Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a shell, a first frame plate, a second frame plate and a piezoelectric assembly. A first air inlet hole and a first air outlet hole are formed in the shell; the first frame plate is arranged on the shell; a first cavity is defined by the second frame plate and the first frame plate, a first through hole is formed in the first frame plate, a second through hole is formed in the first frame plate and / or the second frame plate, and the second through hole is communicated with the first air outlet hole; the piezoelectric assembly is arranged in the first through hole, and the first through hole is communicated with the first air inlet hole; under the condition that the piezoelectric assembly vibrates, gas is driven to enter the first cavity through the first through hole and flow out of the first cavity through the second through hole.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In the related technology, mainstream smart phones mainly use centrifugal fans for heat dissipation. This solution usually adds a heat dissipation module with a built-in centrifugal fan inside the mobile phone. The heat dissipation module is overlapped on the metal shielding cover of the back device of the system-on-chip (SOC). The heat emitted by the device needs to pass through the air layer, the metal shielding cover, the thermal conductive gel, and the fan module shell before finally coming into contact with the external cold air. This makes the heat conduction path between the SOC heat source to the fan module longer, resulting in low heat conduction efficiency, which in turn affects the heat dissipation effect of the electronic equipment. Summary of the invention

[0003] The present application aims to provide an electronic device, which at least solves the problem of low heat dissipation efficiency of the electronic device.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In the first aspect, the present application proposes an electronic device, including a housing, a first frame, a second frame and a piezoelectric component. The housing has a first air inlet and a first air outlet; the first frame is arranged on the housing; the second frame and the first frame are combined to form a first cavity, the first frame has a first through hole, the first frame and / or the second frame have a second through hole, and the second through hole is connected to the first air outlet; the piezoelectric component is arranged in the first through hole, and the first through hole is connected to the first air inlet; wherein, when the piezoelectric component vibrates, the driving gas enters the first cavity through the first through hole, and flows out of the first cavity through the second through hole.

[0006] The present application defines an electronic device, including a housing, a first frame, a second frame and a piezoelectric component. The first frame is arranged in the housing, and the first frame is the main board of the electronic device; the second frame is connected to the first frame, and the second frame is the sub-board of the electronic device; external cold air enters the first cavity formed between the second frame and the first frame through the first air inlet, and the gas in the first cavity is discharged through the second through hole, so that the first frame and the second frame are cooled by the flowing gas in the first cavity; the piezoelectric component is arranged on the second frame, covering the first through hole of the second frame, and the piezoelectric component can generate vibration, and the vibration of the piezoelectric component can drive the gas in the first cavity to accelerate the flow. When the piezoelectric component vibrates, the piezoelectric component bulges upward, so that the first cavity forms a local low-pressure area, and at this time, the external cold air enters the first cavity from the first air inlet. When the piezoelectric component vibrates, the piezoelectric component is concave downward, so that the volume of the first cavity is reduced, and then the pressure in the first cavity is increased, and the gas in the first cavity is compressed and discharged through the second through hole. The first cavity is enclosed by the first frame and the second frame, and the gas directly enters the first cavity, so that the gas directly contacts the heating device on the circuit board (such as the SOC heating device), shortening the heat transfer path and improving the heat dissipation efficiency of the electronic device. The reciprocating vibration of the piezoelectric component enables the first cavity to continuously inhale and discharge gas. After the gas flows through the circuit board, it flows out of the first cavity through the second through hole, so that the gas quickly circulates in the first cavity, and the cold air flow directly contacts the circuit board, quickly reducing the heat of the circuit board and improving the heat dissipation efficiency of the electronic device.

[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 is one of the schematic diagrams of a partial structure of an electronic device according to an embodiment of the present application;

[0010] Figure 2 is a second schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0011] Figure 3 is a third schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0012] Figure 4 is a fourth schematic diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0013] Figure 5is a schematic diagram of a one-way valve according to an embodiment of the present application;

[0014] Figure 6 is a schematic diagram of a one-way valve in a closed state according to an embodiment of the present application;

[0015] Figure 7 It is a schematic diagram of the open state of the one-way valve according to an embodiment of the present application.

[0016] in, Figures 1 to 7 The corresponding relationship between the reference numerals and component names in the figure is:

[0017] 100 electronic device, 110 housing, 112 first air outlet, 114 frame, 120 first frame, 122 first cavity, 124 first air inlet, 126 second through hole, 130 second frame, 132 first through hole, 134 second cavity, 140 piezoelectric component, 142 piezoelectric component, 144 elastic conductive sheet, 150 first one-way valve, 152 body, 154 valve sheet, 156 cantilever beam, 158 gap, 160 shielding cover, 162 Mounting groove, 164 notch, 166 second air inlet, 170 second one-way valve, 180 cover, 182 second opening, 190 decorative piece, 200 lens, 202 first air inlet, 210 first waterproof breathable membrane, 220 first sealing piece, 230 first sealing foam, 240 dustproof net, 250 second waterproof breathable membrane, 260 second sealing foam, 270 third sealing foam, 280 third one-way valve, 290 electrical component, 292 film. DETAILED DESCRIPTION

[0018] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0019] Refer to the following Figures 1 to 7 An electronic device 100 according to some embodiments of the present application is described.

[0020] In one embodiment of the present application, Figure 1 and Figure 2As shown, an electronic device 100 is proposed, including a housing 110, a first frame 120, a second frame 130 and a piezoelectric component 140. The housing has a first air inlet 202 and a first air outlet 112, and the first frame 120 is arranged on the housing 110; the second frame 130 and the first frame 120 are enclosed to form a first cavity 122, the first frame has a first through hole 132, the first frame and / or the second frame has a second through hole, and the second through hole is connected to the first air outlet; the piezoelectric component 140 is arranged in the first through hole 132, and the first through hole 132 is connected to the first air inlet; wherein, when the piezoelectric component 140 vibrates, the gas can be driven to enter the first cavity 122 through the first through hole 132, and flow out of the first cavity 122 through the second through hole 126.

[0021] The present application defines an electronic device 100, which includes a housing 110, a first frame 120, a second frame 130 and a piezoelectric component 140. The first frame 120 is disposed in the housing 110, and is the main board of the electronic device 100; the second frame 130 is connected to the first frame 120, and is the sub-board of the electronic device 100; external cold air enters the first cavity 122 formed between the second frame 130 and the first frame 120 through the first air inlet 124, and the gas in the first cavity 122 is then discharged through the second through hole 126, so that the first frame 120 and the second frame 130 are cooled by the flowing gas in the first cavity 122; the piezoelectric component 140 is disposed on the second frame 130, covers the first through hole 132 of the second frame 130, and can generate vibrations, and the vibration of the piezoelectric component 140 can drive the gas in the first cavity 122 to accelerate the flow. When the piezoelectric component 140 vibrates, the piezoelectric component 140 bulges upward, so that the first cavity 122 forms a local low-pressure area. At this time, external cold air enters the first cavity 122 from the first air inlet 124. When the piezoelectric component 140 vibrates, the piezoelectric component 140 sinks downward, so that the volume of the first cavity 122 decreases, and the pressure in the first cavity 122 increases, and the gas in the first cavity 122 is compressed and discharged through the second through hole 126. The first cavity 122 is enclosed by the first frame 120 and the second frame 130, and the gas directly enters the first cavity 122, so that the gas directly contacts the heating device (such as the SOC heating device) on the circuit board, shortening the heat transfer path and improving the heat dissipation efficiency of the electronic device 100. The reciprocating vibration of the piezoelectric component 140 enables continuous gas intake and discharge in the first cavity 122. The gas flows through the circuit board and then flows out of the first cavity 122 through the second through hole 126, so that the gas circulates rapidly in the first cavity 122. The cold air flow directly contacts the circuit board, which quickly reduces the heat of the circuit board and improves the heat dissipation efficiency of the electronic device 100.

[0022] At the same time, the electronic device 100 dissipates heat through the vibration of the piezoelectric component 140, replacing the traditional centrifugal fan design. The piezoelectric component 140 is smaller and lighter than the centrifugal fan, which is conducive to the lightweight design of the electronic device 100 and improves the user experience.

[0023] The electronic device 100 dissipates heat through the vibration of the piezoelectric component 140, replacing the traditional centrifugal fan design. The piezoelectric component 140 is smaller than the centrifugal fan, making better use of the internal space of the electronic device 100 and helping to improve the performance of the electronic device 100.

[0024] The electronic device 100 dissipates heat through the vibration of the piezoelectric component 140, replacing the traditional centrifugal fan design. The piezoelectric component 140 is quieter than the centrifugal fan and is almost noiseless during operation, making the electronic device 100 quieter during use and improving the user experience.

[0025] The piezoelectric component 140 vibrates to dissipate heat from the electronic device 100, replacing the traditional centrifugal fan design. The piezoelectric component 140 reduces the area of ​​the openings on the exterior of the electronic device 100, which helps maintain the integrity and simplicity of the exterior design of the electronic device 100. At the same time, since the area of ​​the openings on the exterior is reduced, dust and water protection measures are easier to implement, thereby improving the waterproof and dustproof stability of the entire electronic device 100.

[0026] The piezoelectric component 140 vibrates to dissipate heat from the electronic device 100, replacing the traditional centrifugal fan design. When the piezoelectric component 140 vibrates, the external cold air enters through the first air inlet 124 and can directly contact the SOC heating device, thereby improving the heat exchange efficiency of the heat dissipation module, shortening the gas flow path, and improving the heat dissipation efficiency of the electronic device 100. Specifically, Figure 3 and Figure 4 As shown, external gas enters the first cavity through the first gas inlet 124, and the flow direction of the gas entering the first cavity is Figure 3 The gas flows in the direction indicated by the arrow A. After the gas exchanges heat in the first cavity 122, it is discharged from the first cavity 122 through the second through hole 126. The flow direction of the gas discharged from the first cavity 122 is Figure 4 In the direction indicated by arrow B.

[0027] In addition, the electronic device 100 in the above embodiment provided by the present application may also have the following additional technical features:

[0028] In some embodiments of the present application, optionally, Figure 2As shown, the piezoelectric assembly 140 includes: an elastic conductive sheet 144 and a piezoelectric component 142. The elastic conductive sheet 144 is disposed on the second frame plate 130 and is electrically connected to the second frame plate 130; the piezoelectric component 142 is disposed on the elastic conductive sheet 144; wherein, when the elastic conductive sheet 144 is energized, the piezoelectric component 142 can drive the elastic conductive sheet 144 to vibrate.

[0029] In this embodiment, the piezoelectric assembly 140 includes an elastic conductive sheet 144 and a piezoelectric component 142. The elastic conductive sheet 144 is electrically connected to the second frame 130, and the piezoelectric component 142 is disposed on the elastic conductive sheet 144, so that the elastic conductive sheet 144 is electrically connected to the second frame 130. When the elastic conductive sheet 144 is energized, the piezoelectric component 142 starts to vibrate, and the piezoelectric component 142 can drive the elastic conductive sheet 144 to vibrate synchronously, drive the gas in the first cavity 122, and allow the gas in the first cavity 122 to circulate.

[0030] Specifically, the lower surface of the piezoelectric component 142 is connected to the elastic conductive sheet 144, and the printed circuit board (PCB) provides a driving voltage to the piezoelectric component 142 through the elastic conductive sheet 144; or, the lower surface of the piezoelectric component 142 can also be connected to the PCB through a specific routing design, so that the piezoelectric component 142 obtains the driving voltage. The PCB applies an alternating voltage to the upper and lower surfaces of the piezoelectric component 142 through the elastic conductive sheet 144 or the routing, so that the piezoelectric component 142 produces an alternating deformation. Furthermore, the upper surface of the piezoelectric component 142 can also be connected to the elastic conductive sheet 144.

[0031] Specifically, the piezoelectric component 140 is a piezoelectric pump, which is a micro pump made by using the inverse piezoelectric effect of piezoelectric ceramics. It has no motor and rotating parts, and is driven by piezoelectric ceramic sheets, thereby replacing the traditional centrifugal fan design. By integrating the piezoelectric pump with the mobile phone PCB, the space of the first cavity 122 is used as the pump cavity, so that the external cold air can directly contact the heating device here, thereby improving the heat dissipation efficiency of the electronic device 100.

[0032] At the same time, by setting the elastic conductive sheet 144 on the second frame plate 130 and electrically connecting to the second frame plate 130, the module integration of the electronic device 100 is improved, the stability of the electronic device 100 is improved, and it is beneficial to the ultimate design of the internal space of the whole machine. The piezoelectric pump is directly connected to the mobile phone PCB, which reduces the board-to-board (BTB, board-to-board) connectors, flexible circuit board (FPC, Flexible Printed Circuit) wiring and other materials required by traditional independent components, reduces the production cost of the electronic device 100, simplifies the installation process of the electronic device 100, and improves the assembly efficiency of the electronic device 100, thereby making the electronic device 100 more competitive in the market.

[0033] In some embodiments of the present application, optionally, Figure 2 As shown, the electronic device 100 also includes a shielding cover 160, which is covered on a side of the second frame 130 away from the first frame 120 and is covered on the outside of the piezoelectric component 140. A second cavity 134 is provided between the shielding cover 160 and the second frame 130. The shielding cover 160 is provided with a second air inlet 166, and the second air inlet 166 is connected to the first cavity 122 through the second cavity 134.

[0034] In this embodiment, the electronic device 100 further includes a shielding cover 160, which is disposed on the outside of the piezoelectric component 140, and a second cavity 134 is formed between the shielding cover 160 and the second frame plate 130. The shielding cover 160 is provided with a second air inlet 166, and external cold air enters the second cavity 134 through the second air inlet 166, and then enters the first cavity 122 through the first air inlet 124. By providing the shielding cover 160 on the outside of the piezoelectric component 140, the piezoelectric component 140 is prevented from being in electrical contact with the cover of the electronic device 100 or the camera module and other structures when the piezoelectric component 140 vibrates, thereby improving the stability of the electronic device 100.

[0035] Furthermore, when electronic components are working, they will generate electromagnetic radiation, which may interfere with the normal operation of other sensitive components in the device. By providing a shielding cover 160 on the outside of the piezoelectric component 140, the electromagnetic radiation can be isolated to prevent electromagnetic interference between different modules, making the use of the electronic device 100 more stable.

[0036] Furthermore, to prevent static electricity from damaging the circuit board and electronic components, a shielding cover 160 is provided on the outside of the piezoelectric component 140 to conduct electricity and guide static electricity to the ground, thereby protecting the electronic components of the electronic device 100 and improving the stability of the electronic device 100.

[0037] Furthermore, by providing a shielding cover 160 on the outer side of the piezoelectric component 140, the PCB component is prevented from being damaged due to collision and the like during transportation and assembly.

[0038] In some embodiments of the present application, optionally, Figure 2 As shown, the electronic device 100 further includes a second one-way valve 170 , which is disposed at the second air inlet 166 to allow the second air inlet 166 to be unidirectionally conductive from the outside of the second cavity 134 to the inside of the second cavity 134 .

[0039] In this embodiment, the electronic device 100 further includes a second one-way valve 170, which is disposed at the second air inlet 166. The second one-way valve 170 allows the second air inlet 166 to be unidirectionally conducted from the outside of the second cavity 134 to the inside of the second cavity 134, thereby preventing the gas in the second cavity 134 from flowing out in the reverse direction at the second air inlet 166, ensuring that the gas in the second cavity 134 fully enters the first cavity 122, ensuring the heat dissipation performance of the electronic device 100, and improving the stability of the electronic device 100.

[0040] In some embodiments of the present application, optionally, Figure 5 As shown, the second one-way valve 170 includes a main body 152, a cantilever beam 156 and a valve plate 154; the main body 152 is connected to the shielding cover 160, and is located on the side of the shielding cover 160 close to the second frame plate 130; the first side of the cantilever beam 156 is connected to the main body 152; the valve plate 154 is connected to the second side of the cantilever beam 156; wherein, the valve plate 154 is in contact with the shielding cover 160, and the second air inlet 166 is closed; the valve plate 154 is separated from the shielding cover 160, and the second air inlet 166 is opened.

[0041] In this embodiment, the second one-way valve 170 includes a body 152, which is connected to the shielding cover 160, so as to support the second one-way valve 170 and improve the stability of the second one-way valve 170 during the operation of the electronic device 100. The second one-way valve 170 also includes a cantilever beam 156 and a valve plate 154, the body 152 is located on a side of the shielding cover 160 close to the second frame plate 130, the first side of the cantilever beam 156 is connected to the body 152, and the valve plate 154 is connected to the second side of the cantilever beam 156. When the airflow flows from the first air inlet 202 to the first through hole 132, the airflow passes through the valve plate and drives the valve plate to move in the direction away from the shielding cover, the valve plate 154 is separated from the shielding cover 160, and the second air inlet 166 is opened. When the airflow tends to flow in the opposite direction, the airflow drives the valve plate 154 to contact the shielding cover 160, and the second air inlet 166 is closed. The airflow cannot pass through the second air inlet 166, thereby realizing the unidirectional conduction of the second air inlet 166 and improving the stability of the airflow drive of the piezoelectric component 140; and the unidirectional conduction of the second air inlet 166 prevents the airflow from flowing in the direction of the second air inlet 166, thereby improving the gas flow in the first cavity 122, thereby improving the heat dissipation effect of the electronic equipment.

[0042] In some embodiments of the present application, optionally, Figure 5 As shown, the body 152 extends in an annular shape and fits the shielding cover 160 ; the valve plate 154 is located on the inner side of the body 152 , and there is a gap 158 between the valve plate 154 and the body 152 ; the cantilever beam 156 extends in an arc shape along the inner circumference of the body and is located in the gap 158 .

[0043] In this embodiment, the body 152 extends in an annular shape and fits the shielding cover 160, further improving the stability of the connection between the body 152 and the shielding cover 160. The valve plate 154 is located on the inner side of the body 152, and there is a gap 158 between the valve plate 154 and the body 152; the cantilever beam 156 extends in an arc shape along the inner circumference of the body and is located in the gap 158, so that the cantilever beam 156 can support the movement of the valve plate 154, and after the valve plate 154 loses the driving force of the airflow, the valve plate 154 will be reset under the elastic force generated by the cantilever beam 156, thereby improving the stability of the second one-way valve 170 during operation.

[0044] In some embodiments of the present application, optionally, Figure 2As shown, the electronic device 100 further includes a frame 114, a cover 180, a decorative member 190 and a lens 200. The cover 180 is disposed on a side of the second frame 130 away from the first frame 120, connected to the frame 114, and disposed at the second opening 182; the decorative member 190 is disposed at the second opening 182, connected to the cover 180; the lens 200 is disposed on the decorative member 190, and the lens 200 is provided with a first air inlet 202, which is communicated with the second air inlet 166.

[0045] In this embodiment, the electronic device 100 further includes a frame 114, a cover 180, a decorative piece 190 and a lens 200. The cover 180 is a back cover of the electronic device 100, connected to the frame 114 of the electronic device 100, and is used to protect the internal components of the electronic device 100, so as to prevent the internal components from being knocked by external objects, and at the same time, to make the internal space of the electronic device 100 airtight to prevent dust from entering. A second opening 182 is provided on the cover 180, and the decorative piece 190 is provided on the second opening 182 and connected to the cover 180. The lens 200 is mounted on the decorative piece 190, and a first air inlet 202 is provided on the lens 200, and the first air inlet 202 is communicated with the second air inlet 166. External air flows through the first air inlet 202 to the second air inlet 166 , enters the second cavity 134 through the second air inlet 166 , and then enters the first cavity 122 through the first air inlet 124 , so that air circulates inside the electronic device 100 , thereby improving the heat dissipation effect of the electronic device 100 .

[0046] At the same time, the first air inlet 202 is provided on the lens 200 to reduce the impact on the appearance of the electronic device 100, thereby making the appearance of the electronic device 100 more refined and improving the competitiveness of the electronic device 100.

[0047] In some embodiments of the present application, optionally, Figure 2 As shown, the electronic device 100 further includes a first waterproof breathable membrane 210 and a first sealing member 220 . The first waterproof breathable membrane 210 is disposed at the second air inlet 166 ; the first sealing member 220 is arranged around the second air inlet 166 and is located between the first waterproof breathable membrane 210 and the decorative member 190 .

[0048] In this embodiment, the electronic device 100 further includes a first waterproof breathable membrane 210 and a first sealing member 220. The first waterproof breathable membrane 210 is adhered to the second air inlet 166 by using a film 292, so that external gas can enter the second cavity 134, but liquid cannot enter the second cavity 134. The first sealing member 220 is arranged around the second air inlet 166, and the first sealing member 220 is adhered between the first waterproof breathable membrane 210 and the decorative member 190. The gap between the first waterproof breathable membrane 210 and the decorative member 190 is sealed by the first sealing member 220, so that the second cavity 134 forms a closed space, thereby preventing external liquid and dust from entering, thereby improving the waterproof and dustproof effect of the electronic device 100.

[0049] In some embodiments of the present application, optionally, Figure 2 As shown, the shielding cover 160 is arranged in the installation groove 162 recessed toward the second cavity 134, and the notch 164 of the installation groove 162 faces the decorative component 190; the first waterproof breathable membrane 210 is arranged in the installation groove 162 and bonded to the cover body 180; at least a portion of the first sealing component 220 is located in the installation groove 162 and bonded to the first waterproof breathable membrane 210.

[0050] In this embodiment, the shielding cover 160 is provided with a mounting groove 162 recessed toward the second cavity 134, the notch 164 of the mounting groove 162 faces the decorative component 190, and the notch 164 is opposite to the first air inlet 202 to ensure the fluidity of the gas; the first waterproof breathable membrane 210 is disposed in the mounting groove 162 and bonded to the cover body 180, so that the position of the first waterproof breathable membrane 210 is fixed in the mounting groove 162, and the mounting groove 162 limits the first waterproof breathable membrane 210, even when the electronic device 100 vibrates, the position deviation of the first waterproof breathable membrane 210 in the mounting groove 162 is less affected. At least part of the first seal 220 is located in the mounting groove 162 and bonded to the first waterproof breathable membrane 210. By setting the first seal 220 in the mounting groove 162, and the mounting groove 162 also limits the first seal 220, even when the electronic device 100 vibrates, the position deviation of the first seal 220 in the mounting groove 162 is less affected, thereby improving the waterproof and dustproof effect of the electronic device 100.

[0051] At the same time, by setting an installation groove 162 recessed toward the second cavity 134 on the shielding cover 160, the first waterproof and breathable membrane 210 and the first seal 220 are both installed in the installation groove 162, thereby reducing the space occupied by the waterproof and dustproof structure, thereby reducing the rear end space of the electronic device 100, making the electronic device thinner and lighter, and improving product competitiveness.

[0052] In some embodiments of the present application, optionally, Figure 2As shown, the electronic device 100 further includes a first sealing foam 230 and a dustproof net 240 . The first sealing foam 230 is disposed on a side of the lens 200 close to the first frame 120 ; the dustproof net 240 is disposed between the first sealing foam 230 and the decorative element 190 and covers the first air inlet 202 .

[0053] In this embodiment, the electronic device 100 also includes a first sealing foam 230 and a dustproof net 240. The first sealing foam 230 is arranged on the side of the lens 200 close to the first frame plate 120, and the dustproof net 240 is arranged between the first sealing foam 230 and the decorative component 190. The dustproof net 240 covers the first air inlet hole 202, so that the first air inlet hole 202 has a waterproof and dustproof effect, thereby further improving the waterproof and dustproof effect of the electronic device 100.

[0054] In some embodiments of the present application, optionally, Figure 2 As shown, the electronic device 100 further includes a second waterproof breathable membrane 250, a second sealing foam 260 and a third sealing foam 270. The second waterproof breathable membrane 250 is disposed between the first frame 120 and the housing 110, covering the second through hole 126; the second sealing foam 260 is disposed between the second waterproof breathable membrane 250 and the first frame 120; and the third sealing foam 270 is disposed between the second waterproof breathable membrane 250 and the housing 110.

[0055] In this embodiment, the electronic device 100 further includes a second waterproof breathable membrane 250, a second sealing foam 260 and a third sealing foam 270. The second waterproof breathable membrane 250 is arranged between the first frame 120 and the housing 110, the second waterproof breathable membrane 250 covers the second through hole 126, and the second waterproof breathable membrane 250 is pasted between the second sealing foam 260 and the third sealing foam 270 by using a film 292, so that the second through hole 126 has waterproof and dustproof properties. The second sealing foam 260 is arranged between the second waterproof breathable membrane 250 and the first frame 120, and the third sealing foam 270 is arranged between the second waterproof breathable membrane 250 and the housing 110, and then the gap between the first frame 120 and the housing 110 is sealed by the second sealing foam 260 and the third sealing foam 270, so that liquid and dust cannot enter the internal space of the electronic device 100, thereby improving the waterproof and dustproof effect of the electronic device 100.

[0056] In some embodiments of the present application, optionally, Figure 2 As shown, the housing 110 is provided with a first air outlet 112 , and the first air outlet 112 is communicated with the second through hole 126 .

[0057] In this embodiment, the housing 110 is provided with a first air outlet 112, which can be provided at the bottom of the housing 110, or provided at other positions, so that the first air outlet 112 is connected with the second through hole 126, thereby allowing the gas in the first cavity 122 to be discharged smoothly. At the same time, by providing the housing 110 with the first air outlet 112, the impact on the appearance of the electronic device 100 is reduced, and the refinement of the appearance of the electronic device 100 is improved.

[0058] In some embodiments of the present application, optionally, Figure 2 As shown, the electronic device 100 further includes a third one-way valve 280 , which is disposed in the second through hole 126 to allow the second through hole 126 to be unidirectionally conductive from the inside of the first cavity 122 to the outside of the first cavity 122 .

[0059] In this embodiment, the electronic device 100 also includes a third one-way valve 280, which is arranged in the second through hole 126, so that the gas in the first cavity 122 is unidirectionally conducted from the second through hole 126 to the outside of the first cavity 122, thereby preventing the gas from flowing back into the second through hole 126, and allowing the gas to circulate quickly in the first cavity 122.

[0060] In some embodiments of the present application, optionally, Figure 2 , Figure 3 and Figure 4 As shown, the piezoelectric assembly 140 and / or the second frame plate 130 is provided with a first air inlet 124 .

[0061] In this embodiment, the first air inlet 124 may be disposed on the piezoelectric component 140 and / or the second frame plate 130 , and the second through hole 126 may be disposed on the first frame plate 120 and / or the second frame plate 130 .

[0062] In some embodiments of the present application, Figure 5 , Figure 6 and Figure 7 As shown, optionally, the electronic device 100 further includes a first one-way valve 150 , which is disposed at the first air inlet 124 to allow the first air inlet 124 to be unidirectionally conductive from the outside of the first cavity 122 to the inside of the first cavity 122 .

[0063] In this embodiment, the electronic device 100 further includes a first one-way valve 150, which is disposed at the first air inlet 124. The first one-way valve 150 allows the first air inlet 124 to be unidirectionally conducted from the outside of the first cavity 122 to the inside of the first cavity 122, thereby preventing gas from flowing out of the first air inlet 124 in the opposite direction when the piezoelectric component 140 vibrates, thereby improving the heat dissipation stability of the electronic device 100.

[0064] Specifically, the first one-way valve 150 includes a body 152, a valve plate 154 and a cantilever beam 156. The body 152 is fixed at the first air inlet 124. The valve plate 154 is fixed to the body 152 through the cantilever beam 156. The cantilever beam 156 drives the valve plate 154 to have a deformation function. The first one-way valve 150 is made of elastic materials such as steel sheets and polyethylene terephthalate (PTE) and has a cantilever beam structure, so that the one-way valve has a deformation recovery function. It can only deform in a single direction, thereby realizing one-way flow of gas and preventing gas backflow. Figure 6 As shown, the first one-way valve 150 is in a closed state, and external gas cannot enter the first cavity 122. Figure 7 As shown, when the internal pressure of the first cavity 122 is lower than the external pressure, the first one-way valve 150 is opened, and the external gas enters the first cavity 122. After the pressure in the first cavity 122 increases, the first one-way valve 150 is closed.

[0065] Furthermore, the opening area of ​​the first air inlet 124 is very small, and the opening area of ​​the first air inlet 124 is smaller than the opening area of ​​the second through hole 126, so there is no need to set the first one-way valve 150. When the piezoelectric component 140 is convexly deformed, the first cavity 122 forms a local low-pressure area, and at this time, the external cold air enters the first cavity 122 from the first air inlet 124. When the piezoelectric component 140 vibrates and deforms concavely, the volume of the first cavity 122 decreases, so that the pressure in the first cavity 122 increases, and the gas in the first cavity 122 is compressed and discharged through the first air inlet 124 and the second through hole 126 at the same time. However, since the opening area of ​​the first air inlet 124 is smaller than the opening area of ​​the second through hole 126, the gas output of the first air inlet 124 is much smaller than the gas output of the second through hole 126, thereby allowing the gas in the first cavity 122 to flow, thereby having a heat dissipation effect on the circuit board inside the electronic device 100.

[0066] In some embodiments of the present application, optionally, Figure 2 , Figure 3 and Figure 4 As shown, the electronic device 100 further includes an electrical component 290, which is disposed on the first frame 120 and located in the first cavity 122. The first air inlet 124 and the second through hole 126 allow air to circulate in the first cavity 122, thereby achieving a heat dissipation effect for the electronic device 100.

[0067] In this embodiment, the electronic device 100 further includes an electrical component 290, which is disposed on the first frame 120 and located in the first cavity 122. The electrical component 290 quickly dissipates heat through the air circulation in the first cavity 122, thereby improving the heat dissipation efficiency, thereby making the electronic device 100 smoother when in use and improving the user experience. At the same time, the electrical component 290 quickly dissipates heat through the air circulation in the first cavity 122, thereby extending the life of the electronic component and thereby improving the life of the electronic device 100.

[0068] Specifically, the electronic device 100 dissipates heat by vibrating the piezoelectric component 140, replacing the traditional centrifugal fan design. The heat emitted by the SOC back device does not need to pass through the air layer, the metal shielding cover, the thermal conductive gel, and the fan module housing before contacting the external cold air. The piezoelectric component 140 vibrates to dissipate heat for the electronic device 100, so that the external cold air can directly contact the SOC heating device after entering through the first air inlet 124, thereby improving the heat exchange efficiency of the heat dissipation module, shortening the gas flow path, and improving the heat dissipation efficiency of the electronic device 100.

[0069] Furthermore, the electronic device 100 defined in the present application may be an electronic device 100 such as a mobile phone, a smart watch, a computer, a tablet, a car screen, etc.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0071] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A shell having a first air inlet and a first air outlet; a first frame plate, the first frame plate being disposed in the housing; A second frame plate, wherein the second frame plate and the first frame plate are combined to form a first cavity, the first frame plate has a first through hole, the first frame plate and / or the second frame plate has a second through hole, and the second through hole is connected to the first air outlet; A piezoelectric component, wherein the piezoelectric component is disposed in the first through hole, and the first through hole is communicated with the first air inlet hole; When the piezoelectric component vibrates, the gas can be driven to enter the first cavity through the first through hole and flow out of the first cavity through the second through hole.

2. The electronic device according to claim 1, characterized in that: The piezoelectric component comprises: An elastic conductive sheet, the elastic conductive sheet is disposed on the second frame plate and is electrically connected to the second frame plate; A piezoelectric component, wherein the piezoelectric component is disposed on the elastic conductive sheet; When the elastic conductive sheet is energized, the piezoelectric component can drive the elastic conductive sheet to vibrate.

3. The electronic device according to claim 1, characterized in that: Also includes: A shielding cover is provided on a side of the second frame plate away from the first frame plate, and is provided on the outside of the piezoelectric component. A second cavity is provided between the shielding cover and the second frame plate. The shielding cover is provided with a second air inlet, and the second air inlet is connected to the first cavity through the second cavity.

4. The electronic device according to claim 3, characterized in that: Also includes: A second one-way valve is provided at the second air inlet so that the second air inlet is unidirectionally conducted from the outside of the second cavity to the inside of the second cavity.

5. The electronic device according to claim 4, characterized in that: The second one-way valve comprises: A body, the body being connected to the shielding cover and being located on a side of the shielding cover close to the second frame plate; a cantilever beam, a first side of the cantilever beam being connected to the body; a valve plate connected to the second side of the cantilever beam; Wherein, the valve sheet is in contact with the shielding cover, and the second air inlet is closed; The valve sheet is separated from the shielding cover, and the second air inlet is opened.

6. The electronic device according to claim 5, characterized in that: The body extends in a ring shape and fits the shielding cover; The valve plate is located inside the body, and there is a gap between the valve plate and the body; The cantilever beam extends in an arc shape along the inner circumference of the body and is located in the gap.

7. The electronic device according to claim 3, characterized in that: The housing further comprises: Frame; A cover body, the cover body is arranged on a side of the second frame plate away from the first frame plate, connected to the frame body, and the cover body is arranged at the second opening; a decorative piece, the decorative piece being arranged at the second opening and connected to the cover body; A lens is arranged on the decorative piece, the lens is provided with the first air inlet hole, and the first air inlet hole is connected with the second air inlet port.

8. The electronic device according to claim 7, characterized in that: Also includes: a first waterproof breathable membrane, wherein the first waterproof breathable membrane is disposed at the second air inlet; A first sealing member is arranged around the second air inlet and is located between the first waterproof breathable membrane and the decorative member.

9. The electronic device according to claim 8, characterized in that: The shielding cover is arranged in a mounting groove recessed toward the second cavity, and the notch of the mounting groove faces the decorative element; The first waterproof and breathable membrane is arranged in the installation groove and bonded to the cover body; At least a portion of the first sealing member is located in the mounting groove and is bonded to the first waterproof breathable membrane.

10. The electronic device according to claim 7, characterized in that: Also includes: A first sealing foam, wherein the first sealing foam is disposed on a side of the lens close to the first frame plate; A dustproof net is arranged between the first sealing foam and the decorative element and covers the first air inlet hole.

11. The electronic device according to claim 1, characterized in that: Also includes: a second waterproof breathable membrane, the second waterproof breathable membrane being disposed between the first frame plate and the housing and covering the second through hole; A second sealing foam, wherein the second sealing foam is disposed between the second waterproof and breathable membrane and the first frame plate; A third sealing foam is arranged between the second waterproof and breathable membrane and the shell.

12. The electronic device according to claim 1, characterized in that: Also includes: A third one-way valve is disposed at the second through hole to allow the second through hole to conduct one-way from the inside of the first cavity to the outside of the first cavity.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The piezoelectric component and / or the second frame plate is provided with a first air inlet.

14. The electronic device according to claim 13, characterized in that: Also includes: A first one-way valve is disposed at the first air inlet so that the first air inlet is unidirectionally conductive from the outside of the first cavity to the inside of the first cavity.

15. The electronic device according to any one of claims 1 to 12, characterized in that: Also includes: An electrical component is disposed on the first frame and located in the first cavity.

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