Display panel, preparation method thereof and display equipment

Abstract

The invention provides a display panel, a preparation method thereof and display equipment. The display panel comprises a substrate, a pixel unit, a protection structure and a light absorption structure, wherein the pixel unit, the protection structure and the light absorption structure are arranged on the same side of the substrate; the light absorption structure is arranged on the outer side of the protection structure, and the surface of the side, away from the substrate, of the light absorption structure is not higher than the surface of the side, away from the substrate, of the protection structure. According to the display panel, the risk that the light absorption structure extends to the surface of the pixel unit can be effectively reduced or even avoided through the protection structure, the light emitting effect of the pixel unit is improved, and the occurrence probability of the dark spot problem is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a preparation method thereof, and a display device. Background Art

[0002] Micro-LED display technology has the advantages of high brightness, high response speed, low power consumption, and long life, and has become a research hotspot in the pursuit of a new generation of display technology. At present, in order to improve the contrast of Micro-LED display panels and reduce reflectivity, black glue (BM) is usually set on the display panel to absorb ambient light to reduce reflectivity. However, existing display panels are prone to dark spot problems. Summary of the invention

[0003] The display panel and its preparation method, and the display device provided in the present application are intended to solve the problem that dark spots are prone to appear in existing display panels.

[0004] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a display panel, which includes: a base substrate and a pixel unit, a protective structure and a light absorption structure arranged on the same side of the base substrate; the light absorption structure is arranged on the outside of the protective structure, and the surface of the light absorption structure facing away from the base substrate is not higher than the surface of the protective structure facing away from the base substrate.

[0005] In one embodiment, a polarity difference between the light absorption structure and the protection structure is greater than a polarity difference between the light absorption structure and the pixel unit.

[0006] In one embodiment, the protection structure is disposed on a surface of the pixel unit facing away from the base substrate, and the orthographic projection of the pixel unit on the base substrate is located within the orthographic projection of the protection structure on the base substrate; and the protection structure is a transparent structure;

[0007] Preferably, the area of ​​a side surface of the protection structure facing the pixel unit is not less than the area of ​​a side surface of the pixel unit facing the protection structure;

[0008] Preferably, the protection structure is an optical structure.

[0009] In one embodiment, the width of the vertical cross section of the protection structure gradually decreases along the direction in which the protection structure approaches the pixel unit;

[0010] Preferably, the protection structure is an inverted trapezoidal structure.

[0011] In one embodiment, it further includes:

[0012] A dielectric layer is provided on one side surface of the substrate; the pixel unit is embedded in the dielectric layer, and the side surface of the pixel unit facing away from the substrate exposes the dielectric layer; the light absorption structure is provided on the side surface of the dielectric layer facing away from the substrate;

[0013] Preferably, a surface of the pixel unit facing away from the substrate is flush with a surface of the dielectric layer facing away from the substrate;

[0014] Preferably, the medium layer is a transparent medium layer.

[0015] In one embodiment, the refractive index of the protection structure is greater than the refractive index of the light absorbing structure.

[0016] In one embodiment, the protection structure is in a closed loop shape and is arranged around the periphery of the pixel unit; and a surface of the protection structure facing away from the substrate is higher than a surface of the pixel unit facing away from the substrate;

[0017] Preferably, the protection structure and the light absorption structure are arranged on a surface of the substrate facing the pixel unit, and the light absorption structure is located on a side of the protection structure facing away from the pixel unit;

[0018] Preferably, the light absorbing structure is in contact with the protective structure;

[0019] Preferably, the protective structure is a white structure.

[0020] In one embodiment, the pixel unit includes a red pixel unit, a green pixel unit and a blue pixel unit, and one red pixel unit, one green pixel unit and one blue pixel unit constitute a light-emitting unit; the two protective structures corresponding to two adjacent pixel units in the same light-emitting unit share a side wall.

[0021] In order to solve the above technical problem, another technical solution adopted by the present application is: to provide a display device, which includes the display panel involved above.

[0022] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a method for preparing a display panel, the method comprising: providing a base substrate, on which a pixel unit is arranged; arranging a transparent material on a side of the base substrate facing the pixel unit, and processing the transparent material to form a protective structure; forming a light absorption structure on the outer side of the protective structure; a surface of the light absorption structure on a side away from the base substrate is not higher than a surface of the protective structure on a side away from the base substrate;

[0023] Preferably, the polarity difference between the light absorption structure and the protection structure is greater than the polarity difference between the light absorption structure and the pixel unit;

[0024] Preferably, a dielectric layer is further provided on the surface of the base substrate, the pixel unit is embedded in the dielectric layer, and the dielectric layer is exposed on a surface of the pixel unit on a side away from the base substrate;

[0025] Preferably, the step of disposing a transparent material on a side of the base substrate facing the pixel unit and processing the transparent material to form a protective structure includes:

[0026] A transparent material is disposed on a surface of the dielectric layer on a side away from the substrate, and a photo-etching process is performed on the transparent material to form a protective structure on a surface of the pixel unit on a side away from the substrate.

[0027] The beneficial effects of the embodiments of the present application are different from those of the prior art: the display panel provided by the embodiments of the present application includes a substrate and a pixel unit, a protective structure and a light absorption structure arranged on the same side of the substrate; the light absorption structure is arranged on the outside of the protective structure, and the surface of the light absorption structure on the side away from the substrate is not higher than the surface of the protective structure on the side away from the substrate. In this way, in the process of preparing the light absorption structure, the protective structure can be used to block the light absorption structure from being siphoned to the side where the light emitting surface of the pixel unit is located, effectively avoiding the risk of the final light absorption structure extending to the side where the light emitting surface of the pixel unit is located, avoiding the light absorption structure from affecting the light emitting of the pixel unit, improving the light emitting effect of the pixel unit, and reducing the probability of the occurrence of the dark spot problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the present application;

[0029] Figure 2 is a schematic structural diagram of a display panel provided by another embodiment of the present application;

[0030] Figure 3 for Figure 2 A top view of the display panel shown;

[0031] Figure 4 A top view of a display panel provided in another embodiment of the present application;

[0032] Figure 5 A flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0033] Figure 6 to Figure 7 for Figure 5 A structural schematic diagram corresponding to a specific process of a method for manufacturing a display panel shown;

[0034] Figure 8 A schematic diagram of the structure of a pixel unit and a substrate provided in another embodiment of the present application;

[0035] Fig. 9 For Figure 8 A schematic diagram of a structure in which a protective structure is formed on the structure shown;

[0036] Fig.10 A simplified structural diagram of an electronic device provided in one embodiment of the present application.

[0037] Description of Reference Numerals

[0038] 10a / 10b-display panel; 1-substrate; 2-pixel unit; 3-protection structure; 4-light absorption structure; 5-dielectric layer; 6-conductive member. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0041] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0042] In the preparation process of Micro-LED display panels, packaging is the key technology to achieve high-quality Micro-LED screen processing. Packaging refers to the protection and optical treatment of the transferred screen. Among them, optical treatment can improve the brightness of the front light of the LED on the one hand, and improve the contrast of the screen and reduce the reflectivity on the other hand.

[0043] In the related technology, micro-lenses (Micro-Lens), high-low fold structure multiplexing and other methods are usually used to improve the brightness of the front light output of the LED. By setting a black glue material (BM) on the screen, the BM is used to absorb ambient light to reduce the reflectivity. Among them, there are two BM solutions based on Micro-LED display panels, the first is the inkjet printing (IJP) solution, and the second is the photolithography solution. The IJP solution is to spray BM liquid material between the pixel units of the LED, and then spread the BM liquid material over the entire panel through self-leveling. However, since the thickness of the pixel unit on the Micro-LED display panel is less than 10um, the BM liquid material is easily siphoned to the surface of the pixel unit, resulting in the light emitted by the pixel unit. It is difficult to penetrate the black BM glue, which leads to dark spots.

[0044] The photolithography scheme can effectively avoid the dark spot phenomenon, but on the display panel side, the photolithography equipment required for display panels of different sizes is different, which makes the selection of photolithography equipment difficult, and the processing efficiency is slow, and the cost becomes a bottleneck.

[0045] Based on this, the embodiments of the present application provide a display panel and a preparation method thereof, and a display device. By setting a protective structure, the polarity difference between the light absorbing structure and the protective structure is greater than the polarity difference between the light absorbing structure and the pixel unit, thereby reducing the risk of the siphon effect of the IJP process and the probability of the occurrence of dark spot problems, and improving the light output effect of the pixel unit.

[0046] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0047] See also Figure 1 , Figure 11 is a schematic diagram of the structure of a display panel 10a / 10b provided in an embodiment of the present application; in this embodiment, a display panel 10a is provided, and the display panel 10a may be a Micro-LED display screen. The display panel 10a includes a base substrate 1 and a pixel unit 2 (LED) disposed on the same side of the base substrate 1, a protection structure 3, and a light absorption structure 4.

[0048] Among them, the substrate 1 can be a printed circuit board (PCB) PCB backplane, a low temperature polycrystalline silicon (LTPS) backplane, a complementary metal oxide semiconductor (CMOS) backplane, an indium gallium zinc oxide (IGZO) backplane, etc., which is used to drive the pixel unit 2 to emit light.

[0049] The pixel unit 2 includes a red pixel unit (R-LED), a green pixel unit (G-LED) and a blue pixel unit (B-LED) for emitting light. Among them, the R-LED is a GaAs-based LED or a gallium nitride-based LED, and the G-LED and B-LED are gallium nitride-based LEDs. In a specific embodiment, the pixel unit 2 is electrically connected to the substrate 1 through a conductive member 6. The material of the conductive member 6 includes metals or alloys such as indium (In), tin (Sn), and gold (Au). The conductive member 6 can be a layer of metal or a multilayer of metal; the conductive member 6 can be consistent with the electrode of the pixel unit 2, or different, or it can be a conductive particle in anisotropic conductive film (ACF) material.

[0050] The light absorbing structure 4 is made of a light absorbing material with a low refractive index, such as a black plastic material, and is used to block external light from being incident on the base substrate 1, and can also block the reflected light formed on the base substrate 1 to prevent it from emitting outward. The material of the light absorbing structure 4 may include chromium (Cr) metal / acrylic resin and black pigment.

[0051] The protection structure 3 is used to prevent the light absorbing material used to form the light absorbing structure 4 from overflowing to the side surface of the pixel unit 2 away from the substrate 1 (hereinafter referred to as the light emitting surface) during the preparation of the light absorbing structure 4, thereby affecting the light emission of the pixel unit 2 and avoiding the formation of dark spots. Among them, one protection structure 3 corresponds to one pixel unit 2, for example, one red pixel unit 2 corresponds to one protection structure 3; one green pixel unit 2 corresponds to another protection structure 3, and the two protection structures 3 are independent of each other and are arranged at intervals. For the convenience of explanation, the following embodiments are all described by taking one pixel unit 2 corresponding to one protection structure 3 as an example.

[0052] Specifically, the light absorption structure 4 is arranged on the outside of the protective structure 3, and relative to the plane where the surface of the side of the substrate 1 facing the pixel unit 2 is located, the surface of the side of the light absorption structure 4 facing away from the substrate 1 is not higher than the surface of the side of the protective structure 3 facing away from the substrate 1. The outside of the protective structure 3 refers to the outside of the protective structure 3 along its circumferential direction. In this way, in the process of preparing the light absorption structure 4, the protective structure 3 can be used to block the light absorption structure 4 from being siphoned to the side where the light emitting surface of the pixel unit 2 is located. Compared with the pixel unit 2, the light absorption structure 4 is more difficult to be siphoned to the surface of the protective structure 3, so that the protective structure 3 can be used to effectively reduce or even avoid the risk of the light absorption material forming the light absorption structure 4 overflowing to the light emitting surface of the pixel unit 2, that is, reduce or even avoid the risk of the light absorption structure 4 extending to the light emitting surface of the pixel unit 2, effectively improve the light emitting effect of the pixel unit 2, and reduce the probability of the occurrence of the dark spot problem.

[0053] Furthermore, the polarity difference between the light absorbing structure 4 and the protective structure 3 is greater than the polarity difference between the light absorbing structure 4 and the pixel unit 2. Among them, the extremely large polarity difference can improve the contrast of the display panel 10a, and can reduce the siphon effect, that is, reduce the risk of the light absorbing material flowing toward the protective structure 3. Among them, the polarity of the substance can be specifically determined according to the dielectric constant of the substance. The polarity of the polymer material can be determined. Generally, a substance with a relative dielectric constant greater than 3.6 is a polar substance; a substance with a relative dielectric constant in the range of 2.8 to 3.6 is a weakly polar substance; and a substance with a relative dielectric constant less than 2.8 is a non-polar substance. Among them, one of the light absorbing structure 4 and the protective structure 3 can be a polar substance, and the other can be a weakly polar substance; one of the light absorbing structure 4 and the pixel unit 2 can be a polar substance, and the other can be a weakly polar substance. The present application does not limit the specific polarity of the light absorbing structure 4, the protective structure 3 and the pixel unit 2, as long as the polarity difference between the light absorbing structure 4 and the protective structure 3 is greater than the polarity difference between the light absorbing structure 4 and the pixel unit 2. The material of the protection structure 3 may specifically be epoxy resin, acrylate or silicone, etc.

[0054] It can be understood that if the protection structure 3 and the light absorption structure 4 are arranged in the same layer, the surface of the light absorption structure 4 facing away from the substrate 1 is not higher than the surface of the protection structure 3 facing away from the substrate 1, which is substantially equivalent to the thickness of the light absorption structure 4 being less than or equal to the thickness of the protection structure 3; wherein the thickness refers to the dimension along the substrate 1 toward the pixel unit 2. The thickness of the protection structure 3 can be selected and set according to actual needs, as long as the thickness of the formed light absorption structure 4 does not exceed the thickness of the protection structure 3.

[0055] Please continue reading Figure 1 In one embodiment, the protective structure 3 of the display panel 10a is disposed on a side surface of the pixel unit 2 facing away from the base substrate 1, and the orthographic projection of the pixel unit 2 on the base substrate 1 is located within the orthographic projection of the protective structure 3 on the base substrate 1. Specifically, along the stacking direction of the display panel 10a, the bottom surface of the protective structure 3 completely covers the top surface of the pixel unit 2, that is, the area of ​​the side surface of the protective structure 3 facing the pixel unit 2 is not less than the area of ​​the side surface of the pixel unit 2 facing the protective structure 3 (i.e., the light emitting surface of the pixel unit 2), so as to protect the entire light emitting surface of the pixel unit 2 and ensure that the light absorption structure 4 does not extend to the light emitting surface of the pixel unit 2. In a specific embodiment, the area of ​​the side surface of the protective structure 3 facing the pixel unit 2 is greater than the area of ​​the side surface of the pixel unit 2 facing the protective structure 3 (i.e., the light emitting surface of the pixel unit 2).

[0056] The protective structure 3 is specifically a transparent structure; to prevent the protective structure 3 from affecting the light emitting effect of the pixel unit 2. The light absorption structure 4 is arranged around the periphery of the protective structure 3 and contacts the outer wall surface of the side wall of the protective structure 3. Specifically, the protective structure 3 can be an optical structure, such as a convex lens structure. The light absorption structure 4 can be arranged in the same layer as the protective structure 3.

[0057] In the above scheme, since the positive projection of the protection structure 3 completely covers the pixel unit 2, and the polarity difference between the light absorbing structure 4 and the protection structure 3 is greater than the polarity difference between the light absorbing structure 4 and the pixel unit 2, in the process of preparing the light absorbing structure 4 arranged in the same layer as the protection structure 3, the light absorbing material is difficult to overflow or even will not overflow to the light emitting surface of the pixel unit 2, and the formed light absorbing structure 4 does not extend to the light emitting surface of the pixel unit 2, so that the light absorbing structure 4 will not affect the light emitting efficiency of the pixel unit 2, reducing the risk of dark spots. At the same time, the transparent protection structure 3 will not affect the light emitting effect of the pixel unit 2.

[0058] In this embodiment, the refractive index of the protective structure 3 is greater than the refractive index of the light absorbing structure 4; thus, the light emitting ratio of the light emitting surface of the pixel unit 2 can be increased, and the siphon effect of the light absorbing structure 4 on the protective structure 3 can be reduced. The material of the protective structure 3 may include an organic transparent glue containing organic functional groups such as phenyl, biphenyl, naphthyl, fluorenyl, carbazole, furanyl, etc., and also includes an organic glue containing metal oxide particles.

[0059] Specifically, the width W of the vertical cross section of the protection structure 3 gradually decreases along the direction of the protection structure 3 approaching the pixel unit 2; Figure 1 As shown, the light incident into the protection structure 3 can be totally reflected at the interface between the protection structure 3 and the light absorption structure 4, thereby improving the light extraction rate of the pixel unit 2. Specifically, the protection structure 3 is an inverted trapezoidal structure.

[0060] For specific embodiments, please refer to Figure 1 The display panel 10a further includes a dielectric layer 5, which is disposed on one side surface of the base substrate 1; the pixel unit 2 is embedded in the dielectric layer 5, and the side surface of the pixel unit 2 facing away from the base substrate 1, that is, the light emitting surface of the pixel unit 2 is exposed to the dielectric layer 5. In this way, it is possible to avoid the dielectric layer 5 blocking the light emitting surface of the pixel unit 2 and affecting the light emission, and the dielectric layer 5 can be used to protect the pixel unit 2. At the same time, the dielectric layer 5 can fix the current position of the pixel unit 2 to avoid the pixel unit 2 from moving to the bottom of the light absorption structure 4 and affecting the light emission effect.

[0061] In this specific embodiment, the light absorption structure 4 is disposed on the surface of the dielectric layer 5 facing away from the base substrate 1. The dielectric layer 5 can be a transparent dielectric layer to facilitate the light emission of the light emitting structure. The dielectric layer 5 can be a transparent resin layer or a cured adhesive layer.

[0062] Specifically, the surface of the pixel unit 2 facing away from the substrate 1 is flush with the surface of the dielectric layer 5 facing away from the substrate 1 , so as to be planarized by the dielectric layer 5 ; and at the same time, it is convenient to make the subsequent protection structure 3 .

[0063] Specifically, in this embodiment, the side of the light absorption structure 4 facing away from the base substrate 1 is lower than the side of the protection structure 3 facing away from the base substrate 1. In this way, the light emitted by the pixel unit 2 can be directly emitted through the protection structure 3, and the light absorption structure 4 will not absorb light from the pixel unit 2, which can further improve the light extraction rate. Of course, the side of the light absorption structure 4 facing away from the base substrate 1 can also be flush with the side of the protection structure 3 facing away from the base substrate 1.

[0064] It can be understood that in the specific embodiment, there are multiple protective structures 3, the multiple protective structures 3 are arranged at intervals, and a light absorption structure 4 is provided between every two adjacent protective structures 3; specifically, the light absorption structure 4 covers other positions of the display panel 10a except the protective structure 3.

[0065] The display panel 10a provided in the present embodiment comprises a base substrate 1 and a pixel unit 2, a protective structure 3 and a light absorption structure 4 arranged on the same side of the base substrate 1; wherein the orthographic projection of the pixel unit 2 on the base substrate 1 is located within the orthographic projection of the protective structure 3 on the base substrate 1; the light absorption structure 4 is arranged on the outside of the protective structure 3, and the surface of the light absorption structure 4 on the side away from the base substrate 1 is not higher than the surface of the protective structure 3 on the side away from the base substrate 1, and the polarity difference between the light absorption structure 4 and the protective structure 3 is greater than the polarity difference between the light absorption structure 4 and the pixel unit 2. In this way, compared with the pixel unit 2, in the process of preparing the light absorption structure 4, the light absorption structure 4 is less likely to be siphoned to the surface of the protective structure 3, so that the risk of the light absorption material forming the light absorption structure 4 overflowing to the surface of the pixel unit 2 can be effectively reduced or even avoided by using the protective structure 3, that is, the light absorption structure 4 is prevented from extending to the side where the light emitting surface of the pixel unit 2 is located, thereby improving the light emitting effect of the pixel unit 2 and reducing the probability of the occurrence of the dark spot problem. At the same time, compared with the photolithography solution, the display panel 10a of this embodiment has a matching protective structure 3 for each pixel unit 2 thereon, and there is no need to select different photolithography equipment according to the different sizes of the display panel 10a, thereby avoiding the difficulty in selecting photolithography equipment, and the problems of slow processing efficiency and high cost. In addition, by preparing a protective structure 3 whose vertical cross-section width W gradually decreases along the direction of the protective structure 3 approaching the pixel unit 2 just above the light-emitting surface of the pixel unit 2, the step difference between the JIP printed BM and the light-emitting surface of the pixel unit 2 is increased, and the risk of light-absorbing material overflowing to the light-emitting surface of the LED is reduced.

[0066] In another embodiment, see Figure 2 , Figure 2 1 is a schematic diagram of the structure of a display panel provided by another embodiment of the present application; another display panel 10b is provided, which is different from the display panel 10a provided by the above embodiment in that the protection structure 3 and the light absorption structure 4 are arranged on the surface of the substrate 1 facing the pixel unit 2; the protection structure 3 is in a closed loop shape and is arranged around the periphery of the pixel unit 2, that is, the protection structure 3 is arranged along the circumferential direction of the pixel unit 2. Moreover, relative to the plane where the surface of the substrate 1 facing the pixel unit 2 is located, the side of the protection structure 3 facing away from the substrate 1 is higher than the side of the pixel unit 2 facing away from the substrate 1.

[0067] It can be understood that if the protection structure 3 and the pixel unit 2 are arranged in the same layer, the side of the protection structure 3 away from the substrate 1 is higher than the side of the pixel unit 2 away from the substrate 1, which is essentially equivalent to the thickness of the protection structure 3 being greater than the thickness of the pixel unit 2.

[0068] In this embodiment, combined Figure 2 , the light absorption structure 4 is arranged on the side of the protective structure 3 away from the pixel unit 2; to prevent the light absorption material from overflowing to the light emitting surface of the pixel unit 2, affecting the light emission of the pixel unit 2. Specifically, the light absorption structure 4 is in contact with the protective structure 3. In this embodiment, the thickness of the light absorption structure 4 is less than or equal to the thickness of the pixel unit 2; preferably, the thickness of the light absorption structure 4 is less than the thickness of the pixel unit 2, so as to ensure that the light absorption structure 4 does not extend to the side where the light emitting surface of the pixel unit 2 is located, so as to ensure the light emission effect of the pixel unit 2.

[0069] In this embodiment, if Figure 2 As shown, the width w of the vertical cross section of the side wall of the protection structure 3 gradually increases along the direction from the protection structure 3 to the substrate 1; thus, the structure can be used to increase the light extraction rate of the pixel unit 2 and improve the light extraction effect. Specifically, the vertical cross section of the side wall of the protection structure 3 can be a trapezoidal structure.

[0070] For details, see Figure 3 , Figure 3 for Figure 2 A top view of the display panel shown; the pixel units include red pixel units, green pixel units and blue pixel units, one red pixel unit, one green pixel unit and one blue pixel unit constitute a light-emitting unit; two protective structures 3 corresponding to two adjacent pixel units 2 in the same light-emitting unit share a side wall m; the light-absorbing structure 4 is arranged around the periphery of the light-emitting unit.

[0071] That is to say, the corresponding protection structure 3 in a light-emitting unit forms an integral dam structure, which completely surrounds the corresponding light-emitting unit in a circumferential direction, and the light-absorbing structure 4 is specifically located on the side of the dam structure away from the light-emitting unit. In this way, the process difficulty and cost are reduced and the processing is convenient.

[0072] Of course, in other embodiments, see Figure 4 , Figure 4A top view of a display panel provided in another embodiment of the present application. One light-emitting unit may correspond to one protective structure 3, which extends along the circumferential direction of the light-emitting unit and is in a closed loop shape; the surface of the protective structure 3 facing away from the substrate 1 is higher than the surface of each pixel unit 2 in the corresponding light-emitting unit facing away from the substrate 1. Specifically, the protective structure 3 and the light-absorbing structure 4 are both arranged on the surface of the substrate 1, the conductive member 6 directly electrically connects the substrate 1 with the pixel unit 2, and the thickness of the protective structure 3 is greater than the sum of the thicknesses of the pixel unit 2 and the conductive member 6.

[0073] Specifically, the protective structure 3 may be a white structure. The white protective structure 3 may improve the efficiency of the front light emission of the pixel unit 2 .

[0074] The display panel 10b provided in this embodiment is provided with a closed-loop protection structure 3 at the periphery of the pixel unit 2, and the height of the protection structure 3 is higher than the height of the light-emitting surface of the pixel unit 2. In this way, in the process of preparing the light-absorbing structure 4, compared with the pixel unit 2, the light-absorbing structure 4 is less likely to be siphoned to the surface of the protection structure 3, so that in the process of preparing the light-absorbing structure 4, the light-absorbing material can be prevented from overflowing to the light-emitting surface of the pixel unit 2, and the light-absorbing structure 4 can be prevented from extending to the light-emitting surface of the pixel unit 2, thereby effectively reducing the risk of dark spots appearing in the pixel unit 2 and improving the light-emitting effect of the display panel 10b.

[0075] See also Figures 5 to 7 , Figure 5 A flow chart of a method for preparing a display panel provided in one embodiment of the present application; Figure 6 to Figure 7 for Figure 5 The structural schematic diagram corresponding to the specific process of the method for preparing the display panel shown in FIG. The method can be used to prepare the display panel 10a provided in the first embodiment above. The method comprises:

[0076] Step S1: providing a base substrate, on which a pixel unit is arranged.

[0077] See also Figure 6 , Figure 6 A schematic structural diagram of a pixel unit and a base substrate provided in an embodiment of the present application; the pixel unit 2 is disposed on a side surface of the base substrate 1 and is electrically connected to the base substrate 1 through a conductive member 6.

[0078] Specifically, a dielectric layer 5 is further provided on the surface of the base substrate 1, and the pixel unit 2 and the conductive member 6 are embedded in the dielectric layer 5, and the surface of the pixel unit 2 facing away from the base substrate 1, that is, the light-emitting surface of the pixel unit 2, is exposed to the dielectric layer 5. Specifically, the surface of the pixel unit 2 facing away from the base substrate 1 is flush with the surface of the dielectric layer 5 facing away from the base substrate 1, so as to be planarized by the dielectric layer 5, and at the same time, it is convenient to make the subsequent protection structure 3.

[0079] Step S2: a transparent material is disposed on a side of the base substrate facing the pixel unit, and the transparent material is processed to form a protection structure.

[0080] In the specific implementation process, see Figure 7 , Figure 7 For Figure 6 Step S2 specifically includes: disposing a transparent material on the surface of the dielectric layer 5 facing away from the substrate 1, and performing a photo-etching process on the transparent material to form a protective structure 3 on the surface of the pixel unit 2 facing away from the substrate 1.

[0081] Specifically, a transparent material that can be patterned can be coated on the surface of the dielectric layer 5 facing away from the substrate 1, and then a protective structure 3 can be formed on the light-emitting surface of each pixel unit 2 through processes such as exposure and development. The bottom surface of the protective structure 3 completely covers the light-emitting surface of the corresponding pixel unit 2; thus, the light-absorbing structure 4 formed in step S3 will not extend to the light-emitting surface of the pixel unit 2, thereby avoiding the light-absorbing structure 4 from affecting the light-emitting effect of the pixel unit 2. Specifically, the width W of the vertical cross section of the protective structure 3 gradually decreases along the direction in which the protective structure 3 approaches the pixel unit 2; the protective structure 3 can be specifically an inverted trapezoidal structure.

[0082] Step S3: forming a light absorbing structure on the outer side of the protection structure.

[0083] Combination Figure 1 , the surface of the light absorbing structure 4 facing away from the substrate 1 is not higher than the surface of the protection structure 3 facing away from the substrate 1; and the polarity difference between the light absorbing structure 4 and the protection structure 3 is greater than the polarity difference between the light absorbing structure 4 and the pixel unit 2. In the specific implementation process, the light absorbing material is arranged on the surface of the dielectric layer 5 facing away from the substrate 1 by using the IJP process, and the light absorbing material surrounds the protection structure 3 to form the light absorbing structure 4 in contact with the outer wall surface of the side wall of the protection structure 3. Among them, the thickness of the light absorbing structure 4 is less than or equal to the thickness of the protection structure 3.

[0084] The method for preparing the display panel provided in the present embodiment forms a protective structure 3 on the light-emitting surface of the pixel unit 2 before forming the light-absorbing structure 4; and then forms the light-absorbing structure 4 on the outside of the protective structure 3; in this way, the protective structure 3 can be used to block the light-absorbing material forming the light-absorbing structure 4 from being siphoned to the side where the light-emitting surface of the pixel unit 2 is located; at the same time, by making the surface of the side of the light-absorbing structure 4 facing away from the substrate 1 not higher than the surface of the side of the protective structure 3 facing away from the substrate 1; the risk of the light-absorbing material overflowing to the side where the light-emitting surface of the pixel unit 2 is located is further reduced, thereby reducing the risk of dark spots caused by the light-absorbing structure 4 extending to the light-emitting surface of the pixel unit 2, thereby improving the light-emitting effect.

[0085] In one embodiment, in combination Figure 2 , Figure 8 and Fig. 9 , Figure 8 A schematic diagram of the structure of a pixel unit and a substrate provided in another embodiment of the present application; Fig. 9 For Figure 8 A schematic diagram of a structure in which a protective structure is formed on the structure shown. Another method for preparing a display panel is also provided, which can be used to prepare Figure 2 The display panel 10b provided in the corresponding embodiment. The manufacturing method of this display panel 10b is different from the manufacturing method provided in the first embodiment described above in that:

[0086] Step S2 specifically includes: disposing a protective material on the surface of the base substrate 1 facing the pixel unit 2, and performing a photoetching process on the protective material to form a protective structure 3 on the base substrate 1; the protective structure 3 is in a closed loop and is disposed around the periphery of the pixel unit 2.

[0087] Specifically, a patternable white material may be coated on the surface of the substrate 1 facing the pixel unit 2, and then a protective structure 3 may be formed around the pixel unit 2 through processes such as exposure and development. The thickness of the protective structure 3 is greater than the sum of the thicknesses of the pixel unit 2 and the conductive member 6. Of course, in other embodiments, the formed protective structure 3 may also be arranged around the circumferential direction of the light-emitting unit.

[0088] In this embodiment, step S3 specifically includes: using the IJP process to arrange a light absorbing material on the surface of the substrate 1 facing the pixel unit 2, and making the light absorbing material surround the protective structure 3 to form a light absorbing structure 4 in contact with the outer wall surface of the side wall of the protective structure 3. Among them, the thickness of the light absorbing structure 4 is not greater than the thickness of the protective structure 3. Specifically, the thickness of the light absorbing structure 4 is less than the thickness of the protective structure 3 to ensure that the light absorbing structure 4 does not extend to the side where the light emitting surface of the pixel unit 2 is located, so as to avoid affecting the light emitting effect of the pixel unit 2 and reduce the risk of dark spots.

[0089] Compared with the preparation method of the display panel provided in the above-mentioned embodiment, the preparation method provided in the present embodiment can not only effectively reduce the risk of overflow of the light-absorbing material to the light-emitting surface of the pixel unit 2, that is, reduce the risk of dark spots caused by the light-absorbing structure 4 extending to the light-emitting surface of the pixel unit 2, thereby improving the light-emitting effect; but also can directly form a protective structure 3 on the surface of the substrate 1, with low cost and simple process.

[0090] In this embodiment, see Fig.10 , Fig.10A simplified structural diagram of an electronic device provided in one embodiment of the present application. An electronic device is also provided, which may be a mobile phone, a watch, a car screen, etc. The electronic device includes a display panel 10a / 10b involved in any of the above embodiments, and the specific structure and function of the display panel 10a / 10b can be found in the above related description.

[0091] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: include: A base substrate and a pixel unit, a protection structure and a light absorption structure arranged on the same side of the base substrate; The light absorption structure is arranged outside the protection structure, and a surface of the light absorption structure facing away from the base substrate is not higher than a surface of the protection structure facing away from the base substrate.

2. The display panel according to claim 1, characterized in that: The polarity difference between the light absorption structure and the protection structure is greater than the polarity difference between the light absorption structure and the pixel unit.

3. The display panel according to claim 1, characterized in that: The protection structure is arranged on a surface of the pixel unit on a side away from the base substrate, and the orthographic projection of the pixel unit on the base substrate is located within the orthographic projection of the protection structure on the base substrate; And the protective structure is a transparent structure; Preferably, the area of ​​a side surface of the protection structure facing the pixel unit is not less than the area of ​​a side surface of the pixel unit facing the protection structure; Preferably, the protection structure is an optical structure.

4. The display panel according to claim 3, characterized in that: The width of the vertical cross section of the protection structure gradually decreases along the direction in which the protection structure approaches the pixel unit; Preferably, the protection structure is an inverted trapezoidal structure.

5. The display panel according to claim 3, characterized in that: Also includes: A dielectric layer is provided on one side surface of the substrate; The pixel unit is embedded in the dielectric layer, and a surface of the pixel unit facing away from the substrate exposes the dielectric layer; the light absorption structure is provided on a surface of the dielectric layer facing away from the substrate; Preferably, a surface of the pixel unit facing away from the substrate is flush with a surface of the dielectric layer facing away from the substrate; Preferably, the medium layer is a transparent medium layer.

6. The display panel according to any one of claims 1 to 5, characterized in that: The refractive index of the protection structure is greater than the refractive index of the light absorbing structure.

7. The display panel according to claim 1, characterized in that: The protection structure is in a closed loop shape and is arranged around the periphery of the pixel unit; and a surface of the protection structure facing away from the substrate is higher than a surface of the pixel unit facing away from the substrate; Preferably, the protection structure and the light absorption structure are arranged on a surface of the substrate facing the pixel unit, and the light absorption structure is located on a side of the protection structure facing away from the pixel unit; Preferably, the light absorbing structure is in contact with the protective structure; Preferably, the protective structure is a white structure.

8. The display panel according to claim 7, characterized in that: The pixel units include a red pixel unit, a green pixel unit and a blue pixel unit. One red pixel unit, one green pixel unit and one blue pixel unit constitute a light-emitting unit. The two protection structures corresponding to two adjacent pixel units in the same light-emitting unit share a side wall.

9. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-8.

10. A method for preparing a display panel, characterized in that: include: Providing a substrate, on which a pixel unit is arranged; Disposing a transparent material on a side of the base substrate facing the pixel unit, and processing the transparent material to form a protective structure; A light absorbing structure is formed on the outer side of the protective structure; a surface of the light absorbing structure facing away from the substrate is not higher than a surface of the protective structure facing away from the substrate; Preferably, the polarity difference between the light absorption structure and the protection structure is greater than the polarity difference between the light absorption structure and the pixel unit; Preferably, a dielectric layer is further provided on the surface of the base substrate, the pixel unit is embedded in the dielectric layer, and the dielectric layer is exposed on a surface of the pixel unit on a side away from the base substrate; Preferably, the step of disposing a transparent material on a side of the base substrate facing the pixel unit and processing the transparent material to form a protective structure includes: A transparent material is disposed on a surface of the dielectric layer on a side away from the substrate, and a photo-etching process is performed on the transparent material to form a protective structure on a surface of the pixel unit on a side away from the substrate.

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