Mini-led matrix integrated packaging equipment for direct-screen PCB (Printed Circuit Board) substrate

Abstract

The invention discloses a Mini-led matrix integrated packaging device for a direct-screen PCB substrate, and belongs to the technical field of semiconductors. The die bonder mainly comprises a die bonder body, the die bonder body comprises a die bonding structure, the die bonding structure comprises a die taking mechanism, a die distributing mechanism and a support, the die taking mechanism comprises a rotating wheel and a plurality of suction nozzle assemblies, the rotating wheel is rotatably matched on the support, each suction nozzle assembly comprises a rod body, a die taking suction nozzle, a first driver, a rotating table and a second driver, and the rod body is slidably connected to the rotating table. The crystal taking suction nozzle is arranged at the first end of the rod body, the first driver can drive the rod body to swing, the crystal distribution mechanism comprises a vertically-arranged core rod, the core rod is located in the center of the multiple suction nozzle assemblies, the core rod can do linear reciprocating motion relative to the support in the axial direction of the core rod, and meanwhile the core rod can rotate around the axis of the core rod. The lower end of the core rod is provided with a die bonding suction head, and the die bonding suction head is provided with a plurality of die bonding suction ports. According to the Mini-led matrix integrated packaging equipment for the direct-screen PCB substrate, the die bonding efficiency during packaging can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a straight-screen PCB substrate Mini-LED matrix integrated packaging device. Background Art

[0002] Matrix integrated package (I MD) is to package two, four or even more groups of RGB chips in a small device unit; typical I MD packages exist in the form of 2*2 or four-in-one; four-in-one means that each I MD package includes 4 pixel groups, and each pixel group is composed of RGB three-color chips; the common use case of I MD is the display module with a pitch of P0.9.

[0003] In the existing IMD sub-packaging and packaging process, if LED flip chips are used for packaging, since the LED flip chips are adhered to the blue film with the P and N poles facing outwards, it is necessary to transfer the LED chips to the solid crystal area of ​​the substrate through a needle-piercing type solid crystal machine to achieve solid crystal. The principle is to invert the blue film that fixes the LED chip so that the side with the LED chip faces downward, so that the P and N poles of the LED chip face downward, and the LED chips on the blue film are pushed down one by one and transferred to the solid crystal area of ​​the substrate by moving the ejector pin downward. However, this method requires moving the LED chips one by one to the corresponding solid crystal area, and the efficiency can only be improved by increasing the movement speed. However, the faster the speed, the higher the offset fault, which limits the speed improvement.

[0004] Therefore, it is necessary to provide a new straight-screen PCB substrate Mini-led matrix integrated packaging device. Summary of the invention

[0005] Based on the above problems existing in the prior art, the purpose of an embodiment of the present invention is to provide a straight-screen PCB substrate Mini-led matrix integrated packaging device, which can improve the die bonding efficiency during packaging.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a straight-screen PCB substrate Mini-led matrix integrated packaging device, including a crystal bonding machine, the crystal bonding machine includes a crystal bonding structure, the crystal bonding structure includes a crystal retrieval mechanism, a crystal placement mechanism and a bracket, the crystal retrieval mechanism includes a rotating wheel and a plurality of suction nozzle assemblies, the rotating wheel is rotatably matched with the bracket, the suction nozzle assembly includes a rod body, a crystal retrieval nozzle, a driver one, a turntable and a driver two, the driver one is installed on the rotating wheel, the driver one is used to drive the turntable to rotate around a horizontal axis, the rod body is slidably connected to the turntable, the driver two is installed on the turntable, the driver two is used to drive the rod body to slide in a direction perpendicular to the rotation axis of the turntable, the crystal retrieval nozzle is arranged at the first end of the rod body, and the driver The device can drive the rod body to swing. When the rod body is driven by the driver and flipped to the first position, the crystal taking nozzle on the rod body is vertically facing downward. When the rod body is driven by the driver and flipped to the second position, the rod body swings 180°, so that the crystal taking nozzle on the rod body is vertically facing upward. Multiple nozzle assemblies are distributed in a circular array. The crystal distribution mechanism includes a vertically arranged core rod, and the core rod is located at the center position of multiple nozzle assemblies. The core rod can make a linear reciprocating movement relative to the bracket along the axial direction of the core rod, and the core rod can rotate around the axis of the core rod. A solid crystal suction head is arranged at the lower end of the core rod, and multiple solid crystal suction ports are arranged in a straight line along the radial direction of the core rod.

[0007] Furthermore, the first end of the rod body is telescopically provided with a telescopic end, the crystal taking nozzle is connected to the telescopic end, and the extension of the telescopic end can drive the crystal taking nozzle to perform linear motion along the axial direction of the rod body.

[0008] Furthermore, the crystal distribution mechanism also includes a base, a center wheel, a planetary carrier, a planetary gear, a gear ring, a rotating sleeve, a driver three and a driver four. The base is rotatably matched with the bracket, and the rotating sleeve is rotatably matched on the base. The rotating sleeve is sleeved on the core rod, and the rotating sleeve and the core rod are threadedly matched. The core rod also slides axially on the base, and the core rod is limited on the base along the circumferential direction. The driver three is used to drive the rotating sleeve to rotate, the center wheel is installed on the base and is coaxially arranged with the core rod, the planetary carrier is rotatably matched with the base, and the planetary gear is rotatably matched on the planetary carrier. The planetary gears are multiple, and the multiple planetary gears are arranged around the axis of the center wheel. The gear ring is sleeved on the multiple planetary gears, and the gear ring is fixedly connected to the bracket, the planetary gears are meshed with the gear rings, and the planetary gears are meshed with the center wheel. Driver four is used to drive the planetary carrier to rotate.

[0009] Furthermore, the crystal retrieval mechanism also includes a pneumatic rotary joint arranged between the bracket and the rotary wheel.

[0010] Furthermore, a meshing structure 1 is provided on the planet carrier, and the output end of the driver 4 meshes with the meshing structure 1 on the planet carrier.

[0011] Furthermore, the rotating sleeve and the output end of the driver three are connected in transmission through tooth meshing.

[0012] Furthermore, the driver one is a rotary cylinder, the driver two is a linear cylinder, and the crystal retrieval mechanism also includes a pneumatic rotary joint arranged between the bracket and the rotary wheel.

[0013] Furthermore, a sliding groove extending along the axial direction of the core rod is provided on the outer peripheral wall of the core rod, a guide ring is fixedly arranged on the base, a sliding protrusion extending along the axial direction of the guide ring is provided on the guide ring, the guide ring is sleeved on the core rod, and the sliding protrusion can be slidably inserted into the sliding groove.

[0014] Furthermore, a sliding hole is provided at the first end of the rod body, the telescopic end is slidably installed in the sliding hole, a piston is provided on the telescopic end, and a piston chamber 1 and a piston chamber 2 are respectively provided inside the rod body at both ends of the piston.

[0015] Furthermore, the number of the die-bonding suction ports is three, and the number of the suction nozzle assemblies is three.

[0016] Compared with the prior art, the above technical solution in the embodiment of the present invention has at least one of the following beneficial effects:

[0017] The present invention provides a straight screen PCB substrate Mini-LED matrix integrated packaging device, which includes a crystal bonding machine, the crystal bonding machine includes a crystal bonding structure, the crystal bonding structure includes a crystal taking mechanism, a crystal placement mechanism and a bracket, the crystal taking mechanism includes a rotating wheel and a plurality of suction nozzle assemblies, the rotating wheel rotates and cooperates with the bracket, the suction nozzle assembly includes a rod body, a crystal taking suction nozzle, a driver 1, a turntable and a driver 2, the driver 1 is installed on the rotating wheel, the driver 1 is used to drive the turntable to rotate around a horizontal axis, the rod body is slidably connected to the turntable, the driver 2 is installed on the turntable, the driver 2 is used to drive the rod body to slide in a direction perpendicular to the rotation axis of the turntable, the crystal taking suction nozzle is arranged at the first end of the rod body, and the driver 1 can The driving rod body swings. As shown in the figure, when the rod body is driven by the driver and flipped to the first position, the crystal taking nozzle on the rod body is vertically facing downward. When the rod body is driven by the driver and flipped to the second position, the rod body swings 180 degrees, so that the crystal taking nozzle on the rod body is vertically facing upward. Multiple nozzle assemblies are distributed in a circular array. The crystal layout mechanism includes a vertically arranged core rod, which is located at the center of multiple nozzle assemblies. The core rod can make a straight reciprocating movement relative to the bracket along the axial direction of the core rod. At the same time, the core rod can rotate around the axis of the core rod. A solid crystal suction head is arranged at the lower end of the core rod. As shown in the figure, a plurality of solid crystal suction ports are arranged on the solid crystal suction head. The plurality of solid crystal suction ports are arranged along the core rod. The rods are arranged in a straight line in the radial direction. When the driver 1 drives the rod body to swing to the first position, the rotation of the rotary wheel causes the multiple crystal taking nozzles on the rod body to rotate one by one to the top of the blue film, and the LED chips are sucked one by one by the multiple crystal taking nozzles. Then, the core rod rotates, and the driver 2 drives the crystal taking nozzle to move in a straight line, so that when the rod body swings to the second position, the crystal taking nozzle is selectively aligned with the multiple crystal fixing nozzles on the crystal fixing nozzle, and the LED chip on the crystal taking nozzle is grabbed by the crystal fixing nozzle. Because the P pole and N pole of the LED chip are upward and close to the crystal taking nozzle when the crystal taking nozzle sucks the LED chip, after the LED chip is turned 180° with the crystal taking nozzle, The P and N poles of the LED chip sucked by the crystal retrieval nozzle are facing downwards, and when the LED chip on the crystal retrieval nozzle is subsequently sucked by the crystal solidifying nozzle, the LED chip sucked by the crystal solidifying nozzle is in a state with its P and N poles facing downwards and away from the crystal solidifying nozzle. The multiple LED chips are transferred to the multiple crystal solidifying nozzles on the crystal solidifying head through the crystal retrieval nozzle, and then the core rod is lowered to drive the crystal solidifying head to move downward, so as to transfer the multiple LED chips together to the multiple corresponding crystal solidifying areas of the substrate, and the multiple LED chips are in a state with their P and N poles facing downwards towards the substrate, which is suitable for the packaging of LED flip chips. Compared with the prior art, the straight-screen PCB substrate Mini-led matrix integrated packaging equipment provided by the embodiment of the present invention can simultaneously transfer and solidify multiple LED chips to multiple crystal solidifying areas each time, thereby reducing the number of displacements between the crystal solidifying area and the blue film for storing the LED chips, shortening the displacement path, and promoting the improvement of the crystal solidifying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a straight screen PCB substrate Mini-led matrix integrated packaging device provided in an embodiment of the present invention.

[0020] Figure 2 A front view of a straight screen PCB substrate Mini-LED matrix integrated packaging device provided in an embodiment of the present invention.

[0021] Figure 3 For along Figure 2 A cross-sectional view along the EE direction, showing a position state of the rod body.

[0022] Figure 4 A schematic diagram of the three-dimensional structure of a nozzle assembly provided in an embodiment of the present invention.

[0023] Figure 5 A cross-sectional view of a rod body provided in an embodiment of the present invention.

[0024] Figure 6 for Figure 3 A magnified schematic diagram of area A in the middle.

[0025] Figure 7 for Figure 3 A magnified schematic diagram of area B.

[0026] Figure 8 A schematic diagram of the three-dimensional structure of a crystal layout mechanism provided in an embodiment of the present invention.

[0027] Fig. 9 An exploded view of a wafer layout mechanism provided in an embodiment of the present invention.

[0028] Fig.10 for Figure 3 A cross-sectional view of a straight screen PCB substrate Mini-LED matrix integrated packaging device is shown, showing another position state of the rod body.

[0029] Fig.11 For along Fig.10 Enlarged schematic diagram of area C in the middle.

[0030] Fig.12 for Figure 3 A cross-sectional view of a straight screen PCB substrate Mini-led matrix integrated packaging device is shown, showing another position state of the rod body.

[0031] Fig.13 for Fig.12 A magnified schematic diagram of region D in the middle.

[0032] Among them, the reference numerals in the figure are as follows: 100, crystal fixing structure; 1, crystal taking mechanism; 11, rotating wheel; 12, nozzle assembly; 121, rod body; 1211, sliding hole; 1212, piston chamber 1; 1213, piston chamber 2; 122, telescopic end; 1221, piston; 123, crystal taking nozzle; 124, reset elastic member; 125, driver 1; 126, rotating table; 1261, sliding rod; 127, driver 2; 128, pneumatic rotary joint; 1281, fixing part; 12 82. Rotating part; 13. Crystal taking suction port; 2. Crystal placing mechanism; 21. Core rod; 211. External thread; 212. Crystal fixing suction head; 213. Slide groove; 22. Base; 221. Connecting plate; 222. Guide collar; 2221. Slide cam; 23. Center wheel; 24. Planet carrier; 241. Meshing structure one; 25. Planetary gear; 26. Gear ring; 27. Rotating sleeve; 28. Driver three; 29. ​​Driver four; 3. Bracket; 31. Accommodating chamber; 4. Conversion head; 41. Crystal fixing suction port. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] It should be noted that when an element is referred to as being "connected to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment," "in some embodiments," or "in some of these embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0038] Please refer to Figures 1 to 13 As shown, a straight screen PCB substrate Mini-led matrix integrated packaging device provided by the present invention is now described. The straight screen PCB substrate Mini-led matrix integrated packaging device includes a crystal bonding machine, the crystal bonding machine includes a crystal bonding structure 100, the crystal bonding structure 100 is used to absorb the LED chip on the blue film of the crystal supply platform (not shown) and place it on the crystal bonding area on the substrate (not shown), the crystal bonding structure 100 includes a crystal taking mechanism 1, a crystal placement mechanism 2 and a bracket 3, the crystal taking mechanism 1 includes a rotating wheel 11 and a plurality of suction nozzle assemblies 12, the rotating wheel 11 is rotatably matched on the bracket 3, as shown in FIG. Figure 4 As shown, the nozzle assembly 12 includes a rod body 121, a crystal pickup nozzle 123, a driver 125, a turntable 126 and a second driver 127. The driver 125 is installed on the turntable 11, and the driver 125 is used to drive the turntable 126 to rotate around a horizontal axis. The rod body 121 is slidably connected to the turntable 126, and the second driver 127 is installed on the turntable 126. The second driver 127 is used to drive the rod body 121 to slide in a direction perpendicular to the rotation axis of the turntable 126. The crystal pickup nozzle 123 is arranged at the first end of the rod body 121, and the driver 125 can drive the rod body 121 to swing. Figure 3 As shown, when the rod body 121 is driven by the driver 125 to flip to the first position, that is, the wafer taking nozzle 123 on the rod body 121 is vertically facing downward, as shown in FIG. Fig.10As shown, when the rod body 121 is driven by the driver 125 to flip to the second position, that is, the rod body 121 swings 180 degrees, so that the crystal extraction nozzle 123 on the rod body 121 is vertically facing upward, and the multiple nozzle assemblies 12 are distributed in a circular array. The crystal arrangement mechanism 2 includes a vertically arranged core rod 21, and the core rod 21 is located at the center position of the multiple nozzle assemblies 12. The core rod 21 can make a linear reciprocating movement relative to the bracket 3 along the axial direction of the core rod 21, and the core rod 21 can rotate around the axis of the core rod 21. The lower end of the core rod 21 is provided with a solid crystal suction head 212, as shown in FIG. Figure 7 As shown, the crystal fixing suction head 212 is provided with a plurality of crystal fixing suction ports 41, and the plurality of crystal fixing suction ports 41 are arranged in a straight line along the radial direction of the core rod 21. When the driver 125 drives the rod body 121 to swing to the first position, the rotation of the rotary wheel 11 causes the plurality of crystal taking suction nozzles 123 on the rod body 121 to rotate one by one to the top of the blue film, and the plurality of crystal taking suction nozzles 123 suck the LED chips one by one, and then the core rod 21 rotates, and the driver 2 127 drives the crystal taking suction nozzles 123 to move in a straight line. The rod 121 moves in a linear manner, so that when the rod 121 swings to the second position, the wafer taking nozzle 123 is selectively aligned with the multiple wafer fixing nozzles 41 on the wafer fixing nozzle 212, and the wafer fixing nozzle 41 works to grab the LED chip on the wafer taking nozzle 123. Because the P pole and N pole of the LED chip are upwardly close to the wafer taking nozzle 123 when the wafer taking nozzle 123 sucks the LED chip, after the LED chip is turned 180 degrees with the wafer taking nozzle 123, the LED chip sucked by the wafer taking nozzle 123 The P pole and N pole of the chip are facing downwards, and then when the LED chip on the crystal removal nozzle 123 is sucked by the solid crystal suction port 41, the LED chip sucked by the solid crystal suction port 41 is in a state with the P pole and N pole facing downwards and away from the solid crystal suction port 41, and the multiple LED chips are transferred to the multiple solid crystal suction ports 41 on the solid crystal suction head 212 through the crystal removal nozzle 123, and then the core rod 21 descends to drive the solid crystal suction head 212 to move downward, so as to transfer the multiple LED chips together to the multiple corresponding solid crystal areas of the substrate, and the multiple LED chips are in a state with the P pole and N pole facing downwards towards the substrate, which is suitable for the packaging of LED flip chips. Compared with the prior art, the straight screen PCB substrate Mini-led matrix integrated packaging equipment provided by the embodiment of the present invention can transfer multiple LED chips to multiple solid crystal areas at the same time each time, thereby reducing the number of displacements between the solid crystal area and the blue film storing the LED chips, shortening the displacement path, and promoting the improvement of solid crystal efficiency.

[0039] In addition, the straight-screen PCB substrate Mini-led matrix integrated packaging equipment provided by the embodiment of the present invention has a crystal retrieval nozzle 123 in the crystal retrieval nozzle assembly 12 of the crystal retrieval structure 100 that can swing, so that the rod body 121 of the nozzle assembly 12 remains switched to the first position, and the crystal retrieval nozzle 123 on the rod body 121 is vertically downward. The crystal retrieval structure 100 is also suitable for performing crystal bonding operations on LED upright chips. Specifically, the rotation of the rotary wheel 11 drives multiple nozzle assemblies 12 to approach the blue film of the crystal supply platform one by one, so that multiple LED chips are grabbed by multiple crystal retrieval nozzles 123, and then the multiple LED chips are transferred to the crystal bonding area of ​​the substrate without multiple displacements between the crystal bonding area on the substrate and the blue film for storing the LED chips. Therefore, the straight-screen PCB substrate Mini-led matrix integrated packaging equipment provided by the embodiment of the present invention can perform crystal bonding operations on both LED upright chips and LED flip chips, has wide applicability, and is conducive to reducing the procurement cost of multiple sets of equipment.

[0040] It can be understood that in order to ensure high operation efficiency, after one of the suction nozzle assemblies 12 grabs the LED chip at the first position, immediately afterwards, during the process in which the rotary wheel 11 rotates to drive the next suction nozzle assembly 12 to grab the LED chip, the suction nozzle assembly 12 that previously grabbed the LED chip at the first position simultaneously swings the rod body 121 to the second position to transfer the LED chip to the solid crystal suction head 212, that is, while the suction nozzle assembly 12 grabs the LED chip, the suction nozzle assembly 12 that previously completed the LED chip grabbing drives the rod body 121 to flip through the driver 125, and transfers the LED chip to the solid crystal suction head 212.

[0041] like Fig.10 , Fig.11 , Fig.12 as well as Fig.13As shown, as the second driver 127 drives the rod body 121 to slide and drives the wafer taking nozzle 123 to slide linearly, so that the wafer taking nozzle 123 is turned to the second position with the rod body 121 driven by the first driver 125, the distance between the wafer taking nozzle 123 and the center of the core rod 21 changes. In addition, since the plurality of crystal bonding suction ports 41 are arranged in a straight line along the radial direction of the core rod 21, the position of the wafer taking nozzle 123 is changed by driving the second driver 127, so that when the wafer taking nozzle 123 is turned to the second position with the rod body 121, the wafer taking nozzle 123 can be aligned with the plurality of crystal bonding suction ports 41. The plurality of crystal bonding suction ports 41 are aligned until the plurality of crystal bonding suction ports 41 are covered with LED chips. In addition, since the plurality of nozzle assemblies 12 are distributed in a circular array around the core rod 21, when the nozzle assembly 12 needs to transfer the grabbed LED chip to the crystal bonding suction head 212, the core rod 21 is rotated until the arrangement direction of the plurality of crystal bonding suction ports 41 coincides with the direction in which the corresponding nozzle assembly 12 and its driver 2 127 drive the crystal retrieval nozzle 123 to move linearly, so that the crystal retrieval nozzle 123 can stay in a position aligned with any one of the crystal bonding suction ports 41.

[0042] In some embodiments, the bracket 3 is hollow inside to form a receiving cavity 31 for supporting component structures.

[0043] like Figure 3 As shown, in some embodiments, driver one 125 is a rotary cylinder, and driver two 127 is a linear cylinder. In this way, the design of the pneumatic structure of driver one 125 and driver two 127 can reduce the dead weight of the suction nozzle assembly 12, help reduce the motion inertia, and help reduce the jitter generated when the suction nozzle assembly 12 is in motion. The crystal retrieval mechanism 1 also includes a pneumatic rotary joint 128 arranged between the bracket 3 and the rotary wheel 11, so that the rotary wheel 11 can rotate flexibly. Specifically, the pneumatic rotary joint 128 includes a fixed part 1281 and a rotary part 1282 that rotates with the fixed part 1281, and an air path is arranged between the fixed part 1281 and the rotary part 1282. The fixed part 1281 is installed on the bracket 3, and the rotary part 1282 is connected to the rotary wheel 11. The pneumatic rotary joint 128 is an existing mature technology, so it will not be described in detail here.

[0044] In some embodiments, the crystal retrieval mechanism 1 further includes a rotary driver (not shown) mounted on the bracket 3, and the output end of the rotary driver is transmission-connected to the rotary wheel 11 so as to drive the rotary wheel 11 to rotate through the rotary driver.

[0045] like Figure 4 As shown, in some embodiments, a sliding rod 1261 is slidably disposed on the turntable 126 , the sliding rod 1261 is perpendicular to the rotation axis of the turntable 126 , and the sliding rod 1261 is connected to the rod body 121 .

[0046] like Figure 4 and Figure 5 As shown, in some embodiments, the first end of the rod body 121 is telescopically provided with a telescopic end 122, and the crystal taking nozzle 123 is connected to the telescopic end 122. The extension of the telescopic end 122 can drive the crystal taking nozzle 123 to make a linear motion along the axial direction of the rod body 121. On the one hand, when the rod body 121 is in the first position, the telescopic end 122 drives the crystal taking nozzle 123 to extend, so as to facilitate the crystal taking nozzle 123 to contact the LED chip to be sucked downward. On the other hand, when the rod body 121 is flipped to the second position, the telescopic end 122 drives the crystal taking nozzle 123 to extend so that the crystal taking nozzle 123 is close to the solid crystal suction head 212, so as to facilitate the linear movement of the LED chip on the crystal taking nozzle 123 and abut against the solid crystal suction head 212 in a linear motion, so as to avoid the flipping of the crystal taking nozzle 123 and directly contacting the LED chip with the solid crystal suction head 212 to cause lateral displacement; Figure 5 As shown, specifically, a sliding hole 1211 is provided at the first end of the rod body 121, and the telescopic end 122 is slidably installed in the sliding hole 1211. A piston 1221 is provided on the telescopic end 122. A piston chamber 1212 and a piston chamber 2 1213 are respectively provided inside the rod body 121 at both ends of the piston 1221. By adjusting the pressure difference between the piston chamber 1 1212 and the piston chamber 2 1213, the piston 1221 can be driven to drive the telescopic end 122 to move axially along the sliding hole 1211. The flow of gas in the piston chamber 1 1212 and the piston chamber 2 1213 is connected to the external gas circuit through the pneumatic rotary joint 128.

[0047] like Figure 5 As shown, in addition, a reset elastic member 124 is provided at one end of the piston 1221 close to the telescopic end 122, and the reset elastic member 124 is used to always apply elastic force to the piston 1221 and the telescopic end 122 to drive the piston 1221 and the telescopic end 122 to slide and retract, so as to accelerate the retraction speed of the telescopic end 122 by the setting of the reset elastic member 124.

[0048] like Figure 5 As shown, in some embodiments, a crystal taking suction port 13 capable of generating negative pressure is provided at the end of the crystal taking suction nozzle 123, and negative pressure is generated at the crystal taking suction port 13 to lock the LED chip at the end of the crystal taking suction nozzle 123. Specifically, the crystal taking suction port 13 of the crystal taking suction nozzle 123 is connected to an external air circuit, and a negative pressure is generated at the crystal taking suction port 13 by vacuuming the air circuit. More specifically, the crystal taking suction port 13 of the crystal taking suction nozzle 123 is connected to an external air circuit via a pneumatic rotary joint 128.

[0049] like Figure 6 , Figure 8 as well as Fig. 9As shown, in some embodiments, the crystal arrangement mechanism 2 also includes a base 22, a center wheel 23, a planetary carrier 24, a planetary wheel 25, a gear ring 26, a rotating sleeve 27, a driver three 28 and a driver four 29. The base 22 is rotatably matched with the bracket 3, the rotating sleeve 27 is rotatably matched on the base 22, the rotating sleeve 27 is sleeved on the core rod 21, and the rotating sleeve 27 and the core rod 21 are threadedly matched. The core rod 21 is also axially slidably matched on the base 22, and the core rod 21 is circumferentially limited on the base 22. The driver three 28 is used to drive the rotating sleeve 27 to rotate, the center wheel 23 is installed on the base 22 and is coaxially arranged with the core rod 21, the planetary carrier 24 is rotatably matched with the base 22, the planetary wheel 25 is rotatably matched on the planetary carrier 24, there are multiple planetary wheels 25, and the multiple planetary wheels 25 are arranged around the axis of the center wheel 23, the gear ring 26 is sleeved on the multiple planetary wheels 25, and the gear ring 26 is fixed to the bracket 3 The planetary gear 25 is connected to the support 3, the planetary gear 25 is meshed with the ring gear 26, and the planetary gear 25 is meshed with the center gear 23. The driver four 29 is used to drive the planetary carrier 24 to rotate. In this way, when the core rod 21 needs to rotate relative to the bracket 3, the driver four 29 drives the planetary carrier 24 to rotate. The rotation of the planetary carrier 24 drives the planetary gear 25 to rotate around the center gear 23. At the same time, the planetary gear 25 meshes with the ring gear 26 and rotates around the axis of the planetary gear 25, thereby driving the center gear 23 to rotate. The rotation of the center gear 23 drives the base 22 to rotate. Since the core rod 21 is limited on the base 22 along the circumferential direction, the core rod 21 is allowed to perform a circular rotation relative to the bracket 3 along the base 22; when the core rod 21 needs to make a linear reciprocating movement relative to the bracket 3 along the axial direction of the core rod 21, the driver three 28 drives the rotating sleeve 27 to rotate. The rotating sleeve 27 rotates to apply an axial thrust to the core rod 21, driving the core rod 21 to slide linearly on the base 22.

[0050] The structure in the crystal arrangement mechanism 2 that drives the core rod 21 to rotate through the planetary structure is a speed-increasing structure, which can accelerate the rotation of the core rod 21 and improve the operating efficiency.

[0051] like Figure 6 As shown, the base 22 is rotatably matched with the bracket 3 through the connecting plate 221.

[0052] like Figure 8As shown, in some embodiments, driver three 28 is a driving device for outputting circular motion power, driver three 28 is installed on the bracket 3, and the output end of driver three 28 is transmission connected with the rotating sleeve 27, and driver four 29 is a driving device for outputting circular motion power, driver four 29 is installed on the bracket 3, and the output end of driver four 29 is transmission connected with the planetary carrier 24, so that when driver three 28 is running, the output end of driver four 29 is locked, and the rotation of the base 22 is locked. At this time, when driver three 28 drives the rotating sleeve 27 to rotate, the base 22 will not rotate with the rotating sleeve 27, and the base 22 maintains the circumferential limit on the core rod 21 to prevent the core rod 21 from rotating; when driver four 29 is running, the output end of driver three 28 can rotate freely, so that the rotating sleeve 27 can rotate with the core rod 21 to prevent the core rod 21 from axial slippage.

[0053] In some other embodiments not shown in the figures, driver three 28 is a driving device for outputting circular motion power, driver three 28 is installed on the base 22, and the output end of driver three 28 is transmission connected to the rotating sleeve 27, and driver four 29 is a driving device for outputting circular motion power, driver four 29 is installed on the bracket 3, and the output end of driver four 29 is transmission connected to the planetary carrier 24, so that when driver three 28 is running, the output end of driver four 29 is locked, and the rotation of the base 22 is locked. At this time, when driver three 28 drives the rotating sleeve 27 to rotate, the base 22 will not rotate with the rotating sleeve 27, and the base 22 maintains the circumferential limit on the core rod 21 to prevent the core rod 21 from rotating; when driver four 29 is running, the output end of driver three 28 is locked, and the rotating sleeve 27 is locked on the base 22 so that it rotates with the core rod 21 to prevent the core rod 21 from axial slippage.

[0054] like Figure 6 As shown, in some of the embodiments, a meshing structure 241 is provided on the planet carrier 24, and the output end of the driver 29 meshes with the meshing structure 241 on the planet carrier 24.

[0055] In some embodiments, the rotary sleeve 27 and the output end of the driver 3 28 are connected to each other through tooth meshing.

[0056] like Figure 6 As shown, in some embodiments, an outer circumferential wall of the core rod 21 is provided with an external thread 211 , an inner circumferential wall of the rotary sleeve 27 is provided with an internal thread, and the external thread 211 of the core rod 21 is meshed with the internal thread of the rotary sleeve 27 .

[0057] like Fig. 9As shown, in some of the embodiments, a slide groove 213 extending along the axial direction of the core rod 21 is provided on the outer peripheral wall of the core rod 21, a guide ring 222 is fixedly provided on the base 22, and a sliding protrusion 2221 extending along the axial direction of the guide ring 222 is provided on the guide ring 222, the guide ring 222 is sleeved on the core rod 21, and the sliding protrusion 2221 can be slidably inserted into the slide groove 213 to limit the core rod 21 on the base 22 along the circumferential direction.

[0058] like Figure 7 As shown, in some embodiments, a conversion head 4 is detachably mounted on the end of the die bonding suction head 212, and a die bonding suction port 41 is provided on the conversion head 4. By replacing conversion heads 4 of different specifications, it can adapt to different working conditions. For example, if the spacing between adjacent die bonding areas is different, the conversion head 4 with a die bonding suction port 41 of corresponding spacing is replaced.

[0059] In some of the embodiments, the bonding head 212 has three bonding suction ports 41 and three nozzle assemblies 12 to adapt to the four-in-one matrix integrated package. Because each pixel group in the four-in-one matrix integrated package structure is composed of three three-color chips, that is, one pixel group has three bonding areas, and each pixel group needs to install three LED chips in parallel. The straight screen PCB substrate Mini-led matrix integrated packaging device provided in the embodiment of the present invention can bond three LED chips on one pixel group at a time.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A straight screen PCB substrate Mini-LED matrix integrated packaging device, including a die bonder, the die bonder including a die bonder structure, characterized in that: The crystal fixing structure includes a crystal taking mechanism, a crystal placing mechanism and a bracket, the crystal taking mechanism includes a rotating wheel and a plurality of suction nozzle assemblies, the rotating wheel is rotatably matched with the bracket, the suction nozzle assembly includes a rod body, a crystal taking nozzle, a driver 1, a turntable and a driver 2, the driver 1 is installed on the rotating wheel, the driver 1 is used to drive the turntable to rotate around a horizontal axis, the rod body is slidably connected to the turntable, the driver 2 is installed on the turntable, the driver 2 is used to drive the rod body to slide in a direction perpendicular to the rotation axis of the turntable, the crystal taking nozzle is arranged at a first end of the rod body, the driver 1 can drive the rod body to swing, and when the rod body is When the driver drives and flips to the first position, the crystal taking nozzle on the rod body is vertically facing downward. When the rod body is driven by the driver and flips to the second position, the rod body swings 180°, so that the crystal taking nozzle on the rod body is vertically facing upward. Multiple nozzle assemblies are distributed in a circular array. The crystal layout mechanism includes a vertically arranged core rod, and the core rod is located at the center position of multiple nozzle assemblies. The core rod can make a linear reciprocating movement relative to the bracket along the axial direction of the core rod, and the core rod can rotate around the axis of the core rod. A crystal fixing suction head is arranged at the lower end of the core rod, and multiple crystal fixing suction ports are arranged in a straight line along the radial direction of the core rod.

2. According to claim 1, a straight screen PCB substrate Mini-LED matrix integrated packaging device is characterized in that: The first end of the rod body is telescopically provided with a telescopic end, and the crystal taking suction nozzle is connected to the telescopic end. The extension of the telescopic end can drive the crystal taking suction nozzle to move linearly along the axial direction of the rod body.

3. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 1, characterized in that: The crystal distribution mechanism also includes a base, a center wheel, a planetary carrier, a planetary gear, a gear ring, a rotating sleeve, a driver three and a driver four. The base is rotatably matched with the bracket, and the rotating sleeve is rotatably matched with the base. The rotating sleeve is sleeved on the core rod, and the rotating sleeve and the core rod are threadedly matched. The core rod also slides axially on the base, and the core rod is limited on the base along the circumferential direction. The driver three is used to drive the rotating sleeve to rotate, the center wheel is installed on the base and is coaxially arranged with the core rod, the planetary carrier is rotatably matched with the base, and the planetary gear is rotatably matched with the planetary carrier. The planetary gear has multiple planetary gears, and the multiple planetary gears are arranged around the axis of the center wheel. The gear ring is sleeved on the multiple planetary gears, and the gear ring is fixedly connected to the bracket. The planetary gear is meshed with the gear ring, and the planetary gear is meshed with the center wheel. Driver four is used to drive the planetary carrier to rotate.

4. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 1, characterized in that: The crystal retrieval mechanism also includes a pneumatic rotary joint arranged between the bracket and the rotary wheel.

5. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 3, characterized in that: The planet carrier is provided with a meshing structure 1, and the output end of the driver 4 meshes with the meshing structure 1 on the planet carrier.

6. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 3, characterized in that: The rotating sleeve and the output end of the driver 3 are connected in transmission through tooth meshing.

7. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 1, characterized in that: The driver 1 is a rotary cylinder, the driver 2 is a linear cylinder, and the crystal taking mechanism also includes a pneumatic rotary joint arranged between the bracket and the rotary wheel.

8. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 3, characterized in that: The outer peripheral wall of the core rod is provided with a slide groove extending along the axial direction of the core rod, a guide ring is fixedly arranged on the base, the guide ring is provided with a sliding protrusion extending along the axial direction of the guide ring, the guide ring is sleeved on the core rod, and the sliding protrusion can be slidably inserted into the slide groove.

9. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 2, characterized in that: A sliding hole is provided at the first end of the rod body, the telescopic end is slidably installed in the sliding hole, a piston is provided on the telescopic end, and a piston chamber 1 and a piston chamber 2 are respectively provided inside the rod body at both ends of the piston.

10. The straight screen PCB substrate Mini-LED matrix integrated packaging device according to claim 1, characterized in that: The number of the die-bonding suction ports is three, and the number of the suction nozzle assemblies is three.

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