Packaging structure and forming method thereof

Abstract

The invention discloses a packaging structure and a forming method thereof, and the packaging structure comprises a micro-channel layer which is internally provided with a liquid channel; the chip structure is positioned on the micro-channel layer and is electrically connected with the micro-channel layer; the packaging layer is located on the micro-channel and covers the chip structure, a liquid inlet groove and a liquid outlet groove are formed in the packaging layer, and the liquid inlet groove and the liquid outlet groove are communicated with the liquid channel; the first cover plate is located on the packaging layer, the first cover plate is provided with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is communicated with the liquid inlet groove, and the liquid outlet pipe is communicated with the liquid outlet groove; and the first underfill is located between the first cover plate and the packaging layer. The additionally arranged first cover plate provides the liquid inlet pipe and the liquid outlet pipe which can be conveniently butted, the sealing connection between the first cover plate and the packaging layer can be ensured through the first underfill, and the sealing connection provided by the first underfill can meet the long-term use reliability requirement.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a packaging structure and a forming method thereof. Background Art

[0002] The packaging process of integrated circuits is an essential step in the process of converting integrated circuit chips into practical electronic products. It plays the role of interconnecting electronic modules, mechanical support, and protection, and can significantly improve the reliability of chips. For integrated circuit packaging systems with high performance requirements, flip-chip packaging has begun to become the mainstream method for high-density integrated circuit packaging; at the same time, the emergence of three-dimensional packaging also provides the possibility for higher-density electronic packaging.

[0003] However, the packaging structure in the prior art still has many problems. Summary of the invention

[0004] The technical problem solved by the present invention is to provide a packaging structure and a forming method thereof, so that the sealing performance can meet the long-term use reliability requirements.

[0005] To solve the above problems, the present invention provides a packaging structure, including: a microfluidic layer, wherein the microfluidic layer has a liquid flow channel; at least one chip structure, wherein the chip structure is located on the microfluidic layer and electrically connected to the microfluidic layer; an encapsulation layer, wherein the encapsulation layer is located on the microfluidic channel and covers the chip structure, wherein the encapsulation layer has a liquid inlet groove and a liquid outlet groove, wherein the liquid inlet groove and the liquid outlet groove are respectively connected to the liquid flow channel; a first cover plate, wherein the first cover plate is located on the encapsulation layer, wherein the first cover plate has a liquid inlet pipe and a liquid outlet pipe, wherein the liquid inlet pipe is connected to the liquid inlet groove, and wherein the liquid outlet pipe is connected to the liquid outlet groove; and a first bottom filler, wherein the first bottom filler is located between the first cover plate and the packaging layer.

[0006] Optionally, a surface of the first cover plate facing the packaging layer has a plurality of first protrusions, and first gaps are provided between adjacent first protrusions.

[0007] Optionally, the first underfill fills up all of the first gaps.

[0008] Optionally, it also includes: a driving substrate, the microfluidic layer is located on the driving substrate and is electrically connected to the driving substrate; a reinforcement ring, the reinforcement ring is located on the driving substrate, and the reinforcement ring surrounds the microfluidic layer, the chip structure, the packaging layer and the first cover plate.

[0009] Optionally, it also includes: a second cover plate, the second cover plate is located on the reinforcement ring, the second cover plate and the reinforcement ring form a filling cavity, the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate pass through the second cover plate and extend to the outside of the filling cavity.

[0010] Optionally, a surface of the second cover plate facing the drive substrate has a plurality of second protrusions, and second gaps are provided between adjacent second protrusions.

[0011] Optionally, the method further includes: a second underfill, wherein the second underfill completely fills the filling cavity and each of the second gaps.

[0012] Optionally, it also includes: a liquid inlet joint, which is detachably connected to the liquid inlet pipe; and a liquid outlet joint, which is detachably connected to the liquid outlet pipe.

[0013] Optionally, the second bottom filler also fills up the gap between the liquid inlet joint and the liquid inlet pipe, and the gap between the liquid outlet joint and the liquid outlet pipe.

[0014] Optionally, the liquid inlet joint and the liquid inlet pipe, and the liquid outlet joint and the liquid outlet pipe are connected by bolts.

[0015] Optionally, the material of the first cover plate includes: metal material.

[0016] Optionally, the material of the second cover plate includes: metal material.

[0017] Correspondingly, the technical solution of the present invention also provides a method for forming a packaging structure, comprising: forming a microfluidic layer, wherein the microfluidic layer has a liquid flow channel; providing at least one chip structure, and bonding the chip structure to the microfluidic layer; forming a packaging layer on the microfluidic layer, wherein the packaging layer covers the chip structure; grooving the packaging layer, and forming a liquid inlet groove and a liquid outlet groove in the packaging layer, wherein the liquid inlet groove and the liquid outlet groove are respectively connected to the liquid flow channel; forming a first cover plate, wherein the first cover plate has a liquid inlet pipe and a liquid outlet pipe; assembling the first cover plate on the packaging layer, wherein the liquid inlet pipe is connected to the liquid inlet groove, and the liquid outlet pipe is connected to the liquid outlet groove; and injecting a first bottom filling glue, wherein the first bottom filling glue is injected between the first cover plate and the packaging layer.

[0018] Optionally, a surface of the first cover plate facing the packaging layer has a plurality of first protrusions, and first gaps are provided between adjacent first protrusions.

[0019] Optionally, the first underfill fills up all of the first gaps.

[0020] Optionally, before the packaging layer is grooved, the method further includes: providing a driving substrate; bonding the microfluidic layer to the driving substrate; and bonding a reinforcement ring to the driving substrate, wherein the reinforcement ring surrounds the microfluidic layer, the chip structure, the packaging layer and the first cover plate.

[0021] Optionally, after assembling the first cover plate on the packaging layer, it also includes: forming a second cover plate; bonding the second cover plate to the reinforcement ring, the second cover plate and the reinforcement ring form a filling cavity, the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate pass through the second cover plate and extend to the outside of the filling cavity.

[0022] Optionally, a surface of the second cover plate facing the drive substrate has a plurality of second protrusions, and second gaps are provided between adjacent second protrusions.

[0023] Optionally, after bonding the second cover plate, the method further includes: injecting a second underfill glue, wherein the second underfill glue completely fills the filling cavity and each of the second gaps.

[0024] Optionally, the second cover plate has a glue inlet hole and a glue outlet hole; the method of injecting the second bottom filling glue includes: injecting the second bottom filling glue into the filling cavity through the glue inlet hole until the second bottom filling glue overflows from the glue outlet hole.

[0025] Optionally, before injecting the second bottom filling glue, the method further includes: providing a liquid inlet joint and a liquid outlet joint; detachably connecting the liquid inlet joint to the liquid inlet pipe, and detachably connecting the liquid outlet joint to the liquid outlet pipe.

[0026] Optionally, the second bottom filler also fills up the gap between the liquid inlet joint and the liquid inlet pipe, and the gap between the liquid outlet joint and the liquid outlet pipe.

[0027] Optionally, the liquid inlet joint and the liquid inlet pipe, and the liquid outlet joint and the liquid outlet pipe are connected by bolts.

[0028] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0029] In the packaging structure of the technical solution of the present invention, it includes: a first cover plate, the first cover plate is located on the packaging layer, the first cover plate has a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is connected to the liquid inlet groove, and the liquid outlet pipe is connected to the liquid outlet groove; a first bottom filler, the first bottom filler is located between the first cover plate and the packaging layer. The added first cover plate provides the liquid inlet pipe and the liquid outlet pipe for convenient docking, and the first bottom filler can ensure the sealed connection between the first cover plate and the packaging layer, and the sealed connection provided by the first bottom filler can meet the long-term use reliability requirements.

[0030] Furthermore, the surface of the first cover plate facing the encapsulation layer has a plurality of first protrusions, and there are first gaps between adjacent first protrusions; the first underfill fills up each of the first gaps. By forming a plurality of tiny first gaps on the surface of the first cover plate facing the encapsulation layer, the first underfill can be adsorbed and filled in each of the first gaps by utilizing the capillary effect, thereby increasing the bonding effect between the first cover plate and the encapsulation layer, and further improving the sealing between the first cover plate and the encapsulation layer.

[0031] Furthermore, it also includes: a second cover plate, the second cover plate is located on the reinforcement ring, the second cover plate and the reinforcement ring form a filling cavity, the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate pass through the second cover plate and extend to the outside of the filling cavity. By adding the second cover plate, the overall mechanical strength of the packaging structure can be further improved.

[0032] Furthermore, the surface of the second cover plate facing the drive substrate has a plurality of second protrusions, and there are second gaps between adjacent second protrusions; the second underfill fills the filling cavity and each of the second gaps. By forming a plurality of tiny second gaps on the surface of the second cover plate facing the drive substrate, the second underfill can be adsorbed and filled in each of the second gaps by utilizing the capillary effect, thereby increasing the bonding effect between the second cover plate and the first cover plate. Moreover, the filling cavity is filled with the second underfill, which can further increase the overall mechanical strength and sealing of the packaging structure.

[0033] Furthermore, the second bottom filler also fills the gaps between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe, so as to further increase the sealing performance between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe.

[0034] In the method for forming the packaging structure of the technical solution of the present invention, the first cover plate is assembled on the packaging layer, the liquid inlet pipe is connected to the liquid inlet groove, and the liquid outlet pipe is connected to the liquid outlet groove; the first bottom filler is injected, and the first bottom filler is injected between the first cover plate and the packaging layer. The additional first cover plate provides the liquid inlet pipe and the liquid outlet pipe for convenient docking, and the first bottom filler can ensure the sealed connection between the first cover plate and the packaging layer, and the sealed connection provided by the first bottom filler can meet the long-term use reliability requirements.

[0035] Furthermore, the surface of the first cover plate facing the encapsulation layer has a plurality of first protrusions, and there are first gaps between adjacent first protrusions; the first underfill fills up each of the first gaps. By forming a plurality of tiny first gaps on the surface of the first cover plate facing the encapsulation layer, the first underfill can be adsorbed and filled in each of the first gaps by utilizing the capillary effect, thereby increasing the bonding effect between the first cover plate and the encapsulation layer, and further improving the sealing between the first cover plate and the encapsulation layer.

[0036] Furthermore, after assembling the first cover plate on the packaging layer, the method further includes: forming a second cover plate; bonding the second cover plate to the reinforcement ring, wherein the second cover plate and the reinforcement ring form a filling cavity, wherein the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate penetrate the second cover plate and extend to the outside of the filling cavity. By adding the second cover plate, the overall mechanical strength of the packaging structure can be further improved.

[0037] Furthermore, the surface of the second cover plate facing the drive substrate has a plurality of second protrusions, and there are second gaps between adjacent second protrusions; the second underfill fills the filling cavity and each of the second gaps. By forming a plurality of tiny second gaps on the surface of the second cover plate facing the drive substrate, the second underfill can be adsorbed and filled in each of the second gaps by utilizing the capillary effect, thereby increasing the bonding effect between the second cover plate and the first cover plate. Moreover, the filling cavity is filled with the second underfill, which can further increase the overall mechanical strength and sealing of the packaging structure.

[0038] Furthermore, the second bottom filler also fills the gaps between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe, so as to further increase the sealing performance between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figures 1 to 9It is a structural schematic diagram of each step of the method for forming a packaging structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] As described in the background art, there are still many problems with the packaging structure in the prior art, which will be described in detail below with reference to the accompanying drawings.

[0041] As the integration of chips becomes higher and higher, the heat generated also increases. Traditional air cooling methods can no longer meet the needs of efficient heat dissipation. Therefore, microchannel liquid cooling technology came into being. This heat dissipation technology uses liquid (usually water or special coolant) to flow through tiny channels on the surface of the chip to remove heat.

[0042] However, currently, the inlet and outlet pipes and the inlet and outlet of the microchannel are temporarily sealed by gluing or rubber gaskets, and such sealing cannot meet the reliability requirements for long-term use.

[0043] On this basis, the present invention provides a packaging structure and a method for forming the same, wherein the added first cover plate provides the liquid inlet pipe and the liquid outlet pipe that can be conveniently connected, and the first bottom filling glue can ensure the sealed connection between the first cover plate and the packaging layer, and the sealed connection provided by the first bottom filling glue can meet the long-term use reliability requirements.

[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0045] Figures 1 to 9 It is a structural schematic diagram of each step of the method for forming a packaging structure in an embodiment of the present invention.

[0046] Please refer to Figure 1 , forming a microfluidic layer 100, wherein the microfluidic layer 100 has a liquid flow channel 101; providing at least one chip structure 102, and bonding the chip structure 102 to the microfluidic layer 102; forming a packaging layer 103 on the microfluidic layer 100, and the packaging layer 103 covers the chip structure 102.

[0047] It should be noted that the microfluidic layer 100 not only provides the liquid channel 101 for the circulation of the coolant, but it itself should be a chip, the main function of which is to connect the chip structure 102 and realize high-speed, short-distance communication through vertical interconnection.

[0048] In this embodiment, the material of the micro-channel layer 100 is silicon.

[0049] In this embodiment, the material of the encapsulation layer 103 is epoxy molding compound. It is a commonly used semiconductor encapsulation material, mainly used to protect the chip structure 102 from physical damage, chemical corrosion and environmental factors, and also helps to improve the reliability and stability of the device. The encapsulation layer 103 is formed by heating materials such as epoxy resin to a molten state, then injecting them into a mold, and cooling and solidifying them.

[0050] In this embodiment, the number of the chip structure 102 is one.

[0051] In other embodiments, there may be more than one chip structure 102 .

[0052] Please continue to refer to Figure 1 After forming the packaging layer 103, providing a driving substrate 104; bonding the microfluidic layer 100 to the driving substrate 104; adhering a reinforcement ring 105 on the driving substrate 104, the reinforcement ring 105 surrounds the microfluidic layer 100, the chip structure 102 and the packaging layer 103.

[0053] In this embodiment, the reinforcing ring 105 mainly functions to increase the mechanical strength of the packaging structure and to suppress the warping phenomenon that occurs during packaging.

[0054] In this embodiment, before bonding the reinforcement ring 105, an adhesive layer 106 is formed on the driving substrate 104, and the adhesive layer 106 is used to bond the chip structure 102 and the microfluidic layer 100, thereby increasing the bonding between the chip structure 102 and the microfluidic layer 100, and can also cover and protect the bonding bumps between the microfluidic layer 100 and the chip structure 102.

[0055] Please refer to Figure 2 The encapsulation layer 103 is grooved to form a liquid inlet groove 107 and a liquid outlet groove 108 in the encapsulation layer 103 , and the liquid inlet groove 107 and the liquid outlet groove 108 are respectively connected to the liquid flow channel 101 .

[0056] In this embodiment, the encapsulation layer 103 may be grooved using a laser groove technology.

[0057] In this embodiment, the tops of the liquid inlet groove 107 and the liquid outlet groove 108 are stepped, and the stepped shape facilitates docking with the liquid inlet pipe and the liquid outlet pipe of the first cover plate provided subsequently.

[0058] Please refer to Figure 3 , forming a first cover plate 109 , wherein the first cover plate 109 has a liquid inlet pipe 110 and a liquid outlet pipe 111 .

[0059] In this embodiment, the first cover plate 109 is made of metal material, specifically carbon steel, copper, stainless steel, aluminum alloy or titanium. The first cover plate 109 is made of metal material, so that it has good mechanical strength.

[0060] Please refer to Figure 4 , the first cover plate 109 is assembled on the packaging layer 103 , the liquid inlet pipe 110 is connected to the liquid inlet groove 107 , and the liquid outlet pipe 111 is connected to the liquid outlet groove 108 .

[0061] In this embodiment, the shapes and sizes of the liquid inlet pipe 110 and the liquid outlet pipe 111 are adapted to the stepped shapes and sizes of the tops of the liquid inlet groove 107 and the liquid outlet groove 108 .

[0062] In this embodiment, a surface of the first cover plate 109 facing the packaging layer 103 has a plurality of first protrusions 112 , and first gaps (not shown) are formed between adjacent first protrusions 112 .

[0063] In this embodiment, the reinforcement ring 105 also surrounds the first cover plate 109 .

[0064] Please refer to Figure 5 , injecting a first underfill 113 , wherein the first underfill 113 is injected between the first cover plate 109 and the encapsulation layer 103 .

[0065] The added first cover plate 109 provides the liquid inlet pipe 110 and the liquid outlet pipe 111 for convenient docking, and the first bottom filling glue 113 can ensure the sealed connection between the first cover plate 109 and the packaging layer 103, and the sealed connection provided by the first bottom filling glue 113 can meet the long-term use reliability requirements.

[0066] In this embodiment, each of the first gaps is filled with the first underfill 113. By forming a plurality of tiny first gaps on the surface of the first cover plate 109 facing the encapsulation layer 103, the first underfill 113 can be adsorbed and filled in each of the first gaps by utilizing the capillary effect, thereby increasing the bonding effect between the first cover plate 109 and the encapsulation layer 103, and further improving the sealing between the first cover plate 109 and the encapsulation layer 103.

[0067] It should be noted that, in this embodiment, before injecting the first bottom filler 113, it is necessary to use a curing glue (not shown) to temporarily fix the first cover plate 109 and the encapsulation layer 103 to prevent the first cover plate 109 from moving when the first bottom filler 113 is injected, thereby affecting the injection effect. The curing glue does not need to be applied more, and it only needs to be applied at the position where the first cover plate 109 and the encapsulation layer 103 are connected to achieve a temporary fixing effect. Commonly used curing glues include UV curing glue, thermal curing glue, two-component curing glue, light-curing polymers (such as PDMS) and epoxy resins.

[0068] Please refer to Figure 6 and Figure 7 , Figure 7 yes Figure 6 The top view of the second cover plate in the figure shows that after the first cover plate 109 is assembled on the packaging layer 103, the second cover plate 114 is formed; the second cover plate 114 is bonded to the reinforcement ring 105, and the second cover plate 114 and the reinforcement ring 105 form a filling cavity 115, the microfluidic layer 100, the chip structure 102, the packaging layer 103 and the first cover plate 109 are located in the filling cavity 115, and the liquid inlet pipe 110 and the liquid outlet pipe 111 of the first cover plate 109 pass through the second cover plate 114 and extend to the outside of the filling cavity 115.

[0069] The overall mechanical strength of the packaging structure can be further improved by adding the second cover plate 114 .

[0070] In this embodiment, the second cover plate 114 is made of metal material, specifically carbon steel, copper, stainless steel, aluminum alloy or titanium. The second cover plate 114 is made of metal material, so that it has good mechanical strength.

[0071] Please continue to refer to Figure 7 In this embodiment, a liquid inlet through hole 116 and a liquid outlet through hole 117 are formed on the second cover plate 114. The liquid inlet pipe 110 of the first cover plate 109 passes through the second cover plate 114 through the liquid inlet through hole 116, and the liquid outlet pipe 111 of the first cover plate 109 passes through the second cover plate 114 through the liquid outlet through hole 117.

[0072] In this embodiment, a surface of the second cover plate 114 facing the driving substrate 104 has a plurality of second protrusions 118 , and second gaps (not marked) are formed between adjacent second protrusions 118 .

[0073] Please refer to Figure 8After bonding the second cover plate 114 , a liquid inlet connector 119 and a liquid outlet connector 120 are provided; the liquid inlet connector 119 is detachably connected to the liquid inlet pipe 110 , and the liquid outlet connector 120 is detachably connected to the liquid outlet pipe 111 .

[0074] In this embodiment, the liquid inlet connector 119 and the liquid outlet connector 120 facilitate the connection between the pipeline of the external cooling liquid supply system and the packaging structure.

[0075] In this embodiment, the liquid inlet joint 119 and the liquid inlet pipe 110 , as well as the liquid outlet joint 120 and the liquid outlet pipe 111 are connected by bolts 121 .

[0076] In this embodiment, the liquid inlet joint 119 and the liquid outlet joint 120 have sealing rings 122, and the sealing rings 122 are respectively fitted onto the outside of the liquid inlet pipe 110 and the liquid outlet pipe 111 that are connected to each other. Therefore, there is a gap (not marked) between the outer wall of the liquid inlet pipe 110 and the inner wall of the liquid inlet joint 119, and between the outer wall of the liquid outlet pipe 111 and the inner wall of the liquid outlet joint 120.

[0077] Please refer to Fig. 9 After the liquid inlet joint 119 is detachably connected to the liquid inlet pipe 110 and the liquid outlet joint 120 is detachably connected to the liquid outlet pipe 111, a second bottom filling glue 125 is injected, and the second bottom filling glue 125 fills the filling cavity 115 and each of the second gaps.

[0078] By forming a plurality of tiny second gaps on the surface of the second cover plate 114 facing the driving substrate 104, the second underfill 125 can be adsorbed and filled in each of the second gaps by utilizing the capillary effect, thereby increasing the bonding effect between the second cover plate 114 and the first cover plate 109. Moreover, when the filling cavity 115 is filled with the second underfill 125, the overall mechanical strength and sealing of the packaging structure can be further increased.

[0079] Please continue to refer to Figure 7 In this embodiment, the second cover plate 114 has a glue inlet hole 123 and a glue outlet hole 124; the method of injecting the second bottom filling glue 125 includes: injecting the second bottom filling glue 125 into the filling cavity 115 from the glue inlet hole 123 until the second bottom filling glue 125 overflows from the glue outlet hole 124.

[0080] In this embodiment, the second bottom filler 125 also fills the gaps between the liquid inlet joint 119 and the liquid inlet pipe 110, and between the liquid outlet joint 120 and the liquid outlet pipe 111. This can further increase the sealing performance between the liquid inlet joint 119 and the liquid inlet pipe 110, and between the liquid outlet joint 120 and the liquid outlet pipe 111.

[0081] Accordingly, a packaging structure is also provided in the embodiment of the present invention, please continue to refer to Fig. 9 , comprising: a microfluidic layer 100, wherein the microfluidic layer 100 has a liquid flow channel 101; at least one chip structure 102, wherein the chip structure 102 is located on the microfluidic layer 100 and is electrically connected to the microfluidic layer 100; an encapsulation layer 103, wherein the encapsulation layer 103 is located on the microfluidic channel and covers the chip structure 102, wherein the encapsulation layer 103 has a liquid inlet groove 107 and a liquid outlet groove 108, wherein the liquid inlet groove 107 and the liquid outlet groove 108 are provided. The grooves 108 are respectively connected to the liquid flow channels 101; a first cover plate 109, the first cover plate 109 is located on the packaging layer 103, the first cover plate 109 has a liquid inlet pipe 110 and a liquid outlet pipe 111, the liquid inlet pipe 110 is connected to the liquid inlet groove 107, and the liquid outlet pipe 111 is connected to the liquid outlet groove 108; a first bottom filling glue 113, the first bottom filling glue 113 is located between the first cover plate 109 and the packaging layer 103.

[0082] The added first cover plate 109 provides the liquid inlet pipe 110 and the liquid outlet pipe 111 for convenient docking, and the first bottom filling glue 113 can ensure the sealed connection between the first cover plate 109 and the packaging layer 103, and the sealed connection provided by the first bottom filling glue 113 can meet the long-term use reliability requirements.

[0083] In this embodiment, the surface of the first cover plate 109 facing the encapsulation layer 103 has a plurality of first protrusions 112, and a first gap is formed between adjacent first protrusions 112; each of the first gaps is filled with the first underfill 113. By forming a plurality of tiny first gaps on the surface of the first cover plate 109 facing the encapsulation layer 103, the first underfill 113 can be adsorbed and filled in each of the first gaps by utilizing the capillary effect, thereby increasing the bonding effect between the first cover plate 109 and the encapsulation layer 103, and further improving the sealing between the first cover plate 109 and the encapsulation layer 103.

[0084] In this embodiment, it also includes: a driving substrate 104, the microfluidic layer 100 is located on the driving substrate 104 and is electrically connected to the driving substrate 104; a reinforcement ring 105, the reinforcement ring 105 is located on the driving substrate 104, and the reinforcement ring 105 surrounds the microfluidic layer 100, the chip structure 102, the packaging layer 103 and the first cover plate 109.

[0085] In this embodiment, it also includes: a second cover plate 114, the second cover plate 114 is located on the reinforcement ring 105, the second cover plate 114 and the reinforcement ring 105 form a filling cavity 115, the microfluidic layer 100, the chip structure 102, the packaging layer 103 and the first cover plate 109 are located in the filling cavity 115, and the liquid inlet pipe 110 and the liquid outlet pipe 111 of the first cover plate 109 penetrate the second cover plate 114 and extend to the outside of the filling cavity 115. By adding the second cover plate 114, the overall mechanical strength of the packaging structure can be further improved.

[0086] In this embodiment, the surface of the second cover plate 114 facing the drive substrate 104 has a plurality of second protrusions 118, and a second gap is formed between adjacent second protrusions 118; the packaging structure further includes: a second bottom filler 125, and the second bottom filler 125 fills the filling cavity 115 and each of the second gaps. By forming a plurality of tiny second gaps on the surface of the second cover plate 114 facing the drive substrate 104, the second bottom filler 125 can be adsorbed and filled in each of the second gaps by using the capillary effect, thereby increasing the bonding effect between the second cover plate 114 and the first cover plate 109. Moreover, the filling cavity 115 is filled with the second bottom filler 125, which can further increase the overall mechanical strength and sealing of the packaging structure.

[0087] In this embodiment, it also includes: a liquid inlet joint 119, which is detachably connected to the liquid inlet pipe 110; and a liquid outlet joint 120, which is detachably connected to the liquid outlet pipe 111.

[0088] In this embodiment, the second bottom filler 125 also fills the gaps between the liquid inlet joint 119 and the liquid inlet pipe 110, and between the liquid outlet joint 120 and the liquid outlet pipe 111. This can further increase the sealing performance between the liquid inlet joint 119 and the liquid inlet pipe 110, and between the liquid outlet joint 120 and the liquid outlet pipe 111.

[0089] In this embodiment, the liquid inlet joint 119 and the liquid inlet pipe 110 , as well as the liquid outlet joint 120 and the liquid outlet pipe 111 are connected by bolts 121 .

[0090] In this embodiment, the first cover plate 109 is made of metal material, specifically carbon steel, copper, stainless steel, aluminum alloy or titanium. The first cover plate 109 is made of metal material, so that it has good mechanical strength.

[0091] In this embodiment, the second cover plate 114 is made of metal material, specifically carbon steel, copper, stainless steel, aluminum alloy or titanium. The second cover plate 114 is made of metal material, so that it has good mechanical strength.

[0092] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A packaging structure, characterized in that: include: A microfluidic channel layer, wherein the microfluidic channel layer has a liquid flow channel; at least one chip structure, the chip structure being located on the microfluidic layer and electrically connected to the microfluidic layer; An encapsulation layer, the encapsulation layer is located on the microfluidic channel and covers the chip structure, the encapsulation layer has a liquid inlet groove and a liquid outlet groove, the liquid inlet groove and the liquid outlet groove are respectively connected to the liquid flow channel; A first cover plate, the first cover plate is located on the packaging layer, the first cover plate has a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is connected to the liquid inlet groove, and the liquid outlet pipe is connected to the liquid outlet groove; A first underfill is located between the first cover plate and the packaging layer.

2. The packaging structure according to claim 1, characterized in that: The surface of the first cover plate facing the packaging layer has a plurality of first protrusions, and first gaps are formed between adjacent first protrusions.

3. The packaging structure according to claim 2, characterized in that: The first underfill fills up each of the first gaps.

4. The packaging structure according to claim 1, characterized in that: Also includes: A driving substrate, wherein the microfluidic layer is located on the driving substrate and is electrically connected to the driving substrate; A reinforcement ring is located on the driving substrate and surrounds the microfluidic layer, the chip structure, the packaging layer and the first cover plate.

5. The packaging structure according to claim 4, characterized in that: Also includes: A second cover plate, wherein the second cover plate is located on the reinforcement ring, the second cover plate and the reinforcement ring form a filling cavity, the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate pass through the second cover plate and extend to the outside of the filling cavity.

6. The packaging structure according to claim 5, characterized in that: The surface of the second cover plate facing the driving substrate has a plurality of second protrusions, and second gaps are formed between adjacent second protrusions.

7. The packaging structure according to claim 6, characterized in that: Also includes: A second underfill is used to fill the filling cavity and each of the second gaps.

8. The packaging structure according to claim 7, characterized in that: Also includes: A liquid inlet joint, the liquid inlet joint is detachably connected to the liquid inlet pipe; a liquid outlet joint, the liquid outlet joint is detachably connected to the liquid outlet pipe.

9. The packaging structure according to claim 8, characterized in that: The second bottom filler also fills up the gaps between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe.

10. The packaging structure according to claim 8, characterized in that: The liquid inlet joint and the liquid inlet pipe, as well as the liquid outlet joint and the liquid outlet pipe are connected by bolts.

11. The packaging structure according to claim 1, characterized in that: The material of the first cover plate includes: metal material.

12. The packaging structure according to claim 5, characterized in that: The material of the second cover plate includes: metal material.

13. A method for forming a packaging structure, characterized in that: include: forming a microfluidic channel layer, wherein the microfluidic channel layer has a liquid flow channel; Providing at least one chip structure, and bonding the chip structure to the microfluidic layer; forming a packaging layer on the microfluidic layer, wherein the packaging layer covers the chip structure; Performing a groove process on the encapsulation layer to form a liquid inlet groove and a liquid outlet groove in the encapsulation layer, wherein the liquid inlet groove and the liquid outlet groove are respectively connected to the liquid flow channel; forming a first cover plate, wherein the first cover plate has a liquid inlet pipe and a liquid outlet pipe; The first cover plate is assembled on the packaging layer, the liquid inlet pipe is connected to the liquid inlet groove, and the liquid outlet pipe is connected to the liquid outlet groove; A first underfill is injected, wherein the first underfill is injected between the first cover plate and the packaging layer.

14. The method for forming a package structure according to claim 13, wherein: The surface of the first cover plate facing the packaging layer has a plurality of first protrusions, and first gaps are formed between adjacent first protrusions.

15. The method for forming a package structure according to claim 14, wherein: The first underfill fills up each of the first gaps.

16. The method for forming a package structure according to claim 13, wherein: Before the packaging layer is grooved, the method further includes: providing a driving substrate; bonding the microfluidic layer to the driving substrate; and bonding a reinforcement ring to the driving substrate, wherein the reinforcement ring surrounds the microfluidic layer, the chip structure, the packaging layer and the first cover plate.

17. The method for forming a package structure according to claim 16, wherein: After assembling the first cover plate on the packaging layer, it also includes: forming a second cover plate; bonding the second cover plate to the reinforcement ring, the second cover plate and the reinforcement ring form a filling cavity, the microfluidic layer, the chip structure, the packaging layer and the first cover plate are located in the filling cavity, and the liquid inlet pipe and the liquid outlet pipe of the first cover plate pass through the second cover plate and extend to the outside of the filling cavity.

18. The method for forming a package structure according to claim 17, wherein: The surface of the second cover plate facing the driving substrate has a plurality of second protrusions, and second gaps are formed between adjacent second protrusions.

19. The method for forming a package structure according to claim 18, wherein: After bonding the second cover plate, the method further includes: injecting a second underfill glue, wherein the second underfill glue completely fills the filling cavity and each of the second gaps.

20. The method for forming a package structure according to claim 19, wherein: The second cover plate has a glue inlet hole and a glue outlet hole; The method of injecting the second underfill glue comprises: injecting the second underfill glue into the filling cavity from the glue inlet hole until the second underfill glue overflows from the glue outlet hole.

21. The method for forming a package structure according to claim 19, wherein: Before injecting the second bottom filling glue, the method further includes: providing a liquid inlet joint and a liquid outlet joint; detachably connecting the liquid inlet joint to the liquid inlet pipe, and detachably connecting the liquid outlet joint to the liquid outlet pipe.

22. The method for forming a package structure according to claim 21, wherein: The second bottom filler also fills up the gaps between the liquid inlet joint and the liquid inlet pipe, and between the liquid outlet joint and the liquid outlet pipe.

23. The method for forming a package structure according to claim 21, wherein: The liquid inlet joint and the liquid inlet pipe, as well as the liquid outlet joint and the liquid outlet pipe are connected by bolts.

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