Online cleaning all-in-one machine for semiconductor ball mounting steel mesh

Abstract

The online cleaning all-in-one machine comprises a supporting seat, the top of the supporting seat is fixedly connected with a fixing plate, the inner side of the fixing plate is provided with two grooves, the inner walls of the two grooves are each provided with two first conveying belts, the fixing plate is provided with four cameras, and the cameras are arranged on the two first conveying belts. The four cameras are located on the left side and the right side of the fixing plate correspondingly. According to the device and the method, when the semiconductor ball mounting steel mesh is subjected to jet cleaning, the jet cleaning time can be controlled according to the condition that dirt is attached to the surface of the semiconductor ball mounting steel mesh, so that the cleaning effect on the semiconductor ball mounting steel mesh with serious dirt is improved while the task of jet cleaning on the semiconductor ball mounting steel mesh is completed, and the service life of the semiconductor ball mounting steel mesh is prolonged. The cleaning time of the semiconductor ball mounting steel mesh with less dirt is saved, the cleaning efficiency of the semiconductor ball mounting steel mesh is integrally improved, and damage to the semiconductor ball mounting steel mesh with less dirt is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor ball planting steel mesh cleaning, and more specifically, to an online cleaning integrated machine for semiconductor ball planting steel mesh. Background Art

[0002] The online cleaning machine for semiconductor ball planting steel mesh is a device specially designed for cleaning steel mesh used in the semiconductor ball planting process. In semiconductor manufacturing, the ball planting steel mesh will have residual impurities such as solder paste and flux after repeated use, which will affect the quality and accuracy of ball planting. The cleaning machine can clean the steel mesh efficiently and thoroughly to ensure its continuous normal use.

[0003] When cleaning semiconductor ball planting steel mesh, jet cleaning and ultrasonic assisted cleaning are usually used in combination. The semiconductor ball planting steel mesh that needs to be cleaned will first be jet cleaned to rinse off the large area of ​​dirt (solid particles and sticky substances such as solder paste and flux) on the surface of the semiconductor ball planting steel mesh. Then the rinsed semiconductor ball planting steel mesh will be subjected to ultrasonic assisted cleaning to complete the cleaning of the semiconductor ball planting steel mesh. When cleaning the semiconductor ball planting steel mesh, usually multiple semiconductor ball planting steel meshes are cleaned at the same time, but the dirt on the surface of each semiconductor ball planting steel mesh is different. The semiconductor ball planting steel mesh is subjected to the same jet cleaning and ultrasonic assisted cleaning time, which will cause some areas of the semiconductor ball planting steel mesh with less surface dirt to be excessively cleaned, which can easily cause the mesh holes of the semiconductor ball planting steel mesh to deform and the surface roughness to increase, affecting the use effect and service life of the semiconductor ball planting steel mesh, and the semiconductor ball planting steel mesh with less surface dirt occupies the cleaning station during excessive cleaning, which leads to a decrease in the cleaning efficiency of the cleaning equipment. Therefore, an online cleaning all-in-one machine for semiconductor ball planting steel mesh is needed. Summary of the invention

[0004] In response to the problems existing in the prior art, the purpose of the present invention is to provide an all-in-one online cleaning machine for semiconductor ball planting steel mesh, which can control the duration of spray cleaning according to the amount of dirt attached to the surface of the semiconductor ball planting steel mesh, thereby improving the overall cleaning efficiency and quality of the semiconductor ball planting steel mesh and solving the background technology problems.

[0005] To achieve the above object, the present invention adopts the following technical solution: An online cleaning all-in-one machine for semiconductor ball planting steel mesh, comprising a support seat, a fixed plate fixedly connected to the top of the support seat, two grooves are arranged on the inner side of the fixed plate, two conveyor belts are installed on the inner walls of the two grooves, four cameras are installed on the fixed plate, the four cameras are respectively located on the left and right sides of the fixed plate, a spraying mechanism is arranged on the fixed plate, a screening mechanism is arranged on the top of the support seat, a box body is fixedly connected to the left side of the support seat, two ultrasonic generators are installed on the inner wall of the box body, a support column is fixedly connected to the inner wall of the box body, a rotating disk is rotatably connected to the left side of the support column, and the A motor is fixedly connected to the right side of the support column, and the output shaft of the motor passes through the support column and is fixedly connected to the rotating disk. Three working grooves are opened on the rotating disk, and the inner walls of the three working grooves are slidably connected with lifting frames. Three electric push rods 2 are embedded in the interior of the rotating disk, and one end of the three electric push rods 2 is respectively fixedly connected to the three lifting frames. The three lifting frames are all U-shaped, and two groups of equidistantly arranged storage strips are fixedly connected to the inner sides of the three lifting frames. A unloading mechanism is provided on the rotating disk, and a feeding mechanism is provided on the box body. A controller and an image analysis module are installed on the front of the support seat.

[0006] As a further description of the above technical solution: The spray washing mechanism includes two water boxes, and the opposite sides of the two water boxes are fixedly connected to the fixed plate. The two water boxes are vertically staggered. The backs of the two water boxes are connected to water inlet pipes, and the opposite sides of the two water boxes are connected to water outlet pipes arranged at equal distances. One end of the two groups of water outlet pipes is equipped with a spray head.

[0007] As a further description of the above technical solution: The screening mechanism includes a movable plate, the bottom of which is slidably connected to a support seat, an electric push rod three fixedly connected to the support seat is inserted on the back of the support seat, a connecting plate is fixedly connected to one end of the back of the electric push rod three, the front of the connecting plate is fixedly connected to the movable plate, the top of the movable plate is provided with horizontal grooves arranged at equal distances, the inner walls of the horizontal grooves are provided with two installation grooves, and two conveyor belts two are installed on the inner walls of the installation grooves.

[0008] As a further description of the above technical solution: The unloading mechanism includes three electric push rods four, the right ends of the three electric push rods four are inserted into the rotating disk and fixedly connected thereto, the left ends of the three electric push rods four are fixedly connected with an L-shaped plate, one side of the three L-shaped plates are slidably connected to the inner wall of the working groove, and one side of the three L-shaped plates are fixedly connected with a pushing plate.

[0009] As a further description of the above technical solution: The feeding mechanism comprises a feeding plate, the bottom of which is fixedly connected to the box body, and a conveyor belt three is installed on the top of the feeding plate.

[0010] As a further description of the above technical solution: The top of the feeding plate is fixedly connected to two guide plates, and the two guide plates are located on both sides of the front and back of the conveyor belt three.

[0011] As a further description of the above technical solution: A solenoid valve is installed on the water outlet pipe, and an input end of the solenoid valve is connected to a controller signal.

[0012] As a further description of the above technical solution: A splash plate is fixedly connected to the left side of the top water box, and the splash plate is located above the top water box.

[0013] As a further description of the above technical solution: Four electric push rods 5 fixedly connected to the fixed plate are inserted on the back side, and cleaning strips are fixedly connected to one end of the front side of the four electric push rods 5. A waste liquid tank is fixedly connected to the top of the support seat, and a drain pipe is connected to the right side of the waste liquid tank.

[0014] As a further description of the above technical solution: The inner bottom wall of the transverse groove is inclined toward one side of the fixed plate, and the movable plate is hollow. The front side of the box body is connected with a liquid extraction pipe, and a water pump is installed on the liquid extraction pipe. One end of the front side of the liquid extraction pipe is connected with a filter box, and a filter box slidably connected to the filter box is inserted through the front side of the filter box. The right side of the filter box is connected with a liquid delivery pipe, and the top of the liquid delivery pipe is connected with the movable plate, and the back side of the movable plate is connected with a return pipe, and the bottom end of the return pipe is connected with the box body. Two groups of heat conduction plates arranged at equal distances are fixedly connected to the inner wall of the transverse groove.

[0015] Compared with the prior art, the advantages of the present invention are: When the semiconductor ball planting steel mesh is spray-cleaned by this scheme, the duration of the spray cleaning can be controlled according to the dirt attached to the surface of the semiconductor ball planting steel mesh, thereby improving the cleaning effect of the semiconductor ball planting steel mesh with severe dirt while completing the spray cleaning task of the semiconductor ball planting steel mesh, saving the cleaning time of the semiconductor ball planting steel mesh with less dirt, improving the overall cleaning efficiency of the semiconductor ball planting steel mesh, and reducing the damage caused to the semiconductor ball planting steel mesh with less dirt; When performing ultrasonic-assisted cleaning on semiconductor ball planting steel meshes, semiconductor ball planting steel meshes that require similar cleaning time can be placed together for cleaning, and the duration of ultrasonic-assisted cleaning of the semiconductor ball planting steel meshes can be controlled. While completing the ultrasonic-assisted cleaning task of the semiconductor ball planting steel meshes, the cleaning effect of the semiconductor ball planting steel meshes with severe dirt can be improved, and the cleaning time of the semiconductor ball planting steel meshes with less dirt can be saved, thereby improving the cleaning efficiency of the semiconductor ball planting steel meshes as a whole, and reducing the deformation of the mesh holes of the semiconductor ball planting steel meshes and the increase in surface roughness; During the ultrasonic assisted cleaning process, the semiconductor ball planting steel mesh to be ultrasonically assisted cleaned later can be loaded, so as to utilize the time waiting for the ultrasonic assisted cleaning of the semiconductor ball planting steel mesh and effectively improve the cleaning efficiency of the semiconductor ball planting steel mesh. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is one of the three-dimensional diagrams of the present invention; Figure 2 This is the second stereogram of the present invention; Figure 3 The third is a three-dimensional diagram of the present invention; Figure 4 The fourth is a three-dimensional diagram of the present invention; Figure 5 A side perspective view of a fixing plate in the present invention; Figure 6 It is a position relationship diagram of the rotating disk and the feeding plate in the present invention; Figure 7 A side perspective view of a rotating disk in the present invention; Figure 8 For the present invention Figure 7 Enlarged view of part A in the middle; Fig. 9 is a side cross-sectional view of the rotating disk of the present invention; Fig.10 It is a three-dimensional diagram of the movable plate in the present invention.

[0017] Description of the numbers in the figure: 1. Support seat; 2. Fixed plate; 3. Groove; 4. Conveyor belt 1; 5. Camera; 6. Spraying mechanism; 601. Water box; 602. Water inlet pipe; 603. Water outlet pipe; 604. Spray head; 7. Screening mechanism; 701. Moving plate; 702. Electric push rod 3; 703. Horizontal groove; 704. Conveyor belt 2; 8. Box; 9. Ultrasonic generator; 10. Support column; 11. Rotating disk; 12. Motor; 13. Working groove; 14. Lifting frame; 15. Electric push rod 2; 16 , unloading mechanism; 161, electric push rod four; 162, L-shaped plate; 163, push plate; 17, feeding mechanism; 171, feeding plate; 172, conveyor belt three; 18, controller; 19, image analysis module; 20, guide plate; 21, solenoid valve; 22, splash plate; 23, electric push rod five; 24, cleaning bar; 25, waste liquid tank; 26, storage bar; 27, liquid extraction pipe; 28, water pump; 29, filter box; 30, liquid delivery pipe; 31, reflux pipe; 32, heat transfer plate. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0019] See also Figure 1-10In the present invention: an online cleaning machine for semiconductor ball planting steel mesh comprises a support seat 1, a fixed plate 2 is fixedly connected to the top of the support seat 1, two grooves 3 are arranged on the inner side of the fixed plate 2, two conveyor belts 4 are installed on the inner walls of the two grooves 3, four cameras 5 are installed on the fixed plate 2, the four cameras 5 are respectively located on the left and right sides of the fixed plate 2, a spray washing mechanism 6 is arranged on the fixed plate 2, a screening mechanism 7 is arranged on the top of the support seat 1, a box 8 is fixedly connected to the left side of the support seat 1, two ultrasonic generators 9 are installed on the inner wall of the box 8, a support column 10 is fixedly connected to the inner wall of the box 8, a rotating disk 11 is rotatably connected to the left side of the support column 10, and the support column 10 is rotatably connected to the left side of the support column 10. A motor 12 is fixedly connected to the right side of the support column 10, and the output shaft of the motor 12 passes through the support column 10 and is fixedly connected to the rotating disk 11. Three working grooves 13 are opened on the rotating disk 11, and the inner walls of the three working grooves 13 are slidably connected with lifting frames 14. Three electric push rods 15 are embedded in the interior of the rotating disk 11, and one end of the three electric push rods 15 is fixedly connected to the three lifting frames 14 respectively. The shape of the three lifting frames 14 is U-shaped, and the inner sides of the three lifting frames 14 are fixedly connected with two groups of equidistantly arranged storage strips 26. A feeding mechanism 16 is provided on the rotating disk 11, and a feeding mechanism 17 is provided on the box body 8. A controller 18 and an image analysis module are installed on the front of the support seat 1. Block 19; the spraying mechanism 6 includes two water boxes 601, and the opposite sides of the two water boxes 601 are fixedly connected to the fixed plate 2, the two water boxes 601 are vertically staggered, the backs of the two water boxes 601 are connected with water inlet pipes 602, and the opposite sides of the two water boxes 601 are connected with water outlet pipes 603 arranged at equal distances, and one end of the two groups of water outlet pipes 603 is installed with a nozzle 604; the screening mechanism 7 includes a movable plate 701, the bottom of the movable plate 701 is slidably connected to the support seat 1, and the back of the support seat 1 is interspersed with an electric push rod 3 702 fixedly connected thereto, and one end of the back of the electric push rod 3 702 is fixedly connected to a connecting plate, and the front of the connecting plate is fixedly connected to the movable plate 701 , the top of the movable plate 701 is provided with equidistantly arranged transverse grooves 703, and the inner wall of the transverse groove 703 is installed with two conveyor belts 2 704; the unloading mechanism 16 includes three electric push rods 4 161, the right ends of the three electric push rods 4 161 are inserted into the rotating disk 11 and fixedly connected thereto, the left ends of the three electric push rods 4 161 are fixedly connected with an L-shaped plate 162, one side of the three L-shaped plates 162 are slidably connected to the inner wall of the working groove 13, and one side of the three L-shaped plates 162 are fixedly connected with a pushing plate 163; the feeding mechanism 17 includes a feeding plate 171, the bottom of the feeding plate 171 is fixedly connected to the box body 8, and the top of the feeding plate 171 is installed with a conveyor belt 3 172.

[0020] In the present invention, when cleaning the semiconductor ball planting steel mesh, first insert the semiconductor ball planting steel mesh between two conveyor belts 4, the two conveyor belts 4 will contact the edges of the semiconductor ball planting steel mesh, and then the user turns on the conveyor belt 4 to drive the semiconductor ball planting steel mesh to be transported to the left. As the semiconductor ball planting steel mesh moves to the left, the semiconductor ball planting steel mesh will pass between the two water boxes 601. During the process, the user pressurizes the cleaning liquid and injects it into the water box 601 from the water inlet pipe 602. Then the cleaning liquid will be sprayed from the nozzle 604 on the water outlet pipe 603 to the top and back surfaces of the semiconductor ball planting steel mesh, thereby realizing double-sided spraying and flushing of the semiconductor ball planting steel mesh.

[0021] Before the semiconductor ball planting steel net passes through the two water boxes 601, the semiconductor ball planting steel net will pass between the two cameras 5 on the right. The camera 5 will transmit the front and back images of the semiconductor ball planting steel net to the image analysis module 19. The image analysis module 19 will analyze the image to determine the dirt attached to the surface of the semiconductor ball planting steel net. Then the data will be sent to the controller 18. During the flushing process, the controller 18 will control the speed of the conveyor belt 4 to drive the semiconductor ball planting steel net to move according to the amount of dirt on the surface of the semiconductor ball planting steel net. When there is a lot of dirt on the part where the cleaning liquid sprayed by the nozzle 604 contacts the semiconductor ball planting steel net , the controller 18 will control the conveyor belt 4 to slowly convey the semiconductor ball planting steel mesh. If there is only a small amount of dirt attached to the position where the cleaning liquid contacts the semiconductor ball planting steel mesh, the conveyor belt 4 can appropriately speed up the conveyance of the semiconductor ball planting steel mesh, thereby shortening the time for spraying and flushing the semiconductor ball planting steel mesh with less dirt while ensuring the completion of the task of spraying and flushing the semiconductor ball planting steel mesh, thereby effectively improving the efficiency of spraying and flushing the semiconductor ball planting steel mesh, and reducing the time that the semiconductor ball planting steel mesh is impacted by the high-pressure cleaning liquid, thereby reducing the damage to the semiconductor ball planting steel mesh caused by spraying and flushing.

[0022] After the spray cleaning is completed, the semiconductor ball planting steel net will continue to be transported to the left, and the semiconductor ball planting steel net that has been spray cleaned will then be inserted into the middle horizontal groove 703, and then the two conveyor belts 2 704 will contact the semiconductor ball planting steel net, and the conveyor belt 2 704 will be turned on to drive the right side of the semiconductor ball planting steel net to align with the right side of the movable plate 701, and the placement of the semiconductor ball planting steel net can be completed, and by turning on the electric push rod 3 702, different horizontal grooves 703 can be controlled to align with the semiconductor ball planting steel net on the fixed plate 2, and then the semiconductor ball planting steel net can be selected to enter the specified horizontal groove 703. Before that, the semiconductor ball planting steel net will pass between the two cameras 5 on the left. 5 will record the image of the semiconductor ball planting steel mesh after the spray cleaning, the image analysis module 19 will process the image and analyze the dirt situation on the surface of the semiconductor ball planting steel mesh after the spray cleaning, and the controller 18 will then analyze the duration of ultrasonic assisted cleaning required for the semiconductor ball planting steel mesh according to the dirt situation, and classify the semiconductor ball planting steel mesh according to the duration of ultrasonic assisted cleaning required for the semiconductor ball planting steel mesh, and move the semiconductor ball planting steel meshes with similar ultrasonic assisted cleaning durations to the same horizontal groove 703, thereby completing the screening according to the duration of ultrasonic assisted cleaning required for the semiconductor ball planting steel mesh, and realizing the classification of the semiconductor ball planting steel mesh according to the duration of ultrasonic assisted cleaning.

[0023] After the semiconductor ball planting steel nets are classified and placed, the user first turns on the electric push rod 2 15, which will drive the lifting frame 14 to rise. After the lifting frame 14 rises, it will drive the storage bar 26 above it to rise. A storage space is formed between two adjacent storage bars 26 at the same height. Each storage space is used to clamp the semiconductor ball planting steel net until the top storage space is aligned with a group of semiconductor ball planting steel nets on the horizontal groove 703. At this time, the conveyor belt 2 704 where the aligned semiconductor ball planting steel nets are located is started. At this time, the semiconductor ball planting steel net on the far left will It is driven by the second conveyor belt 704 to the top storage space, and then the user turns on the second electric push rod 15 to adjust the second storage space to the same height as the semiconductor ball planting steel net. The second conveyor belt 704 can be turned on again to complete the placement of the second semiconductor ball planting steel net. Similarly, the same group of semiconductor ball planting steel nets can be placed in the same lifting frame 14. After the semiconductor ball planting steel nets are successfully placed, the user turns on the second electric push rod 15 in the reverse direction until the lifting frame 14 falls back into the working groove 13. At this time, the loading of a group of semiconductor ball planting steel nets is completed.

[0024] Then the user turns on the motor 12 to drive the rotating disk 11 to rotate one hundred and twenty degrees. At this time, a lifting frame 14 located in the box body 8 will move to the left side of the movable plate 701. The user turns on the electric push rod 3 702 to drive the movable plate 701 to move, and then adjust the other group of semiconductor ball planting steel nets to be flush with the storage space on the lifting frame 14. Similarly, the loading of this group of semiconductor ball planting steel nets can be realized.

[0025] After completing the loading of the two sets of semiconductor ball planting steel meshes, the user turns on the motor 12 to drive the rotating disk 11 to rotate until the lifting frame 14 with the semiconductor ball planting steel meshes is located in the box body 8. At this time, the two sets of semiconductor ball planting steel meshes will be immersed in the cleaning liquid in the box body 8. At this time, the user turns on the ultrasonic generator 9 to perform ultrasonic-assisted cleaning on the two sets of semiconductor ball planting steel meshes immersed in the cleaning liquid.

[0026] As attached Figure 7 As shown, the semiconductor ball planting steel meshes in the two lifting frames 14 at the bottom are immersed in the cleaning liquid, and the two groups of semiconductor ball planting steel meshes are ultrasonically assisted cleaning at the same time. The storage space at the top can be used for loading operations at this time. Since the semiconductor ball planting steel meshes in each lifting frame 14 require different ultrasonic assisted cleaning times, one group of semiconductor ball planting steel meshes will be cleaned first. At this time, the user can turn on the motor 12 to drive the rotating disk 11 to rotate, and can remove the semiconductor ball planting steel mesh that has been cleaned first from the box body 8. At this time, the semiconductor ball planting steel mesh that has not been cleaned will still be immersed in the cleaning liquid for cleaning. This ensures that the semiconductor ball planting steel mesh that has not been cleaned is continuously cleaned, and can avoid the semiconductor ball planting steel mesh that has been cleaned first from being over-cleaned, reduce the deformation of the semiconductor ball planting steel mesh mesh and the increase in surface roughness, and the semiconductor ball planting steel mesh that has just been loaded will enter the cleaning liquid, so that the semiconductor ball planting steel mesh that has just been loaded can be cleaned, and then when the cleaned semiconductor ball planting steel mesh is separated from the cleaning liquid, the automatic loading of the semiconductor ball planting steel mesh can be realized.

[0027] After the semiconductor ball planting steel net is cleaned and separated from the box body 8, the semiconductor ball planting steel net will be located on the right side of the feeding plate 171. At this time, the user turns on the electric push rod four 161 to drive the L-shaped plate 162 to move to the left, and the pushing plate 163 will move to the left and contact with the semiconductor ball planting steel net. With the movement of the pushing plate 163, the semiconductor ball planting steel net on the storage strip 26 will be pushed to the top of the conveyor belt three 172 on the feeding plate 171. At this time, turning on the conveyor belt three 172 can drive the semiconductor ball planting steel net to be transported to the next link, thereby completing the cleaning of a group of semiconductor ball planting steel nets.

[0028] The user can choose to remove the semiconductor ball planting steel mesh from the box 8 according to the time required for ultrasonic assisted cleaning of the semiconductor ball planting steel mesh, thereby reducing the time for cleaning the semiconductor ball planting steel mesh while ensuring effective cleaning of the semiconductor ball planting steel mesh, thereby improving the cleaning efficiency of the device, and there are three lifting frames 14 on the rotating disk 11. During the process of two lifting frames 14 driving two groups of semiconductor ball planting steel meshes to be ultrasonically assisted cleaned in the box 8, the user can send the other group of semiconductor ball planting steel meshes into the top lifting frame 14, thereby realizing the utilization of the time waiting for ultrasonic assisted cleaning of the semiconductor ball planting steel mesh, and effectively improving the cleaning efficiency of the semiconductor ball planting steel mesh.

[0029] See also Figure 1 , 2 , 3, 4, 6 and 7, wherein: the top of the feeding plate 171 is fixedly connected to two guide plates 20, and the two guide plates 20 are located on the front and back sides of the conveyor belt three 172.

[0030] In the present invention, the provision of the guide plate 20 can prevent the semiconductor ball implanting steel mesh from sliding off the feeding plate 171 after cleaning, thereby improving the practicability of the device.

[0031] See also Figure 5 , wherein: a solenoid valve 21 is installed on the water outlet pipe 603 , and the input end of the solenoid valve 21 is connected to the controller 18 signal.

[0032] In the present invention, the setting of the solenoid valve 21 can control the opening and closing of some water outlet pipes 603. After closing one of the solenoid valves 21, the nozzle 604 located on the water outlet pipe 603 will stop discharging water, and the semiconductor ball planting steel mesh part below the nozzle 604 will lose the flushing effect. In this way, the nozzle 604 corresponding to the semiconductor ball planting steel mesh surface without dirt can be closed, thereby reducing the use of cleaning fluid while reducing damage to the semiconductor ball planting steel mesh.

[0033] See also Figure 2 , wherein: a splash plate 22 is fixedly connected to the left side of the top water box 601 , and the splash plate 22 is located above the top water box 601 .

[0034] In the present invention, the provision of the splash plate 22 can prevent the sprayed cleaning liquid from being ejected into the air and polluting the working environment, thereby improving the practicability of the device.

[0035] See also Figure 5 , wherein: four electric push rods 5 23 fixedly connected to the back of the fixed plate 2 are inserted, one end of the front of the four electric push rods 5 23 is fixedly connected to a cleaning strip 24, the top of the support seat 1 is fixedly connected to a waste liquid tank 25, and the right side of the waste liquid tank 25 is connected to a drain pipe.

[0036] In the present invention, before the camera 5 takes a picture of the semiconductor ball implanting steel mesh, the user turns on the electric push rod 5 23 to drive the cleaning bar 24 to move. After the cleaning bar 24 moves, it will slide along the surface of the camera 5, and then scrape off the dust and water droplets attached to the surface of the camera 5, so as to maintain the camera 5 The shooting effect of the semiconductor ball implanting steel mesh, the waste liquid tank 25 is set to collect and recycle the cleaning liquid used for spraying.

[0037] See also Figure 1 , 2 , 3, 4 and 10, wherein: the inner bottom wall of the transverse groove 703 is inclined toward one side of the fixed plate 2, the movable plate 701 is hollow, the front of the box body 8 is connected with a liquid extraction pipe 27, on which a water pump 28 is installed, one end of the front of the liquid extraction pipe 27 is connected with a filter box 29, the front of the filter box 29 is interspersed with a filter box slidably connected thereto, the right side of the filter box 29 is connected with a liquid delivery pipe 30, the top of the liquid delivery pipe 30 is connected to the movable plate 701, the back of the movable plate 701 is connected with a reflux pipe 31, the bottom end of the reflux pipe 31 is connected to the box body 8, and two groups of heat conduction plates 32 arranged at equal distances are fixedly connected to the inner wall of the transverse groove 703.

[0038] In the present invention, the cleaning liquid sprayed on the semiconductor ball planting steel net held and transported by the two conveyor belts 704 in the transverse groove 703 will remain, and the cleaning liquid on the semiconductor ball planting steel net will drip into the transverse groove 703. The inner bottom wall of the transverse groove 703 is inclined toward the waste liquid tank 25, so that the cleaning liquid dripping on the semiconductor ball planting steel net can be guided, and the cleaning liquid will flow into the waste liquid tank 25 for collection and waiting for subsequent recycling, thereby improving the practicality of the device; When the user turns on the water pump 28, the water pump 28 will pump the cleaning liquid into the box 8, and the cleaning liquid will enter the filter box 29 from the liquid extraction pipe 27 and be filtered by the filter box. The filtered cleaning liquid will enter the movable plate 701 from the liquid delivery pipe 30 and flow back to the box 8 from the reflux pipe 31, thereby achieving the effect of filtering and circulating the cleaning liquid, effectively reducing the impact of impurities in the cleaning liquid on the effect of ultrasonic-assisted cleaning, and improving the effect of ultrasonic-assisted cleaning on the semiconductor ball planting steel mesh.

[0039] Ultrasonic cleaning of semiconductor ball implanting steel mesh is mainly through ultrasonic cavitation effect. During the process, the temperature of the cleaning liquid inside the box 8 will gradually rise. At this time, when the heated cleaning liquid flows in the movable plate 701, the hollow space inside the movable plate 701 just provides a diffusion space for the heated cleaning liquid, which can better absorb the heat in the cleaning liquid, thereby achieving the effect of controlling the temperature of the cleaning liquid in the box 8, avoiding overheating of the cleaning liquid in the box 8 and causing the cleaning liquid to fail.

[0040] When the semiconductor ball planting steel mesh is being transported by the conveyor belt 2 704, multiple heat conducting plates 32 will slide across the surface of the semiconductor ball planting steel mesh, and then scrape off the cleaning liquid used for spray cleaning remaining on the surface of the semiconductor ball planting steel mesh, to prevent the cleaning liquid used for spray cleaning from flowing into the cleaning liquid used for ultrasonic assisted cleaning in the box 8, dilute the ultrasonic assisted cleaning liquid, and improve the effect of ultrasonic assisted cleaning. In addition, the heat conducting plates 32 can absorb the heat of the movable plate 701, and transfer the heat on the movable plate 701 to the semiconductor ball planting steel mesh, thereby preheating the semiconductor ball planting steel mesh. If preheating is not performed, the cold steel mesh is suddenly placed in a cleaning liquid with a higher temperature, and thermal stress will be generated on the surface and inside of the steel mesh due to the temperature difference. This thermal stress may cause slight deformation of the steel mesh or micro cracks inside the steel mesh. By preheating the steel mesh to make its temperature close to the temperature of the cleaning liquid, the generation of this thermal stress can be reduced, the structural integrity of the steel mesh can be protected, and the service life of the steel mesh can be extended.

[0041] Finally, it should be noted that in all the conveying processes involved in this case, the conveying operation is completed by using the mutual friction between the conveyor belt and the surface of the semiconductor ball planting steel mesh, and during the conveying process, technical personnel in this field can easily ensure the stability of the conveying operation by adjusting the friction coefficient.

[0042] The above are only preferred specific implementations of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and improved concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An online cleaning machine for semiconductor ball implanting steel mesh, comprising a support base (1), characterized in that: The top of the support seat (1) is fixedly connected to a fixed plate (2), the inner side of the fixed plate (2) is provided with two grooves (3), the inner walls of the two grooves (3) are each provided with two conveyor belts (4), the fixed plate (2) is provided with four cameras (5), the four cameras (5) are respectively located on the left and right sides of the fixed plate (2), the fixed plate (2) is provided with a spray washing mechanism (6), the top of the support seat (1) is provided with a screening mechanism (7), the left side of the support seat (1) is fixedly connected to a box body (8), the inner wall of the box body (8) is provided with two ultrasonic generators (9), the inner wall of the box body (8) is fixedly connected to a support column (10), the left side of the support column (10) is rotatably connected to a rotating disk (11), the right side of the support column (10) is fixedly connected to a motor (12), and the The output shaft of the motor (12) passes through the support column (10) and is fixedly connected to the rotating disk (11); three working grooves (13) are provided on the rotating disk (11); the inner walls of the three working grooves (13) are slidably connected to a lifting frame (14); three electric push rods (15) are embedded inside the rotating disk (11); one end of the three electric push rods (15) is respectively fixedly connected to the three lifting frames (14); the three lifting frames (14) are all U-shaped; the inner sides of the three lifting frames (14) are fixedly connected to two groups of storage bars (26) arranged at equal distances; a feeding mechanism (16) is provided on the rotating disk (11); a feeding mechanism (17) is provided on the box body (8); and a controller (18) and an image analysis module (19) are installed on the front of the support seat (1).

2. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 1, characterized in that: The spray washing mechanism (6) comprises two water boxes (601), the opposite sides of the two water boxes (601) are fixedly connected to the fixed plate (2), the two water boxes (601) are vertically staggered, the backs of the two water boxes (601) are connected to water inlet pipes (602), the opposite sides of the two water boxes (601) are connected to water outlet pipes (603) arranged at equal distances, and one end of the two groups of water outlet pipes (603) is installed with a spray head (604).

3. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 1, characterized in that: The screening mechanism (7) comprises a movable plate (701), the bottom of the movable plate (701) is slidably connected to the support seat (1), the back of the support seat (1) is interspersed with an electric push rod three (702) fixedly connected thereto, one end of the back of the electric push rod three (702) is fixedly connected to a connecting plate, the front of the connecting plate is fixedly connected to the movable plate (701), the top of the movable plate (701) is provided with horizontal grooves (703) arranged at equal distances, the inner wall of the horizontal groove (703) is provided with two installation grooves, and the inner wall of the installation groove is installed with two conveyor belts two (704).

4. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 1, characterized in that: The unloading mechanism (16) comprises three electric push rods (161), the right ends of the three electric push rods (161) are inserted into the rotating disk (11) and fixedly connected thereto, the left ends of the three electric push rods (161) are fixedly connected to an L-shaped plate (162), one side of the three L-shaped plates (162) are slidably connected to the inner wall of the working groove (13), and one side of the three L-shaped plates (162) are fixedly connected to a push plate (163).

5. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 1, characterized in that: The feeding mechanism (17) comprises a feeding plate (171), the bottom of the feeding plate (171) is fixedly connected to the box body (8), and a conveyor belt three (172) is installed on the top of the feeding plate (171).

6. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 5, characterized in that: Two guide plates (20) are fixedly connected to the top of the feeding plate (171), and the two guide plates (20) are located on both sides of the front and back of the conveyor belt three (172).

7. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 2, characterized in that: The water outlet pipe (603) is provided with a solenoid valve (21), and an input end of the solenoid valve (21) is connected to a controller (18) for signal transmission.

8. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 2, characterized in that: A splash plate (22) is fixedly connected to the left side of the top water box (601), and the splash plate (22) is located above the top water box (601).

9. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 1, characterized in that: Four electric push rods (23) fixedly connected to the fixed plate (2) are inserted into the back of the fixed plate (2), and a cleaning strip (24) is fixedly connected to one end of the front of the four electric push rods (23). A waste liquid tank (25) is fixedly connected to the top of the support seat (1), and a drain pipe is connected to the right side of the waste liquid tank (25).

10. The online cleaning machine for semiconductor ball implanting steel mesh according to claim 3, characterized in that: The inner bottom wall of the transverse groove (703) is inclined toward one side of the fixed plate (2); the movable plate (701) is hollow; the front side of the box body (8) is connected to a liquid extraction pipe (27); a water pump (28) is installed on the liquid extraction pipe (27); one end of the front side of the liquid extraction pipe (27) is connected to a filter box (29); a filter box slidably connected to the filter box (29) is inserted through the front side of the filter box (29); the right side of the filter box (29) is connected to a liquid delivery pipe (30); the top end of the liquid delivery pipe (30) is connected to the movable plate (701); the back side of the movable plate (701) is connected to a return pipe (31); the bottom end of the return pipe (31) is connected to the box body (8); and two groups of heat conduction plates (32) arranged at equal distances are fixedly connected to the inner wall of the transverse groove (703).

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