Wiring structure and electronic module

Abstract

The wiring structure includes: an external substrate; a wiring substrate; a first connection member and a second connection member connecting the external substrate and the wiring substrate; and a bonding material that bonds the external substrate and the wiring substrate. The outer substrate has: a first substrate having a first side surface; a first ground conductor; and a first signal conductor. The first ground conductor includes: a first upper ground conductor; and a first lower ground conductor electrically connected with the first upper ground conductor. The wiring substrate has: an insulator having a second side surface disposed so as to face the first side surface; a second signal conductor; a second ground conductor; and a third ground conductor electrically connected to the second ground conductor. The third grounding conductor is located on the second side. The first connection member connects the first ground conductor and the second ground conductor. The second connection member connects the first signal conductor and the second signal conductor. The bonding material is a conductive paste on the second side surface, and electrically connects the third ground conductor and the first lower ground conductor.

Description

Technical Field

[0001] The invention relates to a wiring structure and an electronic module. Background Art

[0002] In recent years, wireless communication equipment and optical communication equipment have been required to have higher frequencies in order to transmit higher-speed and larger-capacity information. Among them, as an electronic device for transmitting signals, a structure such as that shown in Patent Document 1 is known.

[0003] In the invention described in Patent Document 1, the semiconductor element and the signal wiring conductor are electrically connected by a bonding wire (see, for example, FIG. 6 of Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent document 1: Japanese Patent Application Publication No. 2016-115736. Summary of the invention

[0007] In one embodiment of the present invention, (1) a wiring structure comprises: an external substrate; a wiring substrate; a connecting component that electrically connects the external substrate and the wiring substrate; and a bonding material that bonds the external substrate and the wiring substrate. The external substrate comprises a first substrate, a first grounding conductor, and a first signal conductor. The first substrate comprises: a first upper surface; a first lower surface on the side opposite to the first upper surface; and a first side surface that connects the first lower surface and the first upper surface. The first grounding conductor comprises: a first upper grounding conductor that is located on the first upper surface; and a first lower grounding conductor that is located on the first lower surface and electrically connected to the first upper grounding conductor. The first signal conductor is located on the first upper surface. The wiring substrate comprises an insulator, a second signal conductor, a second grounding conductor, and a third grounding conductor. The insulator comprises: a second upper surface; a second lower surface on the side opposite to the second upper surface; and a second side surface that connects the second lower surface and the second upper surface and is arranged to be opposite to the first side surface. The second grounding conductor is located on the second upper surface and extends in a first direction away from the second side surface. The third grounding conductor is electrically connected to the second grounding conductor. In addition, the third grounding conductor is configured to be spaced apart from the second upper surface on the second side surface. The second signal conductor is located on the second upper surface. The connecting component has a first connecting component and a second connecting component. The first connecting component electrically connects the first grounding conductor to the second grounding conductor. The second connecting component electrically connects the first signal conductor to the second signal conductor. The bonding material is a conductive paste located on the second side surface. In addition, the bonding material electrically connects the third grounding conductor to the first lower grounding conductor.

[0008] (2) In the wiring structure of (1) above, the insulator further includes a first opening having a first opening on the second side. The first opening has a first inner wall surface continuous with the second side. The third grounding conductor includes a first region located on the first inner wall surface. The bonding material is located in the first opening. In addition, the bonding material electrically connects the first region to the first lower grounding conductor.

[0009] (3) In the wiring structure of (2) above, the first opening is arranged on the second side surface so as to be spaced apart from the second upper surface.

[0010] (4) In the wiring structure according to any one of (1) to (3) above, the bonding material is disposed on the second side surface so as to be spaced apart from the second upper surface.

[0011] (5) In the wiring structure of (2) to (4) above, the first opening is arranged to overlap with the second ground conductor when viewed in plan from a direction perpendicular to the second upper surface.

[0012] (6) In the wiring structure of (2) to (5) above, the wiring substrate further includes a fourth grounding conductor located in the insulator. The fourth grounding conductor is electrically connected to the second grounding conductor. The insulator further includes a second opening having a second opening on the second side surface. The second opening has a second inner wall surface continuous with the second side surface. In addition, the second opening is configured to be separated from the first opening on the second side surface. The third grounding conductor also includes a second region located on the second inner wall surface. The fourth grounding conductor is continuous with the first region and the second region.

[0013] (7) In the wiring structure of (2) to (6) above, the wiring substrate further includes a fifth grounding conductor located within the insulator. The fifth grounding conductor is electrically connected to the second grounding conductor. The second side surface includes: a second upper side surface connected to the second upper surface; and a second lower side surface separated from the second upper surface and connected to the second upper side surface. The first opening portion includes a first opening on the second lower side surface. The fifth grounding conductor is located between the second upper side surface and the second lower side surface on the second side surface. In addition, the fifth grounding conductor is continuous with the first region. The bonding material is configured to be separated from the fifth grounding conductor on the second side surface.

[0014] (8) In the wiring structure of (7) above, when viewed in plan from a direction perpendicular to the first upper surface, a distance L1 between the second upper side surface and the first side surface is less than a distance L2 between the second lower side surface and the first side surface.

[0015] (9) The wiring structure of (1) to (8) further includes a base portion having a third upper surface. The first lower surface of the external substrate is located on the third upper surface. The bonding material bonds the first lower ground conductor and the base portion.

[0016] (10) In the wiring structure of (9), the base portion has a third side surface arranged opposite to the second side surface, and when viewed from a direction perpendicular to the first upper surface, the minimum distance between the third side surface and the second side surface is greater than the minimum distance between the first side surface and the second side surface.

[0017] (11) In the wiring structure described in any one of (1) to (10) above, the connecting member is a wire mainly composed of a metal material.

[0018] (12) In the wiring structure of any one of (1) to (11) above, the bonding material includes silver epoxy resin.

[0019] (13) An electronic module according to one embodiment of the present invention comprises the wiring structure of (1) to (12) above, a base, a frame, and a cover. The base has a wiring structure mounted on its upper surface. The frame is located on the upper surface of the base. The cover is located above the frame. The external substrate is an electronic circuit substrate. The external substrate is surrounded by the wiring substrate, the frame, and the cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a perspective view of a wiring structure according to one embodiment of the present invention.

[0021] Figure 2 This is a perspective view of an insulator according to one embodiment of the present invention.

[0022] Figure 3 Cut along Y1-Y1 Figure 1 Figure 2 shows a wiring structure.

[0023] Figure 4 It is a top view of a wiring structure according to one embodiment of the present invention.

[0024] Figure 5 This is an exploded perspective view of an electronic module including a wiring structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] <Configuration of Wiring Structure>

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. It should be noted that any direction of the wiring structure can be upward or downward, but for convenience, the orthogonal coordinate system xyz is defined, and the positive side of the z direction is defined as upward. In addition, in the present invention, the concept of top view includes top view perspective. In addition, the direction perpendicular to the first upper surface 11a refers to, for example, the z direction in the accompanying drawings. Figure 4 In the figure, the second lower side surface 22c2, the first inner wall surface 2211, the second inner wall surface 2222, and the third side surface 101c are represented by dotted lines in a perspective manner.

[0027] Reference Figure 1 to Figure 4 Wiring structure 100 according to one embodiment of the present invention is described. Wiring structure 100 includes: external substrate 1; wiring substrate 2; connection member 3 that electrically connects external substrate 1 and wiring substrate 2; and bonding material 4 that bonds external substrate 1 and wiring substrate 2.

[0028] like Figure 1 As shown, the external substrate 1 has a first substrate 11, a first ground conductor G1 and a first signal conductor S1. The external substrate 1 may be, for example, an electronic circuit substrate that performs signal processing such as converting an optical signal into an electrical signal or converting an electrical signal into an optical signal. In addition, the external substrate 1 may also be a flexible substrate (FPC: Flexible Printed Circuits). In the present invention, the electronic circuit substrate is a concept including optical semiconductor elements such as semiconductor lasers (LD) or photodiodes (PD), semiconductor integrated circuit elements, and sensor elements such as optical sensors. In the case where the external substrate 1 is an optical semiconductor element, the external substrate 1 can be formed of semiconductor materials such as gallium arsenide or gallium nitride, for example.

[0029] like Figure 1 to Figure 4 As shown, the first substrate 11 includes a first upper surface 11a, a first lower surface 11b on the opposite side of the first upper surface 11a, and a first side surface 11c connecting the first lower surface 11b and the first upper surface 11a. As the material of the first substrate 11, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, a dielectric material such as a glass ceramic material can be used. The first substrate 11 can be a structure with multiple insulating layers stacked, or a single layer. In addition, when the external substrate 1 is an electronic circuit substrate, as the material of the first substrate 11, for example, aluminum nitride, copper-tungsten alloy, etc. can be used.

[0030] like Figure 1As shown, the first grounding conductor G1 includes: a first upper grounding conductor G1a, which is located on the first upper surface 11a; and a first lower grounding conductor G1b, which is located on the first lower surface 11b and is electrically connected to the first upper grounding conductor G1a. In one embodiment, the first upper grounding conductor G1a is configured to extend along the x direction on the first upper surface 11a. As the material of the first grounding conductor G1, for example, metal materials such as gold, silver, copper, nickel, tungsten, molybdenum and manganese can be cited. In addition, the first grounding conductor G1 can be formed by sintering a metal paste on the first upper surface 11a, or by using a thin film forming technique such as an evaporation method or a sputtering method. The first grounding conductor G1 has a width of, for example, 0.05 mm to 2 mm and a length of, for example, 1.5 mm to 25 mm. The thickness of the first grounding conductor G1 is, for example, 0.01 mm to 0.1 mm. It should be noted that the width, length, and thickness of the first ground conductor G1 described here can be the size of the first ground conductor G1 in the y direction, the size of the first ground conductor G1 in the x direction, and the size of the first ground conductor G1 in the z direction, respectively. The width / length / thickness of the first signal conductor S1, the second signal conductor S2, and the second ground conductor G2 described later can also be defined in the same way.

[0031] like Figure 3 As shown, in one embodiment, the first upper grounding conductor G1a and the first lower grounding conductor G1b are electrically connected by a first through hole V1 provided in the first substrate 11. As long as the first upper grounding conductor G1a and the first lower grounding conductor G1b can be electrically connected, for example, the first upper grounding conductor G1a and the first lower grounding conductor G1b can be electrically connected by providing a conductor film on the first side surface 11c.

[0032] The first signal conductor S1 is located on the first upper surface 11a. In one embodiment, the first signal conductor S1 is arranged side by side with the first upper ground conductor G1a. With this structure, the impedance can be easily adjusted, thereby reducing the signal loss. The material of the first signal conductor S1 can be the same as the material of the first ground conductor G1, or it can be different. For example, the same material as the material of the first ground conductor G1 can be cited. In addition, the first signal conductor S1 can also be formed by the same method as the first ground conductor G1 mentioned above. The first signal conductor S1 has a width of, for example, 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm. The thickness of the first signal conductor S1 is, for example, 0.01 mm to 0.1 mm.

[0033] The wiring substrate 2 has an insulator 22, a second signal conductor S2, a second ground conductor G2, and a third ground conductor G3. Although not shown, the wiring substrate 2 is electrically connected to the external substrate 1, and a wire, a lead terminal, a flexible substrate, etc. may be further connected on the side not facing the external substrate 1. With this structure, in the electronic module 10, the wiring substrate 2 can be used as an input and output terminal for sending and receiving electrical signals.

[0034] like Figure 2 to Figure 4 As shown, the insulator 22 includes: a second upper surface 22a; a second lower surface 22b on the opposite side of the second upper surface 22a; and a second side surface 22c, which is connected to the second lower surface 22b and the second upper surface 22a and is arranged to be opposite to the first side surface 11c. As the material of the insulator 22, for example, a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body, a dielectric material such as a glass ceramic material can be used. It can be the same as the material of the first substrate 11 described above, or it can be different.

[0035] In addition, the insulator 22 may be a structure in which a plurality of dielectric materials are stacked, or may be a single layer. The size of the insulator 22 in a plan view is, for example, 4 mm×4 mm to 50 mm×50 mm, and the thickness is 0.5 mm to 10 mm. When the insulator 22 is composed of a plurality of layers, a plurality of conductors such as wiring formed of metal paste or the like may be arranged between the layers.

[0036] The second grounding conductor G2 is located on the second upper surface 22a and extends in the positive direction of the x-axis away from the second side surface 22c. The material of the second grounding conductor G2 may be the same as or different from the material of the first grounding conductor G1. For example, the material same as the material of the first grounding conductor G1 may be mentioned. In addition, the second grounding conductor G2 may also be formed by the same method as the first grounding conductor G1. The second grounding conductor G2 may have a width of, for example, 0.05 mm to 2 mm and a length of, for example, 1.5 mm to 25 mm. The thickness of the second grounding conductor G2 may be, for example, 0.01 mm to 0.1 mm.

[0037] An insulating film such as ceramic (e.g., alumina coating) or resin may be disposed on the first upper ground conductor G1a, the first signal conductor S1, the second ground conductor G2, and the second signal conductor S2. The insulating film may be disposed on the first upper ground conductor G1a, the first signal conductor S1, the second ground conductor G2, and the second signal conductor S2 by screen printing. In addition, the insulating film may be disposed only on a portion of each signal conductor. With this structure, the possibility of a short circuit between the first upper ground conductor G1a and the first signal conductor S1 can be reduced. With respect to the second ground conductor G2 and the second signal conductor S2, by disposing an insulating film, the same effect as described above can be achieved.

[0038] like Figure 2 and Figure 3 As shown, the third grounding conductor G3 is electrically connected to the second grounding conductor G2. In addition, the third grounding conductor G3 is configured to be spaced apart from the second upper surface 22a on the second side surface 22c. The material of the third grounding conductor G3 may be the same as or different from the material of the second grounding conductor G2. For example, the same material as the material of the second grounding conductor G2 described above may be cited. The third grounding conductor G3 may be formed by sintering a metal paste on the second side surface 22c, or may be formed using a thin film forming technique such as an evaporation method or a sputtering method. In one embodiment, the third grounding conductor G3 is electrically connected to the second grounding conductor G2 via a second through hole V2 formed in the insulator 22 and a fifth grounding conductor G5 described later.

[0039] like Figure 1 , Figure 2 , Figure 3 As shown, the second signal conductor S2 is located on the second upper surface 22a. The material of the second signal conductor S2 may be the same as or different from the material of the first grounding conductor G1. For example, the same material as the material of the aforementioned first grounding conductor G1 may be cited. In addition, the second signal conductor S2 may also be formed by the same method as the aforementioned first grounding conductor G1. The second signal conductor S2 may have a width of, for example, 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm. The thickness of the second signal conductor S2 may be, for example, 0.01 mm to 0.1 mm. In one embodiment, since the second signal conductor S2 is arranged side by side with the second grounding conductor G2, the second signal conductor S2 as a signal wiring can be set to a coplanar structure. By setting it to a coplanar structure, high-frequency signals can be smoothly conducted.

[0040] In addition, in one embodiment, the second signal conductor S2 and the second ground conductor G2 are arranged to extend in parallel, but they are not necessarily parallel. The second signal conductor S2 and the second ground conductor G2 may be separated or close to each other in the middle. That is, the distance between the second signal conductor S2 and the second ground conductor G2 in the y direction may also change in the middle. In addition, the second signal conductor S2 and the second ground conductor G2 may be bent in the middle.

[0041] In addition, if Figure 2 and Figure 4 As shown, the second signal conductor S2 may also include a connecting portion S2e, a first portion S2a, and a line portion S2b. In this case, the second connecting component 32 described later is connected to the connecting portion S2e. The line portion S2b extends along the x direction. The first portion S2a is configured to be sandwiched between the line portion S2b and the connecting portion S2e. In addition, the width of the first portion S2a may be smaller than the width of the first line portion S2b. With this structure, the inductance component can be increased in the second signal conductor S2.

[0042] In addition, the width of the connection portion S2e may be larger than that of the line portion S2b. With this structure, the connection portion S2e can be easily connected to the second connection member 32.

[0043] In addition, if Figure 4 As shown, in one embodiment, when viewed from the z direction, the second signal conductor S2 and the second ground conductor G2 are configured to extend to the second side surface 22c. With this structure, since the size and length of the connecting component 3 can be reduced, the possibility of impedance variation can be reduced in the connection portion between the first signal conductor S1 and the second signal conductor S2 and the connection portion between the first ground conductor G1 and the second ground conductor G2. In addition, the second signal conductor S2 and the second ground conductor G2 do not necessarily have to be configured to extend to the second side surface 22c. When viewed from the z direction, the second signal conductor S2 and the second ground conductor G2 can be configured to be spaced apart from the second side surface 22c in the x direction. With this structure, when the wiring substrate 2 is manufactured by cutting, the possibility of damage to the second signal conductor S2 and the second ground conductor G2 can be reduced.

[0044] like Figure 1 and Figure 3As shown, the connection component 3 includes a first connection component 31 and a second connection component 32. The first connection component 31 electrically connects the first ground conductor G1 and the second ground conductor G2. The second connection component 32 electrically connects the first signal conductor S1 and the second signal conductor S2. In one embodiment, the first connection component 31 and the second connection component 32 may be wires whose main component is a metal material. In this case, when viewed from the y direction, when the heights of the first upper surface 11a and the second upper surface 22a (the lengths in the z direction) are different, it is also easy to connect the external substrate 1 and the wiring substrate 2 through the connection component 3. In addition, the connection component 3 may also be a flexible substrate. In this case, the conductor line formed on the flexible substrate can be regarded as the first connection component 31 and the second connection component 32. In addition, either the first connection component 31 or the second connection component 32 may be a flexible substrate, or either may be a wire.

[0045] like Figure 1 As shown, when the wiring substrate 2 has the third signal conductor S3 and the sixth ground conductor G6 located on the second upper surface 22a, the connecting component 3 may also have a third connecting component 33 and a fourth connecting component 34. In addition, the external substrate 1 may also have a fourth signal conductor S4 and a seventh ground conductor G7 located on the first upper surface 11a. In this case, the third connecting component 33 electrically connects the third signal conductor S3 and the fourth signal conductor S4, and the fourth connecting component 34 electrically connects the sixth ground conductor G6 and the seventh ground conductor G7. With this structure, the second signal conductor S2 and the third signal conductor S3 can be regarded as a pair of differential signal lines, and the wiring substrate 2 can transmit differential signals.

[0046] In addition, the wiring substrate 2 may further include an eighth ground conductor G8 located between the second signal conductor S2 and the third signal conductor S3. When the second signal conductor S2 and the third signal conductor S3 are wiring patterns having a curved portion, etc., the influence of the phase shift between the second signal conductor S2 and the third signal conductor S3 can be reduced. Thus, good transmission of high-frequency signals can be achieved.

[0047] The bonding material 4 is a conductive paste located on the second side surface 22c. In addition, the bonding material 4 can electrically connect the third ground conductor G3 and the first lower ground conductor G1b. Figure 4 , the connecting component 3 is omitted. In one embodiment, the bonding material 4 may include silver epoxy resin. When the bonding material 4 includes silver epoxy resin, the silver epoxy resin has a higher viscosity than solder and brazing material, so the bonding material 4 is difficult to slide off. Therefore, it is easy to position the bonding material 4 at a desired position. It should be noted that the bonding material 4 may also be solder, brazing material, etc.

[0048] As described above, by electrically connecting the third ground conductor G3 and the first lower ground conductor G1b via the bonding material 4, the deviation of the ground potential between the external substrate 1 and the wiring substrate 2 can be eliminated, and the grounding state can be strengthened. Therefore, in the second signal conductor S2, the crosstalk characteristics can be improved during signal transmission. In addition, by adopting the above-mentioned structure, the external substrate 1 can be located close to the wiring substrate 2, so that the wiring structure 100 can be further miniaturized.

[0049] like Figure 2 and Figure 3 As shown, the insulator 22 may also have a first opening portion 221 having a first opening O1 on the second side surface 22c. In this case, the first opening portion 221 has a first inner wall surface 2211 that is continuous with the second side surface 22c. The third grounding conductor G3 includes a first region G31 located on the first inner wall surface 2211. The bonding material 4 is located in the first opening portion 221. In addition, the bonding material 4 electrically connects the first region G31 to the first lower grounding conductor G1b. That is, when viewed from the z direction, the bonding material 4 is located at a position up to the inside of the first opening portion 221. With this structure, the grounding state of the high-frequency signal wiring in the external substrate 1 and the wiring substrate 2 can be strengthened. In addition, the bonding strength between the external substrate 1 and the wiring substrate 2 can be improved.

[0050] In one embodiment, the first region G31 of the third grounding conductor G3 is a so-called castellated structure formed by applying metal paste on the first inner wall surface 2211 of the first opening 221 . The third grounding conductor G3 may also be a shape formed by dividing through holes filled with metal paste in the first inner wall surface 2211 .

[0051] like Figure 2 and Figure 3 As shown, the first opening portion 221 can also be configured to be spaced apart from the second upper surface 22a on the second side 22c. Through this structure, the possibility of a short circuit between the bonding material 4 located in the first opening portion 221 and the second signal conductor S2 or the connecting component 3 on the second upper surface 22a can be reduced. In addition, the first opening portion 221 is not limited to the structure as described above, and can also be a shape cut from the second upper surface 22a to the second side 22c. In this case, the grounding state of the high-frequency signal wiring can be further strengthened. When viewed from the z direction, the first opening portion 221 can be a quadrilateral shape, or a circular arc shape, or a quadrilateral shape with some corners rounded.

[0052] like Figure 3 As shown, the bonding material 4 may be arranged on the second side surface 22c with a gap therebetween from the second upper surface 22a. With this structure, the possibility of the bonding material 4 contacting the connection member 3 and causing a short circuit can be reduced.

[0053] When viewed from the z direction, the first opening 221 may also be configured to overlap with the second ground conductor G2. That is, the first opening 221 having the first inner wall surface 2211 on which the first region G31 of the third ground conductor G3 serving as a castellated structure is formed may also be formed below the second ground conductor G2.

[0054] in addition, Figure 4 As shown, in one embodiment, the width of the first opening 221 when viewed from the z direction (the size in the y direction) may also be less than the width of the second ground conductor G2. In addition, not limited to the above embodiment, the width of the first opening 221 may also be greater than the width of the second signal conductor S2.

[0055] like Figure 2 and Figure 3 As shown, the wiring substrate 2 may also have a fourth grounding conductor G4 located in the insulator 22. In this case, the fourth grounding conductor G4 is electrically connected to the second grounding conductor G2. It should be noted that the fourth grounding conductor G4 may be an inner grounding conductor layer, or may be located at the bottom layer of the insulator 22. The insulator 22 also has a second opening 222 having a second opening O2 on the second side 22c. The second opening 222 has a second inner wall surface 2222 that is continuous with the second side 22c. In addition, the second opening 222 is configured to be separated from the first opening 221 on the second side 22c. The third grounding conductor G3 also includes a second area G32 located on the second inner wall surface 2222. The fourth grounding conductor G4 is continuous with the first area G31 and the second area G32. By adopting the structure as described above, the grounding state of the wiring substrate 2 can be strengthened. In one embodiment, the second opening portion 222 is arranged side by side with the first opening portion 221 on the second lower side surface 22c2 described later. The first opening portion 221 and the second opening portion 222 may not necessarily be arranged side by side on the second lower side surface 22c2, and may also be arranged staggered in the z direction or the y direction.

[0056] In addition, in one embodiment, the bonding material 4 is located in the first opening 221 and the second opening 222. Therefore, since the bonding area in the wiring substrate 2 is increased, the bonding strength between the external substrate 1 and the wiring substrate 2 can be improved. It should be noted that the bonding material 4 located in the first opening 221 and the bonding material 4 located in the second opening 222 do not necessarily need to be arranged continuously, and the bonding material 4 located in the first opening 221 and the bonding material 4 located in the second opening 222 may also be arranged separately.

[0057] like Figure 4As shown, when the wiring substrate 2 has the sixth ground conductor G6 located on the second upper surface 22 a , the second opening 222 is arranged to overlap with the sixth ground conductor G6 when viewed in plan from the z direction.

[0058] like Figure 2 and Figure 3 As shown, the wiring substrate 2 may further include a fifth ground conductor G5 located inside the insulator 22. In this case, the fifth ground conductor G5 is an inner ground conductor layer and is electrically connected to the second ground conductor G2. The second side surface 22c includes: a second upper side surface 22c1 connected to the second upper surface 22a; and a second lower side surface 22c2 separated from the second upper surface 22a and connected to the second upper side surface 22c1. The first opening 221 includes a first opening on the second lower side surface. The fifth ground conductor G5 is located between the second upper side surface 22c1 and the second lower side surface 22c2 on the second side surface 22c. In addition, the fifth ground conductor G5 is continuous with the first region G31. The bonding material 4 may also be configured to be separated from the fifth ground conductor G5 on the second side surface 22c. By configuring the fifth ground conductor G5 inside the insulator 22, the ground potential can be strengthened. Furthermore, since the bonding material 4 is disposed at a distance from the fifth ground conductor G5 on the second side surface 22 c , the possibility of a short circuit between the bonding material 4 and the second signal conductor S2 or the connecting member 3 on the second upper surface 22 a can be reduced.

[0059] like Figure 3 and Figure 4 As shown, when viewed from the z direction, the distance L1 between the second upper side surface 22c1 and the first side surface 11c may be less than the distance L2 between the second lower side surface 22c2 and the first side surface 11c. That is, the second side surface 22c may also be in a step shape. In other words, when viewed from the z direction, the second lower side surface 22c2 may be further away from the first side surface 11c than the second upper side surface 22c1 in the positive direction of the x-axis. With this structure, when dielectric materials are stacked to form the insulator 22, the possibility of the insulator 22 colliding with the external substrate 1 can be reduced by utilizing the misalignment of the stacking so that a part of the layers protrude in the negative direction of x. Therefore, the possibility of damage to the external substrate 1 can be reduced.

[0060] like Figure 3As shown, it may also include a base portion 101 having a third upper surface 101a. In this case, the first lower surface 11b of the external substrate 1 is located on the third upper surface 101a. The bonding material 4 can bond the first lower grounding conductor G1b and the base portion 101. With this structure, it is easy to adjust the height of the external substrate 1 in the z direction, and the external substrate 1 and the wiring substrate 2 can be easily bonded using the connecting component 3. After the bonding material 4 is applied to the first lower surface 11b of the external substrate 1, it is bonded to the base portion 101 and the second side surface 22c, thereby forming a wiring structure 100 in one embodiment.

[0061] like Figure 3 As shown, the base portion 101 may also have a third side surface 101c configured to be opposite to the second side surface 22c. When viewed from the z direction, the minimum value of the distance between the third side surface 101c and the second side surface 22c is greater than the minimum value of the distance between the first side surface 11c and the second side surface 22c. With this structure, the bonding material 4 can easily form a fillet from the first lower surface 11b to the third side surface 101c, thereby improving the bonding strength between the external substrate 1 and the base portion 101. Figure 3 As shown, in one embodiment, the minimum value of the distance between the third side surface 101c and the second side surface 22c is, for example, the distance L3 between the third side surface 101c and the second upper side surface 22c1. In addition, in one embodiment, the minimum value of the distance between the first side surface 11c and the second side surface 22c is, for example, the distance L1 between the first side surface 11c and the second upper side surface 22c1.

[0062] <Electronic module configuration>

[0063] The electronic module 10 of one embodiment of the present invention includes a wiring structure 100, a base 102, a frame 103, and a cover 106. The electronic module 10 may further include a sealing ring 105. In one embodiment, the external substrate 1 is an electronic circuit substrate. When viewed from the z direction, the external substrate 1 is surrounded by the wiring substrate 2, the frame 103, and the cover 106.

[0064] like Figure 5 As shown, when viewed from the z direction, the wiring substrate 2 can be integrated with the U-shaped wall portion 104.

[0065] The base 102 has an upper surface, on which the wiring structure 100 is mounted. The base 102 is, for example, a quadrilateral shape when viewed from above, with a size of 10 mm×10 mm to 50 mm×50 mm, and a thickness of 0.5 mm to 20 mm. As the material of the base 102, for example, metal materials such as copper, iron, tungsten, molybdenum, nickel or cobalt or alloys containing these metal materials can be cited. In this case, the base 102 can also be a metal plate or a laminated body formed by laminating a plurality of metal plates. In addition, when the material of the base 102 is the above-mentioned metal material, in order to reduce oxidative corrosion, a gold-plated layer such as nickel or gold is formed on the surface of the base 102 using an electroplating method or an electroless plating method. In addition, the material of the base 102 is an insulating material, for example, it can also be a ceramic material such as an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body or a glass ceramic.

[0066] The frame 103 is located on the upper surface of the base 102, and when viewed from above, the frame 103 protects the external substrate 1 located inside. Figure 5 As shown, in one embodiment, the upper surface of the base 102 is surrounded by the frame 103 and the wall 104. That is, the external substrate 1 is surrounded by the frame 103 and the wall 104. In this way, the frame 103 may not surround the entire outer edge of the upper surface of the base 102. In addition, in one embodiment, although the frame 103 is arranged along the outer edge of the upper surface of the base 102, the frame 103 may be located further inside than the outer edge of the upper surface of the base 102.

[0067] The material of the frame 103 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, or an alloy containing these metal materials. In addition, the material of the frame 103 is an insulating material, for example, an alumina sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0068] The cover 106 is located above the frame 103. The cover 106 protects the external substrate 1 together with the frame 103. The cover 106 is, for example, a quadrilateral shape when viewed from above, with a size of 10 mm×10 mm to 50 mm×50 mm and a thickness of 0.5 mm to 2 mm. As the material of the cover 106, for example, metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum or tungsten or alloys formed by combining a plurality of these metal materials can be cited. By subjecting an ingot of such a metal material to a metal processing method such as a rolling method or a punching method, a metal component constituting the cover 106 can be manufactured.

[0069] The sealing ring 105 has the function of joining the cover 106 to the frame 103. The sealing ring 105 is located on the frame 103. As the material of the sealing ring 105, for example, metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum or tungsten or alloys formed by combining a plurality of these metal materials can be cited. It should be noted that, when the sealing ring 105 is not provided on the frame 103, the cover 106 can also be joined via an adhesive material such as solder, brazing material, glass or resin adhesive material.

[0070] It should be noted that various combinations of characteristic parts in one embodiment are not limited to the examples of the above-mentioned embodiment. In addition, each embodiment can also be combined with each other.

[0071] The wiring structure of one embodiment is configured as described above, so that the ground potential can be strengthened, thereby reducing the possibility of crosstalk occurring during signal transmission.

[0072] Industrial Applicability

[0073] The present invention can be used as a wiring structure and an electronic module.

[0074] Description of Reference Numerals

[0075] 1 external base plate

[0076] 11. First substrate

[0077] 11a First upper surface

[0078] 11b First lower surface

[0079] 11c First side

[0080] 2 Wiring substrate

[0081] 22 Insulator

[0082] 22a Second upper surface

[0083] 22b Second lower surface

[0084] 22c Second side

[0085] 22c1 second upper side

[0086] 22c2 second lower side

[0087] 221 First opening

[0088] O1 First opening

[0089] 2211 First inner wall surface

[0090] 222 Second opening

[0091] O2 Second opening

[0092] 2222 Second inner wall surface

[0093] 3 Connecting parts

[0094] 31 First connecting member

[0095] 32 Second connecting member

[0096] 33 Third connecting member

[0097] 34 Fourth connecting member

[0098] 4. Bonding materials

[0099] V1 First through hole

[0100] V2 Second through hole

[0101] S1 First signal conductor

[0102] S2 Second signal conductor

[0103] S3 Third signal conductor

[0104] S4 Fourth signal conductor

[0105] G1 First grounding conductor

[0106] G1a First upper ground conductor

[0107] G1b First lower ground conductor

[0108] G2 Second grounding conductor

[0109] G3 Third grounding conductor

[0110] G31 First Area

[0111] G32 Second Area

[0112] G4 Fourth grounding conductor

[0113] G5 Fifth grounding conductor

[0114] G6 Sixth grounding conductor

[0115] G7 Seventh grounding conductor

[0116] G8 Eighth grounding conductor

[0117] L1 Distance between the first side and the second upper side

[0118] L2 Distance between the first side and the second lower side

[0119] L3 Distance between the second side and the third side

[0120] 10 Electronic modules

[0121] 100 Wiring structure

[0122] 101 Base

[0123] 101a Third upper surface

[0124] 101c Third side

[0125] 102 Base

[0126] 103 Frame

[0127] 104 Wall

[0128] 105 Sealing ring

[0129] 106 Cover

Claims

1. A wiring structure, wherein: The wiring structure comprises: an external substrate; a wiring substrate; a connecting member that electrically connects the external substrate and the wiring substrate; and a bonding material that bonds the external substrate and the wiring substrate, The external substrate comprises: a first substrate, a first ground conductor and a first signal conductor. The first substrate includes: a first upper surface; a first lower surface opposite to the first upper surface; and a first side surface, the first side surface connecting the first lower surface and the first upper surface. The first grounding conductor includes: a first upper grounding conductor, the first upper grounding conductor is located on the first upper surface; and a first lower grounding conductor, the first lower grounding conductor is located on the first lower surface and is electrically connected to the first upper grounding conductor. The first signal conductor is located on the first upper surface, The wiring substrate includes an insulator, a second ground conductor, a second signal conductor, and a third ground conductor. The insulator includes: a second upper surface; a second lower surface on the opposite side of the second upper surface; and a second side surface, the second side surface connects the second lower surface and the second upper surface and is arranged to be opposite to the first side surface, The second grounding conductor is located on the second upper surface and extends in a first direction away from the second side surface. The second signal conductor is located on the second upper surface, The third grounding conductor is electrically connected to the second grounding conductor and is arranged on the second side surface to be spaced apart from the second upper surface. The connecting component has: a first connecting member electrically connecting the first grounding conductor and the second grounding conductor; and a second connecting member electrically connecting the first signal conductor and the second signal conductor, The bonding material is a conductive paste that is located on the second side surface and electrically connects the third ground conductor and the first lower ground conductor.

2. The wiring structure according to claim 1, wherein: The insulator further includes a first opening portion having a first opening on the second side surface, The first opening has a first inner wall surface continuous with the second side surface, The third ground conductor includes a first area located on the first inner wall surface, The bonding material is located in the first opening and electrically connects the first region and the first lower ground conductor.

3. The wiring structure according to claim 2, wherein: The first opening is arranged on the second side surface so as to be spaced apart from the second upper surface.

4. The wiring structure according to any one of claims 1 to 3, wherein: The bonding material is disposed on the second side surface so as to be spaced apart from the second upper surface.

5. The wiring structure according to claim 2 or 3, wherein: The first opening is arranged to overlap with the second ground conductor when viewed in plan from a direction perpendicular to the second upper surface.

6. The wiring structure according to claim 2 or 3, wherein: The wiring substrate further includes a fourth grounding conductor, the fourth grounding conductor being located in the insulator and electrically connected to the second grounding conductor. The insulator further has a second opening portion having a second opening on the second side surface, The second opening has a second inner wall surface continuous with the second side surface and is arranged to be separated from the first opening on the second side surface. The third grounding conductor also includes a second area located on the second inner wall surface, The fourth ground conductor is continuous with the first region and the second region.

7. The wiring structure according to claim 2 or 3, wherein: The wiring substrate further includes a fifth grounding conductor, the fifth grounding conductor being located in the insulator and electrically connected to the second grounding conductor. The second side surface includes: a second upper side surface connected to the second upper surface; and a second lower side surface spaced apart from the second upper surface and connected to the second upper side surface. The first opening portion has the first opening on the second lower side surface, The fifth ground conductor is located between the second upper side surface and the second lower side surface on the second side surface and is continuous with the first region. The bonding material is disposed on the second side surface so as to be spaced apart from the fifth ground conductor.

8. The wiring structure according to claim 7, wherein: When viewed in plan from a direction perpendicular to the first upper surface, a distance L1 between the second upper side surface and the first side surface is less than or equal to a distance L2 between the second lower side surface and the first side surface.

9. The wiring structure according to any one of claims 1 to 8, wherein: The wiring structure further includes a base portion having a third upper surface, The first lower surface of the external substrate is located on the third upper surface, The bonding material bonds the first lower ground conductor and the base portion.

10. The wiring structure according to claim 9, wherein: The base portion has a third side surface arranged opposite to the second side surface, When viewed in plan from a direction perpendicular to the first upper surface, a minimum value of a distance between the third side surface and the second side surface is greater than or equal to a minimum value of a distance between the first side surface and the second side surface.

11. The wiring structure according to any one of claims 1 to 10, wherein The connecting component is a wire with metal material as a main component.

12. The wiring structure according to any one of claims 1 to 11, wherein The bonding material includes silver epoxy.

13. An electronic module, wherein: The electronic module has: The wiring structure according to any one of claims 1 to 12; a base having the wiring structure mounted on an upper surface thereof; a frame portion, the frame portion being located on the upper surface of the base portion; as well as a cover body, the cover body being located at the frame portion, The external substrate is an electronic circuit substrate and is surrounded by the wiring substrate, the frame, and the cover.

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