A protective conveying vehicle for semiconductor production

Abstract

The present invention discloses a protective conveying carrier for semiconductor production, relates to the field of protective conveying technology, and aims to solve the technical problem of low conveying efficiency in existing semiconductor production. The present invention comprises a base, wherein a wafer receiving mechanism is arranged on the conveying mechanism, a processed object is placed on a carrier component, and is cut into rectangular pieces by a laser cutting mechanism, and then is transmitted to a position directly below a vacuum suction cup mechanism by a conveying mechanism, the rectangular piece is first lifted up by a lifting component, and a first dispersion component, a second dispersion component and a telescopic spring block are driven by an adjusting driving component to disperse the rectangular piece on the carrier component, and finally is protectively adsorbed by the vacuum suction cup mechanism. The present invention has the function of quickly dispersing the rectangular pieces, thus greatly improving the production efficiency, so that more pieces can be processed per unit time, and the urgent demand of the modern semiconductor industry for high output is met.

Description

Technical Field

[0001] The present invention relates to the field of protective conveying technology, and more specifically, to a protective conveying carrier for semiconductor production. Background Art

[0002] In the field of semiconductor manufacturing, wafers are core components, and every link in their production process is crucial. Especially in the transportation link after wafer cutting, there are currently many problems that need to be solved urgently.

[0003] With the continuous development of semiconductor technology, the production efficiency of wafers is becoming increasingly higher. However, after cutting, the existing wafers are usually transported and transported one by one. This traditional transportation method is extremely inefficient. In the large-scale production process, a large number of wafers need to be transferred from the cutting station to subsequent packaging and other processes. Transporting them one by one not only consumes a lot of manpower and time, but also seriously limits the speed of the entire production process, and cannot meet the needs of the rapid development of the modern semiconductor industry.

[0004] At the same time, the wafer is rectangular after cutting, and its four corners are extremely fragile and easily damaged. In the existing transportation process of packaging after cutting, there is a lack of efficient and well-protected devices designed specifically for the special shape and fragility of wafers, and in most cases, clamps are used for placement and transportation, and the clamps often cannot provide effective protection for the four corners of the wafer. During transportation, due to vibration, collision or other unexpected situations, the four corners of the wafer are prone to defects such as edge collapse and cracks, which leads to a decrease in the yield of the wafer and increases production costs. Moreover, once the wafer is damaged during transportation, it will not only cause the scrapping of the wafer itself, but may also have an adverse effect on subsequent production processes, further reducing production efficiency and product quality.

[0005] In summary, the existing method of transporting wafers after cutting has the problems of low transport efficiency and insufficient protection of wafers. There is an urgent need for a protective transport vehicle for semiconductor production that can improve the transport efficiency and have good protection performance. In view of this, we propose a protective transport vehicle for semiconductor production. Summary of the invention

[0006] The purpose of the present invention is to provide a protective conveying vehicle for semiconductor production to solve the technical problem of low conveying efficiency in existing semiconductor production.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: A protective conveying carrier for semiconductor production, comprising a base, a dustproof shell is provided on the base, a conveying mechanism is provided on the base, a laser cutting mechanism is provided on the base directly above the conveying mechanism, a support frame is provided on the base at the back of the conveying mechanism, a rotating seat is provided on the support frame, a vacuum suction cup mechanism is provided on the rotating seat, and a wafer receiving mechanism is provided on the conveying mechanism;

[0008] The wafer receiving mechanism includes a wafer carrying component, a lifting component, an adjustment drive component, a first spacing component, a second spacing component, a telescopic spring block and a carrier assembly. The wafer carrying component is arranged on the conveying mechanism, the lifting component is arranged on the outer wall of the wafer carrying component, the adjustment drive component is connected to the output end of the lifting component, the second spacing component is fixedly arranged on the top of the adjustment drive component, the first spacing component is fixedly arranged on the top of the second spacing component, the telescopic spring block is connected to the first spacing component and the second spacing component, and the carrier assembly is arranged on the telescopic spring block.

[0009] Preferably, the wafer supporting assembly includes a supporting seat, a accommodating cavity, a wafer ring groove and a lifting slide, the supporting seat is arranged on the conveying mechanism, the accommodating cavity is opened on the supporting seat, the wafer ring groove is opened at the top of the inner wall of the supporting seat, the lifting slide is opened on the supporting seat, the lifting assembly is movably inserted in the lifting slide, and the adjusting drive assembly, the first spacing assembly, the second spacing assembly, the telescopic spring block and the carrier assembly are all arranged in the accommodating cavity.

[0010] Preferably, the lifting assembly includes a cylinder, a lifting rod, a connecting plate and a bracket, the cylinder is fixedly arranged at the top of the outer wall of the bearing seat, the lifting rod is connected to the output end of the cylinder, the connecting plate is connected to the end of the lifting rod away from the cylinder, the bracket is connected to the end of the connecting plate away from the lifting rod, and the adjustment drive assembly and the second spacing assembly are fixedly arranged at the top of the bracket.

[0011] Preferably, the adjustment drive assembly includes a servo motor, a first gear and a second gear, the servo motor is hoisted on the inner top wall of the bracket, the first gear is rotatably connected to the top of the bracket, the output end of the servo motor is connected to the first gear, the second gear is fixedly connected to the top of the first gear, the first spacing assembly is meshedly connected to the second gear, and the second spacing assembly is meshedly connected to the first gear.

[0012] Preferably, the second spacing component includes a second fixed ring, a second socket, a second insertion rod and a second straight tooth groove, the second fixed ring is fixedly arranged on the top of the bracket, the second sockets are arranged in a ring-shaped manner with equal intervals on the second fixed ring, the second insertion rod is movably inserted in the second socket, the second straight tooth groove is arranged at one end of the second insertion rod close to the first gear, and the second straight tooth groove is meshed and connected to the first gear.

[0013] Preferably, the first spacing component includes a first fixed ring, a first socket, a first insertion rod, a first straight tooth groove and a connecting rod, the first fixed ring is fixedly arranged on the top of the second fixed ring, the first socket is annularly arranged on the first fixed ring with equal intervals, the first insertion rod is movably inserted on the first socket, the first straight tooth groove is arranged on the end of the first insertion rod close to the second gear, the first straight tooth groove is meshingly connected to the second gear, and the connecting rod is fixedly connected to the end of the first insertion rod away from the first straight tooth groove.

[0014] Preferably, the telescopic spring block includes a telescopic male head, a telescopic female head, an insert block, a slot, a spring and a mounting hole, the telescopic male head is fixedly connected to the first insert rod and the connecting rod, the insert block is fixedly connected to the telescopic male head, the slot is opened on the telescopic female head, the telescopic female head is movably mounted on the insert block through the slot, one end of the spring is connected to the insert block, and the other end of the spring is connected to the slot, the mounting hole is opened on the telescopic male head and the telescopic female head, and the carrier assembly is arranged on the mounting hole.

[0015] Preferably, telescopic spring blocks are symmetrically fixed on the connecting rod, and two telescopic spring blocks are stacked away from one end of the connecting rod and connected through a carrier assembly.

[0016] Preferably, the carrier assembly comprises a fixed block and a rubber suction cup, wherein the fixed block is fixedly inserted on the telescopic elastic block, and the rubber suction cup is fixedly connected to an end of the fixed block away from the telescopic elastic block;

[0017] Wherein, the fixing block and the rubber suction cup are also provided at the top of the second gear.

[0018] Preferably, the vacuum suction cup mechanism includes a protective plate, a retention groove, an air suction hole, a diffusion plate, a hanging barrel, an air suction pipe and a carrier, the carrier is connected to the rotating seat, the hanging barrel is connected to one end of the carrier away from the rotating seat, the diffusion plate is connected to the bottom end of the hanging barrel, the protective plate is connected to the bottom end of the diffusion plate, a plurality of the retention grooves are opened at the bottom end of the protective plate, the air suction hole is opened at the top of the retention groove and is connected to the diffusion plate, one end of the air suction pipe is connected to the hanging barrel, and the other end of the air suction pipe is connected to the air pump.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention improves the existing conveying carrier for semiconductor wafer production, arranges a wafer receiving mechanism on the conveying mechanism, places the wafer to be cut on the wafer carrying component, cuts the wafer into rectangular sheets by a laser cutting mechanism, and then transmits it to a position directly below the vacuum suction cup mechanism by the conveying mechanism, first lifts up the rectangular sheet wafer by a lifting component, drives the first spacing component, the second spacing component and the telescopic spring block by adjusting the driving component to disperse the sheet rectangular wafer on the carrier component, and finally protects and adsorbs it by the vacuum suction cup mechanism. The present invention has the function of quickly dispersing the sheet rectangular wafer, greatly improves the production efficiency, enables more wafers to be processed per unit time, and meets the urgent demand of the modern semiconductor industry for high output.

[0021] 2. In the present invention, by driving the servo motor, the servo motor drives the first gear and the second gear to rotate synchronously, the first gear meshes with the first straight tooth groove to make the first insertion rod slide on the first insertion hole of the first fixed ring, the first insertion rod drives the connecting rod at the other end to move outward, and the connecting rod drives the telescopic spring block fixedly connected at both ends to move outward, when the other end of the telescopic spring block is separated from the first fixed ring, the telescopic spring block separates the sheet wafers on the three carrier assemblies. The present invention greatly improves the dispersion efficiency, reduces the time required for the dispersion process, and makes the entire semiconductor wafer production process more compact and efficient. This rapid dispersion action can be closely connected with the subsequent adsorption operation, reducing the exposure time of the wafer to the air, reducing the possibility of the wafer being contaminated by dust and impurities, and further ensuring the quality of the wafer and the performance stability of the product.

[0022] 3. In the present invention, when the first insertion rod and the second insertion rod move outward synchronously and expand, they drive the telescopic male head, the telescopic female head, the insertion block and the slot to move outward synchronously. When the end of the telescopic female head away from the telescopic male head detaches from the outer walls of the first fixed ring and the second fixed ring, the elastic force of the spring causes the insertion block to slide in the slot, so that the telescopic male head is separated from the telescopic female head, driving the carrier assembly and the sheet wafer thereon to separate, thereby achieving a dispersion effect. This elasticity-based mechanical structure is simple and effective, reduces the use of complex electronic control systems or vulnerable mechanical parts, improves the reliability and durability of the entire mechanism, reduces the maintenance cost and failure rate of the equipment, and is conducive to long-term and stable semiconductor wafer production operations.

[0023] 4. In the present invention, an air pump is driven to form negative pressure inside a plurality of retention tanks through an air suction pipe, a hanging tube, a diffusion plate and an air suction hole, and the dispersed sheet wafers are suctioned and transported to a subsequent packaging process. Compared with traditional mechanical clamping and other transporting methods, this negative pressure-based transporting method avoids possible scratches and collision damages to the wafers caused by mechanical contact, especially for the microstructure and fragile corners of the wafer surface, greatly reducing the risk of damage, ensuring the integrity of the wafer during the transport process, and improving the yield rate of the product. While achieving transport, the floating dust and particulate matter on the wafer surface are further sucked by suction. Through negative pressure suction, these potential pollution sources are effectively removed, and the cleanliness of the wafer is improved, thereby ensuring the quality and stability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall internal structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the wafer receiving mechanism of the present invention;

[0027] Figure 4 It is a cross-sectional view of the wafer support assembly, the lifting assembly and the adjustment drive assembly structure schematic diagram of the present invention;

[0028] Figure 5 It is a cross-sectional view of the wafer support assembly, the lifting assembly and the bottom surface structural schematic diagram of the adjustment drive assembly of the present invention;

[0029] Figure 6 It is a schematic diagram of the bottom surface structure of the first spacing component, the second spacing component, the telescopic spring block and the carrier component of the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the second spacing component of the present invention;

[0031] Figure 8 It is a partial structural schematic diagram of the second spacing component of the present invention;

[0032] Fig. 9 It is a schematic diagram of the split structure of the telescopic bullet block of the present invention;

[0033] Fig.10 It is a schematic diagram of the structure of the first spacing component of the present invention;

[0034] Fig.11 It is a partial structural schematic diagram of the first spacing component of the present invention;

[0035] Fig.12 It is a schematic diagram of the bottom surface structure of part of the first spacing component of the present invention;

[0036] Fig.13 It is a schematic diagram of the unfolded structure of the first spacing component and the telescopic bullet block of the present invention;

[0037] Fig.14 It is a schematic diagram of the cross-sectional structure of the vacuum suction cup mechanism of the present invention;

[0038] Fig.15 It is a schematic diagram of the wafer receiving and taking mechanism of the present invention in the state of taking a wafer;

[0039] Fig.16 It is a schematic diagram of wafer cutting of the present invention;

[0040] Fig.17 It is a schematic diagram of the scattered state of wafers after cutting of the present invention.

[0041] Description of the numbers in the figure:

[0042] 1. Base; 2. Dustproof shell; 3. Conveying mechanism; 4. Laser cutting mechanism; 5. Rotating seat; 6. Vacuum suction cup mechanism; 7. Wafer receiving mechanism; 8. Support frame;

[0043] 601, protective plate; 602, retention tank; 603, air suction hole; 604, diffusion plate; 605, hanging tube; 606, air suction pipe; 607, carrier;

[0044] 701, wafer carrying assembly; 702, lifting assembly; 703, adjusting driving assembly; 704, first spacing assembly; 705, second spacing assembly; 706, telescopic spring block; 707, carrier assembly;

[0045] 7011, bearing seat; 7012, accommodating cavity; 7013, wafer ring groove; 7014, lifting slide groove;

[0046] 7021, cylinder; 7022, lifting rod; 7023, connecting plate; 7024, bracket;

[0047] 7031, servo motor; 7032, first gear; 7033, second gear;

[0048] 7041, first fixing ring; 7042, first insertion hole; 7043, first insertion rod; 7044, first straight tooth groove; 7045, connecting rod;

[0049] 7051, second fixing ring; 7052, second insertion hole; 7053, second insertion rod; 7054, second straight tooth groove;

[0050] 7061, telescopic male connector; 7062, telescopic female connector; 7063, plug block; 7064, slot; 7065, spring; 7066, mounting hole;

[0051] 7071. Fixing block; 7072. Rubber suction cup. DETAILED DESCRIPTION

[0052] like Figures 1 to 17 As shown, the present invention relates to a protective conveying carrier for semiconductor production, comprising a base 1, a dustproof shell 2 is provided on the base 1, a conveying mechanism 3 is provided on the base 1, a laser cutting mechanism 4 is provided on the base 1 directly above the conveying mechanism 3, a support frame 8 is provided on the base 1 at the back of the conveying mechanism 3, a rotating seat 5 is provided on the support frame 8, a vacuum suction cup mechanism 6 is provided on the rotating seat 5, and a wafer receiving mechanism 7 is provided on the conveying mechanism 3;

[0053] The wafer receiving mechanism 7 includes a wafer carrying component 701, a lifting component 702, an adjusting drive component 703, a first spacing component 704, a second spacing component 705, a telescopic spring block 706 and a carrier assembly 707. The wafer carrying component 701 is arranged on the conveying mechanism 3, the lifting component 702 is arranged on the outer wall of the wafer carrying component 701, the adjusting drive component 703 is connected to the output end of the lifting component 702, the second spacing component 705 is fixedly arranged at the top of the adjusting drive component 703, the first spacing component 704 is fixedly arranged at the top of the second spacing component 705, the telescopic spring block 706 is connected to the first spacing component 704 and the second spacing component 705, and the carrier assembly 707 is arranged on the telescopic spring block 706.

[0054] The present invention improves the existing conveying carrier for semiconductor wafer production by arranging a wafer receiving mechanism 7 on the conveying mechanism 3, placing the wafer to be cut on the wafer carrying component 701, cutting the wafer into rectangular sheets by the laser cutting mechanism 4, and then transmitting the wafer to the position directly below the vacuum suction cup mechanism 6 by the conveying mechanism 3, first lifting the rectangular sheet wafer by the lifting component 702, and driving the first spacing component 704, the second spacing component 705 and the telescopic spring block 706 by adjusting the driving component 703 to disperse the sheet rectangular wafer on the carrier component 707, and finally protecting and adsorbing the sheet rectangular wafer by the vacuum suction cup mechanism 6. The present invention has the function of quickly dispersing the sheet rectangular wafer, greatly improving the production efficiency, so that more wafers can be processed per unit time, and meeting the urgent demand of the modern semiconductor industry for high output.

[0055] In an embodiment of the present invention, the wafer supporting assembly 701 includes a supporting seat 7011, a accommodating cavity 7012, a wafer ring groove 7013 and a lifting slide 7014. The supporting seat 7011 is arranged on the conveying mechanism 3, the accommodating cavity 7012 is opened on the supporting seat 7011, the wafer ring groove 7013 is opened at the top of the inner wall of the supporting seat 7011, the lifting slide 7014 is opened on the supporting seat 7011, the lifting assembly 702 is movably inserted in the lifting slide 7014, and the adjusting drive assembly 703, the first spacing assembly 704, the second spacing assembly 705, the telescopic spring block 706 and the carrier assembly 707 are all arranged in the accommodating cavity 7012. In the present invention, the wafer to be processed is placed on the wafer ring groove 7013 of the supporting seat 7011, and the wafer to be processed is transported to the bottom of the laser cutting mechanism 4 for cutting through the conveying mechanism 3. After cutting, it is transported to the bottom of the vacuum suction cup mechanism 6 for transportation to the subsequent packaging process. In the present invention, the conveying mechanism 3 drives the wafer supporting assembly 701 to reciprocate to realize wafer production transportation.

[0056] In an embodiment of the present invention, the lifting assembly 702 includes a cylinder 7021, a lifting rod 7022, a connecting plate 7023 and a bracket 7024. The cylinder 7021 is fixedly arranged at the top of the outer wall of the supporting seat 7011, the lifting rod 7022 is connected to the output end of the cylinder 7021, the connecting plate 7023 is connected to the end of the lifting rod 7022 away from the cylinder 7021, the bracket 7024 is connected to the end of the connecting plate 7023 away from the lifting rod 7022, and the adjusting drive assembly 703 and the second spacing assembly 705 are fixedly arranged at the top of the bracket 7024. In the present invention, the lifting rod 7022 is driven to rise by driving the return stroke of the cylinder 7021, and the lifting rod 7022 drives the connecting plate 7023 to slide in the lifting slide groove 7014, and the connecting plate 7023 drives the bracket 7024, and the bracket 7024 drives the adjusting drive component 703, the first spacing component 704, the second spacing component 705, the telescopic spring block 706, the carrier component 707 and the rectangular sheet wafer to realize the lifting function.

[0057] In an embodiment of the present invention, the adjustment drive assembly 703 includes a servo motor 7031, a first gear 7032 and a second gear 7033. The servo motor 7031 is hoisted on the inner top wall of the bracket 7024. The first gear 7032 is rotatably connected to the top of the bracket 7024. The output end of the servo motor 7031 is connected to the first gear 7032. The second gear 7033 is fixedly connected to the top of the first gear 7032. The first spacing assembly 704 is meshedly connected to the second gear 7033, and the second spacing assembly 705 is meshedly connected to the first gear 7032. In the present invention, by driving the servo motor 7031, the servo motor 7031 drives the first gear 7032 and the second gear 7033 to rotate synchronously, the first gear 7032 drives the second spacing assembly 705 to realize the function of spreading the rectangular sheet wafer, and the second gear 7033 drives the first spacing assembly 704 to realize the function of spreading the rectangular sheet wafer.

[0058] In an embodiment of the present invention, the second spacing component 705 includes a second fixed ring 7051, a second socket 7052, a second plug rod 7053 and a second straight tooth groove 7054. The second fixed ring 7051 is fixedly arranged on the top of the bracket 7024, the second socket 7052 is arranged in a ring-shaped and equidistant manner on the second fixed ring 7051, the second plug rod 7053 is movably inserted in the second socket 7052, the second straight tooth groove 7054 is arranged at one end of the second plug rod 7053 close to the first gear 7032, and the second straight tooth groove 7054 is meshedly connected to the first gear 7032.

[0059] The first spacing component 704 includes a first fixed ring 7041, a first insertion hole 7042, a first insertion rod 7043, a first straight tooth groove 7044 and a connecting rod 7045. The first fixed ring 7041 is fixedly arranged on the top of the second fixed ring 7051. The first insertion hole 7042 is arranged on the first fixed ring 7041 in a ring shape with equal intervals. The first insertion rod 7043 is movably inserted in the first insertion hole 7042. The first straight tooth groove 7044 is arranged at one end of the first insertion rod 7043 close to the second gear 7033. The first straight tooth groove 7044 is meshed and connected to the second gear 7033. The connecting rod 7045 is fixedly connected to one end of the first insertion rod 7043 away from the first straight tooth groove 7044.

[0060] like Figures 7 to 13As shown, in the present invention, by driving the servo motor 7031, the servo motor 7031 drives the first gear 7032 and the second gear 7033 to rotate synchronously, the first gear 7032 meshes with the first straight tooth groove 7044 to make the first insertion rod 7043 slide on the first insertion hole 7042 of the first fixed ring 7041, the first insertion rod 7043 drives the connecting rod 7045 at the other end to move outward, and the connecting rod 7045 drives the telescopic elastic block 706 fixedly connected at both ends thereof to move outward, when the other end of the telescopic elastic block 706 is separated from the first fixed ring 7041, the telescopic elastic block 706 separates the sheet wafers on the three carrier assemblies 707;

[0061] When the second gear 7033 rotates, the second straight tooth groove 7054 is engaged to make the second rod 7053 slide on the second insertion hole 7052 of the second fixed ring 7051, and the second rod 7053 drives the telescopic elastic block 706 at the other end to move outward, and the telescopic elastic block 706 is separated from the outer wall of the first fixed ring 7041, so that the telescopic elastic block 706 is synchronously ejected, thereby realizing the function of synchronously dispersing multiple sheet wafers;

[0062] The present invention greatly improves the dispersion efficiency and reduces the time required for the dispersion process, making the entire semiconductor wafer production process more compact and efficient. This rapid dispersion action can be closely connected with the subsequent adsorption operation, reducing the time the wafer is exposed to the air, reducing the possibility of the wafer being contaminated by dust and impurities, and further ensuring the quality of the wafer and the performance stability of the product.

[0063] As another embodiment of the present invention, the telescopic spring block 706 includes a telescopic male head 7061, a telescopic female head 7062, an insert block 7063, a slot 7064, a spring 7065 and a mounting hole 7066. The telescopic male head 7061 is fixedly connected to the first insert rod 7043 and the connecting rod 7045, the insert block 7063 is fixedly connected to the telescopic male head 7061, the slot 7064 is opened on the telescopic female head 7062, the telescopic female head 7062 is movably mounted on the insert block 7063 through the slot 7064, one end of the spring 7065 is connected to the insert block 7063, and the other end of the spring 7065 is connected to the slot 7064, the mounting hole 7066 is opened on the telescopic male head 7061 and the telescopic female head 7062, and the carrier assembly 707 is arranged on the mounting hole 7066.

[0064] The connecting rod 7045 is symmetrically fixed with telescopic spring blocks 706 . Two telescopic spring blocks 706 are stacked away from one end of the connecting rod 7045 and are connected through a carrier assembly 707 .

[0065] In the present invention, when the first insertion rod 7043 and the second insertion rod 7053 move outward and expand synchronously, the telescopic male head 7061, the telescopic female head 7062, the plug 7063 and the slot 7064 are driven to move outward synchronously. When the end of the telescopic female head 7062 away from the telescopic male head 7061 is separated from the outer walls of the first fixed ring 7041 and the second fixed ring 7051, the elastic force of the spring 7065 causes the plug 7063 to slide in the slot 7064, so that the telescopic male head 7061 is separated from the telescopic female head 7062, driving the carrier assembly 707 and the sheet wafer thereon to separate, thereby achieving a dispersion effect. This elasticity-based mechanical structure is simple and effective, reduces the use of complex electronic control systems or vulnerable mechanical parts, improves the reliability and durability of the entire mechanism, reduces the maintenance cost and failure rate of the equipment, and is conducive to long-term and stable semiconductor wafer production operations.

[0066] As another embodiment of the present invention, the carrier assembly 707 includes a fixed block 7071 and a rubber suction cup 7072. The fixed block 7071 is fixedly inserted on the telescopic spring block 706, and the rubber suction cup 7072 is fixedly connected to one end of the fixed block 7071 away from the telescopic spring block 706; wherein a fixed block 7071 and a rubber suction cup 7072 are also provided at the top of the second gear 7033.

[0067] As another embodiment of the present invention, the vacuum suction cup mechanism 6 includes a protective plate 601, a retention groove 602, an air suction hole 603, a diffusion plate 604, a hanging tube 605, an air suction pipe 606 and a carrier 607, the carrier 607 is connected to the rotating seat 5, the hanging tube 605 is connected to the end of the carrier 607 away from the rotating seat 5, the diffusion plate 604 is connected to the bottom of the hanging tube 605, the protective plate 601 is connected to the bottom of the diffusion plate 604, a plurality of retention grooves 602 are opened at the bottom of the protective plate 601, the air suction hole 603 is opened at the top of the retention groove 602 and is connected to the diffusion plate 604, one end of the air suction pipe 606 is connected to the hanging tube 605, and the other end of the air suction pipe 606 is connected to the air pump.

[0068] In the present invention, by driving the air pump, negative pressure is formed inside the plurality of retention grooves 602 through the suction pipe 606, the hanging tube 605, the diffusion plate 604 and the suction hole 603, and the dispersed sheet wafers are suctioned and transported to the subsequent packaging process. Compared with the traditional mechanical clamping and other transporting methods, this negative pressure-based transporting method avoids the scratches and collision damages that may be caused to the wafers by mechanical contact, especially for the microstructure and fragile corners of the wafer surface, greatly reducing the risk of damage, ensuring the integrity of the wafer during the transport process, and improving the yield rate of the product. While achieving transport, the floating dust and particulate matter on the wafer surface are further sucked by suction. Through negative pressure suction, these potential pollution sources are effectively removed, the cleanliness of the wafer is improved, and the quality and stability of the final product are guaranteed.

[0069] Working principle: This embodiment provides a protective conveying carrier for semiconductor production. When in use, first place the wafer to be cut on the wafer carrying assembly 701, cut the wafer into rectangular sheets by the laser cutting mechanism 4, and then transfer it to the position directly below the vacuum suction cup mechanism 6 by the conveying mechanism 3, drive the cylinder 7021 to return and drive the lifting rod 7022 to rise, the lifting rod 7022 drives the connecting plate 7023 to slide in the lifting slide 7014, the connecting plate 7023 drives the bracket 7024, the bracket 7024 drives the adjusting driving assembly 703, the first spacing assembly 704, the second spacing assembly 705, the telescopic spring block 706, the carrier assembly 707 and the rectangular sheet wafer to achieve lifting;

[0070] Then drive the servo motor 7031, the servo motor 7031 drives the first gear 7032 and the second gear 7033 to rotate synchronously, the first gear 7032 meshes with the first straight tooth groove 7044 to make the first plug rod 7043 slide on the first plug hole 7042 of the first fixed ring 7041, the first plug rod 7043 drives the connecting rod 7045 at the other end to move outward, and the connecting rod 7045 drives the telescopic elastic block 706 fixedly connected at both ends to move outward; when the second gear 7033 rotates, the servo motor 7031 meshes with the second straight tooth groove 7054 to make the second plug rod 7053 slide on the second plug hole 7052 of the second fixed ring 7051, and the second plug rod 7053 053 drives the telescopic spring block 706 at the other end to move outward. When the first plug rod 7043 and the second plug rod 7053 move outward synchronously and expand, the telescopic male head 7061, the telescopic female head 7062, the plug block 7063 and the slot 7064 are driven to move outward synchronously. When the end of the telescopic female head 7062 away from the telescopic male head 7061 is separated from the outer walls of the first fixing ring 7041 and the second fixing ring 7051, the elastic force of the spring 7065 causes the plug block 7063 to slide in the slot 7064, so that the telescopic male head 7061 is separated from the telescopic female head 7062, driving the carrier assembly 707 and the sheet wafer thereon to separate, thereby achieving a dispersion effect.

[0071] Finally, the hydraulic cylinder on the support frame 8 is driven to lower the rotating seat 5, and then the motor is driven to drive the rotating seat 5 to drive the carrier 607, the hanging tube 605, the diffusion plate 604 and the protective plate 601 to move to the top of the dispersed sheet wafers, and the air pump is driven to form a negative pressure inside the several retention grooves 602 through the suction pipe 606, the hanging tube 605, the diffusion plate 604 and the suction hole 603, so that the dispersed sheet wafers are sucked and transported to the subsequent packaging process.

[0072] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A protective conveying vehicle for semiconductor production, characterized in that: The invention comprises a base (1), wherein a dustproof housing (2) is provided on the base (1), a conveying mechanism (3) is provided on the base (1), a laser cutting mechanism (4) is provided on the base (1) at a position directly above the conveying mechanism (3), a support frame (8) is provided on the base (1) at a position behind the conveying mechanism (3), a rotating seat (5) is provided on the support frame (8), a vacuum suction cup mechanism (6) is provided on the rotating seat (5), and a wafer receiving mechanism (7) is provided on the conveying mechanism (3); The wafer receiving mechanism (7) comprises a wafer bearing component (701), a lifting component (702), an adjusting drive component (703), a first spacing component (704), a second spacing component (705), a telescopic spring block (706) and a carrier component (707), wherein the wafer bearing component (701) is arranged on the conveying mechanism (3), the lifting component (702) is arranged on the outer wall of the wafer bearing component (701), the adjusting drive component (703) is connected to the output end of the lifting component (702), the second spacing component (705) is fixedly arranged on the top of the adjusting drive component (703), the first spacing component (704) is fixedly arranged on the top of the second spacing component (705), the telescopic spring block (706) is connected to the first spacing component (704) and the second spacing component (705), and the carrier component (707) is arranged on the telescopic spring block (706); The second spacing component (705) comprises a second fixed ring (7051), a second plug hole (7052), a second plug rod (7053) and a second straight tooth groove (7054), wherein the second fixed ring (7051) is fixedly arranged on the top of the bracket (7024), the second plug holes (7052) are arranged on the second fixed ring (7051) in a ring shape and at equal intervals, the second plug rod (7053) is movably inserted in the second plug hole (7052), the second straight tooth groove (7054) is arranged at one end of the second plug rod (7053) close to the first gear (7032), and the second straight tooth groove (7054) is meshedly connected to the first gear (7032); The first spacing component (704) comprises a first fixed ring (7041), a first plug hole (7042), a first insertion rod (7043), a first straight tooth groove (7044) and a connecting rod (7045), wherein the first fixed ring (7041) is fixedly arranged at the top end of the second fixed ring (7051), the first plug hole (7042) is arranged on the first fixed ring (7041) in a ring shape with equal intervals, the first insertion rod (7043) is movably inserted in the first insertion hole (7042), the first straight tooth groove (7044) is arranged at an end of the first insertion rod (7043) close to the second gear (7033), the first straight tooth groove (7044) is meshedly connected to the second gear (7033), and the connecting rod (7045) is fixedly connected to an end of the first insertion rod (7043) away from the first straight tooth groove (7044); The telescopic spring block (706) comprises a telescopic male head (7061), a telescopic female head (7062), an insert block (7063), a slot (7064), a spring (7065) and a mounting hole (7066); the telescopic male head (7061) is fixedly connected to the first insert rod (7043) and the connecting rod (7045); the insert block (7063) is fixedly connected to the telescopic male head (7061); the slot (7064) is provided on the telescopic female head (706 2), the telescopic female head (7062) is movably mounted on the plug block (7063) through the slot (7064), one end of the spring (7065) is connected to the plug block (7063), and the other end of the spring (7065) is connected to the slot (7064), the mounting hole (7066) is opened on the telescopic male head (7061) and the telescopic female head (7062), and the carrier assembly (707) is arranged on the mounting hole (7066); The carrier assembly (707) comprises a fixed block (7071) and a rubber suction cup (7072), wherein the fixed block (7071) is fixedly inserted on the telescopic elastic block (706), and the rubber suction cup (7072) is fixedly connected to an end of the fixed block (7071) away from the telescopic elastic block (706); The fixing block (7071) and the rubber suction cup (7072) are also provided at the top of the second gear (7033).

2. A protective conveying carrier for semiconductor production according to claim 1, characterized in that: The wafer supporting assembly (701) comprises a supporting seat (7011), a containing cavity (7012), a wafer ring groove (7013) and a lifting slide groove (7014); the supporting seat (7011) is arranged on the conveying mechanism (3); the containing cavity (7012) is opened on the supporting seat (7011); the wafer ring groove (7013) is opened at the top of the inner wall of the supporting seat (7011); the lifting slide groove (7014) is opened on the supporting seat (7011); the lifting assembly (702) is movably inserted in the lifting slide groove (7014); the adjusting drive assembly (703), the first spacing assembly (704), the second spacing assembly (705), the telescopic spring block (706) and the carrier assembly (707) are all arranged in the containing cavity (7012).

3. A protective conveying carrier for semiconductor production according to claim 2, characterized in that: The lifting assembly (702) comprises a cylinder (7021), a lifting rod (7022), a connecting plate (7023) and a bracket (7024); the cylinder (7021) is fixedly arranged at the top end of the outer wall of the bearing seat (7011); the lifting rod (7022) is connected to the output end of the cylinder (7021); the connecting plate (7023) is connected to the end of the lifting rod (7022) away from the cylinder (7021); the bracket (7024) is connected to the end of the connecting plate (7023) away from the lifting rod (7022); the adjusting drive assembly (703) and the second spacing assembly (705) are fixedly arranged at the top end of the bracket (7024).

4. A protective conveying carrier for semiconductor production according to claim 3, characterized in that: The adjustment drive component (703) comprises a servo motor (7031), a first gear (7032) and a second gear (7033); the servo motor (7031) is hoisted on the inner top wall of the bracket (7024); the first gear (7032) is rotatably connected to the top of the bracket (7024); the output end of the servo motor (7031) is connected to the first gear (7032); the second gear (7033) is fixedly connected to the top of the first gear (7032); the first spacing component (704) is meshedly connected to the second gear (7033); and the second spacing component (705) is meshedly connected to the first gear (7032).

5. A protective conveying carrier for semiconductor production according to claim 4, characterized in that: The connecting rod (7045) is symmetrically fixed with telescopic spring blocks (706), and the two telescopic spring blocks (706) are stacked at one end away from the connecting rod (7045) and connected via a carrier assembly (707).

6. A protective conveying carrier for semiconductor production according to claim 5, characterized in that: The vacuum suction cup mechanism (6) comprises a protective plate (601), a retention groove (602), an air suction hole (603), a diffusion plate (604), a hanging tube (605), an air suction pipe (606) and a carrier (607), wherein the carrier (607) is connected to the rotating seat (5), the hanging tube (605) is connected to one end of the carrier (607) away from the rotating seat (5), the diffusion plate (604) is connected to the bottom end of the hanging tube (605), the protective plate (601) is connected to the bottom end of the diffusion plate (604), a plurality of the retention grooves (602) are opened at the bottom end of the protective plate (601), the air suction hole (603) is opened at the top of the retention groove (602) and is connected to the diffusion plate (604), one end of the air suction pipe (606) is connected to the hanging tube (605), and the other end of the air suction pipe (606) is connected to the air pump.

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