Card processing method, card and electronic device

Abstract

The application provides a card holder processing method, a card holder and electronic equipment, and belongs to the technical field of electronic equipment. The method comprises the following steps: punching a plate to form a pull rod hole and a first set of positioning holes on the plate; grinding the punched plate; performing CNC processing on the front surface of the ground plate to form a second set of positioning holes on the plate; performing CNC processing on the back surface of the plate after the front surface processing to form a card holder cap blank; performing surface treatment on the card holder cap blank to obtain a card holder cap to be punched; performing punch blanking on the card holder cap to be punched to obtain a card holder cap; obtaining a middle plate, and performing injection molding processing on the middle plate and the card holder cap to form a card holder. The application achieves the technical effect of improving processing precision and production efficiency.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to a card holder processing method, a card holder and an electronic equipment. BACKGROUND

[0002] As a key component for loading a SIM card, the manufacturing precision and quality of the card holder are crucial for ensuring the stability of mobile phone signal reception and the user experience. With the development of smart phones towards lightness, thinness and high performance, the processing requirements of the card holder of the mobile phone are also increasingly high. At present, in the technical field of electronic equipment, the card holder processing process mostly adopts a relatively single processing method, such as simple stamping or injection molding. Although the basic manufacturing requirements can be met, in the card holder processing process, the accumulation of processing errors is difficult to avoid, and there are certain limitations in processing precision, production efficiency and material utilization, which is not conducive to reducing manufacturing costs.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. SUMMARY

[0004] The technical problem to be solved by the present application is poor processing precision and low production efficiency.

[0005] To solve the above technical problems, the present application provides a card holder processing method, which comprises punching a plate to form a pull rod hole and a first group of positioning holes on the plate; grinding the punched plate; CNC processing the front surface of the ground plate to form a second group of positioning holes on the plate; CNC processing the back surface of the plate after front surface processing to form a card holder cap blank; surface treating the card holder cap blank to obtain a card holder cap to be stamped; stamping and blanking the card holder cap to be stamped to obtain a card holder cap; obtaining a middle plate, and injection molding the middle plate and the card holder cap to form a card holder.

[0006] Optionally, the CNC processing of the front surface of the ground plate comprises: using the first group of positioning holes as the positioning reference in the XY direction, and using the back surface of the plate as the positioning reference in the Z direction, to perform CNC processing on the front surface of the ground plate.

[0007] Optionally, the CNC processing of the back surface of the plate after front surface processing comprises: using the second group of positioning holes as the positioning reference in the XY direction, and using the front surface of the plate as the positioning reference in the Z direction, to perform CNC processing on the back surface of the plate after front surface processing.

[0008] Optionally, the surface treatment of the card slot cap blank comprises sand blasting treatment, and the sand blasting treatment comprises: using zirconium sand as a sand blasting material to perform sand blasting treatment on the card slot cap blank.

[0009] Optionally, the surface treatment of the card slot cap blank comprises anodic oxidation treatment, and the anodic oxidation treatment comprises: performing anodic oxidation treatment on the card slot cap blank according to a preset thickness value to form an anodic oxidation film on the card slot cap blank, wherein the thickness value ranges from 5 μm to 10 μm.

[0010] Optionally, the injection molding of the middle plate and the card slot cap to form a card slot comprises: performing one-time injection molding of the card slot cap and the middle plate in a mold to form a card slot; and performing secondary injection molding on the card slot to add a waterproof silica gel ring on the card slot.

[0011] Optionally, the one-time injection molding of the card slot cap and the middle plate in a mold comprises: performing one-time injection molding of the card slot cap and the middle plate in a mold by using a composite material of polycarbonate added with 20% glass fiber.

[0012] Optionally, the punching of the plate comprises: punching the plate according to a preset flatness, wherein the flatness is not greater than 0.10 mm.

[0013] According to still another aspect of the present application, the present application further provides a card slot, which is manufactured by the card slot manufacturing method.

[0014] According to still another aspect of the present application, the present application further provides an electronic device, which comprises a shell, a card slot hole provided in the shell, and the card slot, which is detachably accommodated in the card slot hole and connected with the shell.

[0015] Advantages:

[0016] The application provides a card holder processing method, which comprises the following steps of: punching a plate to form a pull rod hole and a first set of positioning holes on the plate; grinding the punched plate; performing CNC processing on the front surface of the ground plate to form a second set of positioning holes on the plate; performing CNC processing on the back surface of the plate after the front surface processing to form a card holder cap blank; performing surface treatment on the card holder cap blank to obtain a card holder cap to be punched; and performing punch blanking on the card holder cap to be punched to obtain a card holder cap. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0018] Figure 1 A flow chart of a card holder processing method provided by the embodiment of the present application.

[0019] Figure 2 A structural schematic diagram of a plate in a card holder processing method provided by the embodiment of the present application.

[0020] Figure 3 A structural schematic diagram of a first set of positioning holes in a card holder processing method provided by the embodiment of the present application.

[0021] Figure 4 A structural schematic diagram of a second set of positioning holes in a card holder processing method provided by the embodiment of the present application.

[0022] Figure 5 A structural schematic diagram of a card holder cap blank in a card holder processing method provided by the embodiment of the present application.

[0023] Figure 6 A structural schematic diagram of a card holder cap in a card holder processing method provided by the embodiment of the present application.

[0024] Figure 7A structural schematic diagram of a card holder provided by an embodiment of the present application.

[0025] Figure 8 A structural schematic diagram of an electronic device provided by an embodiment of the present application.

[0026] The meanings of the respective reference numerals in the drawings are as follows: 1 - plate material, 11 - pull rod hole, 12 - first set of positioning holes, 13 - second set of positioning holes, 14 - front surface, 15 - back surface; 2 - card holder cap blank, 21 - card holder cap; 3 - middle plate; 4 - card holder; 5 - composite material, 51 - waterproof silica gel ring; 6 - electronic device, 61 - shell, 62 - card holder hole. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, examples of the embodiments being shown in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application. In order to enable those skilled in the art to better understand the scheme of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application.

[0028] It should be noted that in the embodiments of the present application, at least one means one or more; and multiple means two or more. The terms "first", "second", "third", or "firstly", "then" and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance, nor can it be understood as indicating or implying order. In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances, and it is not intended to limit the present application.

[0029] Reference to "one embodiment" or "some embodiments" or "one implementation" or "some implementations" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearance of the phrase "in one embodiment" or "in some embodiments" in various places in the specification are not necessarily all referring to the same embodiment. The terms "including," "comprising," "having," and the like are meant to be open-ended terms that specifically permit the specification of more than one component. Use of the term "and / or" as an alternative to "or" means that both individual alternatives or all of the alternatives are included in the disclosure. The terms "comprise," "comprising," "include," "including," and "includes" are used synonymously to denote or encompass an element, integer, step, or component along with any progeny of the element, integer, step, or component.

[0030] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. It is to be understood that various steps in the method embodiments disclosed herein can be carried out in different orders and / or concurrently, and that some steps can be omitted entirely, depending on the circumstances. Furthermore, the method embodiments can include other steps and / or additional steps not expressly mentioned herein.

[0031] Please refer to Figures 1 to 6 , Figure 1 is a flow chart of a card holder 4 processing method provided by an embodiment of the application. Figure 2 is a structural schematic diagram of a plate 3 material 1 in a card holder 4 processing method provided by an embodiment of the application. Figure 3 is a structural schematic diagram of a first set of positioning holes 12 in a card holder 4 processing method provided by an embodiment of the application. Figure 4 is a structural schematic diagram of a second set of positioning holes 13 in a card holder 4 processing method provided by an embodiment of the application. Figure 5 is a structural schematic diagram of a card holder cap blank 2 in a card holder 4 processing method provided by an embodiment of the application. Figure 6 is a structural schematic diagram of a card holder cap 21 in a card holder 4 processing method provided by an embodiment of the application. The card holder 4 processing method provided by an embodiment of the application comprises the following steps:

[0032] In step S100, the plate material 1 is punched to form the pull rod hole 11 and the first set of positioning holes 12 on the plate material 1; wherein the punching of the plate material 1 comprises: punching the plate material 1 according to a preset flatness, wherein the flatness is not greater than 0.10 mm.

[0033] Specifically, the cutting of the plate 1 can be performed according to the design size of the card holder 4, so as to ensure that the size accuracy is controlled within ±0.02 mm. Then, punching equipment is used to punch the plate 1 to form the pull rod hole 11 and the first set of positioning holes 12, the first set of positioning holes 12 including a plurality of positioning holes distributed at intervals. Before punching, the plate 1 is pretreated to ensure that the flatness of the plate 1 is controlled within 0.1 mm, so as to ensure the accuracy of subsequent processing and reduce the accumulation of errors in subsequent processing. According to the material and thickness of the plate 1, appropriate punching speed and pressure can be set. After punching, quality inspection can be performed, including checking the flatness, grain size and performance test report, to ensure that the quality of the plate 1 meets the processing requirements.

[0034] Step S200, grinding the plate 1 after punching;

[0035] Specifically, after the pull rod hole 11 and the first set of positioning holes 12 are formed on the plate 1 through the above step S100, the plate 1 after punching is ground to remove burrs and unevenness that may be generated during the punching process, which is beneficial to improve the surface quality of the plate 1. According to the material and thickness of the plate 1, appropriate grinding speed and pressure can be set. During the grinding process, a cooling system can also be used to prevent the plate 1 from overheating and deforming, ensuring the grinding quality. Through the punching and grinding operations of the above steps S100 and S200, accurate references can be provided for the subsequent CNC processing of steps S300 and S400, ensuring the position accuracy and shape accuracy of the card holder cap blank 2.

[0036] Step S300, CNC processing the front surface 14 of the plate 1 after grinding to form a second set of positioning holes 13 on the plate 1; wherein the CNC processing of the front surface 14 of the plate 1 after grinding includes: using the first set of positioning holes 12 as the positioning reference in the XY direction, and using the back surface 15 of the plate 1 as the positioning reference in the Z direction, to CNC process the front surface 14 of the plate 1 after grinding.

[0037] Specifically, after the plate 1 is ground through the above step S200, the CNC processing technology can be used to process the front surface 14 of the plate 1 after grinding, and a four-axis CNC machine tool can be used to process the plate 1 to form the second set of positioning holes 13. During the processing, the first set of positioning holes 12 is used as the positioning reference in the XY direction, and the back surface 15 of the plate 1 is used as the positioning reference in the Z direction, to ensure the accuracy and precision of the CNC processing.

[0038] Step S400, the back surface 15 of the plate 1 after the front surface 14 is machined is machined by CNC to form the card holder cap blank 2; wherein the back surface 15 of the plate 1 after the front surface 14 is machined is machined by CNC, including: using the second set of positioning holes 13 as the positioning reference in the XY direction, and using the front surface 14 of the plate 1 as the positioning reference in the Z direction, to machine the back surface 15 of the plate 1 after the front surface 14 is machined by CNC.

[0039] Specifically, the second set of positioning holes 13 is used as the positioning reference in the XY direction, and the front surface 14 of the plate 1 is used as the positioning reference in the Z direction, to machine the back surface 15 of the plate 1 by CNC to form the card holder cap blank 2. The cutting speed and feed rate can be set according to the material and thickness of the plate 1. Before CNC machining, the plate 1 can be pretreated, such as removing surface impurities, to improve the quality and efficiency of the machining. After CNC machining, precise positioning can be achieved and the preliminary shape of the card holder cap 21 can be machined.

[0040] Step S500, surface treatment is performed on the card holder cap blank 2 to obtain the card holder cap 21 to be stamped, wherein the surface treatment includes polishing, sandblasting, and anodizing. The sandblasting of the card holder cap blank 2 includes using zirconium sand as the sandblasting material. The anodizing of the card holder cap blank 2 includes anodizing the card holder cap blank 2 according to a preset thickness value to form an anodized film on the card holder cap blank 2, wherein the thickness value ranges from 5 to 10 microns.

[0041] Specifically, after the card holder cap blank 2 is formed by the above steps S100 to S400, polishing, sandblasting, and anodizing can be performed in sequence. Polishing removes machining marks and improves surface finish. Sandblasting uses zirconium sand as the sandblasting material to enhance surface roughness and adhesion. In addition, deburring and overall inspection can be performed between steps S400 and S500. Overall inspection is performed after polishing, sandblasting, and anodizing, respectively. Anodizing forms an anodized film with corrosion resistance according to a preset thickness value, such as a thickness value of 5 to 10 microns. Polishing, sandblasting, and anodizing can significantly improve the surface finish and corrosion resistance of the card holder cap 21, providing a good foundation for subsequent injection molding in step S700.

[0042] Step S600, the card holder cap 21 to be stamped is stamped and blanked to obtain the card holder cap 21.

[0043] Specifically, after the card holder cap 21 to be punched is obtained through the above steps S100 to S500, the card holder cap 21 to be punched can be punched and blanked, that is, the punching equipment is used to apply pressure to the card holder cap 21 to be punched, so that the card holder cap 21 is separated along the predetermined contour line. For example, a multi-stage punching process can be used to gradually approach the final shape, ensure the yield rate, and form the card holder cap 21 product that meets the design specifications.

[0044] In step S700, the middle plate 3 is obtained, and the middle plate 3 and the card holder cap 21 are injection molded to form the card holder 4. The injection molding of the middle plate 3 and the card holder cap 21 to form the card holder 4 includes: placing the card holder cap 21 and the middle plate 3 in a mold for one-time injection molding to form the card holder 4; and performing secondary injection molding on the card holder 4 to add a waterproof silica gel ring 5 to the card holder 4. The one-time injection molding of the card holder cap 21 and the middle plate 3 in the mold includes: using a composite material 5 of polycarbonate added with 20% glass fiber for one-time injection molding of the card holder cap 21 and the middle plate 3 in the mold.

[0045] Specifically, after the card holder cap 21 is obtained through the above steps S100 to S600, the middle plate 3 and the card holder cap 21 are injection molded to form the card holder 4. In addition, a comprehensive inspection can be performed between the above steps S600 and S700. After step S700 is completed, a comprehensive inspection can also be performed and the card holder 4 can be packaged and shipped. It should be noted that during the injection molding process, the card holder cap 21 and the middle plate 3 are first placed inside a mold, and a polycarbonate composite material 5 added with 20% glass fiber is used for one-time injection molding to improve the mechanical strength of the card holder 4 and form an injection molding structure at a predetermined position. The polycarbonate composite material 5 added with 20% glass fiber refers to the mass percentage of glass fiber in the composite material 5 being 20%. Subsequently, the card holder 4 is subjected to secondary injection molding to add a waterproof silica gel ring 5 to enhance the waterproof performance of the card holder 4. After the middle plate 3 and the card holder cap 21 are injection molded, the overall manufacturing of the card holder 4 is completed, realizing a complete transformation process from raw materials to finished products.

[0046] The application provides a card holder 4 processing method, which comprises the following steps of: punching a plate 1 to form a pull rod hole 11 and a first set of positioning holes 12 on the plate 1; grinding the plate 1 after punching; performing CNC processing on the front surface 14 of the plate 1 after grinding to form a second set of positioning holes 13 on the plate 1; performing CNC processing on the back surface 15 of the plate 1 after processing the front surface 14 to form a card holder cap blank 2; sequentially performing polishing processing, sand blasting treatment and anodic oxidation treatment on the card holder cap blank 2 to obtain a card holder cap 21 to be punched; performing stamping and blanking on the card holder cap 21 to be punched to obtain the card holder cap 21; obtaining a middle plate 3, and performing injection molding processing on the card holder cap 21 and the middle plate 3 to form the card holder 4. In this way, the pull rod hole 11, the first set of positioning holes 12 and the second set of positioning holes 13 are formed on the plate 1 through punching, grinding and CNC processing, a positioning basis is provided for subsequent processing of the card holder cap 21, the card holder cap blank 2 is formed, and the preliminary shape, size and position of the card holder 4 are ensured. The surface quality, surface finish and corrosion resistance of the card holder cap 21 are improved through polishing, sand blasting and anodic oxidation treatment on the card holder cap blank 2. The card holder cap 21 after stamping and blanking and the middle plate 3 are injection molded, the overall processing of the card holder 4 is completed, and high precision and high quality of the card holder 4 are ensured. Therefore, the technical effects of improving processing precision and production efficiency are achieved.

[0047] In order to make a detailed description of the card holder 4 provided by the application, the above-mentioned embodiment one makes a detailed description of a card holder 4 processing method, and based on the same inventive concept, the application further provides a card holder 4, which is described in detail in embodiment two.

[0048] Please refer to Figure 7 , Figure 7 is a structural schematic diagram of a card holder 4 provided by the embodiment of the application. Embodiment two of the application provides a card holder 4, wherein the card holder cap 21 is obtained by the card holder 4 processing method.

[0049] The application provides a card holder 4, by punching a plate 1 to form a pull rod hole 11 and a first set of positioning holes 12 on the plate 1. The plate 1 after punching is polished, and the front surface 14 of the plate 1 after polishing is processed by CNC to form a second set of positioning holes 13 on the plate 1. The back surface 15 of the plate 1 after processing the front surface 14 is processed by CNC to form a card holder cap blank 2. The card holder cap blank 2 is sequentially polished, sandblasted and anodized to obtain a card holder cap 21 to be punched. The card holder cap 21 to be punched is punched and blanked to obtain the card holder cap 21. A middle plate 3 is obtained, and the middle plate 3 is injection molded with the card holder cap 21 to form the card holder 4. In this way, the pull rod hole 11, the first set of positioning holes 12 and the second set of positioning holes 13 are formed on the plate 1 by punching, polishing and CNC processing, which provides a positioning basis for subsequent processing of the card holder cap 21, and forms the card holder cap blank 2, which ensures the preliminary shape, size and position of the card holder 4. The surface quality, surface finish and corrosion resistance of the card holder cap 21 are improved by polishing, sandblasting and anodizing the card holder cap blank 2. The card holder cap 21 after punching and blanking is injection molded with the middle plate 3 to complete the overall processing of the card holder 4, which ensures high precision and high quality of the card holder 4. Thus, the technical effects of improving processing precision and production efficiency are achieved.

[0050] In order to make a detailed description of the electronic device 6 provided by the application, the above-mentioned embodiment one makes a detailed description of a card holder 4 processing method, and based on the same inventive concept, the application also provides an electronic device 6, which is described in detail in embodiment three.

[0051] Please see Figure 8 , Figure 8 is a structural schematic diagram of an electronic device 6 provided by the embodiment of the application. Embodiment three of the application provides an electronic device 6, which comprises a shell 61, the shell 61 is provided with a card holder hole 62, and the card holder 4 is detachably accommodated in the card holder hole 62 and connected with the shell 61.

[0052] The electronic device 6 is provided by punching a plate 1 to form a pull rod hole 11 and a first set of positioning holes 12 on the plate 1. The plate 1 after punching is ground, and the front surface 14 of the plate 1 after grinding is CNC processed to form a second set of positioning holes 13 on the plate 1. The back surface 15 of the plate 1 after processing the front surface 14 is CNC processed to form a card holder cap blank 2. The card holder cap blank 2 is sequentially polished, sandblasted and anodized to obtain a card holder cap 21 to be punched. The card holder cap 21 to be punched is punched and blanked to obtain the card holder cap 21. A middle plate 3 is obtained, and the middle plate 3 is injection molded with the card holder cap 21 to form a card holder 4. The card holder 4 is detachably accommodated inside a card holder hole 62 of a shell 61. In this way, the pull rod hole 11, the first set of positioning holes 12 and the second set of positioning holes 13 are formed on the plate 1 by punching, grinding and CNC processing, which provides a positioning basis for subsequent processing of the card holder cap 21, and forms the card holder cap blank 2, which ensures the preliminary shape, size and position of the card holder 4. The surface quality, surface finish and corrosion resistance of the card holder cap 21 are improved by polishing, sandblasting and anodizing the card holder cap blank 2. The card holder cap 21 after punching and blanking is injection molded with the middle plate 3 to complete the overall processing of the card holder 4, which ensures high precision and high quality of the card holder 4. Thus, the technical effects of improving processing precision and production efficiency are achieved.

[0053] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0054] The above embodiments only express the preferred embodiments of the present application, which are described in detail and specifically, but should not be construed as limiting the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A card carrier processing method, characterized by, The card holder processing method comprises: punching the plate to form a pull rod hole and a first set of positioning holes on the plate; grinding the punched plate; CNC processing the front surface of the ground plate to form a second set of positioning holes on the plate; CNC processing the back surface of the front-surface-processed plate to form a card holder cap blank; surface treating the card holder cap blank to obtain a card holder cap to be punched; punching and blanking the card holder cap to be punched to obtain a card holder cap; obtaining a middle plate and injection molding the middle plate and the card holder cap to form a card holder.

2. The card edge processing method of claim 1, wherein, The CNC processing of the front surface of the ground plate comprises: adopting the first set of positioning holes as the positioning reference in the XY direction and adopting the back surface of the plate as the positioning reference in the Z direction to CNC process the front surface of the ground plate.

3. The card edge processing method of claim 1, wherein, The CNC processing of the back surface of the front-surface-processed plate comprises: adopting the second set of positioning holes as the positioning reference in the XY direction and adopting the front surface of the plate as the positioning reference in the Z direction to CNC process the back surface of the front-surface-processed plate.

4. The card edge processing method of claim 1, wherein, The surface treatment of the card holder cap blank comprises sand blasting treatment, and the sand blasting treatment comprises: adopting zirconium sand as the sand blasting material to sand blast the card holder cap blank.

5. The card edge processing method of claim 1, wherein, The surface treatment of the card holder cap blank comprises anodic oxidation treatment, and the anodic oxidation treatment comprises: anodically oxidizing the card holder cap blank according to a preset thickness value to form an anodic oxidation film on the card holder cap blank, wherein the thickness value ranges from 5 μm to 10 μm.

6. The card edge processing method of claim 1, wherein, The injection molding of the card holder cap and the middle plate in the mold to form a card holder comprises: one-time injection molding of the card holder cap and the middle plate in the mold to form a card holder and secondary injection molding of the card holder to add a waterproof silica gel ring on the card holder.

7. The card edge processing method of claim 6, wherein, The one-time injection molding of the card holder cap and the middle plate in the mold comprises: one-time injection molding of the card holder cap and the middle plate in the mold by using a composite material of polycarbonate added with 20% glass fiber.

8. The card edge processing method of claim 1, wherein, The punching of the plate comprises: punching the plate according to a preset flatness, wherein the flatness is not greater than 0.10 mm.

9. A card holder characterized in that The card holder is obtained by the card holder processing method according to any one of claims 1 to 8.

10. An electronic device, comprising: The electronic device comprises: a shell provided with a card holder hole, and the card holder according to claim 9, which is detachably accommodated in the card holder hole and connected with the shell.

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