Packaging structure and method of water quality sensitive chip

Abstract

The invention discloses a packaging structure and method of a water quality sensitive chip, the water quality sensitive chip comprises a sensitive structure, the packaging structure comprises a packaging shell, an isolation layer and an electric connection structure, the packaging shell is provided with a water body channel, and the water quality sensitive chip, the isolation layer and the electric connection structure are all arranged in the packaging shell. And the isolation layer is positioned between the water quality sensitive chip and the electric connection structure. According to the packaging structure, the water quality sensitive chip can be packaged in the packaging shell, the water quality sensitive chip can be supported and protected, the water quality sensitive chip is prevented from being damaged by the outside world, and contact between the outside water body and the sensitive structure can be achieved through the water body channel; meanwhile, isolation between the internal structure and external water can be achieved through the isolation layer, and the external water is prevented from making contact with an electric signal access. The packaging structure is high in practicability, capable of achieving supporting protection, water sealing, electric connection and water pressure resistance of the water quality sensitive chip at the same time, and beneficial to application and popularization of the water quality sensitive chip in the field of water quality monitoring.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to a packaging structure and method of a water quality sensitive chip. Background Art

[0002] The sensitive unit of the water quality sensor can be manufactured using MEMS technology and semiconductor technology, that is, a water quality sensitive chip. The water quality sensitive chip has a sensitive structure, which converts the water quality signal to be tested into an electrical signal through chemical or physical reactions. Since the sensitive structure of the water quality sensitive chip needs to be in contact with the water body to be tested, the existing water quality sensitive chips are generally exposed structures, which is not only inconvenient for supporting use, but also the chip structure itself is extremely easy to damage, and the electrical signal path is also easily affected, making it difficult to be applied to actual water quality monitoring in a long-term and stable manner. Summary of the invention

[0003] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a packaging structure for a water quality sensitive chip, which can simultaneously achieve support protection, water sealing, electrical connection and water pressure resistance for the water quality sensitive chip, which is conducive to the promotion and application of water quality sensitive chips in the field of water quality monitoring.

[0004] In order to solve the above problems, the technical solution adopted by the present invention is as follows: the water quality sensitive chip includes a sensitive structure, the packaging structure includes a packaging shell, an isolation layer and an electrical connection structure, the packaging shell is provided with a water channel, the water quality sensitive chip, the isolation layer and the electrical connection structure are all arranged in the packaging shell, and the isolation layer is located between the water quality sensitive chip and the electrical connection structure, which is used to isolate the external water body from the internal structure, the sensitive structure can be electrically connected to the electrical connection structure, and the sensitive structure can also contact the external water body through the water channel, and transmit the electrical signal to the inner world through the electrical connection structure.

[0005] Compared with the prior art, the beneficial effect of the present invention is that the present packaging structure can encapsulate the water quality sensitive chip in the packaging shell, which can not only support and protect the water quality sensitive chip to prevent the water quality sensitive chip from being damaged by the outside world, but also realize the contact between the external water body and the sensitive structure through the water body channel, and at the same time, it can also realize the isolation between the internal structure such as the electrical connection structure and the external water body through the isolation layer, preventing the external water body from contacting the electrical signal path to avoid affecting the signal transmission. The present packaging structure has a simple structure and strong practicality. It can simultaneously realize the support protection, water sealing, electrical connection and water pressure resistance of the water quality sensitive chip, and can be stably applied to water body measurement for a long time, which is conducive to the promotion and application of water quality sensitive chips in the field of water quality monitoring.

[0006] The packaging structure of the above-mentioned water quality sensitive chip, the sensitive structure includes a sensitive electrode and a connecting electrode, the sensitive electrode and the connecting electrode are electrically connected, the connecting electrode can be electrically connected to the electrical connection structure, the sensitive electrode is used to sense the external water body, and transmit the electrical signal to the internal world through the connecting electrode and the electrical connection structure.

[0007] The packaging structure of the water quality sensitive chip mentioned above, the electrical connection structure is electrically connected to the inner side of the isolation layer, the connecting electrode is electrically connected to the outer side of the isolation layer, the inner side of the isolation layer is electrically connected to the outer side, wherein the inner side of the isolation layer is the side away from the water channel.

[0008] In the packaging structure of the water quality sensitive chip, the inner side and the outer side of the isolation layer are electrically connected via the isolation layer electrical structure, the electrical connection structure is welded and fixed to the inner side of the isolation layer electrical structure, and the connection electrode is welded and fixed to the outer side of the isolation layer electrical structure.

[0009] In the packaging structure of the water quality sensitive chip, the welding and fixing points between the connecting electrode and the isolation layer electrical structure are covered with waterproof glue, and the waterproof glue does not cover the sensitive electrode.

[0010] The packaging structure of the water quality sensitive chip mentioned above, the packaging shell includes a mounting shell and a protective cover, the protective cover is connected to the first end of the mounting shell, the water quality sensitive chip is installed in the mounting shell, and the sensitive structure is closer to the first end of the mounting shell than the electrical connection structure, and the water channel is opened in the protective cover.

[0011] In the packaging structure of the above-mentioned water quality sensitive chip, a first installation cavity and a second installation cavity in a stepped distribution are provided in the installation shell, the isolation layer is installed at the step between the first installation cavity and the second installation cavity, the electrical connection structure is located in the first installation cavity, the water quality sensitive chip is located in the second installation cavity, and the second installation cavity is connected to the water channel.

[0012] In the packaging structure of the water quality sensor chip, the communication port between the water channel and the external water body is opened on the side of the protective cover.

[0013] In the packaging structure of the water quality sensor chip, the width of the middle portion of the water channel is greater than the width of the connecting port.

[0014] In the packaging structure of the water quality sensor chip, the end of the packaging shell away from the water channel is filled with sealant, and the sealant covers the isolation layer or covers the isolation layer and part of the electrical connection structure.

[0015] The present invention also provides a packaging method for a water quality sensor chip, which uses the packaging structure of the water quality sensor chip, and comprises the following steps:

[0016] S1. Provide water quality sensitive chip, mounting shell, protective cover and isolation layer;

[0017] S2, welding and fixing the connecting electrode to the outer side of the isolation layer electrical structure;

[0018] S3. Use waterproof glue to seal the welding and fixing points of the connecting electrode and the electrical structure of the isolation layer, and ensure that the waterproof glue does not cover the sensitive electrode;

[0019] S4, electrically connecting and fixing the electrical connection structure to the inner side of the electrical structure of the isolation layer, and the electrical connection fixing method may be welding, fixing with conductive adhesive, etc.;

[0020] S5. Install the assembled water quality sensitive chip and the isolation layer into the installation shell;

[0021] S6. Use sealant to cover the isolation layer from the inside, or to cover the isolation layer and part of the electrical connection structure, so as to achieve connection and fixation between the isolation layer and the mounting shell;

[0022] S7. Fix the protective cover to the first end of the mounting shell.

[0023] The present packaging method can complete the packaging of water quality sensitive chips. The packaging operation is convenient and can simultaneously realize support protection, water sealing, electrical connection and water pressure resistance of the water quality sensitive chips. It can be stably applied to water body measurement for a long time, which is conducive to the promotion and application of water quality sensitive chips in the field of water quality monitoring.

[0024] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of the overall structure of the packaging structure of an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A cross-sectional view of the package structure shown.

[0027] Explanation of the accompanying drawings: 100 water quality sensitive chip, 110 sensitive structure, 200 packaging shell, 210 mounting shell, 211 first mounting cavity, 212 second mounting cavity, 213 step, 220 protective cover, 221 water channel, 222 connecting port, 300 isolation layer, 310 isolation layer electrical structure, 400 waterproof glue, 500 sealant, 600 electrical connection structure. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below. Figure 1 and Figure 2 An embodiment of the present invention provides a packaging structure of a water quality sensitive chip, wherein the water quality sensitive chip 100 includes a sensitive structure 110, and the packaging structure includes a packaging shell 200, an isolation layer 300 and an electrical connection structure 600. The packaging shell 200 is provided with a water channel 221. The water quality sensitive chip 100, the isolation layer 300 and the electrical connection structure 600 are all arranged in the packaging shell 200, and the isolation layer 300 is located between the water quality sensitive chip 100 and the electrical connection structure 600, and is used to isolate the external water body from the internal structure. The sensitive structure 110 can be electrically connected to the electrical connection structure 600, and the sensitive structure 110 can also contact the external water body through the water channel 221, and transmit the electrical signal to the inner world through the electrical connection structure 600.

[0029] The present packaging structure can encapsulate the water quality sensitive chip 100 in the packaging shell 200, which can not only support and protect the water quality sensitive chip 100 to prevent the water quality sensitive chip 100 from being damaged by the outside world, but also realize the contact between the external water body and the sensitive structure 110 through the water body channel 221, and at the same time, it can also realize the isolation between the electrical connection structure 600 and the external water body through the isolation layer 300, preventing the external water body from contacting the electrical signal path to avoid affecting the signal transmission. The present packaging structure has a simple structure and strong practicality. It can simultaneously realize the support protection, water sealing, electrical connection and water pressure resistance of the water quality sensitive chip 100, and can be used for water body measurement in a long-term and stable manner, which is conducive to the promotion and application of water quality sensitive chips in the field of water quality monitoring.

[0030] Furthermore, the sensitive structure 110 includes a sensitive electrode and a connecting electrode. The sensitive electrode is used to contact the external water body and sense external water quality parameters. The sensitive electrode is electrically connected to the connecting electrode. The connecting electrode is a signal transmission structure of the water quality sensitive chip 100 and is electrically connected to the electrical connection structure 600 to transmit the electrical signal to the inner world through the connecting electrode and the electrical connection structure 600.

[0031] Further, refer to Figure 2, the electrical connection structure 600 is electrically connected to the inner side of the isolation layer 300, the connecting electrode is electrically connected to the outer side of the isolation layer 300, and the inner side and the outer side of the isolation layer 300 are electrically connected, so that the electrical signal of the sensitive structure 110 is transmitted to the inner boundary through the connecting electrode and the electrical connection structure 600. Among them, the inner side of the isolation layer 300 is the side away from the water channel 221, and the outer side is the side close to the water channel 221, that is, the side close to the external water body. Furthermore, the inner side and the outer side of the isolation layer 300 are electrically connected through the isolation layer electrical structure 310, and the isolation layer electrical structure 310 is embedded in the interior of the isolation layer 300, the electrical connection structure 600 is welded and fixed to the inner side of the isolation layer electrical structure 310, and the connecting electrode is welded and fixed to the outer side of the isolation layer electrical structure 310. The connecting electrodes, the outside of the isolation layer electrical structure 310, and the welding and fixing parts of the connecting electrodes and the isolation layer electrical structure 310 are covered with waterproof glue 400, and the waterproof glue 400 does not cover the sensitive electrodes to prevent external water from contacting the electrical signal path. The end of the isolation layer 300 away from the water channel 221 is filled with sealant 500, and the sealant 500 covers the isolation layer 300 from the inside or covers the isolation layer 300 and part of the electrical connection structure 600. During packaging, the water quality sensitive chip 100 and the isolation layer 300 are fixed in the packaging shell 200, and the sealant 500 covers the isolation layer 300 from the inside, and can also cover part of the electrical connection structure 600, thereby achieving fixation between the isolation layer 300 and the packaging shell 200, and at the same time providing sufficient water pressure resistance for the entire packaging structure. Further, as Figure 2 As shown, the sealant 500 is filled in the inner end of the first mounting cavity 211 to cover the electrical connection structure 600 and the isolation layer 300 .

[0032] Furthermore, the overall shape of the packaging shell 200 can be square, cylindrical or other shapes, and the packaging shell 200 can be an integrated structure or a split structure. Figure 1 , Figure 2In the embodiment, the encapsulation shell 200 includes a mounting shell 210 and a protective cover 220, the protective cover 220 is connected to the first end of the mounting shell 210, the water channel 221 is opened in the protective cover 220, the water quality sensitive chip 100 is installed in the mounting shell 210, and the sensitive structure 110 is closer to the first end of the mounting shell 210 than the electrical connection structure 600, that is, closer to the protective cover 220 and the water channel 221, so that the sensitive electrode can contact the external water through the water channel 221. During packaging, the water quality sensitive chip 100 can be installed in the mounting shell 210 first, and then the protective cover 220 can be fixedly connected to the first end of the mounting shell 210, so that the space where the sensitive electrode is located can be connected to the water channel 221, or the sensitive electrode is directly exposed in the water channel 221, so that the external water can contact the sensitive electrode through the water channel 221. The protective cover 220 can be fixed to the first end of the mounting shell 210 by welding, threaded connection or snap connection.

[0033] Further, refer to Figure 2 The installation shell 210 is provided with a first installation cavity 211 and a second installation cavity 212 in a stepped distribution. The isolation layer 300 is installed at the step 213 between the first installation cavity 211 and the second installation cavity 212. The electrical connection structure 600 is located in the first installation cavity 211. The water quality sensitive chip 100 is located in the second installation cavity 212, and the second installation cavity 212 is connected to the water channel 221. Furthermore, the sensitive electrode does not extend out of the second installation cavity 212. Before the protective cover 220 is installed, the sensitive electrode is located in the second installation cavity 212 as a whole, and can be protected by the installation shell 210 to avoid collision damage. After the protective cover 220 is installed, the protective cover 220 can further protect the water quality sensitive chip 100, and the second installation cavity 212 is connected to the water channel 221, so that the external water can contact the sensitive electrode through the water channel 221.

[0034] Furthermore, the connecting port 222 between the water channel 221 and the external water body is opened on the side of the protective cover 220, so that the opposite side of the sensitive structure 110 can be directly protected by the protective cover 220, and during measurement, the water enters from the connecting port 222 on the side of the protective cover 220 and contacts the sensitive electrode. There can be multiple connecting ports 222 of the water channel 221 distributed along the periphery of the protective cover 220, and the middle width of the water channel 221 is greater than the width of the connecting port 222, so that the sensitive structure 110 can be in a relatively safe internal space, and the sensitive structure 110 can be better protected from damage. Furthermore, the water channel 221 can also add auxiliary water quality measurement structures, such as filters, specific selection membranes, etc., to improve the measurement accuracy of the water quality sensitive chip.

[0035] An embodiment of the present invention further provides a method for packaging a water quality sensor chip, using the packaging structure of the water quality sensor chip described above, comprising the following steps:

[0036] S1, providing a water quality sensing chip 100, a mounting shell 210, a protective cover 220 and an isolation layer 300;

[0037] S2, welding and fixing the connecting electrode to the outer side of the isolation layer electrical structure 310;

[0038] S3, using waterproof glue 400 to seal the welding and fixing points between the connecting electrode and the isolation layer electrical structure 310, and ensure that the waterproof glue 400 does not cover the sensitive electrode;

[0039] S4, electrically connecting and fixing the electrical connection structure 600 to the inner side of the isolation layer electrical structure 310, and the electrical connection and fixing method may be welding, fixing with conductive adhesive, etc.;

[0040] S5, installing the assembled water quality sensor chip 100 and the isolation layer 300 into the installation shell 210;

[0041] S6. Use sealant 500 to cover the isolation layer 300 from the inside, or cover the isolation layer 300 and part of the electrical connection structure 600, to achieve connection and fixation between the isolation layer 300 and the mounting shell 210;

[0042] S7 . Fix the protection cover 220 to the first end of the mounting shell 210 .

[0043] This packaging method can complete the packaging of water quality sensitive chips. The packaging operation is convenient, and the support protection, water sealing, electrical connection and water pressure resistance of the water quality sensitive chip can be achieved at the same time. It can be stably applied to water body measurement for a long time, which is conducive to the promotion and application of water quality sensitive chips in the field of water quality monitoring. Of course, it should be noted that the above steps S1 to S7 are only for the convenience of distinguishing the steps, and do not imply the order between the steps. For example, the above step S4 can be completed at any time, such as before step S2 and step S3, and the above step S3 can be completed at any time before step S7.

[0044] It should be noted that in the description of the present invention, if there are any orientation descriptions, such as up, down, front, back, left, right, etc., the orientations or positional relationships indicated are all based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and cannot be understood as a limitation on the present invention.

[0045] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0046] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0047] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A packaging structure of a water quality sensor chip, the water quality sensor chip (100) comprising a sensitive structure (110), characterized in that: The packaging structure comprises a packaging shell (200), an isolation layer (300) and an electrical connection structure (600); the packaging shell (200) is provided with a water channel (221); the water quality sensitive chip (100), the isolation layer (300) and the electrical connection structure (600) are all arranged in the packaging shell (200); and the isolation layer (300) is located between the water quality sensitive chip (100) and the electrical connection structure (600) to isolate the external water body from the internal structure; the sensitive structure (110) can be electrically connected to the electrical connection structure (600); and the sensitive structure (110) can also contact the external water body through the water channel (221) and transmit the electrical signal to the internal world through the electrical connection structure (600).

2. The packaging structure of the water quality sensor chip according to claim 1, characterized in that: The sensitive structure (110) comprises a sensitive electrode and a connecting electrode, the sensitive electrode and the connecting electrode are electrically connected, the connecting electrode can be electrically connected to the electrical connection structure (600), the sensitive electrode is used to sense external water bodies, and transmit electrical signals to the internal world through the connecting electrode and the electrical connection structure (600).

3. The packaging structure of the water quality sensor chip according to claim 2, characterized in that: The electrical connection structure (600) is electrically connected to the inner side of the isolation layer (300), the connection electrode is electrically connected to the outer side of the isolation layer (300), and the inner side of the isolation layer (300) is electrically connected to the outer side, wherein the inner side of the isolation layer (300) is the side away from the water channel (221).

4. The packaging structure of the water quality sensor chip according to claim 3, characterized in that: The inner side and the outer side of the isolation layer (300) are electrically connected via the isolation layer electrical structure (310), the electrical connection structure (600) is welded and fixed to the inner side of the isolation layer electrical structure (310), and the connection electrode is welded and fixed to the outer side of the isolation layer electrical structure (310).

5. The packaging structure of the water quality sensor chip according to claim 4, characterized in that: The connecting electrode, the outer side of the isolation layer electrical structure (310), and the welding and fixing point between the connecting electrode and the isolation layer electrical structure (310) are all covered with waterproof glue (400), and the waterproof glue (400) does not cover the sensitive electrode.

6. The packaging structure of the water quality sensor chip according to claim 1, characterized in that: The packaging shell (200) comprises a mounting shell (210) and a protective cover (220), wherein the protective cover (220) is connected to a first end of the mounting shell (210), the water quality sensing chip (100) is mounted in the mounting shell (210), and the sensitive structure (110) is closer to the first end of the mounting shell (210) than the electrical connection structure (600), and the water body channel (221) is opened in the protective cover (220).

7. The packaging structure of the water quality sensor chip according to claim 6, characterized in that: The installation shell (210) is provided with a first installation cavity (211) and a second installation cavity (212) which are arranged in a stepped manner; the isolation layer (300) is installed at a step (213) between the first installation cavity (211) and the second installation cavity (212); the electrical connection structure (600) is located in the first installation cavity (211); the water quality sensing chip (100) is located in the second installation cavity (212); and the second installation cavity (212) is connected to the water channel (221).

8. The packaging structure of the water quality sensor chip according to claim 6, characterized in that: The communication port (222) between the water channel (221) and the external water body is provided on the side of the protective cover (220).

9. The packaging structure of the water quality sensor chip according to claim 1, characterized in that: The end of the packaging shell (200) away from the water channel (221) is filled with sealant (500), and the sealant (500) covers the isolation layer (300) or covers the isolation layer (300) and part of the electrical connection structure (600).

10. A method for packaging a water quality sensitive chip, characterized in that: The packaging structure of the water quality sensor chip according to any one of claims 1 to 9 comprises the following steps: S1, providing a water quality sensing chip (100), a mounting shell (210), a protective cover (220) and an isolation layer (300); S2, welding and fixing the connecting electrode to the outer side of the isolation layer electrical structure (310); S3, using waterproof glue (400) to seal the outer side of the connecting electrode, the isolation layer electrical structure (310), and the welding fixing point between the connecting electrode and the isolation layer electrical structure (310), and ensuring that the waterproof glue (400) does not cover the sensitive electrode; S4, electrically connecting and fixing the electrical connection structure (600) to the inner side of the isolation layer electrical structure (310); S5, installing the assembled water quality sensing chip (100) and the isolation layer (300) into the installation shell (210); S6. Using a sealant (500) to cover the isolation layer (300) from the inside, or to cover the isolation layer (300) and part of the electrical connection structure (600), to achieve connection and fixation between the isolation layer (300) and the mounting shell (210); S7. Fixedly connect the protection cover (220) to the first end of the mounting shell (210).

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