Display module and display device

Abstract

The invention discloses a display module and a display device. The display module comprises a display panel and a near field communication structure, the display panel comprises a display part, a bending part and a binding part which are connected in sequence, and the bending part is folded to the backlight side of the display part; the near field communication structure is located on the backlight side of the display part; the display part, the near field communication structure and the binding part are sequentially arranged in the direction perpendicular to the display part, and the orthographic projection of the near field communication structure on the display part and the orthographic projection of the binding part on the display part are at least partially overlapped. The display device comprises the display module. By increasing the area of the near field communication structure, the semaphore of the near field communication structure is improved, and the short-distance wireless communication performance of the display module is ensured.

Description

Technical Field

[0001] The present disclosure relates to but is not limited to the field of display devices, and in particular to a display module and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diode (QLED) are active light-emitting display devices with the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, bendability and low cost. With the continuous development of display technology, flexible display devices (Flexible Display) using OLED or QLED as light-emitting devices and thin film transistors (TFT) for signal control have become the mainstream products in the current display field.

[0003] Currently, some display devices have a near field communication (NFC) structure, but there is a problem of insufficient signal quantity of the NFC structure. Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The technical problem to be solved by the present disclosure is to provide a display module, which increases the area of ​​the near-field communication structure, improves the signal volume of the near-field communication structure, ensures the short-range wireless communication performance of the display module, and solves the problem of insufficient signal volume of the near-field communication structure.

[0006] At least one embodiment of the present disclosure provides a display module, including:

[0007] A display panel, the display panel comprising a display portion, a bending portion, and a binding portion connected in sequence, the bending portion being folded to a backlight side of the display portion;

[0008] A near field communication structure, wherein the near field communication structure is located on the backlight side of the display portion;

[0009] The display portion, the near field communication structure and the binding portion are arranged in sequence in a direction perpendicular to the display portion, and an orthographic projection of the near field communication structure on the display portion at least partially overlaps with an orthographic projection of the binding portion on the display portion.

[0010] In an exemplary embodiment, it further includes a first back film layer, wherein the first back film layer is located on a surface of the binding portion close to the display portion, and the near field communication structure is bonded to the first back film layer.

[0011] In an exemplary embodiment, the near field communication structure is provided with a double-sided adhesive tape on the surface facing the first backing film layer for bonding, and the double-sided adhesive tape is configured as an acrylic hot melt adhesive.

[0012] In an exemplary embodiment, the thickness of the double-sided tape is set to 0.02 mm to 0.05 mm.

[0013] In an exemplary embodiment, a composite film is further included, wherein the composite film is disposed between the near field communication structure and the display portion, and the thickness of the composite film is set to be less than 0.16 mm.

[0014] In an exemplary embodiment, the composite film includes a first film layer and a grid glue stacked in a direction perpendicular to the display portion, and the first film layer is configured as a graphite layer, a foam glue layer or a polyimide layer.

[0015] In an exemplary embodiment, the thickness of the first film layer is set to 0.05 to 0.07 mm, and the thickness of the grid glue is set to 0.02 to 0.04 mm.

[0016] In an exemplary embodiment, the thickness of the composite film is set to 0.06 mm to 0.12 mm.

[0017] In an exemplary embodiment, it further includes a conductive member for grounding the display panel;

[0018] The near field communication structure includes a ferrite plate and a copper foil stacked in a direction perpendicular to the display portion, wherein the copper foil is located on a side of the ferrite plate away from the display portion;

[0019] The ferrite plate is provided with a first through hole, the conductive member passes through the first through hole, one end of the conductive member is against the copper foil, and the conductive member is arranged to be spaced apart from the inner side wall of the first through hole.

[0020] In an exemplary embodiment, it further includes a composite film and a second back film layer, wherein the second back film layer is disposed on a surface of the display portion facing the near field communication structure.

[0021] The second back film layer, the composite film, and the near field communication structure are stacked in sequence in a direction perpendicular to the display portion;

[0022] The composite membrane is provided with a second through hole, the second through hole is connected to the first through hole, and the first through hole and the second through hole constitute a containing cavity;

[0023] One end of the conductive member away from the copper foil abuts against the second back film layer, the conductive member sequentially passes through the first through hole and the second through hole, and the conductive member is arranged to be spaced apart from the inner side wall of the second through hole.

[0024] In an exemplary embodiment, a plurality of the conductive members are provided, a plurality of the accommodating cavities are provided, and the conductive members and the accommodating cavities are arranged in a one-to-one correspondence.

[0025] In an exemplary embodiment, the cross-sectional shape of the conductive member on a plane parallel to the display portion is set to a rectangle, a circle, a diamond, a triangle, a trapezoid or an irregular shape, and the hole shapes of the second through hole and the first through hole are both set to be consistent with the cross-sectional shape of the conductive member on a plane parallel to the display portion.

[0026] In an exemplary embodiment, the conductive member is configured as conductive foam or conductive double-sided tape.

[0027] In an exemplary embodiment, the cross-sectional area of ​​the conductive member on a plane parallel to the display portion is set to be greater than or equal to 5 mm 2 .

[0028] In an exemplary embodiment, the near-field communication structure includes a ferrite plate and a first routing line arranged on the ferrite plate, wherein an orthographic projection of the first routing line on the display portion at least partially overlaps with an orthographic projection of the binding portion on the display portion, or an orthographic projection of the first routing line on the display portion at least partially does not overlap with an orthographic projection of the binding portion on the display portion.

[0029] In an exemplary embodiment, a chip is further included, wherein the chip is arranged on a surface of the binding portion away from the near field communication structure, and the orthographic projection of the chip on the display portion is located within the orthographic projection of the near field communication structure on the display portion.

[0030] In an exemplary embodiment, the orthographic projection of the near-field communication structure on the display portion is set as a first projection, the orthographic projection of the binding portion on the display portion is set as a second projection, and the overlapping projection area of ​​the second projection and the first projection is set to be greater than two-thirds of the projection area of ​​the second projection.

[0031] In an exemplary embodiment, a projection area of ​​an orthographic projection of the near field communication structure on the display portion is not less than two-thirds of an area of ​​the display portion.

[0032] In an exemplary embodiment, it also includes a cover plate located on the light-emitting side of the display unit, a curable optical adhesive, a polarizer and an encapsulation layer, and the encapsulation layer, the polarizer, the curable optical adhesive and the cover plate are stacked in sequence in a direction away from the display unit.

[0033] At least one embodiment of the present disclosure provides a display device, including the above-mentioned display module.

[0034] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by implementing the present application. Other advantages of the present application can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0036] Figure 1 is a schematic diagram of a related display module;

[0037] Figure 2 for Figure 1 A projection diagram of the near field communication structure in FIG.

[0038] Figure 3 A schematic diagram of a display module of an exemplary embodiment of the present disclosure;

[0039] Figure 4 for Figure 3 A schematic projection diagram of a near field communication structure and a binding portion;

[0040] Figure 5 for Figure 3 Schematic diagram of the display panel in FIG.

[0041] Figure 6 for Figure 3 A partial schematic diagram of a display module in FIG.

[0042] Figure 7 A schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0043] Figure 8 for Figure 7 A schematic diagram of a projection of a near field communication structure on a display unit;

[0044] Fig. 9 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0045] Fig.10 for Fig. 9A schematic diagram of a projection of a near field communication structure on a display unit;

[0046] Fig.11 for Fig. 9 Another schematic diagram of projection of the near field communication structure on the display unit;

[0047] Fig.12 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0048] Fig.13 for Fig.12 A schematic diagram of a projection of a near field communication structure on a display unit;

[0049] Fig.14 for Fig.12 Another schematic diagram of projection of the near field communication structure on the display unit;

[0050] Fig.15 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0051] Fig.16 for Fig.15 A schematic diagram of a projection of a near field communication structure on a display unit;

[0052] Fig.17 for Fig.15 Another schematic diagram of projection of the near field communication structure on the display unit;

[0053] Fig.18 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0054] Fig.19 for Fig.18 A schematic diagram of a projection of a near field communication structure on a display unit;

[0055] Fig. 20 for Fig.18 Another schematic diagram of a projection of the near field communication structure on the display unit;

[0056] Fig.21 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure;

[0057] Fig. 22 is a cross-sectional schematic diagram of another display module according to an exemplary embodiment of the present disclosure;

[0058] Fig.23 for Fig. 22 A partial cross-sectional schematic diagram of a display module;

[0059] Fig.24 for Fig. 22 Schematic diagram of the ferrite plate in Figure 1.

[0060] Description of reference numerals:

[0061] 1-cover plate; 2-curable optical adhesive; 3-polarizer;

[0062] 4-encapsulation layer; 5-display panel; 6-back film layer;

[0063] 7-composite film; 8-bent gasket; 9-near field communication structure;

[0064] 10-first circuit board; 11-chip; 12-protective adhesive layer;

[0065] 13-display portion; 14-bending portion; 15-binding portion;

[0066] 16-double-sided adhesive tape; 17-first back film layer; 18-second back film layer;

[0067] 19-first plate segment; 20-second plate segment; 21-first bend;

[0068] 22-light emitting side; 23-backlight side; 24-first gap;

[0069] 25-first film layer; 26-grid glue; 27-ferrite plate;

[0070] 28-first routing line; 29-first area; 30-first edge;

[0071] 31-notch; 32-second edge; 33-copper foil;

[0072] 34-conductive member; 35-first through hole; 36-second through hole;

[0073] 37 - accommodating cavity; 38 - second gap; 39 - third gap. DETAILED DESCRIPTION

[0074] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail in conjunction with the accompanying drawings below. Note that the embodiments can be implemented in multiple different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0075] In the present specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.

[0076] In this specification, for the sake of convenience, the words and phrases indicating the orientation or positional relationship, such as "middle", "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., are used to illustrate the positional relationship of the constituent elements with reference to the drawings. This is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which each constituent element is described. Therefore, it is not limited to the words and phrases described in the specification, and can be appropriately replaced according to the situation.

[0077] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate, or the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

[0078] In this specification, "electrical connection" includes the case where components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0079] In this specification, "parallel" means a state where the angle formed by two straight lines is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" means a state where the angle formed by two straight lines is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.

[0080] The triangles, rectangles, trapezoids, pentagons or hexagons in this specification are not in the strict sense, and may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.

[0081] The term "about" in the embodiments of the present disclosure means that the limits are not strictly defined and a numerical value within the range of process and measurement errors is allowed.

[0082] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps of the specific order described. As will be understood by those of ordinary skill in the art, other sequences of steps are also possible. Therefore, the specific sequence of the steps set forth in the specification should not be interpreted as a limitation to the claims. In addition, the claims for the method and / or process should not be limited to the steps of performing them in the order written, and those skilled in the art can easily understand that these sequences can be changed and still remain within the spirit and scope of the embodiments of the present application.

[0083] Figure 1 is a schematic diagram of a related display module. Figure 2 for Figure 1 The projection diagram of the near field communication structure in Figure 1 and Figure 2 As shown, the relevant display module includes a display panel 5, a composite film (Super Clean Foam, SCF for short) 7, a bending spacer 8, and a near field communication structure (NFC for short) 9, wherein the display panel 5 includes a display portion 13, a bending portion 14, and a binding portion 15, and the composite film 7 and the bending spacer 8 support the space between the display portion 13 and the binding portion 15. In the direction parallel to the display portion 13, the distance between the near field communication structure 9 and the binding portion 15 can be L, and the value of L is greater than or equal to 2.5 mm. For example, in some display modules, the distance between the near field communication structure 9 and the binding portion 15 is 2.5 mm, 3 mm or 5 mm. The binding portion 15 is projected onto the display portion 13 as projection A, and the near field communication structure 9 is projected onto the display portion 13 as projection B, wherein projection A and projection B are arranged at intervals, and the distance between the two is L. The inventors of this application have found that when the overall size of the display module is small, the surface area of ​​the near-field communication structure 9 in the display module is too small, which will lead to insufficient signal of the near-field communication structure 9 and poor short-range wireless communication performance of the display module.

[0084] Figure 3 is a schematic diagram of a display module of an exemplary embodiment of the present disclosure, Figure 4 for Figure 3 A projection diagram of a near field communication structure and a binding portion in the embodiment of the present disclosure provides a display module, such as Figure 3 and Figure 4As shown, the display module may include a display panel 5 and a near field communication structure 9, wherein the display panel 5 may include a display portion 13, a bending portion 14 and a binding portion 15 connected in sequence, the bending portion 14 may be folded to the backlight side of the display portion 13, and the near field communication structure 9 may be located on the backlight side of the display portion 13. The display portion 13, the near field communication structure 9 and the binding portion 15 may be arranged in sequence in a direction perpendicular to the display portion 13, and the orthographic projection B of the near field communication structure 9 on the display portion 13 and the orthographic projection A of the binding portion 15 on the display portion 13 at least partially overlap. Thus, the display module of this example extends the near field communication structure 9 to between the display portion 13 and the binding portion 15. Compared with the related display module in which the near field communication structure 9 does not extend between the display portion 13 and the binding portion 15, the display module of this example increases the area of ​​the near field communication structure 9, improves the signal amount of the near field communication structure 9, and ensures the short-range wireless communication performance of the display module.

[0085] Figure 5 for Figure 3 Schematic diagram of a display panel in FIG. 1 , in some exemplary embodiments, as shown in FIG. Figure 3 and Figure 5 As shown, the display panel 5 may include a display portion 13, a bending portion 14 and a binding portion 15 which are connected in sequence, wherein the display portion 13, the bending portion 14 and the binding portion 15 may be an integral part, the display portion 13 may be a flat plate, and the display portion 13 may have a light emitting side 22 and a backlight side 23. After the display portion 13 is lit, the light emitting side 22 emits light to display text or images. The bending portion 14 can be made of a flexible material and can be bent. The bending portion 14 has metal traces, etc. When the bending portion 14 is produced, it can be laid flat on the production equipment. When the bending portion 14 is installed, the bending portion 14 can be folded to the backlight side 23 of the display portion 13, so that the bending portion 14 is in a bent state and remains in a bent state. In the bent state, the bending portion 14 is surrounded by a nearly semicircular shape. The radius of the semicircle surrounded by the bending portion 14 is about 0.2mm to 0.5mm. In this example, the radius of the semicircle surrounded by the bending portion 14 is about 0.25mm, but it is not limited to this. For example, it can also be 0.2mm, 0.3mm or 0.35mm. The binding portion 15 is on the backlight side 23 of the display portion 13. The binding portion 15 is parallel to the display portion 13. The binding portion 15 has a chip mounting area (Chip On Panel, referred to as COP) area and a driver integrated circuit area (Driver Integrated Circuit, referred to as D-IC). A first gap 24 is formed between the binding portion 15 and the display portion 13 , and a component is required to support and fill the first gap 24 to support the space between the binding portion 15 and the display portion 13 .

[0086] In some exemplary embodiments, Figure 3As shown, the display module also includes a first circuit board 10 and a chip 11, wherein the first circuit board 10 may be a flexible printed circuit board (Flexible Printed Circuit, referred to as FPC), the first circuit board 10 may be welded with the near field communication structure 9, and components (not shown in the figure) may be provided on the first circuit board 10, and the components (not shown in the figure) may be located on one side of the first circuit board 10. The first circuit board 10 may include a first board segment 19, a first bend 21 and a second board segment 20 connected once, wherein the first bend 21 may divide the first circuit board 10 into a first board segment 19 and a second board segment 20 located in different planes, and the components (not shown in the figure) may all be arranged on the second board segment 20. The surface of the second board segment 20 facing the display unit 5 may be welded with the near field communication structure 9, the second board segment 20 may be provided with a device area (not shown in the figure), and a plurality of components (not shown in the figure) may all be arranged in the device area (not shown in the figure), and the plurality of components may include larger components such as flash memory chips, and the components are mounted on the first circuit board 10 by surface mount technology (Surface Mount Technology, referred to as SMT). The first plate segment 19 can extend to the surface of the binding portion 15 away from the display portion 13, and is bound to the driver integrated circuit area of ​​the binding portion 15 to form an electrical connection. The chip 11 is located on the surface of the binding portion 15 away from the display portion 13, and is bound to the chip mounting area of ​​the binding portion 15 to form an electrical connection. In addition, the orthographic projection of the chip 11 on the display portion 13 is located within the orthographic projection of the near field communication structure 9 on the display portion 13.

[0087] In some exemplary embodiments, Figure 3 As shown, the display module further includes a cover plate 1, a curable optical adhesive 2, a polarizer 3, and an encapsulation layer 4 located on the light-emitting side of the display portion 13, wherein the encapsulation layer 4, the polarizer 3, the curable optical adhesive 2, and the cover plate 1 are sequentially stacked in a direction away from the display portion 13, and the encapsulation layer 4, the polarizer 3, the curable optical adhesive 2, and the cover plate 1 can all transmit the light emitted by the display portion 13. The encapsulation layer 4 and the cover plate 1 can both protect the display portion 13, and the polarizer 3 can reduce the influence of external light emission on the image display of the display portion 13.

[0088] In some exemplary embodiments, Figure 3 and Figure 5As shown, the display module may further include a bottom film layer (BF for short) 6, wherein the bottom film layer 6 may be arranged on the display panel 5. According to different positions, the bottom film layer 6 may be divided into a first back film layer 17 and a second back film layer 18. The first back film layer 17 is located on the surface of the binding portion 15 facing the near field communication structure 9, and the second back film layer 18 is located on the backlight side surface of the display portion 13. When the bending portion 14 is in a bent state, the first back film layer 17 covers the surface of the binding portion 15 facing the display portion 13, and the second back film layer 18 covers the surface of the display portion 13 close to the binding portion 15. The first back film layer 17 and the second back film layer 18 may be prepared on the display panel 5 during the production of the display panel 5. At this time, the bending portion 14 is laid flat on the production equipment, and the first back film layer 17 and the second back film layer 18 are arranged in place at one time. At the same time, the first back film layer 17 and the second back film layer 18 also fill part of the space in the first gap 24. In addition, the display module may also include a protective adhesive layer (Metal Coating Layer, MCL for short) 12, which at least covers the side of the bending portion 14 facing away from the near-field communication structure 9, and also covers the portion of the surface of the binding portion 15 away from the near-field communication structure 9. The protective adhesive layer 12 can protect the components it covers.

[0089] In an exemplary embodiment, Figure 3 and, Figure 4 and Figure 5 As shown, one end of the near field communication structure 9 is inserted into the first gap 24 and is located between the first back film layer 17 and the second back film layer 18. The near field communication structure 9 can be bonded to the first back film layer 17. Figure 1The display module shown in this example omits the curved gasket 8, and the near-field communication structure 9 replaces the curved gasket 8 and is filled between the display portion 13 and the binding portion 15. The near-field communication structure 9 may be provided with a double-sided adhesive 16 for bonding on the surface facing the first back film layer 17, and the double-sided adhesive 16 may be made of AD adhesive, that is, acrylic hot-melt adhesive. The double-sided adhesive 16 may be pre-pasted on the near-field communication structure 9 before the near-field communication structure 9 is assembled with the display panel 5. When the near-field communication structure 9 is assembled with the display panel 5, the double-sided adhesive 16 and the near-field communication structure 9 are fed as one, which can reduce the preparation steps and effectively optimize the production line process without increasing the manual work for the corresponding double-sided adhesive 16 attachment. In an exemplary embodiment, the thickness of the double-sided adhesive tape 16 can be set to 0.02 mm to 0.05 mm. The thickness of the double-sided adhesive tape 16 can be the dimension of the double-sided adhesive tape 16 in a direction perpendicular to the display portion 15. In this example, the thickness of the double-sided adhesive tape 16 can be 0.03 mm, but it is not limited thereto. For example, the thickness of the double-sided adhesive tape 16 can be 0.04 mm, and for another example, the thickness of the double-sided adhesive tape 16 can be 0.02 mm, and for another example, the thickness of the double-sided adhesive tape 16 can be 0.05 mm. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the orthographic projection of the near field communication structure 9 on the display portion 13 can be set to the first projection B. The first projection B and the second projection A can partially overlap, the first projection B has a portion that does not overlap with the second projection A, and the second projection A has a portion that does not overlap with the first projection B. The overlapping portion of the first projection B and the second projection A can be the third projection C. The orthographic projection of the double-sided tape 16 on the display portion 13 may be located within the third projection C, and the orthographic projection of the chip 11 on the display portion 13 may also be located within the third projection C. In an exemplary embodiment, the overlapping projection area of ​​the second projection A and the first projection B is the area of ​​the third projection C, and the area of ​​the third projection C may be greater than two-thirds of the area of ​​the second projection A. In this example, the area of ​​the third projection C is approximately four-fifths of the projection area of ​​the second projection A, but is not limited thereto. For example, the area of ​​the third projection C is approximately seven-ninths of the area of ​​the second projection A, and for another example, the area of ​​the third projection C is approximately three-quarters of the area of ​​the second projection A. In an exemplary embodiment, the projection area of ​​the positive projection of the near field communication structure 9 on the display portion 13 is the area of ​​the first projection B, and the area of ​​the first projection B is not less than two-thirds of the area of ​​the display portion 13. The area of ​​the display portion 13 is the area occupied by the display portion 13 in the plane in which it is located. In this example, the area of ​​the first projection B may be four-fifths of the area of ​​the display portion 13, but is not limited to this. For example, the area of ​​the first projection B may be two-thirds of the area of ​​the display portion 13. For another example, the area of ​​the first projection B may be seven-tenths of the area of ​​the display portion 13.

[0090] Figure 6 for Figure 3 A partial schematic diagram of, in some exemplary embodiments, such as Figure 3 , Figure 5and Figure 6 As shown, the display module may further include a composite film 7, which is located on the backlight side 23 of the display portion 13, and may be disposed between the near field communication structure 9 and the display portion 13, and may be sandwiched between the second back film layer 18 and the near field communication structure 9, and the near field communication structure 9 may be bonded to the second back film layer 18 and the near field communication structure 9, respectively. One end of the composite film 7 is also inserted into the first gap 24, and the orthographic projection of the near field communication structure 9 on the display portion 13 may be entirely located within the orthographic projection of the composite film 7 on the display portion 13, so that the orthographic projection of the binding portion 15 on the display portion 13 may overlap with the orthographic projection of the composite film 7 on the display portion 13. In some exemplary embodiments, the thickness of the composite film 7 may be H1, and H1 may be less than 0.16 mm. In this example, the thickness of the composite film 7 may range from 0.06 mm to 0.12 mm, that is, 0.06 mm ≤ H1 ≤ 0.12 mm. The thickness of the composite film 7 may be the size of the composite film 7 in a direction perpendicular to the display portion 13. In this example, the thickness of the composite film 7 can be 0.09 mm, that is, H1 = 0.09 mm. Compared with the thickness of the composite film 7 in the related display module, which can be 0.16 mm, the thickness of the composite film 7 in this example is smaller, providing sufficient space for the near field communication structure 9 and the double-sided adhesive 16 in the first gap 24. In an exemplary embodiment, the composite film 7 includes a first film layer 25 and a grid adhesive 26 stacked in a direction perpendicular to the display portion 13. The number of layers of the first film layer 25 and the grid adhesive 26 is not limited to one layer, and can be multiple layers. The material of the first film layer 25 can be graphite, foam adhesive or polyimide. The thickness of the first film layer 25 can be set to H2, and the value of H2 can be 0.05 to 0.07 mm. The thickness of the grid adhesive 26 can be set to H3, and the value of H3 can be 0.02 mm to 0.04 mm.

[0091] In an exemplary embodiment, Figure 6 As shown, the thickness of the composite film 7 can be 0.09mm, that is, H1=0.09mm, the material of the first film layer 25 can be foam glue, the first film layer 25 forms a foam glue layer, the thickness of the foam glue layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.06mm, H3=0.03mm.

[0092] In an exemplary embodiment, Figure 6 As shown, the thickness of the composite film 7 can be 0.09mm, that is, H1=0.09mm, the material of the first film layer 25 can be foam glue, the first film layer 25 forms a foam glue layer, the thickness of the foam glue layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.05mm, H3=0.04mm.

[0093] In an exemplary embodiment, Figure 6As shown, the thickness of the composite film 7 can be 0.09mm, that is, H1=0.09mm, the material of the first film layer 25 can be polyimide, the first film layer 25 forms a polyimide layer, the thickness of the polyimide layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.06mm, H3=0.03mm.

[0094] In an exemplary embodiment, Figure 6 As shown, the thickness of the composite film 7 can be 0.09mm, that is, H1=0.09mm, the material of the first film layer 25 can be polyimide, the first film layer 25 forms a polyimide layer, the thickness of the polyimide layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.05mm, H3=0.04mm.

[0095] In an exemplary embodiment, Figure 6 As shown, the thickness of the composite film 7 can be 0.09mm, that is, H1=0.09mm, the material of the first film layer 25 can be a graphite sheet, the first film layer 25 forms a graphite layer, the thickness of the graphite layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.06mm, H3=0.03mm.

[0096] In an exemplary embodiment, Figure 6 As shown, the thickness of the composite film 7 can be 0.09 mm, that is, H1=0.09 mm, the material of the first film layer 25 can be a graphite sheet, the first film layer 25 forms a graphite layer, the thickness of the graphite layer is H2, and the thickness of the grid glue 26 can be set to H3, wherein H2=0.05 mm, H3=0.04 mm.

[0097] Figure 7 is a schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as Figure 7 As shown, the near field communication structure 9 may include a ferrite plate 27 and a first trace 28 disposed on the ferrite plate 27, wherein the ferrite plate 27 may be a rectangular plate, but is not limited thereto, for example, the ferrite plate 27 may be a parallelogram plate, a trapezoidal plate, a circular plate or an irregular pattern plate, etc. The first trace 28 is arranged along the edge of the ferrite plate 27 and is surrounded in a ring, but the position of the first trace 28 is not limited to the edge of the ferrite plate 27, and may be other positions of the ferrite plate 27.

[0098] Figure 8 for Figure 7 Schematic diagram of projection of the near field communication structure on the display unit, in some exemplary embodiments, as Figure 3 , Figure 7 and Figure 8As shown, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A. The first projection B and the second projection A may overlap partially, and the first projection B and the second projection A both have a part that does not overlap, and the overlapping part of the first projection B and the second projection A may be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 may overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping part.

[0099] Fig. 9 FIG. 1 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. Fig. 9 As shown, the near field communication structure 9 may include a ferrite plate 27 and a first trace 28 disposed on the ferrite plate 27, wherein the ferrite plate 27 may be a rectangular plate, but is not limited thereto, for example, the ferrite plate 27 may be a parallelogram plate, a trapezoidal plate, a circular plate or an irregular pattern plate, etc. The first trace 28 is formed in a ring shape, and the ferrite plate 27 has a first area 29 where the first trace 28 is not arranged.

[0100] Fig.10 for Fig. 9 A schematic diagram of a projection of a near field communication structure on a display unit, in some exemplary embodiments, such as Figure 3 , Fig. 9 and Fig.10 As shown, the first area 29 of the ferrite plate 27 corresponds to the binding portion in a direction perpendicular to the display portion 13, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the first projection B and the second projection A may overlap partially, and both have a part that does not overlap, and the overlapping part may be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 may not overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D do not overlap.

[0101] Fig.11 for Fig. 9 Another projection diagram of the near field communication structure in the display unit, in some exemplary embodiments, as Figure 3 , Fig. 9 and Fig.11As shown, the first area 29 of the ferrite plate 27 is staggered with the binding part in a direction perpendicular to the display part 13, the orthographic projection of the ferrite plate 27 on the display part 13 is consistent with the orthographic projection of the near field communication structure 9 on the display part 13, and both projections are the first projection B. The orthographic projection of the binding part 15 on the display part 13 can be set to the second projection A, and the first projection B and the second projection A can overlap partially, and the first projection B and the second projection A both have a part that does not overlap, and the overlapping part of the first projection B and the second projection A can be the third projection C. The orthographic projection of the first wiring 28 on the display part 13 can be the fourth projection D, and the orthographic projection of the first wiring 28 on the display part 13 can overlap with the orthographic projection of the binding part 15 on the display part 13, that is, the second projection A and the fourth projection D have an overlapping part.

[0102] Fig.12 FIG. 1 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. Fig.12 As shown, the near field communication structure 9 may include a ferrite plate 27 and a first trace 28 disposed on the ferrite plate 27, wherein the ferrite plate 27 may be an irregular pattern plate. The first trace 28 is in a ring shape, and the ferrite plate 27 has a first area 29 where the first trace 28 is not disposed.

[0103] Fig.13 for Fig.12 A schematic diagram of a projection of a near field communication structure on a display unit, in some exemplary embodiments, such as Figure 3 , Fig.12 and Fig.13 As shown, the first area 29 of the ferrite plate 27 corresponds to the binding portion 15 in a direction perpendicular to the display portion 13, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the first projection B and the second projection A may overlap partially, and both have a part that does not overlap, and the overlapping part may be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 may not overlap with the projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D do not overlap.

[0104] Fig.14 for Fig.12 Another projection diagram of the near field communication structure in the display unit, in some exemplary embodiments, as Figure 3 , Fig.12 and Fig.14As shown, the first area 29 of the ferrite plate 27 is staggered with the binding portion 15 in a direction perpendicular to the display portion 13, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B, the orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, the first projection B and the second projection A can overlap partially, the first projection B and the second projection A both have a part that does not overlap, and the overlapping part of the first projection B and the second projection A can be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 can be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping part.

[0105] Fig.15 FIG. 1 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. Fig.15 As shown, the near field communication structure 9 may include a ferrite plate 27 and a first trace 28 disposed on the ferrite plate 27, wherein the ferrite plate 27 may be an irregular pattern plate. The first trace 28 is in a ring shape, and the ferrite plate 27 has a first area 29 where the first trace 28 is not disposed.

[0106] Fig.16 for Fig.15 A schematic diagram of a projection of a near field communication structure on a display unit, in some exemplary embodiments, such as Figure 3 , Fig.15 and Fig.16 As shown, the first area 29 of the ferrite plate 27 corresponds to the binding portion 15 in a direction perpendicular to the display portion 13, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the first projection B and the second projection A may overlap partially, and both have a part that does not overlap, and the overlapping part may be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 may not overlap with the projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D do not overlap.

[0107] Fig.17 for Fig.15 Another projection diagram of the near field communication structure in the display unit, in some exemplary embodiments, as Figure 3 , Fig.15 and Fig.17As shown, the first area 29 of the ferrite plate 27 is staggered with the binding portion 15 in a direction perpendicular to the display portion 13, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B, the orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, the first projection B and the second projection A can overlap partially, the first projection B and the second projection A both have a part that does not overlap, and the overlapping part of the first projection B and the second projection A can be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 can be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping part.

[0108] Fig.18 FIG. 1 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. Fig.18 As shown, the near field communication structure 9 may include a ferrite plate 27 of an irregular pattern plate and a first trace 28 disposed on the ferrite plate 27, wherein the circumferential edge of the ferrite plate 27 includes a first edge 30, and two notches 31 may be disposed on the first edge 30, so that the ferrite plate 27 forms an irregular shape. The first trace 28 is arranged along the edge of the ferrite plate 27 and is surrounded by a ring.

[0109] Fig.19 for Fig.18 A schematic diagram of a projection of a near field communication structure on a display unit, in some exemplary embodiments, such as Figure 3 , Fig.18 and Fig.19 As shown, the first edge 30 of the ferrite plate 27 is located on the side of the ferrite plate 27 close to the bending portion 14, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A. The first projection B and the second projection A may overlap partially, and both have a part that does not overlap, and the overlapping part may be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 may be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 may overlap with the projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D overlap, and the orthographic projection of the first edge 30 on the display portion 13 may be the fifth projection E, and the fifth projection E is located within the second projection A.

[0110] Fig. 20 for Fig.18 Another projection diagram of the near field communication structure in the display unit, in some exemplary embodiments, as Figure 3 , Fig.18 and Fig. 20As shown, the first edge 30 of the ferrite plate 27 is located on the side of the ferrite plate 27 away from the bending portion 14, the orthographic projection of the ferrite plate 27 on the display portion 13 is consistent with the orthographic projection of the near field communication structure 9 on the display portion 13, and both projections are the first projection B. The orthographic projection of the binding portion 15 on the display portion 13 can be set to the second projection A, and the first projection B and the second projection A can overlap partially, and the first projection B and the second projection A both have a part that does not overlap, and the overlapping part of the first projection B and the second projection A can be the third projection C. The orthographic projection of the first wiring 28 on the display portion 13 can be the fourth projection D, and the orthographic projection of the first wiring 28 on the display portion 13 can overlap with the orthographic projection of the binding portion 15 on the display portion 13, that is, the second projection A and the fourth projection D have an overlapping part.

[0111] Fig.21 FIG. 1 is another schematic diagram of a near field communication structure of an exemplary embodiment of the present disclosure. In some exemplary embodiments, as shown in FIG. Fig.21 As shown, the near field communication structure 9 may include a ferrite plate 27 of an irregular pattern plate and a first trace 28 disposed on the ferrite plate 27, wherein the circumferential edge of the ferrite plate 27 includes a first edge 30 and a second edge 32, and two notches 31 may be disposed on the first edge 30 and the second edge 32, so that the ferrite plate 27 forms an irregular shape. The first trace 28 is arranged along the edge of the ferrite plate 27 and is surrounded by a ring.

[0112] Fig. 22 is a cross-sectional schematic diagram of another display module according to an exemplary embodiment of the present disclosure. In some exemplary embodiments, Figure 3 and Fig. 22 As shown, the near field communication structure 9 may include a plate-shaped ferrite plate 27 and a copper foil 33, which may be stacked in a direction perpendicular to the display portion 13, the ferrite plate 27 is located on the side of the copper foil 33 facing the composite film 7, and the ferrite plate 27 may bond the composite film 7 to the copper foil 33. In a direction perpendicular to the display portion 13, the display portion 13, the second back film layer 18, the composite film 7, the ferrite plate 27 and the copper foil 33 are stacked in sequence.

[0113] Fig.23 for Fig. 22 A partial cross-sectional schematic diagram of a display module in FIG. Fig.24 for Fig. 22 Schematic diagram of a ferrite plate in FIG. 1 , in some exemplary embodiments, as shown in FIG. Figure 3 , Fig. 22 , Fig.23 and Fig.24As shown, the display module may also include a conductive member 34, which can penetrate the composite film 7 and the ferrite plate 27, and can achieve the connection between the copper foil 33 and the second back film layer 18. The copper foil 33 can be used as a grounding terminal by connecting to a shell or other forms, and the second back film layer 18 is connected to the copper foil 33 through the conductive member 34, thereby achieving the grounding of the display part 13.

[0114] In some exemplary embodiments, Figure 3 , Fig. 22 , Fig.23 and Fig.24 As shown, the ferrite plate 27 may be provided with a first through hole 35, the first through hole 35 passes through the ferrite plate 27 in a direction perpendicular to the display portion 13, the first through hole 35 may be a rectangular hole, but is not limited thereto, for example, the first through hole 35 may be a regular hole such as a circular hole, a triangular hole, a trapezoidal hole, or an irregular hole. The composite film 7 may be provided with a second through hole 36, the second through hole 36 passes through the composite film 7 in a direction perpendicular to the display portion 13, the hole shape and hole shape size of the second through hole 36 are consistent with those of the first through hole 35, in this example, the second through hole 36 and the first through hole 35 are both rectangular holes, but are not limited thereto, for example, the hole shape of the second through hole 36 is different from that of the first through hole 35, and for another example, the hole shape of the second through hole 36 and the first through hole 35 are consistent, but the size is inconsistent. One end of the first through hole 35 extends to the copper foil 33, the other end of the first through hole 35 is connected to the first end of the second through hole 36, and the second end of the second through hole 36 extends to the second back film layer 18, so that the second through hole 36 and the first through hole 35 are correspondingly arranged in a direction perpendicular to the display part 15, and the second through hole 36 and the first through hole 35 together constitute a accommodating cavity 37, so that the cross-section of the accommodating cavity 37 on a plane parallel to the display part 13 is rectangular.

[0115] In some exemplary embodiments, Figure 3 , Fig. 22 , Fig.23 and Fig.24As shown, the material of the conductive member 34 may be conductive foam or conductive double-sided tape, which is conductive and flexible. The conductive member 34 in this example is made of conductive foam, but is not limited thereto. For example, the material of the conductive member 34 may be other flexible and conductive materials other than conductive foam and conductive double-sided tape. The cross-section of the conductive member 34 on a plane parallel to the display portion 13 may be rectangular, so that the shape of the conductive member 34 matches the hole shape of the second through hole 36 and the first through hole 35, but is not limited thereto. For example, the cross-section of the conductive member 34 on a plane parallel to the display portion 13 may be circular, trapezoidal, rhombus, triangular or irregular in shape, and the second through hole 36 and the first through hole 35 are both configured as corresponding circular holes, trapezoidal holes, rhombus holes, triangular holes or irregular holes corresponding to the conductive member 34. The cross-section of the conductive member 34 on a plane parallel to the display portion 13 may be rectangular, and the minimum area of ​​the cross-section may be S, where S ≥ 5 mm 2 In this example, S = 6 mm 2 , but not limited thereto, for example, the minimum cross-sectional area S of the conductive member 34 may be 5 mm 2 For example, the minimum cross-sectional area S of the conductive member 34 may be 6.5 mm 2 For example, the minimum cross-sectional area S of the conductive member 34 may be 8 mm 2 .

[0116] In some exemplary embodiments, Figure 3 , Fig. 22 , Fig.23 and Fig.24 As shown, the conductive member 34 is in the accommodating cavity 37, the conductive member 34 passes through the second through hole 36 and the first through hole 35, one end of the conductive member 34 in the direction perpendicular to the display portion 13 abuts against the copper foil 33, and the other end of the conductive member 34 in the direction perpendicular to the display portion 13 abuts against the second back film layer 18. The minimum cross-sectional area of ​​the conductive member 34 on the plane parallel to the display portion 13 can be greater than or equal to 5mm 2 , so that the contact area between the conductive member 34 and the second back film layer 18 is greater than or equal to 5mm 2 The contact area between the conductive member 34 and the copper foil 33 is greater than or equal to 5 mm 2 It can be seen that the ground contact area of ​​the conductive member 34 is greater than or equal to 5 mm 2. Thus, the static electricity of the display part 15 is guided to the conductive member 34 through the second back film layer 18, and then the conductive member 34 can be guided to the copper foil 33. The conductive member 34 passes through the first through hole 35, and the outer wall of the conductive member 34 and the inner wall of the first through hole 35 are spaced apart, that is, there is a second gap 38 between the outer wall of the conductive member 34 and the inner wall of the first through hole 35. The second gap 38 can be a gap surrounding the conductive member 34, so that the conductive member 34 does not contact the inner wall of the first through hole 35. The minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through hole 35 is about 0.3mm to 0.7mm. In this example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through hole 35 can be 0.5mm, but it is not limited thereto. For example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through hole 35 can be 0.4mm, and for another example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the first through hole 35 can be 0.6mm. The conductive member 34 passes through the second through hole 36, and the outer wall of the conductive member 34 and the inner wall of the second through hole 36 are spaced apart, that is, there is a third gap 39 between the outer wall of the conductive member 34 and the inner wall of the second through hole 36. The third gap 39 may be a gap surrounding the conductive member 34, so that the conductive member 34 does not contact the inner wall of the second through hole 36. The minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through hole 36 is about 0.3 mm to 0.7 mm. In this example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through hole 36 may be 0.5 mm, but it is not limited thereto. For example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through hole 36 may be 0.4 mm, and for another example, the minimum distance between the outer wall of the conductive member 34 and the inner wall of the second through hole 36 may be 0.6 mm.

[0117] In some exemplary embodiments, Figure 3 , Fig. 22 , Fig.23 and Fig.24 As shown, there may be one conductive member 34 and one accommodating cavity 37. However, it is not limited thereto. In some exemplary embodiments, there may be multiple conductive members 34 and multiple accommodating cavities 37, and the conductive members 34 and accommodating cavities 37 are arranged one by one. For example, the ferrite plate 27 may be provided with two first through holes 35, and the composite film 7 may be provided with two second through holes 36 corresponding to the first through holes 35, forming two accommodating cavities 37, and each of the two accommodating cavities 37 is provided with one conductive member 34; for another example, the ferrite plate 27 may be provided with four first through holes 35, and the composite film 7 may be provided with four second through holes 36 corresponding to the first through holes 35, forming four accommodating cavities 37, and each of the four accommodating cavities 37 is provided with one conductive member 34. Multiple conductive members 34 can all contact the copper foil 33 and the second back film layer 18, and multiple conductive members 34 can effectively improve the anti-static field and electrostatic protection capabilities of the display module.

[0118] In some exemplary embodiments, a method of assembling Figure 3 The display module shown in the figure has three main steps in the installation method, including binding of the display panel 5, assembly of the composite film 7, installation of the near-field communication structure 9, and bending. First, the bending portion 14 of the display panel 5 is not in a bent state, and the bending portion 14 is not folded. In this state, the bonding of the back film 6 and the protective adhesive layer 12 is completed, and the binding portion 15 of the display panel 5 and the first circuit board 10 are bound. Next, the composite film 7 is attached to the display portion 13 of the display panel 5, and the composite film 7 is attached to the backlight side of the display portion 13. Then, the near-field communication structure 9 is installed, and the near-field communication structure 9 is bonded to the composite film 7 in an aligned manner, wherein the double-sided adhesive 16 has been pre-installed on the near-field communication structure 9, and the double-sided adhesive 16 and the near-field communication structure 9 are fed as one piece. Finally, the bending portion 14 is folded so that the bending portion 14 is in a bent state, and the double-sided adhesive 16 is bonded to the back film on the binding area 15 in an aligned manner, and then the near-field communication structure 9 and the first circuit board 10 are welded to complete the assembly of the display module. In addition, as Figure 3 As shown, the display module can also be installed with a cover plate 1, a curable optical adhesive 2, a polarizer 3 and an encapsulation layer 4. When performing the first step of installing the display module, that is, before binding the display panel 5, the encapsulation layer 4, the polarizer 3, the curable optical adhesive 2 and the cover plate 1 need to be installed in sequence in alignment with the display part 13 of the display panel 5.

[0119] In some exemplary embodiments, a display device includes the above-mentioned display module, and the display device can be an OLED display device. The display device provided in the embodiment of the present disclosure can be applied to electronic devices, and can be a mobile phone, a tablet computer, a television, a display, a laptop computer, a digital photo frame, a navigator, a car display, or any product or component with a display function such as a wearable device, such as a smart watch, a smart bracelet, smart glasses, smart headphones, smart clothing, a head-mounted display, etc. In this example, the display device is a mobile phone, and by increasing the space occupied by the near-field communication structure 9, the signal amount of the near-field communication structure 9 can be guaranteed while simplifying the structure.

[0120] In combination with the above embodiments, the display module increases the space occupied by the near-field communication structure 9 to ensure the signal volume of the near-field communication structure 9, so that the performance of the display device at the 12 o'clock and 6 o'clock directions is close. The display module reduces the thickness of the composite film, and replaces the curved gasket with double-sided tape 16, and then extends the near-field communication structure 9 to increase the area of ​​the near-field communication structure 9, thereby improving the performance of the near-field communication structure 9. The display module can achieve the overall maximum stacking thickness unchanged, but the signal of the near-field communication structure 9 will be greatly improved, and the cancellation of the curved gasket can save material and labor costs. The double-sided tape 16 and the near-field communication structure 9 signal are fed as one, which effectively optimizes the production line process without increasing the labor corresponding to the double-sided tape 16 attachment. The display module introduces electrostatic field optimization measures, uses the near-field communication structure 9 and the composite film to open a gap, and uses a conductive member to ground the copper foil and the display panel. The grounding area of ​​a single conductive member 34 is recommended to be greater than or equal to 5mm 2 The number of the conductive member 34 is at least one, which effectively improves the anti-static field and electrostatic protection capabilities of the display module.

[0121] It will be appreciated by those skilled in the art that all or some of the steps, systems, and functional modules / units in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. In hardware implementations, the division between the functional modules / units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed by several physical components in cooperation. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, it is well known to those of ordinary skill in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a display portion, a bending portion, and a binding portion connected in sequence, the bending portion being folded to a backlight side of the display portion; A near field communication structure, wherein the near field communication structure is located on the backlight side of the display portion; The display portion, the near field communication structure and the binding portion are arranged in sequence in a direction perpendicular to the display portion, and an orthographic projection of the near field communication structure on the display portion at least partially overlaps with an orthographic projection of the binding portion on the display portion.

2. The display module according to claim 1, characterized in that: It also includes a first back film layer, which is located on the surface of the binding part close to the display part, and the near field communication structure is bonded to the first back film layer.

3. The display module according to claim 2, characterized in that: The near field communication structure is provided with a double-sided adhesive for bonding on a surface facing the first back film layer, and the double-sided adhesive is configured as acrylic hot melt adhesive.

4. The display module according to claim 3, characterized in that: The thickness of the double-sided tape is set to 0.02 mm to 0.05 mm.

5. The display module according to claim 2, characterized in that: It also includes a composite film, which is arranged between the near field communication structure and the display part, and the thickness of the composite film is set to be less than 0.16 mm.

6. The display module according to claim 5, characterized in that: The composite film includes a first film layer and a grid glue stacked in a direction perpendicular to the display part, and the first film layer is configured as a graphite layer, a foam glue layer or a polyimide layer.

7. The display module according to claim 6, characterized in that: The thickness of the first film layer is set to 0.05 to 0.07 mm, and the thickness of the grid glue is set to 0.02 to 0.04 mm.

8. The display module according to claim 5, characterized in that: The thickness of the composite film is set to be 0.06 mm to 0.12 mm.

9. The display module according to claim 1, characterized in that: Also included is a conductive member for grounding the display panel; The near field communication structure includes a ferrite plate and a copper foil stacked in a direction perpendicular to the display portion, wherein the copper foil is located on a side of the ferrite plate away from the display portion; The ferrite plate is provided with a first through hole, the conductive member passes through the first through hole, one end of the conductive member is against the copper foil, and the conductive member is arranged to be spaced apart from the inner side wall of the first through hole.

10. The display module according to claim 9, characterized in that: It also includes a composite film and a second back film layer, wherein the second back film layer is arranged on a surface of the display part facing the near field communication structure, The second back film layer, the composite film, and the near field communication structure are stacked in sequence in a direction perpendicular to the display portion; The composite membrane is provided with a second through hole, the second through hole is connected to the first through hole, and the first through hole and the second through hole constitute a receiving cavity; One end of the conductive member away from the copper foil abuts against the second back film layer, the conductive member sequentially passes through the first through hole and the second through hole, and the conductive member is arranged to be spaced apart from the inner side wall of the second through hole.

11. The display module according to claim 10, characterized in that: There are a plurality of the conductive members, there are a plurality of the accommodating cavities, and the conductive members and the accommodating cavities are arranged in one-to-one correspondence.

12. The display module according to claim 10, characterized in that: The cross-sectional shape of the conductive member on a plane parallel to the display portion is set to be rectangular, circular, rhombus, triangle, trapezoid or irregular, and the hole shapes of the second through hole and the first through hole are both set to be consistent with the cross-sectional shape of the conductive member on a plane parallel to the display portion.

13. The display module according to claim 9, characterized in that: The conductive member is configured as conductive foam or conductive double-sided tape.

14. The display module according to claim 9, characterized in that: The cross-sectional area of ​​the conductive member on a plane parallel to the display portion is set to be greater than or equal to 5 mm 2 .

15. The display module according to any one of claims 1 to 8, characterized in that: The near-field communication structure includes a ferrite plate and a first routing line arranged on the ferrite plate, wherein an orthographic projection of the first routing line on the display portion at least partially overlaps with an orthographic projection of the binding portion on the display portion, or an orthographic projection of the first routing line on the display portion at least partially does not overlap with an orthographic projection of the binding portion on the display portion.

16. The display module according to any one of claims 1 to 14, characterized in that: A chip is also included. The chip is arranged on a surface of the binding portion away from the near field communication structure, and the orthographic projection of the chip on the display portion is located within the orthographic projection of the near field communication structure on the display portion.

17. The display module according to any one of claims 1 to 14, characterized in that: The orthographic projection of the near field communication structure on the display portion is set to a first projection, the orthographic projection of the binding portion on the display portion is set to a second projection, and the overlapping projection area of ​​the second projection and the first projection is set to be greater than two-thirds of the projection area of ​​the second projection.

18. The display module according to any one of claims 1 to 14, characterized in that: The projection area of ​​the orthographic projection of the near field communication structure on the display portion is not less than two thirds of the area of ​​the display portion.

19. The display module according to any one of claims 1 to 14, characterized in that: It also includes a cover plate, a curable optical adhesive, a polarizer and an encapsulation layer located on the light-emitting side of the display unit. The encapsulation layer, the polarizer, the curable optical adhesive and the cover plate are stacked in sequence in a direction away from the display unit.

20. A display device, characterized in that: Comprising a display module as described in any one of claims 1 to 19.

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