A pin bending device for processing electronic components

Abstract

The present invention relates to the technical field of electronic component processing, and in particular to a pin bending device for processing electronic components, comprising a base, a lower die is slidably mounted on the base, a limiting platform is fixedly mounted on the base on one side of the lower die, an upper die is correspondingly arranged above the lower die, the upper die is mounted on a lifter, a plurality of pin extrusion columns are fixedly mounted on the upper die near the limiting platform, the pin extrusion columns are arranged at intervals along the width direction of the base, a positioning groove is provided on the lower die, a positioning block is telescopically mounted in the positioning groove; a plurality of partitions are fixed at intervals along the width direction of the base on the limiting platform, each partition is provided with a circular arc guide groove, a sliding body can be slidably mounted in each circular arc guide groove, and a grinder is telescopically mounted on the sliding body. The present invention is provided with a plurality of grinders that can be sleeved on the pins of components, so that the outer ends of the pins can be polished synchronously while bending, thereby effectively improving the processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component processing, and in particular to a pin bending device for processing electronic components. Background Art

[0002] In the process of processing electronic components, some components need to have their pins bent in order to facilitate insertion into the motherboard. Existing bending equipment mainly includes a lower die and an upper die. The lower die is provided with positioning grooves, positioning blocks, etc. The components are placed in the positioning grooves on the lower die, and the pins of the components extend out of the positioning grooves. Then the upper die is controlled to press the components into the positioning grooves, and the pins of the components extending out of the positioning grooves are squeezed by the outer edge of the positioning grooves and bent upward, thereby completing the bending of the pins. However, since the atmosphere contains about one-fifth of oxygen and there is a certain amount of water vapor that will enhance oxidation, the general component pins are nickel-plated, silver-plated, and tin-plated. The oxidation resistance of these metals is not very strong. The oxidized pins need to be removed by a blade or a razor. Otherwise, it is easy to have cold solder joints and circuit debugging, which will easily cause failures. For this reason, some electronic components require operators to use handheld tools to remove the oxide layer on the outer end of the pin before or after bending, and then they can be sent for subsequent installation. This has caused a certain impact on the efficiency of the bending process. For this reason, it is necessary to design a bending device that can simultaneously grind the pins while bending, so as to improve the bending efficiency. Summary of the invention

[0003] The purpose of the present invention is to solve the problem in the prior art that component pins need to be manually polished before or after bending, and to propose a pin bending device for processing electronic components.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] Design a pin bending device for processing electronic components, including a base, a lower die is slidably installed on the base along its length direction, a limiting platform is fixedly installed on the base on one side of the lower die, an upper die is correspondingly arranged above the lower die, the upper die is installed on a lifter, a plurality of pin extrusion columns are fixedly installed on the upper die near the limiting platform, the lower ends of the pin extrusion columns extend to the bottom of the upper die, the pin extrusion columns are arranged at intervals along the width direction of the base, a positioning groove is opened on the lower die, and a positioning block is telescopically installed in the positioning groove;

[0006] A number of partitions are fixed on the limit platform at intervals along the width direction of the base, and the partitions are arranged one-to-one corresponding to the pin extrusion columns so that the moving pin extrusion columns will not collide with the partitions. Each of the partitions is provided with an arc-shaped guide groove, and a sliding body can be slidably installed in each of the arc-shaped guide grooves, and a grinder is telescopically installed on the sliding body.

[0007] Preferably, the other end of the sliding body is fixedly connected to an adjacent grinder via a connecting column, so that the sliding bodies can be linked.

[0008] Preferably, a group of magnetic blocks are fixedly mounted on each of the partitions, each group of the magnetic blocks are arranged in an arc shape and are corresponding to the adjacent arc-shaped guide grooves, the grinder is made of ferromagnetic material, and the magnetic blocks and the grinder attract each other.

[0009] Preferably, the grinder includes two splints, two side plates, and a plurality of grinding blocks. The two splints are fixedly connected by two side plates. A plurality of grinding blocks are fixed on the inner surfaces of the two splints at intervals along their length directions. A guide rod is fixed to the side plate close to the sliding body. A sliding sleeve is mounted on the guide rod, and the sliding sleeve is fixedly connected to the sliding body. A spring is mounted on the guide rod on one side of the sliding sleeve, and both ends of the spring are respectively connected to the sliding sleeve and the side plate.

[0010] Preferably, the clamping plate is also provided with a plurality of chip removal grooves along its length direction.

[0011] Preferably, a vertical groove is formed on the upper portion of each partition plate, and the vertical groove is communicated with the upper end of the adjacent arc-shaped guide groove.

[0012] Preferably, a vent hole communicating with the positioning groove is provided on the lower mold.

[0013] The present invention provides a pin bending device for processing electronic components, which has the following beneficial effects:

[0014] By arranging multiple partitions on the limit table on one side of the lower mold, each partition is equipped with a friction device that can slide along the arc-shaped guide groove, so that when the pins are bent, the components can be placed on the lower mold, and then the lower mold is pushed, so that multiple pins of the components on the lower mold can be inserted into multiple friction devices respectively. In the subsequent processing process, when the pins are bent, the bent pins will drive the multiple friction devices to slide along the arc-shaped guide groove. When the friction devices move, since they are made of ferromagnetic material, the friction devices will have intermittent magnetic effects with multiple magnetic blocks spaced apart on the outside of the arc-shaped guide groove, so that the friction devices will slide along the arc-shaped guide groove while performing reciprocating telescopic motion on the pins, so that the internal grinding blocks can be used to synchronously grind the component pins, so that the outer ends of the pins can be simultaneously polished while bending, effectively improving the processing efficiency of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a pin bending device for processing electronic components proposed by the present invention Figure 1 ;

[0016] Figure 2 A schematic diagram of the structure of a pin bending device for processing electronic components proposed by the present invention Figure 2 ;

[0017] Figure 3 Schematic diagram of the partition distribution structure of the pin bending equipment for processing electronic components proposed by the present invention Figure 1 ;

[0018] Figure 4 Schematic diagram of the partition distribution structure of the pin bending equipment for processing electronic components proposed by the present invention Figure 2 ;

[0019] Figure 5 A schematic diagram of the structure of the arc-shaped guide groove and the vertical groove of a pin bending device for processing electronic components proposed by the present invention;

[0020] Figure 6 A schematic diagram of the structure of a grinder for a pin bending device for processing electronic components proposed by the present invention;

[0021] Figure 7 A schematic diagram of the internal structure of a grinder of a pin bending device for processing electronic components proposed by the present invention;

[0022] Figure 8 A schematic diagram of the working state of a pin bending device for processing electronic components proposed by the present invention Figure 1 ;

[0023] Fig. 9A schematic diagram of the working state of a pin bending device for processing electronic components proposed by the present invention Figure 2 ;

[0024] Fig.10 A schematic diagram of the working state of a pin bending device for processing electronic components proposed by the present invention Figure 3 ;

[0025] Fig.11 Schematic diagram of the bending process of a pin bending device for processing electronic components proposed by the present invention Figure 1 ;

[0026] Fig.12 Schematic diagram of the bending process of a pin bending device for processing electronic components proposed by the present invention Figure 2 ;

[0027] Fig.13 The present invention is a schematic diagram of the side structure of a pin bending device for processing electronic components.

[0028] In the figure: 1. base; 2. slide groove; 3. limit rod; 4. lower die; 5. positioning groove; 6. positioning block; 7. lifter; 8. upper die; 9. pin extrusion column; 10. partition; 11. arc guide groove; 12. sliding body; 13. grinder; 131. clamping plate; 132. side plate; 133. chip groove; 134. grinding block; 14. magnetic block; 15. vertical groove; 16. connecting column; 17. sliding sleeve; 18. guide rod; 19. limit table; 20. vent hole; 21. components. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Example 1: Reference Figure 1 - Figure 5 , Figure 8 - Fig.13 A pin bending device for processing electronic components comprises a base 1, a lower die 4 is slidably mounted on the base 1 along its length direction, a plurality of slide grooves 2 are provided at the bottom of the lower die 4, a limiting rod 3 is inserted in each slide groove 2, and the limiting rod 3 is fixedly connected to the base 1, as shown in the attached Figure 8-10As shown, the reason why the lower mold 4 is set to a sliding state is to facilitate the pins of the components 21 placed on the lower mold 4 to be inserted into multiple grinders 13 synchronously by moving the lower mold 4. A limit table 19 is fixedly installed on the base 1 on one side of the lower mold 4, and an upper mold 8 is correspondingly arranged above the lower mold 4. The upper mold 8 is installed on the lifter 7. Several pin extrusion columns 9 are fixedly installed on the upper mold 8 near the limit table 19. The lower ends of the pin extrusion columns 9 extend below the upper mold 8. The pin extrusion columns 9 are arranged at intervals along the width direction of the base 1. A positioning groove 5 is provided on the lower mold 4, and a positioning block 6 is telescopically installed in the positioning groove 5. The upper surface of the positioning block 6 is convex upward near the side of the pin extrusion column 9, so that the convex part can support the pins of the components 21; when the positioning block 6 is not squeezed by the upper mold 8, the upper surface of the positioning block 6 shrinks into the positioning groove 5, and the convex part of the positioning block 6 remains flush with the upper surface of the lower mold 4. The lower mold 4 is provided with a vent hole 20 which is in communication with the positioning groove 5. The function of the vent hole 20 is to keep the air pressure balance inside the positioning groove when the positioning block 6 is extended and retracted in the positioning groove 5.

[0031] A plurality of partitions 10 are fixed at intervals along the width direction of the base 1 on the limiting platform 19. The partitions 10 are arranged one by one with the pin extrusion columns 9 so that the moving pin extrusion columns 9 will not collide with the partitions 10. A circular arc guide groove 11 is provided on each partition 10. A sliding body 12 can be slidably installed in each circular arc guide groove 11, and a grinder 13 is telescopically installed on the sliding body 12. Since the bending part of the pin mainly swings around the bending point during the bending process, the circular arc guide groove 11 is provided for this purpose, so that the bent pin can drive the grinder 13 to move along the circular arc guide groove 11.

[0032] The other end of the sliding body 12 is fixedly connected to the adjacent grinder 13 through the connecting column 16, so that the sliding bodies 12 can be linked. By connecting the sliding bodies 12 together, when one sliding body 12 moves, the other sliding bodies 12 can move synchronously, so that the grinders 13 connected to the sliding bodies 12 can keep the same posture synchronously, which is convenient for inserting the pins of the components 21.

[0033] A group of magnetic blocks 14 are fixedly mounted on each partition 10. Each group of magnetic blocks 14 are arranged in an arc shape and are arranged corresponding to the adjacent arc-shaped guide grooves 11. The grinder 13 is made of ferromagnetic material, and the magnetic blocks 14 and the grinder 13 attract each other. When the grinder 13 moves along the arc-shaped guide groove 11, intermittent magnetic action occurs between it and each magnetic block, and the grinder 13 and the sliding body 12 are telescopically connected, so that the grinder 13 automatically expands and contracts under the action of magnetic force, so that the grinder 13 can reciprocate on the pin inside it, thereby grinding the pin surface.

[0034] A vertical groove 15 is formed on the upper part of each partition 10, and the vertical groove 15 is connected to the upper end of the adjacent arc-shaped guide groove 11. In order to take out the component 21 after the pins of the component 21 are bent, the vertical groove 15 is provided, and the sliding body 12 moves upward along the vertical groove 15, so that the sliding body 12 drives the grinder 13 to move upward, so that the grinder 13 can be pulled out from the pins, and then the component 21 can be taken out.

[0035] Example 2: Reference Figure 6 - Figure 7 As another preferred embodiment of the present invention, the difference from the embodiment 1 is that the grinder 13 includes two clamping plates 131, two side plates 132, and a plurality of grinding blocks 134. The two clamping plates 131 are fixedly connected by the two side plates 132. The inner surfaces of the two clamping plates 131 are fixed with a plurality of grinding blocks 134 at intervals along the length direction thereof. A guide rod 18 is fixed to the side plate 132 close to the sliding body 12. A sliding sleeve 17 is sleeved on the guide rod 18. The sliding sleeve 17 is fixedly connected to the sliding body 12. A spring is sleeved on the guide rod 18 on one side of the sliding sleeve 17. The two ends of the spring are respectively connected to the sliding sleeve 17 and the side plate 132. When the grinder 13 is subjected to the magnetic force of the magnetic block 14, the grinder 13 will stretch the spring. When the grinder 13 is offset from the magnetic block 14, the spring will pull the grinder 13 to reset. In this way, the automatic extension and retraction of the grinder 13 can be realized. The clamping plate 131 is also provided with a plurality of chip removal grooves 133 along its length. By arranging the grinding blocks 134 at intervals and cooperating with the plurality of chip removal grooves 133, the debris generated by the grinder 13 during the grinding process can be discharged through the chip removal grooves 133, so that the inside of the grinder 13 can maintain a good grinding effect.

[0036] The overall workflow of the present invention is as follows:

[0037] As attached Figure 8-10 As shown, first, the lower die 4 is moved outward so that the lower die 4 is spaced apart from the limiting platform 19, and then the component 21 to be processed is placed on the lower die 4 so that the main body of the component 21 is placed in the positioning groove 5 on the lower die 4, and the pins of the component 21 are arranged one by one with the partitions 10, and then the lower die 4 is moved toward the limiting platform 19 side so that the lower die 4 can drive the pins of the component 21 to be inserted into the grinder 13 on each partition 10;

[0038] Then as attached Figure 11-12As shown, the lifter 7 is then started, and the lifter 7 drives the upper mold 8 to move downward, so that the upper mold 8 presses the component 21 and the positioning block 6 into the positioning groove 5. At the same time, the pin extrusion block on the upper mold 8 will synchronously squeeze the pin close to the main part of the component 21. At this time, the pin close to the main part of the component 21 will be synchronously pressed into the positioning groove 5, and the pin outside the positioning groove 5 will be bent upward due to being squeezed. At this time, the pin will drive the grinder 13 to move along the arc-shaped guide groove 11 during the upward bending process. During the movement, the grinder 13 made of ferromagnetic material will have intermittent magnetic action with several magnetic blocks 14 on one side of the arc-shaped guide groove 11, so that each grinder 13 can move while performing reciprocating telescopic motion, so that the multiple grinding blocks 134 inside it can be used to grind the pin;

[0039] After the bending is completed, the lifter 7 is started to drive the upper mold 8 to move upward and reset. At this time, the sliding body 12 is moved upward along the vertical groove 15, so that the sliding body 12 drives the grinder 13 to separate from the pin upward, and then the processed component 21 can be taken out.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A pin bending device for processing electronic components, comprising a base (1), a lower die (4) being slidably mounted on the base (1) along its length direction, a limiting platform (19) being fixedly mounted on the base (1) on one side of the lower die (4), an upper die (8) being correspondingly arranged above the lower die (4), the upper die (8) being mounted on a lifter (7), characterized in that: A plurality of pin extrusion columns (9) are fixedly mounted on one side of the upper die (8) near the limit platform (19), the lower ends of the pin extrusion columns (9) all extend below the upper die (8), the pin extrusion columns (9) are arranged at intervals along the width direction of the base (1), the lower die (4) is provided with a positioning groove (5), and a positioning block (6) is telescopically mounted in the positioning groove (5); A plurality of partitions (10) are fixed on the limit platform (19) at intervals along the width direction of the base (1), and the partitions (10) are arranged one-to-one with the pin extrusion columns (9) so that the moving pin extrusion columns (9) will not collide with the partitions (10). Each of the partitions (10) is provided with an arc-shaped guide groove (11), and a sliding body (12) can be slidably installed in each of the arc-shaped guide grooves (11), and a grinder (13) is telescopically installed on the sliding body (12); A group of magnetic blocks (14) is fixedly mounted on each of the partitions (10); each group of the magnetic blocks (14) is arranged in an arc shape and is arranged corresponding to the adjacent arc-shaped guide grooves (11); the grinder (13) is made of ferromagnetic material; the magnetic blocks (14) and the grinder (13) attract each other.

2. The pin bending device for processing electronic components according to claim 1, characterized in that: The other end of the sliding body (12) is fixedly connected to an adjacent sander (13) via a connecting column (16), so that the sliding bodies (12) can be linked.

3. The pin bending device for processing electronic components according to claim 1, characterized in that: The grinder (13) comprises two clamping plates (131), two side plates (132), and a plurality of grinding blocks (134). The two clamping plates (131) are fixedly connected via the two side plates (132). A plurality of grinding blocks (134) are fixedly arranged on the inner surfaces of the two clamping plates (131) along their length direction. A guide rod (18) is fixedly arranged on the side plate (132) close to the sliding body (12). A sliding sleeve (17) is sleeved on the guide rod (18). The sliding sleeve (17) is fixedly connected to the sliding body (12). A spring is sleeved on the guide rod (18) on one side of the sliding sleeve (17). The two ends of the spring are respectively connected to the sliding sleeve (17) and the side plate (132).

4. The pin bending device for processing electronic components according to claim 3, characterized in that: The clamping plate (131) is also provided with a plurality of chip removal grooves (133) extending through the clamping plate (131) along its length direction.

5. The pin bending device for processing electronic components according to claim 1, characterized in that: A vertical groove (15) is formed on the upper portion of each partition plate (10), and the vertical groove (15) is connected to the upper end of an adjacent arc-shaped guide groove (11).

6. The pin bending device for processing electronic components according to claim 1, characterized in that: The lower mold (4) is provided with a vent hole (20) which is in communication with the positioning groove (5).

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