Dynamic body temperature adjusting device and method

Abstract

The invention discloses a dynamic body temperature adjusting device and method. The device comprises a first shell, a partition plate, a temperature conducting piece, a semiconductor chilling plate, a cooling fan, a circuit board, a temperature collecting piece, a power source piece, a second shell and a fixing band. The semiconductor chilling plate is adopted as a refrigeration source, the temperature is collected in real time through the temperature collecting part, the refrigeration efficiency is intelligently matched through the control element, the cooling rate is more comfortable, and discomfort caused by rapid cooling or slow cooling is avoided; the temperature influence between the heat dissipation cavity and the electric control cavity is reduced through the arranged partition plate; and the cooling fan can be prevented from blowing hot air to the electric control cavity, and the service life of the whole device is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature detection and regulation equipment, and in particular to a dynamic body temperature regulation device and regulation method. Background Art

[0002] With the development of medicine, physical cooling is becoming more and more popular. Traditional physical cooling mostly uses ice packs or hydrogel products. In addition to requiring human intervention, these products also have the problem of not being able to stop cooling or improve cooling efficiency. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a dynamic body temperature adjustment device, which can reduce the trouble of human intervention in cooling and can adjust the cooling power according to the real-time temperature detection situation.

[0004] The present invention also provides a regulation method using the dynamic body temperature regulation device.

[0005] According to a first aspect of the present invention, a dynamic body temperature regulation device comprises a first shell, a partition, a thermal conductive plate, a semiconductor refrigeration plate, a heat dissipation fan, a circuit board, a temperature collection component, a power supply component, a second shell and a fixing belt: the first shell is arranged in an arc shape, and a heat dissipation cavity and an electric control cavity are arranged in the direction in which the arc extends in the first shell, and a plug interface is arranged between the heat dissipation cavity and the electric control cavity, and a mounting port is opened at the concave arc end of the first shell, and the mounting port is connected to the heat dissipation cavity; a partition is plugged into the plug interface, and the partition is used to block the heat dissipation cavity and the electric control cavity; the thermal conductive plate comprises a mounting part and an application part, and the mounting part is connected to the application part through a connecting neck, and the mounting part is connected in the heat dissipation cavity, and the connecting neck and the application part both extend out of the heat dissipation cavity, and the connecting neck and the application part are arranged at the concave arc end, and the mounting part, the connecting neck and the application part are integrally formed and made of heat dissipation material; the semiconductor refrigeration plate is arranged in the heat dissipation cavity, The cold end of the semiconductor refrigeration chip is mounted on the mounting portion; the heat dissipation fan is mounted on the hot end of the semiconductor refrigeration chip; the circuit board is mounted in the electric control cavity, the circuit board is integrated with a control element and a signal emitting element, and the semiconductor refrigeration chip and the heat dissipation fan are both electrically connected to the circuit board; a temperature collection component is electrically connected to the circuit board, the temperature collection component is mounted in the electric control cavity, the collection end of the temperature collection component extends out of the electric control cavity, and the temperature collection component is used to collect temperature; a power supply component is electrically connected to the circuit board, and the power supply is used to power the semiconductor refrigeration chip, the heat dissipation fan, the control element, the signal emitting element and the temperature collection component; a second shell is snap-connected to the first shell, and the second shell is used to cooperate with the first shell to encapsulate the heat dissipation cavity and the electric control cavity; a fixing belt is sleeved on the connecting neck, the fixing belt is used to fix the first shell, and the fixing belt separates the mounting portion and the application portion.

[0006] A dynamic body temperature regulation device according to an embodiment of the present invention has at least the following beneficial effects: the first shell and the second shell constitute the outer shell of the entire device, the thermal conductive sheet and the cooling fan cooperate to achieve cooling and heat dissipation, the arc design of the outer shell cooperates with the fixing belt so that the entire device can better fit the curve of the measured part, increase the fitting area, improve the measurement accuracy and the cooling area, the connection method between the connecting neck of the thermal conductive sheet and the fixing belt is convenient and fast, and the fixing belt can also separate the mounting part and the application part to avoid temperature cross-talk; the partition is set to reduce the temperature influence between the heat dissipation cavity and the electric control cavity, and can prevent the cooling fan from blowing hot air to the electric control cavity, thereby ensuring the service life of the entire device; the semiconductor refrigeration sheet is used as the cooling source, the temperature acquisition component is used to collect the temperature in real time, and the control element is used to intelligently match the cooling efficiency to achieve a more comfortable cooling rate and avoid the discomfort caused by rapid or slow cooling.

[0007] According to some embodiments of the present invention, the temperature collector includes a patch-type temperature collector or a radiation-type temperature collector. The patch-type temperature collector and the radiation-type temperature collector can be purchased directly, which is convenient for installation and use.

[0008] According to some embodiments of the present invention, the fixing belt comprises an elastic belt, and the fixing belt is connected to the application part via snaps. The snap connection is more stable, and the fixing belt can be used as a consumable and can be replaced.

[0009] According to some embodiments of the present invention, a skin-friendly layer is provided on one side of the elastic band close to the application portion, and the skin-friendly layer makes wearing more comfortable.

[0010] According to some embodiments of the present invention, the circuit board is a flexible board, and the circuit board is fixedly connected to the first shell by screws.

[0011] According to some embodiments of the present invention, the thermal conductive sheet is made of copper, aluminum or graphene.

[0012] According to some embodiments of the present invention, a silver layer is provided on one side of the mounting portion for mounting the semiconductor refrigeration sheet, and the silver layer is provided to quickly absorb temperature so that the copper metal part can better transfer cold.

[0013] According to some embodiments of the present invention, the application portion is provided with an escape opening, and the temperature collection member extends from the electric control cavity and is placed in the escape opening.

[0014] According to some embodiments of the present invention, the power supply component is detachably connected to the first shell, so as to facilitate replacement of the power supply component.

[0015] A dynamic body temperature regulation method according to a second aspect of an embodiment of the present invention uses a dynamic body temperature regulation device, comprising the following steps: S1, prepare a plurality of the dynamic body temperature regulating devices, and put the fixing belts on the temperature-measured parts as needed; S2, a temperature threshold is preset in the control element. When the temperature is higher than the threshold, the control element controls the semiconductor refrigeration chip to cool and controls the cooling fan to start. When the temperature changes, the control element controls the cooling capacity of the semiconductor refrigeration chip to increase or decrease according to a preset curve and controls the speed of the cooling fan to increase or decrease. When the temperature reaches a suitable range, the control element controls the semiconductor refrigeration chip and the cooling fan to stop working. S3, taking a terminal device, connecting the signal transmitting element through the terminal device, and monitoring or manually controlling the status of the semiconductor refrigeration plate and the cooling fan through the terminal device.

[0016] A dynamic body temperature regulation method according to an embodiment of the present invention has at least the following beneficial effects: according to this method, the semiconductor refrigeration sheet is used as the cooling source, the temperature collection component is used to collect the temperature in real time, and the control element is used to intelligently match the cooling efficiency to achieve a more comfortable cooling rate and avoid the discomfort caused by rapid or slow cooling. At the same time, the signal emitting element is connected through the terminal device to realize data sharing, and the device can also be controlled or monitored through the terminal device for easy use.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 It is a schematic cross-sectional view of a dynamic body temperature regulating device according to an embodiment of the present invention; Figure 2 for Figure 1 An exploded view of the cross-sectional structure of the dynamic temperature regulation device is shown; Figure 3 for Figure 2 The enlarged view of point A in the middle; Figure 4 for Figure 1 The structural schematic diagram of the temperature conducting plate of the dynamic body temperature regulating device is shown; Figure 5 for Figure 1 The dynamic thermoregulation device shown includes a schematic diagram of a fixing belt; Figure 6 for Figure 5 Enlarged view of point B in the middle.

[0019] A first shell 100a and a second shell 100b; Heat dissipation cavity 110, electric control cavity 120, plug-in port 130, installation port 140; Partition 200, thermal conductive sheet 300, mounting portion 310; The application portion 320, the avoidance opening 321, and the connecting neck 330; Semiconductor cooling sheet 400, cooling fan 500; Circuit board 600, control element 610, signal transmitting element 620; Temperature collection component 700 , power supply component 800 , and fixing belt 900 . DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0023] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0024] Reference Figures 1 to 6According to the first aspect of the present invention, a dynamic body temperature adjustment device includes a first shell 100a, a partition 200, a thermal conductive sheet 300, a semiconductor refrigeration sheet 400, a heat dissipation fan 500, a circuit board 600, a temperature collection component 700, a power supply component 800, a second shell 100b and a fixing belt 900: the first shell 100a is arranged in an arc shape, and the first shell 100a is provided with a heat dissipation cavity 110 and an electric control cavity 120 along the direction in which the arc extends, and a plug interface 130 is provided between the heat dissipation cavity 110 and the electric control cavity 120, and a mounting port 140 is provided at the concave arc end of the first shell 100a, and the mounting port 140 is connected to the heat dissipation cavity 110; the partition 200 is plugged into the plug interface 130, and the partition 200 is used to block the heat dissipation cavity 110. 0 and the electric control cavity 120; the thermal conductive sheet 300 includes a mounting portion 310 and an application portion 320, the mounting portion 310 is connected to the application portion 320 through a connecting neck 330, the mounting portion 310 is connected in the heat dissipation cavity 110, the connecting neck 330 and the application portion 320 both extend out of the heat dissipation cavity 110, the connecting neck 330 and the application portion 320 are arranged at the concave arc end, the mounting portion 310, the connecting neck 330 and the application portion 320 are integrally formed and made of heat dissipation material; the semiconductor cooling sheet 400 is arranged in the heat dissipation cavity 110, and the cold end of the semiconductor cooling sheet 400 is mounted on the mounting portion 310; the heat dissipation fan 500 is mounted on the hot end of the semiconductor cooling sheet 400; the circuit board 600 is installed in the electric control cavity 120, and the circuit board 600 is integrated with a control The element 610 and the signal transmitting element 620, the semiconductor cooling sheet 400 and the cooling fan 500 are all electrically connected to the circuit board 600; the temperature collecting component 700 is electrically connected to the circuit board 600, the temperature collecting component 700 is installed in the electric control cavity 120, the collecting end of the temperature collecting component 700 extends out of the electric control cavity 120, and the temperature collecting component 700 is used to collect temperature; the power supply component 800 is installed in the electric control cavity 120. It should be noted that the power supply component 800 can also be installed separately on the fixing belt 900, and a pocket or a hardware installation shell specially installed for the power supply component 800 is provided on the fixing belt 900, which is connected to the snap button through a wire, and the snap button is used to power the circuit board 600, or it is directly connected to the circuit board 600 with a wire for powering, and the wire is in The concealment method and waterproof setting in the fixing belt 900 are adaptively designed according to the needs of the field. For example, the wire is embedded in the fixing belt 900, and the side seam of the wire extending out of the fixing belt 900 is sewn or sealed with glue. The power supply unit 800 is connected to the wire by magnetic attraction, or fixed by a common spring clamping to connect the power supply unit 800 and the wire. The power supply unit 800 is electrically connected to the circuit board 600, and the power supply is used to supply power to the semiconductor cooling sheet 400, the cooling fan 500, the control element 610, the signal transmitting element 620 and the temperature collecting element 700; the second shell 100b is snap-connected to the first shell 100a, and the second shell 100b is used to cooperate with the first shell 100a to encapsulate the heat dissipation cavity 110 and the electric control cavity 120;The fixing belt 900 is sleeved on the connecting neck 330, and is used to fix the first shell 100a. The fixing belt 900 separates the mounting portion 310 and the application portion 320. ;

[0025] It should be understood that the first shell 100a and the second shell 100b constitute the outer shell of the entire device, and the thermal conductive sheet 300 and the cooling fan 500 are used to achieve cooling and heat dissipation. The arc design of the outer shell cooperates with the fixing belt 900 to enable the entire device to better fit the curve of the measured part, increase the fitting area, and improve the measurement accuracy and cooling area. The connection method between the connecting neck 330 of the thermal conductive sheet 300 and the fixing belt 900 is convenient and fast, and the fixing belt 900 can also separate the mounting part 310 and the application part 320 to avoid temperature cross-talk; the partition 200 is set to reduce the temperature influence between the heat dissipation cavity 110 and the electric control cavity 120, and can prevent the cooling fan 500 from blowing hot air to the electric control cavity 120, thereby ensuring the service life of the entire device; a semiconductor refrigeration sheet 400 is used as a cooling source, and a temperature collection component 700 is used to collect temperature in real time. The control element 610 is used to intelligently match the cooling efficiency to achieve a more comfortable cooling rate and avoid the discomfort caused by rapid or slow cooling.

[0026] It should be understood that the heat dissipation fan 500 is a miniature heat dissipation fan, which is commonly used for mobile phone heat dissipation, etc. A heat dissipation port is opened on the second shell 100b, and the heat dissipation port is connected to the heat dissipation cavity 110; in order to achieve heat dissipation of the electric control cavity 120, the electric control cavity 120 is also provided with a corresponding heat dissipation port, and the electric control cavity 120 is mainly cooled by natural air.

[0027] It can be understood that the semiconductor refrigeration chip 400 is a current transducer type chip. By controlling the input current, high-precision temperature control can be achieved to improve or reduce the refrigeration efficiency. Coupled with temperature detection and control means, it is easy to achieve remote control, program control, and computer control, which is convenient for forming an automatic control system. The semiconductor refrigeration chip 400 has very small thermal inertia and a very fast cooling and heating time. When the hot end dissipates heat well and the cold end is unloaded, cooling begins within less than 5 seconds after power-on, and the refrigeration chip can reach the maximum temperature difference within 1 minute. It can be powered on for cooling at any time and powered off to stop cooling at any time. The power of a single refrigeration element pair of the semiconductor refrigeration chip 400 is very small, so the cooling power can be a few milliwatts, which can be safely used on the human body.

[0028] It can be understood that the circuit board 600, the control element 610 and the signal transmitting element 620 are all conventional devices, and their electrical connection relationship can be made by technical personnel in this field according to needs. The control element 610 includes a PLC or a microcomputer and other systems that can complete data integration and control. The system measures the temperature in real time through the temperature acquisition component 700, thereby capturing the temperature change of the human body when the human body has a fever, and matches the cooling power of the semiconductor refrigeration plate 400 according to the change, so as to quickly and comfortably reduce the human body temperature.

[0029] The specific process is: When the system detects that the body temperature rises, the semiconductor cooling chip 400 obtains a larger voltage or current through the program control implanted in the control element 610, thereby improving the cooling efficiency and providing the human body with more cold sources to balance the body temperature.

[0030] When the system detects that the temperature of the human body tends to drop slowly, the system controls the semiconductor cooling chip 400 to reduce the voltage or current, thereby reducing the cooling efficiency and reducing the cold source provided to the human body to provide comfort.

[0031] When the system detects that the human body does not have a fever, the semiconductor refrigeration chip 400 is powered off through program control to stop providing cold source to the human body. When the body temperature is detected to rise again, the semiconductor refrigeration chip 400 is started again through the program, thereby realizing intelligent cooling according to the change of body temperature.

[0032] Among them, the signal transmitting element 620 includes a conventional Bluetooth component or a WiFi component. This signal transmitting element 620 is conventional and commonly used in various remote control occasions, such as a smart plug that can be connected to a mobile phone. Here, the existing signal transmitting element 620 is used on the circuit board to achieve remote control and detection. The purpose is to allow the guardian to remotely monitor the baby when wearing it, avoid running back and forth at night to check, and improve the convenience of baby care.

[0033] In some implementations, the temperature collector 700 includes a patch-type temperature collector or a radiation-type temperature collector. The patch-type temperature collector and the radiation-type temperature collector can be purchased directly, which is convenient for installation and use.

[0034] Reference Figure 5 and Figure 6 The fixing belt 900 includes an elastic belt, and the fixing belt 900 is connected to the application portion 320 via snaps. The snap connection is more stable, and the fixing belt 900 can be used as a consumable and can be replaced.

[0035] In some implementations, a skin-friendly layer is provided on one side of the elastic band close to the application portion 320, and the skin-friendly layer makes wearing more comfortable. In some embodiments, the skin-friendly layer is made of a silicone layer, which can absorb heat and prevent the conventional fluffy skin-friendly layer from producing flying hairs that are accidentally breathed into the lungs. Of course, the skin-friendly layer can also be made of ordinary cotton fabrics or skin-friendly chemical fiber fabrics.

[0036] In some implementations, the circuit board 600 is a flexible board, and the circuit board 600 is fixedly connected to the first housing 100a by screws. The circuit board 600 may also be a rigid board.

[0037] In some implementations, the thermal conductive sheet 300 is made of copper, aluminum, or graphene.

[0038] In some implementations, a silver layer is provided on one side of the mounting portion 310 for mounting the semiconductor cooling sheet 400. The silver layer is provided to quickly absorb temperature, so that the copper metal part can better transfer cold.

[0039] Reference Figure 1 The application portion 320 is provided with an avoidance opening 321, and the temperature collection component 700 extends from the electric control cavity 120 and is placed in the avoidance opening 321. It can be understood that when the temperature collection component 700 is a radiation temperature collector, it no longer extends out of the avoidance opening 321. The avoidance opening 321 provides a window for radiation collection. The so-called radiation temperature collector is similar to a forehead temperature gun, while the patch temperature collector is similar to a thermometer, which mainly detects temperature through a contact temperature sensor. Both of these are conventional and existing devices.

[0040] In some embodiments, the power supply component 800 is detachably connected to the first shell 100a to facilitate replacement of the power supply component 800. It can be understood that a charging interface is provided on the circuit board 600, and the charging interface is electrically connected to the power supply component 800. The charging interface is connected to a charger to charge the power supply component 800. The power supply component 800 is a rechargeable battery.

[0041] A dynamic body temperature regulation method according to a second aspect of an embodiment of the present invention uses a dynamic body temperature regulation device, comprising the following steps: S1, prepare several dynamic body temperature regulating devices, and put the fixing belt 900 on the temperature measured part as needed; S2, a temperature threshold is preset in the control element 610. When the temperature is higher than the threshold, the control element 610 controls the semiconductor refrigeration sheet 400 to cool and controls the cooling fan 500 to start. When the temperature changes, the control element 610 controls the cooling capacity of the semiconductor refrigeration sheet 400 to increase or decrease according to a preset curve and controls the speed of the cooling fan 500 to increase or decrease. When the temperature reaches a suitable range, the control element 610 controls the semiconductor refrigeration sheet 400 and the cooling fan 500 to stop working. S3, take a terminal device, connect the signal transmitting element 620 through the terminal device, monitor or manually control the status of the semiconductor refrigeration plate 400 and the cooling fan 500 through the terminal device. It can be understood that the terminal device can be a desktop computer or a mobile device such as a mobile phone or a tablet.

[0042] A dynamic body temperature regulation method according to an embodiment of the present invention has at least the following beneficial effects: according to this method, a semiconductor refrigeration sheet 400 is used as a cooling source, a temperature collection component 700 is used to collect temperature in real time, and a control element 610 is used to intelligently match the cooling efficiency to achieve a more comfortable cooling rate and avoid the discomfort caused by rapid or slow cooling. At the same time, a signal transmitting element 620 is connected through a terminal device to achieve data sharing, and the device can also be controlled or monitored through the terminal device for easy use.

[0043] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A dynamic body temperature regulation device, characterized in that: include: The first shell (100a) is arranged in an arc shape, a heat dissipation cavity (110) and an electric control cavity (120) are arranged on the first shell (100a) along the direction in which the arc extends, an insertion port (130) is arranged between the heat dissipation cavity (110) and the electric control cavity (120), and a mounting port (140) is provided at a concave arc end of the first shell (100a), the mounting port (140) being connected to the heat dissipation cavity (110); A partition plate (200) is plugged into the plug port (130), and the partition plate (200) is used to block the heat dissipation cavity (110) and the electric control cavity (120); A thermal conductive sheet (300) comprising a mounting portion (310) and an application portion (320), wherein the mounting portion (310) is connected to the application portion (320) via a connecting neck (330), the mounting portion (310) is connected within the heat dissipation cavity (110), the connecting neck (330) and the application portion (320) both extend out of the heat dissipation cavity (110), the connecting neck (330) and the application portion (320) are arranged at the concave arc end, and the mounting portion (310), the connecting neck (330) and the application portion (320) are integrally formed and made of heat dissipation material; A semiconductor refrigeration sheet (400) is arranged in the heat dissipation cavity (110), and a cold end of the semiconductor refrigeration sheet (400) is mounted on the mounting portion (310); A heat dissipation fan (500) mounted on the hot end of the semiconductor cooling sheet (400); A circuit board (600) is installed in the electric control cavity (120), a control element (610) and a signal transmitting element (620) are integrated and installed on the circuit board (600), and the semiconductor cooling sheet (400) and the heat dissipation fan (500) are both electrically connected to the circuit board (600); a temperature collecting component (700) electrically connected to the circuit board (600), the temperature collecting component (700) being installed in the electric control cavity (120), a collecting end of the temperature collecting component (700) extending out of the electric control cavity (120), and the temperature collecting component (700) being used to collect temperature; a power supply component (800), electrically connected to the circuit board (600), the power supply being used to supply power to the semiconductor cooling sheet (400), the cooling fan (500), the control component (610), the signal transmitting component (620) and the temperature collecting component (700); A second shell (100b) is snap-connected to the first shell (100a), the second shell (100b) being used to cooperate with the first shell (100a) to encapsulate the heat dissipation cavity (110) and the electric control cavity (120); A fixing belt (900) is sleeved on the connecting neck (330), the fixing belt (900) is used to fix the first shell (100a), and the fixing belt (900) separates the mounting portion (310) and the application portion (320).

2. A dynamic body temperature regulation device according to claim 1, characterized in that: The temperature collecting component (700) comprises a patch-type temperature collector or a radiation-type temperature collector.

3. A dynamic body temperature regulation device according to claim 1, characterized in that: The fixing belt (900) comprises an elastic belt, and the fixing belt (900) is connected to the application portion (320) via a snap button.

4. A dynamic body temperature regulation device according to claim 3, characterized in that: A skin-friendly layer is provided on one side of the elastic band close to the application portion (320).

5. A dynamic body temperature regulation device according to claim 1, characterized in that: The circuit board (600) is a flexible board, and the circuit board (600) is fixedly connected in the first housing (100a) by means of screws.

6. A dynamic body temperature regulation device according to claim 1, characterized in that: The thermal conductive sheet (300) is made of copper, aluminum or graphene.

7. A dynamic body temperature regulation device according to claim 1, characterized in that: A silver layer is provided on one side of the mounting portion (310) for mounting the semiconductor cooling sheet (400).

8. A dynamic body temperature regulation device according to claim 1, characterized in that: The application portion (320) is provided with an escape opening (321), and the temperature collection member (700) extends from the electric control cavity (120) and is placed in the escape opening (321).

9. A dynamic body temperature regulation device according to claim 1, characterized in that: The power supply (800) is detachably connected in the first housing (100a).

10. A method for dynamic body temperature regulation, characterized in that: The dynamic body temperature regulation device according to claim 1 comprises the following steps: S1, preparing a plurality of the dynamic body temperature regulating devices, and putting the fixing belt (900) on the temperature-measured part as required; S2, a temperature threshold is preset in the control element (610); when the temperature is higher than the threshold, the control element (610) controls the semiconductor refrigeration chip (400) to cool, and controls the cooling fan (500) to start; when the temperature changes, the control element (610) controls the cooling capacity of the semiconductor refrigeration chip (400) to increase or decrease according to a preset curve, and controls the speed of the cooling fan (500) to increase or decrease; when the temperature reaches a suitable range, the control element (610) controls the semiconductor refrigeration chip (400) and the cooling fan (500) to stop working; S3, taking a terminal device, connecting to the signal transmitting element (620) via the terminal device, and monitoring or manually controlling the status of the semiconductor cooling plate (400) and the cooling fan (500) via the terminal device.

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