Die bonder with double-layer conveying function

Abstract

The utility model discloses a die bonder with a double-layer conveying function, and relates to the technical field of die bonders, the die bonder comprises a rack, a control assembly and a working platform, the control assembly is installed on one side of the rack, the working platform is installed in the rack, a material preparation assembly and a feeding cross beam are arranged on the upper side of the working platform, and the feeding cross beam is arranged on the lower side of the rack. A first die bonding assembly and a second die bonding assembly are arranged on the upper side of the feeding cross beam, and a placing platform is arranged on one side of the rack. According to the die bonder with the double-layer conveying function, when the die bonder ascends, the die bonder is convenient to convey, when the die bonder descends, the die bonder is adsorbed by the vacuum adsorption area, and the first wafer rack and the second wafer rack are arranged in opposite directions, so that double-layer conveying is realized, and meanwhile, the feeding distance and interval of the die bonder are improved and accurately controlled; according to the die bonder with the double-layer conveying function, the problems that an existing die bonder cannot accurately control the feeding distance and interval, and die bonding dislocation is prone to occurring during die bonding are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a crystal bonding machine with a double-layer conveying function. Background Art

[0002] A die bonder is a semiconductor packaging machine that fixes crystals. It can fix transistors and other components on the chip to the substrate. It is mainly used for lead frame press plates of various gold wire ultrasonic welding equipment, as well as various chip mounting equipment, spare parts, instruments, and meters of automation equipment. Depending on the fixed object, the die bonder can be divided into LED die bonders, IC die bonders, semiconductor die bonders, and discrete device die bonders.

[0003] The crystal bonding machine is composed of a frame, a control component, a working platform, a material preparation component, a feeding beam and a crystal bonding component. The control component is installed on one side of the frame for user operation, and the working platform is installed inside the frame for support. The material preparation component, the feeding beam and the crystal bonding component are installed on the upper side of the working platform for operation. However, the existing crystal bonding machine uses a motor to drive the screw and the pulley for feeding, and it is impossible to accurately control the feeding distance and interval. It is easy to cause crystal bonding dislocation during crystal bonding. For this reason, we propose a crystal bonding machine with a double-layer conveying function. Summary of the invention

[0004] The purpose of the utility model is to provide a crystal bonding machine with a double-layer conveying function to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a crystal bonding machine with double-layer conveying function, comprising a frame, a control component and a working platform,

[0006] A control component is installed on one side of the frame, a working platform is installed inside the frame, a material preparation component and a feeding beam are arranged on the upper side of the working platform, a first crystal bonding component and a second crystal bonding component are arranged on the upper side of the feeding beam, a placing platform is arranged on one side of the frame, a material placing frame is placed on the upper side of the placing platform, a feeding guide rail is installed on the upper side of the working platform through connecting bolts, and the upper side of the feeding guide rail is slidably connected with the first wafer rack and the second wafer rack;

[0007] A transmission assembly is installed on the upper side of the first wafer rack and the second wafer rack, a vacuum adsorption area is arranged on one side of the transmission assembly, and a crystal bonding plate is placed on the upper side of the transmission assembly.

[0008] Preferably, a first precision feeding mechanism is arranged on the outer side of the placement platform, and the first precision feeding mechanism is composed of a first electric rail, a second electric rail, an electric slide, a connecting plate and a feeding plate, and the first electric rail and the second electric rail are installed on the outer side of the frame.

[0009] Preferably, the first electric rail and the second electric rail are connected to a placement platform and a connecting plate respectively on one side close to the material placement frame through an electric slide, a feeding plate is provided at the bottom of the connecting plate, and a second precision feeding mechanism is provided on one side of the first wafer rack and the second wafer rack.

[0010] Preferably, the second precision feeding mechanism is composed of an adjusting motor, an adjusting guide rail and a transmission seat. A groove is opened on one side of the first wafer rack and the second wafer rack, and an adjusting motor is installed in the groove. The bottom of the adjusting motor is connected to the transmission seat through a coupling, and the outer side of the transmission seat is meshed with the tooth block on one side of the adjusting guide rail. The bottom of the adjusting guide rail is installed on the working platform through a locking bolt.

[0011] Preferably, a toothed belt drive assembly is installed on the upper side of the work platform, and the toothed belts inside the two groups of toothed belt drive assemblies are respectively connected to the first wafer rack and the second wafer rack on the adjacent side through a connecting frame.

[0012] Preferably, a connecting seat is connected to the bottom of the horizontal conveying component.

[0013] Preferably, a mounting frame is installed at the bottom of the connecting seat, and a lifting mechanism is arranged inside the mounting frame. The lifting mechanism includes a mounting plate connected to the mounting frame, a driving motor is installed on one side of the mounting plate, and a driving pulley and a transmission pulley are rotatably connected to the other side of the mounting plate. The bottoms of the two groups of mounting plates are respectively installed on the wafer racks on the adjacent sides.

[0014] Preferably, one end of the driving motor is connected to the driving pulley via a coupling, the outer sides of the driving pulley and the transmission pulley are meshed with the driving toothed belt, and the outer side of the driving toothed belt is connected to the mounting frame via a connecting block.

[0015] Preferably, sliding rails are symmetrically installed on both sides of the mounting plate, docking sliders are symmetrically installed inside the mounting frame, and the outer side of the sliding rails is slidably connected to the docking slider on the adjacent side.

[0016] Preferably, a servo motor is installed on one side of the mounting plate, a driving gear is installed on one end of the servo motor through an output shaft, the outer side of the driving gear is meshed with a rack, and the sides of the two racks away from each other are connected to the inner wall of the mounting frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the crystal bonding machine with a double-layer conveying function drives the transmission seat to rotate and gradually mesh with the adjusting guide rail on one side through the adjusting motor and the coupling at the bottom, driving the first wafer rack and the second wafer rack to move back and forth left and right along the adjusting guide rail and the feeding guide rail. When the first wafer rack and the second wafer rack are abutted, the transmission motor inside the transmission assembly is started to drive the gear and the rack to mesh, driving the crystal bonding plate on the upper side of the toothed belt to move to the side where the first wafer rack is located, completing the exchangeable conveying of the crystal bonding plate on the upper side of the first wafer rack and the second wafer rack. Starting the driving motor in the lifting mechanism can drive the crystal bonding plate to rise and fall on the first wafer rack and the second wafer rack. When the crystal bonding plate rises, it is convenient to convey the crystal bonding plate. When the crystal bonding plate descends, it is adsorbed by the vacuum adsorption area. The reverse setting of the first wafer rack and the second wafer rack realizes double-layer conveying while improving the crystal bonding machine's precise control of the feeding distance and interval, solving the problem that the existing crystal bonding machine cannot precisely control the feeding distance and interval, and the crystal bonding dislocation is easy to occur during crystal bonding.

[0018] 1. In order to more accurately control the moving distance of the first wafer rack and the second wafer rack, during the feeding operation, the staff sends a command to the control box inside the rack through the control component to control the start of the adjustment motor installed in the groove on one side of the first wafer rack and the second wafer rack, and drives the transmission seat to rotate and gradually engage with the adjustment guide rail on one side through the adjustment motor and the coupling at the bottom, and improves the transmission accuracy through the meshing action of the transmission seat and the gear block on one side of the adjustment guide rail, thereby realizing the precise motion control of the first wafer rack and the second wafer rack, thereby driving the first wafer rack and the second wafer rack to move along the adjustment guide rail and the feeding guide rail;

[0019] At the same time, the transmission assembly is started to start the transmission motor inside the transmission assembly to drive the gear and the rack to mesh, thereby driving the solid crystal plate on the upper side of the toothed belt to move toward the side where the first wafer rack is located. After the solid crystal plate moves to the toothed belt on the upper side of the first wafer rack, the transmission motor inside the first wafer rack will use the same transmission method as the second wafer rack to drive the solid crystal plate to the vacuum adsorption area at one end. The transmission assembly can drive the solid crystal plate to reciprocate on the upper side of the first wafer rack and the second wafer rack. The first wafer rack and the second wafer rack can reciprocate along the feeding guide rail at the bottom under the action of the adjusting guide rail, thereby realizing the interchangeable design of the solid crystal plate on the upper side of the first wafer rack and the second wafer rack. The solid crystal machine with double-layer conveying function is provided with a first precise feeding mechanism and a second precise feeding mechanism, which can quickly complete the precise conveying of the printed circuit board and improve the solid crystal efficiency.

[0020] 2. In order to improve the flexibility of the crystal bonder when using the double-layer conveying function, when the first wafer rack and the second wafer rack are in use, the driving motor installed on one side of the mounting plate is started to rotate forward, and the driving motor drives the driving pulley connected thereto to rotate through the coupling. During the rotation of the driving pulley, the driving toothed belt on the outer side is meshed to drive the driving toothed belt and the transmission pulley to rotate. During the rotation of the driving toothed belt, the mounting frame and the connecting seat connected thereto through the connecting block are driven to move upward, thereby driving the transmission assembly and the crystal bonder placed on the upper side of the transmission assembly to rise;

[0021] At the same time, starting the driving motor in reverse can drive the transmission component and the crystal bonding plate placed on the upper side of the transmission component to descend. When rising, it is away from the vacuum adsorption area, which is convenient for the rapid transmission of the crystal bonding plate. When descending, it is the reverse design of the first wafer rack and the second wafer rack. At this time, the crystal bonding plate is stably adsorbed by the vacuum adsorption area, which is convenient for subsequent crystal bonding work. The crystal bonding machine with double-layer conveying function has the reverse setting of the first wafer rack and the second wafer rack, which realizes double-layer conveying and improves the crystal bonding machine's precise control of the feeding distance and interval. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the first three-dimensional structure of the crystal bonding machine of the utility model;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the working platform of the utility model;

[0024] Figure 3 This is a schematic diagram of the first three-dimensional structure of the precision feeding mechanism of the utility model;

[0025] Figure 4 This is a schematic diagram of the second three-dimensional structure of the precision feeding mechanism of the utility model;

[0026] Figure 5 This is a schematic diagram of the three-dimensional structure of the connecting seat of the utility model when viewed from above;

[0027] Figure 6 This is a three-dimensional structural diagram of the lifting mechanism of the utility model;

[0028] Figure 7 This is a schematic diagram of the three-dimensional structure of the toothed belt drive assembly of the utility model from top view;

[0029] Figure 8 It is a schematic diagram of the three-dimensional structure of the rack rail of the utility model when viewed from above.

[0030] In the figure: 1, rack; 101, control component; 2, working platform; 201, material preparation component; 3, feeding beam; 301, first solid crystal component; 302, second solid crystal component; 4, placing platform; 401, material placement frame; 5, first wafer rack; 501, feeding guide rail; 502, second wafer rack; 502d, transmission component; 502e, vacuum adsorption area; 502f, solid crystal plate; 6, first precise feeding mechanism; 601, first electric guide rail; 602, second electric guide rail; 603, electric slide; 604, connecting plate; 605, feeding plate; 7, second precision feeding mechanism; 701, adjusting motor; 702, adjusting guide rail; 703, transmission seat; 704, toothed belt drive assembly; 705, connecting frame; 8, connecting seat; 801, mounting frame; 9, lifting mechanism; 901, mounting plate; 902, driving motor; 903, driving pulley; 904, driving pulley; 905, driving toothed belt; 905a, connecting block; 906, sliding track; 906c, docking slider; 907, rack rail; 908, driving gear; 909, servo motor. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Embodiment 1:

[0033] See also Figure 1-Figure 4 The utility model provides a technical solution: a crystal bonding machine with a double-layer conveying function, comprising a frame 1, a control component 101 and a working platform 2.

[0034] A control component 101 is installed on one side of the frame 1, a working platform 2 is installed inside the frame 1, a material preparation component 201 and a feeding beam 3 are arranged on the upper side of the working platform 2, a first crystal bonding component 301 and a second crystal bonding component 302 are arranged on the upper side of the feeding beam 3, a placement platform 4 is arranged on one side of the frame 1, a material placement frame 401 is placed on the upper side of the placement platform 4, a feeding guide rail 501 is installed on the upper side of the working platform 2 through connecting bolts, and the upper side of the feeding guide rail 501 is slidably connected with the first wafer rack 5 and the second wafer rack 502;

[0035] A transmission assembly 502d is installed on the upper side of the first wafer rack 5 and the second wafer rack 502, a vacuum adsorption area 502e is provided on one side of the transmission assembly 502d, and a crystal bonding plate 502f is placed on the upper side of the transmission assembly 502d.

[0036] The outside of the placing platform 4 is provided with a first precision feeding mechanism 6, which is composed of a first electric rail 601, a second electric rail 602, an electric slide 603, a connecting plate 604 and a feeding plate 605. The outside of the frame 1 is provided with a first electric rail 601 and a second electric rail 602, and the first electric rail 601 and the second electric rail 602 are respectively connected to the placing platform 4 and the connecting plate 604 through the electric slide 603 on one side close to the material placing frame 401, and a feeding plate 605 is provided at the bottom of the connecting plate 604, and a second precision feeding mechanism 7 is provided on one side of the first wafer rack 5 and the second wafer rack 502;

[0037] The second precision feeding mechanism 7 is composed of an adjusting motor 701, an adjusting guide rail 702 and a transmission seat 703. A groove is opened on one side of the first wafer rack 5 and the second wafer rack 502, and the adjusting motor 701 is installed in the groove. The bottom of the adjusting motor 701 is connected to the transmission seat 703 through a coupling. The outer side of the transmission seat 703 is meshed with the tooth block on one side of the adjusting guide rail 702. The bottom of the adjusting guide rail 702 is installed with the working platform 2 through a locking bolt.

[0038] In specific implementation, in order to more accurately control the moving distance of the first wafer rack 5 and the second wafer rack 502, during the feeding operation, the staff sends a command to the control box inside the rack 1 through the control component 101 to control the start of the adjustment motor 701 installed in the groove on one side of the first wafer rack 5 and the second wafer rack 502, and drives the transmission seat 703 to rotate and gradually engage with the adjustment guide rail 702 on one side through the adjustment motor 701 and the coupling at the bottom, and improves the transmission accuracy through the meshing action of the transmission seat 703 and the tooth block on one side of the adjustment guide rail 702, thereby realizing the precise motion control of the first wafer rack 5 and the second wafer rack 502, thereby driving the first wafer rack 5 and the second wafer rack 502 to move back and forth left and right along the adjustment guide rail 702 and the feeding guide rail 501;

[0039] At the same time, a transmission assembly 502d is installed on the upper side of the first wafer rack 502 and the second wafer rack 502. When the crystal bonding plate 502f on the upper side of the second wafer rack 502 completes the crystal bonding work, the adjustment motor 701 and the coupling at the bottom drive the transmission seat 703 to rotate and gradually engage with the adjustment guide rail 702 on one side to move the second wafer rack 502 to abut against the first wafer rack 5. At this time, the transmission motor inside the transmission assembly 502d is started to drive the gear and the rack to engage, thereby driving the crystal bonding plate 502f on the upper side of the toothed belt to the first wafer rack 502. The first wafer rack 502 moves to the side where the crystal bonding plate 502f is located until the crystal bonding plate 502f moves to the toothed belt on the upper side of the first wafer rack 5, and the transmission motor inside the first wafer rack 5 will use the same transmission method as the second wafer rack 502 to transmit the crystal bonding plate 502f to the vacuum adsorption area 502e at one end to complete the exchange of the crystal bonding plate 502f. At this time, the vacuum adsorption area 502e performs vacuum adsorption, so that the crystal bonding plate 502f is stably adsorbed, which is convenient for the subsequent crystal bonding work. At the same time, the combination of gears and racks is more suitable for the needs of multiple stations.

[0040] Among them, in order to ensure that the printed circuit boards can be loaded in a timely and accurate manner, the first electric guide rail 601 and the second electric guide rail 602 are respectively installed on both sides of the placement platform 4 and the placement frame 401. The first electric guide rail 601 can drive the placement platform 4 and the placement frame 401 to move up and down through the internal electric slide 603. The second electric guide rail 602 cooperates with the connecting plate 604 and the feeding plate 605 through the internal electric slide 603 to push the printed circuit board at this height from the placement frame 401 to the upper side of the second wafer rack 502. The feeding guide rails 501 installed at the bottom of the first wafer rack 5 and the second wafer rack 502 are used to provide sliding support. The crystal bonding machine with a double-layer conveying function is provided with a first precise feeding mechanism 6 and a second precise feeding mechanism 7, which can quickly complete the precise conveying of the printed circuit board and improve the crystal bonding efficiency.

[0041] Embodiment 2:

[0042] See also Figure 7 It can be seen that a toothed belt drive assembly 704 is installed on the upper side of the working platform 2, and the toothed belts inside the two sets of toothed belt drive assemblies 704 are respectively connected to the first wafer rack 5 and the second wafer rack 502 on the adjacent side through the connecting frame 705;

[0043] A transmission assembly 502d is installed on the upper side of the first wafer rack 5 and the second wafer rack 502, a vacuum adsorption area 502e is provided on one side of the transmission assembly 502d, and a crystal bonding plate 502f is placed on the upper side of the transmission assembly 502d.

[0044] In the specific implementation, during the feeding operation, the staff sends a command to the control box inside the rack 1 through the control component 101 to control the start of the toothed belt drive component 704. At this time, the toothed belt inside the toothed belt drive component 704 starts to rotate, thereby driving the first wafer rack 5 and the second wafer rack 502 respectively connected to the two toothed belts to move back and forth along the feeding guide rail 501;

[0045] When the crystal bonding plate 502f on the upper side of the second wafer rack 502 completes the crystal bonding work, the toothed belt drive assembly 704 at the bottom of the second wafer rack 502 is started, and after the second wafer rack 502 is moved to a position abutting against the first wafer rack 5, the transmission assembly 502d is started to drive the crystal bonding plate 502f on the upper side of the toothed belt to move toward the side where the first wafer rack 5 is located, until the crystal bonding plate 502f moves to the toothed belt on the upper side of the first wafer rack 5, the transmission motor inside the first wafer rack 5 will use the same transmission method as the second wafer rack 502 to drive the crystal bonding plate 502f to the vacuum adsorption area 502e at one end, completing the exchange of the crystal bonding plate 502f.

[0046] Embodiment 3:

[0047] See also Figure 5 and Figure 6 It can be seen that the bottom of the transmission assembly 502d is connected to a connection seat 8, the bottom of the connection seat 8 is installed with a mounting frame 801, the inside of the mounting frame 801 is provided with a lifting mechanism 9, the lifting mechanism 9 includes a mounting plate 901 connected to the mounting frame 801, one side of the mounting plate 901 is installed with a driving motor 902, the other side of the mounting plate 901 is rotatably connected with a driving pulley 903 and a transmission pulley 904, and the bottoms of the two groups of mounting plates 901 are respectively installed with the wafer racks on the adjacent sides;

[0048] One end of the driving motor 902 is connected to the driving pulley 903 through a coupling, the outer sides of the driving pulley 903 and the transmission pulley 904 are meshed with the driving toothed belt 905, the outer side of the driving toothed belt 905 is connected to the mounting frame 801 through a connecting block 905a, sliding rails 906 are symmetrically installed on both sides of the mounting plate 901, and docking sliders 906c are symmetrically installed inside the mounting frame 801, and the outer side of the sliding rail 906 is slidably connected to the docking slider 906c on the adjacent side.

[0049] In a specific implementation, in order to improve the flexibility of the crystal bonding machine when in use, when the first wafer rack 5 and the second wafer rack 502 are in use, the drive motor 902 installed on one side of the mounting plate 901 is started to rotate forward, and the drive motor 902 drives the drive pulley 903 connected thereto to rotate through the coupling. During the rotation of the drive pulley 903, it engages with the outer drive toothed belt 905, driving the drive toothed belt 905 and the transmission pulley 904 to rotate. During the rotation of the drive toothed belt 905, the mounting frame 801 and the connecting seat 8 connected thereto through the connecting block 905a are driven to move upward, thereby driving the transmission assembly 502. d and the crystal fixing plate 502f placed on the upper side of the transmission component 502d rise. At the same time, starting the driving motor 902 in reverse can drive the transmission component 502d and the crystal fixing plate 503 placed on the upper side of the transmission component 502d to descend, and the lifting and lowering operation can be smoothly realized. The sliding rails 906 on both sides of the mounting plate 901 are slidably docked with the sliding blocks 906c inside the mounting frame 801, which are used to improve the stability of the connecting seat 8 and the mounting frame 801 during lifting and lowering. The crystal fixing machine with a double-layer conveying function is provided with a lifting mechanism 9, which can effectively improve the flexibility of the first wafer rack 5 and the second wafer rack 502 when in use.

[0050] Embodiment 4:

[0051] See also Figure 8 It can be seen that a servo motor 909 is installed on one side of the mounting plate 901, and a driving gear 908 is installed on one end of the servo motor 909 through an output shaft. The outer side of the driving gear 908 is meshed with a rack 907, and the two sides of the racks 907 that are away from each other are connected to the inner wall of the mounting frame 801.

[0052] During specific implementation, during the height adjustment process, the servo motor 909 installed on one side of the mounting plate 901 is started to rotate forward, and the servo motor 909 drives the driving gear 908 connected thereto to rotate through the output shaft. During the rotation of the driving gear 908, it engages with the outer rack 907, driving the mounting frame 801 and the connecting seat 8 connected thereto to move upward, thereby driving the transmission component 502d and the crystal bonding plate 502f placed on the upper side of the transmission component 502d to rise. At the same time, starting the servo motor 909 in the reverse direction can drive the transmission component 502d and the crystal bonding plate 502f placed on the upper side of the transmission component 502d to descend.

[0053] In summary, when using the die bonding machine with double-layer conveying function, first place the material frame 401 on the upper side of the placing platform 4, and send a command through the control component 101 to start the first electric rail 601 and the second electric rail 602 to cooperate with each other to push the printed circuit board to the upper side of the second wafer rack 502. At this time, the adjustment motor 701 on one side of the second wafer rack 502 drives the transmission seat 703 and the adjustment rail 702 to transport the printed circuit board to the die bonding location along the feeding rail 501. The first die bonding component 301 and the second die bonding component 302 obtain materials from the material preparation component 201 and transport them to the die bonding location through the feeding beam 3 for die bonding.

[0054] When the crystal bonding plate 502f on the upper side of the second wafer rack 502 completes the corresponding operation, the adjusting motor 701 and the coupling at the bottom drive the transmission seat 703 to rotate and gradually engage with the adjusting guide rail 702 on one side to move the second wafer rack 502 to abut against the first wafer rack 5, and the transmission motor inside the transmission assembly 502d is started to drive the gear and the rack to engage, thereby driving the crystal bonding plate 502f on the upper side of the second wafer rack 502 to move toward the first wafer rack 5, completing the transportation of the crystal bonding plate 502f, and the transported crystal bonding plate 502f contacts the vacuum adsorption area 502e, and the vacuum adsorption area 502e adsorbs it;

[0055] The drive motor 902 installed on one side of the start-up mounting plate 901 is started to rotate forward, and the drive motor 902 drives the drive pulley 903 connected thereto to rotate through the coupling. During the rotation of the drive pulley 903, it engages with the drive toothed belt 905 on the outside, driving the drive toothed belt 905 and the transmission pulley 904 to rotate. During the rotation of the drive toothed belt 905, it drives the mounting frame 801 and the connecting seat 8 connected thereto through the connecting block 905a to move upward, thereby driving the transmission component 502d and the solid crystal plate 503 placed on the upper side of the transmission component 502d to rise. At this time, the solid crystal plate 502f is away from the vacuum adsorption area 502e on one side of the transmission component 502d, and the adsorption effect of the vacuum adsorption area 502e on the solid crystal plate 502f is reduced, which facilitates the exchange and transportation of the solid crystal plate 502f. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0056] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A crystal bonding machine with a double-layer conveying function, comprising a frame (1), a control component (101) and a working platform (2), characterized in that: A control component (101) is installed on one side of the frame (1); a working platform (2) is installed inside the frame (1); a material preparation component (201) and a feeding beam (3) are arranged on the upper side of the working platform (2); a first crystal bonding component (301) and a second crystal bonding component (302) are arranged on the upper side of the feeding beam (3); a placement platform (4) is arranged on one side of the frame (1); a material placement frame (401) is placed on the upper side of the placement platform (4); a feeding guide rail (501) is installed on the upper side of the working platform (2) via connecting bolts; the upper side of the feeding guide rail (501) is slidably connected to the first wafer rack (5) and the second wafer rack (502); A transmission assembly (502d) is installed on the upper side of the first wafer rack (5) and the second wafer rack (502), a vacuum adsorption area (502e) is arranged on one side of the transmission assembly (502d), and a crystal fixing plate (502f) is placed on the upper side of the transmission assembly (502d).

2. The die bonding machine with double-layer conveying function according to claim 1, characterized in that: A first precise feeding mechanism (6) is arranged on the outside of the placing platform (4), and the first precise feeding mechanism (6) is composed of a first electric guide rail (601), a second electric guide rail (602), an electric slide seat (603), a connecting plate (604) and a feeding plate (605), and the first electric guide rail (601) and the second electric guide rail (602) are installed on the outside of the frame (1).

3. The die bonding machine with double-layer conveying function according to claim 2, characterized in that: The first electric guide rail (601) and the second electric guide rail (602) are connected to a placement platform (4) and a connecting plate (604) respectively on one side close to the material placement frame (401) via an electric slide seat (603); a feeding plate (605) is provided at the bottom of the connecting plate (604); and a second precise feeding mechanism (7) is provided on one side of the first wafer rack (5) and the second wafer rack (502).

4. The die bonding machine with double-layer conveying function according to claim 3, characterized in that: The second precision feeding mechanism (7) is composed of an adjusting motor (701), an adjusting guide rail (702) and a transmission seat (703); a groove is provided on one side of the first wafer rack (5) and the second wafer rack (502), and the adjusting motor (701) is installed in the groove; the bottom of the adjusting motor (701) is connected to the transmission seat (703) via a coupling; the outer side of the transmission seat (703) is meshed with a tooth block on one side of the adjusting guide rail (702); the bottom of the adjusting guide rail (702) is installed with the working platform (2) via a locking bolt.

5. The die bonding machine with double-layer conveying function according to claim 4, characterized in that: A toothed belt drive assembly (704) is installed on the upper side of the working platform (2), and the toothed belts inside the two groups of toothed belt drive assemblies (704) are respectively connected to the first wafer rack (5) and the second wafer rack (502) on the adjacent side through a connecting frame (705).

6. The die bonding machine with double-layer conveying function according to claim 5, characterized in that: The bottom of the transmission assembly (502d) is connected to a connecting seat (8).

7. The die bonding machine with double-layer conveying function according to claim 6, characterized in that: A mounting frame (801) is installed at the bottom of the connecting seat (8), and a lifting mechanism (9) is arranged inside the mounting frame (801). The lifting mechanism (9) includes a mounting plate (901) connected to the mounting frame (801), a driving motor (902) is installed on one side of the mounting plate (901), and a driving pulley (903) and a transmission pulley (904) are rotatably connected on the other side of the mounting plate (901), and the bottoms of the two groups of mounting plates (901) are respectively installed on the wafer racks on the adjacent sides.

8. The die bonding machine with double-layer conveying function according to claim 7, characterized in that: One end of the driving motor (902) is connected to the driving pulley (903) via a coupling, the outer sides of the driving pulley (903) and the transmission pulley (904) are meshed with the driving toothed belt (905), and the outer side of the driving toothed belt (905) is connected to the mounting frame (801) via a connecting block (905a).

9. The die bonding machine with double-layer conveying function according to claim 8, characterized in that: Sliding rails (906) are symmetrically installed on both sides of the installation plate (901), docking sliders (906c) are symmetrically installed inside the installation frame (801), and the outer side of the sliding rail (906) is slidably connected to the docking slider (906c) on the adjacent side.

10. The die bonding machine with double-layer conveying function according to claim 9, characterized in that: A servo motor (909) is installed on one side of the mounting plate (901), and a driving gear (908) is installed on one end of the servo motor (909) via an output shaft. The outer side of the driving gear (908) is meshed with a rack (907), and the two racks (907) are connected to the inner wall of the mounting frame (801) at the sides away from each other.

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