A method and device for controlling the performance of the connection interface between nickel-copper brazing material and diamond

Abstract

The present application provides a method and device for regulating the performance of the connection interface between nickel-copper solder and diamond, which relates to the field of computing and welding material technology, and effectively solves the problem that the existing research methods cannot quickly and efficiently predict the influence of strong carbon elements on the interface performance of brazed diamond / nickel-copper solder and the influence on diamond after brazing from the atomic scale, and timely regulate the solder composition. The method includes: constructing a nickel-copper solder crystal model and a diamond crystal model respectively based on a preset construction method; cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface; obtaining a doped interface model of nickel-copper solder / diamond based on strong carbon elements and the established clean interface model; analyzing the properties corresponding to the clean interface model of nickel-copper solder / diamond and the doped interface model, respectively, to obtain analysis results, and obtaining the regulated nickel-copper solder based on the analysis results.

Description

Technical Field

[0001] The present application relates to the technical field of computing and welding materials, and in particular to a method and device for regulating the connection interface performance between nickel-copper brazing material and diamond. Background Art

[0002] As the hardest substance in nature, diamond particles have the characteristics of high hardness, high stiffness, high wear resistance, and low thermal expansion. They can significantly improve the wear resistance and hardness of composite materials. At the same time, their good thermal conductivity helps to quickly dissipate heat and reduce the wear rate of materials in high temperature environments. Therefore, diamond particles are often used to enhance the mechanical properties of nickel-copper coatings. Strong carbon elements have extremely high hardness and wear resistance, and play an important role in material reinforcement and surface treatment. They significantly improve the strength and fatigue resistance of materials, and enhance the stability and durability of materials in high temperature and high pressure environments. At the same time, strong carbon elements can react with carbon in diamond to form strong carbides, enhance the mechanical properties of the coating and improve the bonding strength between diamond and coating. Therefore, strong carbon elements are often selected as part of the components in nickel-copper brazing filler metals to obtain nickel-copper-diamond composite coatings with better performance.

[0003] At present, the use of first-principles methods to study the influence of strong carbon elements on the interface performance of brazed diamond / nickel-copper brazing alloys and the influence of diamond after brazing is still a hot topic. For example, the paper "First-principles calculation and experimental study on the interface strengthening of diamond brazed with Ni-Cr brazing alloys" published in the 59th issue of Mechanical Engineering Journal on November 14, 2023 by authors Zhang Jian, Xiao Ang, Zhang Ao, Liu Junyi, and Zhang Mingjun studied the microscopic behavior and mechanism of the diamond interface brazed with Ni-Cr brazing alloys doped with strong carbide-forming elements X (X=Mn, Ti, V, Zr, Nb, Mo, Hf, Ta, W) and verified it experimentally. However, this method did not use first-principles calculations to control the brazing alloy composition, resulting in the research effect being not obvious.

[0004] How to quickly and efficiently predict the influence of strong carbon elements on the interface performance of diamond / nickel-copper brazing alloys and the influence on diamond after brazing from the atomic scale and timely adjust the brazing alloy composition is one of the difficulties in this field. Based on this, it is urgent to develop methods to predict the influence of strong carbon elements on the interface performance of diamond / nickel-copper brazing alloys and adjust the brazing alloy composition, improve the research in related fields, and improve production efficiency and product quality. Summary of the invention

[0005] In view of this, the purpose of the present application is to provide a method and device for regulating the performance of the connection interface between nickel-copper solder and diamond. The method and device for regulating the performance of the connection interface between nickel-copper solder and diamond effectively solve the problem that the existing research methods cannot quickly and efficiently predict the influence of strong carbon elements on the interface performance of brazed diamond / nickel-copper solder and the influence on diamond after brazing from the atomic scale and timely regulate the solder composition.

[0006] In a first aspect, an embodiment of the present application provides a method for controlling the performance of a connection interface between a nickel-copper brazing material and diamond, the method comprising:

[0007] Based on the preset construction method, corresponding nickel-copper solder crystal models and diamond crystal models are constructed for the target nickel-copper solder and diamond respectively; the target nickel-copper solder has a target atomic ratio and a target applicable model; the nickel-copper solder crystal model and the diamond crystal model have corresponding atoms;

[0008] Cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, and performing convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface;

[0009] A clean interface model of nickel-copper solder / diamond is established based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, and a doped interface model of nickel-copper solder / diamond is obtained based on the strong carbon element and the clean interface model of the nickel-copper solder / diamond; the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface have a target fit;

[0010] The properties corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model are analyzed to obtain analysis results, and based on the analysis results, the nickel-copper solder components in the doped interface model of the nickel-copper solder / diamond are regulated to obtain the regulated nickel-copper solder.

[0011] In combination with the first aspect, the embodiment of the present application provides a first possible implementation of the first aspect, wherein the step of obtaining the analysis result to adjust the components of the corresponding nickel-copper solder based on the analysis result to obtain the adjusted nickel-copper solder comprises:

[0012] Based on the analysis results, the nickel-copper solder / diamond doping interface model is calculated again in multiple calculation dimensions to obtain calculation results;

[0013] Based on the calculation results, the nickel-copper solder components in the nickel-copper solder / diamond doping interface model are regulated to verify the performance of the regulated nickel-copper solder based on the regulated nickel-copper solder / diamond doping interface model.

[0014] In combination with the first aspect, the embodiment of the present application provides a second possible implementation of the first aspect, wherein the verification based on the doping interface model of the regulated nickel-copper solder / diamond to verify the performance of the regulated nickel-copper solder includes:

[0015] Based on the adjusted nickel-copper solder / diamond doping interface model, a nickel-copper-diamond composite coating is prepared according to a preset preparation method, and the corresponding preset verification equipment is called;

[0016] The nickel-copper-diamond composite coating is subjected to a performance test based on the preset verification equipment to obtain a test result, so as to determine the performance of the regulated nickel-copper solder based on the test result.

[0017] In combination with the first aspect, the embodiment of the present application provides a third possible implementation of the first aspect, wherein the doped interface model of nickel-copper solder / diamond is obtained based on the clean interface model of the strong carbon element and the nickel-copper solder / diamond, comprising:

[0018] The initial doping interface model is obtained by partially replacing the atoms in the clean interface model of the nickel-copper solder / diamond with the atoms corresponding to the strong carbon element;

[0019] The initial doping interface model is structurally optimized based on a plurality of interface model structural optimization parameters to obtain the doping interface model.

[0020] In combination with the first aspect, the embodiment of the present application provides a fourth possible implementation of the first aspect, wherein the analysis of the performances corresponding to the clean interface model of the nickel-copper brazing material / diamond and the doped interface model, respectively, obtains analysis results, including:

[0021] Based on the performance of the nickel-copper solder / diamond clean interface model and the doped interface model, confirm the analysis dimensions of the nickel-copper solder / diamond clean interface model and the doped interface model;

[0022] Based on the analysis dimension, the performance of the clean interface model and the doped interface model of the nickel-copper solder / diamond is analyzed to obtain analysis results.

[0023] In combination with the first aspect, the embodiment of the present application provides a fifth possible implementation of the first aspect, wherein the analysis dimension includes at least one of the following: interface adhesion work, charge density, differential charge density, state density and Mulliken layout number.

[0024] In combination with the first aspect, the embodiment of the present application provides a sixth possible implementation of the first aspect, wherein the convergence test is performed on a plurality of the nickel-copper solder crystal surfaces and the diamond crystal surfaces to obtain the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, comprising:

[0025] Conducting convergence tests on the surfaces of the nickel-copper solder crystals and the surfaces of the diamond crystals to obtain test results; the test results include surface energy test results and atomic layer spacing convergence results;

[0026] Based on the surface energy test results and the atomic layer spacing convergence results, the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface are screened out from multiple nickel-copper solder crystal surfaces and diamond crystal surfaces.

[0027] In a second aspect, an embodiment of the present application provides a device for controlling the performance of a connection interface between a nickel-copper brazing material and diamond, the device comprising:

[0028] A construction module, for constructing a corresponding nickel-copper solder crystal model and a diamond crystal model for a target nickel-copper solder and a diamond respectively based on a preset construction method; the target nickel-copper solder has a target atomic ratio and a target applicable model;

[0029] A testing module, used for cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, so as to perform convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface;

[0030] Establishing a module for establishing a nickel-copper solder / diamond clean interface model based on an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface, and obtaining a nickel-copper solder / diamond doped interface model based on the nickel-copper solder / diamond clean interface model; the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface have a target fit;

[0031] A control module is used to obtain analysis results based on the performance analysis of the clean interface model of the nickel-copper solder / diamond and the doped interface model, so as to control the components in the corresponding nickel-copper solder interface model based on the analysis results to obtain the regulated nickel-copper solder.

[0032] In a third aspect, an embodiment of the present application provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of any one of the methods for regulating the performance of the connection interface between nickel-copper brazing material and diamond are performed.

[0033] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of any one of the methods for regulating the performance of the connection interface between nickel-copper solder and diamond are executed.

[0034] The embodiment of the present application provides a method for regulating the performance of the connection interface between nickel-copper solder and diamond. The method first constructs corresponding nickel-copper solder crystal models and diamond crystal models for target nickel-copper solder and diamond respectively based on a preset construction method; the target nickel-copper solder has a target atomic ratio and a target applicable model; the nickel-copper solder crystal model and the diamond crystal model have corresponding atoms; secondly, the nickel-copper solder crystal model and the diamond crystal model are cut respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, and convergence tests are performed on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface; then, a clean interface model of nickel-copper solder / diamond is established based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, and a doped interface model of nickel-copper solder / diamond is obtained based on the strong carbon element and the clean interface model of the nickel-copper solder / diamond; the optimal nickel-copper solder crystal surface and the diamond are respectively subjected to convergence tests. The optimal diamond crystal surfaces have a target fit; finally, the performances corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model are analyzed to obtain analysis results, and based on the analysis results, the nickel-copper solder components in the doped interface model of the nickel-copper solder / diamond are regulated to obtain the regulated nickel-copper solder, thereby achieving a rapid and efficient prediction of the influence of strong carbon elements on the interface performance of brazed diamond / nickel-copper solder and the influence on diamond after brazing from the atomic scale, and the effect of quickly adjusting the components of the nickel-copper solder, and also achieving the effect of obtaining a connection interface with good performance, reliable and stable, and improving the service life of heterogeneous joints, effectively solving the problem that the existing research methods cannot quickly and efficiently predict the influence of strong carbon elements on the interface performance of brazed diamond / nickel-copper solder and the influence on diamond after brazing from the atomic scale and timely regulate the solder composition, and providing a scientific and accurate new solder design idea for accurately regulating solder components, designing new solders, reducing experimental costs, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A schematic diagram of the process of the first method for controlling the performance of the connection interface between nickel-copper solder and diamond provided in this embodiment is shown;

[0037] Figure 2 A schematic diagram of the crystal model of diamond and nickel-copper solder CuNi3 provided in this embodiment is shown;

[0038] Figure 3 The interface schematic diagram of the clean interface model and the doped interface model provided in this embodiment is shown;

[0039] Figure 4 (a)-(i) show the atomic structure schematic diagrams of the clean interface model constructed and the doped interface model after relaxation provided in this embodiment;

[0040] Figure 5 (a)-(i) in the figure show the charge density schematic diagrams of the doping interface model of different element doping provided in this embodiment after complete relaxation;

[0041] Figure 6 A schematic diagram of element distribution at the diamond / nickel-copper solder interface provided in this embodiment is shown;

[0042] Figure 7 The schematic diagram of the structure of the first device for controlling the connection interface performance between nickel-copper solder and diamond provided in this embodiment is shown;

[0043] Figure 8 A schematic structural diagram of an electronic device provided in this embodiment is shown. DETAILED DESCRIPTION

[0044] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0045] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0046] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0047] How to quickly and efficiently predict the influence of strong carbon elements on the interface performance of diamond / nickel-copper brazing alloys and the influence on diamond after brazing from the atomic scale and timely adjust the brazing alloy composition is one of the difficulties in this field. Based on this, it is urgent to develop methods to predict the influence of strong carbon elements on the interface performance of diamond / nickel-copper brazing alloys and adjust the brazing alloy composition, improve the research in related fields, and improve production efficiency and product quality.

[0048] Based on this, the embodiments of the present application provide a method and device for regulating the performance of the connection interface between nickel-copper brazing material and diamond, which is described below through embodiments.

[0049] Example 1

[0050] To facilitate understanding of this embodiment, a method for regulating the performance of high nitrogen steel / nickel copper brazing alloy with an active element disclosed in the embodiment of this application is first introduced in detail. Figure 1 The flowchart of a method for regulating the performance of the connection interface between a nickel-copper brazing alloy and diamond is shown. The present application provides a method for regulating the performance of the connection interface between a nickel-copper brazing alloy and diamond, and the method comprises:

[0051] S101, constructing corresponding nickel-copper solder crystal models and diamond crystal models for target nickel-copper solder and diamond respectively based on a preset construction method; the target nickel-copper solder has a target atomic ratio and a target applicable model; the nickel-copper solder crystal model and the diamond crystal model have corresponding atoms;

[0052] S102, cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, and performing convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface;

[0053] S103, establishing a nickel-copper solder / diamond clean interface model based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, and obtaining a nickel-copper solder / diamond doped interface model based on the strong carbon element and the nickel-copper solder / diamond clean interface model; the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface have a target fit;

[0054] S104, analyzing the properties corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model, respectively, to obtain analysis results, and based on the analysis results, regulating the nickel-copper solder components in the doped interface model of the nickel-copper solder / diamond to obtain the regulated nickel-copper solder.

[0055] In step S101, since the nickel-copper solder is a nickel-based material, the target nickel-copper solder is a nickel-copper solder with a target atomic ratio of nickel to copper of greater than 1:1. The original model of the nickel-copper solder can be CuNi and CuNi3. In order to be more compatible with the diamond, the target applicable model of the nickel-copper solder is CuNi3. After determining the target original model of the nickel-copper solder, a preset construction method is used to construct corresponding nickel-copper solder crystal models and diamond crystal models for the target nickel-copper solder and diamond, respectively. The preset construction method includes a crystal database, crystal structure visualization software, and computational simulation software. The crystal structure visualization software includes Materials Studio, VESTA, etc., and the computational simulation software includes CASTEP, etc. The nickel-copper solder crystal model can be represented as a CuNi3 crystal model, and the diamond crystal model can be represented as a diamond crystal model. The CuNi3 crystal model and the diamond crystal model can be constructed through the crystal database, the crystal structure visualization software, and the computational simulation software. The CuNi3 crystal model is imported from the crystal database, and the diamond crystal model is constructed using Materials Studio. Studio visual computational simulation software, where the CuNi3 crystal constants are a=b=3.53423 Å, c=7.106922 Å, and the diamond crystal constants are a=b=c=3.560745 Å. Figure 2 The crystal models of CuNi3 and diamond are shown. The nickel-copper solder crystal model and the diamond crystal model have corresponding atoms, that is, the corresponding effects of the target nickel-copper solder and diamond are achieved.

[0056] After constructing the nickel-copper solder crystal model and the diamond crystal model, in order to ensure the stability of the nickel-copper solder crystal model and the diamond crystal model, the nickel-copper solder crystal model and the diamond crystal model are structurally optimized according to structural optimization parameters, and the structural optimization parameters include functional, pseudopotential, K-point grid, cutoff energy, maximum stress and maximum displacement, wherein the functional is an exchange-correlation functional, and the PBE form in the generalized gradient approximation (GGA) is adopted; the pseudopotential adopts an ultrasoft pseudopotential; the K-point grid adopts 4×4×4; the cutoff energy is set to 500 eV; the maximum stress is set to 0.05 GPa, and the maximum displacement is set to 0.001 Å. After structural optimization, a stable nickel-copper solder crystal model and a diamond crystal model are obtained.

[0057] In step S102, the nickel-copper solder crystal model and the diamond crystal model are imported into Materials Studio crystal structure visualization calculation simulation software, and the nickel-copper solder crystal model and the diamond crystal model are cut respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, that is, the nickel-copper solder crystal model and the diamond crystal model need to be cut respectively to obtain a plurality of nickel-copper solder crystal surfaces of the nickel-copper solder crystal model and a plurality of diamond crystal surfaces of the diamond crystal model, wherein the cut surfaces include but are not limited to (111), (100), (001), and (010) surfaces. Here, the (010) and (001) faces are selected for cutting of the nickel-copper solder crystal model and the diamond crystal model, and the (100) and (010) faces can also be selected for cutting, and convergence tests are performed on multiple nickel-copper solder crystal surfaces and diamond crystal surfaces respectively, that is, it is necessary to perform convergence tests on each nickel-copper solder crystal surface and each diamond crystal surface obtained, and after the test, the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface are obtained, wherein the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface are the most stable surfaces of multiple nickel-copper solder crystal surfaces and multiple diamond crystal surfaces, respectively.

[0058] In the specific implementation process of step S102, there is an embodiment in which: the convergence test is performed on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, including:

[0059] S1021, respectively performing convergence tests on the surfaces of the nickel-copper solder crystals and the diamond crystal surfaces to obtain test results; the test results include surface energy test results and atomic layer spacing convergence results;

[0060] S1022. Based on the surface energy test results and the atomic layer spacing convergence results, select the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface from multiple nickel-copper solder crystal surfaces and diamond crystal surfaces.

[0061] In steps S1021-S1022, the convergence test includes a surface energy convergence test and an atomic layer spacing convergence test, which are respectively expressed by formulas (1)-(2):

[0062] (1);

[0063] (2);

[0064] in, and Corresponding to the total energy of the single cell and the surface model, and correspond to the number of atoms in the single cell and the surface model, respectively, A corresponds to the area of ​​the surface model, is the surface energy test result, that is, the energy of the surface of the cut model. and They represent the distance between the i-th layer surface and the j-th layer surface before and after the surface model relaxation, is the atomic layer test result, which indicates the rate of change of the distance between the i-th surface and the j-th surface before and after the relaxation of the surface model. When either the surface energy test result or the atomic layer test result is stable at a fixed value, the number of layers corresponding to the first appearance of the fixed value is the optimal number of layers of this crystal plane, and the surface corresponding to the optimal number of layers is the optimal nickel-copper solder crystal surface or the optimal diamond crystal surface.

[0065] When the (010) and (001) planes are selected for cutting, the surface atomic layer thickness after cutting is tested for convergence by calculating the surface energy and the atomic layer spacing. It is found that the 8-layer diamond surface and the 7-layer CuNi3 surface are convergent and can represent the true material properties. Therefore, the 8-layer diamond and 7-layer CuNi3 surface models are selected as the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface, respectively.

[0066] When the (100) and (010) planes are selected for cutting, the surface atomic layer thickness after cutting is tested for convergence by calculating the surface energy and the atomic layer spacing. It is found that the 8-layer diamond surface and the 7-layer CuNi3 surface are convergent and can represent the true material properties. Therefore, the 8-layer diamond and 7-layer CuNi3 surface models are selected as the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface, respectively.

[0067] In step S103, after obtaining the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface, in order to further ensure the stability of the constructed nickel-copper solder / diamond clean interface model, the fitness of the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface is calculated, and the fitness of the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface has a target fitness, and the target fitness is less than 6%, that is, the fitness of the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface is less than 6%. At this time, a nickel-copper solder / diamond clean interface model is established based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface and the target fitness between the two. The specific method of establishing is to splice the optimal nickel-copper solder crystal surface with the optimal diamond crystal surface. After the clean interface model is established, it is also necessary to perform structural optimization according to the structural optimization parameters like the crystal model to make the clean interface model more in line with the requirements. The clean interface model of CuNi3 / diamond is established as follows: Figure 3 As shown in (a), the degree of fit between the optimal diamond crystal surface and the optimal nickel-copper solder crystal surface of the clean interface model is less than 5%, which meets the requirements, and based on the strong carbon element and the nickel-copper solder / diamond clean interface model, the doped interface model of nickel-copper solder / diamond is obtained. Specifically, the atoms corresponding to the strong carbon element are replaced with the atoms in the nickel-copper solder / diamond clean interface model to obtain the doped interface model of nickel-copper solder / diamond, wherein the strong carbon element is the abbreviation of strong carbide-forming element.

[0068] In the specific implementation process of step S103, there is an embodiment in which the doped interface model of nickel-copper solder / diamond is obtained based on the clean interface model of the strong carbon element and the nickel-copper solder / diamond, including:

[0069] S1031, partially replacing atoms in the clean interface model of the nickel-copper solder / diamond with atoms corresponding to the strong carbon element to obtain an initial doping interface model;

[0070] S1032. Structural optimization is performed on the initial doping interface model based on a plurality of interface model structural optimization parameters to obtain the doping interface model.

[0071] In steps S1031-S1032, before determining to replace the clean interface model, first determine the replaceable strong carbon elements. In the present application, the strong carbon elements include but are not limited to titanium Ti, zirconium Zr, vanadium V, and chromium Cr. When replacing, one or two elements can be used for replacement. In the present application, when replacing, only atoms corresponding to one element are used for replacement, and the replacement amount is the same. Then, Ti, Zr, V, and Cr in the strong carbon elements are used to replace the Cu atoms in the first layer and the Cu atoms in the third layer respectively to construct a doping interface model, such as Figure 3 As shown in (b) and (c), (b) is M atoms doped in the CuNi3 interface layer; (c) is M atoms doped inside CuNi3, and the atoms corresponding to the strong carbon element are partially replaced with the atoms in the clean interface model of the nickel-copper solder / diamond to obtain the initial doped interface model. After obtaining the initial doped interface model, similar to the clean interface model, the initial doped interface model needs to be structurally optimized multiple times according to the interface model structure optimization parameters, so that the obtained doped interface model is more stable. The structure optimization parameters include: functional, pseudopotential, K-point grid, cutoff energy, maximum stress and maximum displacement; the functional is specifically GGA ofPBE; the pseudopotential is specifically an ultrasoft pseudopotential; the K-point grid is specifically 5×5×5; the cutoff energy is specifically 300 eV; the maximum stress and maximum displacement are specifically 0.05 GPa; the maximum displacement is specifically 0.001 Å.

[0072] In step S104, after obtaining the doped interface model of the nickel-copper solder / diamond, the clean interface model of the nickel-copper solder / diamond and the doped interface model of the nickel-copper solder / diamond are simultaneously analyzed for performance, that is, the clean interface model of the nickel-copper solder / diamond and the doped interface model are simultaneously analyzed for performances corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model, respectively, to obtain analysis results, which are performance evaluations of the doped interface model and the clean interface model of the nickel-copper solder / diamond, and the analysis results indicate areas where the nickel-copper solder needs to be adjusted, and based on the analysis results, the nickel-copper solder components in the doped interface model of the nickel-copper solder / diamond are regulated, and based on the regulated doped interface model of the nickel-copper solder / diamond, verification is performed in a predefined manner to verify that the adjusted nickel-copper solder components improve the performance of the doped interface model of the nickel-copper solder / diamond compared to before the adjustment, and nickel-copper solder is produced based on the regulated nickel-copper solder components, thereby improving the performance of the nickel-copper solder.

[0073] In the specific implementation process of step S104, there is an embodiment in which the analysis of the properties corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model respectively obtains the analysis results, including:

[0074] S10411. Based on the performance of the clean interface model of the nickel-copper solder / diamond and the doped interface model, confirm the analysis dimensions of the clean interface model of the nickel-copper solder / diamond and the doped interface model;

[0075] S10412. Perform performance analysis on the clean interface model and the doped interface model of the nickel-copper solder / diamond based on the analysis dimension to obtain analysis results.

[0076] In steps S10411-S10412, after obtaining the clean interface model and the doped interface model of the nickel-copper solder / diamond, it is necessary to perform performance analysis on the clean interface model and the doped interface model to determine the performance difference between the two, and to accurately understand the influence of strong carbon elements on the nickel-copper solder / diamond. Since the clean interface model and the doped interface model of the nickel-copper solder / diamond both have atoms and structures, it is necessary to analyze the two in terms of bonding strength and electronic structure, so as to obtain the performance difference between the doped interface model and the clean interface model. Based on these two aspects, the analysis dimensions for the performance analysis are determined. The analysis dimensions can be multiple or one. In the present application, the analysis dimensions are multiple. After determining the analysis dimensions, the clean interface model and the doped interface model of the nickel-copper solder / diamond are subjected to performance analysis. The performance analysis includes performance calculation. After the performance analysis is performed on all analysis dimensions, they need to be summarized to obtain analysis results.

[0077] In the specific implementation process of steps S10411-S10412, there is an embodiment in which the analysis dimension includes at least one of the following: interface adhesion work, charge density, differential charge density, state density and Mulliken layout number.

[0078] In this embodiment, the calculation formula of the interfacial adhesion work is shown in formula (3):

[0079] (3)

[0080] in, , They are separate A and B layer energies; is the total energy of the interface structure; is the interface area, is the interfacial adhesion work. Charge density, differential charge density, state density and Mulliken layout number can all be analyzed in the existing way.

[0081] After calculating the bonding strength and electronic structure of the clean interface model and the doped interface model, the analysis results are summarized as follows:

[0082] Bonding strength: The interfacial adhesion work of the clean interface model is 8.69 J / m 2 When Zr is doped in the CuNi3 interface layer, the adhesion work is lower than that of the clean interface. When Ti, Cr, and V are doped in the CuNi3 interface layer, the adhesion work is higher than that of the clean interface. Among them, the adhesion work of the interface model doped with Cr in the interface layer reaches the highest of 9.3 J / m 2 The results show that Ti, Cr and V elements have a positive effect on the interface performance of Ni-Cu solder / diamond, and the effect of Cr is the strongest. Figure 4 Figure 2 shows the atomic structure of the interface after complete relaxation of the interface model of different element doping. (a) is the clean CuNi3 / diamondi interface; (b), (c), (d) Ti, Zr, and V atoms are doped in the CuNi3 interface layer; (e), (f), and (g) Ti, Zr, and V atoms are doped in the interior of CuNi3. Figure 4 It can be seen that compared with the clean interface, the interface spacing of Ti doped in the interface layer is significantly reduced to 1.635Å, indicating that the Ti element improves the interface bonding strength. The above phenomenon also occurred when Cr and V were doped in the interface layer, and the minimum interface distance of the Cr element doped interface reached 1.487Å. In addition, when Ti, Zr, Cr, and V were doped inside CuNi3, there was no obvious change in the interface layer. During the experiment, the distribution of elements is related to the atomic aggregation trend after relaxation. Therefore, the diffusion behavior of elements can be reasonably inferred by the atomic aggregation trend. Figure 4 It can be seen that the distances between Ti, Zr, V and C in the interface layer are all lower than their respective interface distances, indicating that Ti, Zr and V tend to diffuse into diamond. On the contrary, the distance between Cr and C in the interface layer is significantly greater than the interface distance, indicating that the Cr element tends to gather inside the brazing material;

[0083] Electronic structure: Figure 5 Figure 2 is the charge density diagram of the interface model after complete relaxation of different element doping. (a) is the clean CuNi3 / diamond interface; (b), (c), (d) Ti, Zr, and V atoms are doped in the CuNi3 interface layer; (e), (f), and (g) Ti, Zr, and V atoms are doped in the interior of CuNi3. Figure 5 It can be seen that in the clean interface model and the doped interface model, there is an overlap of electron clouds between Ni atoms and C atoms, indicating that there are covalent bonds between Ni atoms and C atoms in all seven interfaces. The charge density near the doped atoms is significantly different from that of the clean CuNi3 / diamond interface. Figure 4From (ad), we can see that when the interface is generated, there are a lot of charges between the Ti, Zr, V, Cu, and Cr atoms at the interface and the C atoms in the interface layer, which makes them have the properties of covalent bonds with C atoms, and the charge density between Ti, V, and Cr atoms and C atoms is significantly greater than the charge density between Cu atoms and C atoms. On the contrary, the charge density between the doped atom Zr and C atoms is significantly less than the charge density between Cu atoms and C atoms, indicating that the order of covalent bond properties from strong to weak is Ti-C, VC, Cr-C>Cu-C>Zr-C. Therefore, it can be concluded that Ti, V, and Cr increase the interface bonding strength while Zr reduces the interface bonding strength. When Ti, Zr, V, and Cr are doped inside CuNi3, the charge distribution of the interface layer does not change significantly, so no excessive treatment is done.

[0084] In the specific implementation process of step S104, there is another embodiment: the step of obtaining the analysis result and adjusting the components of the corresponding nickel-copper solder based on the analysis result to obtain the adjusted nickel-copper solder includes:

[0085] S10421, based on the analysis results, the nickel-copper solder / diamond doping interface model is calculated again in multiple calculation dimensions to obtain calculation results;

[0086] S10422. Based on the calculation results, the nickel-copper solder components in the nickel-copper solder / diamond doping interface model are regulated to verify the performance of the regulated nickel-copper solder based on the regulated nickel-copper solder / diamond doping interface model.

[0087] In steps S10421-S10422, after the analysis results are obtained, the doping interface model of nickel-copper solder / diamond is calculated again in multiple calculation dimensions, wherein the doping interface model includes the following substances by mass percentage: Ni: 30-32%; Ti: 13-14%; Cu: 13.5-14%; Cr: 5-6%; Zr: 8.5-11%; Diamond: 18.5-21%; TiV alloy: balance, and the calculation dimensions include atomic doping ratio, atomic mass percentage, and fine-tuning element mass percentage, wherein the atomic doping ratio is the doping interface model. The ratio between the atoms corresponding to the heteroatom-level strong carbon element and the total number of atoms in the interface layer, the atomic mass percentage is obtained by replacing the corresponding proportion of nickel atoms and copper atoms and converting them according to the doping ratio, and the fine-tuning element mass percentage is obtained according to the atomic doping ratio, the atomic mass percentage and the experimental requirements. Based on the fine-tuning element mass percentage, the nickel-copper solder component in the nickel-copper solder / diamond doping interface model is regulated, and the regulated nickel-copper solder / diamond doping interface model is verified to verify that the performance of the regulated nickel-copper solder meets the experimental requirements and material requirements.

[0088] In the specific implementation process of step S10422, there is another embodiment: the verification based on the adjusted nickel-copper solder / diamond doping interface model to verify the performance of the adjusted nickel-copper solder includes:

[0089] S104221. Based on the adjusted nickel-copper solder / diamond doping interface model, prepare a nickel-copper-diamond composite coating according to a preset preparation method, and call the corresponding preset verification equipment;

[0090] S104222. Perform a performance test on the nickel-copper-diamond composite coating based on the preset verification equipment to obtain a test result, so as to determine the performance of the regulated nickel-copper solder based on the test result.

[0091] In steps S104221-S104222, a nickel-copper-diamond composite coating is prepared according to a preset preparation method based on the regulated nickel-copper brazing material / diamond doping interface model, wherein the preset preparation method is vacuum brazing, and the corresponding preset verification equipment is called to test the performance of the nickel-copper-diamond composite coating to obtain test results to understand whether the performance of the composite coating meets the expected standards, and whether there are any performance bottlenecks or deficiencies. If there are deficiencies, regulation is performed again until the requirements are met, thereby verifying whether the regulation is effective, and determining the performance of the nickel-copper brazing material after regulation. The preset verification equipment includes EDS, friction and wear testing machine, and can also be other verification equipment.

[0092] Observing the diffusion behavior of elements in the experiment can better verify the results of first-principles calculations, such as Figure 6 As shown, Figure 6 This is the EDS of the diamond / nickel-copper solder interface. Figure 6 It can be seen that Ti, Zr, and V have obvious segregation at the diamond interface, while Cr segregates inside the brazing material, which is consistent with the atomic structure of the interface layer after relaxation, and well verifies the first-principles calculation results. The method has a wide range of applications. The application scope of predicting doping elements, namely strong carbon elements, includes but is not limited to Ti, Zr, V, and Cr. The application scope of predicting brazing parent materials includes but is not limited to the field of connection between diamond and nickel-copper brazing materials. After appropriate adjustments to the construction model and calculation method, it can also be used to predict the interface performance of heterogeneous connections of other types of materials. The method can also be used for the design of new nickel-copper brazing materials, reducing the workload of achieving efficient connection between nickel-copper brazing materials and diamond heterogeneous materials, and has stronger reliability. By combining first-principles calculations with experiments, the accuracy of the prediction results can be determined according to the degree of consistency between the calculation results and the experimental results, thereby improving the credibility of the prediction results and helping to significantly reduce the experimental workload.

[0093] Example 2

[0094] The present application also provides a device for controlling the performance of the connection interface between nickel-copper brazing material and diamond, such as Figure 7 The block diagram of a nickel-copper solder and diamond connection interface performance control device is shown. The function implemented by the nickel-copper solder and diamond connection interface performance control device corresponds to the steps of performing a nickel-copper solder and diamond connection interface performance control method on a terminal device. The device can be understood as a component of a server including a processor, and the device includes:

[0095] The construction module 701 is used to construct a corresponding nickel-copper solder crystal model and a diamond crystal model for the target nickel-copper solder and diamond respectively based on a preset construction method; the target nickel-copper solder has a target atomic ratio and a target applicable model;

[0096] The testing module 702 is used to cut the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, so as to perform convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface;

[0097] Establishing module 703, for establishing a nickel-copper solder / diamond clean interface model based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, and obtaining a nickel-copper solder / diamond doped interface model based on the nickel-copper solder / diamond clean interface model;

[0098] The control module 704 is used to obtain the analysis results of the performance analysis based on the clean interface model of the nickel-copper solder / diamond and the doped interface model, so as to control the components in the corresponding nickel-copper solder interface model based on the analysis results to obtain the regulated nickel-copper solder.

[0099] In a feasible implementation, the control module includes:

[0100] A calculation module, used to calculate the nickel-copper solder / diamond doping interface model again in multiple calculation dimensions based on the analysis results to obtain calculation results;

[0101] A verification module is used to regulate the nickel-copper solder component in the nickel-copper solder / diamond doping interface model based on the calculation results, so as to verify the performance of the regulated nickel-copper solder based on the regulated nickel-copper solder / diamond doping interface model.

[0102] In a feasible implementation manner, the control module further includes:

[0103] A preparation module is used to prepare a nickel-copper-diamond composite coating according to a preset preparation method based on the adjusted nickel-copper solder / diamond doping interface model, and call the corresponding preset verification equipment;

[0104] The first control module is used to perform a performance test on the nickel-copper-diamond composite coating based on the preset verification equipment to obtain a test result, so as to determine the performance of the regulated nickel-copper solder based on the test result.

[0105] In a feasible implementation, a module is established, including:

[0106] A replacement module, used to partially replace the atoms in the clean interface model of the nickel-copper solder / diamond with the atoms corresponding to the strong carbon element to obtain an initial doping interface model;

[0107] The optimization module is used to perform structural optimization on the initial doping interface model based on a plurality of interface model structural optimization parameters to obtain the doping interface model.

[0108] In a feasible implementation, the control module also includes:

[0109] A confirmation module, used to confirm the analysis dimensions of the clean interface model of the nickel-copper solder / diamond and the doped interface model based on the performance of the clean interface model of the nickel-copper solder / diamond and the doped interface model;

[0110] An analysis module is used to perform performance analysis on the clean interface model and the doped interface model of the nickel-copper solder / diamond based on the analysis dimension to obtain analysis results.

[0111] In a feasible implementation, the control module further includes:

[0112] Interface adhesion work, charge density, differential charge density, density of states and Mulliken population number.

[0113] In a feasible implementation, the test module includes:

[0114] The first test module is used to perform convergence tests on the surfaces of the nickel-copper solder crystals and the diamond crystals to obtain test results; the test results include surface energy test results and atomic layer spacing convergence results;

[0115] A screening module is used to screen out the best nickel-copper solder crystal surface and the best diamond crystal surface from multiple nickel-copper solder crystal surfaces and diamond crystal surfaces based on the surface energy test results and the atomic layer spacing convergence results.

[0116] Example 3

[0117] The present application also provides an electronic device, such as Figure 8 As shown, it includes: a processor 801, a memory 802 and a bus 803, the memory 802 stores machine-readable instructions executable by the processor 801, when the electronic device is running, the processor 801 and the memory 802 communicate through the bus 803, and when the machine-readable instructions are executed by the processor 801, any one of the steps of the method for regulating the performance of the connection interface between nickel-copper solder and diamond is performed.

[0118] Example 4

[0119] The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of any one of the methods for regulating the performance of the connection interface between nickel-copper solder and diamond are executed.

[0120] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the method embodiment, and will not be repeated in this application. In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0121] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0122] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0123] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a platform server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0124] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for controlling the performance of the connection interface between nickel-copper brazing material and diamond, characterized in that: The method comprises: Based on the preset construction method, corresponding nickel-copper solder crystal models and diamond crystal models are constructed for the target nickel-copper solder and diamond respectively; the target nickel-copper solder has a target atomic ratio and a target applicable model; the nickel-copper solder crystal model and the diamond crystal model have corresponding atoms; Cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, and performing convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface; A clean interface model of nickel-copper solder / diamond is established based on the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface, and a doped interface model of nickel-copper solder / diamond is obtained based on the strong carbon element and the clean interface model of the nickel-copper solder / diamond; the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface have a target fit; The properties corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model are analyzed to obtain analysis results, and based on the analysis results, the nickel-copper solder components in the doped interface model of the nickel-copper solder / diamond are regulated to obtain the regulated nickel-copper solder.

2. The method according to claim 1, characterized in that The step of obtaining the analysis result and adjusting the components of the corresponding nickel-copper solder based on the analysis result to obtain the adjusted nickel-copper solder comprises: Based on the analysis results, the nickel-copper solder / diamond doping interface model is calculated again in multiple calculation dimensions to obtain calculation results; Based on the calculation results, the nickel-copper solder components in the nickel-copper solder / diamond doping interface model are regulated to verify the performance of the regulated nickel-copper solder based on the regulated nickel-copper solder / diamond doping interface model.

3. The method according to claim 2, characterized in that The verification based on the doping interface model of the regulated nickel-copper solder / diamond to verify the performance of the regulated nickel-copper solder includes: Based on the adjusted nickel-copper solder / diamond doping interface model, a nickel-copper-diamond composite coating is prepared according to a preset preparation method, and the corresponding preset verification equipment is called; The nickel-copper-diamond composite coating is subjected to a performance test based on the preset verification equipment to obtain a test result, so as to determine the performance of the regulated nickel-copper solder based on the test result.

4. The method according to claim 1, characterized in that: The doped interface model of nickel-copper solder / diamond is obtained based on the clean interface model of the strong carbon element and the nickel-copper solder / diamond, including: The initial doping interface model is obtained by partially replacing the atoms in the clean interface model of the nickel-copper solder / diamond with the atoms corresponding to the strong carbon element; The initial doping interface model is structurally optimized based on a plurality of interface model structural optimization parameters to obtain the doping interface model.

5. The method according to claim 1, characterized in that The analysis of the properties corresponding to the clean interface model of the nickel-copper solder / diamond and the doped interface model, respectively, to obtain analysis results includes: Based on the performance of the nickel-copper solder / diamond clean interface model and the doped interface model, confirm the analysis dimensions of the nickel-copper solder / diamond clean interface model and the doped interface model; Based on the analysis dimension, the performance of the clean interface model and the doped interface model of the nickel-copper solder / diamond is analyzed to obtain analysis results.

6. The method according to claim 5, characterized in that The analysis dimension includes at least one of the following: interface adhesion work, charge density, differential charge density, state density and Mulliken layout number.

7. The method according to claim 1, characterized in that The method of performing convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface comprises: Conducting convergence tests on the surfaces of the nickel-copper solder crystals and the surfaces of the diamond crystals to obtain test results; the test results include surface energy test results and atomic layer spacing convergence results; Based on the surface energy test results and the atomic layer spacing convergence results, the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface are screened out from multiple nickel-copper solder crystal surfaces and diamond crystal surfaces.

8. A device for controlling the performance of the connection interface between nickel-copper brazing material and diamond, characterized in that: The device comprises: A construction module, for constructing a corresponding nickel-copper solder crystal model and a diamond crystal model for a target nickel-copper solder and a diamond respectively based on a preset construction method; the target nickel-copper solder has a target atomic ratio and a target applicable model; A testing module, used for cutting the nickel-copper solder crystal model and the diamond crystal model respectively to obtain a plurality of corresponding nickel-copper solder crystal surfaces and diamond crystal surfaces, so as to perform convergence tests on the plurality of nickel-copper solder crystal surfaces and diamond crystal surfaces respectively to obtain an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface; Establishing a module for establishing a nickel-copper solder / diamond clean interface model based on an optimal nickel-copper solder crystal surface and an optimal diamond crystal surface, and obtaining a nickel-copper solder / diamond doped interface model based on the nickel-copper solder / diamond clean interface model; the optimal nickel-copper solder crystal surface and the optimal diamond crystal surface have a target fit; A control module is used to obtain analysis results based on the performance analysis of the clean interface model of the nickel-copper solder / diamond and the doped interface model, so as to control the components in the corresponding nickel-copper solder interface model based on the analysis results to obtain the regulated nickel-copper solder.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the method for regulating the connection interface performance of a nickel-copper solder and diamond as described in any one of claims 1 to 7 are performed.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, which, when executed by a processor, executes the steps of a method for regulating the performance of a connection interface between a nickel-copper solder and diamond as described in any one of claims 1 to 7.

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