A wafer carrier fixture for dry etching of LED chips

Abstract

A wafer carrier jig for dry etching of LED chips relates to the field of semiconductor technology, and comprises a shell mechanism provided with two protection mechanisms, a master control mechanism arranged inside the shell mechanism and used for controlling the operation of the two protection mechanisms, two cooling mechanisms respectively arranged at the lower ends of the two protection mechanisms, and a buffer mechanism for providing helium to the two cooling mechanisms and preventing the wafer from being damaged due to excessive input air pressure; the device can store a carrier inside the device to avoid direct exposure of the carrier, and effectively protect the carrier; the device can lift the carrier out of the device when etching the wafer, and the operation is simple and the practicability is high; the device can evenly and effectively cool the carrier, and improve the utilization rate of the device while ensuring the smooth dry etching of the LED chip.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, and in particular to a wafer carrier for dry etching of LED chips. Background Art

[0002] Dry etching is a technology that uses plasma to etch thin films. When the gas exists in the form of plasma, it has two characteristics: on the one hand, the chemical activity of these gases in the plasma is much stronger than that in normal conditions. According to the different materials to be etched, choosing the right gas can react with the material faster to achieve the purpose of etching and removal; on the other hand, the electric field can be used to guide and accelerate the plasma so that it has a certain amount of energy. When it bombards the surface of the etched object, it will knock out the atoms of the etched material, thereby achieving the purpose of etching by physical energy transfer. Therefore, dry etching is the result of a balance between the physical and chemical processes on the surface of the wafer.

[0003] During the dry etching process, the surface temperature is high, and because photoresist is usually used as a mask for etching, photoresist is easily carbonized and deformed under high temperature conditions, resulting in failure of chip pattern conversion during the manufacturing process, and photoresist is not easy to remove after carbonization. Therefore, the wafer carrier fixture used in dry etching usually needs to consider thermal conductivity and etching resistance. At the same time, the existing wafer carrier fixture has no structure, so it is very easy to cause damage to the equipment under the action of external force, resulting in irreversible consequences.

[0004] To this end, a wafer carrier fixture for dry etching of LED chips is needed. The device can store the carrier into the inside of the device to avoid direct exposure of the carrier and effectively protect the carrier. The device can lift the carrier out of the device when etching the wafer, and the operation is simple and practical. The device can evenly and effectively cool the carrier, thereby improving the utilization rate of the equipment and ensuring the smooth dry etching of the LED chip. Summary of the invention

[0005] In view of the above technical problems, the present invention proposes a wafer carrier fixture for dry etching of LED chips, and the technical solution used is:

[0006] A wafer carrier jig for dry etching of LED chips, comprising a housing mechanism provided with two protection mechanisms, a master control mechanism arranged inside the housing mechanism for controlling the operation of the two protection mechanisms, two cooling mechanisms respectively arranged at the lower ends of the two protection mechanisms, and a buffer mechanism for providing helium to the two cooling mechanisms and preventing the wafer from being damaged due to excessive input gas pressure;

[0007] The housing mechanism comprises: a wafer carrier and a protection box; the wafer carrier is provided with two square holes, and grooves are provided on both sides of the square holes; the protection box is fixedly mounted on the lower end surface of the wafer carrier;

[0008] The protection mechanism comprises: a carrier, a first cover plate and a second cover plate; the carrier is slidably mounted at a square hole on the wafer carrier; the first cover plate and the second cover plate are respectively slidably mounted in grooves on both sides of the square hole, and vertical plates are fixedly mounted on the outer sides of the first cover plate and the second cover plate;

[0009] The general control mechanism includes: a large bracket, a support block I, a push rod, a gear I, a round rod I, a round rod II, a cam, a Z-shaped plate, a support block II, a lever, a Z-shaped frame I, a Z-shaped frame II, a small gear II, a card plate and a card frame; the large bracket is fixedly installed on the lower end surface of the carrier plate; the support block I is fixedly installed on the large bracket; the push rod is slidably installed on the lower end of the support block I, and a rack is fixedly installed on the inner end of the push rod; the shaft of the gear I is rotatably installed in the circular hole between the two vertical plates on the large bracket, and the gear I is intermittently meshed with the rack at the inner end of the push rod; the round rod I is rotatably installed in the circular hole on the rear side plate of the large bracket, and the round rod I is connected to the shaft of the gear I through a synchronous belt; the round rod II is rotatably installed in the circular hole of the vertical plate on the large bracket, and a gear is fixedly installed on the round rod II; there are two cams, and the two cams are respectively fixedly installed at the two ends of the round rod II; there are two Z-shaped plates, and the two Z-shaped plates are respectively fixedly installed on both sides of the large bracket ; There are two support blocks II, and the two support blocks II are fixedly installed on the large bracket respectively; there are two levers, and the intermediate shafts of the two levers are rotatably installed in the circular holes at the lower ends of the two support blocks II, and small rods are fixedly installed at both ends of the levers; one end of the Z-shaped frame I is fixedly installed on the vertical plate outside the first cover plate, and the other end of the Z-shaped frame I is provided with a slot, and the small rod at one end of the lever slides in the slot on the Z-shaped frame I; there are two Z-shaped frames II, and one end of the two Z-shaped frames II is slidably installed on both sides of the push rod respectively, and the other end of the Z-shaped frame II is provided with a slot, and the small rod at the other end of the lever slides in the slot on the Z-shaped frame II; the pinion II is fixedly installed on the side of the push rod, and the pinion II is intermittently meshed with the gear on the round rod II; the card frame is fixedly installed on the lower end surface of the carrier disc, and two inner and outer slots are installed on the card frame; one end of the card plate is rotatably installed in the outer circular hole of the push rod, and the other end of the card plate is intermittently and alternately stuck with the two slots on the card frame;

[0010] The buffer mechanism is fixedly mounted on the lower end surface of the wafer carrier through a rod, and two hollow tubes are fixedly mounted on both sides of the buffer mechanism;

[0011] The cooling mechanism includes: an L-shaped support plate, a cooling rack, a main ventilation rack and a sub-ventilation rack; the L-shaped support plate is fixedly installed on the lower end surface of the carrier plate; there are two cooling racks, and the two cooling racks are spliced ​​into a square rack; the main ventilation rack is fixedly installed on the L-shaped support plate, the interior of the main ventilation rack is a cavity, the main ventilation rack is in a circular ring shape, and the upper end of the main ventilation rack is provided with four centrally symmetrical air outlet holes; there are four sub-ventilation racks, the interiors of the four sub-ventilation racks are hollow, the sub-ventilation racks are in a circular ring shape, the lower end air inlets of the four sub-ventilation racks are respectively fixedly connected to the four air outlet holes on the main ventilation rack, and the upper end of the sub-ventilation rack is provided with two centrally symmetrical air outlet holes, and the air outlet holes at the upper ends of the sub-ventilation racks are respectively connected to the air inlets at the lower ends of the cooling hollow rods on the two groups of cooling racks.

[0012] Preferably, the first cover plate and the second cover plate are made of ceramic material.

[0013] Preferably, two gears are fixedly mounted on both ends of the round rod I.

[0014] Preferably, it is characterized in that a spring is installed on the side of the Z-shaped frame II, and both ends of the spring are connected to the side panels of the push rod.

[0015] Preferably, four cooling hollow rods are fixedly mounted on the cooling rack, an air inlet hole is provided at the center position of the lower end of the cooling hollow rod, and a plurality of small holes are provided at the upper end of the cooling hollow rod.

[0016] Preferably, an inlet ball is fixedly mounted on the lower end of the main ventilation frame, and the inlet ball is fixedly connected to the side hollow tube of the buffer mechanism.

[0017] Preferably, the protection mechanism also includes: a top block and a rack I; the top block is fixedly mounted on the side of the platform, and the lower end of the top block contacts the corresponding cam; the rack I is fixedly mounted on the vertical plate outside the second cover plate, and the rack I is meshed with the gear at the end of the round rod I.

[0018] Preferably, a spring is installed at the upper end of the top block, and the other end of the spring is connected to the lower end surface of the corresponding Z-shaped plate.

[0019] Since the present invention adopts the above technical solution, the present invention has the following advantages:

[0020] 1. The present invention drives the gear I to rotate clockwise through the push rod, and the gear I drives the two racks I to move outward at the same time, and the two racks I drive the two second cover plates to move outward at the same time. At the same time, when the push rod moves inward, the other end of the driving lever drives the Z-shaped frame I corresponding thereto to move outward, and the Z-shaped frame I drives the first cover plate to move outward. At this time, the first cover plate and the second cover plate at the upper end of the carrier are opened at the same time, saving manpower.

[0021] 2. The present invention drives the pinion II to move through the push rod, and the pinion II drives the gear on the round rod II to rotate clockwise, thereby driving the round rod II to rotate clockwise, and the round rod II drives the two cams to rotate clockwise, and the two cams push the two top blocks to move upward at the same time, and the two top blocks respectively drive the two carriers to move upward, so that the two carriers are moved out of the equipment. At this time, the card plate is located at the inner card slot of the card rack, and then the card plate is manually rotated so that the card plate is stuck in the inner card slot of the card rack. In this way, it is convenient to etch the wafer on the carrier.

[0022] 3. The present invention makes the cold zone of the carrier more uniform and further improves the cooling effect of the carrier by first introducing helium into the annular main ventilation rack, then into the annular sub-ventilation rack, and finally inputting helium from the middle position of the lower end of the cooling hollow rod on the cooling rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of the first angle of the overall structure of the present invention.

[0024] Figure 2 It is a schematic structural diagram of the overall structure of the present invention from a second angle.

[0025] Figure 3 It is a schematic diagram of a part of the internal structure of the overall structure of the present invention.

[0026] Figure 4 It is a schematic diagram of the internal structure of the overall structure of the present invention.

[0027] Figure 5 It is a schematic diagram of the protection mechanism of the present invention.

[0028] Figure 6 It is a schematic diagram of the assembly structure of two protection mechanisms and a master control mechanism of the present invention.

[0029] Figure 7 It is a schematic diagram from a first angle showing a partial structure of the assembly structure of the protection mechanism and the master control mechanism of the present invention.

[0030] Figure 8 It is a second angle schematic diagram of a partial structure of the assembly structure of the protection mechanism and the general control mechanism of the present invention.

[0031] Fig. 9 It is a schematic diagram of the assembly structure of the buffer mechanism and two cooling mechanisms of the present invention.

[0032] Fig.10 It is a schematic diagram of the cooling mechanism of the present invention from a first angle.

[0033] Fig.11 It is a second angle schematic diagram of the cooling mechanism of the present invention.

[0034] Figure numbers: 1. Shell mechanism; 2. Protection mechanism; 3. Master control mechanism; 4. Buffer mechanism; 5. Cooling mechanism; 101. Plate; 102. Protection box; 201. Stage; 202. First cover plate; 203. Second cover plate; 204. Top block; 205. Rack I; 301. Large bracket; 302. Support block I; 303. Push rod; 304. Gear I; 305. Round rod I; 306. Round rod II; 307. Cam; 308. Z-shaped plate; 309. Support block II; 310. Lever; 311. Z-shaped frame I; 312. Z-shaped frame II; 313. Pinion II; 314. Card plate; 315. Card frame; 501. L-shaped support plate; 502. Cooling frame; 503. Main ventilation frame; 504. Sub-ventilation frame. DETAILED DESCRIPTION

[0035] The technical solution of the present invention is further specifically described below by way of embodiments and in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0036] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "up", "down", "in", "out", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0037] Example:

[0038] This embodiment is a wafer carrier jig for dry etching of LED chips.

[0039] like Figure 1-Figure 11 As shown, a wafer carrier fixture for dry etching of LED chips comprises a housing mechanism 1 provided with two protection mechanisms 2, a master control mechanism 3 arranged inside the housing mechanism 1 for controlling the operation of the two protection mechanisms 2, two cooling mechanisms 5 respectively arranged at the lower ends of the two protection mechanisms 2, and a buffer mechanism 4 for providing helium to the two cooling mechanisms 5 and preventing the wafer from being damaged due to excessive input gas pressure;

[0040] like Figure 2 As shown, the housing mechanism 1 includes: a wafer carrier 101 and a protection box 102; the wafer carrier 101 is provided with two square holes, and grooves are provided on both sides of the square holes; the protection box 102 is fixedly mounted on the lower end surface of the wafer carrier 101;

[0041] like Figure 5 As shown, the protection mechanism 2 includes: a carrier 201, a first cover plate 202 and a second cover plate 203; the carrier 201 is slidably mounted at a square hole on the wafer carrier plate 101, and the upper end surface of the carrier 201 is used to carry the wafer; the first cover plate 202 and the second cover plate 203 are respectively slidably mounted in the grooves on both sides of the square hole, and the outer sides of the first cover plate 202 and the second cover plate 203 are fixedly mounted with vertical plates, the first cover plate 202 and the second cover plate 203 can be opened at the same time to facilitate the removal of the carrier 201, and the first cover plate 202 and the second cover plate 203 can also be closed at the same time to protect the carrier 201;

[0042] like Figure 6-Figure 8As shown, the master control mechanism 3 includes: a large bracket 301, a support block I 302, a push rod 303, a gear I 304, a round rod I 305, a round rod II 306, a cam 307, a Z-shaped plate 308, a support block II 309, a lever 310, a Z-shaped frame I 311, a Z-shaped frame II 312, a small gear II 313, a clamping plate 314 and a clamping frame 315; the large bracket 301 is fixedly mounted on the lower end surface of the carrier plate 101; the support block I 302 is fixedly mounted on the large bracket 301; the push rod 303 is slidably mounted on the lower end of the support block I 302, and a rack is fixedly mounted on the inner end of the push rod 303; the shaft of the gear I 304 is rotatably mounted in the round hole between the two vertical plates on the large bracket 301, and the gear I 304 and the push rod The rack at the inner end of 303 is intermittently meshed. Specifically, when the rack on the inner side of the push rod 303 moves to mesh with the gear I 304, the rack on the inner side of the push rod 303 drives the gear I 304 to rotate, and the gear I 304 drives the round rod I 305 to rotate; the round rod I 305 is rotatably installed in the round hole on the rear side plate of the large bracket 301, and the shaft of the round rod I 305 and the gear I 304 are connected by a synchronous belt; the round rod II 306 is rotatably installed in the round hole of the vertical plate on the large bracket 301, and a gear is fixedly installed on the round rod II 306; there are two cams 307, and the two cams 307 are respectively fixedly installed at the two ends of the round rod II 306; there are two Z-shaped plates 308, and the two Z-shaped plates 308 are respectively fixedly installed on the two ends of the large bracket 301 side; there are two support blocks II 309, and the two support blocks II 309 are fixedly mounted on the large bracket 301; there are two levers 310, and the intermediate shafts of the two levers 310 are respectively rotatably mounted in the circular holes at the lower ends of the two support blocks II 309, and small rods are respectively fixedly mounted at both ends of the levers 310; one end of the Z-shaped frame I 311 is fixedly mounted on the vertical plate outside the first cover plate 202, and the other end of the Z-shaped frame I 311 is provided with a slot, and the small rod at one end of the lever 310 slides in the slot on the Z-shaped frame I 311; there are two Z-shaped frames II 312, and one end of the two Z-shaped frames II 312 is respectively slidably mounted on both sides of the push rod 303, and the other end of the Z-shaped frame II 312 is provided with a slot, and the small rod at the other end of the lever 310 slides in the slot on the Z-shaped frame I 311. The pinion gear II 313 is fixedly mounted on the side of the push rod 303, and the pinion gear II 313 is intermittently meshed with the gear on the round rod II 306. Specifically, when the pinion gear II 313 moves to mesh with the gear on the round rod II 306, the pinion gear II 313 drives the round rod II 306 to rotate, and the round rod II 306 drives the cams 307 at both ends thereof to rotate; the bracket 315 is fixedly mounted on the lower end surface of the carrier plate 101, and the bracket 315 is provided with two inner and outer slots. In the initial position, the clamping plate 314 is clamped in the outer slot of the bracket 315; one end of the clamping plate 314 is rotatably mounted in the outer circular hole of the push rod 303, and the other end of the clamping plate 314 is intermittently and alternately clamped in the two slots on the bracket 315;

[0043] like Fig. 9As shown, the buffer mechanism 4 is fixedly mounted on the lower end surface of the wafer carrier 101 through a rod, and two hollow tubes are fixedly mounted on both sides of the buffer mechanism 4. The buffer mechanism 4 provides helium to the two cooling mechanisms 5 at the same time, and buffers the air pressure between the main ventilation rack 503 and the four sub-ventilation racks 504 to avoid damage to the wafer due to excessive input air pressure;

[0044] like Fig.10 , Fig.11 As shown, the cooling mechanism 5 includes: an L-shaped support plate 501, a cooling rack 502, a main ventilation rack 503 and a sub-ventilation rack 504; the L-shaped support plate 501 is fixedly installed on the lower end surface of the wafer carrier 101; there are two cooling racks 502, and the two cooling racks 502 are spliced ​​into a square rack; the main ventilation rack 503 is fixedly installed on the L-shaped support plate 501, the main ventilation rack 503 has a cavity inside, the main ventilation rack 503 is annular, and the upper end of the main ventilation rack 503 is provided with four There are four sub-ventilation racks 504, the interior of the four sub-ventilation racks 504 is a cavity, the sub-ventilation racks 504 are circular, the lower air inlets of the four sub-ventilation racks 504 are respectively fixedly connected to the four air outlets on the main air rack 503, and the upper end of the sub-ventilation rack 504 is provided with two centrally symmetrical air outlets, and the air outlets at the upper ends of the sub-ventilation racks 504 are respectively connected to the corresponding air inlets at the lower ends of the cooling hollow rods on the two groups of cooling racks 502; Specifically, helium is introduced into the buffer mechanism 4, and the buffer mechanism 4 evenly introduces helium into the two main ventilation racks 503 through the hollow tubes on both sides. The two main ventilation racks 503 then introduce helium into the four corresponding sub-ventilation racks 504, and the four sub-ventilation racks 504 introduce helium into the cooling hollow rods in the corresponding cooling racks 502. At this time, the helium cools the carrier 201 through the several small holes on the cooling hollow rods, thereby improving the thermal conductivity of the carrier 201. The buffer mechanism 4 can buffer the air pressure of the main ventilation rack 503 and the sub-ventilation rack 504 when the air pressure is relatively high, so as to avoid damage to the wafer due to excessive input air pressure. At the same time, helium is first introduced into the annular main ventilation rack 503, then into the annular sub-ventilation rack 504, and finally helium is input from the middle position of the lower end of the cooling hollow rod on the cooling rack 502, so that the cold zone of the carrier 201 is more uniform, thereby further improving the cooling effect of the carrier 201.

[0045] like Figure 5 As shown, the first cover plate 202 and the second cover plate 203 are made of ceramic material, and ceramic has the characteristics of high temperature resistance and etching resistance.

[0046] like Figure 6 , Figure 7 As shown, two gears are fixedly mounted on both ends of the round rod Ⅰ305.

[0047] like Figure 6-Figure 8As shown, a spring is installed on the side of the Z-shaped frame II 312, and both ends of the spring are connected to the side panels of the push rod 303.

[0048] like Fig.10 As shown, four cooling hollow rods are fixedly installed on the cooling rack 502, an air inlet is provided at the center of the lower end of the cooling hollow rod, and a plurality of small holes are provided at the upper end of the cooling hollow rod. The helium gas entering the cooling hollow rod cools the carrier 201 through the small holes thereon.

[0049] like Fig.11 As shown, an inlet ball is fixedly installed at the lower end of the main ventilation frame 503, and the inlet ball is fixedly connected to the side hollow tube of the buffer mechanism 4.

[0050] like Figure 5 As shown, the protection mechanism 2 also includes: a top block 204 and a rack I 205; the top block 204 is fixedly mounted on the side of the carrier 201, the lower end of the top block 204 contacts the corresponding cam 307, and the top block 204 cooperates with the cam 307 it contacts, that is, the cam 307 rotates to push the top block 204 to move up and down; the rack I 205 is fixedly mounted on the vertical plate outside the second cover plate 203, and the rack I 205 is meshed with the gear at the end of the round rod I 305.

[0051] like Figure 5 As shown, a spring is installed at the upper end of the top block 204 , and the other end of the spring is connected to the lower end surface of the corresponding Z-shaped plate 308 .

[0052] Working principle of this embodiment:

[0053] When the carrier 201 is lifted out of the device, the card plate 314 is first rotated manually to disengage the card plate 314 from the card slot on the outside of the card frame 315. Then, the card plate 314 is pushed inward manually, and the card plate 314 drives the push rod 303 to move inward. At this time, the rack on the inside of the push rod 303 is meshed with the gear I 304, and the push rod 303 drives the gear I 304 to rotate clockwise, and the gear I 304 drives the round rod I 305 to rotate clockwise, and the round rod I 305 drives the two racks I 205 to move outward at the same time, and the two racks I 205 drive the two second cover plates 203 outward at the same time. When the push rod 303 moves inward, the Z-shaped frame II 312 on both sides of the push rod 303 drives one end of the corresponding lever 310 to move inward. At this time, the other end of the lever 310 drives the corresponding Z-shaped frame I 311 to move outward. The Z-shaped frame I 311 drives the first cover plate 202 to move outward. At this time, the first cover plate 202 and the second cover plate 203 at the upper end of the carrier 201 are opened at the same time. When the rack at the inner end of the push rod 303 moves inward to disengage from the gear I 304, the first cover plate 202 and the second cover plate 203 are just opened. The upper end of the corresponding carrier 201 is fully opened, and at this time, the small gear II 313 is just meshed with the gear on the round rod II 306, and the card plate 314 is pushed inwards manually. When the card plate 314 drives the push rod 303 to move inwards, since the first cover plate 202 has been fully opened, it can no longer move outwards. At this time, the push rod 303 moves inwards again, and the spring on the side of the Z-shaped frame II 312 is compressed. In this way, the push rod 303 can still move inwards for a distance. At this time, the push rod 303 drives the small gear II 313 to move, and the small gear II 313 drives the round rod 206. The gear on the rod II 306 rotates clockwise, thereby driving the round rod II 306 to rotate clockwise, and the round rod II 306 drives the two cams 307 to rotate clockwise, and the two cams 307 push the two top blocks 204 to move upward at the same time, and the two top blocks 204 respectively drive the two carriers 201 to move upward, so that the two carriers 201 are moved out of the equipment. At this time, the card plate 314 is located at the inner card slot of the card rack 315, and then the card plate 314 is manually rotated to make the card plate 314 stuck in the inner card slot of the card rack 315, so that it is convenient to etch the wafer on the carrier 201;When the wafer etching is completed, the carrier 201 is moved back to the equipment, and the card plate 314 is manually rotated to disengage the card plate 314 from the inner card slot of the card frame 315, and then the card plate 314 is manually pulled outward, and the card plate 314 drives the push rod 303 to move outward. At this time, the small gear II 313 first drives the gear on the round rod II 306 to rotate counterclockwise to return to its position, and then drives the round rod II 306 to rotate counterclockwise to return to its position, and the round rod II 306 drives the two cams 307 to rotate counterclockwise to return to their positions, and the two cams 307 no longer push The top block 204 moves downward, driving the corresponding carrier 201 to move downward, so that the carrier 201 returns to its original position. When the carrier 201 is completely returned to its original position, the pinion II 313 is no longer meshed with the gear on the round rod II 306. When the push rod 303 still moves outward, the rack at the inner end of the push rod 303 meshes with the gear I 304. At this time, the rack at the inner end of the push rod 303 drives the gear I 304 to rotate counterclockwise, and the gear I 304 drives the round rod I 305 to rotate counterclockwise, and the round rod I 305 drives the gear When the push rod 303 moves outward, the spring on the side of the Z-shaped frame II 312 releases the pressure, and the Z-shaped frame II 312 does not move. When the carrier 201 is completely returned to its original position, the spring on the side of the Z-shaped frame II 312 returns to its initial state and still pulls the push rod 303 outward, the pinion II 313 drives the lever 310 and its corresponding end to move outward, and the other end of the lever 310 drives the corresponding end to move outward. The corresponding Z-shaped frame I 311 moves inward, and the Z-shaped frame I 311 drives the first cover plate 202 to move inward, closing the upper end of the carrier 201. When the first cover plate 202 is completely moved back to its position, the card plate 314 moves to the outer end slot of the card frame 315 again, and then the card plate 314 is manually rotated to make the card plate 314 snap into the outer end slot of the card frame 315 again. At this time, the first cover plate 202 and the second cover plate 203 completely close the upper end of the carrier 201, effectively protecting the carrier 201.

[0054] When the carrier 201 is cooled, helium is introduced into the buffer mechanism 4. The buffer mechanism 4 evenly introduces helium into the two main ventilation racks 503 through the hollow tubes on both sides. The two main ventilation racks 503 introduce helium into the four corresponding sub-ventilation racks 504. The four sub-ventilation racks 504 introduce helium into the cooling hollow rods in the corresponding cooling racks 502. At this time, the helium cools the carrier 201 through the several small holes on the cooling hollow rods, thereby increasing the temperature of the carrier 201. 01 has good thermal conductivity, and the buffer mechanism 4 can play the role of air pressure buffer for the main ventilation frame 503 and the sub-ventilation frame 504 when the air pressure is relatively high, so as to avoid the wafer being damaged due to the excessive input air pressure. At the same time, helium is first introduced into the annular main ventilation frame 503, then into the annular sub-ventilation frame 504, and finally helium is input from the middle position of the lower end of the cooling hollow rod on the cooling frame 502, so that the cold zone of the carrier 201 is more uniform, thereby further improving the cooling effect of the carrier 201.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier fixture for dry etching of LED chips, characterized in that: It comprises a housing structure (1) provided with two protection mechanisms (2), a master control mechanism (3) arranged inside the housing structure (1) and used to control the operation of the two protection mechanisms (2), two cooling mechanisms (5) respectively arranged at the lower ends of the two protection mechanisms (2), and a buffer mechanism (4) for providing helium to the two cooling mechanisms (5) and preventing damage to the wafer due to excessive input gas pressure; The housing mechanism (1) comprises: a wafer carrier (101) and a protective box (102); the wafer carrier (101) is provided with two square holes, and grooves are provided on both sides of the square holes; the protective box (102) is fixedly mounted on the lower end surface of the wafer carrier (101); The protection mechanism (2) comprises: a carrier (201), a first cover plate (202) and a second cover plate (203); the carrier (201) is slidably mounted at a square hole on the wafer carrier (101); the first cover plate (202) and the second cover plate (203) are respectively slidably mounted in grooves on both sides of the square hole, and vertical plates are fixedly mounted on the outer sides of the first cover plate (202) and the second cover plate (203); The protection mechanism (2) further comprises: a top block (204) and a rack I (205); the top block (204) is fixedly mounted on the side of the carrier (201), and the lower end of the top block (204) contacts the corresponding cam (307); the rack I (205) is fixedly mounted on the vertical plate outside the second cover plate (203), and the rack I (205) and the gear at the end of the round rod I (305) are meshed with each other; a spring is mounted on the upper end of the top block (204), and the other end of the spring is connected to the lower end surface of the corresponding Z-shaped plate (308); The master control mechanism (3) comprises: a large bracket (301), a support block I (302), a push rod (303), a gear I (304), a round rod I (305), a round rod II (306), a cam (307), a Z-shaped plate (308), a support block II (309), a lever (310), a Z-shaped frame I (311), a Z-shaped frame II (312), a small gear II (313), a clamping plate (314) and a clamping frame (315); the large bracket (301) is fixedly mounted on the lower end surface of the carrier plate (101); the support block I (302) is fixedly mounted on the large bracket (301); the push rod (303) is slidably mounted on the lower end of the support block I (302); the push rod (303) A rack is fixedly installed at the inner end; the shaft of gear I (304) is rotatably installed in the circular hole between the two vertical plates on the large bracket (301), and gear I (304) is intermittently meshed with the rack at the inner end of the push rod (303); round rod I (305) is rotatably installed in the circular hole on the rear side plate of the large bracket (301), and the shafts of round rod I (305) and gear I (304) are connected through a synchronous belt; round rod II (306) is rotatably installed in the circular hole of the vertical plate on the large bracket (301), and a gear is fixedly installed on round rod II (306); there are two cams (307), and the two cams (307) are respectively fixedly installed at the two ends of round rod II (306); there are two Z-shaped plates (308), and the two The Z-shaped plates (308) are fixedly mounted on both sides of the large bracket (301); there are two support blocks II (309), and the two support blocks II (309) are fixedly mounted on the large bracket (301); there are two levers (310), and the intermediate shafts of the two levers (310) are rotatably mounted in the round holes at the lower ends of the two support blocks II (309), and small rods are fixedly mounted on both ends of the levers (310); one end of the Z-shaped frame I (311) is fixedly mounted on the vertical plate outside the first cover plate (202), and the other end of the Z-shaped frame I (311) is provided with a slot, and the small rod at one end of the lever (310) slides in the slot on the Z-shaped frame I (311); there are two Z-shaped frames II (312), and the two Z One end of the Z-shaped frame II (312) is slidably mounted on both sides of the push rod (303), and the other end of the Z-shaped frame II (312) is provided with a slot, and the small rod at the other end of the lever (310) slides in the slot on the Z-shaped frame II (312); the small gear II (313) is fixedly mounted on the side of the push rod (303), and the small gear II (313) is intermittently meshed with the gear on the round rod II (306); the card frame (315) is fixedly mounted on the lower end surface of the carrier plate (101), and the card frame (315) is provided with two inner and outer slots; one end of the card plate (314) is axially rotatably mounted in the outer end circular hole of the push rod (303), and the other end of the card plate (314) is intermittently and alternately locked with the two slots on the card frame (315); The buffer mechanism (4) is fixedly mounted on the lower end surface of the wafer carrier (101) via a rod, and two hollow tubes are fixedly mounted on both sides of the buffer mechanism (4); The cooling mechanism (5) comprises: an L-shaped support plate (501), a cooling rack (502), a main ventilation rack (503) and a sub-ventilation rack (504); the L-shaped support plate (501) is fixedly mounted on the lower end surface of the wafer carrier (101); there are two cooling racks (502), and the two cooling racks (502) are spliced ​​into a square rack; the main ventilation rack (503) is fixedly mounted on the L-shaped support plate (501), the interior of the main ventilation rack (503) is a cavity, the main ventilation rack (503) is in the shape of a circular ring, and the main ventilation rack (50 3) is provided with four centrally symmetrical air outlet holes at the upper end; there are four sub-ventilation racks (504), the interiors of the four sub-ventilation racks (504) are cavities, the sub-ventilation racks (504) are circular, the air inlets at the lower ends of the four sub-ventilation racks (504) are respectively fixedly connected to the four air outlet holes on the main ventilation rack (503), and two centrally symmetrical air outlet holes are provided at the upper end of the sub-ventilation racks (504), and the air outlet holes at the upper ends of the sub-ventilation racks (504) are respectively connected to the air inlet holes at the lower ends of the cooling hollow rods on the two groups of cooling racks (502).

2. A wafer carrier jig for dry etching of LED chips according to claim 1, characterized in that: The first cover plate (202) and the second cover plate (203) are made of ceramic material.

3. The wafer carrier jig for dry etching of LED chips according to claim 1, characterized in that: Two gears are fixedly mounted on both ends of the round rod I (305).

4. The wafer carrier jig for dry etching of LED chips according to claim 1, characterized in that: A spring is installed on the side of the Z-shaped frame II (312), and both ends of the spring are connected to the side panels of the push rod (303).

5. The wafer carrier jig for dry etching of LED chips according to claim 1, characterized in that: Four cooling hollow rods are fixedly mounted on the cooling rack (502), an air inlet hole is arranged at the center of the lower end of the cooling hollow rod, and a plurality of small holes are arranged at the upper end of the cooling hollow rod.

6. The wafer carrier jig for dry etching of LED chips according to claim 1, characterized in that: An inlet ball is fixedly mounted on the lower end of the main ventilation frame (503), and the inlet ball is fixedly connected to the hollow tube on the side of the buffer mechanism (4).

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