various optical systems such as a light diffusion lens or an optical system in the form of side-reflected light on the light emitting surface, the direction angle of light is improved, and a thinner and more uniform surface light source can be realized with fewer light emitting devices.

[0063] In addition, by implementing multiple local dimming with the same number of local dimming and light sources, the black-white contrast ratio (black contrast) can be maximized and difficulties associated with installation space limitations, circuit complexity, and increased unit cost can be greatly reduced when manufacturing modules.

[0064] In addition, in order to achieve more contrast levels, a control element (driving circuit) having a structure with the most brightness control levels may also be included, and for precise control, various configurations may be made to feedback terminals and terminals for multiple functions, power terminals, ground terminals, etc.

[0065] On the other hand, Figure 2 As shown, the first width W1 of the display component 10 can be substantially equal to the second width W2 of the driving component 20, or the border width BW of the display component 10 can be equal to or less than half of the first pitch P1 of the plurality of light-emitting devices R, G and B of the display component 10, so that the image of each screen displayed in the large screen by being arranged side by side with another driving package 100 with an integrated display can be displayed as interconnected as a whole.

[0066] The third width W3 of the terminal part 22 is substantially equal to the first width W1 or smaller than the first width W1.

[0067] Therefore, when the display component 10 of the driver package 100 with integrated display of the present invention and other adjacent display components 10 with driver packages 100 with integrated display are arranged to contact each other, the border width BW may not exist at all, or the sum of the border widths BW on both sides is less than the first pitch P1 of the multiple light-emitting devices R, G and B of the display component 10, so the image displayed in each display component 10 can be realized as a single integrated image.

[0068] Figure 4 is to show that by Figure 1 FIG. 1 is a diagram showing a usage state in which the driver packages 100 with integrated display are connected to each other to form a large screen.

[0069] like Figure 4 As shown, the display component 10 and the driving component 20 are integrated into a single package, which allows the present invention to be applied not only to small IT devices such as AR devices or VR devices, or small projectors, etc., but also to a wide range of applications such as notebook computers, monitors, TVs, etc. by connecting each package in a plurality of packages to each other in a seamless and borderless form, as well as to large-screen display devices, backlight panels, and lighting devices, which can easily expand the screen.

[0070] Figures 5 to 9 It is a display Figure 1 A cross-sectional view of an example of a step-by-step manufacturing process for a driver package with an integrated display.

[0071] like Figures 5 to 9 As shown, we will describe step by step Figure 1 An example of a manufacturing process of a driver package 100 with an integrated display is shown in FIG. Figure 5 As shown, a complementary metal oxide semiconductor (CMOS) wafer SW in which a driver IC circuit or an MCU (main control unit) circuit is formed can be prepared.

[0072] At this time, the CMOS wafer SW can have a micro-bump 21 formed on one side thereof by methods such as chemical plating or electroplating, and a terminal component 22 formed on the other side thereof by methods such as welding, and can include a driving component 20 in which a through substrate via (TSV) T is formed between the micro-bump 21 and the terminal component 22.

[0073] Then, if Figure 6 As shown, an LED wafer LW in which micro LEDs or LEDs are formed may be prepared.

[0074] At this time, the LED wafer LW may include a plurality of light emitting devices R, G, and B, such as micro LEDs or mini LEDs.

[0075] Then, if Figure 7 As shown in FIG. 1 , the CMOS wafer SW and the LED wafer LW are aligned in a wafer-to-wafer manner using chip patterns, bump patterns, alignment marks, etc. Then, as Figure 8 As shown, the CMOS wafer SW and the LED wafer LW are combined together using heating, eutectic bonding, laser bonding, etc., so that the driving component of the CMOS wafer SW and the display component 10 of the LED wafer LW are electrically connected to each other.

[0076] Then, if Fig. 9As shown, the combined CMOS wafer SW and LED wafer LW can be cut into unit packages along a cutting line L using a blade or laser cutting method.

[0077] For example, for ease of use and management, unit packages are manufactured in sizes ranging from about 0.5 inches to about 2 inches.

[0078] Therefore, by combining the display component 10 and the driving component 20 together in a wafer-to-wafer manner and centrally mounting a plurality of light-emitting devices R, G and B on the driving component 20, productivity can be greatly improved and manufacturing time and manufacturing cost can be greatly reduced.

[0079] Figures 10 to 13 It is a display Figure 1 A cross-sectional view of another example of a step-by-step manufacturing process of a driver package 100 with an integrated display.

[0080] like Figures 10 to 13 As shown, we will describe step by step Figure 1 Another example of a manufacturing process of the driver package 100 with integrated display is shown in FIG. Fig.10 As shown, a complementary metal oxide semiconductor (CMOS) wafer SW in which a driver IC circuit or an MCU (main control unit) circuit is formed may be cut along cutting lines L into the form of semiconductor chips SC using a blade or laser cutting.

[0081] At this time, the CMOS wafer SW can have a micro-bump 21 formed on one side thereof by methods such as chemical plating or electroplating, and a terminal component 22 formed on the other side thereof by methods such as welding, and can include a driving component 20 in which a through substrate via (TSV) T is formed between the micro-bump 21 and the terminal component 22.

[0082] Then, if Fig.11 As shown, the LED wafer LW in which the micro LEDs or LEDs are formed may be cut along cutting lines L into the form of LED chips LC using a blade or laser cutting.

[0083] At this time, the LED wafer LW may include a plurality of light emitting devices R, G, and B, such as micro LEDs or mini LEDs.

[0084] Then, if Fig.12 As shown, the cut semiconductor chips SC and the cut LED chips LC are aligned in a chip-to-chip manner using chip patterns, bump patterns, alignment marks, etc. Then, as shown in FIG. Fig.13 As shown, the cut semiconductor chips SC and the cut LED chips LC are bonded together so that the cut semiconductor chips SC and the cut LED chips LC are electrically connected to each other.

[0085] Therefore, by combining the display component 10 and the driving component 20 in a chip-to-chip manner and centrally mounting a plurality of light-emitting devices R, G and B on the driving component 20, productivity can be greatly improved and manufacturing time and manufacturing cost can be greatly reduced.

[0086] However, the manufacturing method of the driver package with integrated display 100 according to various embodiments of the present disclosure is not necessarily limited to the method described herein, and various forms and types of manufacturing methods may also be employed.

[0087] Fig.14 is a flow chart showing a method of manufacturing a driver package with an integrated display according to some embodiments of the present disclosure.

[0088] like Figures 1 to 14 As shown, the manufacturing method of the driver package 100 with integrated display according to some embodiments of the present disclosure may include step a1 of preparing a complementary metal oxide semiconductor (CMOS) wafer SW in which a driver IC circuit or a main control unit (MCU) circuit is formed; step b1 of preparing an LED wafer LW in which a micro LED or LED is formed; step c1 of combining the CMOS wafer SW and the LED wafer LW together so that the driving component of the CMOS wafer SW and the display component of the LED wafer LW are electrically connected to each other; and step d1 of cutting the combined CMOS wafer SW and the LED wafer LW into unit packages along a cutting line L.

[0089] Fig.15 is a flow chart showing a method for manufacturing a driver package with an integrated display according to some other embodiments of the present disclosure.

[0090] like Figures 1 to 15 As shown, the manufacturing method of the driver package 100 with integrated display according to some other embodiments of the present disclosure may include a step a2 of cutting a complementary metal oxide semiconductor (CMOS) wafer SW in which a driver IC circuit or a main control unit (MCU) circuit is formed into the form of a semiconductor chip SC along a cutting line L, a step b2 of cutting an LED wafer LW in which a micro LED or LED is formed into the form of an LED chip LC along a cutting line L, and a step c2 of combining the semiconductor chip SC and the LED chip LC together so that the cut semiconductor chip SC and the cut LED chip LC are electrically connected to each other.

[0091] The present disclosure has been described with reference to the embodiments shown in the accompanying drawings, but these embodiments are merely illustrative, and those skilled in the art should understand that various modifications and equivalent implementations may be made without departing from the scope of the present disclosure. Therefore, the true technical protection scope of the present disclosure should be determined based on the technical concept of the attached claims.

[0092] List of reference numerals:

[0093] 10: Display components

[0094] R,G,B: light emitting device

[0095] LW: LED Wafer

[0096] LC: LED chip

[0097] 20: Driving components

[0098] 21: Micro bumps

[0099] 22: Terminal parts

[0100] SW: CMOS wafer

[0101] SC: Semiconductor chip

[0102] T: Through-substrate via (TSV)

[0103] S: external substrate

[0104] W1: First width

[0105] W2: Second width

[0106] BW: Border width

[0107] P1: First spacing

[0108] W3: Third width

[0109] L: Cutting line

[0110] 100: Driver package with integrated display

Claims

1. A driver package with integrated display, comprising: A display unit including a plurality of light emitting devices forming a plurality of pixels so that the entire screen or a portion of the screen is displayed; as well as A driving part, wherein the display part is formed on one side of the driving part and a terminal part is formed on the other side of the driving part, the driving part is used to drive the plurality of light emitting devices.

2. The driver package with integrated display according to claim 1, wherein: The display part is provided in the form of an LED chip formed by cutting an LED wafer in which micro LEDs or LEDs are formed to realize a single color or RGB color.

3. The driver package with integrated display according to claim 1, wherein: The driving part is provided in the form of a semiconductor chip formed by cutting a complementary metal oxide semiconductor (CMOS) wafer, in which a driving IC circuit or a main control unit MCU circuit is formed to control the display part.

4. The driver package with integrated display according to claim 3, wherein: In the driving component, at least one micro bump is formed on one side of the driving component so as to be electrically connected to each of the plurality of light emitting devices.

5. The driver package with integrated display according to claim 4, wherein: In the driving part, at least one through substrate via TSV is formed between the micro bump and the terminal part.

6. The driver package with integrated display according to claim 1, wherein: The terminal member includes at least any one of a ball grid array, a pad, or a lead frame electrically connected to an external substrate.

7. The driver package with integrated display according to claim 1, wherein: The first width of the display component is substantially equal to the second width of the driving component, or the border width of the display component is equal to or less than half of the first spacing of the plurality of light-emitting devices of the display component, so that the image of each screen displayed on the large screen by being arranged side by side with another driving package with an integrated display is displayed as being interconnected as a whole.

8. The driver package with integrated display according to claim 7, wherein: The third width of the terminal part is substantially equal to or smaller than the first width.

9. A method for manufacturing a driver package with integrated display, comprising: Step a1: preparing a complementary metal oxide semiconductor (CMOS) wafer in which a driver IC circuit or a main control unit (MCU) circuit is formed; Step b1: preparing a LED wafer in which micro-LEDs or LEDs are formed; Step c1: combining the CMOS wafer and the LED wafer together so that the driving component of the CMOS wafer and the display component of the LED wafer are electrically connected to each other; and Step d1: cutting the combined CMOS wafer and the LED wafer into unit packages.

10. A method for manufacturing a driver package with integrated display, comprising: Step a2: cutting the complementary metal oxide semiconductor (CMOS) wafer in which the driver IC circuit or the main control unit (MCU) circuit is formed into the form of semiconductor chips; Step b2: cutting the LED wafer in which the micro LEDs or LEDs are formed into the form of LED chips; as well as Step c2: combining the semiconductor chip and the LED chip together so that the cut semiconductor chip and the cut LED chip are electrically connected to each other.

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