Flange processing and forging equipment
The combination of the eccentric striking component and the heat transfer protection component solves the cumbersome problem of die position adjustment in the forging of large neck flanges, achieves uniform hammering of the blank and waste chip cleaning, and improves the flange forging quality and ease of operation.
Patent Information
- Application Number
- CN202510046778.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2045-01-13
AI Technical Summary
During the forging process of large neck flanges, the die position adjustment is cumbersome, making it difficult to hammer the blank evenly, affecting the forming effect.
The eccentric striking component is used to drive the die to move and rotate, and the hammering frequency of the forging die is matched with the heat transfer protection component and the chip removal system to achieve uniform hammering of the billet and waste chip cleaning.
It improves the billet forming effect, reduces heat loss, improves flange forging quality, and simplifies the operation process.
Smart Images

Figure CN119525421B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of flange forging dies, in particular to flange processing and forging equipment. Background Art
[0002] Neck flange is a common pipe connection structure, usually used in pipeline systems. Its main feature is a protruding neck on the outer circumference of the flange. During the forging process of this flange, a red-hot cylindrical blank is usually placed in a neck die, and the forging blank is continuously struck by the forging top die to form the required forging.
[0003] However, for large neck flanges, as the blank is forged, the top surface area of the blank gradually increases, and the staff needs to constantly adjust the mold position so that the forging die head hammers along the outer edge of the blank. The operation is cumbersome and it is difficult to hammer the blank evenly, which affects the blank forming effect.
[0004] Therefore, a flange processing and forging equipment is proposed to solve the above problems. Summary of the Invention
[0005] (1) Technical problems solved
[0006] In response to the shortcomings of the existing technology, the present invention provides a flange processing and forging equipment, which automatically moves the mold to a position deviating from the bottom of the forging mold and drives the blank to rotate. Combined with a certain hammering frequency of the forging mold, the forging blank can be hammered evenly, thereby improving the blank forming effect. It is simple to operate, so as to solve the problems raised in the above background technology.
[0007] (2) Technical solution
[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a flange processing and forging device, comprising:
[0009] mold base;
[0010] The eccentric knocking assembly is arranged on the top of the mold base, and the eccentric knocking assembly includes a driving motor 1, and the driving motor 1 is fixedly installed on the left side of the mold base, and the output end of the driving motor 1 is fixedly connected to the first gear, the top surface of the first gear is provided with an eccentric groove, and an eccentric slide is provided above the eccentric groove, and the bottom surface of the eccentric slide is fixedly connected with a transmission pin, and the transmission pin is slidably connected to the inner surface of the eccentric groove, and the front and rear sides of the eccentric slide are fixedly connected to the slide, and the front and rear sides of the mold base are provided with a first slide groove, and the slide is slidably connected to the inner surface of the first slide groove, and the outer edge of the first gear is meshed with the second gear, and the center of the second gear is fixedly plugged with a rotating shaft, the bottom end of the rotating shaft is rotatably connected to the mold base, and the top end of the rotating shaft is fixedly sleeved with a friction wheel;
[0011] A chip removal chassis, the chip removal chassis is fixedly mounted on the top surface of the eccentric slide, the middle portion of the chip removal chassis is rotatably connected to a flange neck mold, a hidden annular groove is concentrically provided on the flange neck mold, at least one first telescopic drive rod is fixedly mounted in the hidden annular groove, the top end of the first telescopic drive rod is fixedly connected to a flange mold, and the flange mold is movably inserted into the hidden annular groove;
[0012] The heat transfer prevention component is arranged on the chip removal chassis, the flange neck mold is fixedly connected to the heat transfer prevention component, and the flange neck mold is located inside the heat transfer prevention component;
[0013] A forging die is disposed on top of the heat transfer prevention assembly.
[0014] Preferably, the eccentric groove is a combination of a fan shape and a V shape, and the V-shaped segment opens outward, and the number of teeth of the first gear is greater than the number of teeth of the second gear.
[0015] Preferably, when the flange mold is retracted into the hidden annular groove, the top surface of the flange mold is flush with the top surface of the flange neck mold.
[0016] Preferably, the heat transfer prevention assembly includes a first ring cover, the bottom surface of the first ring cover is in contact with the top surface of the chip removal chassis, the interior of the first ring cover is inlaid with a second telescopic drive rod, the top of the second telescopic drive rod is fixedly connected to the second ring cover, the side wall of the second ring cover is provided with an inner view transparent plate, the top of the second ring cover is slidably connected to a slide plate, the sliding direction of the slide plate is parallel to the sliding direction of the eccentric slide seat, and the slide plate can always keep the top of the second ring cover closed, the middle part of the slide plate is rotatably connected to the mold barrel, the inner wall of the mold barrel is provided with a second slide groove, the top of the forging die side wall is fixedly connected to a slider, the slider can slide up and down along the inner surface of the second slide groove, the forging die is movably inserted in the mold barrel, the bottom of the inner wall of the first ring cover is fixedly connected to a fixed scraper, and the end of the fixed scraper away from the first ring cover is fixedly connected to the flange neck mold.
[0017] Preferably, the first ring cover and the second ring cover are concentric and have the same radius, and the surfaces of the first ring cover, the second ring cover, the slide plate and the mold cylinder are all provided with a heat insulation layer.
[0018] Preferably, the flange neck mold is provided with an in-mold chip removal component, and the in-mold chip removal component includes a chip cleaning gear ring, which is concentrically connected to the top of the flange neck mold, and the flange plate mold is located in the middle of the chip cleaning gear ring, and the top surface of the chip cleaning gear ring is evenly circumferentially provided with multiple air pumps, and the output end of the air pump is fixedly connected to a chip removal nozzle, the side wall of the flange neck mold is fixedly connected to a side plate, and the side plate is fixedly connected to a second drive motor, and the output end of the second drive motor is fixedly connected to a third gear, and the chip cleaning gear ring is meshed with the third gear.
[0019] Preferably, the direction of the airflow ejected by the chip removal nozzle forms an angle with the diameter of the chip cleaning gear ring.
[0020] Preferably, an off-mold chip removal assembly is provided on one side of the chip removal chassis, and the off-mold chip removal assembly includes a chip removal groove opened on one side of the chip removal chassis, the top of the chip removal groove is rotatably connected to a chip removal plate, a return spring is provided between the bottom surface of the chip removal plate and the bottom surface of the chip removal groove, the top surface of the return spring is fixedly connected to a ladder frame, and the bottom surface of the fixed scraper is in contact with the top surface of the chip removal chassis.
[0021] Preferably, the top surface of the chip removal plate can be flush with the top surface of the chip removal chassis through the elastic force of the reset spring, and the middle part of the ladder frame is hollow.
[0022] (3) Beneficial effects
[0023] Compared with the prior art, the present invention provides a flange processing and forging device with the following beneficial effects:
[0024] 1. The present invention drives the first gear to rotate by driving a motor. The eccentric groove on the first gear first drives the eccentric slide to the right through the transmission pin until the first ring cover is frictionally fitted with the friction wheel. At this time, the forging die is located above the outer edge of the blank. The second gear is rotated by the meshing transmission of the first gear, driving the friction wheel to rotate. The friction wheel then friction-drives the flange neck die and the top surface blank to rotate. The outer edge part is evenly hammered and forged by the forging die. After the eccentric groove rotates one circle, the blank is moved to its original position. Using the above structure, the die is automatically moved to a position deviating from the bottom of the forging die, and the blank is driven to rotate. Combined with a certain hammering frequency of the forging die, the forging blank can be evenly hammered, thereby improving the blank forming effect and simple operation.
[0025] 2. The present invention contracts the first telescopic drive rod to engage the first ring cover and the second ring cover with each other, and cooperates with the die barrel and the forging die to place the blank in a sealed environment. The heat dissipated by the blank itself is sealed and insulated, reducing heat loss, thereby reducing the temperature difference on the surface of the blank and improving the forging quality of the flange blank to a certain extent.
[0026] 3. The present invention circulates the gas in the heat transfer protection component through an air pump and sprays it obliquely through a chip removal nozzle. At the same time, the third gear is driven to rotate by driving motor 2, and then the third gear engages with the chip cleaning gear ring to rotate the chip removal nozzle, so that the jet air flow itself directly acts on the waste chips and generates centrifugal force on the waste chips, thereby cleaning the waste chips from the top surface of the flange neck mold, thereby reducing the waste chips between the flange plate mold and the blank, and further improving the quality of the neck flange forging.
[0027] 4. The present invention accumulates the waste chips between the first ring cover and the flange neck mold and scrapes them to the top of the chip discharge groove through the fixed scraper. At the same time, the fixed scraper is squeezed along the inclined surface of the ladder frame, driving the chip discharge plate to rotate downward. At this time, the waste chips slide along the surface of the chip discharge plate to the top surface of the eccentric slide. After the fixed scraper passes the ladder frame, the reset spring resets and rebounds, so that the chip discharge plate is flush with the top surface of the chip discharge chassis, so that the heat transfer protection component continues to be sealed, and then the waste chips are discharged from the surface of the eccentric slide for cleaning. The above structure is used to automatically discharge the waste chips between the first ring cover and the flange neck mold, avoiding the accumulation of waste chips in the first ring cover to generate large dust. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a three-dimensional diagram of the main structure of the present invention;
[0029] Figure 2 This is a cross-sectional view of the main structure of the present invention;
[0030] Figure 3 This is a structural diagram of the flange neck mold, hidden ring groove, first telescopic drive rod and flange plate mold of the present invention;
[0031] Figure 4 This is an exploded view of the eccentric striking assembly structure of the present invention;
[0032] Figure 5 A top view of the related structure of the first gear, eccentric groove, transmission pin and second gear of the present invention;
[0033] Figure 6 This is a structural diagram of the heat transfer prevention assembly and the forging die of the present invention;
[0034] Figure 7 For the present invention Figure 3 A magnified view of the structure of the middle A area;
[0035] Figure 8 This is a structural diagram related to the out-of-mold chip removal component of the present invention.
[0036] Reference numerals:
[0037] 1. Mold base;
[0038] 2. Eccentric striking assembly; 21. Drive motor 1; 22. First gear; 23. Eccentric slot; 24. Eccentric slide; 25. Transmission pin; 26. Slide; 27. First slide; 28. Second gear; 29. Rotating shaft; 210. Friction wheel;
[0039] 3. Chip removal chassis;
[0040] 4. Flange neck mold; 41. Hidden ring groove; 42. First telescopic drive rod; 43. Flange plate mold;
[0041] 5. Heat transfer prevention assembly; 51. First ring cover; 52. Second telescopic drive rod; 53. Second ring cover; 54. Inner transparent plate; 55. Slide plate; 56. Mold cylinder; 57. Second chute; 58. Fixed scraper;
[0042] 6. Forging die; 61. Slider;
[0043] 7. In-mold chip removal assembly; 71. Chip cleaning gear ring; 72. Air pump; 73. Chip removal nozzle; 74. Side plate; 75. Drive motor 2; 76. Third gear;
[0044] 8. External chip removal assembly; 81. Chip removal groove; 82. Chip removal plate; 83. Return spring; 84. Ladder frame. DETAILED DESCRIPTION
[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0046] The present invention will be described in further detail below with reference to the accompanying drawings and examples.
[0047] Example 1, please refer to Figures 1 to 5 As shown:
[0048] To solve the problems mentioned in the technical solution, the embodiment of the present application provides a flange processing and forging device, including:
[0049] Mold base 1;
[0050] The eccentric knocking assembly 2 is arranged on the top of the mold base 1, and the eccentric knocking assembly 2 includes a driving motor 21, which is fixedly installed on the left side of the mold base 1. The output end of the driving motor 21 is fixedly connected to the first gear 22, and the top surface of the first gear 22 is provided with an eccentric groove 23. An eccentric slide 24 is provided above the eccentric groove 23. The bottom surface of the eccentric slide 24 is fixedly connected with a transmission pin 25, and the transmission pin 25 is slidably connected to the inner surface of the eccentric groove 23. The front and rear sides of the eccentric slide 24 are fixedly connected with a slide 26. The front and rear sides of the mold base 1 are provided with a first slide 27. The slide 26 is slidably connected to the inner surface of the first slide 27. The outer edge of the first gear 22 is meshed with the second gear 28. A rotating shaft 29 is fixedly inserted at the center of the second gear 28. The bottom end of the rotating shaft 29 is rotatably connected to the mold base 1, and the top of the rotating shaft 29 is fixedly sleeved with a friction wheel 210.
[0051] The chip removal chassis 3 is fixedly mounted on the top surface of the eccentric slide 24. The middle part of the chip removal chassis 3 is rotatably connected to a flange neck mold 4. A hidden annular groove 41 is concentrically provided on the flange neck mold 4. At least one first telescopic drive rod 42 is fixedly mounted in the hidden annular groove 41. The top end of the first telescopic drive rod 42 is fixedly connected to a flange mold 43. The flange mold 43 is movably inserted into the hidden annular groove 41.
[0052] The heat transfer prevention component 5 is arranged on the chip removal chassis 3, the flange neck mold 4 is fixedly connected to the heat transfer prevention component 5, and the flange neck mold 4 is located inside the heat transfer prevention component 5;
[0053] a forging die 6, which is arranged on top of the heat transfer prevention component 5;
[0054] Among them, the flange neck mold 4 is used for flange neck forming, and the flange plate mold 43 is used for flange plate forming; the first telescopic drive rod 42 can drive the flange plate mold 43 to rise and fall, which is convenient for cleaning the oxidized waste forged from the surface of the blank before forming, thereby improving the quality of flange forging, and can also expose the blank after forging to the outside, without pouring the blank out of the mold, thereby facilitating the removal of the blank; the flange plate mold 43 rises after the blank has been forged for a period of time, which can make the distance between the blank and the flange plate mold 43 smaller, thereby reducing waste chips falling into the flange plate mold 43.
[0055] Preferably, the eccentric groove 23 is a combination of a sector shape and a V-shape, with the V-shaped segment opening outward, and the number of teeth of the first gear 22 is greater than the number of teeth of the second gear 28;
[0056] Specifically, the V-shaped portion of the eccentric groove 23 is used to drive the eccentric slide 24 to slide back and forth, and the fan-shaped segment is used to keep the eccentric slide 24 deviated from the bottom of the forging die 6; after the eccentric slide 24 slides to the right until the anti-heat transfer component 5 contacts the friction wheel 210, the friction wheel 210 can drive the flange neck die 4, the anti-heat transfer component 5 and the blank to rotate synchronously, so that the forging die 6 can evenly hammer the outer edge of the blank.
[0057] Preferably, when the flange mold 43 is retracted into the hidden annular groove 41 , the top surface of the flange mold 43 is flush with the top surface of the flange neck mold 4 .
[0058] For further example 2, please refer to Figure 6 As shown:
[0059] The heat transfer prevention assembly 5 includes a first ring cover 51, the bottom surface of the first ring cover 51 is in contact with the top surface of the chip removal chassis 3, and a second telescopic driving rod 52 is embedded in the interior of the first ring cover 51. The top of the second telescopic driving rod 52 is fixedly connected to the second ring cover 53, and the side wall of the second ring cover 53 is provided with an inner transparent plate 54. The top of the second ring cover 53 is slidably connected to a slide plate 55, and the sliding direction of the slide plate 55 is parallel to the sliding direction of the eccentric slide 24, and the slide plate 55 can always keep the top of the second ring cover 53 airtight. The middle part of the slide plate 55 is rotatably connected to the mold barrel 56, and the inner wall of the mold barrel 56 is provided with a second slide groove 57. The top of the side wall of the forging die 6 is fixedly connected to a slider 61, and the slider 61 can slide up and down along the inner surface of the second slide groove 57. The forging die 6 is movably inserted into the mold barrel 56. The bottom of the inner wall of the first ring cover 51 is fixedly connected to a fixed scraper 58, and the end of the fixed scraper 58 away from the first ring cover 51 is fixedly connected to the flange neck mold 4;
[0060] When the first ring cover 51 and the second ring cover 53 are put together, a closed space is formed to keep the blank warm and insulate it, thereby ensuring that the surface temperature of the blank is uniform when the forging environment temperature is low, improving the quality of flange forging, and preventing forging waste from splashing and scalding workers.
[0061] When in use, the forging die 6 is connected to the vertical hammer hydraulic system. Through the arrangement of the slide plate 55 and the die cylinder 56, the forging die 6 always remains in the original position and performs vertical hammer forging while the first ring cover 51 moves to the right.
[0062] By extending the second telescopic driving rod 52, the first ring cover 51 and the second ring cover 53 can be separated, thereby facilitating the insertion of the blank and the removal of the flange forging;
[0063] By providing the inner viewing transparent plate 54, the staff can observe the forging of the neck flange.
[0064] Preferably, the first ring cover 51 and the second ring cover 53 are concentric and have the same radius, and the surfaces of the first ring cover 51, the second ring cover 53, the slide plate 55 and the mold cylinder 56 are all provided with a heat insulation layer.
[0065] For further example 3, please refer to Figure 3 and Figure 7 As shown:
[0066] An in-mold chip removal component 7 is provided on the flange neck mold 4. The in-mold chip removal component 7 includes a chip cleaning tooth ring 71. The chip cleaning tooth ring 71 is concentrically connected to the top of the flange neck mold 4, and the flange plate mold 43 is located in the middle of the chip cleaning tooth ring 71. A plurality of air pumps 72 are evenly circumferentially provided on the top surface of the chip cleaning tooth ring 71. The output end of the air pump 72 is fixedly connected to a chip removal nozzle 73. The side wall of the flange neck mold 4 is fixedly connected to a side plate 74. A driving motor 2 75 is fixedly connected to the side plate 74. The output end of the driving motor 2 75 is fixedly connected to a third gear 76. The chip cleaning tooth ring 71 is meshed with the third gear 76.
[0067] Preferably, the direction of the airflow ejected by the chip removal nozzle 73 forms an angle with the diameter of the chip cleaning gear ring 71 .
[0068] Specifically, the air pump 72 is used to make the chip removal nozzle 73 spray airflow to clean the waste chips. The airflow rotates and sprays obliquely to drive the waste chips to generate a certain centrifugal force, thereby removing the waste chips from the surface of the flange neck mold 4. In addition, as the billet is forged, its diameter gradually increases, and the airflow is sprayed onto the billet surface and rebounds, which can also blow the waste chips off the top surface of the flange neck mold 4.
[0069] The air pump 72 and the chip removal nozzle 73 are both provided with filters to prevent waste chips from affecting their use.
[0070] For further example 4, please refer to Figure 6 and Figure 8 As shown:
[0071] An off-mold chip removal assembly 8 is provided on one side of the chip removal chassis 3. The off-mold chip removal assembly 8 includes a chip removal groove 81 opened on one side of the chip removal chassis 3. The top of the chip removal groove 81 is rotatably connected to a chip removal plate 82. A return spring 83 is provided between the bottom surface of the chip removal plate 82 and the bottom surface of the chip removal groove 81. The top surface of the return spring 83 is fixedly connected to a ladder frame 84. The bottom surface of the fixed scraper 58 is in contact with the top surface of the chip removal chassis 3.
[0072] Preferably, the top surface of the chip removal plate 82 can be flush with the top surface of the chip removal chassis 3 through the elastic force of the reset spring 83, and the middle part of the ladder frame 84 is hollow.
[0073] Specifically, as the first ring cover 51 and the flange neck mold 4 rotate, the fixed scraper 58 accumulates the waste chips along the top surface of the chip removal chassis 3 and pushes them to the chip removal groove 81. The fixed scraper 58 squeezes the ladder frame 84 to drive the chip removal plate 82 to rotate downward, and the waste chips slide down along the chip removal plate 82 to the top surface of the eccentric slide 24, thereby automatically discharging the waste chips in the first ring cover 51, avoiding the accumulation of waste chips in the first ring cover 51 and generating large dust.
[0074] Everything in the above example works as follows:
[0075] When in use, the hammer hydraulic system drives the forging die 6 to hammer forge the blank vertically first. As the forging progresses, the blank gradually flattens and its diameter becomes larger. Then, the first telescopic drive rod 42 is extended to extend the flange plate die 43 from the hidden ring groove 41, and then the driving motor 21 drives the first gear 22 to rotate. The eccentric groove 23 on the first gear 22 first drives the eccentric slide 24 to slide to the right through the transmission pin 25 until the first ring cover 51 and the friction wheel 210 are frictionally fitted. At this time, the forging die 6 is located above the outer edge of the blank, and the second gear 28 is rotated by the meshing transmission of the first gear 22, driving the friction wheel 210 to rotate, and then the friction wheel 210 frictionally drives the flange neck die 4 and its top surface blank to rotate, and the outer edge part is evenly hammered and forged by the forging die 6. After the eccentric groove 23 rotates one circle, the blank is moved to its original position;
[0076] In cold weather, during the forging process of the neck flange, the first telescopic drive rod 42 contracts, so that the first ring cover 51 and the second ring cover 53 are buckled together, and the die barrel 56 and the forging die 6 are matched to put the blank in a sealed environment. The heat dissipated by the blank itself is sealed and insulated, reducing heat loss, thereby reducing the temperature difference on the surface of the blank, and improving the forging quality of the flange blank to a certain extent;
[0077] Before the flange plate die 43 is raised, as the blank is forged, oxidized waste chips fall off the surface of the flange neck die 4. The gas in the heat transfer protection assembly 5 is circulated by the air pump 72 and sprayed obliquely through the chip removal nozzle 73. At the same time, the third gear 76 is driven to rotate by the second drive motor 75, and then the third gear 76 engages the chip cleaning gear ring 71 to rotate the chip removal nozzle 73, so that the jet air flow directly acts on the waste chips and generates centrifugal force on the waste chips, thereby cleaning the waste chips from the top surface of the flange neck die 4.
[0078] During the process of the friction wheel 210 driving the first ring cover 51 to rotate, the waste chips between the first ring cover 51 and the flange neck mold 4 are accumulated and scraped to the top of the chip discharge groove 81 through the fixed scraper 58. At the same time, the fixed scraper 58 is squeezed along the inclined surface of the ladder frame 84, driving the chip discharge plate 82 to rotate downward. At this time, the waste chips slide along the surface of the chip discharge plate 82 to the top surface of the eccentric slide 24. After the fixed scraper 58 passes the ladder frame 84, the reset spring 83 resets and rebounds, so that the chip discharge plate 82 is flush with the top surface of the chip discharge chassis 3, so that the heat transfer protection component 5 continues to remain sealed, and then the waste chips are discharged from the surface of the eccentric slide 24 for cleaning.
[0079] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.
[0080] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. A flange processing and forging equipment, characterized in that: include: mold base (1); An eccentric knocking assembly (2) is provided on the top of the mold base (1), and the eccentric knocking assembly (2) includes a driving motor (21), the driving motor (21) is fixedly installed on the left side of the mold base (1), the output end of the driving motor (21) is fixedly connected to a first gear (22), an eccentric groove (23) is provided on the top surface of the first gear (22), an eccentric slide (24) is provided above the eccentric groove (23), a transmission pin (25) is fixedly connected to the bottom surface of the eccentric slide (24), and the transmission pin (25) slides The eccentric slide (24) is movably connected to the inner surface of the eccentric groove (23), the front and rear sides of the eccentric slide (24) are fixedly connected with a slide (26), the front and rear sides of the mold base (1) are provided with a first slide groove (27), the slide (26) is slidably connected to the inner surface of the first slide groove (27), the outer edge of the first gear (22) is meshed with the second gear (28), the center of the second gear (28) is fixedly connected with a rotating shaft (29), the bottom end of the rotating shaft (29) is rotatably connected to the mold base (1), and the top end of the rotating shaft (29) is fixedly sleeved with a friction wheel (210); A chip removal chassis (3), the chip removal chassis (3) is fixedly mounted on the top surface of the eccentric slide (24), the middle portion of the chip removal chassis (3) is rotatably connected to a flange neck mold (4), a hidden annular groove (41) is coaxially provided on the flange neck mold (4), at least one first telescopic drive rod (42) is fixedly mounted in the hidden annular groove (41), the top end of the first telescopic drive rod (42) is fixedly connected to a flange mold (43), and the flange mold (43) is movably inserted into the hidden annular groove (41); The heat transfer prevention component (5) is provided on the chip removal chassis (3), the flange neck mold (4) is fixedly connected to the heat transfer prevention component (5), and the flange neck mold (4) is located in the heat transfer prevention component (5), the heat transfer prevention component (5) includes a first ring cover (51), the bottom surface of the first ring cover (51) is in contact with the top surface of the chip removal chassis (3), a second telescopic drive rod (52) is embedded in the interior of the first ring cover (51), the top of the second telescopic drive rod (52) is fixedly connected to the second ring cover (53), the side wall of the second ring cover (53) is provided with an inner view transparent plate (54), the top of the second ring cover (53) is slidably connected to a slide plate (55), and the heat transfer prevention component (55) includes a first ring cover (51), the bottom surface of the first ring cover (51) is in contact with the top surface of the chip removal chassis (3), a second telescopic drive rod (52) is embedded in the interior of the first ring cover (51), the top of the second telescopic drive rod (52) is fixedly connected to the second ring cover (53), the side wall of the second ring cover (53) is provided with an inner view transparent plate (54), and the top of the second ring cover (53) is slidably connected to the slide plate (55). The sliding direction of the slide plate (55) is parallel to the sliding direction of the eccentric slide seat (24), and the slide plate (55) can always keep the top of the second ring cover (53) sealed. The middle part of the slide plate (55) is rotatably connected to the mold barrel (56), and the inner wall of the mold barrel (56) is provided with a second slide groove (57). The top of the side wall of the forging die (6) is fixedly connected to a slider (61), and the slider (61) can slide up and down along the inner surface of the second slide groove (57). The forging die (6) is movably inserted into the mold barrel (56). The bottom of the inner wall of the first ring cover (51) is fixedly connected to a fixed scraper (58), and the end of the fixed scraper (58) away from the first ring cover (51) is fixedly connected to the flange neck die (4); A forging die (6) is provided on the top of the heat transfer protection component (5). When in use, the forging die (6) is connected to a vertical hammer hydraulic system. By arranging the slide plate (55) and the die barrel (56), the forging die (6) always remains in its original position to perform vertical hammer forging while the first ring cover (51) moves to the right.
2. The flange processing and forging equipment according to claim 1, characterized in that: The eccentric groove (23) is a combination of a sector shape and a V-shape, with the V-shaped segment opening outward, and the number of teeth of the first gear (22) is greater than the number of teeth of the second gear (28).
3. The flange processing and forging equipment according to claim 1, characterized in that: When the flange mold (43) is retracted into the hidden annular groove (41), the top surface of the flange mold (43) is flush with the top surface of the flange neck mold (4).
4. The flange processing and forging equipment according to claim 1, characterized in that: The first ring cover (51) and the second ring cover (53) are concentric and have the same radius, and the surfaces of the first ring cover (51), the second ring cover (53), the slide plate (55) and the mold cylinder (56) are all provided with a heat insulation layer.
5. The flange processing and forging equipment according to claim 1, characterized in that: The flange neck mold (4) is provided with an in-mold chip removal component (7), and the in-mold chip removal component (7) includes a chip cleaning tooth ring (71), the chip cleaning tooth ring (71) is coaxially connected to the top of the flange neck mold (4), and the flange plate mold (43) is located in the middle of the chip cleaning tooth ring (71), and the top surface of the chip cleaning tooth ring (71) is evenly circumferentially provided with a plurality of air pumps (72), the output end of the air pump (72) is fixedly connected to a chip removal nozzle (73), the side wall of the flange neck mold (4) is fixedly connected to a side plate (74), the side plate (74) is fixedly connected to a second drive motor (75), the output end of the second drive motor (75) is fixedly connected to a third gear (76), and the chip cleaning tooth ring (71) is meshed with the third gear (76).
6. The flange processing and forging equipment according to claim 5, characterized in that: The direction of the airflow ejected by the chip removal nozzle (73) forms an angle with the diameter of the chip cleaning gear ring (71).
7. The flange processing and forging equipment according to claim 1, characterized in that: An off-die chip removal assembly (8) is provided on one side of the chip removal chassis (3), and the off-die chip removal assembly (8) includes a chip removal groove (81) opened on one side of the chip removal chassis (3), the top of the chip removal groove (81) is rotatably connected to a chip removal plate (82), a return spring (83) is provided between the bottom surface of the chip removal plate (82) and the bottom surface of the chip removal groove (81), the top surface of the return spring (83) is fixedly connected to a ladder frame (84), and the bottom surface of the fixed scraper (58) is in contact with the top surface of the chip removal chassis (3).
8. The flange processing and forging equipment according to claim 7, characterized in that: The top surface of the chip removal plate (82) is flush with the top surface of the chip removal chassis (3) by the elastic force of the return spring (83), and the middle portion of the ladder frame (84) is hollow.
Citation Information
Patent Citations
Intelligent flange production forging equipment
CN117399549A
Thin wall metallic formed body, and method and apparatus for forging the same
JP2008036700A