Wire supply module and wire bonding machine including the same

Abstract

The wiring supply module may include a plurality of spools and a wiring machine. The wire may be wound around the spool. A wiring machine may be disposed between the spools to connect the wires to each other. The wiring machine may include a housing, a wire connector, and a cutter. The housing may have a wiring channel configured to receive an end of the wiring. The wire connector may be disposed in the housing to connect the ends of the wiring to each other. A cutter may be disposed in the housing to partially cut the connected end of the wiring. Accordingly, when all the wires on the currently used spool may be used up, the wires on another spool may be connected to the wires on the currently used spool so that the wires may be continuously supplied without replacing the spools.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0110350 filed on August 23, 2023 in the Korean Intellectual Property Office (KIPO), the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Various example embodiments relate to a wiring supply module and a wire bonding machine including the same. For example, some example embodiments relate to a wiring supply module configured to supply a wire that can be used to connect a package substrate to a semiconductor chip to a capillary, and a wire bonding machine including the wiring supply module. Background Art

[0004] Typically, a wire bonding machine may electrically connect a package substrate to a semiconductor chip using conductive wires. The wire bonding machine may include a heater, a capillary, a wire supply module, and the like. The heater may heat the package substrate. The capillary may draw the conductive wires toward the package substrate and the semiconductor chip. The wire supply module may supply the conductive wires to the capillary.

[0005] According to the prior art, a wiring supply module may comprise a spool on which the wiring may be wound.

[0006] When all the wires on one spool are available, the spool may need to be replaced with a new spool on which new wires can be wound. The spools may be replaced manually by workers, so that the efficiency of the wire splicing process may be reduced due to the spool replacement. Summary of the invention

[0007] Various example embodiments provide a wiring supply module capable of continuously supplying wiring without replacing a spool.

[0008] Various example embodiments also provide a wire bonding machine including the above-mentioned wire supply module.

[0009] In some example embodiments, a wiring supply module may be provided, the wiring supply module including: a plurality of spools on which wiring is wound; and a wiring machine disposed between the plurality of spools and configured to connect the wiring to each other. The wiring machine includes: a housing including a wiring channel configured to accommodate ends of the wiring; a wiring connector disposed in the housing and configured to connect the ends of the wiring to each other; and a cutter disposed in the housing and configured to partially cut the connected ends of the wiring.

[0010] In some example embodiments, a wiring supply module may be provided, the wiring supply module including: a plurality of spools on which the wiring is wound; and a wiring machine arranged between the plurality of spools and configured to connect the wiring to each other. The wiring machine includes: a housing including a wiring channel configured to accommodate ends of the wiring; a supply channel configured to supply wiring materials for connecting the ends of the wiring to the wiring machine; a suction channel configured to remove residues generated when connecting the ends of the wiring; and a cutter arranged in the housing and configured to partially cut the connected ends and residues of the wiring. The wiring machine is arranged in the housing and configured to connect the ends of the wiring to each other.

[0011] In some example embodiments, a wire bonding machine may be provided, the wire bonding machine including: a heater configured to heat a substrate having a semiconductor chip; a capillary arranged above the heater to extract a wire and configured to connect the semiconductor chip to the substrate; and a wire supply module configured to supply the wire to the capillary. The wire supply module includes: a plurality of spools on which the wires are wound; and a wire bonding machine arranged between the plurality of spools and configured to connect the wires to each other. The wire bonding machine includes: a housing including a wiring channel configured to accommodate ends of the wires; a wire bonding machine arranged in the housing and configured to connect the ends of the wires to each other; and a cutter arranged in the housing and configured to partially cut the connected ends of the wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Various example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. Figures 1 to 19 Represents non-limiting example embodiments as described herein.

[0013] Figure 1 is a perspective view showing a wire bonding machine according to an example embodiment;

[0014] Figure 2 It is shown Figure 1 An enlarged cross-sectional view of a wire supply module of a wire bonding machine;

[0015] Figure 3 It is shown Figure 2 A front view of a wiring machine for a wiring supply module;

[0016] Figure 4 It is shown Figure 3 Rear view of the wiring machine in;

[0017] Figure 5 It is shown Figure 3 A cross-sectional view of a wiring machine in FIG.

[0018] Figures 6 to 13 It is shown Figure 3 Illustration of various connectors of the wiring machine in;

[0019] Fig.14 is shown for detection Figure 1 A diagram showing the operation of a wiring connection section between wires in a wire bonding machine in FIG.

[0020] Figures 15 to 19 is shown to remove the wire bonding process Fig.14 A cross-sectional view of the operation of the wiring part. DETAILED DESCRIPTION

[0021] Hereinafter, various exemplary embodiments will be explained in detail with reference to the accompanying drawings.

[0022] It will be understood that elements and / or their properties (e.g., structures, surfaces, directions, etc.) that may be referred to as "perpendicular", "parallel", etc. relative to other elements and / or their properties (e.g., structures, surfaces, directions, etc.) may be "perpendicular", "parallel", etc. relative to the other elements and / or their properties, or may be "substantially perpendicular", "substantially parallel", etc. relative to the other elements and / or their properties, respectively.

[0023] Elements and / or their properties (e.g., structures, surfaces, directions, etc.) that are “substantially perpendicular” relative to other elements and / or their properties will be understood as being “perpendicular” relative to the other elements and / or their properties within manufacturing tolerances and / or material tolerances and / or having a deviation of equal to or less than 10% in amplitude and / or angle from “perpendicular” relative to the other elements and / or their properties (e.g., a tolerance of ±10%), etc.

[0024] Elements and / or their properties (e.g., structure, surface, direction, etc.) that are "substantially parallel" relative to other elements and / or their properties will be understood as being "parallel" relative to the other elements and / or their properties within manufacturing tolerances and / or material tolerances and / or having a deviation of equal to or less than 10% in amplitude and / or angle from "parallel" relative to the other elements and / or their properties (e.g., a tolerance of ±10%), etc.

[0025] Figure 1 is a perspective view showing a wire bonding machine according to an example embodiment, Figure 2 It is shown Figure 1 An enlarged cross-sectional view of a wire supply module of a wire bonding machine in FIG.

[0026] Reference Figure 1 and Figure 2, the wire bonding machine of the example embodiment may electrically connect a substrate such as a printed circuit board (PCB) (e.g., a package substrate) with a semiconductor chip using conductive wiring. The semiconductor chip may be attached to an upper surface of the package substrate. The wire bonding machine may bond a bonding pad of the semiconductor chip to a pad of the package substrate to electrically connect the semiconductor chip to the package substrate.

[0027] The wire bonding machine may include a heater 110 , a track 120 , a capillary 140 , a transducer 130 , a camera module 150 , and a wire supply module 200 , but example embodiments are not limited thereto.

[0028] The heater 110 may heat a package substrate having a semiconductor chip. For example, the package substrate may be placed on an upper surface of the heater 110. Heat generated from the heater 110 may be applied to the package substrate and the semiconductor chip (eg, the package substrate and pads of the semiconductor chip).

[0029] The rail 120 may be disposed above the heater 110. A package substrate having a semiconductor chip may be loaded into the heater 110 through the rail 120. Also, the package substrate wire-connected to the semiconductor chip may be unloaded from the heater 110 through the rail 120 after a wire bonding process.

[0030] In some example embodiments, the rail 120 may include a front rail 122 and a rear rail 124. The front rail 122 and the rear rail 124 may extend parallel to each other along the first horizontal direction D1. The heater 110 may be located between the front rail 122 and the rear rail 124. The front rail 122 may be located between the heater 110 and the capillary 140. For example, the front rail 122 may be arranged at a front side of the heater 110 oriented toward the capillary 140. In contrast, the rear rail 124 may be arranged at a rear side of the heater 110 opposite to the capillary 140.

[0031] The capillary 140 may be installed at the transducer 130. The transducer 130 may apply ultrasonic waves to the capillary 140. In addition, the transducer 130 may move along the second horizontal direction D2 substantially perpendicular to the first horizontal direction D1. In addition, the transducer 130 may move along the first horizontal direction D1. Therefore, the capillary 140 on the transducer 130 may also move along the first horizontal direction D1 and the second horizontal direction D2. For example, the capillary 140 that may move toward the heater 110 in the second horizontal direction D2 may enter the space above the heater 110 across the front rail 122.

[0032] The capillary 140 may extract the wiring. One end of the wiring extracted from the capillary 140 may be ball-bonded to a bonding pad of a semiconductor chip. The other end of the wiring may be stitch-bonded to a pad of a package substrate.

[0033] For example, the wire bonding machine may apply a discharge flame to the wire extending from the lower end of the capillary 140 to form a ball. The transducer 130 may move the capillary 140 to the semiconductor chip. Ultrasonic waves may be applied to the capillary 140 from the transducer 130 to form a ball at the lower end of the wire. The ball may be bonded to a bonding pad of the semiconductor chip. The transducer 130 may then move the capillary 140 to the package substrate. Ultrasonic waves may be applied to the capillary 140 to stitch-bond the other end of the wire to the package substrate. After stitch bonding, the wire may be cut from the pad of the package substrate. The above-mentioned bonding process may be repeated.

[0034] The camera module 150 may be disposed above the capillary 140. The camera module 150 may photograph the package substrate and the semiconductor chip bonded to each other through the wires extracted from the capillary 140. Based on the picture of the package substrate and the semiconductor chip photographed by the camera module 150, it may be determined whether the wire bonding is normal.

[0035] The wiring supply module 200 may be disposed above the capillary 140. The wiring supply module 200 may supply the wiring to the capillary 140. In some example embodiments, the wiring supply module 200 may include a plurality of spools, a tension applicator 230, and a wiring machine 300, but example embodiments are not limited thereto.

[0036] The wiring may be wound on a bobbin. In some example embodiments, the bobbin may include a first bobbin 210 and a second bobbin 220, but example embodiments are not limited thereto. For example, the bobbin may include at least three bobbins. When the bobbin may be two, the first wiring W1 may be wound on the first bobbin 210. The second wiring W2 may be wound on the second bobbin 220. In addition, the first bobbin 210 may be used in the current wiring bonding process. Therefore, the second bobbin 220 may be a spare bobbin. Therefore, the first end of the first wiring W1 on the first bobbin 210 may be drawn to the capillary 140. The second end of the first wiring W1 may extend toward the second bobbin 220. The first end of the second wiring W2 on the second bobbin 220 may extend toward the first bobbin 210.

[0037] The tension applicator 230 may apply tension to the first wiring W1 extending to the capillary 140. In some example embodiments, the tension applicator 230 may include a horizontal tension applicator 232 and a vertical tension applicator 234. The horizontal tension applicator 232 may apply horizontal tension to the first wiring W1. The vertical tension applicator 234 may apply vertical tension to the first wiring W1.

[0038] Figure 3 It is shown Figure 2 Front view of the wiring machine with wiring supply module in the Figure 4 It is shown Figure 3The rear view of the wiring machine in Figure 5 It is shown Figure 3 A cross-sectional view of the wiring machine in FIG.

[0039] Reference Figures 3 to 5 , the wiring machine 300 may be arranged between the first bobbin 210 and the second bobbin 220. The wiring machine 300 may connect the ends of the first wiring W1 and the second wiring W2 to each other. For example, the wiring machine 300 may connect the second end of the first wiring W1 to the first end of the second wiring W2. When the first wiring W1 wound on the first bobbin 210 may be almost exhausted, the wiring machine 300 may connect the first wiring W1 and the second wiring W2 to each other. Therefore, the second wiring W2 wound on the second bobbin 220 can be continuously supplied to the capillary 140 through the first bobbin 210. As a result, the wiring can be continuously supplied to the capillary 140 without changing the bobbin. In some example embodiments, the wiring machine 300 may include a housing 310, a wiring connector 320, and a cutter 330, but example embodiments are not limited thereto.

[0040] The housing 310 may be arranged between the first bobbin 210 and the second bobbin 220. The housing 310 may be configured to accommodate the first wiring W1 and the second wiring W2. Therefore, the housing 310 may have a cylindrical shape having a diameter greater than that of the first wiring W1 and the second wiring W2, but example embodiments are not limited thereto. For example, the housing 310 may have a rectangular parallelepiped shape. The housing 310 may include a wiring channel 312, a supply channel 314, and a suction channel 316.

[0041] The wiring channel 312 may be configured to accommodate the first wiring W1 and the second wiring W2. The wiring channel 312 may have a diameter for accommodating the first wiring W1 and the second wiring W2. For example, the diameter of the wiring channel 312 may be slightly larger than the diameter of the first wiring W1 and the second wiring W2. The wiring channel 312 may be formed in the housing 310 along the axial direction of the housing 310. The wiring channel 312 may be exposed through the left and right surfaces of the housing 310. The first wiring W1 may be inserted into the wiring channel 312 through the right surface of the housing 310. The second wiring W2 may be inserted into the wiring channel 312 through the left surface of the housing 310.

[0042] The supply channel 314 may supply a wiring material that may be used to connect the first wiring W1 to the second wiring W2 to the wiring channel 312. The supply channel 314 may be formed in the housing 310 along a radial direction substantially perpendicular to the axial direction of the housing 310, but example embodiments are not limited thereto. The supply channel 314 may be connected to the wiring channel 312. Therefore, the wiring material may be provided to the wiring channel 312 through the supply channel 314.

[0043] The suction channel 316 may remove residues generated when the first wiring W1 is connected to the second wiring W2. The suction channel 316 may be connected to a vacuum pump. The vacuum generated by the vacuum pump may be applied to the suction channel 316 to discharge the residues from the housing 310 through the suction channel 316. In some example embodiments, the suction channel 316 may be located between the wire connector 320 and the cutter 330, but example embodiments are not limited thereto. In addition, the suction channel 316 may include a pair of suction channels located above and below the second end of the first wiring W1, but example embodiments are not limited thereto.

[0044] The connector 320 may be arranged in the housing 310. The connector 320 may connect the ends of the first wiring W1 and the second wiring W2 to each other. In some example embodiments, the connector 320 may include a heater. When the ends of the first wiring W1 and the second wiring W2 in the wiring channel 312 may contact each other, the heater may apply heat to the ends of the first wiring W1 and the second wiring W2 to melt the ends of the first wiring W1 and the second wiring W2. The melted ends of the first wiring W1 and the second wiring W2 may be naturally cooled so that the ends of the first wiring W1 and the second wiring W2 may be transformed into a solid state to connect the first wiring W1 and the second wiring W2 to each other.

[0045] The cutter 330 may partially cut the end portion of the connection between the first wiring W1 and the second wiring W2. Fig.14 ) may have a thickness greater than the diameters of the first wiring W1 and the second wiring W2, the cutter 330 may partially cut the wiring portion J between the first wiring W1 and the second wiring W2 to have a wiring portion J having a diameter corresponding to the diameters of the first wiring W1 and the second wiring W2. In addition, when a residue generated when connecting the first wiring W1 to the second wiring W2 may remain on the wiring portion J, the cutter 330 may cut the residue. In some example embodiments, the cutter 330 may include a pair of cutters located above and below the end of the first wiring W1, but example embodiments are not limited thereto.

[0046] Figures 6 to 13 It is shown Figure 3 Illustration of various types of connectors in the wiring machine.

[0047] Reference Figure 6 , the connector 320 of the example embodiment may include a welding machine. The welding machine may weld the ends of the first wiring W1 and the second wiring W2 using welding material. For example, the welding machine may be a direct joining type using instant welding. Alternatively, the welding machine may be an electric welding machine using electric sparks.

[0048] Reference Figures 7 to 9 , the connector 320 of the exemplary embodiment may use glue. Figure 7 Enamel resin may be shown as glue. Figure 8 An epoxy resin jointing agent may be shown as the glue. Fig. 9 Acrylic adhesive may be illustrated as the glue. However, the glue may include other materials, but example embodiments are not limited to the above-mentioned materials.

[0049] Reference Figures 10 to 13 , the connector 320 of the example embodiment may use a wiring connector. Fig.10 The twisted ends of the first wiring W1 and the second wiring W2 may be shown. Fig.11 The tied ends of the first wiring W1 and the second wiring W2 may be shown. Fig.12 The connected ends of the first wiring W1 and the second wiring W2 using air splicing may be shown. The air splicing may form a joint between the ends of the first wiring W1 and the second wiring W2 using vibrations through ultrasonic welding. Fig.13 The connected ends of the first wiring W1 and the second wiring W2 using air interweaving may be shown. The air interweaving may interweave the ends of the first wiring W1 and the second wiring W2 together using compressed air.

[0050] In some example embodiments, the wiring may be continuously supplied to the capillary 140 by connecting the ends of the first wiring W1 and the second wiring W2 using the wiring machine 300. However, the wiring portion J between the first wiring W1 and the second wiring W2 may have a property different from that of the second wiring W2. For example, the wiring portion J between the first wiring W1 and the second wiring W2 may have a strength different from that of the second wiring W2. In addition, the wiring portion between the first wiring W1 and the second wiring W2 may have an electrical conductivity different from that of the second wiring W2. In some example embodiments, when the semiconductor chip and the substrate may be connected to each other using the wiring portion J between the first wiring W1 and the second wiring W2, the electrical reliability between the semiconductor chip and the substrate may be deteriorated.

[0051] In order to prevent (or reduce) the degradation of electrical reliability, such as Fig.14 As shown, the wiring portion J between the first wiring W1 and the second wiring W2 may be detected using the camera 160. For example, when the ends of the first wiring W1 and the second wiring W2 may be connected to each other using glue, glue having a color different from that of the first wiring W1 and the second wiring W2 may be provided. Therefore, the wiring portion J having the glue may have a color different from that of the first wiring W1 and the second wiring W2. The wiring portion J may be detected from an image obtained by the camera 160. Alternatively, gray may be generated between the wiring portion J and the first wiring W1 and the second wiring W2. Therefore, gray may be displayed on the image obtained by the camera 160.

[0052] Figures 15 to 19is shown to remove the wire bonding process Fig.14 A cross-sectional view of the operation of the wiring part.

[0053] Reference Fig.15 , when the wire portion J can be extracted from the capillary 140, the capillary 140 can be moved downward to the front rail 122 instead of the substrate.

[0054] Reference Fig.16 , the wiring portion J can be joined to the front rail 122.

[0055] Reference Fig.17 , the capillary 140 may move upward to separate the second wiring W2 from the wiring portion J. For example, the wiring portion J may remain on the front rail 122 .

[0056] Reference Fig.18 , the capillary 140 can continuously rise. The wiring fixture 236 can horizontally press the second wiring W2. Fig.19 As shown, a ball B may be formed on a lower end of the second wiring W2.

[0057] Therefore, in some example embodiments, the wire portion J may not be used in the wire bonding process. As a result, degradation of electrical reliability between the semiconductor chip and the substrate caused by the wire portion J may be prevented (or reduced).

[0058] In some example embodiments, the wiring machine between the spools may connect the ends of the wires wound on the spools. Thus, when all the wires on the spool currently in use may be exhausted, the wires on another spool may be connected to the wires on the spool currently in use, so that the wires can be continuously supplied without changing the spools. For example, the wiring machine may automatically connect the wires to each other to improve the efficiency of the wire bonding process.

[0059] The above is an illustration of some example embodiments and should not be construed as limiting thereof. Although some example embodiments have been described, it should be readily understood by those skilled in the art that many modifications are possible without departing from the inventive concept. Therefore, all such modifications are intended to be included within the scope of the inventive concept as defined in the claims. In the claims, means-plus-function clauses are intended to cover the structures described herein while performing the stated functions, covering not only structural equivalents but also equivalent structures. Therefore, it will be understood that the above is an illustration of various example embodiments and should not be construed as being limited to the specific example embodiments disclosed, and modifications to the disclosed example embodiments and other example embodiments are intended to be included within the scope of the appended claims.

Claims

1. A wiring supply module, comprising: a plurality of spools on which the wiring is wound; as well as a wiring machine disposed between the plurality of spools and configured to connect the wirings to each other, Wherein, the wiring machine comprises: a housing including a wiring channel configured to receive an end portion of the wiring; a connector disposed in the housing and configured to connect the ends of the wirings to each other; and A cutter is disposed in the housing and is configured to partially cut the connected end of the wiring.

2. The wiring supply module according to claim 1, wherein: The wiring channel extends in the housing from both side surfaces of the housing.

3. The wiring supply module according to claim 2, wherein: The housing further includes a supply channel for supplying a wiring material for connecting the end portions of the wiring to the connector.

4. The wiring supply module according to claim 1, wherein: The housing further includes a suction passage configured to remove residues generated when the end portion of the wiring is connected.

5. The wiring supply module according to claim 4, wherein: The suction passage is between the connector and the cutter.

6. The wiring supply module of claim 4, wherein: The suction passage includes a pair of passages above and below the ends of the wiring.

7. The wiring supply module of claim 1, wherein: The connector includes a heater.

8. The wiring supply module of claim 1, wherein: The connector includes a welding machine.

9. The wiring supply module of claim 8, wherein: The welding machine includes an electric welder configured to use an electric spark.

10. The wiring supply module of claim 1, wherein: The connector is configured to connect the ends of the wiring to each other using glue.

11. The wiring supply module of claim 10, wherein: The glue includes enamel resin, epoxy resin joint or acrylic joint.

12. The wiring supply module of claim 1, wherein: The wiring machine is configured to connect the ends of the wiring through a wiring connection.

13. The wiring supply module of claim 12, wherein: The wiring connection includes twisting or tying the ends of the wiring.

14. The wiring supply module of claim 12, wherein: The wiring connection includes air splicing or air weaving.

15. The wiring supply module of claim 1, wherein: The cutter includes a pair of cutters arranged above and below the end of the wiring.

16. A wiring supply module, comprising: a plurality of spools on which the wiring is wound; as well as a wiring machine disposed between the plurality of spools and configured to connect the wirings to each other, Wherein, the wiring machine comprises: a housing including a wiring channel configured to receive an end portion of the wiring; a supply channel configured to supply a wiring material for connecting the ends of the wiring to a wiring connector; a suction passage configured to remove residues generated when the end portions of the wiring are connected; and a cutter arranged in the housing and configured to partially cut the connected end of the wiring and the residue, and The connector is disposed in the housing and is configured to connect the ends of the wirings to each other.

17. A wiring supply module according to claim 16, wherein: The wiring channel extends in the housing from both side surfaces of the housing.

18. The wiring supply module of claim 16, wherein: The suction passage is between the connector and the cutter.

19. The wiring supply module of claim 16, wherein: The suction passage includes a pair of passages above and below the ends of the wiring.

20. The wiring supply module of claim 16, wherein: The connector includes a heater.

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