Heat dissipation devices and electronic devices

Abstract

The present invention provides a heat dissipation device and electronic device. The heat dissipation device includes a circuit board, a heat source device, and a liquid cooling plate. The heat source device is fixedly mounted on the circuit board. The liquid cooling plate includes first and second cover plates, and a middle plate sandwiched between the first and second cover plates. The side of the middle plate proximate the first cover plate is recessed to form a first receiving space, and the side of the middle plate proximate the second cover plate is recessed to form a second receiving space. The liquid cooling plate also includes a heat sink disposed within the first receiving space, and the first receiving space is filled with a phase-change liquid. The middle plate is provided with a liquid inlet and a liquid outlet, both of which are connected to the second receiving space. The liquid cooling plate also includes a liquid inlet pipe and a liquid outlet pipe connected to the second receiving space via the liquid inlet and outlet holes. The second receiving space is filled with coolant. The second cover plate is provided with a clearance hole isolated from the second receiving space, through which the heat source device passes to adhere to the middle plate. Compared with related art, the heat dissipation device of the present invention has better heat dissipation performance.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] With the advancement of electronic and electrical technology and increasing user demands, various electronic products used in daily life, scientific research, and education are becoming increasingly versatile and powerful, leading to increasingly severe heat generation. Vapor Chambers (VCs) are lightweight heat dissipation components. Due to their divergent vapor path and excellent 2D surface thermal conductivity, they can be applied to a variety of electronic products, enhancing their heat dissipation and becoming an ideal solution for solving heat dissipation issues in these products.

[0003] Existing vapor chamber solutions typically place them between the heat source device and the product's metal casing. Heat from the heat source device is transferred to the vapor chamber, which then dissipates the heat through the product's metal casing. However, existing vapor chamber solutions rely on passive heat dissipation from the product's metal casing. For large, high-heat-generating chip modules, such as the heat source device modules in laptops, passive heat dissipation based on the casing is limited. When the laptop requires high performance, performance issues can easily arise due to delayed heat dissipation. Consequently, existing solutions offer poor heat dissipation.

[0004] Therefore, it is necessary to provide a new heat dissipation solution to solve the above problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation device and an electronic device with better heat dissipation effect.

[0006] In order to solve the above technical problems, the present invention provides a heat dissipation device, which includes a circuit board, a heat source device and a liquid cooling plate, wherein:

[0007] The heat source device is fixedly mounted on the circuit board;

[0008] The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further includes a heat sink disposed in the first receiving space, the first receiving space is filled with a phase-change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, the middle plate is provided with a liquid inlet hole and a liquid outlet hole both of which are connected to the second receiving space; the liquid cooling plate further includes a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a coolant;

[0009] The second cover plate is provided with a clearance hole isolated from the second receiving space, and the heat source device passes through the clearance hole and fits with the middle plate.

[0010] Furthermore, the middle plate includes a recessed portion formed with the second cover plate to form the second receiving space, and a fitting portion fitted with the heat source device, the fitting portion is recessed toward the surface of the heat source device away from the second cover plate to form a groove, and the groove includes a groove bottom surface fitted with the heat source device.

[0011] Furthermore, the heat source device includes a first device having a first thickness, and a second device having a second thickness smaller than the first thickness, the first device is fixedly mounted on the surface of the circuit board and the second device is fixedly mounted on the surface of the circuit board and is located on the same horizontal plane, the fitting portion includes a protruding portion protruding from the bottom surface of the groove toward the heat source device, and the second device is fitted to the protruding portion.

[0012] Furthermore, the heat dissipation device further includes a plurality of support structures arranged at intervals in the second receiving space; the support structures arranged in the second receiving space are supported between the second cover plate and the recessed portion.

[0013] Furthermore, the second cover plate is provided with a first interface mounting position and a second interface mounting position which are respectively opposite to the liquid inlet hole and the liquid outlet hole; the liquid inlet pipe is clamped at the first interface mounting position and is connected with the liquid inlet hole to form a liquid inlet channel connecting the second receiving space with the outside world; the liquid outlet pipe is clamped at the second interface mounting position and is connected with the liquid outlet hole to form a liquid outlet channel connecting the second receiving space with the outside world.

[0014] Furthermore, the heat dissipation device also includes a fixing screw, a threaded hole and a fixing hole. The threaded hole is arranged on the second cover plate and the side close to the circuit board. The fixing hole is arranged through the circuit board and is opposite to the threaded hole. The fixing screw passes through the fixing hole along the direction of the circuit board toward the liquid cooling plate and forms a threaded fixed connection with the threaded hole.

[0015] Furthermore, the liquid cooling plate includes a plurality of heat sinks arranged in an array, and the heat sinks are temperature averaging plates with a capillary structure.

[0016] The present invention further provides an electronic device, comprising the heat dissipation device as described above.

[0017] Compared with the related art, the heat dissipation device of the present invention includes a circuit board, a heat source device and a liquid cooling plate, wherein the heat source device is fixedly mounted on the circuit board; the liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein the side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate also includes a heat dissipation member arranged in the first receiving space, and the first receiving space is filled with a phase-change liquid; the side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and the middle plate is provided with a liquid inlet hole and a liquid outlet hole both connected to the second receiving space; the liquid cooling plate also includes a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with coolant; a clearance hole isolated from the second receiving space is opened on the second cover plate, and the heat source device is attached to the middle plate through the clearance hole. In the above structure, based on the structure of the middle plate, the temperature equalizing structure is embedded in the liquid cooling plate. Combined with the efficient heat conduction capability of the temperature equalizing structure and the rapid heat dissipation capability of the liquid cooling plate, the overall heat conduction capability of the circuit board is improved, which is more conducive to directly controlling the heat generation of the heat source devices on the circuit board. Compared with the related technology, the heat dissipation performance of the heat dissipation device of the present invention is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a heat dissipation device provided in an embodiment of the present invention;

[0020] Figure 2 For the Figure 1 A cross-sectional view of line AA in the schematic diagram of the three-dimensional structure of the heat dissipation device;

[0021] Figure 3 A schematic diagram of the overall exploded structure of a heat dissipation device provided in an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the exploded structure of the liquid cooling plate in the heat dissipation device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figure 1-4 As shown, an embodiment of the present invention provides a heat dissipation device 100, which includes a circuit board 1, a liquid cooling plate 2, and a heat source device 3, wherein:

[0025] The heat source device 3 is fixedly mounted on the circuit board 1 .

[0026] Please refer to Figure 4 The liquid cooling plate 2 includes a first cover plate 21, a second cover plate 23, and a middle plate 22 sandwiched between the first cover plate 21 and the second cover plate 23, wherein the side of the middle plate 22 close to the first cover plate 21 is recessed toward the second cover plate 23 to form a first receiving space 221, and the liquid cooling plate 2 also includes a heat sink 20 arranged in the first receiving space 221, and the first receiving space 221 is filled with a phase-change liquid; the side of the middle plate 22 close to the second cover plate 23 is recessed toward the first cover plate 21 to form a second receiving space 222, and the middle plate 22 is provided with a liquid inlet hole 223 and a liquid outlet hole 224 both connected to the second receiving space 222; the liquid cooling plate 2 also includes a liquid inlet pipe 24 connected to the second receiving space 222 through the liquid inlet hole 223, and a liquid outlet pipe 25 connected to the second receiving space 222 through the liquid outlet hole 224; the second receiving space 222 is filled with cooling liquid. A clearance hole 231 isolated from the second receiving space 222 is defined on the second cover plate 23 , and the heat source device 3 passes through the clearance hole 231 and fits with the middle plate 22 .

[0027] The heat generated by the heat source device 3 is transferred to the first receiving space 221, and through the action of the heat sink 20 and the phase change liquid, the heat is evenly dispersed in the first receiving space 221, and then transferred to the second receiving space 222; the coolant in the second receiving space 222 circulates through the liquid inlet pipe 24 and the liquid outlet pipe 25, thereby achieving rapid heat dissipation.

[0028] In this embodiment, the heat sink 20 is a temperature-dissipating plate with a capillary structure. Specifically, the liquid cooling plate 2 includes a plurality of heat sinks 20 arranged in an array, further enhancing the heat dissipation effect of the heat dissipation device 100 .

[0029] Generally, the liquid inlet pipe 24 and the liquid outlet pipe 25 are respectively connected to an external condensation pump to form a liquid cooling channel for transporting the coolant in the second receiving space 222 back and forth. The coolant moves rapidly through the liquid cooling channel and dissipates heat in combination with external heat sinks, fans and other devices, and returns to the second receiving space 222, thereby maintaining a lower temperature for the liquid cooling plate 2.

[0030] In the embodiment of the present invention, by directly contacting the heat source device 3 with the middle plate 22, the heat generated by it can be directly transferred to the first receiving space 221 through the middle plate 22, which has a better heat dissipation effect than when it is in contact with the first cover plate 21 and the second cover plate 23.

[0031] Specifically, the middle plate 22 includes a recessed portion 225 that forms the second receiving space 222 with the second cover plate 23, and a contact portion 226 that contacts the heat source device 3. The contact portion 226 is recessed toward the surface of the heat source device 3, away from the second cover plate 23, to form a groove 2261. The groove 2261 includes a groove bottom surface 2262 that contacts the heat source device 3. When the heat source device 3 has a uniform thickness, contact with the groove bottom surface 2262 ensures maximum heat transfer to the first receiving space 221.

[0032] Furthermore, the heat source device 3 includes a first device 31 having a first thickness and a second device 32 having a second thickness less than the first thickness. The first device 31 is fixedly mounted on the surface of the circuit board 1 and the second device 32 is fixedly mounted on the surface of the circuit board 1 at the same horizontal plane. The fitting portion 226 includes a raised portion 2263 that protrudes from the groove bottom surface 2262 toward the heat source device 3, and the second device 32 is fitted with the raised portion 2263. By providing the raised portion 2263, even when the heat source device 3 includes devices of different thicknesses, it can still fit tightly with the middle plate 22, achieving a good heat dissipation effect.

[0033] The second cover plate 23 is provided with a first interface mounting position 232 and a second interface mounting position 233, which are respectively opposite to the liquid inlet hole 223 and the liquid outlet hole 224. The liquid inlet pipe 24 is fixed to the first interface mounting position 232 and communicates with the liquid inlet hole 223 to form a liquid inlet channel connecting the second receiving space 222 with the outside world. The liquid outlet pipe 25 is fixed to the second interface mounting position 233 and communicates with the liquid outlet hole 224 to form a liquid outlet channel connecting the second receiving space 222 with the outside world. The provision of the first interface mounting position 232 and the second interface mounting position 233 facilitates the installation of the liquid inlet pipe 24 and the liquid outlet pipe 25.

[0034] The heat dissipation device 100 further includes a fixing screw 4, a threaded hole 5, and a fixing hole 6. The threaded hole 5 is provided on the side of the second cover plate 23 close to the circuit board 1. The fixing hole 6 is provided through the circuit board 1 and is directly opposite the threaded hole 5. The fixing screw 4 passes through the fixing hole 6 along the direction from the circuit board 1 to the liquid cooling plate 2 and forms a threaded fixed connection with the threaded hole 5. Preferably, for a plate-shaped liquid cooling plate 2, a combination structure of multiple sets of fixing screws 4, threaded holes 5, and fixing holes 6 can be designed to achieve stable fixation of the entire plate, so that the surface of the liquid cooling plate 2 and the heat source device 3 have a certain contact surface pressure, and the fit is more tightly.

[0035] In this embodiment of the present invention, the liquid cooling plate 2 is preferably manufactured using an ECP (Electrochemical Plating) process, which electrochemically deposits copper onto a semiconductor substrate. The liquid cooling plate 2 in this embodiment of the present invention can be manufactured using the ECP process using a substrate made of a highly thermally conductive material. The substrate material can be copper, aluminum, stainless steel, titanium alloy, or other materials, all of which have excellent thermal conductivity.

[0036] The heat sink 100 further includes a plurality of spaced support structures 26 disposed within the second receiving space 222. The support structures 26 within the second receiving space 222 are supported between the second cover plate 23 and the recessed portion 225. The design of the support structures 26 within the second receiving space 222 facilitates increasing the heat exchange area of ​​the midplate 22, thereby improving the overall heat conduction and heat dissipation performance of the heat sink 100.

[0037] An embodiment of the present invention further provides an electronic device, which includes the heat dissipation device 100 as described in the above embodiment. It can be understood that the electronic device designed based on the heat dissipation device 100 provided in the embodiment of the present invention, based on the embedded heat conduction design of the temperature equalizing plate of the heat dissipation device 100 and the heat dissipation structure of the efficient liquid cooling plate, can achieve better heat dissipation performance. Please refer to the description of the above embodiment and will not be repeated here.

[0038] Compared with the related art, the heat dissipation device of the present invention includes a circuit board, a heat source device and a liquid cooling plate, wherein the heat source device is fixedly mounted on the circuit board; the liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein the side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate also includes a heat dissipation member arranged in the first receiving space, and the first receiving space is filled with a phase-change liquid; the side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, and the middle plate is provided with a liquid inlet hole and a liquid outlet hole both connected to the second receiving space; the liquid cooling plate also includes a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with coolant; a clearance hole isolated from the second receiving space is opened on the second cover plate, and the heat source device is attached to the middle plate through the clearance hole. In the above structure, based on the structure of the middle plate, the temperature equalizing structure is embedded in the liquid cooling plate. Combined with the efficient heat conduction capability of the temperature equalizing structure and the rapid heat dissipation capability of the liquid cooling plate, the overall heat conduction capability of the circuit board is improved, which is more conducive to directly controlling the heat generation of the heat source devices on the circuit board. Compared with the related technology, the heat dissipation performance of the heat dissipation device of the present invention is better.

[0039] The above description is only an embodiment of the present invention. It should be pointed out that those skilled in the art can make improvements without departing from the creative concept of the present invention, but these improvements all fall within the scope of protection of the present invention.

Claims

1. A heat dissipation device, comprising a circuit board, a heat source device, and a liquid cooling plate, characterized in that: The heat source device is fixedly mounted on the circuit board; The liquid cooling plate includes a first cover plate, a second cover plate, and a middle plate sandwiched between the first cover plate and the second cover plate, wherein a side of the middle plate close to the first cover plate is recessed toward the second cover plate to form a first receiving space, the liquid cooling plate further includes a plurality of heat dissipating members arranged in the first receiving space, the plurality of heat dissipating members are all temperature balancing plates with a capillary structure, and the first receiving space is filled with a phase-change liquid; a side of the middle plate close to the second cover plate is recessed toward the first cover plate to form a second receiving space, a liquid inlet hole and a liquid outlet hole are provided on the middle plate, both of which are connected to the second receiving space; the liquid cooling plate further includes a liquid inlet pipe connected to the second receiving space through the liquid inlet hole, and a liquid outlet pipe connected to the second receiving space through the liquid outlet hole; the second receiving space is filled with a coolant; The second cover plate is provided with a clearance hole isolated from the second receiving space, and the heat source device passes through the clearance hole and fits with the middle plate; The middle plate includes a recessed portion formed with the second cover plate to form the second receiving space, and a fitting portion fitted with the heat source device, wherein the fitting portion is recessed toward the surface of the heat source device and away from the second cover plate to form a groove, and the groove includes a groove bottom surface fitted with the heat source device; The heat source device includes a first device having a first thickness and a second device having a second thickness smaller than the first thickness. The first device is fixedly mounted on the surface of the circuit board and the second device is fixedly mounted on the surface of the circuit board and is located on the same horizontal plane. The fitting portion includes a protrusion protruding from the bottom surface of the groove toward the heat source device, and the second device is fitted to the protrusion. The second receiving space is arranged around the circumference of the heat source device.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a plurality of support structures arranged at intervals in the second receiving space; the support structures arranged in the second receiving space are supported between the second cover plate and the recessed portion.

3. The heat dissipation device according to claim 1, wherein: The second cover plate is provided with a first interface mounting position and a second interface mounting position which are respectively opposite to the liquid inlet hole and the liquid outlet hole; the liquid inlet pipe is clamped at the first interface mounting position and is connected with the liquid inlet hole to form a liquid inlet channel connecting the second receiving space with the outside world; the liquid outlet pipe is clamped at the second interface mounting position and is connected with the liquid outlet hole to form a liquid outlet channel connecting the second receiving space with the outside world.

4. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a fixing screw, a threaded hole and a fixing hole. The threaded hole is arranged on the second cover plate and the side close to the circuit board. The fixing hole is arranged through the circuit board and is opposite to the threaded hole. The fixing screw passes through the fixing hole along the direction of the circuit board toward the liquid cooling plate and forms a threaded fixed connection with the threaded hole.

5. The heat dissipation device according to claim 1, characterized in that: The plurality of heat dissipating elements are arranged in an array.

6. An electronic device, characterized in that: The electronic device includes the heat dissipation device according to claim 1.

Images