Improved method for manufacturing packaging substrate

Abstract

The invention discloses an improved method for manufacturing a packaging substrate, and the method comprises the steps: carrying out the chemical copper deposition, flash plating and film pasting operation on a copper surface of the substrate, so as to form a copper deposition layer on the substrate, protecting the copper deposition layer, adding the copper laying design on the copper deposition layer, and carrying out the exposure, development, electroplating and film removal on the substrate. The method comprises the steps of primary film pasting, secondary film pasting, secondary exposure of a copper laying position, differential etching of the copper laying position, secondary film removing and secondary differential etching, so that a uniform plating layer is formed on the substrate, and the copper laying design is to lay a square copper block. The packaging substrate is improved on the basis of adopting the MSAP process, and the copper laying design is introduced, so that the problem of non-uniform plating is solved.

Description

Technical Field

[0001] The present invention relates to the field of improvement of packaging substrate manufacturing, and in particular to an improved method for manufacturing a packaging substrate. Background Art

[0002] With the development of packaging substrates, more and more products are being developed, and the packaging substrate of the isolator inductor device is one of them. Although its graphic design is simple and it only consists of a choke and a contact, it is processed by the Tenting process. There will be incomplete copper corrosion between the lines and there will be more gaps and open circuits in the choke. Although the MSAP process can solve the above two problems, it will introduce new problems: uneven plating, and the difference between the copper thickness at the choke position and the copper thickness at the contact position is more than 14μm. Therefore, there is an urgent need for a method to improve the uneven distribution of residual copper rate in the MSAP process, which ultimately leads to uneven plating. Summary of the invention

[0003] The embodiments of the present invention provide an improved method, device, computer equipment and storage medium for manufacturing a packaging substrate, so as to solve the problem that the residual copper rate in the MSAP process is unevenly distributed, which ultimately leads to uneven plating.

[0004] The first aspect of the present application provides an improved method for manufacturing a packaging substrate, comprising: Performing chemical copper deposition, flash plating and film lamination operations on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate; A copper plating design is added to the copper deposition layer, and the substrate is exposed, developed, electroplated, stripped, laminated twice, exposed twice at the copper plating position, differentially etched at the copper plating position, stripped twice, and differentially etched twice, so as to form a uniform plating layer on the substrate, wherein the copper plating design is to lay square copper blocks.

[0005] Optionally, a copper plating design is added on the copper plating layer, including: According to the choke pattern design required by the customer, square copper blocks are added near the choke contacts and at locations with low residual copper rates in the choke.

[0006] Optionally, the copper-plating position of the substrate is double-exposed and the copper-plating position is differentially etched, including: Put the film again on the substrate after the film is removed, and only expose the square copper block position of the copper-plated position; After the copper-plated position is exposed twice, the amount of etching solvent is adjusted to completely etch away the square copper blocks at the copper-plated position.

[0007] A second aspect of the present application provides a method for preparing a substrate, which is prepared by using any of the improved methods for preparing a packaging substrate described above.

[0008] The improved method for manufacturing the above-mentioned packaging substrate is to form a copper layer on the substrate by performing chemical copper deposition, flash plating and film lamination operations on the copper surface of the substrate, and protect the copper layer, add a copper plating design on the copper plating layer, and respectively perform exposure, development, electroplating, film stripping, secondary film lamination, secondary exposure of the copper plating position, differential etching of the copper plating position, secondary film stripping, and secondary differential etching on the substrate to form a uniform coating on the substrate, wherein the copper plating design is to lay square copper blocks. The present application improves the problem of uneven coating by introducing a copper plating design based on the MSAP process adopted by the packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0010] Figure 1 is a flow chart of an improved method for manufacturing a packaging substrate in one embodiment of the present invention; Figure 2 Schematic diagram of an improved method for manufacturing a packaging substrate in one embodiment of the present invention. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0012] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0013] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0014] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]", depending on the context.

[0015] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0016] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0017] It should be understood that the order of execution of the steps in the following embodiments does not imply a precedence of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0018] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.

[0019] In one embodiment, if Figure 1 As shown, an improved method for manufacturing a packaging substrate is provided, and the method is applied in Figure 1 The following steps are used as an example: S10: performing chemical copper deposition, flash plating and film lamination operations on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate; S20: adding a copper plating design on the copper deposition layer, and performing exposure, development, electroplating, film stripping, secondary film lamination, secondary exposure of the copper plating position, differential etching of the copper plating position, secondary film stripping, and secondary differential etching on the substrate to form a uniform plating layer on the substrate.

[0020] Specifically, the existing MSAP process, whose full name is Modified Semi-Additive Process, is an advanced printed circuit board (PCB) manufacturing process. However, in the production of packaging substrates, the difference in copper thickness between the choke position and the contact position will be greater than 14μm, that is, there will be a problem of uneven plating. In order to solve the problem of uneven plating, the present application introduces a copper plating design, and improves the two process flows of exposure and differential etching in the existing MSAP process, thereby reducing the problem of too large a difference in the area ratio of copper layer materials at these two positions on the packaging substrate in the production of the packaging substrate.

[0021] This application requires chemical copper deposition, flash plating and film lamination on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate. Among them, chemical copper deposition is to use palladium to catalyze formaldehyde to reduce copper ions to copper element adsorbed on the substrate to form a copper conductive layer, namely, a copper deposition layer, and add a copper plating design on the copper plating layer, and expose, develop, electroplate, strip, laminate twice, expose the copper plating position twice, differentially etch the copper plating position, strip twice, and differentially etch twice to form a uniform coating on the substrate.

[0022] It should be noted that if Figure 2 As shown, the copper plating design described in the present application is designed according to the choke pattern required by the customer. Square copper blocks are added near the choke contacts and at locations where the choke residual copper rate is low, and all of them are bitten off during the first differential etching. The size of the added square copper blocks is adjusted according to the size of the choke contacts, and the distance between the added square copper blocks and the choke is not greater than 50μm during laying, so as to ensure that a uniform plating layer can be formed on the substrate.

[0023] It should be noted that exposure is to design the choke pattern according to the customer's needs, expose the substrate through the film and UV light, so that the dry film of the light-exposed part will be polymerized to become an anti-corrosion layer, and the choke pattern required by the customer will be exposed on the substrate. Development refers to dissolving and washing away the dry film of the part that has not been photopolymerized to expose the copper conductive layer there. Electroplating refers to using the copper electroplating method to thicken the exposed choke, choke contacts and copper-plated positions of the package substrate after development. De-filming refers to removing the anti-corrosion dry film by chemical or physical action, and the auxiliary lead is completed. Filming refers to filling the dry film in the molten flow state in the microscopic gaps on the copper surface so that it is flatly attached to the substrate. Secondary exposure of the copper-plated position refers to exposing only the square copper block position of the copper-plated position, and polymerizing the dry film of the light-exposed part again to become an anti-corrosion layer. Differential etching of the copper-plated position uses etching solution to bite off all the square copper blocks at the copper-plated position. Secondary stripping refers to the process of removing the dry film of the resist layer by chemical or physical action on the substrate again after differential etching of the copper layer. Secondary differential etching refers to the process of thinning the copper layer of the entire substrate by etching solution after secondary stripping of the substrate.

[0024] In one embodiment, an improved method for manufacturing a package substrate is provided. In step S20, the copper-plated positions of the substrate are double-exposed and differentially etched, specifically comprising the following steps: S21: applying a film again on the substrate after the film is removed, and only exposing the square copper block position at the copper-laying position; S22: After the copper-plating position is exposed twice, the amount of etching solvent is adjusted to completely etch away the square copper blocks at the copper-plating position.

[0025] Specifically, after completing the processes of exposure, development, electroplating, and film removal, the substrate needs to be filmed again. After the film is filmed again, the copper-plated position needs to be exposed. Therefore, during the second exposure, only the square copper block at the copper-plated position needs to be exposed for the second exposure. After the second exposure of the copper-plated position, the dosage of the etching solution is adjusted to corrode all the square copper blocks at the copper-plated position.

[0026] It should be noted that after all the square copper blocks at the copper-plated positions are etched away, the substrate needs to be stripped and differentially etched a second time, that is, the dry film on the substrate is removed again to fully reveal the choke and the contacts, and the amount of etching solvent is adjusted again to etch away the excess copper near the choke and the contacts.

[0027] In this embodiment, the provided substrate preparation method innovates the original exposure and differential etching processes, introduces a copper plating design, adds secondary film lamination, copper plating position exposure, secondary differential etching and other processes, and further reduces the difference in copper thickness at the choke position and the copper thickness at the contact position.

[0028] In one embodiment, an improved method for manufacturing a packaging substrate is provided. Figure 1 As shown, in step S11, chemical copper deposition, flash plating and film lamination operations are performed on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate, which specifically includes the following steps: S11: performing copper deposition operation on the copper surface of the substrate and the inner hole of the substrate to form a copper deposition layer; S12: A thin layer of copper is electroplated on the copper deposited layer of the substrate to protect the copper deposited layer in the inner hole of the substrate, and the dry film in the molten flow state is filled in the microscopic gaps on the copper surface to make it flatly attached to the substrate to form a protective film for the substrate.

[0029] Specifically, when making a packaging substrate, it is necessary to perform a chemical copper plating operation on the substrate, that is, using palladium to catalyze formaldehyde to reduce copper ions into copper element adsorbed on the substrate to form a copper plating layer. After the copper plating layer is formed, the copper plating layer is electroplated using a copper plating method to electroplate the substrate to thicken the copper plating layer. Then, the dry film in a molten flowing state is filled in the microscopic gaps on the copper surface to make it flatly attached to the substrate, forming a protective film for the substrate.

[0030] The improved method for manufacturing the above-mentioned packaging substrate is to form a copper layer on the substrate by performing chemical copper deposition, flash plating and film lamination operations on the copper surface of the substrate, and protect the copper layer, add a copper plating design on the copper plating layer, and respectively perform exposure, development, electroplating, film stripping, secondary film lamination, secondary exposure of the copper plating position, differential etching of the copper plating position, secondary film stripping, and secondary differential etching on the substrate to form a uniform coating on the substrate, wherein the copper plating design is to lay square copper blocks. The present application improves the problem of uneven coating by introducing a copper plating design based on the MSAP process adopted by the packaging substrate.

[0031] In an embodiment of the present application, a substrate preparation method is also provided, characterized in that the substrate is prepared by using the improved method for preparing the packaging substrate mentioned in any of the aforementioned embodiments.

[0032] It is worth noting that the packaging substrate manufactured by the substrate preparation method provided in the embodiment of the present application can improve the problem of uneven substrate plating. The substrate preparation method provided in the embodiment of the present application innovates the original two processes of exposure and differential etching, introduces copper plating design, adds secondary film lamination, copper plating position exposure, secondary differential etching and other processes, and further reduces the difference in copper thickness at the choke position and the contact position.

[0033] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0034] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. An improved method for manufacturing a packaging substrate, characterized in that: include: Performing chemical copper deposition, flash plating and film lamination operations on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate; A copper plating design is added to the copper deposition layer, and the substrate is exposed, developed, electroplated, stripped, laminated twice, exposed twice at the copper plating position, differentially etched at the copper plating position, stripped twice, and differentially etched twice, so as to form a uniform plating layer on the substrate, wherein the copper plating design is to lay square copper blocks.

2. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: Adding a copper plating design on the copper plating layer includes: According to the choke pattern design required by the customer, square copper blocks are added near the choke contacts and at locations with low residual copper rates in the choke.

3. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: Secondary exposure of the copper-plating position of the substrate and differential etching of the copper-plating position include: Put the film again on the substrate after the film is removed, and only expose the square copper block position of the copper-plated position; After the copper-plated position is exposed twice, the amount of etching solvent is adjusted to completely etch away the square copper blocks at the copper-plated position.

4. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: Secondary stripping and secondary differential etching of the substrate, including: After all the square copper blocks at the copper-plated positions are etched away, the dry film on the substrate is removed again to fully reveal the choke and the contacts, and the amount of etching solvent is adjusted again to etch away excess copper near the choke and the contacts.

5. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: The chemical copper deposition, flash plating and film lamination operations are performed on the copper surface of the substrate to form a copper deposition layer on the substrate to protect the substrate, including: Perform copper deposition operation on the copper surface of the substrate and the inner hole of the substrate to form a copper deposition layer; A thin layer of copper is electroplated on the copper layer of the substrate to protect the copper layer in the inner hole of the substrate, and the dry film in the molten flow state is filled in the microscopic gaps on the copper surface to make it adhere flatly to the substrate to form a protective film for the substrate.

6. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: Electroplating of package substrates, including: The developed package substrate is subjected to copper electroplating to thicken the copper thickness of the exposed choke, choke contacts and copper-plated positions.

7. The improved method for manufacturing a packaging substrate according to claim 1, characterized in that: Expose the substrate, including: According to the choke pattern design required by the customer, the substrate is irradiated with film and UV light, so that the dry film in the light-irradiated part is polymerized and turned into an anti-etching layer, and the choke pattern required by the customer is exposed on the substrate.

8. The improved method for manufacturing a packaging substrate according to claim 2, characterized in that: The choke pattern design according to customer needs adds square copper blocks near the choke contacts and at locations with low residual copper rates, including: The distance between the added square copper block and the choke coil during laying is no more than 50 μm.

9. The improved method for manufacturing a packaging substrate according to claim 2, characterized in that: The choke pattern design according to customer needs adds square copper blocks near the choke contacts and at locations with low residual copper rates, including: The size of the added square copper block is adjusted according to the size of the choke coil contact.

10. A method for preparing a substrate, characterized in that: The improved method for manufacturing a packaging substrate as claimed in any one of claims 1 to 9 is used for preparation.

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