Display device

Abstract

The display device includes: a substrate including a display area and a non-display area adjacent to the display area; a display panel disposed on the substrate and including a plurality of pixels; a support member that overlaps the display region and the non-display region and is disposed at a lower portion of the substrate; a connection wiring that overlaps a portion of the non-display area and at least a portion of which penetrates the support member; a pad electrode disposed in the non-display area on the substrate and electrically connected to the connection wiring; and a connection member in contact with each of the pad electrode and the connection wiring.

Description

Technical Field

[0001] The present invention relates to a display device, and more particularly to a display device having built-in wiring. Background Art

[0002] A display device is a device that displays images for providing visual information to a user. With the development of information technology, the importance of display devices as a connection medium between users and information has become increasingly prominent. For example, the use of display devices such as liquid crystal display devices (LCD) and organic light emitting display devices (OLED) is increasing.

[0003] The display device may include a display area for displaying an image and a non-display area surrounding the display area. Pixels as the minimum unit for displaying the image may be configured in the display area. Each pixel may include a pixel circuit and a light-emitting element connected to the pixel circuit. A plurality of wirings and a driver chip may be configured in the non-display area. Summary of the invention

[0004] An object of the present invention is to provide a display device with improved reliability and enhanced display quality.

[0005] However, the purpose of the present invention is not limited to the above-mentioned purpose, and various extensions can be made without departing from the scope of the idea and field of the present invention.

[0006] In order to achieve the aforementioned purpose of the present invention, a display device involved in an embodiment of the present invention may include: a substrate, including a display area and a non-display area adjacent to the display area; a display panel, arranged on the substrate, including a plurality of pixels; a supporting component, overlapping with the display area and the non-display area, and arranged at the lower part of the substrate; a connecting wiring, overlapping with a portion of the non-display area, at least a portion of which passes through the supporting component; a pad electrode, arranged in the non-display area on the substrate, and electrically connected to the connecting wiring; and a connecting component, contacting the pad electrode and the connecting wiring, respectively.

[0007] In one embodiment, in the non-display area, a contact hole penetrating both the substrate and the pad electrode in a thickness direction is defined in the substrate and the pad electrode.

[0008] In one embodiment, the connection member may electrically connect the pad electrode and the connection wiring through the contact hole.

[0009] In one embodiment, the display device may further include: a driving chip for providing signals and voltages to the plurality of pixels, and the connecting wiring may include: a first portion overlapping at least a portion of the upper surface of the supporting component and in contact with the connecting component; a second portion arranged on the back side of the supporting component and in contact with the driving chip; and a third portion connecting the first portion and the second portion.

[0010] In one embodiment, the display device may further include: an electronic component disposed on the back side of the second portion.

[0011] In one embodiment, the display area may include: a folding area, which is flexible; and a non-folding area, which is adjacent to the folding area, and the supporting component includes: a telescopic part, which overlaps with the folding area and has a lattice shape; and a flat part, which overlaps with the non-folding area and is adjacent to the telescopic part.

[0012] In one embodiment, the first portion may be located in a direction of the third portion opposite to a direction toward the telescopic portion, and the second portion is located in a direction of the third portion toward the telescopic portion.

[0013] In one embodiment, the connecting component may include a conductive material.

[0014] In one embodiment, the conductive material may include at least one selected from the group consisting of solder paste and silver paste.

[0015] In one embodiment, the connection component may include an anisotropic conductive film (ACF).

[0016] In one embodiment, the supporting member may include glass fiber reinforced plastic (GFRP).

[0017] In one embodiment, the pad electrodes and the connecting components may be repeatedly arranged along a direction parallel to the substrate.

[0018] In order to achieve the aforementioned purpose of the present invention, a display device involved in an embodiment of the present invention may include: a substrate, including a display area and a non-display area adjacent to the display area; a display panel, arranged on the substrate, including a plurality of pixels; a supporting component, overlapping the display area and the non-display area, and arranged at the lower part of the substrate; a connecting wiring, overlapping a portion of the non-display area, at least a portion of which passes through the supporting component; a pad electrode, arranged in the non-display area on the substrate, and electrically connected to the connecting wiring; a connecting component, contacting the pad electrode and the connecting wiring, respectively; and a digitizer, located inside the supporting component, including a plurality of first wirings extending in a first direction respectively, and a plurality of second wirings arranged in a layer different from the plurality of first wirings and extending in a second direction intersecting the first direction respectively.

[0019] In one embodiment, the plurality of first wirings may be repeatedly arranged along the second direction, and the plurality of second wirings may be repeatedly arranged along the first direction.

[0020] In one embodiment, the first wiring may be arranged below the second wiring, and the first wiring and the second wiring may be connected to each other.

[0021] In one embodiment, the digitizer may further include: a connector connected to the first wiring and the second wiring respectively.

[0022] In one embodiment, the display area may include: a folding area, which is flexible; and a non-folding area, which is adjacent to the folding area, and the supporting component includes: a telescopic part, which overlaps with the folding area and includes a lattice shape; and a flat part, which overlaps with the non-folding area and is adjacent to the telescopic part.

[0023] In one embodiment, each of the second wirings may include: a first pattern overlapping the flat portion; and a second pattern overlapping the expansion portion and surrounding the lattice shape of the expansion portion.

[0024] In one embodiment, the supporting component may include: an upper layer, arranged on the upper part of the second wiring; a lower layer, arranged on the lower part of the first wiring; and except for an intermediate layer between the upper layer and the lower layer, the upper layer and the lower layer include the same substance, and the upper layer and the lower layer respectively include substances different from the intermediate layer.

[0025] In one embodiment, the connection component may include an anisotropic conductive film.

[0026] (Effects of the Invention)

[0027] In the display device involved in the embodiment of the present invention, the display device may include a supporting member and a connecting wiring arranged inside the supporting member. The first part of the connecting wiring may contact the connecting member filling the through hole penetrating the substrate in the thickness direction, and the second part of the connecting wiring may contact the driving chip that provides signals and voltages to multiple pixels. Thus, the driving chip can contact the connecting wiring without a separate film, and no additional space is required for configuring the film, so the dead space of the display device can be reduced. In addition, a part of the display device connected to the driving chip may not be bent, so the strength of the display device can be improved.

[0028] However, the effects of the present invention are not limited to the aforementioned effects, and various extensions can be made within the scope of the idea and field of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a plan view showing a display device according to an embodiment of the present invention.

[0030] Figure 2 It means folded Figure 1 A side view of an example of a state of a display device.

[0031] Figure 3 It means folded Figure 1 A side view of another example of the state of the display device.

[0032] Figure 4 It means along Figure 1 A cross-sectional view of an example of a cross section taken along line II′.

[0033] Figure 5 It is magnified. Figure 4 A magnified image of area A.

[0034] Figure 6 It is magnified. Figure 4 Magnified view of area B.

[0035] Figure 7 Yes means Figure 4 A plan view of an example of a first portion of a connecting wiring.

[0036] Figure 8 Yes means Figure 4 A plan view of an example of a second portion of the connecting wiring.

[0037] Fig. 9 Yes means Figure 4 A plan view of another example of the second portion of the connecting wiring.

[0038] Fig.10 It means along Figure 1 A cross-sectional view of another example of the cross section taken along line II′.

[0039] Fig.11 It is magnified. Fig.10 Magnified view of region C.

[0040] Fig.12 It means along Figure 1 A sectional view of another example of the cross section taken along line II′.

[0041] Fig.13 Yes means Fig.12 A plan view of an example of a digitizer.

[0042] Fig.14 It is magnified. Fig.13 Magnified view of area D.

[0043] Fig.15 It means along Figure 1 A sectional view of another example of the cross section taken along line II′.

[0044] Explanation of symbols:

[0045] DD: display device; FA: folding area; NFA1: first non-folding area; NFA2: second non-folding area; DA: display area; NDA: non-display area; 100: substrate; 200, 200′: pad electrodes; 220, 220′: connecting parts; 240: connecting wiring; 242: first part; 244: second part; 246: third part; 300: supporting part; 320: flat part; 340: telescopic part; 360: multiple holes; 400: driving chip; 420: electronic component; 500: digitizer; 500a: first wiring; 500b: second wiring. DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and repeated description of the same components is omitted.

[0047] Figure 1 It is a plan view showing a display device according to an embodiment of the present invention. Figure 2 It means folded Figure 1 A side view of an example of a state of a display device. Figure 3 It means folded Figure 1 A side view of another example of the state of the display device.

[0048] Reference Figure 1 , Figure 2and Figure 3 , the display device DD may include a display area DA and a non-display area NDA. The display area DA may be defined as an area where an image is generated, and the non-display area NDA may be defined as an area where no image is generated. The non-display area NDA may be disposed adjacent to the display area DA. For example, the non-display area NDA may surround the entire display area DA.

[0049] In the present specification, a plane may be defined by a first direction DR1 and a second direction DR2. For example, the second direction DR2 may be perpendicular to the first direction DR1. In addition, the third direction DR3 may be perpendicular to the plane.

[0050] Pixels PX may be arranged in the display area DA. For example, the pixels PX may be arranged in the entire display area DA along the first direction DR1 and the second direction DR2. Each pixel PX may emit light of a predetermined color. An image may be displayed in the display area DA by the light emitted from each pixel PX.

[0051] The display device DD may include a folding area FA that is bent into a foldable display device DD by an external force, and a first non-folding area NFA1 and a second non-folding area NFA2 that are adjacent to at least one side of the folding area FA and are not folded. The folding area FA, the first non-folding area NFA1, and the second non-folding area NFA2 may overlap at least the display area DA. For example, the folding area FA may have a folding axis extending along the first direction DR1.

[0052] The display area DA may be divided into a first display area DA1 and a second display area DA2 adjacent to each other in a second direction DR2 intersecting the first direction DR1. For example, the second direction DR2 may intersect the first direction DR1. The first display area DA1 and the second display area DA2 may be continuously connected to substantially form one display area DA. For example, when the display area DA is folded along the folding axis, as shown in FIG. Figure 2 As shown, the display device DD may have an inner folding structure such that the first display area DA1 and the second display area DA2 face each other. Figure 3 As shown, when the display area DA is folded along the folding axis, the display device DD may also have an outer folding structure in which the display area DA is arranged on the outside.

[0053] Figure 4 It means along Figure 1 A cross-sectional view of an example of a cross section taken along line II′. Figure 5 It is magnified. Figure 4 A magnified view of region A. For example, Figure 5 This is an enlarged representation of the configuration Figure 4FIG. 2 is an enlarged view of a portion of the non-display area NDA of the connection wiring 240 .

[0054] Reference Figure 4 and Figure 5 The display device DD may include a display panel PNL, a pad electrode 200, a connection member 220, a support member 300, a protection film PF, a connection wiring 240, a driving chip 400, a polarization member POL, a window member WNL, a protection layer PL, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3.

[0055] The display panel PNL may include a first substrate layer 120 , a second substrate layer 140 , a crack prevention bank 160 , an insulating layer IL, and an encapsulation layer ENL on the non-display area NDA. The substrate 100 may include the first substrate layer 120 and the second substrate layer 140 .

[0056] The first substrate layer 120 may be a transparent insulating substrate. The first substrate layer 120 may be flexible so as to be able to be bent. Examples of materials that can be used as the first substrate layer 120 include polyimide (PI), polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylenesulfide (PPS), polycarbonate (PC), cellulose acetate propionate (CAP), etc. These materials may be used alone or in combination with each other.

[0057] The second substrate layer 140 may be disposed on an upper portion of the first substrate layer 120. The second substrate layer 140 may include substantially the same material as the first substrate layer 120.

[0058] The crack prevention bank 160 may be disposed on the non-display area NDA of the second substrate layer 140. The crack prevention bank 160 may be disposed closer to the outermost contour of the display device DD (i.e., the outermost contour of the non-display area NDA) than the pad electrode 200. For example, the crack prevention bank 160 may be located in the second direction DR2 of the pad electrode 200. Specifically, the crack prevention bank 160 may be spaced apart from the pad electrode 200 along the second direction DR2 on the second substrate layer 140.

[0059] The crack prevention bank 160 may include an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ) etc. These substances may be used alone or in combination.

[0060] The insulating layer IL may be disposed on the display area DA of the second substrate layer 140. The insulating layer IL may include a multi-layer structure. The insulating layer IL may be disposed at the same layer as the crack prevention bank 160. The insulating layer IL may include substantially the same material as the crack prevention bank 160. In addition, the insulating layer IL may be formed by substantially the same process as the crack prevention bank 160. However, the present invention is not limited thereto.

[0061] The encapsulation layer ENL may be disposed on the insulating layer IL. For example, the encapsulation layer ENL may cover the upper portion of the insulating layer IL. Figure 6 This will be described in detail later.

[0062] The pad electrode 200 may be disposed on the non-display area NDA of the second substrate layer 140. The pad electrode 200 may be electrically connected to an external device. Specifically, the external device may provide a data signal, a gate signal, a light emitting control signal, a gate initialization signal, an initialization voltage, a power supply voltage, etc. to the pixel PX. That is, the pad electrode 200 may electrically connect the external device and the pixel PX.

[0063] In one embodiment, a contact hole penetrating through the substrate 100 and the pad electrode 200 in the third direction DR3 may be defined. The contact hole may be formed by removing a portion of the pad electrode 200, the first substrate layer 120, and the second substrate layer 140.

[0064] The protective film PF may be disposed at the lower portion of the first substrate layer 120. The protective film PF may reduce pressure applied to the display panel PNL when the display panel PNL is folded or bent. In addition, the protective film PF may prevent moisture and the like from penetrating into the display panel PNL and may absorb external impact.

[0065] The protective film PF may include a polymer substance. For example, the polymer substance may include polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cycloolefin polymer (COP), etc. These substances may be used alone or in combination with each other.

[0066] The connection member 220 may be in contact with the pad electrode 200. In one embodiment, the connection member 220 may electrically connect the pad electrode 200 and the connection wiring 240 through the contact hole. For example, the connection member 220 may fill the contact hole that penetrates the substrate 100 and the pad electrode 200 at the same time. Specifically, the contact hole may also extend to the protection film PF and the first adhesive member AM1, and the connection member 220 may penetrate the pad electrode 200, the substrate 100, the protection film PF, and the first adhesive member AM1.

[0067] In one embodiment, the connection member 220 may include a conductive substance. For example, the conductive substance may include solder paste, silver paste, etc. These substances may be used alone or in combination.

[0068] The support member 300 may be disposed at the lower portion of the protective film PF. The support member 300 may include a flat portion 320 located in the first non-folding area NFA1 and the second non-folding area NFA2 and a retractable portion 340 overlapping the folding area FA. The retractable portion 340 may be retractable corresponding to the folding and unfolding of the display device DD. In other words, the flat portion 320 may be a portion of the support member 300 corresponding to the first non-folding area NFA1 and the second non-folding area NFA2. In addition, the retractable portion 340 may be a portion of the support member 300 corresponding to the folding area FA.

[0069] In one embodiment, the supporting member 300 may include glass fiber reinforced plastic (GFRP), carbon fiber reinforced plastic (CFRP), or the like.

[0070] In one embodiment, the telescopic portion 340 may have a lattice shape. Specifically, a plurality of holes 360 may be defined in the telescopic portion 340. For a detailed description of the plurality of holes 360, please refer to Fig.14 To be discussed later.

[0071] The first adhesive member AM1 may be disposed between the support member 300 and the protective film PF. For example, the first adhesive member AM1 may attach the protective film PF to the support member 300. The first adhesive member AM1 may include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a photocurable resin, a thermosetting resin, etc. These substances may be used alone or in combination with each other.

[0072] The first adhesive member AM1 may be disposed on the flat portion 320 of the supporting member 300 . However, the first adhesive member AM1 may not be disposed on the elastic portion 340 .

[0073] The connection wiring 240 may be disposed on the non-display area NDA. In addition, the connection wiring 240 may be disposed to pass through the flat portion 320 overlapping the non-display area NDA. The connection wiring 240 may include a first portion 242, a second portion 244, and a third portion 246.

[0074] The first portion 242 may be a portion of the connection wiring 240 facing the second direction DR2. In one embodiment, the first portion 242 may be in contact with the connection member 220. The first portion 242 may be adjacent to the upper surface of the flat portion 320. For example, the first portion 242 may be exposed from the upper surface of the flat portion 320 and in contact with the connection member 220.

[0075] In one embodiment, one surface of the first portion 242 may be located on the same plane as the upper surface of the flat portion 320. In other embodiments, the one surface of the first portion 242 may not be located on the same plane as the upper surface of the flat portion 320.

[0076] The second portion 244 may be a portion of the connection wiring 240 that faces a direction opposite to the second direction DR2 and is different from the first portion 242. In one embodiment, the second portion 244 may be in contact with the driving chip 400. The second portion 244 may be adjacent to the back surface of the flat portion 320. For example, the second portion 244 may be exposed from the back surface of the flat portion 320 and in contact with the driving chip 400. Thus, the electrical signal generated by the driving chip 400 may be transmitted to the pixel PX through the pad electrode 200, the connection member 220, and the connection wiring 240.

[0077] In one embodiment, one side of the second portion 244 may be located on the same plane as the back side of the flat portion 320. In other embodiments, the one side of the second portion 244 may not be located on the same plane as the back side of the flat portion 320.

[0078] The third portion 246 may connect the first portion 242 and the second portion 244. Thus, the first portion 242 may be disposed adjacent to the upper surface of the flat portion 320, and the second portion 244 may be disposed adjacent to the back surface of the flat portion 320. The third portion 246 may be located inside the support member 300. For example, the third portion 246 may penetrate the support member 300 in the third direction DR3.

[0079] The third portion 246 may be perpendicular to the first portion 242 and the second portion 244. In addition, the first portion 242, the second portion 244, and the third portion 246 may have a stepped shape. However, the present invention is not limited thereto, and the connection wiring 240 may have various shapes that can contact the connection member 220 and the driving chip 400.

[0080] The driver chip 400 may be disposed under the connection wiring 240. For example, the driver chip 400 may contact the second portion 244 exposed on the back surface of the flat portion 320. Specifically, the driver chip 400 may directly contact the second portion 244, and no film may be disposed between the driver chip 400 and the second portion 244.

[0081] As described above, the connection wiring 240 may be provided inside the support member 300. In addition, the connection wiring 240 may be in direct contact with the connection member 220 and the driver chip 400. Thus, the driver chip 400 may be in contact with the connection wiring 240 without a separate film, and no additional space is required for configuring the film, thereby reducing the dead space of the display device DD. In addition, a portion of the display device DD connected to the driver chip 400 is not bent, thereby further improving the strength of the display device DD.

[0082] The polarization part POL may be disposed on the display panel PNL and may block external light incident to the display panel PNL from the outside.

[0083] The second adhesive member AM2 may be disposed between the polarization member POL and the display panel PNL. For example, the second adhesive member AM2 may be disposed between the polarization member POL and the encapsulation layer ENL. The second adhesive member AM2 may include substantially the same material as the first adhesive member AM1.

[0084] The window member WNL may be disposed on the polarization member POL. The window member WNL may have a transmissive portion corresponding to the display area DA. For example, the window member WNL may include a polymer substance, a glass film, etc. so as to be bendable. These substances may be used alone or in combination with each other.

[0085] The third adhesive member AM3 may be disposed between the window member WNL and the polarization member POL. For example, the third adhesive member AM3 may attach the polarization member POL to the window member WNL. The third adhesive member AM3 may include substantially the same material as the second adhesive member AM2.

[0086] The protective layer PL may be disposed on the window component WNL. The protective layer PL may perform at least one of the functions of anti-scattering of the window component WNL, impact absorption of the window component WNL, anti-stab of the window component WNL, anti-fingerprint of the window component WNL, and anti-glare of the window component WNL. The protective layer PL may include a transparent polymer film. For example, as examples of the transparent polymer film constituting the protective layer PL, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), polyimide (PI), polyarylate (PAR), polycarbonate (PC), polymethyl methacrylate (PMMA), cycloolefin polymer (COP), etc. may be cited.

[0087] Figure 6 It is magnified. Figure 4 Magnified view of area B.

[0088] Reference Figures 4 to 6 The display panel PNL may include a substrate 100, an active pattern ACT, a first insulating layer IL1, a gate electrode GE, a second insulating layer IL2, a first electrode E1, a second electrode E2, a third insulating layer IL3, a third electrode E3, a fourth insulating layer IL4, a pixel electrode AE, a light emitting layer EM, a fifth insulating layer IL5, a common electrode CE, and an encapsulation layer ENL.

[0089] An insulating layer IL may be disposed on the display area DA of the substrate 100. The insulating layer IL may include a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, and a fourth insulating layer IL4.

[0090] A buffer layer may be disposed on the substrate 100. For example, the buffer layer may be disposed between the substrate 100 and the first insulating layer IL1. The buffer layer may prevent impurities from diffusing from the substrate 100 to the active pattern ACT.

[0091] The active pattern ACT may be disposed on the buffer layer. The active pattern ACT may include amorphous silicon, polysilicon, or an oxide semiconductor. The active pattern ACT may include a source region and a drain region doped with impurities and a channel region disposed between the source region and the drain region.

[0092] The first insulating layer IL1 may be disposed on the buffer layer. The first insulating layer IL1 may cover the active pattern ACT on the buffer layer. For example, the first insulating layer IL1 may have a substantially uniform thickness along the contour of the active pattern ACT. Optionally, the first insulating layer IL1 may also fully cover the active pattern ACT and have a substantially flat upper surface without generating a height difference around the active pattern ACT.

[0093] The first insulating layer IL1 may include an inorganic insulating material. The inorganic insulating material may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ) etc. These substances may be used alone or in combination.

[0094] The gate electrode GE may be disposed on the first insulating layer IL1. The gate electrode GE may overlap the channel region of the active pattern ACT. The gate electrode GE may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc. For example, the gate electrode GE may include silver (Ag), an alloy containing silver, molybdenum (Mo), an alloy containing molybdenum, aluminum (Al), an alloy containing aluminum, aluminum nitride (AlN), tungsten (W), tungsten nitride (WN), copper (Cu), nickel (Ni), chromium (Cr), chromium nitride (CrN), titanium (Ti), tantalum (Ta), platinum (Pt), scandium (Sc), indium tin oxide (ITO), indium zinc oxide (IZO), etc.

[0095] The second insulating layer IL2 may be disposed on the first insulating layer IL1. The second insulating layer IL2 may cover the gate electrode GE. The second insulating layer IL2 may include an inorganic insulating substance.

[0096] The second insulating layer IL2 may include an inorganic insulating material. The inorganic insulating material may include silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ) etc. These substances may be used alone or in combination.

[0097] The first electrode E1 and the second electrode E2 may be disposed on the second insulating layer IL2. The first electrode E1 and the second electrode E2 may contact the source region and the drain region of the active pattern ACT respectively through contact holes penetrating the first insulating layer IL1 and the second insulating layer IL2. The first electrode E1 and the second electrode E2 may include metal, alloy, conductive metal oxide, conductive metal nitride, transparent conductive material, etc. The active pattern ACT, the gate electrode GE, the first electrode E1 and the second electrode E2 may form a transistor TR.

[0098] The third insulating layer IL3 may be disposed on the second insulating layer IL2. The third insulating layer IL3 may cover the first electrode E1 and the second electrode E2. The third insulating layer IL3 may include an organic insulating material. Examples of the organic insulating material that may be used as the third insulating layer IL3 include photoresist, polyimide-based resin, polyamide-based resin, siloxane-based resin, acryl-based resin, epoxy-based resin, and the like. These materials may be used alone or in combination with each other.

[0099] The third electrode E3 may be disposed on the third insulating layer IL3. The third electrode E3 may be connected to the first electrode E1 through a contact hole penetrating the third insulating layer IL3. However, the present invention is not necessarily limited thereto. For example, the third electrode E3 may also contact the second electrode E2 through a contact hole penetrating the third insulating layer IL3. The third electrode E3 may include a metal, an alloy, a conductive metal oxide, a conductive metal nitride, a transparent conductive material, etc.

[0100] In one embodiment, the third electrode E3 and the pad electrode 200 may be disposed in the same layer. In other words, the third electrode E3 and the pad electrode 200 may be formed in the same process step. In other words, the third electrode E3 and the pad electrode 200 may include the same material. However, the present invention is not necessarily limited thereto, and the pad electrode 200 may be disposed in the same layer as one of the various conductive layers included in the display panel PNL.

[0101] The fourth insulating layer IL4 may be disposed on the third insulating layer IL3. The fourth insulating layer IL4 may cover the third electrode E3. The fourth insulating layer IL4 may include an organic insulating material. Examples of the organic insulating material that may be used as the fourth insulating layer IL4 include photoresist, polyimide-based resin, polyamide-based resin, siloxane-based resin, acryl-based resin, epoxy-based resin, and the like. These materials may be used alone or in combination with each other.

[0102] The pixel electrode AE ​​may be disposed on the fourth insulating layer IL4 . The pixel electrode AE ​​may contact the first electrode E1 or the second electrode E2 through a contact hole penetrating the fourth insulating layer IL4 . Thus, the pixel electrode AE ​​may be electrically connected to the transistor TR.

[0103] The fifth insulating layer IL5 may be disposed on the fourth insulating layer IL4. The fifth insulating layer IL5 may cover a portion of the pixel electrode AE ​​on the fourth insulating layer IL4. The fifth insulating layer IL5 may have a pixel opening that exposes at least a portion of the upper surface of the pixel electrode AE. The fifth insulating layer IL5 may include an organic insulating material. For example, the organic insulating material may include a photoresist, a polyimide-based resin, a polyamide-based resin, a siloxane-based resin, an acrylic resin, an epoxy-based resin, etc. These materials may be used alone or in combination with each other.

[0104] The light emitting layer EM may be disposed on the pixel electrode AE. For example, the light emitting layer EM may be disposed on the pixel electrode AE ​​exposed from the fifth insulating layer IL5. In one embodiment, the light emitting layer EM may have a multilayer structure including a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer.

[0105] The common electrode CE may be disposed on the light emitting layer EM and the fifth insulating layer IL5. The light emitting layer EM may emit light based on a voltage difference between the pixel electrode AE ​​and the common electrode CE. The pixel electrode AE, the light emitting layer EM and the common electrode CE may form a light emitting element EL.

[0106] The encapsulation layer ENL may be disposed on the light emitting element EL. For example, the encapsulation layer ENL may be disposed on the common electrode CE. The encapsulation layer ENL may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The encapsulation layer ENL may prevent oxygen and moisture from penetrating into the light emitting element EL.

[0107] Figure 7 Yes means Figure 4 A plan view of an example of a first portion of a connection wiring. For example, Figure 7 1 is a plan view showing a state where the pad electrode 200 and the connection member 220 are in contact with each other on the second substrate layer 140 .

[0108] Reference Figure 7In one embodiment, the plane shape of the connection member 220 in contact with the first portion 242 may have a circular shape. However, the present invention is not limited thereto, and the plane shape of the connection member 220 may have various shapes.

[0109] At least one connection member 220 may be in contact with the first portion 242. In one embodiment, when there are two or more connection members 220, the connection members 220 may be arranged continuously along the second direction DR2 on a plane. In addition, the connection wirings 240 may be arranged continuously along the first direction DR1 on a plane. However, in the present invention, the arrangement direction of the connection members 220 and the connection wirings 240 is not limited thereto.

[0110] The connection wiring 240 may be disposed on the non-display area NDA. For example, the first portion 242, the second portion 244, and the third portion 246 may all be disposed on the non-display area NDA. In one embodiment, the first portion 242 may be located in the second direction DR2 of the third portion 246. In addition, in one embodiment, the second portion 244 may be located in a direction opposite to the second direction DR2 of the third portion 246.

[0111] Figure 8 Yes means Figure 4 A plan view of an example of a second portion of the connecting wiring. Fig. 9 Yes means Figure 4 A plan view of another example of the second portion of the connecting wiring.

[0112] Reference Figure 8 As described above, the second portion 244 of the connection wiring 240 may be in contact with the driver chip 400. As a plurality of connection wirings 240 are arranged, a plurality of driver chips 400 may be arranged accordingly.

[0113] Reference Fig. 9 In one embodiment, the display device DD may further include an electronic component 420 disposed on the back side of the second portion 244. For example, the electronic component 420 may be in contact with the back side of the second portion 244. In addition, the electronic component 420 may be spaced apart from the driving chip 400 in a direction opposite to the second direction DR2. However, in the present invention, the direction in which the driving chip 400 and the electronic component 420 are spaced apart is not limited thereto.

[0114] The electronic component 420 may provide signals and voltages or store information in the display device DD. The electronic component 420 may include a DC-DC converter, an ASIC (application specific integrated circuit), an LDO regulator (Low Drop-out regulator), an EEPROM (electrically erasable programmable read-only memory), a flash memory, etc. However, the present invention is not limited thereto, and may also include various components associated with driving the display device DD.

[0115] Fig.10 It means along Figure 1 A cross-sectional view of another example of the cross section taken along line II′. Fig.11 It is magnified. Fig.10 Magnified view of region C.

[0116] Below, the description and references are omitted or simplified. Figures 4 to 6 The description content is duplicate content.

[0117] Reference Fig.10 and Fig.11 In one embodiment, the connection component 220′ may include an anisotropic conductive film (ACF). The connection component 220′ may penetrate the substrate 100 and the protection film PF in the third direction DR3. Thus, the connection component 220′ may contact the first portion 242 and the pad electrode 200′, respectively. In other words, the connection component 220′ may electrically connect the pad electrode 200′ and the connection wiring 240.

[0118] The pad electrode 200' may be disposed on the second substrate layer 140. For example, the pad electrode 200' may contact the connection component 220' through an opening defined in the second substrate layer 140. Thus, the pad electrode 200' may contact the connection component 220' through the opening. In one embodiment, the pad electrode 200' may have a concave-convex structure. However, the present invention is not limited thereto, and may have various structures in which the pad electrode 200' and the connection component 220' can contact each other.

[0119] A filling member FM may be disposed between the pad electrode 200' and the encapsulation layer ENL. The filling member FM may fill the area between the pad electrode 200' and the encapsulation layer ENL to compensate for the height difference. The filling member FM may contact the pad electrode 200'. For example, the filling member FM may cover the pad electrode 200'. In one embodiment, the filling member FM may include an organic substance.

[0120] As described above, the driver chip 400 may be disposed on the second portion 244 of the connection wiring 240. Fig.11 However, the driver chip 400 and the electronic components (eg, Fig. 9 The electronic components 420). The content of the position, composition, etc. of the electronic components and the reference Fig. 9 The contents of the description are substantially the same.

[0121] Fig.12 It means along Figure 1 A sectional view of another example of the cross section taken along line II′. Fig.13 Yes means Fig.12 A plan view of an example of a digitizer. Fig.14 It is magnified. Fig.13 A magnified view of region D. For example, Fig.14 It is a plan view showing a state where the digitizer 500 is arranged on the telescopic portion 340 ′.

[0122] Below, the description and references are omitted or simplified. Figure 4 The description content is duplicate content.

[0123] Reference Fig.12 and Fig.13 , the display device DD may include a supporting member 300 ′ and a digitizer 500 .

[0124] The support member 300' may include an upper layer 300'a, a lower layer 300'b, and an intermediate layer 300'c. The upper layer 300'a may be located at the upper portion of the digitizer 500. The lower layer 300'b may be located at the lower portion of the digitizer 500. The intermediate layer 300'c may be the remaining portion of the support member 300' except for the upper layer 300'a and the lower layer 300'b. For example, the support member 300' may include an upper layer 300'a configured at the upper portion of the second wiring 500b, a lower layer 300'b configured at the lower portion of the first wiring 500a, and an intermediate layer 300'c except for the upper layer 300'a and the lower layer 300'b. In other words, the intermediate layer 300'c may be configured between the upper layer 300'a and the lower layer 300'b.

[0125] In one embodiment, the upper layer 300'a, the lower layer 300'b, and the middle layer 300'c may include the same material as each other. For example, the upper layer 300'a, the lower layer 300'b, and the middle layer 300'c may include glass fiber reinforced plastic (GFRP), carbon fiber reinforced plastic (CFRP), etc. These materials may be used alone or in combination with each other.

[0126] In one embodiment, the upper layer 300'a and the lower layer 300'b may include the same material, and the middle layer 300'c may include a material different from the upper layer 300'a and the lower layer 300'b. For example, the upper layer 300'a and the lower layer 300'b may include polyimide (PI), and the middle layer 300'c may include glass fiber reinforced plastic. However, the present invention is not limited thereto.

[0127] The digitizer 500 can be implemented by electromagnetic resonance (EMR), pressure-sensitive, capacitive, or a combination thereof. For the digitizer 500, the user brings the input component close to the display device DD, so that the input component and the digitizer 500 can communicate with each other and perform various input functions. For example, the input component can be an electromagnetic pen. However, the input component of the present invention is not limited thereto.

[0128] The digitizer 500 may be located inside the support member 300'. The digitizer 500 may include a first wiring 500a, a second wiring 500b, and a connection portion 500c.

[0129] The first wiring 500a may be disposed on an upper portion of the lower layer 300'b of the support member 300'. For example, the first wiring 500a may be in contact with an upper surface of the lower layer 300'b of the support member 300'.

[0130] Each first wiring 500a may extend in the first direction DR1. For example, a plurality of first wirings 500a may be arranged along the first direction DR1 via the display area DA and the non-display area NDA. In addition, a plurality of first wirings 500a may be arranged continuously along the second direction DR2. In other words, each first wiring 500a may extend in the first direction DR1 and be arranged continuously along the second direction DR2.

[0131] The second wiring 500b may be disposed at a lower portion of the upper layer 300'a of the support member 300'. For example, the second wiring 500b may be in contact with the back surface of the upper layer 300'a of the support member 300'.

[0132] Each second wiring 500b may extend in the second direction DR2. For example, a plurality of second wirings 500b may be arranged along the second direction DR2 via the folding area FA, the first non-folding area NFA1, and the second non-folding area NFA2. In addition, a plurality of second wirings 500b may be arranged continuously along the first direction DR1. In other words, each second wiring 500b may extend in the second direction DR2 and be arranged continuously along the first direction DR1.

[0133] In one embodiment, the first wiring 500a and the second wiring 500b may be arranged at different layers from each other. For example, the first wiring 500a may be arranged below the second wiring 500b.

[0134] On the other hand, the connection wiring 240 may be spaced apart from the first wiring 500a and the second wiring 500b, respectively. That is, the connection wiring 240 may not be in contact with the first wiring 500a and the second wiring 500b, respectively.

[0135] The connection portion 500c may connect the first wiring 500a and the second wiring 500b. Specifically, the connection portion 500c may be disposed in a layer different from the first wiring 500a and the second wiring 500b, so that the connection portion 500c is located between the first wiring 500a and the second wiring 500b to connect the first wiring 500a and the second wiring 500b.

[0136] One wiring group may be formed including one first wiring among the plurality of first wirings 500a, one second wiring among the plurality of second wirings 500b overlapping the first wiring, and a connection portion connecting the first wiring and the second wiring.

[0137] In the wiring groups, each part may cross each other on a plane. For example, a part of the first wiring group 500-1, a part of the second wiring group 500-2, and a part of the third wiring group 500-3 may cross each other on a plane. In other words, each part of the first wiring group 500-1, the second wiring group 500-2, and the third wiring group 500-3 may overlap each other. However, in a cross section, each part of the wiring group may be spaced apart from each other. For example, the first wiring group 500-1, the second wiring group 500-2, and the third wiring group 500-3 may be spaced apart from each other in a cross section.

[0138] On the other hand, Fig.13 Three wiring groups are shown in FIG. 5 , but the present invention is not limited thereto, and the digitizer 500 may include at least one wiring group.

[0139] In addition, although Fig.13 Although not shown in the figure, the connection wiring 240 may be spaced apart from the wiring group. For example, the connection wiring 240 may be arranged between the wiring groups adjacent to each other.

[0140] Reference Fig.13 and Fig.14 The plurality of holes 360 may be staggered and arranged continuously in the entirety of the expansion portion 340'. For example, adjacent holes among the plurality of holes 360 may be arranged continuously in a diagonal direction between the first direction DR1 and the second direction DR2.

[0141] As described above, the second wiring 500b may extend in the second direction DR2 in the flat portion 320'. In the flat portion 320', the second wirings 500b parallel to the second direction DR2 may be continuously arranged in the first direction DR1. Thus, a first pattern P1 in which the second wirings 500b are spaced at a constant interval in the first direction DR1 may be defined. In other words, the second wiring 500b may include a first pattern P1 overlapping the flat portion 320'.

[0142] However, since a plurality of holes 360 are defined in the expansion portion 340', the second wiring 500b may not extend parallel to the second direction DR2 in the expansion portion 340'. Thus, the second wiring 500b may be arranged along a portion of the expansion portion 340' adjacent to the plurality of holes 360. Specifically, the second wiring 500b may include a second pattern P2 in a lattice shape surrounding the outer shape of the plurality of holes 360. In other words, the second wiring 500b may include a second pattern P2 overlapping the expansion portion 340'.

[0143] The second wirings 500-1b, 500-2b, 500-3b of the first wiring group 500-1, the second wiring group 500-2, and the third wiring group 500-3 may be spaced apart from each other. The intervals between the second wirings 500-1b, 500-2b, 500-3b in the expansion portion 340' in the second direction DR2 may be smaller than the intervals between the second wirings 500-1b, 500-2b, 500-3b in the flat portion 320' in the second direction DR2. In other words, the intervals between the second wirings 500-1b, 500-2b, 500-3b adjacent to each other forming the second pattern P2 may be smaller than the intervals between the second wirings 500-1b, 500-2b, 500-3b adjacent to each other forming the first pattern P1.

[0144] The connector CNT may be located at a location where the first wiring 500a and the second wiring 500b meet. In one embodiment, the digitizer 500 may include a connector CNT connected to the first wiring 500a and the second wiring 500b, respectively. The connector CNT may be electrically connected to a printed circuit board (PCB) in the external device, thereby providing a sensing signal transmitted from the outside to the printed circuit board (PCB). Fig.13 and Fig.14 As shown in FIG. 1 , the printed circuit substrate (PCB) can receive the sensing signal through the connector CNT and transmit the sensing signal to the external device.

[0145] Fig.15 It means along Figure 1 A sectional view of another example of the cross section taken along line II′.

[0146] Below, the description and references are omitted or simplified. Figure 4 , Fig.10 and Fig.12 The description content is duplicate content.

[0147] Reference Fig.15 , the display device DD may include both the connection component 220' and the digitizer 500. Fig.10 As described above, the connection member 220' may be an anisotropic conductive film. Fig.11 The pad electrode 200' may have a concave-convex structure. A filling component (eg, Fig.11 Filling part FM).

[0148] The present invention can be applied to display devices and electronic devices including the same. For example, the present invention can be applied to high-resolution smart phones, mobile phones, smart pads, smart watches, tablet PCs, vehicle navigation systems, televisions, computer monitors, notebooks, etc.

[0149] Although the present invention has been described above with reference to the exemplary embodiments, it should be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as described in the claims.

Claims

1. A display device, comprising: A substrate, comprising a display area and a non-display area adjacent to the display area; A display panel, arranged on the substrate, comprising a plurality of pixels; A supporting member, overlapping the display area and the non-display area, and arranged at a lower portion of the substrate; a connecting wiring, overlapping a portion of the non-display area and at least a portion of which passes through the supporting member; A pad electrode, arranged in the non-display area on the substrate and electrically connected to the connection wiring; as well as The connection member is in contact with the pad electrode and the connection wiring respectively.

2. The display device according to claim 1, characterized in that In the non-display area, a contact hole is defined in the substrate and the pad electrode, penetrating both the substrate and the pad electrode in a thickness direction.

3. The display device according to claim 2, characterized in that The connection member electrically connects the pad electrode and the connection wiring through the contact hole.

4. The display device according to claim 1, characterized in that Also includes: A driving chip provides signals and voltages to the plurality of pixels, The connection wiring comprises: a first portion overlapping at least a portion of the upper surface of the support member and in contact with the connecting member; a second portion, disposed on the back surface of the support member and in contact with the driver chip; and The third part connects the first part and the second part.

5. The display device according to claim 4, characterized in that: Also includes: The electronic component is arranged on the back surface of the second portion.

6. The display device according to claim 4, characterized in that: The display area includes: a folding area, which is flexible; and a non-folding area, which is adjacent to the folding area. The supporting member comprises: a telescopic portion, overlapping the folding region, and having a lattice shape; and The flat portion overlaps the unfolded area and is adjacent to the telescopic portion.

7. The display device according to claim 6, characterized in that: The first portion is located in a direction of the third portion opposite to a direction toward the telescopic portion, The second portion is located in a direction of the third portion toward the telescopic portion.

8. The display device according to claim 1, characterized in that: The connecting member includes a conductive material.

9. The display device according to claim 8, characterized in that: The conductive material includes at least one selected from the group consisting of solder paste and silver paste.

10. The display device according to claim 1, characterized in that The connection member includes an anisotropic conductive film.

11. The display device according to claim 1, characterized in that: The support member comprises glass fiber reinforced plastic.

12. The display device according to claim 1, characterized in that: The pad electrodes and the connection members are repeatedly arranged along a direction parallel to the substrate.

13. A display device, comprising: A substrate, comprising a display area and a non-display area adjacent to the display area; A display panel, arranged on the substrate, comprising a plurality of pixels; A supporting member, overlapping the display area and the non-display area, and arranged at a lower portion of the substrate; a connecting wiring, overlapping a portion of the non-display area and at least a portion of which passes through the supporting member; A pad electrode, arranged in the non-display area on the substrate and electrically connected to the connection wiring; a connecting component, contacting the pad electrode and the connecting wiring respectively; as well as The digitizer is located inside the support member and includes a plurality of first wirings extending in a first direction and a plurality of second wirings arranged in a layer different from the plurality of first wirings and extending in a second direction intersecting the first direction.

14. The display device according to claim 13, characterized in that: The plurality of first wirings are repeatedly arranged along the second direction, and the plurality of second wirings are repeatedly arranged along the first direction.

15. The display device according to claim 13, characterized in that: The first wiring is arranged below the second wiring, and the first wiring and the second wiring are connected to each other.

16. The display device according to claim 13, characterized in that: The digitizer further includes a connector connected to the first wiring and the second wiring respectively.

17. The display device according to claim 13, characterized in that: The display area includes: a folding area, which is flexible; and a non-folding area, which is adjacent to the folding area. The supporting member comprises: a telescopic portion, overlapping the folding region, comprising a lattice shape; and The flat portion overlaps the unfolded area and is adjacent to the telescopic portion.

18. The display device according to claim 17, characterized in that: Each of the second wirings comprises: a first pattern overlapping the flat portion; and The second pattern overlaps with the stretchable portion and surrounds the lattice shape of the stretchable portion.

19. The display device according to claim 13, characterized in that: The supporting member includes: an upper layer disposed on an upper portion of the second wiring; a lower layer disposed on a lower portion of the first wiring; and an intermediate layer other than the upper layer and the lower layer. The upper layer and the lower layer include the same substance, and the upper layer and the lower layer each include a substance different from the intermediate layer.

20. The display device according to claim 13, characterized in that The connection member includes an anisotropic conductive film.

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