Atomization device, atomization equipment and heating element

Abstract

The invention discloses an atomization device, atomization equipment and a heating element. The atomization device comprises a heating body and a heating element, the heating body comprises a liquid suction face and an atomization face opposite to the liquid suction face, and a flow channel penetrating through the liquid suction face and the atomization face is formed in the heating body; the heating element is at least partially located on one side of the liquid absorption face, and the maximum height from the heating element to the liquid absorption face is larger than 0.5 mm. According to the atomization device, the maximum height from the heating element to the liquid absorption face of the heating body is larger than 0.5 mm, so that the heating element can heat the atomization substrate with the distance from the liquid absorption face larger than 0.5 mm, the viscosity of the atomization substrate is reduced, the atomization substrate can flow through the flow channel easily, and the probability of dry burning of the heating body is reduced.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and more specifically, to an atomization device, an atomization equipment and a heating element. Background Art

[0002] In the related art, the atomization device includes a heating element, and the heating element is provided with a flow channel, and the atomized substrate can flow from one side of the heating element to the other side of the heating element through the flow channel and be atomized by heat to form an aerosol. However, when the viscosity of the atomized substrate is relatively high, the atomized substrate is difficult to flow through the flow channel, which can easily cause the heating element to dry burn. Summary of the invention

[0003] Embodiments of the present application provide an atomization device, an atomization equipment, and a heating element.

[0004] The atomization device of the embodiment of the present application includes a heating body and a heating element, the heating body includes a liquid absorption surface and an atomization surface opposite to the liquid absorption surface, and the heating body forms a flow channel running through the liquid absorption surface and the atomization surface; the heating element is at least partially located on one side of the liquid absorption surface, and the maximum height of the heating element from the liquid absorption surface is greater than 0.5 mm.

[0005] In the atomization device of the embodiment of the present application, the maximum height of the heating element from the liquid absorption surface of the heating body is greater than 0.5 mm, so that the heating element can heat the atomization matrix within a range greater than 0.5 mm from the liquid absorption surface to reduce the viscosity of the atomization matrix, which is beneficial for the atomization matrix to flow through the flow channel and reduce the probability of dry burning of the heating body.

[0006] In certain embodiments, the maximum height of the heating element from the liquid absorption surface is 1 mm-3 mm.

[0007] In some embodiments, the heating element includes a base and an extension portion, the base is disposed close to the heating element, the extension portion extends from the base in a direction away from the heating element, and the maximum height of the extension portion from the liquid absorption surface is greater than 0.5 mm.

[0008] In some embodiments, the base is formed with a through hole, and the through hole passes through two surfaces of the base in a thickness direction.

[0009] In some embodiments, the extension portion includes at least one fin, and each of the fins is connected to the base near an edge of the through hole.

[0010] In some embodiments, there are multiple through holes, and the edge of each through hole is connected to the fin.

[0011] In some embodiments, an extension direction of the fin is substantially parallel to a thickness direction of the base.

[0012] In some embodiments, the fins are inclined with respect to a thickness direction of the base.

[0013] In some embodiments, the fin is formed with a via hole, and the via hole passes through both sides of the fin in a thickness direction.

[0014] In some embodiments, the heating element is thermally conductively connected to the heating body, and the heat of the heating body can be transferred to the heating element.

[0015] In certain embodiments, the atomization device includes a flow stabilizing element disposed between the heating element and the heating body, and the flow stabilizing element is capable of transferring heat from the heating body to the heating element.

[0016] In certain embodiments, the heating element is configured to emit heat when powered.

[0017] In certain embodiments, the heating element is configured to contact an electrode terminal of the atomization device so that the electrode terminal supplies power to the heating element, and the electrode terminal is used to contact the atomization surface.

[0018] In certain embodiments, the heating element is formed with a through hole, and the through hole is used for the electrode terminal to pass through so that the electrode terminal contacts the heating element.

[0019] In some embodiments, the heating element includes a base and a power connection portion connected to the base, the base is located on one side of the liquid absorption surface, and the power connection portion extends from the base to the atomization surface and contacts the electrode terminal.

[0020] In some embodiments, the power connection portion includes a first connecting piece and a second connecting piece, the first connecting piece connects the base and the second connecting piece, the second connecting piece is bent relative to the first connecting piece and is located on one side of the atomizing surface, and the second connecting piece is used to contact the electrode terminal.

[0021] In certain embodiments, the heating element is a metal heating element.

[0022] In certain embodiments, the heating element is a stainless steel heating element or an aluminum heating element.

[0023] In certain embodiments, the heating element is formed by a die-casting process and / or a stamping process.

[0024] In certain embodiments, the atomization device further comprises a mounting seat, and the heating body and the heating element are both mounted in the mounting seat.

[0025] In certain embodiments, the atomization device further comprises a housing, wherein an atomization matrix is ​​disposed within the housing, and at 25° C., the viscosity of the atomization matrix is ​​greater than 10,000 cps.

[0026] The atomization device of the embodiment of the present application includes a host and the atomization device described in any of the above embodiments, and the atomization device is connected to the host.

[0027] The heating element of the embodiment of the present application is used for an atomization device, which includes a heating element, the heating element including a liquid absorption surface and an atomization surface opposite to the liquid absorption surface, the heating element is formed with a flow channel running through the liquid absorption surface and the atomization surface, the heating element is configured to be at least partially located on one side of the liquid absorption surface, and the maximum height of the heating element from the liquid absorption surface is greater than 0.5 mm.

[0028] In some embodiments, the heating element includes a base and an extension portion, the base is disposed close to the heating element, the extension portion extends from the base in a direction away from the heating element, and the maximum height of the extension portion from the liquid absorption surface is greater than 0.5 mm.

[0029] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0031] Figure 1 is a plan view of an atomization device according to an embodiment of the present application;

[0032] Figure 2 is a three-dimensional cross-sectional schematic diagram of an atomization device according to an embodiment of the present application;

[0033] Figure 3 is a cross-sectional schematic diagram of an atomization device according to an embodiment of the present application;

[0034] Figure 4 yes Figure 3 A partially enlarged schematic diagram of an atomization device;

[0035] Figure 5 is a partially exploded schematic diagram of an atomization device according to an embodiment of the present application;

[0036] Figure 6 is a three-dimensional schematic diagram of a heating element according to an embodiment of the present application;

[0037] Figure 7 is a three-dimensional schematic diagram of a heating element according to an embodiment of the present application;

[0038] Figure 8 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0039] Fig. 9 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0040] Fig.10 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0041] Fig.11 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0042] Fig.12 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0043] Fig.13 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0044] Fig.14 is a three-dimensional cross-sectional schematic diagram of an atomization device according to another embodiment of the present application;

[0045] Fig.15 yes Fig.14 A partially enlarged schematic diagram of an atomization device;

[0046] Fig.16 is a three-dimensional schematic diagram of another heating element according to an embodiment of the present application;

[0047] Fig.17 It is a three-dimensional schematic diagram of an atomization device according to an embodiment of the present application.

[0048] Main markings:

[0049] 100-atomizing device, 10-heating body, 11-liquid absorption surface, 12-atomizing surface, 13-flow channel, 14-base, 15-heating film, 16-perforation, 20-heating element, 21-base, 211-through hole, 22-extension part, 221-fin, 222-through hole, 23-electrical connection part, 231-first connecting piece, 232-second connecting piece, 233-clamping space, 30-current stabilizing element, 40-electrode terminal, 50-mounting seat, 51-lower liquid channel, 52-mist outlet channel, 60-housing, 61-liquid storage chamber, 1000-atomizing device, 200-host. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0052] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and examples of materials provided in the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0053] See also Figure 1-Figure 4 The atomization device 100 of the embodiment of the present application includes a heating body 10 and a heating element 20. The heating body 10 includes a liquid absorption surface 11 and an atomization surface 12 opposite to the liquid absorption surface 11. The heating body 10 forms a flow channel 13 that penetrates the liquid absorption surface 11 and the atomization surface 12; the heating element 20 is at least partially located on one side of the liquid absorption surface 11, and the maximum height H of the heating element 20 from the liquid absorption surface 11 is greater than 0.5 mm.

[0054] In the atomization device 100 of the embodiment of the present application, the maximum height H of the heating element 20 from the liquid absorption surface 11 of the heating element 10 is greater than 0.5 mm, so that the heating element 20 can heat the atomization matrix within a range greater than 0.5 mm from the liquid absorption surface 11 to reduce the viscosity of the atomization matrix, which is beneficial for the atomization matrix to flow through the flow channel 13 and reduce the probability of dry burning of the heating element 10.

[0055] Specifically, the atomizing device 100 is a component for forming an atomized matrix into an aerosol. The atomizing device 100 can atomize the atomized matrix into an aerosol by heating. The heating element 10 is a component for generating heat. The liquid absorption surface 11 of the heating element 10 is the surface that first contacts the atomized matrix, and the atomizing surface 12 of the heating element 10 is the surface that atomizes the atomized matrix to form an aerosol. The flow channel 13 is, for example, a circular hole or the like, which can guide the atomized matrix from the liquid absorption surface 11 to the atomizing surface 12.

[0056] As discussed above, the heating element 10 itself can generate heat, thereby heating and atomizing the atomized matrix around the atomizing surface 12 of the heating element 10. However, the range of the heating atomized matrix of the heating element 10 is small, so that the amount of heated atomized matrix is ​​small, which may be difficult to meet the requirements. In this way, the heating element 20 is at least partially arranged on one side of the liquid absorption surface 11, and the maximum height H of the heating element 20 from the liquid absorption surface 11 is greater than 0.5mm, so that the heating element 20 can exchange heat with more surrounding atomized matrix, so that the temperature of the atomized matrix around the heating element 20 increases, the viscosity decreases, and the fluidity of the atomized matrix is ​​enhanced, so that the atomized matrix is ​​easier to reach the atomizing surface 12 through the flow channel 13, and the probability of dry burning of the heating element 10 is reduced.

[0057] It should be pointed out that the maximum height H of the heating element 20 from the liquid absorbing surface 11 refers to the maximum dimension between the heating element 20 and the liquid absorbing surface 11 along the normal direction of the liquid absorbing surface 11 .

[0058] The atomized matrix in the embodiment of the present application may be a high viscosity atomized matrix, and the viscosity of the atomized matrix may be greater than 10000 cps at room temperature (25° C.) In the embodiment of the present application, the viscosity is measured by the viscosity measurement method of GBT 17473.5-1998 Thick Film Microelectronics Technology Precious Metal Paste Test Method Viscosity Measurement.

[0059] In some embodiments, the maximum height H of the heating element 20 from the liquid absorption surface 11 can be 0.6 mm, 1 mm, 1.5 mm, 2 mm, 3 mm, etc.

[0060] See also Figure 5 and Figure 6 In some embodiments, the heating element 10 may include a substrate 14 and a heating film 15 disposed on the substrate 14. The substrate 14 has a liquid absorption surface 11, and the heating film 15 has an atomization surface 12. The substrate 14 may be in a sheet shape and may be made of materials such as glass and dense ceramics. The heating film 15 may be made of conductive and easily heat-generating materials such as metals and alloys. For example, the material of the heating film 15 may be gold, silver, platinum, palladium, palladium-copper alloy, gold-silver-platinum alloy, gold-silver alloy, titanium-zirconium alloy, palladium-silver alloy, gold-platinum alloy, stainless steel, and the like.

[0061] In some embodiments, the heating element 20 is a metal heating element 20. In other words, the heating element 20 can be made of a metal material. In this way, the metal heating element 20 has good thermal conductivity and can quickly exchange heat with the atomized substrate, thereby heating the atomized substrate. In one example, the heating element 20 can increase the temperature of the surrounding atomized substrate by more than 10°C.

[0062] In some embodiments, the heating element 20 is a stainless steel heating element 20 or an aluminum heating element 20. In other words, the heating element 20 can be made of stainless steel or aluminum. In this way, stainless steel or aluminum has good thermal conductivity and is easy to shape, so that the heating element 20 can be prepared more easily.

[0063] Of course, in some embodiments, the heating element 20 can be made of copper, metal alloy, etc.

[0064] In some embodiments, the heating element 20 is formed by a die-casting process and / or a stamping process. In this way, the heating element 20 is easily formed into a predetermined shape, thereby facilitating heating of the atomized substrate. Figure 7-Figure 9 In the embodiment of the present invention, the heating element 20 can be formed by a die-casting process; Fig.12 In the embodiment of the present invention, the heating element 20 can be formed by a die casting process.

[0065] See also Figure 4 In some embodiments, the maximum height H of the heating element 20 from the liquid suction surface 11 is 1 mm-3 mm. For example, the maximum height H may be 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.5 mm, 3 mm, etc. When the maximum height H is within this range, a sufficient amount of atomized substrate can be heated so that a sufficient amount of atomized substrate can be atomized through the flow channel 13, and the volume of the heating element 20 can be reduced, making the atomization device 100 more miniaturized.

[0066] See also Figure 4 In some embodiments, the heating element 20 includes a base 21 and an extension portion 22. The base 21 is arranged close to the heating element 10. The extension portion 22 extends from the base 21 in a direction away from the heating element 10. The maximum height H of the extension portion 22 from the liquid absorption surface 11 is greater than 0.5 mm.

[0067] In this way, the base 21 can make the heating element 20 more stable during installation, and the extension portion 22 can increase the height of the heating element 20 and heat the atomizing matrix, thereby expanding the heating range of the heating element 20, so that the maximum height H of the heating element 20 from the liquid absorption surface 11 of the heating body 10 meets the requirement of being greater than 0.5 mm.

[0068] Specifically, the base 21 and the extension 22 may both be in sheet form. The base 21 may have a square profile, and the extension 22 may be in a strip shape. The maximum height H of the extension 22 from the liquid absorbing surface 11 is the maximum height H of the heating element 20 from the liquid absorbing surface 11.

[0069] See also Figure 4 and Figure 7 In some embodiments, the base 21 is formed with a through hole 211, and the through hole 211 penetrates two surfaces in the thickness direction of the base 21. In this way, the through hole 211 can reduce the flow resistance of the atomized matrix, so that the heated atomized matrix can flow toward the liquid absorption surface 11 more easily, so that the atomized matrix can be atomized on the atomization surface 12 after passing through the flow channel 13.

[0070] Specifically, the through hole 211 may be a square hole, a circular hole, etc. The projection of the through hole 211 on the liquid absorption surface 11 may overlap with at least part of the flow channel 13, thereby facilitating the atomized matrix to flow to the liquid absorption surface 11 faster after passing through the through hole 211.

[0071] See also Figure 7 In some embodiments, the extension portion 22 includes at least one fin 221, and each fin 221 is connected to the base 21 near the edge of the through hole 211. In this way, the fin 221 can have a generally larger surface, which can increase the heating efficiency of the heating element 20, thereby reducing the viscosity of the atomized substrate more quickly. In addition, since the fin 221 is close to the edge of the through hole 211, the temperature of the atomized substrate flowing through the through hole 211 will not decrease, so that the atomized substrate maintains a lower viscosity, and then the atomized substrate flows more smoothly to the atomization surface 12, reducing the probability of dry burning of the heating element 10.

[0072] Specifically, the fin 221 may be in a straight strip shape, a bent shape, a frame shape, etc. The present application does not limit the specific shape and structure of the fin 221, as long as the fin 221 can heat the atomized substrate.

[0073] See also Figure 7 and Figure 8 In some embodiments, the number of through holes 211 is multiple, and the edge of each through hole 211 is connected to a fin 221. In this way, the multiple through holes 211 can make the number of fins 221 multiple, so that the heating area of ​​the heating element 20 is larger, which is conducive to improving the heating efficiency of the heating element 20 on the atomized substrate. In addition, the fin 221 can heat the atomized substrate flowing through each through hole 211, thereby reducing the viscosity of the atomized substrate and improving the overall fluidity of the atomized substrate.

[0074] When there are multiple fins 221, the types of the fins 221 may be the same or different. Figure 7As shown, some fins 221 are in the shape of straight strips, and some fins 221 are in the shape of bends. Figure 8 , Fig. 9 and Fig.12 As shown, the fins 221 have the same construction.

[0075] Specifically, the number of through holes 211 may be 2, 3, 4, etc. Fig. 9 In the example of FIG. 1 , the number of through holes 211 is 2. Fig.10 In the example of FIG. 1 , the number of through holes 211 is 3. One or more fins 221 may be connected to the edge of the same through hole 211. Fig. 9 In the example of FIG. 2 , a fin 221 is connected to the edge of a through hole 211. Fig.11 In the example, two fins 221 are connected to the edge of one of the through holes 211 .

[0076] Furthermore, the number of fins 221 connected to the edges of the through holes 211 may be the same or different. Fig.11 In the example, two fins 221 are connected to the edge of the middle through hole 211, and one fin 221 is connected to the edge of the side through hole 211.

[0077] See also Fig.12 In some embodiments, the extension direction of the fin 221 is substantially parallel to the thickness direction of the base 21. In this way, each side of the fin 221 can contact the atomized substrate to heat the atomized substrate, and the atomized substrate can flow toward the base 21 along the side of the fin 221, so that the flow resistance of the atomized substrate is small, which is conducive to the flow of the atomized substrate. In addition, the fin 221 can form a larger maximum height H, so that the heating range of the heating element 20 is increased, which is conducive to reducing the viscosity of a larger amount of the atomized substrate.

[0078] See also Fig.13 In some embodiments, the fin 221 is inclined in the thickness direction of the base 21. In this way, the fin 221 can reduce the flow speed of the atomized matrix, and the fin 221 has a longer contact time with the atomized matrix, which is conducive to heating the atomized matrix, so that the viscosity of the atomized matrix flowing to the heating element 10 is reduced, and the atomized matrix is ​​easier to reach the atomization surface 12 to be atomized, thereby reducing the probability of dry burning of the heating element 10.

[0079] See also Fig.13In some embodiments, the fin 221 is formed with a via 222, and the via 222 runs through both sides of the fin 221 in the thickness direction. In this way, the via 222 reduces the flow resistance of the atomized substrate, so that the atomized substrate can smoothly pass through the through hole 211 and the flow channel 13 in sequence to reach the atomization surface 12. Specifically, the number of vias 222 on each fin 221 can be one or more. The via 222 can be various types of holes such as circular holes, square holes, and elongated holes. The present application does not limit the specific shape of the via 222.

[0080] Please refer again Figure 4 In some embodiments, the heating element 20 is thermally conductively connected to the heating body 10, and the heat of the heating body 10 can be transferred to the heating element 20. In this way, after the heating element 20 exchanges heat with the heating body 10, the temperature of the heating element 20 itself increases, thereby heating the atomized substrate.

[0081] It should be pointed out that the heating element 20 is thermally conductively connected to the heating body 10 , and the heating element 20 and the heating body 10 can be connected in contact or indirectly through an intermediate medium, as long as the heating body 10 can transfer heat to the heating element 20 .

[0082] Please refer again Figure 4 and Figure 5 In some embodiments, the atomization device 100 includes a flow stabilizing element 30 , which is disposed between the heating element 20 and the heating body 10 , and the flow stabilizing element 30 can transfer heat from the heating body 10 to the heating element 20 .

[0083] In this way, the flow stabilizing element 30 can not only stabilize the flow rate of the atomized matrix and prevent the heating element 10 from leaking, so that the atomized matrix can flow more evenly through the flow channel 13 to the atomizing surface 12 and be atomized, but the flow stabilizing element 30 can also transfer the heat of the heating element 10 to the heating element 20, thereby increasing the temperature of the heating element 20 itself.

[0084] Specifically, the flow stabilizing element 30 is an element with multiple pores, and the multiple pores can be arranged regularly or irregularly. The flow stabilizing element 30 can be in the form of a thin sheet and stacked with the heating element 10. The base 21 of the heating element 20 can be pressed against the flow stabilizing element 30 to make the contact area between the flow stabilizing element 30 and the heating element 20 larger, which is conducive to the heat of the heating element 10 being transferred to the heating element 20 through the flow stabilizing element 30.

[0085] In some embodiments, the flow stabilizing element 30 may be a cotton flow stabilizing element or a metal flow stabilizing element. When the flow stabilizing element 30 is a cotton flow stabilizing element, the flow stabilizing element 30 is made of cotton material, and the heating element 10 can transfer heat to the heating element 20 through the atomized matrix adsorbed on the cotton flow stabilizing element. When the flow stabilizing element 30 is a metal flow stabilizing element, the flow stabilizing element 30 is made of metal material, and the heating element 10 can transfer heat to the heating element 20 through the atomized matrix on the metal flow stabilizing element and the metal flow stabilizing element itself.

[0086] See also Fig.14 and Fig.15 In some embodiments, the heating element 20 is configured to emit heat when powered. In this way, the heating element 20 can convert electrical energy into thermal energy, and the temperature of the heating element 20 itself can be higher, emitting more heat, thereby quickly heating the atomized substrate and causing a greater temperature rise of the atomized substrate, which is conducive to lowering the viscosity of the atomized substrate, thereby increasing the fluidity of the atomized substrate.

[0087] Specifically, as discussed above, the heating element 20 can be made of metal material. Since metal material has a certain resistance, it can effectively convert electrical energy into thermal energy.

[0088] See also Fig.14 and Fig.15 In some embodiments, the heating element 20 is configured to contact the electrode terminal 40 of the atomizing device 100 so that the electrode terminal 40 supplies power to the heating element 20, and the electrode terminal 40 is used to contact the atomizing surface 12. In this way, the electrode terminal 40 can supply power to the heating element 20 and the heating body 10 at the same time, or in other words, the heating body 10 and the heating element 20 can share the same electrode terminal 40, which can reduce the number of parts of the atomizing device 100, thereby making the atomizing device 100 more compact.

[0089] Specifically, the number of electrode terminals 40 can be two, namely a positive terminal and a negative terminal. The positive terminal can be connected to the positive pole of a power source, and the negative terminal can be connected to the negative pole of a power source. The power source supplies power to the heating element 20 and the heating body 10 through the positive terminal and the negative terminal, so that both the heating body 10 and the heating element 20 can generate heat.

[0090] See also Fig.15In some embodiments, the heating element 10 is formed with a through hole 16, and the through hole 16 is used to allow the electrode terminal 40 to pass through so that the electrode terminal 40 contacts the heating element 20. As mentioned above, the heating element 20 is located on one side of the liquid absorption surface 11, and the electrode terminal 40 contacts the atomization surface 12. In this way, the through hole 16 is formed on the heating element 10, so that one end of the electrode terminal 40 can contact the heating element 20, so that the electrode terminal 40 supplies power to the heating element 20.

[0091] Specifically, the electrode terminal 40 is generally columnar, and the size of the through hole 16 may be slightly larger than that of the electrode terminal 40 , so that the electrode terminal 40 passes through the through hole 16 while preventing the atomized matrix from leaking from the through hole 16 .

[0092] It can be understood that, when the current stabilizing element 30 is disposed between the heating body 10 and the heating element 20 , the electrode terminal 40 passes through the current stabilizing element 30 and abuts against the heating element 20 .

[0093] See also Fig.16 In some embodiments, the heating element 20 includes a base 21 and a power connection portion 23 connected to the base 21, the base 21 is located on one side of the liquid absorption surface 11, and the power connection portion 23 extends from the base 21 to the atomization surface 12 and contacts the electrode terminal 40. In this way, the power connection portion 23 can connect the heating element 20 to the electrode terminal 40, so that the electrode terminal 40 supplies power to the heating element 20, so that the heating element 20 can heat the atomized substrate.

[0094] Specifically, the material of the power connection portion 23 can be the same as that of the base 21. The power connection portion 23 and the base 21 can be manufactured by die casting and / or stamping. The power connection portion 23 can extend from the side of the heating element 10 to the atomizing surface 12, so that the structure of the heating element 10 is not damaged, so that the atomized matrix can stably flow to the atomizing surface 12.

[0095] See also Fig.16 In some embodiments, the power connection portion 23 may include a first connection piece 231 and a second connection piece 232, wherein the first connection piece 231 is connected to the base 21 and the second connection piece 232, and the second connection piece 232 is bent relative to the first connection piece 231 and is located on one side of the atomizing surface 12, and the second connection piece 232 is used to contact the electrode terminal 40. In this way, the first connection piece 231 and the second connection piece 232 cooperate to extend the power connection portion 23 from the base 21 to the atomizing surface 12, so that the power connection portion 23 is connected to the electrode terminal 40 through the second connection piece 232.

[0096] Specifically, the first connecting piece 231, the second connecting piece 232 and the base 21 can jointly form a clamping space 233, and the heating element 10 and the flow stabilizing element 30 are accommodated in the clamping space 233. In this way, the clamping space 233 can make the heating element 10, the heating element 20 and the flow stabilizing element 30 form a whole, which is conducive to the installation of the heating element 10, the heating element 20 and the flow stabilizing element 30.

[0097] See also Figure 4 and Figure 5 In some embodiments, the atomizing device 100 further includes a mounting seat 50, and the heating element 10 and the heating component 20 are both mounted in the mounting seat 50. In this way, the mounting seat 50 can make the heating element 10 and the heating component 20 more stably mounted. Figure 5 As shown, the mounting base 50 is provided with a lower liquid channel 51 and a mist outlet channel 52. The lower liquid channel 51 is a channel for the atomized matrix to flow from the liquid storage chamber to the heating element 10. Under the action of gravity, air pressure and other forces, the atomized matrix enters the lower liquid channel 51 from one end of the lower liquid channel 51 and flows to the heating element 10 from the other end of the lower liquid channel 51.

[0098] The mist outlet channel 52 is a channel for conducting smoke such as aerosol formed by the heating element 10 heating the atomizing matrix to the outside of the mounting seat 50 . In other words, the aerosol formed by the atomizing matrix can flow to the outside of the mounting seat 50 through the mist outlet channel 52 .

[0099] The mist outlet channel 52 and the lower liquid channel 51 are arranged crosswise and in isolation, for example, the lower liquid channel 51 is arranged on the first side of the mounting seat 50, and the mist outlet channel 52 is arranged on the second side of the mounting seat 50, and the first side and the second side are perpendicular. As shown in the orientation of the figure, the lower liquid channel 51 is arranged on the left and right sides of the mounting seat 50, and the mist outlet channel 52 is arranged on the front and rear sides of the mounting seat 50.

[0100] Please refer again Figure 1-Figure 4 In some embodiments, the atomizing device 100 further includes a housing 60, in which an atomizing matrix is ​​disposed. In this way, a predetermined amount of the atomizing matrix can be contained in the housing 60, so that the atomizing device 100 can be reused multiple times. Specifically, the housing 60 is a basic component of the atomizing device 100, and the housing 60 can carry other parts of the atomizing device 100. The housing 60 is formed with a liquid storage chamber 61, in which the atomizing matrix is ​​contained.

[0101] See also Fig.17 The atomization device 1000 of the embodiment of the present application includes a host 200 and an atomization device 100 of any of the above embodiments, and the atomization device 100 is connected to the host 200.

[0102] In summary, in one embodiment, the heating element 20 is used for the atomization device 100, the atomization device 100 includes a heating body 10, the heating body 10 includes a liquid absorption surface 11 and an atomization surface 12 opposite to the liquid absorption surface 11, the heating body 10 is formed with a flow channel 13 passing through the liquid absorption surface 11 and the atomization surface 12, the heating element 20 is configured to be at least partially located on one side of the liquid absorption surface 11, and the maximum height H of the heating element 20 from the liquid absorption surface 11 is greater than 0.5 mm.

[0103] In some embodiments, the heating element 20 includes a base 21 and an extension portion 22. The base 21 is disposed close to the heating element 10. The extension portion 22 extends from the base 21 away from the heating element 10. The maximum height H of the extension portion 22 from the liquid absorption surface 11 is greater than 0.5 mm.

[0104] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0105] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0106] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An atomizing device, characterized in that: include: A heating element, the heating element comprising a liquid absorbing surface and an atomizing surface opposite to the liquid absorbing surface, and the heating element is formed with a flow channel penetrating the liquid absorbing surface and the atomizing surface; and A heating element, wherein the heating element is at least partially located on one side of the liquid absorbing surface, and the maximum height of the heating element from the liquid absorbing surface is greater than 0.5 mm.

2. The atomizing device according to claim 1, characterized in that: The maximum height of the heating element from the liquid absorption surface is 1mm-3mm.

3. The atomizing device according to claim 1, characterized in that: The heating element includes a base and an extension portion, wherein the base is arranged close to the heating element, and the extension portion extends from the base in a direction away from the heating element, and a maximum height of the extension portion from the liquid absorption surface is greater than 0.5 mm.

4. The atomizing device according to claim 3, characterized in that: The base is formed with a through hole, and the through hole penetrates two surfaces of the base in a thickness direction.

5. The atomizing device according to claim 4, characterized in that: The extension portion includes at least one fin, and each of the fins is connected to the base near an edge of the through hole.

6. The atomizing device according to claim 5, characterized in that: There are multiple through holes, and the edge of each through hole is connected to the fin.

7. The atomizing device according to claim 5, characterized in that: The extending direction of the fin is substantially parallel to the thickness direction of the base.

8. The atomizing device according to claim 5, characterized in that: The fin is inclined with respect to a thickness direction of the base.

9. The atomizing device according to claim 8, characterized in that: The fin is formed with a via hole, and the via hole passes through both sides of the fin in the thickness direction.

10. The atomizing device according to claim 1, characterized in that: The heating element is thermally conductively connected to the heating body, and the heat of the heating body can be transferred to the heating element.

11. The atomizing device according to claim 10, characterized in that: The atomizing device comprises a flow stabilizing element arranged between the heating element and the heating body, and the flow stabilizing element can transfer the heat of the heating body to the heating element.

12. The atomizing device according to claim 1, characterized in that: The heating element is configured to emit heat when powered.

13. The atomizing device according to claim 12, characterized in that: The heating element is configured to contact an electrode terminal of the atomizing device so that the electrode terminal supplies power to the heating element, and the electrode terminal is used to contact the atomizing surface.

14. The atomizing device according to claim 13, characterized in that: The heating body is formed with a through hole for the electrode terminal to pass through so that the electrode terminal contacts the heating element.

15. The atomizing device according to claim 13, characterized in that: The heating element comprises a base and a power connection portion connected to the base, wherein the base is located at one side of the liquid absorption surface, and the power connection portion extends from the base to the atomization surface and contacts the electrode terminal.

16. The atomizing device according to claim 15, characterized in that The power connection portion includes a first connecting piece and a second connecting piece, the first connecting piece connects the base and the second connecting piece, the second connecting piece is bent relative to the first connecting piece and is located on one side of the atomization surface, and the second connecting piece is used to contact the electrode terminal.

17. The atomizing device according to claim 1, characterized in that The heating element is a metal heating element.

18. The atomizing device according to claim 17, characterized in that The heating element is a stainless steel heating element or an aluminum heating element.

19. The atomizing device according to claim 1, characterized in that: The heating element is formed by a die-casting process and / or a stamping process.

20. The atomizing device according to claim 1, characterized in that The atomizing device further comprises a mounting seat, in which the heating body and the heating element are both mounted.

21. The atomizing device according to claim 1, characterized in that The atomizing device further comprises a shell, in which an atomizing matrix is ​​arranged. At 25° C., the viscosity of the atomizing matrix is ​​greater than 10,000 cps.

22. An atomizing device, characterized in that: include: Host; and The atomizing device according to any one of claims 1 to 21, wherein the atomizing device is connected to the host.

23. A heating element for an atomizing device, the atomizing device comprising a heating element, the heating element comprising a liquid absorbing surface and an atomizing surface opposite to the liquid absorbing surface, the heating element forming a flow channel penetrating the liquid absorbing surface and the atomizing surface, characterized in that: The heating element is configured to be at least partially located on one side of the liquid absorbing surface, and the maximum height of the heating element from the liquid absorbing surface is greater than 0.5 mm.

24. The heating element according to claim 23, characterized in that The heating element includes a base and an extension portion, wherein the base is arranged close to the heating element, and the extension portion extends from the base in a direction away from the heating element, and a maximum height of the extension portion from the liquid absorption surface is greater than 0.5 mm.

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