A jet flow control-based drilling system auxiliary chip removal device

Abstract

The application relates to a jet flow control-based hole making system auxiliary chip removal device, which comprises a high-pressure buffer assembly, a low-pressure buffer assembly and a gas guide mechanism. The high-pressure buffer assembly is arranged in the low-pressure buffer assembly and is used for blowing up and suspending chips in the air. The low-pressure buffer assembly is wrapped outside the high-pressure buffer assembly and is used for absorbing chips. The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a through knife inlet channel in the same longitudinal direction, which is used for the knife to pass through the working area of the surface to be processed to perform drilling work. The bottom of the low-pressure buffer assembly is attached to the surface to be processed. The gas guide mechanism is used for adjusting and optimizing the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly. Compared with the prior art, the application combines the high-pressure blowing and low-pressure suction double mechanisms, effectively solves the problem of low efficiency of the traditional chip removal mode. The introduction of the gas guide mechanism realizes the accurate regulation and control of the airflow, and improves the pertinence and efficiency of the chip removal.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mechanical processing, in particular to a drilling system auxiliary chip removal device based on jet flow control. BACKGROUND

[0002] In metal cutting processing, if the chips generated by drilling operation are not removed in time, it will not only affect the processing efficiency, but also cause tool wear, workpiece surface quality decline and safety hazards.

[0003] Through investigation, the existing drilling chip removal device is divided into two types of straight suction type and blowing suction type, wherein the wind field of the straight suction type chip removal device is approximately axisymmetric distribution, which causes the following problems: 1. The chips are located in the central region of the chip removal device, and the flow field in this region just forms a low-speed high-pressure area, so it is difficult to remove the chips; 2. The suction pressure decays quickly, and the effective chip removal airflow is difficult to reach the chip area. The blowing suction type chip removal device makes up for the deficiency of the straight suction type, but still has the following problems: 1. During the machining process, the wind field around the tool exists in the form of cylindrical flow, which produces a low-speed area in the "leeward surface", hindering the chips from moving with the fluid; 2. Part of the chips are blown into the environment instead of entering the suction port.

[0004] Therefore, in combination with the existing needs of the chip removal device in the machining process and the deficiencies of the existing chip removal device, it is particularly important to develop a device that can effectively and quickly remove the drilling chips. SUMMARY

[0005] The purpose of the present application is to overcome the defects of the prior art, and to provide a drilling system auxiliary chip removal device based on jet flow control. The present application precisely controls the direction and intensity of airflow by using the principle of airflow dynamics, so as to realize a device for efficiently and continuously removing chips during drilling process, and improve the processing efficiency and workpiece quality.

[0006] The purpose of the present application can be realized by the following technical scheme:

[0007] The present application provides a drilling system auxiliary chip removal device based on jet flow control, which comprises: a high-pressure buffer assembly, a low-pressure buffer assembly, and a gas guide mechanism.

[0008] The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly, and is used to blow up the chips and suspend them in the air.

[0009] The low-pressure buffer assembly is wrapped outside the high-pressure buffer assembly and is used to absorb the chips.

[0010] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a through knife inlet channel in the same longitudinal direction, which is used for the tool to pass through the working area of the workpiece to be machined for drilling operation.

[0011] The bottom of the low-pressure buffer assembly is attached to the surface to be processed.

[0012] The air guide mechanism is used to adjust and optimize the direction and speed of the air flow in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0013] In some embodiments, the high-pressure buffer assembly includes a high-pressure buffer cavity, an air inlet pipe,

[0014] The air inlet pipe is in communication with the high-pressure buffer cavity and is used to connect a high-pressure air source.

[0015] The high-pressure buffer cavity is used to guide the air flow entering from the air inlet pipe to the working area.

[0016] In some embodiments, the air inlet pipe is provided with one or more.

[0017] In some embodiments, the low-pressure buffer assembly includes a low-pressure buffer cavity, an air suction pipe,

[0018] The air suction pipe is in communication with the low-pressure buffer cavity and is used to connect a low-pressure air source.

[0019] The low-pressure buffer cavity is used to guide the air flow from the working area to the air suction pipe.

[0020] In some embodiments, the air suction pipe is provided with one or more.

[0021] In some embodiments, the air guide mechanism includes a plurality of air guide vanes arranged in the low-pressure buffer cavity and used to guide the air flow, the air guide vanes being located above the surface to be processed and around the chips in the working area.

[0022] In some embodiments, the air guide mechanism includes an air inlet branch pipe, a power impeller, an air guide impeller,

[0023] The air inlet branch pipe is used to connect a high-pressure air source.

[0024] The power impeller is arranged in the low-pressure buffer cavity, aligned with the air inlet branch pipe, and connected with the air guide impeller.

[0025] The power impeller and the air guide impeller are provided with holes penetrating the tool inlet channel, the air guide vanes include a plurality of air guide vanes arranged around the holes and located above the surface to be processed and around the chips in the working area, and are used to change the direction of the air flow in the working area.

[0026] In some embodiments, further comprising: a chip collection device, a filtration system, a control system,

[0027] The chip collection device is connected to the air suction pipe and is used to collect and store the suctioned chips.

[0028] The filtering device is arranged inside the air suction pipe or between the chip collection device and the air suction pipe, and is used for placing the chips into the low-pressure air source.

[0029] The control system is used for receiving external signals and adjusting the gas parameters in the air suction pipe and the air inlet pipe.

[0030] In some specific embodiments, a sealing ring is arranged between the bottom of the low-pressure buffer cavity and the surface to be machined.

[0031] In some specific embodiments, the high-pressure buffer assembly and the low-pressure buffer assembly are made of wear-resistant and corrosion-resistant materials.

[0032] Compared with the prior art, the present application has the following beneficial effects:

[0033] (1) The device of the present application dynamically adjusts the gas flow parameters by controlling the direction and intensity of the gas flow, generates a time-varying wind field, effectively removes the chips generated during the drilling process from the working area, and improves the drilling efficiency and safety.

[0034] (2) The present application combines the high-pressure blowing and low-pressure suction mechanisms to effectively solve the problem of low efficiency of traditional chip removal. The introduction of the gas guide mechanism realizes the precise control of the gas flow and improves the targeting and efficiency of chip removal.

[0035] (3) The device of the present application has a simple and compact structure, is easy to install and maintain, and is suitable for various machining scenes. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 Figure 1 is a schematic diagram of the structure of embodiment 1 of the present application.

[0037] Figure 2 Figure 2 is another schematic diagram of the structure of embodiment 1 of the present application.

[0038] Figure 3 Figure 3 is a schematic diagram of the structure of embodiment 2 of the present application.

[0039] Figure 4 Figure 4 is a schematic diagram of the gas guide structure in embodiment 2 of the present application.

[0040] The figures are identified as follows:

[0041] 1 is a cavity wall, 2 is an air suction pipe, 3 is an air inlet pipe, 4 is a high-pressure buffer cavity, 5 is a low-pressure buffer cavity, 6 is a chip inlet, 7 is a tool inlet channel, 8 is a gas guide mechanism, 9 is a surface to be machined, 10 is a chip, 11 is a sealing ring, 12 is a gas guide vane, 13 is an air inlet branch pipe, 14 is a power impeller, 15 is a gas guide impeller, and 16 is a bearing. DETAILED DESCRIPTION

[0042] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0044] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0045] In the following embodiments, unless otherwise specified, the functional components or structures are conventional components or structures used in the art to achieve the corresponding functions.

[0046] Example 1

[0047] like Figures 1-2 As shown, this is an auxiliary chip removal device for a hole-making system based on jet control, including: a high-pressure buffer assembly, a low-pressure buffer assembly, and an air guiding mechanism 8;

[0048] The high-pressure buffer assembly is located inside the low-pressure buffer assembly and is used to blow the chips up and suspend them in the air.

[0049] The low-pressure buffer component is wrapped around the high-pressure buffer component and is used to absorb chips.

[0050] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a through-passage tool inlet channel 7 in the same longitudinal direction for the tool to pass through the working area of ​​the surface to be processed 9 to perform drilling operations.

[0051] The bottom of the low-pressure buffer assembly is in contact with the surface to be processed 9;

[0052] The air guiding mechanism 8 is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0053] More specifically, in this embodiment:

[0054] The auxiliary chip removal device for the jet-controlled hole-making system includes a high-pressure buffer assembly, a low-pressure buffer assembly, and an air guiding mechanism.

[0055] The high-pressure buffer assembly comprises a high-pressure buffer chamber 4 and an air inlet pipe 3, wherein the air inlet pipe 3 is in communication with the high-pressure buffer chamber 4 and is used to connect a high-pressure gas source to blow high-pressure gas flow into the high-pressure buffer chamber 4 to blow away the cuttings generated in the drilling process. The high-pressure buffer chamber 4 is used to guide the gas flow entering from the air inlet pipe 3 to the working area. The air inlet pipe 3 can be provided with one or more, and the parameters of the gas flow, such as flow rate, flow volume, pressure, etc., can be adjusted manually or automatically.

[0056] The low-pressure buffer assembly is wrapped outside the high-pressure buffer assembly and is used to absorb the cuttings. The low-pressure buffer assembly comprises a low-pressure buffer chamber 5 and an air suction pipe 2, wherein the air suction pipe 2 is in communication with the low-pressure buffer chamber 5 and is used to connect a low-pressure gas source to form a negative pressure area for sucking and discharging the suspended cuttings and reducing flow loss. The low-pressure buffer chamber 5 is used to guide the gas flow from the working area to the air suction pipe 2. The air suction pipe 2 can be provided with one or more, and the parameters of the gas flow, such as flow rate, flow volume, pressure, etc., can be adjusted manually or automatically.

[0057] The high-pressure buffer chamber 4 is located inside, and the low-pressure buffer chamber 5 wraps the high-pressure buffer chamber 4 outside to form two chambers fixed inside and outside. The chamber walls 1 of the high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are made of wear-resistant and corrosion-resistant materials. The bottom of the low-pressure buffer chamber 5 is attached to the surface to be processed 9 through a sealing gasket 11, or can be attached through wool felt, a brush, etc. to ensure the effective guidance and sealing of the gas flow. The high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are provided with a tool inlet channel 7 at the same longitudinal direction at the central area, which is used for the tool to pass through to perform the drilling operation on the working area of the surface to be processed 9. The cuttings 10 generated by drilling are located in the area directly below the tool inlet channel 7.

[0058] The air guide mechanism 8 comprises a plurality of air guide vanes 12 arranged in the low-pressure buffer chamber 5 and used to guide the gas flow. The air guide vanes 12 can be connected with the chamber wall 1 of the high-pressure buffer chamber 4. The air guide vanes 12 are located above the surface to be processed 9 and around the cuttings in the working area.

[0059] In addition, it also comprises a cutting collection device, a filtering system and a control system.

[0060] The cutting collection device is connected with the air suction pipe 2 and is used to collect and store the cuttings sucked in. The filtering device is arranged inside the air suction pipe 2 or between the cutting collection device and the air suction pipe 2 and is used to place the cuttings to enter the low-pressure gas source. The control system is used to receive external signals to adjust the gas parameters in the air suction pipe 2 and the air inlet pipe 3.

[0061] In this embodiment, the high-pressure gas flow enters the high-pressure buffer cavity 4 through the air inlet pipe 3, aiming at the drilling action area, and uses the power of the gas flow to blow up the generated chips 10 and suspend them in the air, avoiding their direct adhesion to the tool or workpiece surface. At the same time, the low-pressure gas source passes through the air suction pipe 2 to generate negative pressure in the low-pressure buffer cavity 5, and the suspended chips 10 are sucked in and transported to the chip collection device, realizing the continuous and efficient removal of the chips 10. The gas guide mechanism 8 designed based on fluid mechanics can adjust the direction and speed of the gas flow, optimize the wind field state, significantly improve the chip removal efficiency, and reduce energy consumption.

[0062] In the drilling process, the jet flow control-based drilling system auxiliary chip removal device of this embodiment has a chip inlet 6 at the bottom, which corresponds to the surface to be machined 9. The drilling tool enters through the tool inlet passage 7, drills the surface to be machined 9, and the high-pressure gas flow enters the device from the air inlet pipe 3, passes through the high-pressure buffer cavity 4 to the designated area to blow up the chips 10, and then the chips 10 are removed by the negative pressure generated by the air suction pipe 2 in the low-pressure buffer cavity 5.

[0063] Embodiment 2

[0064] As shown in Figures 3-4 , it is a jet flow control-based drilling system auxiliary chip removal device, which includes: a high-pressure buffer assembly, a low-pressure buffer assembly, and a gas guide mechanism 8.

[0065] The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly and is used to blow up the chips and suspend them in the air.

[0066] The low-pressure buffer assembly is wrapped outside the high-pressure buffer assembly and is used to absorb the chips.

[0067] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a through tool inlet passage 7 in the same longitudinal direction, which is used for the tool to pass through the working area of the surface to be machined 9 for drilling work.

[0068] The bottom of the low-pressure buffer assembly is in contact with the surface to be machined 9.

[0069] The gas guide mechanism 8 is used to adjust and optimize the direction and speed of the gas flow in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0070] More specifically, in this embodiment:

[0071] The jet flow control-based drilling system auxiliary chip removal device includes a high-pressure buffer assembly, a low-pressure buffer assembly, and a gas guide mechanism 8.

[0072] The high-pressure buffer assembly comprises a high-pressure buffer chamber 4 and an air inlet pipe 3, wherein the air inlet pipe 3 is communicated with the high-pressure buffer chamber 4 and is used for connecting a high-pressure air source to blow high-pressure air flow into the high-pressure buffer chamber 4 to blow away the cuttings generated in the drilling process. The high-pressure buffer chamber 4 is used for guiding the air flow entering from the air inlet pipe 3 to the working area. The air inlet pipe 3 can be provided with one or more, and the parameters of the air flow, such as flow rate, flow volume, pressure, etc., can be adjusted by manual or automatic mode.

[0073] The low-pressure buffer assembly is wrapped outside the high-pressure buffer assembly and is used for absorbing the cuttings. The low-pressure buffer assembly comprises a low-pressure buffer chamber 5 and an air suction pipe 2, wherein the air suction pipe 2 is communicated with the low-pressure buffer chamber 5 and is used for connecting a low-pressure air source to form a negative pressure area for sucking and discharging the suspended cuttings and reducing flow loss. The low-pressure buffer chamber 5 is used for guiding the air flow from the working area to the air suction pipe 2. The air suction pipe 2 can be provided with one or more, and the parameters of the air flow, such as flow rate, flow volume, pressure, etc., can be adjusted by manual or automatic mode.

[0074] The high-pressure buffer chamber 4 is located inside, and the low-pressure buffer chamber 5 wraps the high-pressure buffer chamber 4 outside to form two chambers fixed inside and outside. The chamber wall 1 of the high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 is made of wear-resistant and corrosion-resistant material. The bottom of the low-pressure buffer chamber 5 is attached to the surface to be processed 9 through a sealing gasket 11, or can be attached through wool felt, a brush, etc. to ensure the effective guidance and sealing of the air flow. The high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are provided with a cutter inlet channel 7 at the same longitudinal direction at the central area, which is used for the cutter to pass through to perform the drilling operation on the working area of the surface to be processed 9. The cuttings 10 generated by the drilling are located in the area directly below the cutter inlet channel 7.

[0075] The air guide mechanism 8 comprises an air inlet branch pipe 13, a power impeller 14 and a guide impeller 15.

[0076] The air inlet branch pipe 13 is arranged on the chamber wall 1 of the low-pressure buffer chamber 5 and is connected with the high-pressure air source.

[0077] The power impeller 14 is connected with the chamber wall 1 of the low-pressure buffer chamber 5 through a bearing 16 and can rotate relative to the chamber wall 1. The power impeller 14 is provided with a blade structure and is aligned with the air inlet branch pipe 13. The high-pressure air flow in the air inlet branch pipe 13 drives the power impeller 14 to rotate.

[0078] The power impeller 14 is connected with the guide vane 15 below, and drives the guide vane 15 to rotate. The connection mode of the two can be adhesive, welding, one-piece forming, etc. The power impeller 14 and the guide vane 15 are provided with a hole through the tool inlet channel 7, so that the tool can work after passing through, and the airflow is introduced into the working area. The guide vane includes a plurality of guide vanes arranged around the hole, and is located above the machined surface 9 and around the chip in the working area, for changing the airflow direction of the working area. Through the synergistic effect of the above-mentioned mechanism, a rotating flow field changing in the working area is generated.

[0079] In addition, it also includes: chip collecting device, filtering system, control system, wherein the chip collecting device is connected with the suction pipe 2, for collecting and storing the suctioned chips;

[0080] The filtering device is arranged inside the suction pipe 2 or between the chip collecting device and the suction pipe 2, for placing the chips into the low-pressure air source;

[0081] The control system is used for receiving external signals, and adjusting the gas parameters in the suction pipe 2 and the inlet pipe 3.

[0082] In the embodiment, the high-pressure airflow enters the high-pressure buffer cavity 4 through the inlet pipe 3, and is aligned with the drilling working area. The generated chips 10 are blown up and suspended in the air by the power of the airflow, so as to avoid direct adhesion to the tool or the workpiece surface. At the same time, the low-pressure air source makes the low-pressure buffer cavity 5 generate negative pressure through the suction pipe 2, so as to suck and transport the suspended chips 10 into the chip collecting device, and realize continuous and efficient removal of the chips 10. The guide mechanism 8 designed based on fluid mechanics can adjust the airflow direction and speed, optimize the wind field state, significantly improve the chip removal efficiency, and reduce the energy consumption.

[0083] In the drilling process, the jet flow control-based drilling system auxiliary chip removal device of the embodiment is used as the chip inlet 6 corresponding to the machined surface 9, the drilling tool enters through the tool inlet channel 7, the high-pressure airflow enters the device from the inlet pipe 3, passes through the high-pressure buffer cavity 4 to the specified area to blow up the chips 10, and then the chips 10 are removed by the negative pressure generated by the suction pipe 2.

[0084] The above description of the embodiments is for the convenience of those skilled in the art to understand and use the invention. Those skilled in the art can easily make various modifications to these embodiments, and apply the general principles described herein to other embodiments without creative labor. Therefore, the present application is not limited to the above-mentioned embodiments, and the improvements and modifications made by those skilled in the art without departing from the scope of the present application should be within the scope of protection of the present application.

Claims

1. An auxiliary chip removal device for a hole-making system based on jet control, characterized in that, include: High-pressure buffer assembly, low-pressure buffer assembly, air guiding mechanism (8); The high-pressure buffer assembly is located inside the low-pressure buffer assembly and is used to blow the chips (10) up and suspend them in the air; The low-pressure buffer component is wrapped around the high-pressure buffer component and is used to absorb chips (10). The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a through-flow tool inlet channel (7) in the same longitudinal direction for the tool to pass through the working area of ​​the surface to be machined (9) to perform drilling operations. The bottom of the low-pressure buffer assembly is in contact with the surface to be processed (9); The air guiding mechanism (8) is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly; The high-pressure buffer assembly includes a high-pressure buffer chamber (4) and an air inlet pipe (3). The air inlet pipe (3) is connected to the high-pressure buffer chamber (4) and is used to connect to a high-pressure air source; The high-pressure buffer chamber (4) is used to guide the airflow entering from the air inlet pipe (3) to the working area; The low-pressure buffer assembly includes a low-pressure buffer chamber (5) and an air intake pipe (2). The suction pipe (2) is connected to the low-pressure buffer chamber (5) and is used to connect to a low-pressure air source; The low-pressure buffer chamber (5) is used to guide the airflow from the working area to the suction pipe (2); The air guiding mechanism (8) includes an air inlet branch pipe (13), a power impeller (14), and an air guiding impeller (15). The intake branch pipe (13) is located on the cavity wall (1) of the low-pressure buffer chamber (5) and is connected to the high-pressure air source; The power impeller (14) is connected to the cavity wall (1) of the low-pressure buffer chamber (5) through the bearing (16) and rotates relative to the cavity wall (1). It has a blade structure. The power impeller (14) is aligned with the air intake branch pipe (13). The high-pressure airflow in the air intake branch pipe (13) drives the power impeller (14) to rotate. The lower part of the power impeller (14) is connected to the air guide impeller (15) and drives the air guide impeller (15) to rotate. The power impeller (14) and the air guide impeller (15) are provided with holes that communicate with the tool inlet channel (7), so that the tool can pass through and perform operations, and introduce airflow into the working area; the air guide blades include several air guide blades arranged around the holes, and are located above the surface to be processed (9) and around the chips in the working area, for changing the airflow direction in the working area.

2. The auxiliary chip removal device for the hole-making system according to claim 1, characterized in that, The air intake pipe (3) is provided with one or more.

3. The auxiliary chip removal device for the hole-making system according to claim 1, characterized in that, The air inhalation tube (2) is provided with one or more.

4. The auxiliary chip removal device for the hole-making system according to claim 1, characterized in that, Also includes: Chip collection device, filtration system, control system The chip collection device is connected to the suction pipe (2) and is used to collect and store the sucked-in chips; The filtration system is located inside the suction pipe (2) or between the chip collection device and the suction pipe (2) to allow chips to enter the low-pressure air source; The control system is used to receive external signals and adjust the gas parameters in the inhalation pipe (2) and the intake pipe (3).

5. The auxiliary chip removal device for the hole-making system according to claim 1, characterized in that, A sealing ring (11) is provided between the bottom of the low-pressure buffer chamber (5) and the surface to be processed (9).

6. The auxiliary chip removal device for the hole-making system according to claim 1, characterized in that, The high-pressure buffer assembly and the low-pressure buffer assembly are made of wear-resistant and corrosion-resistant materials.

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