A wafer bonding force testing method for image sensor manufacturing

Abstract

The present invention relates to the field of wafer testing, and provides a wafer bonding force testing method for image sensor production, including using a bonding force testing device to test a wafer body, wherein the wafer body includes an upper wafer and a lower wafer, the upper wafer is connected to the lower wafer through a bonding interface, and the bonding force testing device includes a bottom plate, a positioning component, a liquid suction component, and a tool component, wherein the positioning component includes a processing table and a fixed plate, the liquid suction component includes a wedge seat, a third elastic member, a guide plate, and two movable cleaning components, and the tool component includes a mounting seat, a cylinder, and a piston rod. The present invention can automatically press and fix the wafer body and release the pressing and fixing, and can automatically insert the tool body into the bonding interface, so that a bonding crack is generated at the bonding interface, thereby improving the testing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to a wafer bonding force testing method for manufacturing an image sensor. Background Art

[0002] Image sensors are usually manufactured using wafers. Image sensors are semiconductor devices that convert light signals into electrical signals.

[0003] In wafer manufacturing, wafer bonding is a process technology used for wafer packaging and substrate manufacturing. It mainly refers to bonding two wafers tightly together through chemical or physical means, and then annealing them to form a chemical bond connection at the interface between the two wafers, thereby forming a device with specific functions and a certain bonding strength.

[0004] A Chinese invention patent with publication number CN112701058B discloses a method for testing wafer bonding force, including the following steps: using a wafer bonding machine to bond wafers to wafers, using an ultrasonic scanning microscope to scan bonding voids on the bonded wafers, subjecting the wafers to high-temperature annealing treatment, using an ultrasonic scanning microscope to scan bonding voids on the annealed wafers again, using a blade-shaped blade to uniformly insert into the wafer bonding interface, waiting for 1 minute, deionized water will enter the cracks between the wafers due to the siphon effect to form a deionized water interface medium, blowing the excess deionized water with a nitrogen gun, placing the wafer in a wafer carrier, and using an ultrasonic scanning microscope to perform a third scan, scanning the shape, size and position of the crack, obtaining the precise length of the crack through the position data provided by the ultrasonic scanning microscope, repeating multi-point testing, substituting the crack length into the formula, calculating the bonding force at that location, and calculating the average value of the multi-point bonding force data.

[0005] However, in the above-mentioned prior art, it is necessary to manually use a blade-shaped blade to uniformly insert into the wafer bonding interface and manually wipe off excess deionized water, which is time-consuming and labor-intensive and reduces test efficiency. Summary of the invention

[0006] In view of the above technical problems, the present invention aims to provide a wafer bonding force testing method for image sensor manufacturing, which is implemented by the following method:

[0007] A wafer bonding force testing method for image sensor manufacturing includes testing a wafer body using a bonding force testing device;

[0008] The wafer body includes an upper wafer and a lower wafer, and the upper wafer is connected to the lower wafer through a bonding interface;

[0009] The bonding force testing device includes a base plate, a positioning assembly, a liquid suction assembly and a tool assembly;

[0010] The positioning assembly includes a processing table and a fixed plate, the processing table is fixedly connected to the top wall of the bottom plate, the fixed plate is fixedly connected to the top wall of the processing table, a motor is fixedly connected to the fixed plate, a rotating shaft is fixedly connected to the motor output shaft, a bevel gear 1 and a spur gear 1 are fixedly connected to the rotating shaft, a rack and a pressure plate are slidably connected to the fixed plate, the rack and the pressure plate are fixed, the rack and the spur gear 1 are meshed, a rotating rod is rotatably connected to the fixed plate, a bevel gear 2 is fixedly connected to the rotating rod, the bevel gear 2 is meshed with the bevel gear 1, a groove is provided on the bottom wall of the rotating rod, an electromagnet is inlaid on the top wall of the groove, an insertion strip is slidably connected to the inner wall of the groove, a permanent magnet 1 is fixedly connected to the upper end of the insertion strip, and the permanent magnet 1 is connected to the top wall of the groove through an elastic member 1;

[0011] The liquid absorption component includes a wedge-shaped seat, a third elastic member, a guide plate and two movable cleaning components, the wedge-shaped seat is slidably connected to the guide plate, the guide plate is fixedly connected to the top wall of the bottom plate, the bottom wall of the wedge-shaped seat is connected to the top wall of the bottom plate through the third elastic member, the movable cleaning component includes a roller body, a support block, a connecting tooth plate, a slide seat, a second elastic member, a connecting block and a second spur gear, the roller body is rotatably connected to the top wall of the support block, the two ends of the wiping belt are respectively wound around the two roller bodies, one of the top walls of the roller bodies is provided with a slot, the support block is fixedly connected to the connecting tooth plate, the connecting tooth plate is slidably connected to the slide seat, the slide seat is slidably connected to the top wall of the wedge-shaped seat, the connecting block is fixedly connected to the top wall of the wedge-shaped seat, the connecting block is connected to the slide seat through the second elastic member, two or more permanent magnets are embedded in the connecting tooth plate, the second spur gear is rotatably connected to the top wall of the wedge-shaped seat, and the two second spur gears are respectively meshed with the two connecting tooth plates;

[0012] The tool assembly includes a mounting seat, a cylinder and a piston rod. The mounting seat is fixedly connected to the piston rod, the piston rod is connected to the cylinder, the cylinder is fixedly connected to the top wall of the base plate, two permanent magnets four are embedded on the mounting seat, a wedge block one and two transmission gear plates are fixedly connected to the mounting seat, and a tool body is fixedly connected to the side wall of the mounting seat.

[0013] Furthermore, the bottom plate is also provided with a solution adding component, which includes a vertical plate, a horizontal plate and a liquid tank, the vertical plate is fixedly connected to the top wall of the bottom plate, the horizontal plate is fixedly connected to the side wall of the vertical plate, the liquid tank is connected to the bottom wall of the horizontal plate, a liquid cavity and a block groove are provided on the liquid tank, the liquid cavity is filled with a solution, the bottom wall of the liquid cavity is connected to the inner wall of the block groove through a second liquid channel, a plug is slidably connected to the inner wall of the liquid cavity, an extension rod is fixedly connected to the bottom wall of the plug, the lower end of the extension rod extends to the bottom of the liquid tank, a wedge block 2 is fixedly connected to the lower end of the extension rod, the wedge block 2 is connected to the bottom wall of the liquid tank through an elastic piece 5, the inner wall of the block groove is slidably connected to a liquid transfer block, a liquid channel 3 is provided on the liquid transfer block, the liquid transfer block is connected to the inner wall of the block groove through an elastic tube, the liquid transfer block is connected to the inner wall of the block groove through an elastic piece 4, and the liquid channel 2 and the liquid channel 3 are respectively connected to the elastic tube;

[0014] The mounting seat is provided with a protruding block, the protruding block is provided with an inclined surface, the protruding block is provided with a liquid guide groove, the liquid guide groove is connected with the outer wall of the mounting seat through liquid channel 1, and the blade body is provided with more than two liquid outlet channels, the liquid outlet channels are connected with the outer wall of the blade body, and the liquid outlet channels are connected with liquid channel 1.

[0015] Furthermore, the liquid tank is slidably connected to the bottom wall of the horizontal plate, a threaded channel is provided on the liquid tank, a threaded rod is rotatably connected to the vertical plate, the threaded rod is threadedly connected in the threaded channel, and a handle is fixedly connected to one end of the threaded rod.

[0016] Furthermore, the handle is provided with concave-convex patterns.

[0017] Furthermore, a cylinder frame is fixedly connected to the top wall of the bottom plate, and the cylinder is fixedly connected to the top wall of the cylinder frame.

[0018] Furthermore, the liquid transfer block is in an L shape.

[0019] Furthermore, a sealing layer is provided on the blocking piece.

[0020] Furthermore, the wiping belt is made of cotton cloth.

[0021] Furthermore, the elastic tube is made of polyethylene.

[0022] Furthermore, the distances between adjacent permanent magnets 2 are equal.

[0023] The present invention has the following beneficial effects:

[0024] The present invention can automatically press and fix the wafer body and release the pressing and fixing, and can automatically insert the knife body into the bonding interface, so as to generate bonding cracks on the bonding interface, thereby improving the testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0026] Figure 1 It is a structural schematic diagram of a wafer bonding force testing method for image sensor manufacturing according to the present invention;

[0027] Figure 2 The present invention Figure 1 Exploded view of the middle mount;

[0028] Figure 3 The present invention Figure 1 Schematic diagram of the structure of the midsole plate;

[0029] Figure 4The present invention Figure 1 Schematic diagram of the structure of the middle wedge seat;

[0030] Figure 5 The present invention Figure 1 The enlarged view of point A in the middle;

[0031] Figure 6 The present invention Figure 1 The enlarged view of point B in the middle;

[0032] Figure 7 The present invention Figure 1 Enlarged view of point C in the middle;

[0033] Figure 8 The present invention Figure 1 Top view of the middle wedge, cylinder, and wafer body.

[0034] Figure numerals: 1, bottom plate; 2, processing table; 3, fixing plate; 4, motor; 5, rotating shaft; 6, bevel gear 1; 7, spur gear 1; 8, rack; 9, pressure plate; 10, bevel gear 2; 11, rotating rod; 12, slot; 13, electromagnet; 14, elastic member 1; 15, permanent magnet 1; 16, insert; 17, roller; 18, wiping belt; 19, supporting block; 20, connecting tooth plate; 21, slot; 22, upper wafer; 23, lower wafer; 24, bonding interface; 25, sliding seat; 26, elastic member 2; 27, connecting block; 28, permanent magnet 2; 29, spur gear 2; 30, transmission tooth plate; 31, mounting seat; 32, permanent magnet 3 ; 33. raised block; 34. cylinder; 35. piston rod; 36. knife body; 37. liquid outlet channel; 38. liquid guide groove; 39. liquid channel one; 40. permanent magnet four; 41. wedge block one; 42. wedge seat; 43. elastic member three; 44. guide plate; 45. cylinder frame; 46. vertical plate; 47. horizontal plate; 48. threaded channel; 49. liquid tank; 50. concave and convex texture; 51. threaded rod; 52. handle; 53. liquid cavity; 54. liquid channel two; 55. block groove; 56. liquid transfer block; 57. liquid channel three; 58. elastic tube; 59. elastic member four; 60. plug; 61. extension rod; 62. wedge block two; 63. elastic member five. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0037] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] like Figure 1-Figure 8 As shown, a wafer bonding force testing method for image sensor manufacturing includes testing a wafer body using a bonding force testing device;

[0039] The wafer body includes an upper wafer 22 and a lower wafer 23, and the upper wafer 22 is connected to the lower wafer 23 via a bonding interface 24;

[0040] The bonding force testing device comprises a base plate 1, a positioning component, a liquid suction component and a tool component;

[0041] The positioning assembly includes a processing table 2 and a fixed plate 3. The processing table 2 is fixedly connected to the top wall of the bottom plate 1, and the fixed plate 3 is fixedly connected to the top wall of the processing table 2. A motor 4 is fixedly connected to the fixed plate 3. A rotating shaft 5 is fixedly connected to the output shaft of the motor 4. A bevel gear 6 and a spur gear 7 are fixedly connected to the rotating shaft 5. The motor 4 is a device that converts electrical energy into mechanical energy. It uses an energized coil to generate a rotating magnetic field and acts on the rotor to form a magneto-electric power rotating torque, so that the output shaft rotates to drive other parts to rotate. A rack 8 and a pressure plate 9 are slidably connected to the fixed plate 3. The rack 8 and the pressure plate 9 are fixedly connected, and the rack 8 and the spur gear 7 are meshed. A rotating rod 11 is connected to the rotating rod 11, and a bevel gear 10 is fixed to the rotating rod 11. The bevel gear 10 is meshed with the bevel gear 16. A groove 12 is provided on the bottom wall of the rotating rod 11. An electromagnet 13 is embedded on the top wall of the groove 12. The electromagnet 13 is a device that generates a magnetic field using electric current. It is composed of one or more coils wound with wires and a ferromagnetic material. When the coil is energized, it will generate a magnetic field, and this magnetic field can attract or repel a permanent magnet 15. An insertion strip 16 is slidably connected to the inner wall of the groove 12. The upper end of the insertion strip 16 is fixedly connected to the permanent magnet 15. The permanent magnet 15 is connected to the top wall of the groove 12 through an elastic member 14.

[0042] The liquid absorption assembly includes a wedge-shaped seat 42, an elastic member 3 43, a guide plate 44 and two movable cleaning assemblies. The wedge-shaped seat 42 is slidably connected to the guide plate 44, and the guide plate 44 is fixed to the top wall of the bottom plate 1. The bottom wall of the wedge-shaped seat 42 is connected to the top wall of the bottom plate 1 through the elastic member 3 43. The movable cleaning assembly includes a roller body 17, a support block 19, a connecting tooth plate 20, a slide seat 25, an elastic member 26, a connecting block 27 and a spur gear 29. The roller body 17 is rotatably connected to the top wall of the support block 19, and the two ends of the wiping belt 18 are respectively wound around the two On the roller body 17, a slot 21 is opened on the top wall of one of the roller bodies 17, the support block 19 is fixedly connected to the connecting tooth plate 20, the connecting tooth plate 20 is slidably connected to the slide seat 25, the slide seat 25 is slidably connected to the top wall of the wedge seat 42, the connecting block 27 is fixedly connected to the top wall of the wedge seat 42, the connecting block 27 is connected to the slide seat 25 through the elastic member 26, more than two permanent magnets 28 are embedded in the connecting tooth plate 20, the spur gear 29 is rotatably connected to the top wall of the wedge seat 42, and the two spur gears 29 are respectively meshed with the two connecting tooth plates 20;

[0043] The tool assembly includes a mounting seat 31, a cylinder 34 and a piston rod 35. The mounting seat 31 is fixedly connected to the piston rod 35, and the piston rod 35 is connected to the cylinder 34. The cylinder 34 uses compressed air to drive the piston to reciprocate in the cylinder, thereby generating power to make the piston rod 35 move linearly. The cylinder 34 is fixedly connected to the top wall of the base plate 1. Two permanent magnets 40 are embedded on the mounting seat 31. A wedge block 41 and two transmission gear plates 30 are fixedly connected to the mounting seat 31. The side wall of the mounting seat 31 is fixedly connected to the tool body 36.

[0044] According to an optional embodiment of the present invention, the bottom plate 1 is further provided with a solution adding component, the solution adding component includes a vertical plate 46, a horizontal plate 47 and a liquid tank 49, the vertical plate 46 is fixedly connected to the top wall of the bottom plate 1, the horizontal plate 47 is fixedly connected to the side wall of the vertical plate 46, the liquid tank 49 is connected to the bottom wall of the horizontal plate 47, and the liquid tank 49 is provided with a liquid cavity 53 and a block groove 55, the liquid cavity 53 is filled with a solution, the bottom wall of the liquid cavity 53 is connected to the inner wall of the block groove 55 through a liquid channel 2 54, the inner wall of the liquid cavity 53 is slidably connected with a plugging piece 60, and the plugging piece 60 is connected to the inner wall of the block groove 55. The bottom wall of the liquid tank 49 is fixedly connected with an extension rod 61, the lower end of the extension rod 61 extends to the bottom of the liquid tank 49, the wedge block 62 is fixedly connected with the lower end of the extension rod 61, the wedge block 62 is connected to the bottom wall of the liquid tank 49 through the elastic member 5 63, the inner wall of the block groove 55 is slidably connected with a liquid transfer block 56, the liquid transfer block 56 is provided with a liquid channel 3 57, the liquid transfer block 56 is connected to the inner wall of the block groove 55 through an elastic tube 58, the liquid transfer block 56 is connected to the inner wall of the block groove 55 through an elastic member 4 59, and the liquid channel 2 54 and the liquid channel 3 57 are respectively connected to the elastic tube 58;

[0045] The mounting seat 31 is provided with a raised block 33, and the raised block 33 is provided with an inclined surface. The inclined surface on the raised block 33 and the wedge block 2 62 are adapted and can transmit to each other. The raised block 33 is provided with a liquid guide groove 38, and the liquid guide groove 38 is connected to the outer wall of the mounting seat 31 through a liquid channel 1 39. The blade body 36 is provided with more than two liquid outlet channels 37, and the liquid outlet channels 37 are connected to the outer wall of the blade body 36, and the liquid outlet channels 37 are connected to a liquid channel 1 39.

[0046] According to an optional embodiment of the present invention, the liquid tank 49 is slidably connected to the bottom wall of the horizontal plate 47, a threaded channel 48 is provided on the liquid tank 49, a threaded rod 51 is rotatably connected to the vertical plate 46, the threaded rod 51 is threadedly connected in the threaded channel 48, and when the threaded rod 51 rotates, the liquid tank 49 can slide horizontally on the horizontal plate 47, and a handle 52 is fixed to one end of the threaded rod 51.

[0047] According to an optional embodiment of the present invention, the handle 52 is provided with a concave-convex pattern 50 , so as to increase the friction between the user's hand and the handle 52 , making it easier for the user to control the rotation of the handle 52 .

[0048] According to an optional implementation of the present invention, a cylinder frame 45 is fixedly connected to the top wall of the base plate 1 , and the cylinder 34 is fixedly connected to the top wall of the cylinder frame 45 .

[0049] According to an optional embodiment of the present invention, the liquid transfer block 56 is L-shaped, so that it is easier to insert into the liquid guide groove 38.

[0050] According to an optional implementation of the present invention, a sealing layer is provided on the blocking piece 60 , and the sealing layer can effectively block the second liquid channel 54 .

[0051] According to an optional embodiment of the present invention, the wiping belt 18 is made of cotton cloth, which has strong liquid absorption and can effectively absorb excess solution.

[0052] According to an optional embodiment of the present invention, the material of the elastic tube 58 includes polyethylene. Polyethylene is a widely used plastic material with good chemical stability and low-temperature toughness. According to different densities, polyethylene can be divided into high-density polyethylene, medium-density polyethylene and low-density polyethylene. Among them, high-density polyethylene is very suitable for use as the material of the elastic tube 58 due to its higher strength and toughness.

[0053] According to an optional implementation of the present invention, the spacings between adjacent permanent magnets 28 are equal.

[0054] Implementation process: Place the wafer body for manufacturing the image sensor on the top wall of the processing table 2, the lower wafer 23 and the top wall of the processing table 2 are against each other, turn on the motor 4, the output shaft of the motor 4 drives the bevel gear 16 and the spur gear 17 to rotate, the spur gear 17 drives the rack 8 and the pressure plate 9 to move downward, so that the pressure plate 9 presses and fixes the upper wafer 22, and the motor 4 stops running. The motor 4 can be set as a brake motor to keep the pressure plate 9 pressing and fixing the upper wafer 22.

[0055] The cylinder 34 is turned on to extend the piston rod 35, and the piston rod 35 drives the mounting seat 31, the transmission gear plate 30, the protruding block 33, the knife body 36, and the permanent magnet 40 to move leftward. The transmission gear plate 30 and the spur gear 29 are meshed to drive the spur gear 29 to rotate, and the spur gear 29 drives the connecting gear plate 20 to move rightward, so that the wiping belt 18 is separated from the bonding interface 24 and moves to the right of the bonding interface 24. The wedge block 1 41 pushes the wedge seat 42 to overcome the elastic force of the elastic member 3 43 and move down along the guide plate 44. The wiping belt 18 moves down to below the bottom wall of the lower wafer 23, so that the knife body 36 can be inserted into the bonding interface 24, and then the knife body 3 6 is inserted into the bonding interface 24 to generate a bonding crack at the bonding interface 24. When the protruding block 33 moves to the left, it will push the wedge block 2 62 to overcome the elastic member 5 63 and move upward, so that the blocking piece 60 moves upward to release the blockage of the liquid channel 2 54. The horizontal section of the liquid transfer block 56 enters the liquid guide groove 38 and abuts against the inner wall of the liquid guide groove 38. The solution in the liquid cavity 53 passes through the liquid channel 2 54, the elastic tube 58, the liquid channel 3 57, the liquid channel 1 39, and the liquid outlet channel 37 to enter the bonding crack. When the protruding block 33 moves to the left, it will push the liquid transfer block 56 to overcome the elastic force of the elastic member 4 59 and move to the left, so that the solution has enough time to flow out into the bonding crack.

[0056] Then the piston rod 35 is retracted, and after the protruding block 33 is separated from the wedge block 2 62, the plug 60 re-blocks the liquid channel 2 54 to prevent the solution from flowing out and causing waste, the wedge block 1 41 is separated from the wedge seat 42, and the wedge seat 42 moves up and resets under the elastic force of the elastic member 3 43, and the wiping belt 18 moves up to the right of the bonding interface 24, and the transmission gear plate 30 drives the spur gear 2 29 to reverse, so that the connecting gear plate 20 moves to the left, and the wiping belt 18 and the bonding interface 24 are against each other, so as to absorb the excess solution. When the permanent magnet 3 32 moves past the permanent magnet 2 28, one of the permanent magnets 3 32 will press the permanent magnet 2 28 on one of the permanent magnets 28. The other permanent magnet three 32 will attract the permanent magnet two 28 on the other permanent magnet two 28. When the permanent magnet three 32 moves between the two permanent magnets two 28, the connecting tooth plate 20 will be reset under the elastic force of the elastic member two 26. Repeating the above principle will cause the two slots 21 to move back and forth, and the wiping belt 18 will also move back and forth, so that the wiping belt 18 will wipe the bonding interface 24 back and forth to absorb excess solution and improve the absorption quality. The permanent magnet three 32 moves to the right of the rightmost permanent magnet two 28 and then stops moving. The two slots 21 stop moving and reset, and the spur gear two 29 resets to below the insert 16.

[0057] The data of bonding cracks on the wafer body are measured and recorded using existing measuring equipment, so as to calculate the bonding force of the wafer body using existing technology.

[0058] Finally, the electromagnet 13 and the motor 4 are started to generate magnetic repulsion to the permanent magnet 15. The permanent magnet 15 and the insert 16 overcome the elastic force of the elastic member 14 and move downward. The insert 16 and the top wall of the roller 17 are against each other. The piston rod 35 is reversed, and the pressure plate 9 moves upward to release the pressing and fixing of the wafer body. The rotating rod 11 drives the insert 16 to rotate. After the insert 16 rotates to align with the slot 21, the insert 16 is inserted into the slot 21 under the elastic force of the elastic member 14, thereby driving one of the rollers 17 to rotate. One of the rollers 17 receives the wiping tape 18, and the other roller 17 releases the wiping tape 18, so that the wetted part of the wiping tape 18 leaves the bonding interface 24, and the clean part of the wiping tape 18 is against the bonding interface 24, so that the subsequent wiping tape 18 absorbs the excess solution on the other wafer body, moves the wafer body away from the processing table 2, and uses the same principle to test the bonding force of other wafer bodies.

[0059] The depth of insertion of the blade body 36 into the bonding interface 24 can be controlled by controlling the extension degree of the piston rod 35. The user can turn the handle 52 to rotate the threaded rod 51 in the threaded channel 48, thereby adjusting the horizontal position of the liquid tank 49 to facilitate adjusting the depth to which the blade body 36 is inserted into the bonding interface 24 at which the liquid tank 49 starts to supply liquid.

[0060] The present invention can automatically press and fix the wafer body and release the press and fixation, can automatically insert the knife body 36 into the bonding interface 24, so as to generate a bonding crack on the bonding interface 24, and automatically inject a proper amount of solution into the bonding crack, and then automatically use the wiping tape 18 to absorb the excess solution, so that the existing measuring equipment can accurately measure the data of the bonding crack on the wafer body, calculate the wafer bonding force, and improve the test efficiency. It can also automatically replace the clean part of the wiping tape 18 with the bonding interface 24.

[0061] The components, modules, mechanisms and devices not described in detail in the present invention are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A wafer bonding force testing method for image sensor manufacturing, characterized in that: Including testing the wafer body using bonding force testing equipment; The wafer body comprises an upper wafer (22) and a lower wafer (23), and the upper wafer (22) is connected to the lower wafer (23) via a bonding interface (24); The bonding force testing device comprises a base plate (1), a positioning component, a liquid suction component and a tool component; The positioning assembly comprises a processing table (2) and a fixing plate (3), the processing table (2) being fixedly connected to the top wall of the bottom plate (1), the fixing plate (3) being fixedly connected to the top wall of the processing table (2), a motor (4) being fixedly connected to the fixing plate (3), a rotating shaft (5) being fixedly connected to the output shaft of the motor (4), a bevel gear (6) and a spur gear (7) being fixedly connected to the rotating shaft (5), a rack (8) and a pressure plate (9) being slidably connected to the fixing plate (3), the rack (8) and the pressure plate (9) being fixedly connected, the rack (8) and the spur gear (7) being fixedly connected. The fixed plate (3) is rotatably connected to a rotating rod (11), a second bevel gear (10) is fixedly connected to the rotating rod (11), the second bevel gear (10) and the first bevel gear (6) are meshed, a groove (12) is provided on the bottom wall of the rotating rod (11), an electromagnet (13) is embedded in the top wall of the groove (12), an insertion strip (16) is slidably connected to the inner wall of the groove (12), a permanent magnet (15) is fixedly connected to the upper end of the insertion strip (16), and the permanent magnet (15) is connected to the top wall of the groove (12) through an elastic member (14); The liquid absorption component comprises a wedge-shaped seat (42), a third elastic member (43), a guide plate (44) and two movable cleaning components. The wedge-shaped seat (42) is slidably connected to the guide plate (44), the guide plate (44) is fixed to the top wall of the bottom plate (1), the bottom wall of the wedge-shaped seat (42) is connected to the top wall of the bottom plate (1) through the third elastic member (43), the movable cleaning component comprises a roller body (17), a support block (19), a connecting tooth plate (20), a slide seat (25), a second elastic member (26), a connecting block (27) and a second spur gear (29), the roller body (17) is rotatably connected to the top wall of the support block (19), and the two ends of the wiping belt (18) are respectively wound around the two guide plates. On the roller body (17), a slot (21) is provided on the top wall of one of the roller bodies (17), the support block (19) is fixedly connected to the connecting tooth plate (20), the connecting tooth plate (20) is slidably connected to the slide seat (25), the slide seat (25) is slidably connected to the top wall of the wedge-shaped seat (42), the connecting block (27) is fixedly connected to the top wall of the wedge-shaped seat (42), the connecting block (27) is connected to the slide seat (25) through the elastic member (26), two or more permanent magnets (28) are embedded in the connecting tooth plate (20), the spur gear (29) is rotatably connected to the top wall of the wedge-shaped seat (42), and the two spur gears (29) are respectively meshed with the two connecting tooth plates (20); The tool assembly comprises a mounting seat (31), a cylinder (34) and a piston rod (35); the mounting seat (31) is fixedly connected to the piston rod (35); the piston rod (35) is connected to the cylinder (34); the cylinder (34) is fixedly connected to the top wall of the base plate (1); two permanent magnets (40) are embedded on the mounting seat (31); a wedge block (41) and two transmission gear plates (30) are fixedly connected to the mounting seat (31); and a tool body (36) is fixedly connected to the side wall of the mounting seat (31).

2. The wafer bonding force testing method for image sensor manufacturing according to claim 1, characterized in that: The bottom plate (1) is also provided with a solution adding assembly, which comprises a vertical plate (46), a horizontal plate (47) and a liquid box (49), wherein the vertical plate (46) is fixedly connected to the top wall of the bottom plate (1), the horizontal plate (47) is fixedly connected to the side wall of the vertical plate (46), and the liquid box (49) is connected to the bottom wall of the horizontal plate (47). The liquid box (49) is provided with a liquid cavity (53) and a block groove (55), wherein the liquid cavity (53) is filled with a solution, the bottom wall of the liquid cavity (53) is connected to the inner wall of the block groove (55) via a second liquid channel (54), a blocking piece (60) is slidably connected to the inner wall of the liquid cavity (53), and an extension rod is fixedly connected to the bottom wall of the blocking piece (60) (61), the lower end of the extension rod (61) extends to the bottom of the liquid tank (49), the wedge block 2 (62) is fixedly connected to the lower end of the extension rod (61), the wedge block 2 (62) is connected to the bottom wall of the liquid tank (49) through the elastic member 5 (63), the inner wall of the block groove (55) is slidably connected with a liquid transfer block (56), the liquid transfer block (56) is provided with a liquid channel 3 (57), the liquid transfer block (56) is connected to the inner wall of the block groove (55) through an elastic tube (58), the liquid transfer block (56) is connected to the inner wall of the block groove (55) through an elastic member 4 (59), and the liquid channel 2 (54) and the liquid channel 3 (57) are respectively connected to the elastic tube (58); The mounting seat (31) is provided with a protruding block (33), the protruding block (33) is provided with an inclined surface, the protruding block (33) is provided with a liquid guide groove (38), the liquid guide groove (38) is connected to the outer wall of the mounting seat (31) through a liquid channel 1 (39), and the blade body (36) is provided with more than two liquid outlet channels (37), the liquid outlet channels (37) are connected to the outer wall of the blade body (36), and the liquid outlet channels (37) are connected to liquid channel 1 (39).

3. The wafer bonding force testing method for image sensor manufacturing according to claim 2 is characterized in that: The liquid box (49) is slidably connected to the bottom wall of the horizontal plate (47), a threaded channel (48) is provided on the liquid box (49), a threaded rod (51) is rotatably connected to the vertical plate (46), the threaded rod (51) is threadedly connected in the threaded channel (48), and a handle (52) is fixedly connected to one end of the threaded rod (51).

4. The wafer bonding force testing method for image sensor manufacturing according to claim 3 is characterized in that: The handle (52) is provided with concave-convex patterns (50).

5. The wafer bonding force testing method for image sensor manufacturing according to claim 4 is characterized in that: The top wall of the bottom plate (1) is fixedly connected to a cylinder frame (45), and the cylinder (34) is fixedly connected to the top wall of the cylinder frame (45).

6. The wafer bonding force testing method for image sensor manufacturing according to claim 5 is characterized in that: The liquid transfer block (56) is in an L shape.

7. The wafer bonding force testing method for image sensor manufacturing according to claim 6, characterized in that: A sealing layer is provided on the blocking piece (60).

8. The wafer bonding force testing method for image sensor manufacturing according to claim 7, characterized in that: The material of the wiping belt (18) includes cotton cloth.

9. The wafer bonding force testing method for image sensor manufacturing according to claim 8, characterized in that: The material of the elastic tube (58) includes polyethylene.

10. The wafer bonding force testing method for image sensor manufacturing according to claim 9, characterized in that: The spacing between adjacent permanent magnets 2 (28) is equal.

Images