Intelligent high-side chip diagnosis circuit and method, electronic equipment and storage medium

Abstract

The invention discloses an intelligent high-side chip diagnosis circuit and method, electronic equipment and a storage medium, and the circuit comprises an intelligent high-side driving chip which comprises an input and output pin used for controlling the working mode of the intelligent high-side driving chip; the current monitoring circuit is connected to a current monitoring pin of the intelligent high-side driving chip; and the voltage detection circuit is used for judging a load open-circuit fault when the intelligent high-side driving chip is in a non-working mode and the output level of the current monitoring pin is a low level, and judging a short-circuit to power supply fault when the output level of the current monitoring pin is a high level. The technical problem that in the prior art, a technical means for conducting fault detection on the intelligent high-side chip is lacked is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of fault diagnosis, and in particular, relates to an intelligent high-side chip diagnosis circuit, method, electronic equipment and storage medium. Background Art

[0002] Smart high-side switches, also known as high-side load switches, are currently widely used to drive loads in vehicles. For smart high-side switches, it is particularly important to have a complete diagnostic mechanism (short circuit to ground SCG, overload Over Load, short circuit to power supply SCB, open load Open Load). This is because there are many electronic modules and potential faults involved in automotive application scenarios. For example, when an open circuit fault occurs in the in-vehicle load-the car turn signal, a double flashing frequency is required to indicate the fault. However, the prerequisite for realizing this closed-loop fault prompt is that the main control unit MCU must first obtain the fault information reported by the high-side driver. In the existing technology, there is a lack of technical means for fault detection of smart high-side chips. Summary of the invention

[0003] The embodiments of the present invention provide a smart high-side chip diagnostic circuit, method, electronic device and storage medium to at least solve the technical problem in the prior art of lacking technical means for fault detection of smart high-side chips.

[0004] According to a first aspect of an embodiment of the present invention, there is provided an intelligent high-side chip diagnostic circuit, comprising: an intelligent high-side driver chip, the intelligent high-side driver chip comprising input and output pins for controlling its working mode; a current monitoring circuit, the current monitoring circuit being connected to the current monitoring pin of the intelligent high-side driver chip, and being used to monitor the current change of the current monitoring pin when the intelligent high-side driver chip is in working mode, and diagnose the intelligent high-side driver chip as a source current grounded load fault when the current reaches or exceeds the current limiting threshold; a voltage detection circuit, the voltage detection circuit being used to control the voltage value output by the intelligent high-side driver chip to be less than an open circuit detection threshold through a pull-down resistor connected to an output pin of a peripheral circuit of the intelligent high-side driver chip when the intelligent high-side driver chip is in non-working mode, and distinguishing the voltage state of the output pin of the peripheral circuit through an internal comparator of the intelligent high-side driver chip to determine the output level of the current monitoring pin, and judging that the load is open when the output level of the current monitoring pin is low, and judging that the load is short-circuited when the output level of the current monitoring pin is high.

[0005] Optionally, the input pin receives a control signal, and the control signal is used to control the intelligent high-side driver chip to switch between a working mode and a non-working mode.

[0006] Optionally, the current monitoring circuit includes: a current sensing resistor, connected between the current monitoring pin of the intelligent high-side driver chip and ground, for generating a voltage signal proportional to the current of the current monitoring pin; a comparator, whose input is connected to the current sensing resistor, for comparing the voltage signal with a preset current limiting threshold, and when the voltage signal reaches or exceeds the current limiting threshold, outputting a source current ground load fault signal.

[0007] According to a second aspect of an embodiment of the present invention, a smart high-side chip diagnosis method is also provided, including:

[0008] In response to the first control signal, the intelligent high-side chip is controlled to enter the working mode, and the current change of the current monitoring pin is monitored by the current monitoring circuit. When the current reaches or exceeds the current limiting threshold, it is diagnosed as a source current grounding load fault; in response to the second control signal, the control chip enters the non-working mode, and the voltage state of the peripheral circuit output pin is detected by the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault, and when the current monitoring pin outputs a high level, it is judged as a short circuit to the power supply fault.

[0009] Optionally, the control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input / output pin.

[0010] Optionally, the current monitoring circuit converts the current change of the current monitoring pin into a voltage signal using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

[0011] Optionally, in a non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish between the fault types of open load and short circuit to the power supply.

[0012] According to a third aspect of an embodiment of the present invention, there is also provided an electronic device, comprising a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the intelligent high-side chip diagnostic method in any embodiment of the first aspect above.

[0013] According to a fourth aspect of an embodiment of the present invention, a non-volatile storage medium is also provided, in which a computer program is stored, wherein the computer program is configured to execute the intelligent high-side chip diagnostic method described in any embodiment of the first aspect when running on a computer or a processor.

[0014] According to a fifth aspect of an embodiment of the present invention, a computer program product is further provided, including a computer program, and when the computer program is executed by a processor, the intelligent high-side chip diagnosis method in any of the above items is implemented.

[0015] In an embodiment of the present invention, the intelligent high-side driver chip includes input and output pins for controlling its working mode; a current monitoring circuit, the current monitoring circuit is connected to the current monitoring pin of the intelligent high-side driver chip, and is used to monitor the current change of the current monitoring pin when the intelligent high-side driver chip is in the working mode, and when the current reaches or exceeds the current limiting threshold, diagnose the intelligent high-side driver chip as a source current grounded load fault; a voltage detection circuit, when the intelligent high-side driver chip is in the non-working mode, the voltage detection circuit controls the voltage value output by the intelligent high-side driver chip to be less than the open circuit detection threshold through a pull-down resistor connected to the output pin of the peripheral circuit of the intelligent high-side driver chip, and distinguishes the voltage state of the peripheral circuit output pin through the internal comparator of the intelligent high-side driver chip to determine the output level of the current monitoring pin, when the output level of the current monitoring pin is low, it is judged as a load open circuit fault, and when the output level of the current monitoring pin is high, it is judged as a short circuit to power supply fault. By constructing a diagnostic circuit that matches the smart high-side chip, it is possible to detect and distinguish three types of faults (load short circuit to ground SCG, load short circuit to power supply SCB, load open circuit OL), thereby solving the technical problem of the lack of technical means for fault detection of smart high-side chips in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 is a structural schematic diagram of an intelligent high-side chip diagnostic circuit according to one embodiment of the present invention;

[0018] Figure 2 is a flow chart of a smart high-side chip diagnostic method according to one embodiment of the present invention;

[0019] Figure 3 4 is a flowchart of a smart high-side chip diagnostic method according to one embodiment of the present invention. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0021] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0022] According to an embodiment of the present invention, an embodiment of a smart high-side chip diagnosis circuit is provided, referring to Figure 1 , the intelligent high-side chip diagnosis circuit includes the following:

[0023] An intelligent high-side driver chip, the intelligent high-side driver chip includes input and output pins for controlling its working mode; a current monitoring circuit, the current monitoring circuit is connected to the current monitoring pin of the intelligent high-side driver chip, and is used to monitor the current change of the current monitoring pin when the intelligent high-side driver chip is in the working mode, and when the current reaches or exceeds the current limiting threshold, diagnose the intelligent high-side driver chip as a source current grounded load fault; a voltage detection circuit, when the intelligent high-side driver chip is in the non-working mode, the voltage detection circuit controls the voltage value output by the intelligent high-side driver chip to be less than the open circuit detection threshold through a pull-down resistor connected to the output pin of the peripheral circuit of the intelligent high-side driver chip, and distinguishes the voltage state of the peripheral circuit output pin through the internal comparator of the intelligent high-side driver chip to determine the output level of the current monitoring pin, when the output level of the current monitoring pin is low, it is judged as a load open circuit fault, and when the output level of the current monitoring pin is high, it is judged as a short circuit to power supply fault.

[0024] In an embodiment of the present invention, the intelligent high-side driver chip includes input and output pins for controlling its working mode; a current monitoring circuit, the current monitoring circuit is connected to the current monitoring pin of the intelligent high-side driver chip, and is used to monitor the current change of the current monitoring pin when the intelligent high-side driver chip is in the working mode, and when the current reaches or exceeds the current limiting threshold, diagnose the intelligent high-side driver chip as a source current grounded load fault; a voltage detection circuit, when the intelligent high-side driver chip is in the non-working mode, the voltage detection circuit controls the voltage value output by the intelligent high-side driver chip to be less than the open circuit detection threshold through a pull-down resistor connected to the output pin of the peripheral circuit of the intelligent high-side driver chip, and distinguishes the voltage state of the peripheral circuit output pin through the internal comparator of the intelligent high-side driver chip to determine the output level of the current monitoring pin, when the output level of the current monitoring pin is low, it is judged as a load open circuit fault, and when the output level of the current monitoring pin is high, it is judged as a short circuit to power supply fault. By constructing a diagnostic circuit that matches the smart high-side chip, it is possible to detect and distinguish three types of faults (load short circuit to ground SCG, load short circuit to power supply SCB, load open circuit OL), thereby solving the technical problem of the lack of technical means for fault detection of smart high-side chips in the prior art.

[0025] Optionally, the input pin receives a control signal, and the control signal is used to control the intelligent high-side driver chip to switch between a working mode and a non-working mode.

[0026] Optionally, the current monitoring circuit includes: a current sensing resistor, connected between the current monitoring pin of the intelligent high-side driver chip and ground, for generating a voltage signal proportional to the current of the current monitoring pin; a comparator, whose input is connected to the current sensing resistor, for comparing the voltage signal with a preset current limiting threshold, and when the voltage signal reaches or exceeds the current limiting threshold, outputting a source current ground load fault signal.

[0027] According to an embodiment of the present invention, an embodiment of an intelligent high-side chip diagnostic method is also provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system containing at least one set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0028] The method embodiment can also be executed in an electronic device including a memory and a processor, a similar control device or a cloud. Taking an electronic device as an example, the electronic device may include one or more processors and a memory for storing data. Optionally, the electronic device may also include a communication device and a display device for communication functions. It can be understood by those of ordinary skill in the art that the above structural description is only illustrative and does not limit the structure of the above electronic device. For example, the electronic device may also include more or fewer components than the above structural description, or have a configuration different from the above structural description.

[0029] The processor may include one or more processing units. For example, the processor may include a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processing (DSP) chip, a microcontroller unit (MCU), a field-programmable gate array (FPGA), a neural-network processing unit (NPU), a tensor processing unit (TPU), an artificial intelligence (AI) type processor, and other processing devices. Among them, different processing units may be independent components or integrated into one or more processors. In some instances, the electronic device may also include one or more processors.

[0030] The memory can be used to store computer programs, for example, to store the computer program corresponding to the intelligent high-side chip diagnostic method in the embodiment of the present invention. The processor implements the above-mentioned intelligent high-side chip diagnostic method by running the computer program stored in the memory. The memory may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory may further include a memory remotely arranged relative to the processor, and these remote memories can be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0031] The communication device is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the communication device includes a network adapter (network interface controller, NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the communication device can be a radio frequency (radio frequency, RF) module, which is used to communicate with the Internet wirelessly. In some embodiments of the present solution, the communication device is used to connect to mobile devices such as mobile phones and tablets, and instructions can be sent to electronic devices through the mobile device.

[0032] The display device may be a touch screen type liquid crystal display (LCD) and a touch display (also referred to as a "touch screen" or "touch display screen"). The liquid crystal display may enable a user to interact with a user interface of the electronic device. In some embodiments, the electronic device has a graphical user interface (GUI), and a user may interact with the GUI through finger contacts and / or gestures on a touch-sensitive surface, and executable instructions for executing the above-mentioned human-computer interaction functions are configured / stored in a computer program product or a readable storage medium executable by one or more processors.

[0033] Figure 2 FIG. 1 is a flow chart of a smart high-side chip diagnostic method according to one embodiment of the present invention. Figure 2 As shown, the method comprises the following steps:

[0034] Step S101, in response to a first control signal, controlling the intelligent high-side chip to enter a working mode, monitoring the current change of the current monitoring pin through a current monitoring circuit, and diagnosing a source current grounding load fault when the current reaches or exceeds a current limiting threshold.

[0035] Step S102, in response to the second control signal, the control chip enters a non-working mode, and detects the voltage state of the output pin of the peripheral circuit through the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault. When the current monitoring pin outputs a high level, it is judged as a short circuit to power supply fault.

[0036] Optionally, the control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input / output pin.

[0037] Optionally, the current monitoring circuit converts the current change of the current monitoring pin into a voltage signal using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

[0038] Optionally, in a non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish between the fault types of open load and short circuit to the power supply.

[0039] Reference Figure 3 , the specific implementation of the above embodiment is as follows:

[0040] First, by setting the two input pins IN1 and IN2 controlled by the controller high, the high-side driver chip ONSTATE (working mode) mode is switched. In the ON STATE mode, when the SCG load (Source Current Grounding Load) is short-circuited to the ground, the CS (current monitoring pin) responsible for current monitoring in the chip will output a large current, reaching the chip current limiting threshold of 14.5A. When the load is open Open Load and the load is short-circuited to the power supply SCB, the CS pin responsible for current monitoring in the chip outputs a current of 0. In summary, in order to achieve the purpose of detecting the SCG load short-circuit to ground fault, it can be achieved by switching the high-side driver chip working mode to ON STATE.

[0041] On the contrary, in order to diagnose and distinguish the other two faults (Open Load or short circuit to power supply SCB), the high-side driver chip working mode needs to be switched to OFF STATE (non-working mode) to achieve this. By placing 10K pull-down resistors (R1, R2) in the peripheral circuit output pins OUT1 and OUT2, the actual output voltage values ​​Vout1 and Vout2 can be made less than the minimum open circuit detection threshold value (2V) of the chip. The internal comparator rule of the chip is that when the actual output voltage value is less than the minimum open circuit detection threshold value, it is regarded as a low level. Therefore, when the high-side driver chip working mode is OFF STATE, when the load is open, the CS pin output level is low, and when the load is shorted to the power supply SCB fault occurs, the CS pin output level is high. In summary, in order to achieve the purpose of distinguishing the two fault states of open load or short circuit to power supply SCB, it can be achieved by switching the high-side driver chip working mode to OFFSTATE.

[0042] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present invention.

[0043] In this embodiment, a vehicle head-up display test system is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" is a combination of software and / or hardware that can implement a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0044] An embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the intelligent high-side chip diagnosis method described in any of the above embodiments.

[0045] Optionally, in this embodiment, the processor in the above electronic device may be configured to run a computer program to perform the following steps:

[0046] Step S101, in response to a first control signal, controlling the intelligent high-side chip to enter a working mode, monitoring the current change of the current monitoring pin through a current monitoring circuit, and diagnosing a source current grounding load fault when the current reaches or exceeds a current limiting threshold.

[0047] Step S102, in response to the second control signal, the control chip enters a non-working mode, and detects the voltage state of the peripheral circuit output pin through the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault. When the current monitoring pin outputs a high level, it is judged as a short circuit to power supply fault.

[0048] Optionally, the control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input / output pin.

[0049] Optionally, the current monitoring circuit converts the current change of the current monitoring pin into a voltage signal using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

[0050] Optionally, in a non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish between the fault types of open load and short circuit to the power supply.

[0051] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments and optional implementation modes, and this embodiment will not be described in detail here.

[0052] An embodiment of the present invention further provides a non-volatile storage medium, in which a computer program is stored, wherein the computer program is configured to execute the intelligent high-side chip diagnostic method described in any of the above embodiments when running on a computer or a processor.

[0053] Optionally, in this embodiment, the above-mentioned computer program may be configured to store a computer program for performing the following steps:

[0054] Step S101, in response to a first control signal, controlling the intelligent high-side chip to enter a working mode, monitoring the current change of the current monitoring pin through a current monitoring circuit, and diagnosing a source current grounding load fault when the current reaches or exceeds a current limiting threshold.

[0055] Step S102, in response to the second control signal, the control chip enters a non-working mode, and detects the voltage state of the output pin of the peripheral circuit through the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault. When the current monitoring pin outputs a high level, it is judged as a short circuit to power supply fault.

[0056] Optionally, the control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input / output pin.

[0057] Optionally, the current monitoring circuit converts the current change of the current monitoring pin into a voltage signal using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

[0058] Optionally, in a non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish between the fault types of open load and short circuit to the power supply.

[0059] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments and optional implementation modes, and this embodiment will not be described in detail here.

[0060] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the intelligent high-side chip diagnosis method described in any of the above embodiments when executed by a processor.

[0061] Optionally, in this embodiment, the above computer program implements the following steps when executed by a processor:

[0062] Step S101, in response to a first control signal, controlling the intelligent high-side chip to enter a working mode, monitoring the current change of the current monitoring pin through a current monitoring circuit, and diagnosing a source current grounding load fault when the current reaches or exceeds a current limiting threshold.

[0063] Step S102, in response to the second control signal, the control chip enters a non-working mode, and detects the voltage state of the output pin of the peripheral circuit through the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault. When the current monitoring pin outputs a high level, it is judged as a short circuit to power supply fault.

[0064] Optionally, the control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input / output pin.

[0065] Optionally, the current monitoring circuit converts the current change of the current monitoring pin into a voltage signal using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

[0066] Optionally, in a non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish between the fault types of open load and short circuit to the power supply.

[0067] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0068] In some embodiments provided in the present application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the modules can be a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, modules or indirect coupling or communication connection of modules, which can be electrical or other forms.

[0069] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0070] In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of software functional modules.

[0071] If the integrated module is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk, etc., which can store program code.

[0072] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An intelligent high-side chip diagnostic circuit, characterized in that: include: An intelligent high-side driver chip, the intelligent high-side driver chip comprising input and output pins for controlling its working mode; A current monitoring circuit, the current monitoring circuit is connected to the current monitoring pin of the intelligent high-side driver chip, and is used to monitor the current change of the current monitoring pin when the intelligent high-side driver chip is in working mode, and when the current reaches or exceeds the current limiting threshold, diagnose the intelligent high-side driver chip as a source current grounding load fault; A voltage detection circuit, when the intelligent high-side driver chip is in a non-working mode, the voltage detection circuit controls the voltage value output by the intelligent high-side driver chip to be less than an open circuit detection threshold value through a pull-down resistor connected to an output pin of a peripheral circuit of the intelligent high-side driver chip, and distinguishes the voltage state of the output pin of the peripheral circuit through an internal comparator of the intelligent high-side driver chip to determine the output level of the current monitoring pin; when the output level of the current monitoring pin is at a low level, it is judged to be a load open circuit fault, and when the output level of the current monitoring pin is at a high level, it is judged to be a short circuit to a power supply fault.

2. The intelligent high-side chip diagnostic circuit according to claim 1, characterized in that: The input pin receives a control signal, and the control signal is used to control the intelligent high-side driver chip to switch between the working mode and the non-working mode.

3. The intelligent high-side chip diagnostic circuit according to claim 1, characterized in that: The current monitoring circuit comprises: A current sensing resistor, connected between the current monitoring pin of the intelligent high-side driver chip and ground, and used to generate a voltage signal proportional to the current of the current monitoring pin; A comparator, whose input terminal is connected to the current sensing resistor, is used to compare the voltage signal with a preset current limiting threshold, and output a source current grounding load fault signal when the voltage signal reaches or exceeds the current limiting threshold.

4. A smart high-edge chip diagnostic method, characterized in that: The intelligent high-side chip diagnostic circuit applied to any one of claims 1 to 3 above comprises: In response to the first control signal, the intelligent high-side chip is controlled to enter the working mode, and the current change of the current monitoring pin is monitored by the current monitoring circuit. When the current reaches or exceeds the current limiting threshold, it is diagnosed as a source current grounding load fault; In response to the second control signal, the chip is controlled to enter a non-working mode, and the voltage state of the output pin of the peripheral circuit is detected by the voltage detection circuit. When the current monitoring pin outputs a low level, it is judged as a load open circuit fault, and when the current monitoring pin outputs a high level, it is judged as a short circuit to power supply fault.

5. The intelligent high-edge chip diagnosis method according to claim 4, characterized in that: The control chip enters the working mode and the non-working mode by receiving the first control signal or the second control signal through the input and output pins.

6. The intelligent high-edge chip diagnosis method according to claim 4, characterized in that: The current monitoring circuit converts the current change of the current monitoring pin into a voltage signal by using a current sensing resistor, and then compares it with the current limiting threshold through a comparator to determine whether there is a source current grounding load fault.

7. The intelligent high-edge chip diagnosis method according to claim 4, characterized in that: In the non-operating mode, the voltage detection circuit pulls down the voltage of the peripheral circuit output pin through a pull-down resistor, and uses an internal comparator to detect the level change of the current monitoring pin to distinguish the fault types of open circuit load and short circuit to power supply.

8. An electronic device, comprising a memory and a processor, characterized in that: The memory stores a computer program, and the processor is configured to run the computer program to execute the intelligent high-side chip diagnosis method described in any one of claims 4 to 7.

9. A non-volatile storage medium, characterized in that: The non-volatile storage medium stores a computer program, wherein the computer program is configured to execute the intelligent high-side chip diagnosis method described in any one of claims 4 to 7 when running on a computer or a processor.

10. A computer program product, characterized in that It comprises a computer program, which implements the intelligent high-side chip diagnosis method according to any one of claims 4 to 7 when being executed by a processor.

Images