An integrated online cleaning machine for semiconductor ball-mounting stencils

Abstract

This invention discloses an integrated online cleaning machine for semiconductor ball-mounted stencils, comprising a support base, a fixed plate fixedly connected to the top of the support base, two grooves formed on the inner side of the fixed plate, two conveyor belts installed on the inner walls of each groove, and four cameras mounted on the fixed plate, located on the left and right sides of the fixed plate respectively. This invention, when performing jet cleaning on semiconductor ball-mounted stencils, can control the jet cleaning duration according to the amount of dirt adhering to the surface of the stencil, thereby improving the cleaning effect on heavily soiled stencils while saving cleaning time on less soiled stencils, thus improving the overall cleaning efficiency of semiconductor ball-mounted stencils and reducing damage to less soiled stencils.

Description

Technical Field

[0001] This invention relates to the field of semiconductor ball-mounted stencil cleaning technology, and more specifically, to an integrated online cleaning machine for semiconductor ball-mounted stencils. Background Technology

[0002] The online cleaning machine for semiconductor ball-mounting stencils is a device specifically designed for cleaning the stencils used in the semiconductor ball-mounting process. In semiconductor manufacturing, after multiple uses, the stencils often retain impurities such as solder paste and flux, affecting the quality and precision of the ball-mounting process. This cleaning machine can efficiently and thoroughly clean the stencils, ensuring their continued normal use.

[0003] The cleaning of semiconductor ball-mounted stencils typically involves a combination of jet cleaning and ultrasonic-assisted cleaning. The stencils are first jet-cleaned to remove large areas of surface contaminants (solder paste, flux, and other solid particles and sticky substances). Then, they undergo ultrasonic cleaning to complete the cleaning process. Multiple stencils are usually cleaned simultaneously, but the surface contaminants vary. The equal duration of jet cleaning and ultrasonic cleaning can lead to over-cleaning of areas with less contaminant, potentially causing mesh deformation and increased surface roughness, thus affecting the stencil's performance and lifespan. Furthermore, over-cleaning of less contaminated areas occupies cleaning stations, reducing the cleaning efficiency of the equipment. Therefore, an integrated online cleaning machine for semiconductor ball-mounted stencils is needed. Summary of the Invention

[0004] To address the problems existing in the prior art, the present invention aims to provide an integrated online cleaning machine for semiconductor ball-mounted stencils. This machine can control the duration of spray cleaning based on the amount of dirt adhering to the surface of the semiconductor ball-mounted stencil, thereby improving the overall cleaning efficiency and quality of the semiconductor ball-mounted stencil and solving the problems in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution;

[0006] An integrated online cleaning machine for semiconductor ball-mounted stencils includes a support base, a fixed plate fixedly connected to the top of the support base, two grooves on the inner side of the fixed plate, two conveyor belts installed on the inner walls of each groove, four cameras mounted on the fixed plate, located on the left and right sides of the fixed plate respectively, a spraying mechanism on the fixed plate, a screening mechanism on the top of the support base, a housing fixedly connected to the left side of the support base, two ultrasonic generators installed on the inner wall of the housing, a support column fixedly connected to the inner wall of the housing, and a rotating disk rotatably connected to the left side of the support column. A motor is fixedly connected to the right side of the support column. The output shaft of the motor passes through the support column and is fixedly connected to the rotating disk. The rotating disk has three working slots, and lifting frames are slidably connected to the inner walls of the three working slots. Three electric push rods are embedded inside the rotating disk. One end of each of the three electric push rods is fixedly connected to the three lifting frames. The three lifting frames are all U-shaped. Two sets of equally spaced storage strips are fixedly connected to the inner sides of each of the three lifting frames. A feeding mechanism is provided on the rotating disk, and a feeding mechanism is provided on the box. A controller and an image analysis module are installed on the front of the support base.

[0007] As a further description of the above technical solution:

[0008] The spraying mechanism includes two water boxes, each with one side fixedly connected to a fixed plate. The two water boxes are vertically staggered, and each water box has an inlet pipe connected to its back. Each water box has an outlet pipe arranged at equal intervals connected to one side. A spray nozzle is installed at one end of each of the two outlet pipes.

[0009] As a further description of the above technical solution:

[0010] The screening mechanism includes a movable plate, the bottom of which is slidably connected to a support base. An electric push rod three is inserted through the back of the support base and fixedly connected thereto. A connecting plate is fixedly connected to one end of the back of the electric push rod three. The front of the connecting plate is fixedly connected to the movable plate. The top of the movable plate has horizontal grooves arranged at equal intervals. Two mounting slots are opened on the inner wall of each horizontal groove. Two conveyor belts two are installed on the inner wall of each mounting slot.

[0011] As a further description of the above technical solution:

[0012] The feeding mechanism includes three electric push rods, the right ends of which are inserted into and fixedly connected to the rotating disk, and the left ends of which are fixedly connected to an L-shaped plate. One side of each L-shaped plate is slidably connected to the inner wall of the working groove, and one side of each L-shaped plate is fixedly connected to a pusher plate.

[0013] As a further description of the above technical solution:

[0014] The feeding mechanism includes a feeding plate, the bottom of which is fixedly connected to the box body, and a conveyor belt is installed on the top of the feeding plate.

[0015] As a further description of the above technical solution:

[0016] Two guide plates are fixedly connected to the top of the feeding plate, and the two guide plates are located on the front and back sides of the conveyor belt.

[0017] As a further description of the above technical solution:

[0018] A solenoid valve is installed on the water outlet pipe, and the input end of the solenoid valve is connected to the controller signal.

[0019] As a further description of the above technical solution:

[0020] A splash guard is fixedly connected to the left side of the top water box, and the splash guard is located above the top water box.

[0021] As a further description of the above technical solution:

[0022] Four electric push rods are inserted through the back of the fixing plate and fixedly connected thereto. A cleaning strip is fixedly connected to one end of the front of each of the four electric push rods. A waste liquid tank is fixedly connected to the top of the support base. A drain pipe is connected to the right side of the waste liquid tank.

[0023] As a further description of the above technical solution:

[0024] The inner bottom wall of the transverse groove is inclined towards one side of the fixed plate. The movable plate is hollow. The front of the box is connected to a liquid extraction pipe, and a water pump is installed on the liquid extraction pipe. One end of the front of the liquid extraction pipe is connected to a filter box. A filter box is slidably connected to the front of the filter box. The right side of the filter box is connected to a liquid delivery pipe. The top end of the liquid delivery pipe is connected to the movable plate. The back of the movable plate is connected to a return pipe. The bottom end of the return pipe is connected to the box. Two sets of heat-conducting plates arranged at equal intervals are fixedly connected to the inner wall of the transverse groove.

[0025] Compared with the prior art, the advantages of this invention are:

[0026] This solution allows for spray cleaning of semiconductor ball-mounted stencils by controlling the spray cleaning duration based on the level of dirt on the stencil surface. This improves the cleaning effect on heavily soiled stencils while saving cleaning time on less soiled stencils, thus enhancing overall cleaning efficiency and reducing damage to less soiled stencils.

[0027] When performing ultrasonic-assisted cleaning on semiconductor ball-mounted stencils, stencils with similar cleaning times can be placed together for cleaning. By controlling the duration of ultrasonic-assisted cleaning, the cleaning effect on heavily soiled stencils can be improved while completing the ultrasonic cleaning task. This saves time on cleaning stencils with less soiling, thereby improving the overall cleaning efficiency and reducing the occurrence of mesh deformation and increased surface roughness.

[0028] During the ultrasonic-assisted cleaning process, the semiconductor ball-mounted stencil to be ultrasonically cleaned can be fed in, making use of the waiting time for the ultrasonic cleaning of the semiconductor ball-mounted stencil and effectively improving the cleaning efficiency of the semiconductor ball-mounted stencil. Attached Figure Description

[0029] Figure 1 This is one of the perspective views of the present invention;

[0030] Figure 2 This is a second perspective view of the present invention;

[0031] Figure 3 This is a third perspective view of the present invention;

[0032] Figure 4 This is the fourth perspective view of the present invention;

[0033] Figure 5 This is a side perspective view of the fixing plate in this invention;

[0034] Figure 6 This is a diagram showing the positional relationship between the rotary disk and the feeding plate in this invention;

[0035] Figure 7 This is a side perspective view of the rotating disk in this invention;

[0036] Figure 8 For the present invention Figure 7 Enlarged view of section A;

[0037] Figure 9 This is a side sectional view of the rotating disk in this invention;

[0038] Figure 10 This is a perspective view of the movable plate in this invention.

[0039] Explanation of the labels in the diagram:

[0040] 1. Support base; 2. Fixing plate; 3. Groove; 4. Conveyor belt one; 5. Camera; 6. Spraying mechanism; 601. Water box; 602. Inlet pipe; 603. Outlet pipe; 604. Spray head; 7. Sieving mechanism; 701. Moving plate; 702. Electric push rod three; 703. Cross groove; 704. Conveyor belt two; 8. Box body; 9. Ultrasonic generator; 10. Support column; 11. Rotary disc; 12. Motor; 13. Working groove; 14. Lifting frame; 15. Electric push rod two; 16. 161. Feeding mechanism; 162. Electric push rod four; 163. L-shaped plate; 164. Pushing plate; 17. Feeding mechanism; 175. Feeding plate; 176. Conveyor belt three; 18. Controller; 19. Image analysis module; 20. Guide plate; 21. Solenoid valve; 22. Splash guard; 23. Electric push rod five; 24. Cleaning strip; 25. Waste liquid tank; 26. Storage strip; 27. Liquid extraction pipe; 28. Water pump; 29. ​​Filter box; 30. Liquid delivery pipe; 31. Return pipe; 32. Heat conduction plate. Detailed Implementation

[0041] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0042] Please see Figure 1-10In this invention: an integrated online cleaning machine for semiconductor ball-mounting stencils includes a support base 1, a fixed plate 2 fixedly connected to the top of the support base 1, two grooves 3 formed on the inner side of the fixed plate 2, two conveyor belts 4 installed on the inner walls of each groove 3, four cameras 5 installed on the fixed plate 2, the four cameras 5 being located on the left and right sides of the fixed plate 2 respectively, a spraying mechanism 6 provided on the fixed plate 2, a screening mechanism 7 provided on the top of the support base 1, a housing 8 fixedly connected to the left side of the support base 1, two ultrasonic generators 9 installed on the inner wall of the housing 8, a support column 10 fixedly connected to the inner wall of the housing 8, a rotating disk 11 rotatably connected to the left side of the support column 10, and the support column 10... A motor 12 is fixedly connected to the right side of the support column 10. The output shaft of the motor 12 passes through the support column 10 and is fixedly connected to the rotating disk 11. Three working slots 13 are provided on the rotating disk 11. Lifting frames 14 are slidably connected to the inner walls of the three working slots 13. Three electric push rods 15 are embedded inside the rotating disk 11. One end of the three electric push rods 15 is fixedly connected to the three lifting frames 14 respectively. The three lifting frames 14 are all U-shaped. Two sets of equally spaced storage strips 26 are fixedly connected to the inner side of the three lifting frames 14. A feeding mechanism 16 is provided on the rotating disk 11. A feeding mechanism 17 is provided on the box body 8. A controller 18 and an image analysis module are installed on the front of the support base 1. Block 19; The spraying mechanism 6 includes two water boxes 601, each with one side fixedly connected to a fixed plate 2. The two water boxes 601 are vertically staggered, and each water box 601 has an inlet pipe 602 connected to its back. Each water box 601 has an outlet pipe 603 arranged at equal intervals connected to one side. A nozzle 604 is installed at one end of each of the two outlet pipes 603. The sieving mechanism 7 includes a movable plate 701, the bottom of which is slidably connected to a support base 1. An electric push rod 702 is inserted through the back of the support base 1 and fixedly connected thereto. A connecting plate is fixedly connected to one end of the back of the electric push rod 702, and the front of the connecting plate is fixedly connected to the movable plate 701. The top of the moving plate 701 is provided with horizontal grooves 703 arranged at equal intervals, and two conveyor belts 704 are installed on the inner wall of the horizontal grooves 703; the unloading mechanism 16 includes three electric push rods 161, the right ends of the three electric push rods 161 are inserted into the rotating disk 11 and fixedly connected to it, the left ends of the three electric push rods 161 are fixedly connected to L-shaped plates 162, one side of the three L-shaped plates 162 is slidably connected to the inner wall of the working groove 13, and one side of the three L-shaped plates 162 is fixedly connected to a pusher plate 163; the feeding mechanism 17 includes a feeding plate 171, the bottom of the feeding plate 171 is fixedly connected to the box 8, and a conveyor belt 172 is installed on the top of the feeding plate 171.

[0043] In this invention, when cleaning the semiconductor ball-mounted steel mesh, the semiconductor ball-mounted steel mesh is first inserted between two conveyor belts 4. The two conveyor belts 4 will contact the edge of the semiconductor ball-mounted steel mesh. Then, the user turns on the conveyor belts 4 to move the semiconductor ball-mounted steel mesh to the left. As the semiconductor ball-mounted steel mesh moves to the left, it will pass between two water boxes 601. During the process, the user pressurizes the cleaning fluid and injects it into the water box 601 through the inlet pipe 602. Then, the cleaning fluid will be sprayed from the nozzle 604 on the outlet pipe 603 onto the top and back surfaces of the semiconductor ball-mounted steel mesh, thereby achieving double-sided spray rinsing of the semiconductor ball-mounted steel mesh.

[0044] Before passing through the two water tanks 601, the semiconductor ball-coated stencil passes between the two cameras 5 on the right. Cameras 5 transmit front and back images of the stencil to the image analysis module 19. The image analysis module 19 analyzes the images to determine the amount of dirt adhering to the surface of the stencil. The data is then sent to the controller 18. During rinsing, the controller 18 controls the speed at which the conveyor belt 4 moves the stencil based on the amount of dirt on its surface. When the cleaning fluid sprayed from the nozzle 604 comes into contact with a large amount of dirt at the contact points with the stencil... The controller 18 controls the conveyor belt 4 to slowly transport the semiconductor ball-mounted steel mesh. If only a small amount of dirt adheres to the contact point between the cleaning fluid and the semiconductor ball-mounted steel mesh, the conveyor belt 4 can appropriately speed up the transport of the semiconductor ball-mounted steel mesh. This shortens the spray rinsing time for semiconductor ball-mounted steel mesh with less dirt while ensuring the completion of the spray rinsing task, thereby effectively improving the efficiency of spray rinsing the semiconductor ball-mounted steel mesh and reducing the duration of impact from the high-pressure cleaning fluid on the semiconductor ball-mounted steel mesh, thus reducing the damage caused to the semiconductor ball-mounted steel mesh by spray rinsing.

[0045] After the spray cleaning is completed, the semiconductor ball-planting stencil will be conveyed to the left. The spray-cleaned stencil will then be inserted into the central transverse groove 703. Next, two conveyor belts 704 will contact the stencil, driving the right side of the stencil to align with the right side of the moving plate 701, thus completing the placement of the stencil. Furthermore, by activating the electric push rod 702, different transverse grooves 703 can be aligned with the stencils on the fixed plate 2, allowing the stencil to be selected for placement into a specific transverse groove 703. Before this, the stencil will pass between the two cameras 5 on the left side. 5 records images of the semiconductor ball-planting stencil after jet cleaning. The image analysis module 19 processes the images and analyzes the surface contamination of the semiconductor ball-planting stencil after jet cleaning. The controller 18 then analyzes the contamination to determine the required ultrasonic-assisted cleaning time for the semiconductor ball-planting stencil. Based on the required ultrasonic-assisted cleaning time, the semiconductor ball-planting stencils are classified, and those with similar required ultrasonic-assisted cleaning times are moved to the same transverse groove 703. This completes the sieving based on the required ultrasonic-assisted cleaning time for the semiconductor ball-planting stencils, thus classifying them according to the ultrasonic-assisted cleaning time.

[0046] After the semiconductor ball-mounted stencils are sorted and placed, the user first activates the electric push rod 15. The electric push rod 15 will raise the lifting frame 14, which in turn will raise the storage strips 26 above it. Two adjacent storage strips 26 at the same height form a storage space, each used to clamp the semiconductor ball-mounted stencils, until the topmost storage space aligns with a group of semiconductor ball-mounted stencils on the transverse groove 703. At this point, the conveyor belt 704, where the aligned semiconductor ball-mounted stencils are located, is activated. The leftmost semiconductor ball-mounted stencil will then... The second semiconductor ball-mounted steel mesh is moved to the top storage space by the second conveyor belt 704. Then, the user can open the second electric push rod 15 to adjust the second storage space to the same height as the semiconductor ball-mounted steel mesh. Opening the second conveyor belt 704 again completes the placement of the second semiconductor ball-mounted steel mesh. Similarly, the semiconductor ball-mounted steel meshes in the same group can be placed in the same lifting frame 14. After the semiconductor ball-mounted steel meshes are successfully placed, the user opens the second electric push rod 15 in the opposite direction until the lifting frame 14 falls back into the working slot 13. At this time, the loading of a group of semiconductor ball-mounted steel meshes is completed.

[0047] Next, the user turns on the motor 12, which drives the rotating disk 11 to rotate 120 degrees. At this time, a lifting frame 14 located in the housing 8 will move to the left side of the moving plate 701. The user turns on the electric push rod 702, which drives the moving plate 701 to move, thereby adjusting another set of semiconductor ball-mounted steel mesh to be flush with the storage space on the lifting frame 14. Similarly, the loading of the semiconductor ball-mounted steel mesh can be achieved.

[0048] After loading the two sets of semiconductor ball-mounted steel meshes, the user turns on the motor 12 to drive the rotating disk 11 to rotate until the lifting frame 14 containing the semiconductor ball-mounted steel meshes is located in the box 8. At this time, the two sets of semiconductor ball-mounted steel meshes will be immersed in the cleaning solution in the box 8. Then, the user turns on the ultrasonic generator 9 to perform ultrasonic-assisted cleaning on the two sets of semiconductor ball-mounted steel meshes immersed in the cleaning solution.

[0049] As attached Figure 7 As shown, the semiconductor ball-mounted steel meshes in the two lifting frames 14 at the bottom are immersed in the cleaning solution. The two sets of semiconductor ball-mounted steel meshes are simultaneously subjected to ultrasonic-assisted cleaning. The storage space at the top can be used for loading at this time. Since the ultrasonic-assisted cleaning time required for each semiconductor ball-mounted steel mesh in the lifting frame 14 is different, one set of semiconductor ball-mounted steel meshes will be cleaned first. At this time, the user can remove the semiconductor ball-mounted steel meshes that have been cleaned first from the box 8 by turning on the motor 12 to drive the rotating disk 11 to rotate. At this time, the semiconductor ball-mounted steel meshes that have not been cleaned will still be immersed in the cleaning solution for cleaning. This ensures that the semiconductor ball-mounted steel meshes that have not been cleaned will continue to be cleaned, and also avoids the semiconductor ball-mounted steel meshes that have been cleaned first being over-cleaned, reducing the occurrence of semiconductor ball-mounted steel mesh mesh deformation and increased surface roughness. Moreover, the semiconductor ball-mounted steel meshes that have just been loaded will enter the cleaning solution to clean them. Then, when the cleaned semiconductor ball-mounted steel meshes are removed from the cleaning solution, the automatic loading of semiconductor ball-mounted steel meshes can be achieved.

[0050] After the semiconductor ball-reinforced stencil is cleaned and detached from the housing 8, it will be located on the right side of the feeding plate 171. At this time, the user will activate the electric push rod 161 to move the L-shaped plate 162 to the left. The pusher plate 163 will move to the left and contact the semiconductor ball-reinforced stencil. As the pusher plate 163 moves, the semiconductor ball-reinforced stencil on the shelf 26 will be pushed down to the top of the conveyor belt 172 on the feeding plate 171. Then, the conveyor belt 172 will be activated to transport the semiconductor ball-reinforced stencil to the next stage, thus completing the cleaning of a set of semiconductor ball-reinforced stencils.

[0051] Users can select to remove the semiconductor ball-mounted stencil from the housing 8 according to the required ultrasonic-assisted cleaning time. This ensures effective cleaning of the semiconductor ball-mounted stencil while reducing the cleaning time, thereby improving the cleaning efficiency of the device. Furthermore, there are three lifting frames 14 on the rotating disk 11. While two sets of semiconductor ball-mounted stencils are being ultrasonically cleaned in the housing 8, the user can send another set of semiconductor ball-mounted stencils into the top lifting frame 14. This utilizes the waiting time for ultrasonic-assisted cleaning of the semiconductor ball-mounted stencils, effectively improving the cleaning efficiency.

[0052] Please see Figure 1 , 2 1, 2, 3, 4, 6 and 7, wherein: the top of the feeding plate 171 is fixedly connected to two guide plates 20, which are located on the front and back sides of the conveyor belt 172.

[0053] In this invention, the guide plate 20 can prevent the semiconductor ball-planting steel mesh from slipping off the feeding plate 171 after cleaning, thereby improving the practicality of the device.

[0054] Please see Figure 5 Among them, a solenoid valve 21 is installed on the water outlet pipe 603, and the input end of the solenoid valve 21 is connected to the controller 18 for signal transmission.

[0055] In this invention, the solenoid valve 21 can control the opening and closing of some water outlet pipes 603. After closing one of the solenoid valves 21, the nozzle 604 located on the water outlet pipe 603 will stop discharging water, and the semiconductor ball-coated steel mesh below the nozzle 604 will lose its rinsing effect. In this way, the nozzles 604 corresponding to those without dirt on the surface of the semiconductor ball-coated steel mesh can be closed, thereby reducing the use of cleaning fluid and reducing damage to the semiconductor ball-coated steel mesh.

[0056] Please see Figure 2 The top water box 601 is fixedly connected to a splash guard 22 on its left side, and the splash guard 22 is located above the top water box 601.

[0057] In this invention, the splash guard 22 can prevent the sprayed cleaning liquid from being sprayed into the air and polluting the working environment, thereby improving the practicality of the device.

[0058] Please see Figure 5 The fixed plate 2 has four electric push rods 23 fixedly connected to it on the back. Each of the four electric push rods 23 has a cleaning strip 24 fixedly connected to one end of its front. The top of the support base 1 is fixedly connected to a waste liquid tank 25. The right side of the waste liquid tank 25 is connected to a drain pipe.

[0059] In this invention, before the camera 5 takes a picture of the semiconductor ball-mounted steel mesh, the user can turn on the electric push rod 23 to move the cleaning strip 24. After the cleaning strip 24 moves, it will slide along the surface of the camera 5, thereby scraping off the dust and water droplets attached to the surface of the camera 5, maintaining the shooting effect of the camera 5 on the semiconductor ball-mounted steel mesh. The waste liquid tank 25 can collect and recycle the cleaning liquid used for spraying.

[0060] Please see Figure 1 , 2 3, 4 and 10, wherein: the inner bottom wall of the transverse groove 703 is inclined to one side of the fixed plate 2, the movable plate 701 is hollow, the front of the box body 8 is connected to the liquid extraction pipe 27, the liquid extraction pipe 27 is equipped with a water pump 28, one end of the front of the liquid extraction pipe 27 is connected to the filter box 29, the front of the filter box 29 is inserted with a filter box slidably connected thereto, the right side of the filter box 29 is connected to the liquid delivery pipe 30, the top end of the liquid delivery pipe 30 is connected to the movable plate 701, the back of the movable plate 701 is connected to the return pipe 31, the bottom end of the return pipe 31 is connected to the box body 8, and the inner wall of the transverse groove 703 is fixedly connected to two sets of heat-conducting plates 32 arranged at equal distances.

[0061] In this invention, the semiconductor ball-planting steel mesh held and conveyed by the two conveyor belts 704 in the transverse trough 703 will have residual cleaning fluid from the spray cleaning. The cleaning fluid on the semiconductor ball-planting steel mesh will drip into the transverse trough 703. The inner bottom wall of the transverse trough 703 is inclined towards the waste liquid tank 25, which can guide the cleaning fluid dripping from the semiconductor ball-planting steel mesh. The cleaning fluid will flow into the waste liquid tank 25 for collection and subsequent recycling, thereby improving the practicality of the device.

[0062] The user turns on the water pump 28, which draws the cleaning fluid into the housing 8. The cleaning fluid enters the filter box 29 through the extraction pipe 27 and is filtered by the filter box. The filtered cleaning fluid enters the moving plate 701 through the delivery pipe 30 and flows back to the housing 8 through the return pipe 31, thereby achieving the effect of filtering and circulating the cleaning fluid. This effectively reduces the impact of impurities in the cleaning fluid on the ultrasonic-assisted cleaning effect and improves the ultrasonic-assisted cleaning effect on semiconductor ball-mounted steel mesh.

[0063] The ultrasonic cleaning of semiconductor ball-mounted steel mesh is mainly achieved through the ultrasonic cavitation effect. During the process, the temperature of the cleaning fluid inside the chamber 8 gradually rises. As the heated cleaning fluid flows in the moving plate 701, the hollow space inside the moving plate 701 provides a diffusion space for the heated cleaning fluid, which can better absorb the heat in the cleaning fluid. This helps to control the temperature of the cleaning fluid in the chamber 8 and prevent the cleaning fluid from overheating and failing.

[0064] During the conveying process of the semiconductor ball-planted stencil by conveyor belt 704, multiple heat-conducting plates 32 slide over the surface of the stencil, scraping off the residual cleaning fluid used for spray cleaning. This prevents the cleaning fluid from flowing into the ultrasonic-assisted cleaning fluid in the housing 8, diluting the ultrasonic-assisted cleaning fluid and improving its effectiveness. Furthermore, the heat-conducting plates 32 absorb heat from the moving plate 701 and transfer it to the semiconductor ball-planted stencil, effectively preheating it. Without preheating, a cold stencil suddenly placed in a high-temperature cleaning fluid would generate thermal stress due to the temperature difference between the surface and interior of the stencil. This thermal stress could cause minor deformation or micro-cracks within the stencil. Preheating the stencil to a temperature close to that of the cleaning fluid reduces this thermal stress, protects the structural integrity of the stencil, and extends its service life.

[0065] Finally, it should be noted that in all the conveyor belt conveying processes involved in this case, the conveying operation is completed by mutual friction between the conveyor belt and the surface of the semiconductor ball-coated steel mesh, and those skilled in the art can easily ensure the stable operation of the conveying operation by adjusting the coefficient of friction during the conveying process.

[0066] The above are merely preferred embodiments of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concept, should be covered within the scope of protection of the present invention.

Claims

1. An integrated online cleaning machine for semiconductor ball-mounting stencils, comprising a support base (1), characterized in that: A fixed plate (2) is fixedly connected to the top of the support base (1). Two grooves (3) are opened on the inner side of the fixed plate (2). Two conveyor belts (4) are installed on the inner walls of the two grooves (3). Four cameras (5) are installed on the fixed plate (2). The four cameras (5) are located on the left and right sides of the fixed plate (2). A spraying mechanism (6) is set on the fixed plate (2). A screening mechanism (7) is set on the top of the support base (1). A box (8) is fixedly connected to the left side of the support base (1). Two ultrasonic generators (9) are installed on the inner wall of the box (8). A support column (10) is fixedly connected to the inner wall of the box (8). A rotating disk (11) is rotatably connected to the left side of the support column (10). A motor (12) is fixedly connected to the right side of the support column (10). The output shaft of the motor (12) passes through the support column (10) and is fixedly connected to the rotating disk (11). The rotating disk (11) has three working slots (13). The inner walls of the three working slots (13) are slidably connected to lifting frames (14). The rotating disk (11) is embedded with three electric push rods (15). One end of the three electric push rods (15) is fixedly connected to the three lifting frames (14). The three lifting frames (14) are all U-shaped. The inner sides of the three lifting frames (14) are fixedly connected with two sets of equally spaced storage strips (26). The rotating disk (11) is provided with a feeding mechanism (16). The box (8) is provided with a feeding mechanism (17). The front of the support base (1) is equipped with a controller (18) and an image analysis module (19). The screening mechanism (7) includes a movable plate (701), the bottom of which is slidably connected to a support base (1). An electric push rod (702) is inserted through the back of the support base (1) and fixedly connected thereto. A connecting plate is fixedly connected to one end of the back of the electric push rod (702). The front of the connecting plate is fixedly connected to the movable plate (701). The top of the movable plate (701) is provided with horizontal grooves (703) arranged at equal intervals. Two mounting grooves are opened on the inner wall of each horizontal groove (703). Two conveyor belts (704) are installed on the inner wall of each mounting groove.

2. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 1, characterized in that: The spraying mechanism (6) includes two water boxes (601). The opposite sides of the two water boxes (601) are fixedly connected to the fixing plate (2). The two water boxes (601) are vertically staggered. The back of the two water boxes (601) is connected to a water inlet pipe (602). The opposite sides of the two water boxes (601) are connected to water outlet pipes (603) arranged at equal distances. A nozzle (604) is installed at one end of each of the two sets of water outlet pipes (603).

3. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 1, characterized in that: The feeding mechanism (16) includes three electric push rods (161). The right ends of the three electric push rods (161) are inserted into the rotating disk (11) and fixedly connected thereto. The left ends of the three electric push rods (161) are fixedly connected to L-shaped plates (162). One side of the three L-shaped plates (162) is slidably connected to the inner wall of the working groove (13). One side of the three L-shaped plates (162) is fixedly connected to a pusher plate (163).

4. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 1, characterized in that: The feeding mechanism (17) includes a feeding plate (171), the bottom of which is fixedly connected to the box (8), and a conveyor belt (172) is installed on the top of the feeding plate (171).

5. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 4, characterized in that: The top of the feeding plate (171) is fixedly connected to two guide plates (20), which are located on the front and back sides of the conveyor belt (172).

6. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 2, characterized in that: A solenoid valve (21) is installed on the water outlet pipe (603), and the input end of the solenoid valve (21) is connected to the controller (18) via signal.

7. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 2, characterized in that: A splash guard (22) is fixedly connected to the left side of the top water box (601), and the splash guard (22) is located above the top water box (601).

8. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 1, characterized in that: Four electric push rods (23) are inserted through the back of the fixed plate (2) and fixedly connected thereto. A cleaning strip (24) is fixedly connected to one end of the front of each of the four electric push rods (23). A waste liquid tank (25) is fixedly connected to the top of the support base (1). A drain pipe is connected to the right side of the waste liquid tank (25).

9. The online cleaning integrated machine for semiconductor ball-mounting stencils according to claim 1, characterized in that: The inner bottom wall of the transverse groove (703) is inclined to one side of the fixed plate (2). The movable plate (701) is hollow. The front of the box (8) is connected to the liquid extraction pipe (27). A water pump (28) is installed on the liquid extraction pipe (27). One end of the front of the liquid extraction pipe (27) is connected to the filter box (29). A filter box is slidably connected to the front of the filter box (29). The right side of the filter box (29) is connected to the liquid delivery pipe (30). The top end of the liquid delivery pipe (30) is connected to the movable plate (701). The back of the movable plate (701) is connected to the return pipe (31). The bottom end of the return pipe (31) is connected to the box (8). The inner wall of the transverse groove (703) is fixedly connected to two sets of heat-conducting plates (32) arranged at equal distances.

Images