Non-contact cleaning module

Abstract

A cleaning module for cleaning a wafer includes a wafer clamp configured to support a wafer in a vertical orientation and includes a access cup and a clamp assembly. The access cup includes a wall having an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer clamp. The clamp assembly includes a first plate assembly, a second plate assembly, a plurality of clamp pins, and a plurality of load pins. The clamp pins are configured to clamp the wafer during a cleaning process, and the load pins are configured to clamp the wafer during a loading and unloading process. The cleaning module further includes a purge arm coupled to a nozzle mechanism configured to deliver a liquid to a front side and a back side of the wafer.

Description

[0001] This application is a divisional application of the patent application with application number "201980050797.7" and titled "Non-contact cleaning module" and filed on August 5, 2019. TECHNICAL FIELD

[0002] Embodiments of the present disclosure generally relate to apparatuses and methods for cleaning a processed wafer, and more particularly, to a non-contact cleaning system and a method for processing a wafer. BACKGROUND

[0003] In various instances, a wafer is cleaned to remove any contamination from the wafer prior to processing the wafer for electrical devices. In one or more embodiments, cleaning methods such as chemical buffing and / or brush scrubbing can be used to clean the wafer. However, these cleaning methods can cause particles to re-attach to the wafer after the corresponding cleaning process. For example, the contact media (e.g., buffing balls and / or cleaning brushes) used for these cleaning processes can be a source of contamination. The particles can cause the wafer to be unable to support processing including analog, logic, and / or advanced memory applications. As a result, the yield of the processed wafer will be negatively impacted.

[0004] Accordingly, there is a need for improved cleaning processes that can be used to remove particles from a cleaned wafer prior to the wafer undergoing further processing. SUMMARY

[0005] In one example, a cleaning module includes a wafer chucking device. The wafer chucking device is configured to support a wafer in a vertical orientation and includes a retrieval cup and a chuck assembly. The retrieval cup includes a wall having an annular inner surface. The annular inner surface defines a processing region and has an angled portion that is symmetric about a central axis of the wafer chucking device. The chuck assembly includes a first plate assembly, a second plate assembly, a chuck pin, and a load pin. The chuck pin belongs to the second plate assembly and the load pin belongs to the first plate assembly. The chuck assembly is configured to be positioned in a loading position, a rinsing position, and a cleaning position. When in the cleaning position, the chuck assembly is disposed within the processing region. Additionally, when the chuck assembly is in the loading position, the chuck pin is a first distance from a center of the chuck assembly, and when the chuck assembly is in the cleaning position, the chuck pin is a second distance from the central axis of the wafer chucking device. The first distance is greater than the second distance. Moreover, the load pin is each a third distance from the central axis when the chuck assembly is in the loading position and the cleaning position.

[0006] In one example, a method for cleaning a wafer in a cleaning module including a wafer chucking device includes moving a first plate assembly of a chuck assembly away from a second plate assembly of the chucking device and toward an annular inner surface of a retrieval cup of the wafer chucking device to position the chuck assembly in a loading position. A wafer is received in a vertical orientation by a plurality of loading pins of the first plate assembly. Additionally, moving the first plate assembly away from the second plate assembly positions a plurality of chucking pins of the second plate assembly at a first distance from a central axis of the wafer chucking device. Moreover, the annular inner surface has an angled portion that is symmetric about the central axis, and the annular inner surface defines a processing region. The method further includes moving the first plate assembly toward the second plate assembly and away from the annular inner surface to position the chuck assembly in a cleaning position. Additionally, the plurality of chucking pins are positioned at a second distance from the central axis, and the wafer is chucked in response to moving the first plate assembly of the chuck assembly toward the second plate assembly. The first distance is greater than the second distance. Moreover, the method includes rotating the chuck assembly, the retrieval cup, and the wafer simultaneously during a cleaning process. BRIEF DESCRIPTION OF DRAWINGS

[0007] For a more complete understanding of the above-described features of the present disclosure, reference is made to the more particular description of the disclosure that follows, taken in conjunction with the accompanying drawings. It is noted that the drawings merely represent typical embodiments of the disclosure and therefore are not to be considered limiting of its scope, as the disclosure can admit to other equally effective embodiments.

[0008] Figure 1 A schematic top view of a chemical mechanical polishing system is shown in accordance with one or more embodiments.

[0009] Figure 2A is a schematic cross-sectional side view of a cleaning module in accordance with one or more embodiments.

[0010] Figure 2B A schematic view of a cleaning module is shown in accordance with one or more embodiments.

[0011] Figure 3A and Figure 3B is a schematic cross-sectional side view of a wafer chucking device in accordance with one or more embodiments.

[0012] Figure 3C , Figure 3D , and Figure 3E Various views of a chuck assembly are shown in accordance with one or more embodiments.

[0013] Figure 3F and Figure 3G Various views of a chuck assembly are shown in accordance with one or more embodiments.

[0014] Figure 4A ,Figure 4B Figure 5 Various nozzle mechanisms are shown in accordance with one or more embodiments.

[0015] Figure 6 A schematic view of a purge arm is shown in accordance with one or more embodiments.

[0016] Figure 7A Airflow within a cleaning module is shown in accordance with one or more embodiments.

[0017] Figure 7B A partial schematic view of a drain is shown in accordance with one or more embodiments.

[0018] Figure 8 A method for cleaning a wafer is shown in accordance with one or more embodiments.

[0019] Figure 9A Figure 9B Figure 9C Figure 9D Various examples of wafer holder devices are shown in accordance with one or more embodiments.

[0020] Figure 10 is a schematic cross-sectional side view of a cleaning module in accordance with one or more embodiments.

[0021] Figure 11 is a schematic cross-sectional side view of a wafer holder device in accordance with one or more embodiments.

[0022] Figure 12A Figure 12B Various views of a holder assembly are shown in accordance with one or more embodiments.

[0023] Figure 13 A method for cleaning a wafer is shown in accordance with one or more embodiments.

[0024] Figure 14A Figure 14B Figure 14C Various examples of wafer holder devices are shown in accordance with one or more embodiments.

[0025] For ease of understanding, the same reference numbers have been used, where possible, to designate identical components that are common to the figures. It can be contemplated that components disclosed in one embodiment can be advantageously employed in other embodiments without specific recitation thereof. DETAILED DESCRIPTION

[0026] ​​​​​​​Embodiments of the present disclosure generally relate to an improved cleaning system and method for removing particles from a processed wafer. In various instances, wafer cleaning is performed through chemical polishing and / or brush scrubbing. However, in such instances, the wafer can undergo re-attachment of particles after either of the chemical polishing and / or brush scrubbing processes. Although the particles re-attached to the wafer can be loosely attached to the wafer and have a relatively small size (e.g., about 50 nm or less), the particles can cause the wafer to be unable to be fabricated into front-end logic and advanced memory devices due to defects created with devices formed on the wafer. As a result, the yield of the processed wafer will be negatively impacted. Accordingly, there is a need for a new cleaning method that is capable of removing the re-attached particles. For example, the following description describes a system and method for a non-contact cleaning method that can be used after a chemical polishing and / or brush scrubbing cleaning process to remove any remaining particles on the wafer.

[0027] Figure 1 is a top plan view illustrating one embodiment of a chemical mechanical planarization ("CMP") system 100. The CMP system 100 includes a factory interface 102, a cleaner 104, and a polishing module 106. A robot 111 is provided to transfer wafers 151 between the factory interface 102 and the polishing module 106. The robot 111 can also be configured to transfer wafers between the polishing module 106 and the cleaner 104. The factory interface 102 includes a robot 110 configured to transfer wafers (e.g., wafers 151) between one or more cassettes 114 and one or more transfer platforms 116. The robot 110 is additionally configured to receive wafers from the cleaner 104 and return cleaned polished wafers to a storage cassette 114.

[0028] The polishing system 100 includes a polishing module 106 that at least partially supports and houses a plurality of polishing stations 124a-124d and load cups 123a-123b. Each polishing station 124 is adapted to polish a substrate retained in a carrier head configured to carry a wafer 151 within a carrier head assembly that translates along an overhead track 128. The carrier head assembly 119 is moved along the track 128 by a carrier motor attached to a gantry 108. The gantry 108 generally includes a structural assembly capable of guiding and facilitating control of the position of the carrier head assembly 119 along the overhead track 128. Additionally, the polishing module 106 also includes a load station 122 for loading and unloading substrates from the carrier head. Each polishing station 124 includes a platen 120 that rotates during wafer polishing. Furthermore, each polishing station 124 polishes a wafer (e.g., wafer 151) with a pad and a polishing liquid.

[0029] A controller 190, such as a programmable computer, is connected to the components of the polishing module 106 and is configured to operate the components of the polishing module 106. For example, the controller 190 can control loading, unloading, and polishing of the wafer 151 by the polishing module 106.

[0030] The controller 190 can include a central processing unit (CPU) 192, memory 194, and support circuits 196 (e.g., input / output circuits), a power supply, clock circuits, cache, etc. The memory 194 is connected to the CPU 192. The memory is a non-transitory computer-readable medium and can be one or more readily available memory such as random access memory (RAM), read-only memory (ROM), floppy disks, hard disks, or other forms of digital storage. In addition, although shown as a single computer, the controller 190 can be a distributed system, e.g., including multiple independently operating processors and memories. This architecture can be adapted for various polishing situations based on the programming of the controller 190 to control the sequence and timing of the positioning of the carrier head at the polishing stations.

[0031] The polishing system 100 further includes at least one of the following: an ultrasonic cleaning module 161, a pre-clean module 162, a brush box cleaning module 164, a final cleaning module 166, and a drying bin 168. In addition, Figure 1 An input handling shuttle module can be included. In one embodiment, the ultrasonic cleaning module 161, the pre-clean module 162, the brush box cleaning module 164, the final cleaning module 166, and the drying bin 168 each include a pair of processing chambers positioned side-by-side in the Y direction. The two final cleaning modules 166 each include a cleaning module as described in greater detail herein. As shown, the cleaning modules 166 can be used as the last cleaning step, e.g., a final cleaning module. In other embodiments, one or more cleaning modules can be positioned between the cleaning modules 166 and the drying bin 168. In addition, in one or more embodiments, one or more modules can be omitted.

[0032] Figure 2Ais a schematic illustration of a cross-sectional view of a non-contact cleaning module 200 according to one or more embodiments. The cleaning module 200 can receive a wafer to be cleaned, e.g., wafer 151, after the wafer is cleaned in one or more of the ultrasonic cleaning module 161, the pre-clean module 162, the brush box cleaning module 164, and before the wafer is placed in a corresponding Marangoni drying tub, e.g., drying tub 168. Additionally, in various embodiments, the cleaning module 200 can be placed anywhere within a wafer cleaning cycle and / or an edge / bevel cleaning process. The cleaning module 200 can be used to remove contamination from a wafer that, if not removed, can cause the corresponding wafer to not meet quality standards and be discarded.

[0033] The cleaning module 200 includes a wafer clamp 203, a blow arm 230, a nozzle mechanism 240, a plenum 280, a drain 260, a spray bar 290, a drain 284, and an air inlet 270. The cleaning module 200 can further include a sensing device 294.

[0034] The wafer clamp 203 is configured to support, e.g., hold, the wafer 151 in a vertical orientation. For example, the wafer clamp 203 is configured to support the wafer 151 in a vertical orientation that is perpendicular to the rotational axis 216. The wafer clamp includes a catch cup 210 and a clamp assembly 220. The catch cup 210 can include a first catch cup 211 and a second catch cup 212. The first catch cup 211 can be coupled to the second catch cup 212. For example, the first catch cup 211 can be coupled to the second catch cup 212 via one or more screws. One or more of the first catch cup 211 and the second catch cup 212 can include one or more threaded portions configured to receive a threaded screw. Alternatively, the catch cup 210 includes a single catch cup. For example, the catch cup 210 can be formed from a single continuous piece of material.

[0035] The catch cup 210 includes a wall 213 having an annular inner surface 214. The annular inner surface 214 defines a process volume 297 within the wafer clamp 203. The annular inner surface 214 has an angled portion that is symmetric about a central axis of the wafer clamp 203. For example, the wafer 151 can be cleaned within the process volume 297. Additionally, the annular inner surface 214 has an angled portion that is symmetric about the rotational axis 216.

[0036] The clamp assembly 220 holds the wafer 151 while cleaning fluid is applied to the wafer 151 for cleaning. The clamp assembly 220 is described in more detail with respect to Figure 3A and corresponding illustrations.

[0037] The cleaning fluid can be applied to the front side of the wafer through the nozzle mechanism 240 and to the back side of the wafer via openings 225 formed in a shaft 224 coupled to the fluid source 223 while the chuck assembly 220 and the access cup 210 are rotating. The shaft 224 can include one or more tubes configured to deliver the cleaning fluid to the wafer 151.

[0038] The drive motor 222 can be coupled to the chuck assembly 220 via the shaft 224. The drive motor 222 rotates the chuck assembly 220 and the access cup 210 about the rotational axis 216. Additionally, the drive motor 222 can impart horizontal movement of the chuck assembly 220 along the rotational axis 216. The drive motor 222 can include a first motor configured to control rotation of the chuck assembly 220 and the access cup 210 and a second motor configured to control horizontal movement of the chuck assembly 220. The first motor can be referred to as a rotational motor and the second motor can be referred to as a linear actuator. Additionally, the second motor can be one of a hydraulic, pneumatic, electromechanical, and magnetic motor. The horizontal movement is generally movement in an axial direction or movement in a direction parallel to the rotational axis 216. In one embodiment, the horizontal movement corresponds to movement in the X direction as indicated. Additionally, the horizontal movement of the chuck assembly 220 can be independent of movement of the access cup 210. Furthermore, the chuck assembly 220 and the access cup 210 can be configured to rotate together (e.g., simultaneously). Figure 3A

[0039] As discussed further below, the purge arm drive motor 234 can be coupled to a purge arm shaft and configured to move the purge arm 230 in an arcuate path that is parallel to the surface of the wafer 151. The purge arm 230 can include one or more tubes to deliver fluid to the nozzle mechanism 240.

[0040] The lid 202 can cover an opening formed in a wall (e.g., housing wall) 283 and provide access to an interior volume 295 of the cleaning module 200 for inserting and removing the wafer 151 from the cleaning module 200. When the lid 202 is in the closed position, the interior volume 295 of the cleaning module 200 can be referred to as an isolated environment. For example, when the lid 202 is closed, the interior volume 295 of the cleaning module 200 is isolated from the outside environment such that the mist and liquid generated and / or used during cleaning of the wafer 151 does not escape from the cleaning module 200 during the cleaning process. Any mist and cleaning liquid used and / or generated during the cleaning process is removed from the cleaning module 200 in a controlled manner via the exhaust 260 and / or the drain 284.

[0041] ​The spray bar 290 can apply a pre-treatment fluid to the wafer 151 as the wafer 151 is inserted into the cleaning module 200 and / or rinse the wafer 151 with a rinse fluid as the wafer 151 is removed from the cleaning module 200. In one embodiment, the spray bar 290 can be used to apply a fluid to the wafer 151 during the time the wafer 151 is in the load or unload position. Pre-treating and / or rinsing the wafer 151 can assist in removing undesirable particles from the surface of the wafer 151. For example, rinsing the wafer 151 as it is removed from the cleaning module 200 assists in removing loose particles from the surface of the wafer 151 and further assists in preventing removed particles from re-attaching to the surface of the wafer 151.

[0042] The drain 284 can be used to remove excess moisture from the cleaning module 200. In one embodiment, the drain 284 removes excess cleaning fluid from the cleaning module 200 during a cleaning process.

[0043] Air can be provided to the plenum 280 through the air inlet 270 and exhausted from the cleaning module 200 through the exhaust 260. The air inlet 270 and the plenum 280 are located on the front of the cleaning module 200 and the exhaust 260 is located on the back of the cleaning module 200. Additionally, the plenum 280 and the exhaust 260 can be used to control the flow of air within the cleaning module 200 to prevent particles from re-attaching to the surface of the wafer 151. The locations of the exhaust 260 and the air inlet 270 can be reversed such that the exhaust 260 is located on the front of the cleaning module 200 and the air inlet 270 is located on the back of the cleaning module 200.

[0044] An interior volume 295 of the cleaning module 200 can be defined between the access cup 210 and a wall (e.g., a housing wall) 283. A wafer (e.g., the wafer 151) can be inserted into the interior volume 295 when loaded into the cleaning module 200 and removed from the interior volume 295 when removed from the cleaning module 200.

[0045] The sensing device 294 can detect the wafer 151 within the cleaning module 200. For example, the sensing device 294 can detect the wafer 151 within the interior volume 295. Additionally, the sensing device 294 can detect the wafer 151 while the wafer 151 is being held by the chuck assembly 220. The sensing device 294 can detect when the wafer 151 is properly or improperly loaded into the chuck assembly 220. Additionally, the sensing device 294 can detect when the wafer 151 falls or drops from the chuck assembly 220. The sensing device 294 can further determine when the wafer 151 is inserted into the cleaning module 200 and removed from the cleaning module 200.

[0046] In one or more embodiments, the controller 190 can control the functions of the cleaning module 200. For example, the controller 190 can control the functions of at least the gripper assembly 220, the spray bar 290, the purge arm 230, the nozzle mechanism 240, the drain 260, and / or the sensing device 294.

[0047] Figure 2B An external view of two cleaning modules (e.g., cleaning modules 200 and 201) is shown. In some embodiments, as shown, the cleaning module 201 includes the same components as the cleaning module 200. Figure 2A to Figure 2B

[0048] A cleaner (e.g., cleaner 104) can include one or more cleaning modules (e.g., one or more of cleaning modules 200 and 201). For example, the cleaner 104 can include the cleaning module 200, and the cleaning module 201 can be omitted. Alternatively, the cleaner 104 can include both cleaning modules 200 and 201. Additionally, the cleaner 104 can include more than two cleaning modules.

[0049] The cleaning modules 200 and 201 can include one or more inlet connections 292. The inlet connections 292 provide a path for providing cleaning fluid within the cleaning modules 200 and 201 during a cleaning process. Cleaning fluid can be provided to the nozzle mechanism 240, a tube on the purge arm next to the nozzle mechanism 240, the fluid source 223, and / or the spray bar 290. Additionally, the cleaning modules 200 and 201 can include a power cable connection 293 configured to couple to a power cable external to the cleaning modules 200 and 201.

[0050] Figure 2B Additionally, the lids 202 and 204 of the cleaning modules 200 and 201 are shown. During a wafer loading process, the lids 202 and 204 are opened so that a wafer (e.g., wafer 151) can be inserted into each of the respective cleaning modules 200, 201. Additionally, during a wafer extraction process, the lids 202 and 204 are opened so that a wafer (e.g., wafer 151) can be extracted from each of the respective cleaning modules 200, 201. In one or more embodiments, the lids 202 and 204 are closed during a cleaning cycle, thereby sealing the cleaning modules 200 and 201.

[0051] In Figure 2B embodiments, the cleaning modules 200 and 201 are positioned so that the wafer 151 can be in a vertical orientation during a cleaning process. However, in other embodiments, other orientations can be used. Additionally, each of the cleaning modules 200 and 201 can be configured to operate as a single module as designated by the cleaner (104) architecture.

[0052] Figure 3A ​An example embodiment of a wafer clamp 203 is shown. As shown, the wafer clamp 203 includes a clamp assembly 220 and a retrieval cup 210, which is shown in Figure 2A During at least a cleaning cycle, the clamp assembly 220 is positioned within the processing volume 297.

[0053] The clamp assembly 220 includes a first plate assembly 318, a second plate assembly 320, a load pin 311, and clamp pins 315. The clamp assembly 220 is coupled to a shaft 224, which can be driven by a drive motor 222 to rotate the first plate assembly 318 and the second plate assembly 320 during a cleaning cycle of a cleaning process. Additionally, the shaft 224 can be driven to move the first plate assembly 318 and the second plate assembly 320 into and out of a load position, an unload position, a rinse position, and a cleaning position. Additionally, a cleaning fluid can flow through the shaft 224 such that the cleaning fluid can be applied to the backside of the wafer 151 via holes 351 in the first plate assembly 318 during the cleaning process. In one embodiment, the shaft 224 can be a spline shaft that allows the clamp assembly 220 to rotate as the shaft 224 translates in the +X and -X directions.

[0054] The clamp pins 315 can clamp, or hold, the wafer 151 during the cleaning process. The clamp pins 315 can include shaped regions configured to receive the wafer 151. For example, the clamp pins 315 can include notched regions shaped to receive edges of the wafer 151. Additionally, the clamp pins 315 can be housed within the second plate assembly 320. Further or alternatively, the clamp pins 315 can be coupled to the second plate assembly 320. The clamp pins 315 can be disposed approximately 120° from each other. Alternatively, the clamp pins 315 can be oriented less than 120° from each other, or greater than 120° from each other. Additionally, the total number of clamp pins 315 can be one or more. Alternatively, the total number of clamp pins 315 is two or more. Additionally, the total number of clamp pins 315 is three or more. The clamp pins 315 can pass through openings in the first plate assembly 318, which enables the clamp pins 315 to clamp or hold the wafer 151 during the cleaning cycle. The clamp pins 315 can have minimal contact with the wafer 151 along the edges of the wafer 151 such that the clamp pins 315 do not hinder the cleaning process of the wafer 151.

[0055] The load pins 311 can hold or secure the wafer 151 during a loading and / or unloading process. Additionally, the load pins 311 are coupled to the first plate assembly 318. As the holder assembly 220 moves between the cleaning position and the loading or unloading position, the load pins 311 move with the first plate assembly 318. The load pins 311 can include shaped regions configured to receive the wafer 151. For example, the load pins 311 can include notched regions shaped to receive the edges of the wafer 151. The load pins 311 can be configured to have minimal contact with the wafer 151 along the edges of the wafer 151 such that the load pins 311 do not hinder the cleaning process of the wafer 151. The load pins 311 can be disposed approximately 120° from each other. Alternatively, the load pins 311 can be oriented less than 120° from each other or greater than 120° from each other. Additionally, the total number of load pins 311 can be one or more, two or more, or three or more.

[0056] The number of hold pins 315 can be the same as the number of load pins 311. Alternatively, the number of hold pins 315 can exceed the number of load pins 311. Additionally, the number of hold pins 315 can be less than the number of load pins 311.

[0057] The first plate assembly 318 and the load pins 311 can be used during a wafer loading process. Additionally, the second plate assembly 320 and the hold pins 315 can be positioned such that there is no interference with the wafer during the loading process. For example, the first plate assembly 318 can be moved relative to the second plate assembly 320 to position the first plate assembly 318 outside of the first access cup 211 and to position the hold pins 315 in the loading position. Additionally, the distance between the hold pins 315 and the center of the holder assembly 220 is increased. Furthermore, the hold pins 315 can be positioned behind the load pins 311 to provide an unobstructed path for vertically loading and / or unloading the wafer 151 onto the load pins 311.

[0058] The wall 213 of the access cup 210 is shaped such that the wall interacts with the second plate assembly 320 and / or the one or more hold pins 315. The wall 213 can be part of the access cup 210 as described above, or the annular wall can be part of the first access cup 211. The wall 213 includes at least one angled portion such that the wall can interact with the feature 312 of the second plate assembly 320. Additionally, the wall 213 assists in directing moisture away from the wafer 151 and into the drain 284, thereby reducing the re-attachment of particles on the wafer 151 during the cleaning process. For example, as will be described in more detail later, the feature 312 interacts with the wall 213 to allow the first plate assembly 318 to move relative to the second plate assembly 320 when the holder assembly 220 is in the wafer loading position.

[0059] Additionally, the access cup 210 can include an opening 221. The diameter of the opening 221 can be sufficient to allow the first plate assembly 318 to pass through, but not large enough to allow the second plate assembly 320 to pass through. For example, the diameter of the opening 221 can be larger than the first plate assembly 318 and smaller than the second plate assembly 320.

[0060] The access cup 210 can include drain holes 262 positioned in an array along the edge of the access cup 210 such that water is drained into the drain 284 as the wafer 151, the chuck assembly 220, and the access cup 210 are rotated by the drive motor 222. Additionally, the second access cup 212 can include drain holes 262. Water is drained through the drain holes 370 into the drain 284 Figure 2A ) where the water is removed from the cleaning module 200.

[0061] As shown in Figure 3A , the chuck assembly 220 includes a first plate assembly 318 and a second plate assembly 320 configured to move relative to one another to assist in receiving the wafer 151 and placing the wafer 151 in a cleaning position. Specifically, Figure 3C and Figure 3D show embodiments of the chuck assembly 220 in a retracted position (e.g., cleaning position) 300a and an extended position 300b, respectively. The chuck assembly 220 can be positioned in the retracted position 300a during a cleaning process. Additionally, the chuck assembly 220 can be positioned in the extended position (e.g., loading position) 300b during a wafer loading process and / or a wafer removal (unloading) process. Additionally, the extended position 300b can correspond to a loading position of the chuck assembly 220 within the cleaning module 200. The loading / unloading position also serves as a rinse position for the wafer 151. For example, when positioned in the loading / unloading position for rinsing, deionized water and / or other cleaning chemicals can be delivered from the overhead shower 290 onto the wafer 151. Further, when the chuck assembly 220 is in the loading position, the chuck assembly 220 is positioned a distance in the X direction from where the chuck assembly 220 is positioned in the cleaning position. In one embodiment, the coupling surface 301 of the first plate assembly 318 is coupled to and driven by the shaft 224.

[0062] One or more spring mechanisms 330 can couple the first plate assembly 318 to the second plate assembly 320. The spring mechanisms 330 can include springs 331 and coupling members 333. The spring mechanisms 330 allow the first plate assembly 318 to move relative to the second plate assembly 320 when the feature (or assembly) 312 contacts the first access cup 211. For example, the second plate assembly 320 includes a feature 312 that is configured to interact with the wall 213 as the gripper assembly 220 moves in the +X direction (e.g., horizontally toward the first access cup 211). In one embodiment, each spring mechanism 330 can include one or more springs 331 that can move over or parallel to the coupling member 333.

[0063] The gripper pins 315 can be configured to move relative to at least one other pin. For example, the gripper pins 315 can include one or more assemblies that move the gripper pins 315 away from one or more other pins. The gripper pins 315 can be configured to grip a wafer (e.g., wafer 151) during a cleaning process. Additionally, the load pins 311 can be configured to grip or hold the wafer 151 during a load and unload process. In other embodiments, the gripper pins 315 can be moved to hold the wafer against the load pins.

[0064] The gripper assembly 220 can also include a guide pin 317 that is configured to limit angular motion of the second plate assembly 320 relative to the first plate assembly 318.

[0065] In one or more embodiments, each gripper pin 315 can be coupled to an assembly 380 that is configured to contact a housing of the first access cup 211, which imparts a translational motion on the one or more gripper pins 315. For example, in response to the assembly 380 contacting the first access cup 211, the gripper pins 315 pivot about the shaft 302 and move toward an outer edge of the gripper assembly 220 as the gripper assembly 220 moves in the +X direction. Figure 3B An example embodiment is shown in which the assembly 380 has just contacted the first access cup 211 and is in a closed position. In one embodiment, as the gripper assembly 220 moves in the +X direction, the assembly 380 contacts the first access cup 211 and pivots about the shaft 302. In response, a translational motion is imparted on the gripper pins 315 coupled to the assembly 380. In one embodiment, the assembly 380 continues to pivot until movement of the gripper assembly 220 in the +X direction stops. In one embodiment, after movement of the gripper assembly 220 in the +X direction stops, the assembly 380 and the gripper pins 315 are positioned in an open position.

[0066] Additionally, assembly 380 can be coupled to spring assembly 381. Spring assembly 381 can further return assembly 380 to the starting position, thereby moving clamp pin 315 to the clamped position in response to assembly 380 no longer contacting the housing of first pick cup 211. Spring assembly 381 can load assembly 380 such that assembly 380 returns to the starting position when assembly 380 no longer contacts the housing of first pick cup 211. Additionally, spring assembly 381 can be a leaf spring or any other spring design.

[0067] Clamp pin 311 and clamp pin 315 can be configured to hold wafer 151 such that wafer 151 does not contact first plate assembly 318 of clamp assembly 220. Additionally, the position of wafer 151 relative to first pick cup 211 can be adjusted during a cleaning cycle.

[0068] Figure 3F An embodiment of clamp pin 315 and assembly 380 in the closed position is shown, end 380a is not in contact with first pick cup 211. Figure 3G Assembly 380 and clamp pin 315 in the open position are labeled. In Figure 3G In the embodiment shown, end 380a of assembly 380 is in contact with first pick cup 211. Additionally, assembly 380 has been pivoted such that end 380b of assembly 380 has been moved relative to end 380a. In one embodiment, end 380b has been rotated toward the upper surface of second plate assembly 320. Furthermore, clamp pin 315 has also been moved such that it is tilted outwardly toward first pick cup 211.

[0069] Further reference to Figure 3C Clamp assembly 220 further includes one or more holes 351. In one or more embodiments, cleaning fluid can flow through hole(s) 351 onto the backside of wafer 151. The cleaning fluid can be a rinse (e.g., DI water, ozone water) or a cleaning chemical. Additionally, the cleaning fluid can be provided via shaft 224 and subsequently provided to holes 351.

[0070] Figure 3E A schematic partial plan view of clamp assembly 220 is shown. Hole(s) 351 flow chemical onto the backside of wafer 151. One or more holes 351 can be arranged in a substantially circular or linear pattern. Each hole 351 can be substantially the same size such that cleaning fluid flows evenly across the back surface of wafer 151. Additionally, at least one hole 351 can have a different size than at least one other hole.

[0071] Figure 4Ais a bottom view of nozzle mechanism 240 attached to purge arm 230. As shown, nozzle mechanism 240 includes nozzle 410, nozzle 420, and nozzle 430. Alternatively, one or more of nozzles 420 and 430 can be omitted. Additionally, nozzle mechanism 240 can include more than three nozzles. Nozzle 410 can be disposed at a first angle (e.g., angle 412) relative to a surface of wafer 151, nozzle 420 can be disposed at a second angle (e.g., angle 422) relative to the surface of wafer 151, and nozzle 430 can be disposed at a third angle (e.g., angle 432) relative to the surface of wafer 151 or the surface of first plate assembly 318. Angle 412 can be different than at least one of angles 422 and 432. Additionally, angles 422 and 432 can be substantially similar. In some configurations, nozzle 410 can be disposed at an angle (e.g., angle 412) relative to the surface of the wafer that is less than the angles (e.g., 422 and 432) at which nozzles 420 and 430 are disposed relative to the surface of the wafer. In some configurations, angle 412 can be about 30° to about 50° relative to the surface of first plate assembly 318 or wafer 151, and angles 422 and 432 are about 80° to about 100° relative to the surface of wafer 151 or the surface of first plate assembly 318. In one embodiment, angle 412 is about 45° relative to the surface of wafer 151 or the surface of first plate assembly 318, and angles 422 and 432 are about 90° (or perpendicular) relative to the surface of wafer 151 or the surface of first plate assembly 318. Additionally, other angles can be utilized. Further or alternatively, angles 412, 422, and 432 can each be between about 80° and about 100°. Additionally, the position of each of nozzles 410, 420, and / or 430 can be adjusted in a direction along the length of purge arm 230 to aim at a particular radial location on the wafer. Further, the angle and position of each nozzle can be selected such that the cleaning fluid output by each nozzle together serves to remove any contaminants from the surface of wafer 151. Figure 4B Figure 4B Figure 4B

[0072] Nozzle mechanism 240 can be configured to output cleaning media onto a first surface of wafer 151 via nozzles 410, 420, and 430. The cleaning media can include a rinse and a cleaning chemical. Additionally, nozzle mechanism 240 is configured to output a first cleaning media via nozzle 410, a second cleaning media via nozzle 420, and a third cleaning media via nozzle 430. Further, one or more of nozzles 410, 420, and 430 are configured to apply one or more rinses.

[0073] ​​​The nozzle mechanism 240 can include one or more non-contact cleaning techniques. The nozzles 410, 420, and 430 can output a medium that is any combination of fluid, gas, and particles. Additionally, one or more of the nozzles 410, 420, and 430 can be a high-energy nozzle for outputting a high-energy medium. The high-energy medium can be any combination of liquid, gas, and particles. Additionally, the high-energy medium can be a high-energy cleaning chemical. One or more of the nozzles 410, 420, and 430 can be an ultrasonic nozzle, a fluid jet nozzle, or a kinetic energy nozzle. For example, the nozzle 410 is one of an ultrasonic nozzle, a jet nozzle, and a kinetic energy nozzle configured to deliver a mixture of gas and liquid. The ultrasonic nozzle includes one or more components configured to alternately apply compression and rarefaction to a cleaning fluid in an alternating fashion according to a sinusoidal or other pattern to create an ultrasonically actuated fluid. For example, the ultrasonic nozzle can be configured to alternately apply compression and rarefaction in a sinusoidal pattern at a rate of 950 kHz to create an ultrasonically actuated fluid. Alternatively, other frequencies can be used.

[0074] The nozzle 420 is configured to apply a first chemical and the nozzle 430 is configured to apply a rinse. Additionally, when the nozzle 410 is an ultrasonic nozzle, the nozzle 420 is configured to apply a first chemical and the nozzle 430 is configured to apply a second chemical. Alternatively, when the nozzle 410 is an ultrasonic nozzle, the nozzle 420 is configured to apply a first rinse and the nozzle 430 is configured to apply a second rinse. Additionally, at least two of the nozzles are configured to apply the same rinse or chemical.

[0075] Cleaning fluid can be provided to the nozzle mechanism 240 via fluid connections 440. The number of connections can be based on the number of nozzles within the nozzle mechanism and / or the number of different types of chemicals and / or rinses utilized by the nozzle mechanism 240. For example, in the case where the nozzle mechanism 240 employs three nozzles configured to output two different cleaning fluids, two connections 440 can be utilized. Additionally, the flow rate of different cleaning chemicals and / or rinses through different nozzles can be different. For example, the flow rate of a cleaning chemical or rinse from a first one of the nozzles 410, 420, and 430 can be different than the flow rate of a cleaning chemical or rinse from a second one of the nozzles 410, 420, and 430. Alternatively, the flow rate of a cleaning chemical or rinse from at least one of the nozzles 410, 420, and 430 can vary during a cleaning process and / or a rinsing process.

[0076] Although FIG. 4 illustrates three separate nozzles, in other embodiments, other numbers of nozzles can be utilized. For example, more than three nozzles can be utilized. Additionally, fewer than three nozzles can be utilized.

[0077] Figure 5An alternative embodiment of the nozzle mechanism 240 is shown. In contrast to the embodiment of FIG. 4, not all of the connections 440 are connected to a common side of the nozzle mechanism 240, instead, a first connection 442 is connected to a first side of the nozzle mechanism 240 and a second connection 444 is connected to a second side of the nozzle mechanism, where the first side is different than the second side.

[0078] Now returning to Figure 2A The purge arm 230 is coupled to a purge arm shaft 232 and a purge arm drive motor 234. The purge arm shaft 232 and the purge arm drive motor 234 form a purge arm drive assembly 236. The purge arm drive assembly 236 is configured to move the nozzle mechanism 240 over the surface of the wafer 151 during the cleaning process such that the cleaning fluid output by the nozzle mechanism 240 is evenly distributed over the surface of the wafer 151. The purge arm drive assembly 236 can also be configured to axially move the purge arm 230 to set the distance between the nozzle mechanism 240 and the surface of the wafer 151.

[0079] Figure 6 A path 610 of the purge arm 230 and the nozzle mechanism 240 over the wafer 151 during a cleaning cycle is shown in accordance with one or more embodiments. As shown in Figure 6 The wafer 151 is disposed over the chuck assembly 220 and retained by the chuck assembly 220. The path 610 can be an arcuate path that is parallel to the device side surface (front surface) of the wafer 151. Alternatively, other shapes and / or lengths of paths can be utilized. For example, the range of motion of the purge arm 230 can vary. As shown in Figure 6 The nozzle mechanism 240 coupled to the end of the purge arm 230 passes through the center of the wafer in the arcuate path. The position of the purge arm 230 and / or the position of the nozzle mechanism 240 can be adjusted to ensure that the nozzle mechanism 240 passes through the center of the rotating wafer 151 during processing. Additionally, at least one of the position of the purge arm 230 and the position of the nozzle mechanism 240 can be adjusted such that the nozzle mechanism 240 passes through a portion of the wafer 151 that is different than the center of the wafer 151. For example, the nozzle mechanism 240 can be moved relative to the purge arm 230 and / or the purge arm 230 can be moved relative to the purge arm shaft 232 to change the position of the nozzle mechanism 240 relative to the surface of the wafer 151. Additionally, the axial distance between the nozzle mechanism 240 and the surface of the wafer 151 can be varied to assist the cleaning process.

[0080] During the cleaning process, the purge arm drive motor 234 moves the purge arm shaft 232, and in turn, the purge arm 230 and the nozzle mechanism 240, over the wafer 151. The purge arm drive motor 234 can control the scan rate of the nozzle mechanism 240. For example, the purge arm drive motor 234 can control the speed at which the nozzle mechanism moves along the path 610.

[0081] Figure 6 A spray bar 290 is further shown. The spray bar 290 can pre-wet the wafer 151 as the wafer is inserted into the cleaning module 200 and rinse the wafer 151 as the wafer is removed from the cleaning module 200. The spray bar 290 can include one or more nozzles configured to output one or more fluids configured. Alternatively, the spray bar 290 can include a tube having holes designed to maintain a uniform flow across the spray bar 290. For example, as the wafer 151 passes the spray bar 290 as the wafer 151 is transferred into and out of the cleaning module 200, and the spray bar 290 applies a rinse fluid to the wafer 151 to ensure that the wafer 151 remains wet during the transfer process, and as the wafer is removed from the cleaning module 200, particles do not re-attach to the wafer 151.

[0082] Figure 7A An example of an air flow pattern within the cleaning module 200 is shown. As shown by the air flow pattern, recirculation is minimized as air flows out of the plenum 280 and out of the exhaust 260. Generally, the shape of the annular inner surface 214 of the wall 213 and the outer surface of the catch cup 210 assist in reducing air recirculation and capturing fluid that flows off the wafer surface as the fluid rotates about the rotational axis 313. In one embodiment, the annular inner surface 214 of the wall 213 has an inverted shape such that the air flow within the processing volume 297 is along the outer edge of the chuck assembly 220 and into the exhaust 260. Additionally, the outer surface of the catch cup 210 can be shaped such that the air flow within the inner volume 295 is around the outside of the catch cup 210 and into the exhaust 260. Further, the shape of the outer surface of the catch cup 210 can force a majority of the air flow to travel around the outside of the catch cup 210 and into the exhaust 260.

[0083] One or more sides of the drain hole 262 can be angled such that the distance between the sides of the drain hole 262 is different. For example, the drain hole 262 can be tapered. The tapered drain hole can increase the rate at which fluid is pumped out of the area inside the catch cup 210. Additionally, a labyrinth 264 can be formed between the catch cup 210 and the housing of the cleaning module 200. The labyrinth 264 can be configured to at least partially limit moisture from flowing back through the labyrinth 264 and into the inner volume 295.

[0084] The plenum 280 can be configured to control the air flow within the cleaning module 200 to minimize recirculation. For example, the plenum 280 can increase and / or decrease the amount of air flowing into the cleaning module 200 to minimize recirculation. Due to the configuration of the catch cup 210, the chuck assembly 220, the plenum 280, the exhaust 260, the spray bar 290, the drain 284, and the air intake 279 disclosed herein, air flow recirculation can be minimized.

[0085] In one embodiment, uniform airflow across the surface of the wafer 151 during the cleaning process is generated by the exhaust 260 and the plenum 280. In various embodiments, the exhaust 260 is configured to provide a path for air to flow out of the cleaning module 200 to prevent particles from re-attaching to the surface of the wafer 151. As described above, air can be provided to the plenum 280 through the air inlet 270 and exhausted from the cleaning module 200 through the exhaust 260. The plenum 280 can be a showerhead type plenum. Additionally, the geometry of the exhaust 260 and / or the shape of the access cup 210 (or the shape of the first access cup 211 and / or the second access cup 212) can be optimized to reduce recirculation within the cleaning module 200. Reducing recirculation minimizes at least re-attachment of particles on the wafer 151 and any evaporated cleaning fluid. The geometry of the exhaust 260 and / or the shape of the access cup 210 (or the shape of the first access cup 211 and / or the second access cup 212) can create a labyrinth 264 behind the access cup 210, thereby minimizing recirculation. Additionally, the drain 284 provides a path for removing cleaning fluid and rinse fluid from the cleaning module 200, thereby minimizing recirculation within the cleaning module 200. The plenum 280 can be positioned along the wall 283 of the cleaning module 200 such that the plenum 280 is positioned proximate the nozzle mechanism 240 and the wafer 151 is between the plenum 280 and the exhaust 260.

[0086] Figure 7B is a schematic top view of the chuck assembly 220, portions of the hole 351, and the drain holes 262 according to one or more embodiments. Each drain hole 262 is fluidically coupled to the drain 284. Additionally, as the chuck assembly 220, the access cup 210, and the wafer 151 rotate, fluid is forced through the drain holes 262 in which the fluid is removed from the cleaning module by the drain 284.

[0087] The drain holes 262 can be positioned along the edge of the access cup 210 (or the second access cup 212) such that moisture is forced into the drain holes 262 during the cleaning process. The drain holes 262 can assist in removing moisture from the cleaning module during the cleaning cycle to ensure that all particles removed from the surface of the wafer 151 during the cleaning process are removed from the cleaning module 200. In various embodiments, at least two drain holes 262 are utilized. In other embodiments, more than two drain holes 262 are utilized.

[0088] The drain holes 262 can be configured to reduce air and / or fluid recirculation within the cleaning module 200. For example, the size and / or orientation of the drain holes 262 can be configured to reduce air and / or fluid recirculation. The drain holes 262 can have a sloped or angled orientation with respect to the surface of the access cup 210 (or the second access cup 212).

[0089] In one embodiment, the drain 284 and / or the exhaust 260 can include one or more internal labyrinth seals that minimize the flow of moisture into the drain hole (or port) 262.

[0090] The drain 284 can be used to remove excess moisture and / or all fluid from the cleaning module 200 upon completion of a cleaning cycle. In one embodiment, moisture flows through the drain hole 262 and into the drain 284. For example, as the wafer 151 rotates, the drain hole 262 is configured to ensure that moisture does not collect on the wafer 151 and is removed via the drain 284. In one embodiment, one or more O-rings or other sealing members can be positioned where the drain 284 meets the cleaning module 200.

[0091] Figure 7B Further shown is the drain hole 262 that is connected to the exhaust 260 and to provide a path for air to flow within the processing volume 297, around the wafer 151, and into the exhaust 260. In one embodiment, the exhaust hole 261 assists in minimizing recirculation within the cleaning module.

[0092] Figure 8 A method 800 for cleaning a wafer (e.g., wafer 151) according to one or more embodiments is shown. At operation 810, the cleaning module is placed in a wafer loading position, as discussed further below. Figure 9A For example, the lid 202 is opened and the clamp assembly 220 of the cleaning module 200 is moved in a lateral direction (e.g., X-direction) parallel to the rotational axis 216 toward the annular inner surface 214 of the wall 213 of the access cup 210. Moving the clamp assembly 220 toward the wall 213 places the clamp assembly 220 in the loading position. In one embodiment, placing the clamp assembly 220 in the loading position includes moving the clamp assembly 220 via the shaft 224 and the drive motor 222 toward the wall 213 (e.g., operation 812). For example, the drive motor 222 drives the shaft 224 in the lateral direction, moving the clamp assembly 220 toward the wall 213 such that the features 312 of the second plate assembly 320 contact the annular inner surface 214 of the wall 213. When the features 312 contact the wall 213, movement of the second plate assembly 320 stops while the first plate assembly 318 continues to move such that at least a portion of the first plate assembly 318 is positioned in the inner volume 295. The first plate assembly 318 remains coupled to the second plate assembly 320 via the spring mechanism 330. For example, as the first plate assembly 318 moves in the positive X-direction and the movement of the second plate assembly 320 stops, the spring mechanism 330 expands, maintaining the coupling between the first plate assembly 318 and the second plate assembly 320.

[0093] Each component 380 is coupled to a corresponding clamping pin of the clamping pin 315, and as component 380 contacts wall 213, each clamping pin 315 tilts (or moves) away from each other movable pin. For example, as Figure 9A As shown, as component 380 contacts wall 213, component 380 pivots and clamping pin 315 moves in an outward direction, thereby tilting away from the center of clamping assembly 220. Moving clamping pin 315 includes moving clamping pin 315 toward the outer edge of clamping assembly 220 such that clamping pin 315 tilts away from other pins (e.g., loading pin 311 and other clamping pins among clamping pins 315) and the separation distance between clamping pins 315 increases.

[0094] The clamp assembly 220 is positioned in the extended position 300b such that the wafer 151 can be received for cleaning and / or removed from the cleaning module 200 after a cleaning cycle has been completed. For example, the clamp assembly 220 may be driven by a drive motor 222 and a shaft 224 such that at least a portion of the first plate assembly 318 extends beyond the wall 213 of the receiving cup 210 and into the internal volume 295, and is in the extended position 300b.

[0095] Figure 9A The illustration shows an embodiment where the gripper assembly 220 is positioned in the device location. Figure 9A In this embodiment, the clamping pin 315 has moved outward and the first plate assembly 318 has moved away from the second plate assembly 320. Additionally, at least the loading pin 311 rests on the outside of the receiving cup 210 and within the internal volume 295, allowing the wafer 151 to be received from the robot onto the loading pin 311. In the loading position, the surface 301 of the first plate assembly 318 may be parallel to the outer edge of the wall 213, recessed from the wall 213 of the receiving cup 210 within the processing volume 297, or on the outside of the wall 213 of the receiving cup 210 and within the internal volume 295. Alternatively, when in the loading position, the surface 301 may be parallel to the outer edge of the wall 213 or within the processing volume 297, while the loading pin 311 rests on the outside of the wall 213 and within the internal volume 295.

[0096] Controller 190 can provide commands to drive motor 222 to move along Figure 3A The rotating axis 313 moves the shaft member 224 in the lateral direction, thereby moving the clamping assembly 220 in the lateral direction. Additionally, the controller 190 can receive a flag indicating that the cleaning module 200 is ready to receive the wafer for cleaning.

[0097] At operation 820 of method 800, a wafer is received for cleaning. For example, in one embodiment, robot 910 inserts wafer 151 into gripper assembly 220 for cleaning. Figure 9AAs shown in the embodiment of FIG. 9, the robot 910 inserts the wafer 151 such that the wafer 151 is held by the load pins 311 (e.g., seated in the grooves of the load pins). For example, the robot 910 is configured to place the wafer 151 into the load pins 311 of the gripper assembly 220.

[0098] During entry into the cleaning module 200, the one or more spray bars 290 can pre-treat the wafer 151 by applying one or more fluids to the wafer 151 as the wafer 151 is inserted into the cleaning module 200. In one embodiment, the wafer 151 can be received after being cleaned in one or more other cleaning modules (e.g., the ultrasonic cleaning module 161, the pre-clean module 162, or the brush box cleaning module 164).

[0099] After the wafer 151 has been fully inserted into the load pins 311, the robot 910 releases the wafer 151 and retracts from the cleaning module 200.

[0100] The controller 190 can provide instructions to the spray bars 290 to begin the pre-treatment process. Additionally, the controller 190 can receive a flag indicating that the wafer 151 has been inserted into the cleaning module 200. For example, the controller 190 can receive sensor data from the sensing device 294 indicating that the wafer 151 has been placed within the cleaning module 200 and generate instructions for the spray bars 290 to begin the pre-treatment process.

[0101] At operation 830 of the method 800, the cleaning module is placed in a cleaning position. For example, as shown in operation 832, the cleaning module 200 can be placed in a cleaning position by moving the gripper assembly 220 away from the wall 213. The drive motor 222 drives the shaft 224 to retract the gripper assembly 220 into the process volume 297. For example, the drive motor 222 can drive the shaft 224 in a lateral or horizontal direction (e.g., the X direction) along the rotation axis 216 to move the gripper assembly 220 away from the wall 213.

[0102] As the drive motor 222 moves the gripper assembly 220 away from the wall 213, the first plate assembly 318 is returned to contact with the second plate assembly 320 and the contact between the feature 312 and the wall 213 is ended. Additionally, the assembly 380 is pivoted to a closed position and the clamp pins 315 move toward each other and clamp the wafer 151. The clamp pins 315 apply pressure to the wafer to hold the wafer 151. Each clamp pin 315 can be coupled to a spring mechanism that applies a force to clamp the wafer 151. The drive motor 222 can drive the shaft 224 until the second plate assembly 320 contacts the retrieval cup 210.

[0103] Additionally, as the gripper assembly 220 moves in the negative X direction (e.g., horizontally away from the wall 213), the feature 312 moves away from the wall 213, and the spring mechanism 330 remains clamped the second plate assembly 320 to the first plate assembly 318. When the feature 312 is no longer in contact with the wall 213, the first plate assembly 318 and the second plate assembly 320 can enter a state of contact with one another.

[0104] As Figure 9C As illustrated in the embodiment of FIG. 15, the wafer 151 is held by the gripper assembly 220 gripper pins 315. In the illustrated embodiment, the gripper assembly 220 has moved in the X direction (e.g., parallel to the rotation axis 216) away from the wall 213, such that the assembly 380 moves away from the wall 213, and the gripper pins 315 grip the wafer 151. Additionally, the robot 910 has been retracted from the interior volume 295 of the cleaning module 200.

[0105] The controller 190 can be configured to provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction away from the wall 213, thereby moving the gripper assembly 220 in the lateral direction and away from the wall 213. The controller 190 can initiate movement of the gripper assembly 220 based on sensor data received from the sensing device 294 indicating that the wafer 151 is being held by the gripper assembly 220, and that the robot 910 has been removed from the interior volume 295. Once the gripper assembly 220 has been placed in the retracted position 300a, a cleaning cycle can be initiated.

[0106] At operation 840, the wafer is cleaned. The wafer 151 and the chuck assembly 220 are placed in a cleaning position such that the wafer 151 and the chuck assembly 220 rest entirely within the processing volume 297. As shown by operation 842, performing a cleaning cycle includes positioning a purge arm over the wafer 151 and dispensing fluid onto the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and the shaft 224. Additionally, as shown by operation 844, performing a cleaning cycle includes rotating the wafer 151. For example, the drive motor 222 can simultaneously rotate the wafer 151, the access cup 210, and the chuck assembly 220. During the cleaning process, the position of the wafer 151 within the processing volume 297 can change. For example, the distance between the wafer 151 and the second access cup 212 can change. The rate at which fluid is applied to the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and the shaft 224 can change. For example, fluid can be applied to the front and back surfaces of the wafer 151 at the same rate or at different rates. Alternatively, the rate at which fluid is applied to the front and back surfaces of the wafer 151 can change during the cleaning process or the rinsing process. For example, the rate at which fluid is applied to the front surface of the wafer 151 via the nozzle mechanism can increase or decrease during the cleaning or rinsing process. Additionally, the rate at which fluid is applied to the back surface of the wafer 151 via the shaft 224 can increase or decrease during the cleaning or rinsing process.

[0107] Cleaning the wafer 151 includes continuously rotating the access cup 210 (e.g., the first access cup 211 and the second access cup 212), the chuck assembly 220, and the wafer 151 while applying cleaning fluid to the first side (front surface) and the second side (back surface) of the wafer 151. Rotating the access cup 210, the chuck assembly 220, and the wafer 151 simultaneously applying cleaning fluid assists in minimizing and / or eliminating the re-attachment of particles to any surface of the wafer 151. The drive motor 222 can be configured to simultaneously rotate the access cup 210, the chuck assembly 220, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the access cup 210, the chuck assembly 220, and the wafer 151. The wafer 151 is rotated at a speed in a range of about 500 RPM to about 1000 RPM such that fluid is removed from the surfaces of the wafer 151. Alternatively, the wafer 151 can be rotated at a speed less than 500 RPM or greater than about 1000 RPM. Additionally, the rate at which the wafer 151 is rotated can change during the cleaning process.

[0108] A first cleaning fluid can be applied to the back surface of the wafer 151 (e.g., the surface of the wafer 151 facing the surface 301) via the fluid source 223, the shaft 224, and the one or more holes 351. Additionally, a second fluid can be applied to the front surface of the wafer 151 (e.g., the surface of the wafer 151 facing away from the surface 301) via the nozzle mechanism 240. The purge arm drive motor 234 can move the purge arm 230 such that the nozzle mechanism 240 moves in an arcuate path over the front surface of the wafer 151. The nozzle mechanism 240 can be configured to apply a cleaning fluid to the front surface of the wafer 151 during a cleaning process. The fluid can include a cleaning chemical and / or a rinsing agent. The cleaning fluid can be applied to the front surface and the back surface of the wafer 151 substantially simultaneously. Additionally, the cleaning fluid can be applied to the front surface of the wafer 151 independently of the cleaning fluid being applied to the back surface of the wafer 151. For example, during one or more overlapping and non-overlapping time periods, the cleaning fluid can be applied to the front surface of the wafer 151 and the cleaning fluid can be applied to the back surface of the wafer 151. During a first non-overlapping time period, one or more cleaning fluids can be applied to the front surface of the wafer 151 and during a second non-overlapping time period, one or more cleaning fluids can be applied to the back surface of the wafer 151. The overlapping and non-overlapping time periods of the cleaning cycle can occur in any order. Additionally, the number and / or order of the overlapping and non-overlapping time periods can change between cleaning cycles. Furthermore, at least the cleaning fluid is reduced or eliminated from splashing back onto the wafer 151 while in the cleaning position.

[0109] Figure 9D An embodiment is shown with the wafer 151 in the cleaning position. The cleaning position includes positioning the gripper assembly 220 within the processing volume 297. Additionally, once the wafer gripper 210 has been placed in the cleaning position, a cleaning cycle can be initiated.

[0110] During at least one of the cleaning process, the loading process, and the unloading process, airflow recirculation is mitigated in the cleaning module 200, thereby preventing particles from re-attaching to the surface of the wafer 151.

[0111] The controller 190 can receive an indication that the gripper assembly 220 is positioned in the cleaning position. The indication can be provided within sensor data from the sensing device 294. Additionally, the controller 190 can be configured to control the flow of cleaning fluid through the shaft 224 and the aperture(s) 351, as well as the movement and control of the fluid through the nozzle mechanism 240. The controller 190 can provide instructions to the purge arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. Additionally, the controller 190 can output instructions to the nozzle mechanism to dispense cleaning fluid from one or more of the nozzles. Additionally, the controller 190 can control the timing of the nozzles such that cleaning fluid is output at different times. For example, one nozzle can be controlled to begin dispensing cleaning fluid before another nozzle. One or more of the nozzles can be configured to output cleaning fluid while at least another nozzle does not output cleaning fluid.

[0112] At operation 850, the cleaned wafer is removed from the cleaning module. Removing the wafer 151 from the cleaning module includes operation 852 moving the gripper assembly 220 toward the wall 213 to place the gripper assembly 220 in an unload position. The unload position can correspond to moving the first plate assembly 318 of the gripper assembly 220 at least partially into the interior volume 295 and placing the gripper pins 315 in a retracted and tilted position. For example, the load position can include positioning the one or more pins 311 and the surface 301 of the first plate assembly 318 in the interior volume 295. Additionally, removing the wafer from the cleaning module includes operation 854 stopping the dispensing of cleaning fluid and operation 856 stopping the rotation of the wafer. The cup 210, the gripper assembly 220, and the wafer 151 can continue to rotate by the drive motor 222 until the wafer 151 is within the interior volume 295.

[0113] At the end of the cleaning cycle, the gripper assembly 220 is moved into the load position by the drive motor 222 and the shaft 224. Additionally, the nozzle mechanism 240 can terminate the spraying of fluid and the nozzle mechanism 240 and the purge arm 230 can be moved away from the wall 213 at the end of the cleaning cycle and before moving the gripper assembly 220. At the end of the cleaning cycle, the nozzle mechanism 240 and the purge arm 230 can be positioned such that they do not interfere with the movement of the gripper assembly 220 and the robot 910.

[0114] At the end of the cleaning cycle, the dispensing of cleaning fluid can be stopped. Additionally, the dispensing of cleaning fluid can be stopped before moving the gripper assembly 220 toward the wall 213. Alternatively, fluid can continue to be disposed on the back surface of the wafer 151 while fluid is stopped from being dispensed to the top surface.

[0115] Additionally, as the move the gripper assembly 220, the gripper assembly 220 and the access cup 210 can be rotated as described above to minimize re-attachment of particles to the wafer 151. In one embodiment, rotating the gripper assembly 220 and the access cup 210 simultaneously moving the gripper assembly 220 reduces splashing of cleaning fluid back onto the wafer 151. Additionally, rotation of the gripper assembly 220 and the access cup 210 can be stopped just before the assembly 380 contacts the wall 213. Furthermore, rotation of the gripper assembly 220 and the access cup 210 can be stopped just before the assembly 380 contacts the wall 213.

[0116] Figure 9A An example embodiment is shown in which the gripper assembly 220 is positioned in an unload position such that the robot 910 can remove the wafer 151 from the cleaning module 200. The robot 910 can enter the cleaning module through the opening that is not obstructed by the cover 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0117] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction toward the wall 213, thereby moving the gripper assembly in the lateral direction and toward the wall 213 to place the gripper assembly 220 in an unload position such that the robot 910 can remove the cleaned wafer 151 from the cleaning module 200. Additionally, once the wafer 151 is positioned in the interior volume 295, the controller 190 can provide instructions to the drive motor 222 to stop rotation of the access cup 210 and the gripper assembly 220. The controller 190 can also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing cleaning fluid. The controller 190 can receive sensor data from the sensing device 294 indicating that the wafer 151 has been placed in the unload position and initiate an unload process in response to the sensor data.

[0118] Figure 10 A cross-sectional view of a non-contact vertical cleaning module (e.g., cleaning module 1000) for a wafer processing system is shown in accordance with one or more embodiments. The cleaning module 1000 is configured to clean a wafer 151 in a vertical orientation (e.g., perpendicular to the axis of rotation 1016). The cleaning module 1000 is similar to the cleaning module 200. For example, both the cleaning module 200 and 1000 include a nozzle mechanism 240, a plenum 280, a drain 260, a spray bar 290, a drain 284, an intake 270, a drive motor 222, a shaft 224, and a fluid source 223. These components are described in more detail above. However, the wafer gripping device 1003 of the cleaning module 1000 is different from the wafer gripping device 203 of the cleaning module 200.

[0119] As with cleaning module 200, cleaning module 1000 can receive a wafer to be cleaned, e.g., wafer 151, within one or more of ultrasonic cleaning module 161, pre-clean module 162, brush box cleaning module 164, and before placing the wafer in a corresponding Marangoni drying slot, e.g., drying slot 168. Cleaning module 1000 can be placed anywhere within a wafer cleaning cycle and / or an edge / bevel cleaning process. Cleaning module 1000 can be used to remove contamination from a wafer that, if not removed, can cause the wafer to not meet quality standards and be discarded.

[0120] Wafer clamping device 1003 is configured to support wafer 151 in a vertical orientation, e.g., an orientation perpendicular to rotation axis 1016. Wafer clamping device 1003 includes a catch cup 1010 and a clamp assembly 1020. Catch cup 1010 is configured similarly to catch cup 210. For example, catch cup 1010 can comprise a single piece of material as described with respect to catch cup 210. Alternatively, catch cup 1010 can include a first catch cup 1011 and a second catch cup 1012. Similar to first catch cup 211 and second catch cup 212, first catch cup 1011 and second catch cup 1012 can be coupled to each other.

[0121] Catch cup 1010 includes a wall 1013. Wall 1013 is configured similarly to wall 213 as described above. Wall 1013 includes an annular inner surface 1014 configured similarly to annular inner surface 214 as described above. Annular inner surface 1014 has an angular portion that is symmetric about a central axis of wafer clamping device 1003. Catch cup 1010 is described in more detail below.

[0122] Drive motor 222 is coupled to clamp assembly 1020. Drive motor 222 is described in more detail above. Drive motor 222 can include a first motor configured to control rotation of clamp assembly 1020 and catch cup 1010 about rotation axis 1016 and a second motor configured to control horizontal movement of clamp assembly 1020. Horizontal movement is movement generally in an axial direction of clamp assembly 1020, or movement in a direction parallel to rotation axis 1016. Horizontal movement corresponds to movement in the X direction. Additionally, horizontal movement of clamp assembly 1020 can be independent of movement of catch cup 1010. Furthermore, clamp assembly 1020 and catch cup 1010 can be configured to rotate together, e.g., clamp assembly 1020 and catch cup can rotate simultaneously.

[0123] As described above with respect to cleaning module 200, spray bar 290 can apply a pre-treatment fluid to wafer 151 as wafer 151 is inserted into cleaning module 1000 and / or flush wafer 151 with a rinse fluid as wafer 151 is removed from cleaning module 1000. Spray bar 290 can be used to apply fluid to wafer 151 during the time that wafer 151 is not being clamped and cleaned.

[0124] As described above with respect to cleaning module 200a, drain 284 can be used to remove excess moisture from cleaning module 1000. Drain 284 can remove excess cleaning fluid from cleaning module 1000 during a cleaning process.

[0125] As described with respect to cleaning module 200, plenum 280 can receive air from air intake 270 to be circulated within cleaning module 1000. Additionally, air can be exhausted from cleaning module 1000 through exhaust 260. Air intake 270 and plenum 280 are located on the front of cleaning module 200 and exhaust 260 is located on the back of cleaning module 1000. Alternatively, the locations of exhaust 260 and air intake 270 can be reversed such that exhaust 260 is located on the front of cleaning module 1000 and air intake 270 is located on the back of cleaning module 1000. Additionally, plenum 280 and exhaust can be configured to control the flow of air within cleaning module 1000 to prevent particles from re-attaching to the surface of wafer 151.

[0126] Cleaning module 1000 can further include sensing device 294. Sensing device 294 is described in greater detail above. Sensing device 294 can detect wafer 151 within cleaning module 1000. For example, sensing device 294 can detect wafer 151 within interior volume 295. Additionally, sensing device 294 can detect wafer 151 while wafer 151 is being held by chuck assembly 1020. Sensing device 294 can detect when wafer 151 is properly or improperly loaded into chuck assembly 1020. Additionally, sensing device 294 can detect when wafer 151 falls or drops from chuck assembly 1020.

[0127] Controller 190 can control the functions of cleaning module 1000 similar to the functions of cleaning module 200. For example, controller 190 can control the functions of at least drive motor 222, chuck assembly 1020, spray bar 290, purge arm 230, nozzle mechanism 240, air intake 270, and / or exhaust 260.

[0128] Figure 11 is shown in Figure 10An example of a wafer clamping device 1003 is shown. During the cleaning process, the clamping assembly 1020 is positioned within the processing volume 297. The clamping assembly 1020 includes a first plate assembly 1022, a second plate assembly 1024, a loading pin 1030, and a clamping pin 1032. The first plate assembly 1022 is coupled to a shaft 224, which is driven by a drive motor 222 during the cleaning cycle to rotate the first plate assembly 1022, the second plate assembly 1024, and the receiving cup 1010. Additionally, the drive motor 222 can horizontally move the shaft 224 along an axis 1016 to move the clamping assembly 1020 in and out of the loading and cleaning positions. Furthermore, cleaning fluid can flow through the shaft 224, allowing it to be applied to the back side of the wafer 151 via a hole 1051 in the first plate assembly 1022 during the cleaning process. In one embodiment, shaft 224 may be a spline shaft that allows the gripper assembly 1020 to be driven when shaft 224 translates in the +X and -X directions.

[0129] The annular inner surface 1014 of wall 1013 may be shaped to help guide moisture away from wafer 151 and into drainage device 284 during cleaning, and to reduce particle re-adhesion onto wafer 151. For example, the annular inner surface 1014 may include a first angled portion and a second angled portion to help guide moisture away from wafer 151 during cleaning. The first angled portion may be larger than the second angled portion. In addition, the angle of the second angled portion with respect to surface 1101 of the first plate assembly 1022 may be larger than the angle of the first angled portion with respect to surface 1101 of the first plate assembly 1022.

[0130] The receiving cup 1010 may be configured to include a first receiving cup 1011 and a second receiving cup 1012. The first receiving cup 1011 may be attached to the second receiving cup 1012. For example, the first receiving cup 1011 may be attached to the second receiving cup 1012 via one or more screws or similar attachment means. The first receiving cup 1011 and / or the second receiving cup 1012 may include one or more threaded portions configured to receive threaded screws. Alternatively, the receiving cup 1010 may be formed from a single piece of material.

[0131] The second receiving cup 1012 may include Figure 7B The drain holes 262 are arrayed along the edge of the receiving cup 1010, allowing moisture to flow into the draining device 284 as the wafer 151, the gripper assembly 220, and the receiving cup 1010 are rotated by the drive motor 222. Additionally, the drain holes 262 are arrayed along the edge of the second receiving cup 1012. Moisture flows through the drain holes 262 into the draining device 284, where it is removed from the cleaning module 1000.

[0132] The first plate assembly 1022 and the second plate assembly 1024 are configured to move relative to each other to assist in receiving the wafer 151 and placing the wafer 151 in a cleaning position. In particular, Figure 12A and Figure 12B Embodiments of the gripper assembly 1020 in a retracted position 1200a and an extended position 1200b are shown, respectively. During a cleaning process, the gripper assembly 1020 can be positioned in the retracted position 1200a. Additionally, during a wafer loading process and / or a wafer removal (unloading) process, the gripper assembly 1020 can be positioned in the extended position 1200b. The extended position 1200b can correspond to a loading position of the gripper assembly 1020 within the cleaning module 1000. Additionally, when in the loading position, the gripper assembly 1020 can be positioned a distance in the X-direction from the cleaning position. The surface 1101 of the first plate assembly 1022 is coupled to and driven by the shaft 224.

[0133] The access cup 1010 includes one or more spring mechanisms 1230 coupled to the second plate assembly 1024. The spring mechanisms 1230 function to retain the second plate assembly 1024 within a certain distance of the access cup 1010 and allow the second plate assembly 1024 to move relative to the access cup 1010. In embodiments where the access cup 1010 includes a first access cup 1011 and a second access cup 1012, the one or more spring mechanisms 1230 are disposed within the second access cup 1012.

[0134] The spring mechanisms 1230 will generally include a spring 1231 and a coupling member 1233. The spring mechanisms 1230 allow the second plate assembly 1023 to move relative to the access cup 1010 (or the second access cup 1012) as the first plate assembly 1022 is driven horizontally by the shaft 224. For example, as the first plate assembly 1022 is moved into the extended (e.g., loading or unloading) position 1200b, the spring mechanisms 1230 expand, moving the second plate assembly 1024 away from the access cup 1010 (or the second access cup 1012). Each spring mechanism 1230 can include one or more springs 1231 that move above or parallel to the coupling member 1233. Axial movement of the second plate assembly 1024 can be limited by the coupling member 1233.

[0135] One or more actuator pins 1242 can be disposed within the access cup 1010 (or the second access cup 1012). The actuator pins 1242 can be coupled to a spring assembly 1243. Alternatively, the actuator pins 1242 can be omitted and only the spring assembly 1243 used. Additionally, the number of actuator pins 1242 is equal to the number of gripping pins 1032. For example, each actuator pin 1242 can be configured to interact with a corresponding one of the gripping pins 1032.

[0136] The gripper assembly 1020 can include a load pin 1030 and a gripper pin 1032. The load pin 1030 can be configured to receive and hold the wafer 151 during a load process and hold the wafer 151 during an unload process. The load pin 1030 can be fixed to the first plate assembly 1022.

[0137] The gripper pin 1032 can include one or more assemblies 1240 configured to impart motion to the gripper pin 1032. For example, the gripper pin 1032 can be configured such that the distance between each gripper pin 1032 and the center of the gripper assembly 1020 is variable. Additionally, the gripper pin 1032 can be coupled to the second plate assembly 1024. For example, the second plate assembly 1024 can include a cavity in which the gripper pin 1032 is disposed. The gripper pin 1032 can grip a wafer (e.g., the wafer 151) during a cleaning process.

[0138] The gripper assembly 1020 can include one or more load pins 1030 and one or more gripper pins 1032. For example, the gripper assembly 1020 can include at least three gripper pins 1032 and at least three load pins 1030. The gripper pins 1032 can be disposed such that each pin is about 120° from another gripper pin. Alternatively, the gripper pins 315 can be disposed at other angles from one another. Additionally, the load pins 1030 can be disposed such that each pin is about 120° from another load pin. Alternatively, the load pins 1030 can be disposed at other angles from one another. Further, the gripper pins 1032 can be disposed according to a first angle and the load pins 1030 can be disposed according to a second angle that is different from the first angle. The number of gripper pins 1032 can be greater than the number of load pins 1030. Alternatively, the number of gripper pins 1032 is equal to or less than the number of load pins 1030.

[0139] The gripper pin 1032 can move between a load or load position and a grip position. For example, as the assembly 1240 disengages from the actuator pin 1242 and engages the stop 1247, the gripper pin 1032 moves between the grip position and the load position. In Figure 12A The gripper pin 1032 is illustrated in the grip position in the embodiment of FIG. 1 1 1. Figure 12B The gripper pin 1032 is illustrated in the load position in the embodiment of FIG. 1 12.

[0140] The stop 1247 can be a part of the pick-up cup 1010. Alternatively, the stop 1247 is attached to the pick-up cup 1010. Additionally, at least a portion of the stop 1247 can be positioned within the cavity 1246. For example, the stop 1247 can include a protrusion positioned within the cavity and interact with the assembly 1240 to control movement of the clamp pin 1032. The distance between the protrusion of the stop 1247 and the actuator pin 1242 can define the amount of movement of the clamp pin 1032. For example, as the distance between the protrusion of the stop 1247 and the actuator pin 1242 is optimized, a greater amount of movement of the clamp pin 1032 is allowed. Additionally, although a single stop 1247 is illustrated, the clamp assembly 1020 can include a stop 1247 for each clamp pin 1032.

[0141] The clamp pin 1032 can move to a clamped position in response to the first plate assembly 1022 imparting motion onto the second plate assembly 1024. For example, when the first plate assembly 1022 is driven into a retracted position (e.g., a cleaning position) 1200a or an extended position (e.g., a loading or unloading position) by the shaft 224. When the clamp assembly is placed into the cleaning position, the force applied by the first plate assembly 1022 onto the second plate assembly 1024 can cause the spring mechanism 1230 to compress, allowing the second plate assembly 1024 and assembly (e.g., actuation assembly) 1240 to move axially to contact the pin (e.g., actuator pin) 1242, causing the clamp pin 1032 to pivot about the shaft 1033 toward the center of rotation of the assembly.

[0142] The clamping force can be defined by the compression of the spring assembly 1243. Additionally, the compression of the spring assembly 1243 is dependent on the distance between the second plate assembly 1024 and the second pick-up cup 1012. When the clamp assembly 1200 is placed into the extended position, the first plate assembly 1022 disengages from the second plate assembly 1024, allowing the spring mechanism 1230 to expand and move the second plate assembly 1024 and assembly 1240 away from the second pick-up cup 1012. The assembly 1240 can disengage from the actuator pin 1242 and contact the stop 1247, causing the clamp pin 1032 to pivot about the shaft 1033 away from the center of rotation of the clamp assembly 1200. Additionally, the axial movement of the second plate assembly 1024 can be limited by the coupling member 1233. The position of the clamp pin 1032 can correspond to the distance between the second plate assembly 1024 and the second pick-up cup 1012 and be defined by the engagement of the assembly 1240 with the pin 1242 and / or stop 1247, and / or the placement of the assembly 1240 within the clamp pin 1032. The distance between the clamp pins 1032 can be reduced when the clamp pins 1032 are in the clamped position as compared to when the clamp pins 1032 are in the loading or unloading position.

[0143] Pins 1030 and 1032 can be configured to hold wafer 151 such that wafer 151 does not contact first plate assembly 1022. The distance between wafer 151 and first plate assembly 1022 is fixed.

[0144] Bellows 1250 is disposed around second plate assembly 1024 and is configured to prevent moisture from entering any space between second plate assembly 1024 and access cup 1010 (or second access cup 1012). Bellows 1250 can completely surround second plate assembly 1024 or only partially surround second plate assembly 1024. Additionally, bellows 1250 can expand and compress in response to movement of second plate assembly 1024. Furthermore, bellows can be coupled to access cup 1010 (or second access cup 1012).

[0145] Bellows 1252 can be coupled to shaft 224 to prevent moisture from reaching and / or flowing between shaft 224 and second plate assembly 1024 and / or access cup 1010 (or second access cup 1012). Bellows 1252 can completely or partially surround shaft 224. Additionally, bellows 1252 can expand and compress in response to movement of shaft 224.

[0146] Bellows 1254 can be positioned with cavity 1246 in which clamp pin 1032 is positioned. Bellows 1254 can assist in preventing moisture from flowing into the cavity and between the cavity and second access cup 1012.

[0147] A flexure device can be disposed between second access cup 1012 and second plate assembly 1024. The flexure device can be configured to apply a force onto second plate assembly 1024 to assist in moving second plate assembly 1024 away from access cup 1010 (or second access cup 1012).

[0148] Clamper assembly 1020 can further include a guide pin 1035. Guide pin 1035 can be coupled to second plate assembly 1024 and configured to guide the movement and alignment of first plate assembly 1022 and second plate assembly 1024. For example, as first plate assembly 1022 moves closer to second plate assembly 1024, guide pin 1035 passes through cavity 1270, thereby aligning first plate assembly 1022 and second plate assembly 1024. Furthermore, guide pin 1035 can be configured to limit the angular movement of second plate assembly 1024 relative to first plate assembly 1022. Clamper assembly 1020 can include one or more guide pins 1035 or no guide pins.

[0149] Figure 12BThe gripper assembly 1020 is shown in the extended (e.g., loading or unloading) position 1200b. As shown, in response to the movement of the second plate assembly 1024 away from the access cup 1010 (or the second access cup 1012), the gripper pin 1032 has moved into the loading position. For example, the spring mechanism 1230 can expand in response to the movement of the first plate assembly 1022 away from the second plate assembly 1024, thereby pushing the second plate assembly 1024 away from the access cup 1010 (or the second access cup 1012). Additionally, the assembly 1240 disengages from the actuator pin 1242 and engages with the stop 1247, and moves the gripper pin 1032 into the loading position. Additionally, the bellows 1250 and 1252 expand with the movement of the second plate assembly 1024 and the shaft 224, respectively.

[0150] A cleaning fluid can flow through the one or more holes 1051 onto the backside of the wafer 151. The cleaning fluid can be a rinse (e.g., DI water or ozone water) or a cleaning chemical. Additionally, the cleaning fluid can be provided via the shaft 224 and subsequently provided to the one or more holes 1051. As shown, the one or more holes 1051 can be used to flow a chemical onto the backside of the wafer 151. The one or more holes 1051 can be formed in the first plate assembly 1022. The number of holes 1051 is one or more. Additionally, the one or more holes 1051 can be arranged in a substantially circular or linear pattern. In one embodiment, each of the one or more holes 1051 can be substantially the same size, such that the cleaning fluid flows evenly across the back surface of the wafer 151. In other embodiments, at least one of the one or more holes 1051 can have a different size than at least one other hole.

[0151] Figure 13 A method 1300 for cleaning a wafer (e.g., the wafer 151) is shown. At operation 1310, a cleaning module is placed in a wafer loading position. For example, the lid 202 is opened and the first plate assembly 1022 of the gripper assembly 1020 of the cleaning module 1000 is moved in a lateral direction (e.g., the X-direction) toward the wall 213 to place the gripper assembly 1020 in the loading position. Placing the gripper assembly 1020 in the loading position includes moving the first plate assembly 1022 via the shaft 224 and the drive motor 222 toward the wall 213 (operation 1312). For example, the drive motor 222 can drive the shaft 224 in the lateral direction, thereby moving the first plate assembly 1022 toward the wall 213 such that the first plate assembly 1022 is separated from the second plate assembly 1024. Additionally, the spring mechanism 1230 expands in response to moving the first plate assembly 1022 away from the second access cup 1012, thereby allowing the assembly 1240 to place the gripper pin 1032 in the loading position.

[0152] Each of the clamp pins 1032 is coupled to a respective assembly 1240 such that each clamp pin 1032 can tilt (or move) away from each other clamp pin 1032. For example, as shown in Figure 14A response to the first plate assembly 1022 separating from the second plate assembly 1024, the assembly 1240 engages the stop 1247, pivots about the shaft 1033, and tilts the clamp pin 1032 away from the center of the gripper assembly 1020. Moving the clamp pin 1032 includes moving the clamp pin 1032 toward the outer edge of the gripper assembly 1020 such that the clamp pin 1032 tilts away from the other clamp pins 1032 and the loading pin 1030, thereby increasing the separation distance between the clamp pins 1032 and the distance between the clamp pin 1032 and the loading pin 1030.

[0153] The gripper assembly 1020 can be placed in the extended position 1200b such that a wafer 151 can be received for cleaning and / or removed from the cleaning module 1000 after a cleaning cycle has been completed. For example, the gripper assembly 1020 can be driven by the drive motor 222 and the shaft 224 such that at least a portion of the first plate assembly 1022 extends beyond the access cup 1010 (or the first access cup 1011) and is in the extended position 1200b. For example, at least one of the surface 1101 and the loading pin 1030 extends beyond the access cup 1010 and into the interior volume 295. Alternatively, the surface 1101 can be disposed within the process volume 297 while the loading pin 1030 is positioned within the interior volume 295.

[0154] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction, thereby moving the gripper assembly 1020 in the horizontal direction along the shaft 1016. Additionally, the controller 190 can receive an indication that the cleaning module 1000 is ready to receive a wafer for cleaning. The indication can be received as sensor data received from the sensing device 294.

[0155] At operation 1320 of the method 1300, a wafer is received for cleaning. For example, in one embodiment, the robot 910 inserts the wafer 151 into the gripper assembly 1020 for cleaning. For example, as shown in the embodiment of Figure 14A the robot 910 inserts the wafer 151 such that the wafer 151 is held by the loading pin 1030 (e.g., seated in a groove of the loading pin 1030).

[0156] During entry into the cleaning module 1000, the one or more spray bars 290 can pre-treat the wafer 151 by applying one or more fluids to the wafer as the wafer 151 is inserted into the cleaning module 1000. After the wafer 151 is cleaned in one or more other cleaning modules (e.g., the megasonic cleaning module 161, the pre-clean module 162, or the brush box cleaning module 164), the wafer 151 can be received.

[0157] After the wafer 151 has been fully inserted into the loading pins 1030, the robot 910 releases the wafer 151 and the robot 910 retracts from the cleaning module 1000.

[0158] The controller 190 provides instructions to the spray bars 290 to begin the pre-treatment process. Additionally, the controller 190 can receive a flag indicating that the wafer 151 has been inserted into the cleaning module 1000. The flag can be received as sensor data from the sensing device 294.

[0159] At operation 1330 of the method 1300, the cleaning module is placed in a cleaning position. For example, as shown in operation 1332, the cleaning module 1000 can be placed in the cleaning position by moving the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024. The drive motor 222 drives the shaft 224 to retract the first plate assembly 1022 of the clamp assembly 1020, thereby moving the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024. For example, the drive motor 222 can drive the shaft 224 in a lateral or horizontal direction (e.g., the X direction) to move the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024.

[0160] Additionally, as the drive motor 222 moves the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024, the first plate assembly 1022 contacts the second plate assembly 1024, thereby compressing the spring mechanism 1230. Additionally, as the first plate assembly 1022 imparts more force on the second plate assembly 1024 and the spring mechanism 1230 compresses, the assembly 1240 disengages from the stop 1247 and contacts a corresponding one of the actuator pins 1242, thereby placing the clamp pins 1032 in a clamping position. In response, the clamp pins 1032 apply a clamping force or pressure to the wafer 151. By changing the position of the second plate assembly 1024, the amount of clamping force applied by the clamp pins 1032 can be changed.

[0161] The controller 190 can be configured to provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction away from the wall 1013 and toward the second plate assembly 1024, thereby moving the first plate assembly 1022 in the lateral direction toward the second plate assembly 1024 and away from the wall 1013. Once the clamp assembly 1020 has been placed in the retracted position 1200a, a cleaning cycle can be initiated. The controller 190 can receive sensor data from the sensing device 294 indicating that the clamp assembly 1020 is positioned in the retracted position 1200a (e.g., a cleaning position) and initiate a cleaning cycle.

[0162] At operation 1340, the wafer is cleaned. The wafer 151 and the clamp assembly 1020 are placed in a cleaning position such that the wafer 151 and the clamp assembly 1020 rest entirely within the process volume 297. The wafer 151 can be cleaned by the cleaning module 1000. For example, as shown by operation 1342, performing a cleaning cycle can include dispensing a fluid onto a surface of the wafer 151. Additionally, as shown by operation 1344, performing a cleaning cycle includes rotating the wafer 151.

[0163] Further, the position of the wafer 151 within the process volume 297 can change during the cleaning process. For example, one or more of the distance between the second plate assembly 1024 and the access cup 1010 (or the second access cup 1012) and the amount of compression of the spring mechanism 1230 can change, thereby changing the position of the wafer 151 within the process volume 297.

[0164] Cleaning the wafer 151 includes simultaneously rotating the access cup 1010, the clamp assembly 1020, and the wafer 151 while applying a cleaning fluid to the first side (front surface) and the second side (back surface) of the wafer 151. Rotating the access cup 1010, the clamp assembly 1020, and the wafer 151 while applying the cleaning fluid assists in minimizing and / or eliminating the re-attachment of particles to either surface of the wafer 151. For example, the drive motor 222 can be configured to rotate the access cup 1010, the clamp assembly 1020, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the access cup 1010, the clamp assembly 1020, and the wafer 151. The wafer 151 is rotated at a speed in a range of about 500 RPM to about 1000 RPM such that the fluid is removed from the surface of the wafer 151. The wafer 151 can be rotated at less than 500 RPM or greater than about 1000 RPM. Additionally, the rate at which the wafer 151 is rotated can change during the cleaning process. Further, once the wafer clamp 210 has been placed in the cleaning position, a cleaning cycle can be initiated.

[0165] A first cleaning fluid can be applied to a back surface of the wafer 151 (e.g., a surface adjacent to the surface 1101) via the fluid source 223, the shaft 224, and the aperture(s) 1051. Additionally, a second fluid can be applied to a front surface of the wafer 151 (e.g., a surface opposite the surface 1101) via the nozzle mechanism 240. The purge arm drive motor 234 moves the purge arm 230 such that the nozzle mechanism 240 moves in an arcuate path over the front surface of the wafer 151. The nozzle mechanism 240 can be configured to apply a cleaning fluid to the front surface of the wafer 151 during a cleaning process. The fluid can include a cleaning chemical and / or a rinse. In one embodiment, the cleaning fluid can be applied to the front and back surfaces of the wafer 151 substantially simultaneously. Additionally, the cleaning fluid can be applied to the front surface of the wafer 151 independently of the cleaning fluid being applied to the back surface of the wafer 151. For example, during one or more overlapping and non-overlapping time periods, the cleaning fluid can be applied to the back surface of the wafer 151 and the cleaning fluid can be applied to the front surface of the wafer 151. During a first non-overlapping time period, one or more cleaning fluids can be applied to the front surface of the wafer 151 and during a second non-overlapping time period, one or more cleaning fluids can be applied to the back surface of the wafer 151. The overlapping and non-overlapping time periods of the cleaning cycle can occur in any order. Additionally, the number and / or order of the overlapping and non-overlapping time periods can vary between cleaning cycles. Despite being in the cleaning position, at least the cleaning fluid is reduced and in various embodiments eliminated from splashing back onto the wafer 151.

[0166] During at least one of the cleaning process, the loading process, and the unloading process, airflow in the cleaning module 200 mitigates recirculation from occurring, thereby preventing particles from re-attaching to the surface of the wafer 151.

[0167] The controller 190 can receive an indication that the gripper assembly 220 is positioned in the cleaning position. For example, the controller 190 can receive sensor data from the sensing device 294. Additionally, the controller 190 can be configured to control the flow of cleaning fluid through the shaft 224 and the aperture(s) 1051, as well as the motion and control of the fluid through the nozzle mechanism 240. The controller 190 can provide instructions to the purge arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. Additionally, the controller 190 can output instructions to the nozzle mechanism to dispense cleaning fluid from one or more nozzles. Additionally, the controller 190 can control the timing of the nozzles such that cleaning fluid is output at different times. For example, one nozzle can be controlled to begin dispensing cleaning fluid before another nozzle. One or more nozzles can be configured to output cleaning fluid while at least another nozzle does not output cleaning fluid.

[0168] At operation 1350, the cleaned wafer is removed from the cleaning module. Removing the wafer from the cleaning module 1000 includes moving the first plate assembly 1022 of the gripper assembly 1020 away from the second plate assembly 1024 of the gripper assembly 1020 (operation 1352). As the first plate assembly 1022 moves away from the second access cup 1012, the spring mechanism 1230 expands, imparting a force on the second plate assembly 1024. In response, the second plate assembly 1024 moves in the same direction as the first plate assembly 1022 moves, and the force exerted on the assembly 1240 by the actuator pin 1242 decreases. Additionally, as the second plate assembly 1024 moves, the assembly 1240 engages the stop 1247 and moves the gripper pin 1032 into the loading position, releasing the grip of the gripper pin 1032 on the wafer 151 and unloading the wafer 151 onto the loading pin 1030.

[0169] Additionally, removing the wafer 151 from the cleaning module includes stopping the dispensing of cleaning fluid (operation 1354) and stopping the rotation of the wafer (operation 1356).

[0170] At the end of the cleaning cycle, the gripper assembly 1020 is moved into the loading position by driving the motor 222 and the shaft 224. Additionally, the nozzle mechanism 240 can terminate the spraying of fluid, and the nozzle mechanism 240 and the purge arm 230 can be moved away from the access cup 1010 at the end of the cleaning cycle and before moving the first plate assembly 1022, moving the nozzle mechanism 240 and the purge arm 230 away from the path of movement of the first plate assembly 1022. For example, at the end of the cleaning cycle, the nozzle mechanism 240 and the purge arm 230 can be positioned such that they do not interfere with the movement of the gripper assembly 1020 and the robot 910.

[0171] The driving motor 222 and the shaft 224 can be configured to move the first plate assembly 1022 in the lateral direction toward the wall 1013, causing the first plate assembly 1022 to separate from the second plate assembly 1024 and place the gripper pin 1032 in the loading position. Additionally, the wafer 151 moves within the interior volume 295. Furthermore, the spray bar 290 can be engaged to apply fluid to the wafer 151 during the unloading process.

[0172] At the end of the cleaning cycle, the dispensing of cleaning fluid via the shaft 224 and the nozzle mechanism 240 is stopped. The dispensing of cleaning fluid is stopped before moving the first plate assembly 1022 toward the wall 1013. Fluid can continue to be disposed on the back surface of the wafer 151 while the dispensing of fluid to the front surface is stopped.

[0173] Additionally, the wafer 151 can be removed after the gripper assembly 1020 has been placed in the unloading position.

[0174] Figure 14AAn example is shown in which the gripper assembly 1020 is positioned in the unload position such that the robot 910 can remove the wafer 151 from the cleaning module 1000. In one embodiment, the robot 910 can enter the cleaning module through the opening that is not obstructed by the lid 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0175] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction toward the first pick cup 211, thereby moving the first plate assembly 1022 in the lateral direction and toward the wall 1013 to place the gripper assembly 1020 in the unload position such that the robot 910 can remove the cleaned wafer 151 from the cleaning module 1000. Additionally, once the wafer 151 is positioned in the interior volume 295, the controller 190 can provide instructions to the drive motor 222 to stop the rotation of the pick cup 1010 and the gripper assembly 1020. The controller 190 can also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing the cleaning fluid. Additionally, the controller 190 can also provide instructions to the spray bar 290 to begin dispensing the fluid. For example, the controller 190 can instruct the spray bar 290 to begin dispensing the fluid in conjunction with the end of the cleaning cycle when the first plate assembly 1022 begins to move, when the first plate assembly 1022 clears the wall 1013, or at any other point during the unload process.

[0176] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure can be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A cleaning module comprising: a wafer clamping device configured to support a wafer in a vertical orientation, the wafer clamping device comprising: a pick-up cup comprising a wall having an annular inner surface defining a processing region; and a clamp assembly comprising: a first plate assembly comprising a plurality of load pins, each of the plurality of load pins configured to support an edge of a wafer oriented in a vertical orientation; and a second plate assembly comprising a plurality of clamp pins, each of the plurality of clamp pins configured to: based on the second plate assembly being positioned a second distance from the first plate assembly in a horizontal direction, each of the plurality of clamp pins is configured to be positioned at a first distance from a central axis of the wafer clamping device, wherein when each of the plurality of clamp pins is positioned at the first distance from the central axis, each of the plurality of clamp pins is configured to contact an edge of the wafer and hold the wafer in a vertical orientation; based on the second plate assembly being positioned a fourth distance from the first plate assembly in a horizontal direction, each of the plurality of clamp pins is configured to be positioned at a third distance from the central axis, wherein the third distance is greater than the first distance and the fourth distance is greater than the second distance.

2. The cleaning module of claim 1, wherein each of the plurality of clamp pins passes through a respective opening in the first plate assembly.

3. The cleaning module of claim 1, wherein the second plate assembly further comprises one or more features configured to contact the pick-up cup.

4. The cleaning module of claim 3, wherein the one or more features are configured to contact the pick-up cup and stop movement of the second plate assembly relative to movement of the first plate assembly.

5. The cleaning module of claim 3, wherein each of the plurality of clamp pins is coupled to a respective assembly configured to contact the pick-up cup.

6. The cleaning module of claim 1, wherein the first plate assembly is connected to the second plate assembly via one or more spring mechanisms.

7. The cleaning module of claim 1, wherein the second plate assembly is coupled to the pick-up cup via one or more spring mechanisms.

8. The cleaning module of claim 7, wherein the one or more spring mechanisms are configured to: compress based on the first plate assembly being the second distance from the second plate assembly; and expand based on the first plate assembly being the fourth distance from the second plate assembly.

9. The cleaning module of claim 1, wherein: the pick-up cup further comprises a plurality of actuator pins; and each of the plurality of clamp pins is coupled to a respective actuator assembly configured to: engage with a respective one of the plurality of actuator pins; and disengage from a respective one of the plurality of actuator pins.

10. The cleaning module of claim 1, further comprising: a nozzle mechanism coupled to the purge arm, the nozzle mechanism including: a first nozzle oriented at a first angle to a surface of the first plate assembly and configured to provide a high energy fluid to the wafer; and a second nozzle oriented at a second angle to the surface of the first plate assembly, wherein the second angle is different from the first angle and configured to apply a second fluid to the wafer, and wherein the first nozzle is one of a megasonic nozzle and a jetting nozzle configured to deliver a mixture of gas and liquid, and wherein the purge arm is configured to move the nozzle mechanism over at least a portion of the first plate assembly.

11. The cleaning module of claim 1, further comprising a drive motor configured to: impart horizontal motion to at least one of the first plate assembly and the second plate assembly; and simultaneously rotate the gripper assembly, the access cup, and the vertically oriented wafer about the central axis during a cleaning process.

12. The cleaning module of claim 1, wherein the access cup includes: one or more drain holes, wherein the access cup is configured to direct moisture to the one or more drain holes as the access cup is rotated about the central axis, and wherein each of the one or more drain holes is fluidly coupled to an interior region of the cleaning module through a respective air labyrinth shaped to mitigate moisture flow into the interior region. ​

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