Device, method and control system for using diamond wire for silicon wafer cutting

Abstract

The present invention discloses an apparatus, method and control system for using diamond wire for silicon wafer cutting. The cutting equipment includes shaft rollers, diamond wires, a silicon material feeding device, a cutting liquid main tank and other components. The specific specifications of the diamond wires are a base material tungsten wire busbar of 26-33μm, a coating thickness of 2-3μm, and 50-200 diamond particles. The cutting method uses the steps of installing silicon material, starting shaft rollers and ultrasonic devices, and conveying cutting liquid to complete cutting using the cutting liquid circulation. The control system contains modules such as user interaction and data acquisition, and the modules work together to realize functions such as parameter setting, device driving, data storage and analysis, and remote communication. The present invention solves the problems of the difficulty in introducing the thinning cutting liquid for diamond wire, reduces the amount of wire used and the cutting time, improves the efficiency and quality of silicon wafer cutting, achieves cost reduction and efficiency improvement, and is of great significance to the photovoltaic slicing process. At the same time, the control system ensures that the cutting process is stable and efficient.

Description

Technical Field

[0001] The present invention mainly relates to the field of using diamond wire for cutting silicon wafers, and in particular to a device, method and control system adapted thereto for using diamond wire for cutting silicon wafers, aiming to solve many problems existing in existing silicon wafer cutting technology, improve the efficiency and quality of silicon wafer cutting and reduce costs. Background Art

[0002] As the world actively seeks sustainable energy solutions, photovoltaic energy, with its clean and renewable advantages, is increasingly prominent in the energy sector. As one of the core components of photovoltaic power generation systems, optimizing the cutting process for silicon wafers is crucial to the development of the entire photovoltaic industry. Currently, diamond wire sawing technology holds a dominant position in the silicon wafer cutting field, but it still faces a series of severe challenges.

[0003] The basic principle of diamond wire sawing (DWS) is to utilize the high-speed reciprocating motion of the diamond wire and the precise feeding of the silicon material, using the diamond particles embedded in the wire to grind the silicon material, thereby cutting the silicon material into wafers of the desired thickness. In this delicate physical process, the cutting fluid plays a key role in many aspects.

[0004] In terms of lubrication performance, the cutting fluid forms a stable lubricating film between the diamond wire and the silicon material, effectively reducing the coefficient of friction between the two. On the one hand, it significantly reduces the heat generated by friction, preventing defects such as scratches and cracks on the silicon wafer surface due to overheating, ensuring the wafer surface has excellent flatness and finish, which is crucial for the efficient photoelectric conversion of silicon wafers in the photovoltaic power generation process. On the other hand, the good lubrication effect reduces the wear rate of the diamond wire, extends the service life of the diamond wire, and reduces the increase in production costs caused by frequent diamond wire replacement.

[0005] Regarding heat dissipation, the intense friction between the diamond wire and the silicon material during the cutting process instantly generates a large amount of heat. If this heat cannot be dissipated in time, the local temperature of the silicon wafer will rise sharply. The cutting fluid, with its excellent thermal conductivity, can quickly absorb and remove this heat, maintaining a relatively stable temperature in the cutting area. This not only prevents the internal crystal structure of the silicon wafer from being altered by high temperatures, ensuring that the electrical properties of the silicon wafer are not affected and its normal performance in subsequent battery preparation steps is guaranteed, but also helps maintain the stability of the cutting environment and improve the reliability of the cutting process.

[0006] The drainage function of the cutting fluid is also crucial. During the cutting process, the grinding of silicon material produces a large amount of fine impurities such as silicon chips. If these impurities accumulate in the cutting area, they will interfere with the normal movement of the diamond wire, increase cutting resistance, and even cause the wire to break, seriously affecting the continuity and stability of the cut. The cutting fluid can promptly flush away these impurities, ensuring that the cutting area remains clean and providing a good environment for a smooth cutting process.

[0007] However, the current way of introducing cutting fluid into the cutting area has many drawbacks that are difficult to overcome.

[0008] The method of introducing cutting fluid through the reciprocating motion of diamond wire limits the amount of cutting fluid that can be carried due to the physical properties of the diamond wire, its surface tension and adsorption capacity. As the photovoltaic industry continues to demand higher quality silicon wafers, the trend toward thinner diamond wires has become inevitable. Thinner diamond wires have a smaller diameter and a correspondingly reduced surface area, further weakening their ability to carry cutting fluid. In actual cutting operations, this method of carrying cutting fluid fails to meet the various requirements for lubrication, cooling, and drainage of the cutting fluid during fine wire cutting, thus impacting cutting quality and efficiency.

[0009] Another common method involves spraying cutting fluid onto the kerf through a nozzle and allowing it to penetrate the cutting area through penetration. However, the effectiveness of this method is limited by numerous factors. Even slight variations in parameters such as nozzle position, spray angle, and spray pressure can lead to uneven distribution of the cutting fluid within the kerf. Furthermore, the microstructure and flatness of the silicon surface can also affect the penetration of the cutting fluid. In practice, uneven distribution of the cutting fluid within the kerf is common. Insufficient cutting fluid supply may prevent proper lubrication and cooling in some areas, resulting in reduced wafer surface quality. In other areas, excessive cutting fluid may accumulate, causing waste and potentially impacting the stability of the cutting process.

[0010] While thinning diamond wire theoretically helps reduce silicon material loss and increase wafer yield, in practice, the difficulty of retaining liquid has not been effectively addressed. To ensure optimal cutting results, the use of diamond wire has to be increased. This not only directly leads to a significant increase in material costs, but also significantly increases the time required to cut silicon material as the amount of diamond wire used increases. In large-scale industrial production, longer cutting times mean reduced equipment utilization and increased energy consumption, further exacerbating the rise in slicing costs and severely hindering the photovoltaic industry's efforts to reduce costs, increase efficiency, and achieve sustainable development.

[0011] In summary, the existing silicon wafer cutting technology urgently needs an innovative solution to overcome the problem of liquid contamination caused by the thinning of diamond wire, reduce the amount of diamond wire used and cutting time, and improve the overall performance of silicon wafer cutting, thereby promoting the healthy and rapid development of the photovoltaic energy industry. Summary of the Invention

[0012] In order to overcome the above problems or at least partially solve the above problems, the purpose of the present invention is to provide an apparatus, method and control system for using diamond wire for silicon wafer cutting, so as to overcome the problem of liquid carrying caused by the thinning of diamond wire, reduce the usage of diamond wire and cutting time, improve the overall performance of silicon wafer cutting, and thus promote the healthy and rapid development of the photovoltaic energy industry.

[0013] In a first aspect, an embodiment of the present invention provides a device for using diamond wire for silicon wafer cutting, which is mainly composed of the following parts:

[0014] Axis roller: As the core transmission component in the slicing process, it can perform precise reciprocating motion, providing power and guidance for the movement of the diamond wire, ensuring that the diamond wire maintains a stable motion trajectory and speed during the cutting process.

[0015] Diamond wire: Its mesh is evenly distributed on the rollers. The base material of the diamond wire is a tungsten busbar with a specific specification, ranging from 26-33μm. The coating thickness is controlled at 2-3μm, and the number of diamond particles on the diamond wire ranges from 50 to 200. This specific parameter setting is designed to maintain cutting performance while adapting to new cutting process requirements and reducing costs.

[0016] Silicon material feeding device: It is equipped with a high-precision feed control system, which can push the silicon material at a stable speed during the slicing process according to the preset parameters, ensuring the coordinated relative movement of the silicon material and the diamond wire to achieve precise cutting.

[0017] Cutting fluid main groove: A gap with a width of 1mm is opened at the diamond wire mesh. This gap not only provides space for the reciprocating cutting of the diamond wire, but also serves as a key channel for the circulation and reflux of the cutting fluid, ensuring the effective supply and recycling of the cutting fluid in the cutting area.

[0018] Cutting fluid: The carefully formulated cutting fluid has excellent lubrication, cooling, and drainage properties. It can form a stable lubricating film during the cutting process, effectively reduce the friction coefficient, quickly take away heat, and promptly remove impurities generated by cutting.

[0019] Ultrasonic device: By generating high-frequency ultrasonic vibrations, it acts on the cutting fluid, making it better dispersed and penetrated in the cutting area, enhancing the lubrication and cooling effects of the cutting fluid, and improving cutting efficiency and quality.

[0020] Cutting fluid inlet: Serves as the inlet for cutting fluid to enter the system. It is connected to the external cutting fluid supply source to ensure the continuous supply of cutting fluid during the cutting process and maintain the stable liquid level and performance of the cutting fluid in the system.

[0021] Cutting fluid return trough: responsible for collecting the cutting fluid returning from the cutting area. Its design structure can effectively guide the return of the cutting fluid, prevent leakage and splashing during the return process, and ensure that the cutting fluid is smoothly returned to the subsequent processing link.

[0022] Cutting fluid auxiliary tank: works together with the cutting fluid main tank to regulate the distribution and circulation of the cutting fluid, buffer and adjust the flow rate, pressure and other parameters of the cutting fluid, and ensure stable circulation and uniform distribution of the cutting fluid in the entire system.

[0023] Cutting fluid extraction pump: provides powerful power support for the circulation of cutting fluid, can accurately control the flow and pressure of cutting fluid according to system requirements, and ensure sufficient supply and effective circulation of cutting fluid in the cutting area.

[0024] Furthermore, the cutting method involved in the present invention comprises the following steps based on the above-mentioned device:

[0025] Equipment preparation stage:

[0026] First, the silicon material is accurately installed on the silicon material feeding device, and the precise feeding speed is set in the control system according to the process requirements of silicon wafer cutting.

[0027] Carefully check the movement of the roller to ensure that it can reciprocate smoothly and accurately. At the same time, check the distribution of the diamond wire mesh to ensure its uniformity and rationality of tension.

[0028] Inject an appropriate amount of cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank to ensure that the liquid level is within the normal working range, and check whether the cutting fluid inlet, reflux tank and related pipelines are tightly connected and there is no leakage.

[0029] Cutting start-up phase:

[0030] Start the shaft roller to drive the diamond wire to start running stably according to the preset reciprocating motion mode, forming a stable cutting motion trajectory.

[0031] The cutting fluid extraction pump is started synchronously to accurately deliver the cutting fluid from the cutting fluid sub-tank to the cutting fluid main tank through the cutting fluid inlet. The cutting fluid reaches the cutting area evenly through the 1mm gap at the diamond wire mesh in the main tank, ensuring that the cutting area can get sufficient cutting fluid supply at the beginning of cutting.

[0032] Turn on the ultrasonic device and set the appropriate ultrasonic frequency and power according to the cutting process requirements. Under the action of ultrasonic waves, the cutting fluid is quickly dispersed into tiny droplets and better penetrates into every corner of the cutting area, thereby improving the contact effect between the cutting fluid and the diamond wire and silicon material.

[0033] Cutting process stages:

[0034] During the cutting process, the silicon material feeding device feeds the silicon material steadily and strictly according to the set speed, ensuring that the silicon material and the diamond wire maintain an accurate relative movement speed to achieve precise cutting.

[0035] The diamond wire continuously reciprocates, and with the lubrication and cooling of the cutting fluid and the assistance of ultrasound, the diamond particles on the diamond wire are used to efficiently grind and cut the silicon material.

[0036] The debris and excess cutting fluid generated by cutting are smoothly returned to the cutting fluid auxiliary tank through the cutting fluid reflux tank under the action of gravity and the flow of the cutting fluid, thereby realizing the recycling of the cutting fluid. At the same time, the filtering device in the cutting fluid auxiliary tank performs preliminary filtration on the reflux cutting fluid to remove some impurities.

[0037] The control system monitors key parameters in the cutting process in real time, such as the tension of the diamond wire, the temperature, pressure, flow of the cutting fluid, and the feed position of the silicon material. Once any abnormal parameters are found, the corresponding adjustment mechanism is immediately activated.

[0038] Cutting completion stage:

[0039] When the cutting task is completed, stop the operation of the shaft roller, ultrasonic device, cutting fluid extraction pump and other equipment in sequence to ensure that the equipment stops operating safely.

[0040] Carefully remove the cut silicon wafer and perform a preliminary appearance inspection on the wafer to check for surface defects and other problems.

[0041] Clean the equipment thoroughly, including the main cutting fluid tank, auxiliary tank, reflux tank and diamond wire surface, remove residual cutting fluid and impurities such as silicon chips, and prepare for the next cutting operation.

[0042] Record all detailed data during the cutting process, such as cutting parameters, equipment operation data, silicon wafer quality data, etc. These data will serve as an important basis for subsequent process optimization and quality control.

[0043] In a second aspect, an embodiment of the present application provides a control system for diamond wire sawing of silicon wafers, comprising:

[0044] User interaction module:

[0045] It provides an intuitive and friendly human-computer interaction interface, through which the operator can input various cutting parameters, such as silicon material feed speed, shaft roller reciprocating motion frequency, ultrasonic power, cutting fluid initial flow rate, etc. At the same time, the operator can also view the real-time operating status of the equipment, various monitoring data during the cutting process, and system prompt information.

[0046] It has a parameter validity verification function. When the operator enters the parameters, the system will automatically check whether the parameters are within a reasonable range. If the parameters are wrong or out of range, a prompt box will pop up in time to inform the operator to modify them to ensure that the input parameters are accurate and avoid abnormal equipment operation or cutting failure due to incorrect parameters.

[0047] Data acquisition module:

[0048] It is closely connected to the sensors installed at various key parts of the equipment to collect a variety of data during the cutting process in real time, including the tension data of the diamond wire (collected through the tension sensor), the temperature data of the cutting fluid (temperature sensor), the pressure data (pressure sensor), the flow data (flow sensor) and the feeding position data of the silicon material (position sensor), etc.

[0049] The collected data is pre-processed, such as data filtering, amplification, analog-to-digital conversion, etc., to convert the original analog signal into a digital signal for subsequent processing and analysis. At the same time, the data is checked for validity, abnormal data is eliminated, and the accuracy and reliability of the data are guaranteed.

[0050] Control algorithm module:

[0051] It has built-in multiple advanced control algorithms, such as PID (proportional-integral-differential) control algorithm, fuzzy control algorithm, etc. According to the requirements of the cutting process and the operating characteristics of the equipment, the appropriate control algorithm is selected to accurately control the equipment.

[0052] The collected real-time data is used as input, and after calculation and processing by the control algorithm, corresponding control signals are generated to adjust equipment operating parameters such as the reciprocating speed of the shaft roller, the feed speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump, to ensure that the cutting process is always in the best state.

[0053] It has an adaptive adjustment function that can automatically adjust the parameters of the control algorithm according to the actual situation during the cutting process to adapt to different cutting conditions and process requirements, thereby improving the control accuracy and stability of the system.

[0054] Device driver module:

[0055] The control signal generated by the control algorithm module is power amplified and converted so that it can drive the shaft roller motor, silicon material feed motor, ultrasonic generator, cutting liquid extraction pump motor and other equipment to perform corresponding actions.

[0056] Real-time monitoring of the equipment's operating status, such as the motor's speed, current, and voltage, is performed. When a fault or abnormality occurs in the equipment, the power supply is promptly cut off and an alarm signal is sent to the control system. Detailed fault information is displayed on the user interface, allowing maintenance personnel to quickly locate and troubleshoot the fault.

[0057] Data storage and analysis module:

[0058] Responsible for storing all data collected during the cutting process and the equipment's operating history data, and establishing a complete database management system to facilitate data query, retrieval and backup.

[0059] Use data analysis algorithms to conduct in-depth analysis of stored data and explore the patterns and potential problems behind the data. For example, by analyzing the quality data of silicon wafers under different cutting parameter combinations, the optimal cutting parameter settings can be found. Through trend analysis of equipment operation data, possible equipment failures can be predicted, and maintenance can be carried out in advance to improve the reliability and service life of the equipment.

[0060] Remote communication module:

[0061] It is equipped with an Ethernet communication interface or a wireless communication module (such as Wi-Fi, 4G / 5G, etc.) to realize data communication between the control system and the remote monitoring center or other equipment.

[0062] Real-time data, equipment operating status, and alarm information during the cutting process can be uploaded to the remote monitoring center, making it convenient for managers to remotely monitor and manage the production process. At the same time, control instructions and parameter update information sent by the remote monitoring center can also be received to achieve remote operation and remote maintenance, thereby improving the flexibility and efficiency of production management.

[0063] In a third aspect, an embodiment of the present application provides a control system for diamond wire sawing silicon wafers, wherein the control logic steps are as follows:

[0064] User interaction step: Provides a human-computer interaction interface to receive user-input cutting parameters, including silicon material feed speed, shaft roller reciprocating motion frequency, ultrasonic power, and cutting fluid initial flow rate. It also displays the real-time operating status of the equipment, cutting process monitoring data, and system prompt information, and verifies the legitimacy of the input parameters.

[0065] Data collection steps: By connecting to sensors at key locations on the equipment, real-time data on diamond wire tension, cutting fluid temperature, pressure, flow, and silicon material feed position are collected. The collected data is then pre-processed, including filtering, amplification, analog-to-digital conversion, and validity checks.

[0066] Control algorithm steps: The control algorithm is selected according to the cutting process requirements and equipment operating characteristics. The collected real-time data is used as input, and the algorithm calculates and generates control signals to adjust the reciprocating speed of the roller, the feed speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump. It also has an adaptive adjustment function.

[0067] Equipment driving steps: amplify and convert the control signal to drive the shaft roller motor, silicon material feeding motor, ultrasonic generator, and cutting liquid extraction pump motor to perform corresponding actions. At the same time, the equipment operation status is monitored in real time. When a fault occurs, the power supply is cut off and an alarm is issued;

[0068] Data storage and analysis steps: store cutting process data and equipment operation history data, and use data analysis algorithms to explore data patterns and potential problems;

[0069] Remote communication steps: Realize data communication with the remote monitoring center or other equipment through the communication interface, upload real-time data, equipment status and alarm information, and receive remote control instructions and parameter update information.

[0070] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising a memory for storing one or more programs; and a processor. When the one or more programs are executed by the processor, the system according to any one of the above-mentioned first aspects is implemented.

[0071] An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the system according to any one of the first aspects described above is implemented.

[0072] The embodiments of the present invention have at least the following advantages or beneficial effects:

[0073] This invention significantly improves the quality of silicon wafer cutting. The efficient supply and uniform distribution of cutting fluid in this invention, thanks to the synergistic effect of the equipment structure and ultrasonic waves, forms a more stable and uniform lubricating film between the diamond wire and the silicon material. This significantly reduces the coefficient of friction during the cutting process, effectively avoiding defects such as scratches and cracks on the silicon wafer surface caused by uneven friction, ensuring a higher degree of flatness and smoothness on the silicon wafer surface, significantly improving the optical performance of the silicon wafer, and meeting the stringent quality requirements of photovoltaic power generation.

[0074] Ensuring stable electrical performance: A timely and efficient heat dissipation mechanism is another major advantage of this invention. During the cutting process, the cutting fluid can quickly remove the large amount of heat generated by the friction between the diamond wire and the silicon material, preventing local overheating of the silicon wafer and changes in the internal crystal structure. The stable crystal structure ensures that the electrical performance of the silicon wafer is not affected during the subsequent battery preparation process, ensuring that the silicon wafer can properly perform its photoelectric conversion function, and improving the overall efficiency and stability of the photovoltaic power generation system.

[0075] The present invention significantly improves production efficiency and shortens the single-batch cutting time. During operation, the cutting method and equipment of the present invention are more efficient in the coordinated work between the various components. From the precise feeding of the silicon material feeding device, the stable reciprocating motion of the diamond wire driven by the shaft roller, to the optimized design of the cutting liquid circulation system and the strengthening effect of the ultrasonic device on the cutting liquid, each link is closely coordinated, making the cutting process smoother and greatly shortening the cutting time of a single batch of silicon wafers. This not only improves the production efficiency of the equipment, but also can produce more silicon wafers in the same time, meeting the market's growing demand for silicon wafers; the control system's real-time monitoring and precise adjustment of the equipment's operating parameters ensures that the equipment is always in the best working condition throughout the entire cutting process. This reduces downtime caused by equipment failure or parameter abnormalities and improves the long-term stability and utilization of the equipment. At the same time, the stable equipment operation state also helps to further improve the cutting quality of silicon wafers, forming a virtuous circle and providing a strong guarantee for the efficient production of the photovoltaic industry.

[0076] The control system described in this invention achieves intelligent control and efficient management of the precise and intelligent cutting process. The control algorithm module in the control system utilizes advanced algorithms, such as PID control and fuzzy control, and features adaptive adjustment capabilities. Based on real-time data collected during the cutting process, such as wire tension, cutting fluid temperature, pressure, flow rate, and silicon material feed position, it accurately calculates and generates control signals, dynamically adjusting equipment operating parameters such as roller speed, silicon material feed speed, ultrasonic power, and cutting fluid pump flow rate. This precise intelligent control ensures that the cutting process always remains under optimal process conditions, effectively improving cutting quality and efficiency and reducing scrap rates. The data storage and analysis module stores and deeply analyzes massive amounts of cutting process data, revealing the inherent relationship between different cutting parameter combinations and silicon wafer quality. This provides data support for process optimization, helping companies continuously improve cutting processes and enhance product quality. Furthermore, by analyzing trend data from equipment operation, potential equipment failures can be predicted in advance, allowing for timely maintenance and repair, avoiding production interruptions caused by sudden equipment failures, reducing repair costs, and increasing equipment reliability and service life. Furthermore, the remote communication module enables real-time data communication between the control system and a remote monitoring center or other devices. Through the remote monitoring center, managers can view the equipment's operating status, cutting process data, and alarm information at any time, enabling remote monitoring and management of the production process. Furthermore, they can send control commands and update parameters remotely, enabling timely response to changes in the production process. This improves the flexibility and efficiency of production management and adapts to the development trend of modern intelligent manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0078] Figure 1 Schematic diagram of the cutting step in the present invention;

[0079] Figure 2 Schematic diagram of the control steps of the control system of the present invention;

[0080] Figure 3 A schematic diagram of the principle of the cutting equipment involved in the present invention;

[0081] Figure 4 This is a structural block diagram of an electronic device provided by an embodiment of the present invention.

[0082] Explanation of the accompanying symbols: 1. Shaft roller; 2. Diamond wire; 3. Silicon material feeding device; 4. Cutting liquid main tank; 5. Cutting liquid; 6. Ultrasonic wave; 7. Cutting liquid inlet; 8. Cutting liquid reflux tank; 9. Cutting liquid sub-tank; 10. Cutting liquid extraction pump; 101. Memory; 102. Processor; 103. Communication interface. DETAILED DESCRIPTION

[0083] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0084] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0085] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0086] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further limitations, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0087] In the description of the embodiments of the present invention, "a plurality of" means at least two.

[0088] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0089] like Figure 1-4 The present application provides a device for using diamond wire for silicon wafer cutting, which mainly consists of the following parts:

[0090] Axis roller: As the core transmission component in the slicing process, it can perform precise reciprocating motion, providing power and guidance for the movement of the diamond wire, ensuring that the diamond wire maintains a stable motion trajectory and speed during the cutting process.

[0091] Diamond wire: Its mesh is evenly distributed on the rollers. The base material of the diamond wire is a tungsten busbar with a specific specification, ranging from 26-33μm. The coating thickness is controlled at 2-3μm, and the number of diamond particles on the diamond wire ranges from 50 to 200. This specific parameter setting is designed to maintain cutting performance while adapting to new cutting process requirements and reducing costs.

[0092] Silicon material feeding device: It is equipped with a high-precision feed control system, which can push the silicon material at a stable speed during the slicing process according to the preset parameters, ensuring the coordinated relative movement of the silicon material and the diamond wire to achieve precise cutting.

[0093] Cutting fluid main groove: A gap with a width of 1mm is opened at the diamond wire mesh. This gap not only provides space for the reciprocating cutting of the diamond wire, but also serves as a key channel for the circulation and reflux of the cutting fluid, ensuring the effective supply and recycling of the cutting fluid in the cutting area.

[0094] Cutting fluid: The carefully formulated cutting fluid has excellent lubrication, cooling, and drainage properties. It can form a stable lubricating film during the cutting process, effectively reduce the friction coefficient, quickly take away heat, and promptly remove impurities generated by cutting.

[0095] Ultrasonic device: By generating high-frequency ultrasonic vibrations, it acts on the cutting fluid, making it better dispersed and penetrated in the cutting area, enhancing the lubrication and cooling effects of the cutting fluid, and improving cutting efficiency and quality.

[0096] Cutting fluid inlet: Serves as the inlet for cutting fluid to enter the system. It is connected to the external cutting fluid supply source to ensure the continuous supply of cutting fluid during the cutting process and maintain the stable liquid level and performance of the cutting fluid in the system.

[0097] Cutting fluid return trough: responsible for collecting the cutting fluid returning from the cutting area. Its design structure can effectively guide the return of the cutting fluid, prevent leakage and splashing during the return process, and ensure that the cutting fluid is smoothly returned to the subsequent processing link.

[0098] Cutting fluid auxiliary tank: works together with the cutting fluid main tank to regulate the distribution and circulation of the cutting fluid, buffer and adjust the flow rate, pressure and other parameters of the cutting fluid, and ensure stable circulation and uniform distribution of the cutting fluid in the entire system.

[0099] Cutting fluid extraction pump: provides powerful power support for the circulation of cutting fluid, can accurately control the flow and pressure of cutting fluid according to system requirements, and ensure sufficient supply and effective circulation of cutting fluid in the cutting area.

[0100] Furthermore, the cutting method involved in this application includes the following steps based on the above-mentioned equipment:

[0101] Equipment preparation stage:

[0102] First, the silicon material is accurately installed on the silicon material feeding device, and the precise feeding speed is set in the control system according to the process requirements of silicon wafer cutting.

[0103] Carefully check the movement of the roller to ensure that it can reciprocate smoothly and accurately. At the same time, check the distribution of the diamond wire mesh to ensure its uniformity and rationality of tension.

[0104] Inject an appropriate amount of cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank to ensure that the liquid level is within the normal working range, and check whether the cutting fluid inlet, reflux tank and related pipelines are tightly connected and there is no leakage.

[0105] Cutting start-up phase:

[0106] Start the shaft roller to drive the diamond wire to start running stably according to the preset reciprocating motion mode, forming a stable cutting motion trajectory.

[0107] The cutting fluid extraction pump is started synchronously to accurately deliver the cutting fluid from the cutting fluid sub-tank to the cutting fluid main tank through the cutting fluid inlet. The cutting fluid reaches the cutting area evenly through the 1mm gap at the diamond wire mesh in the main tank, ensuring that the cutting area can get sufficient cutting fluid supply at the beginning of cutting.

[0108] Turn on the ultrasonic device and set the appropriate ultrasonic frequency and power according to the cutting process requirements. Under the action of ultrasonic waves, the cutting fluid is quickly dispersed into tiny droplets and better penetrates into every corner of the cutting area, thereby improving the contact effect between the cutting fluid and the diamond wire and silicon material.

[0109] Cutting process stages:

[0110] During the cutting process, the silicon material feeding device feeds the silicon material steadily and strictly according to the set speed, ensuring that the silicon material and the diamond wire maintain an accurate relative movement speed to achieve precise cutting.

[0111] The diamond wire continuously reciprocates, and with the lubrication and cooling of the cutting fluid and the assistance of ultrasound, the diamond particles on the diamond wire are used to efficiently grind and cut the silicon material.

[0112] The debris and excess cutting fluid generated by cutting are smoothly returned to the cutting fluid auxiliary tank through the cutting fluid reflux tank under the action of gravity and the flow of the cutting fluid, thereby realizing the recycling of the cutting fluid. At the same time, the filtering device in the cutting fluid auxiliary tank performs preliminary filtration on the reflux cutting fluid to remove some impurities.

[0113] The control system monitors key parameters in the cutting process in real time, such as the tension of the diamond wire, the temperature, pressure, flow of the cutting fluid, and the feed position of the silicon material. Once any abnormal parameters are found, the corresponding adjustment mechanism is immediately activated.

[0114] Cutting completion stage:

[0115] When the cutting task is completed, stop the operation of the shaft roller, ultrasonic device, cutting fluid extraction pump and other equipment in sequence to ensure that the equipment stops operating safely.

[0116] Carefully remove the cut silicon wafer and perform a preliminary appearance inspection on the wafer to check for surface defects and other problems.

[0117] Clean the equipment thoroughly, including the main cutting fluid tank, auxiliary tank, reflux tank and diamond wire surface, remove residual cutting fluid and impurities such as silicon chips, and prepare for the next cutting operation.

[0118] Record all detailed data during the cutting process, such as cutting parameters, equipment operation data, silicon wafer quality data, etc. These data will serve as an important basis for subsequent process optimization and quality control.

[0119] Example 1:

[0120] Equipment preparation

[0121] Select diamond wire with a specification of 26μm tungsten wire busbar, a coating thickness of 2μm, and 50 diamond particles, and install it evenly on the shaft roller to ensure that the wire mesh is evenly distributed and the tension is moderate.

[0122] The silicon material was accurately installed on the silicon material feeding device and the silicon material feeding speed was set to 0.5 mm / s.

[0123] Inject an appropriate amount of carefully prepared cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank, check the cutting fluid inlet, reflux tank and the tightness of each pipeline connection to ensure there is no leakage.

[0124] Turn on the power of the equipment and perform an idling test on the shaft roller to check the smoothness of its reciprocating motion and ensure that the motion error is within the allowable range.

[0125] Cutting process

[0126] Start the shaft roller to drive the diamond wire to reciprocate at a speed of 10m / s.

[0127] Start the cutting liquid extraction pump and transport the cutting liquid from the auxiliary tank to the main tank through the liquid inlet. Set the cutting liquid flow rate to 5L / min, and the cutting liquid will evenly reach the cutting area through the 1mm gap in the main tank.

[0128] At the same time, start the ultrasonic device, set the ultrasonic frequency to 20kHz and the power to 500W, so that the cutting fluid can be better dispersed and penetrated into the cutting area under the action of ultrasonic waves.

[0129] During the cutting process, the control system monitors the diamond wire tension in real time, maintaining it between 10-15N, the cutting fluid temperature between 25-35°C, the pressure between 0.2-0.3MPa, and the flow rate stable at around 5L / min. The silicon material feeding device feeds the silicon material steadily at the set speed.

[0130] After cutting is completed

[0131] After cutting is completed, stop the shaft roller, ultrasonic device and cutting liquid extraction pump.

[0132] The silicon wafer was carefully removed and its surface was thoroughly inspected using an optical microscope. No obvious scratches, cracks or other defects were found, and the surface roughness of the silicon wafer reached 0.8μm.

[0133] Clean the equipment, including the main tank, auxiliary tank, reflow tank and diamond wire surface to ensure there is no residual cutting fluid and silicon chips.

[0134] Record the cutting process data, such as cutting parameters, equipment operation data, silicon wafer quality data, etc., to provide a reference for subsequent process optimization.

[0135] Example 2:

[0136] Equipment preparation

[0137] A diamond wire with a specification of 33μm tungsten wire busbar, a coating thickness of 3μm, and 200 diamond particles is used. It is installed on the shaft roller and the wire mesh is adjusted.

[0138] The silicon material was mounted on the feeding device and the feeding speed was set to 0.8 mm / s.

[0139] After injecting the cutting fluid, check the system sealing, start the equipment to preheat, check the movement accuracy of the shaft roller, and control the reciprocating motion error within a very small range.

[0140] Cutting process

[0141] The starting shaft roller drives the diamond wire to reciprocate at a speed of 15m / s.

[0142] Start the liquid extraction pump and deliver the cutting liquid to the main tank at a flow rate of 8L / min, so that it reaches the cutting area through the gap. Turn on the ultrasonic device and set the frequency to 30kHz and the power to 800W.

[0143] During cutting, the control system monitors the diamond wire tension at 12-18N, the cutting fluid temperature at 20-30°C, the pressure at 0.25-0.35MPa, and the flow rate at around 8L / min, and the silicon material feeding device feeds stably.

[0144] After cutting is completed

[0145] The relevant equipment was stopped, the silicon wafer was taken out, and the surface of the silicon wafer was inspected with an atomic force microscope. The surface roughness was 0.6μm, and there were no obvious defects.

[0146] Clean all parts of the equipment and record cutting data, including the equipment operating time of 150 minutes, which is 20% shorter than traditional methods, and the use of diamond wire is reduced by 15%.

[0147] Comparative Example 1 (traditional cutting method, without ultrasonic device and special equipment structure):

[0148] Equipment preparation

[0149] Conventional diamond wire (parameters similar to those in Example 1) was used and installed on a common shaft roller. The silicon material was installed in a conventional feeding device and the feeding speed was set to 0.6 mm / s.

[0150] Fill with normal cutting fluid and check basic plumbing connections.

[0151] Cutting process

[0152] The starting shaft roller drives the diamond wire to reciprocate at a speed of 8m / s, and the cutting fluid is only sprayed into the cutting seam through the spray port, without any special circulation structure.

[0153] The cutting parameters cannot be effectively monitored and adjusted during the cutting process, and the operation can only rely on experience.

[0154] After cutting is completed

[0155] After stopping the equipment and taking out the silicon wafer, it was found that there were many scratches and micro cracks on the surface of the silicon wafer, and the surface roughness reached 1.5μm.

[0156] The recording device was operated for 200 minutes, and the amount of diamond wire used was 25% more than that in Example 1.

[0157] Comparative Example 2 (only optimizing the diamond wire parameters, other cutting conditions remain unchanged):

[0158] Equipment preparation

[0159] An optimized diamond wire with the same specifications as in Example 1 (26 μm tungsten wire busbar, 2 μm coating thickness, 50 diamond particles) was used and installed on a conventional cutting device. The silicon material feed speed was set to 0.5 mm / s.

[0160] Inject conventional cutting fluid and check the basic operating conditions of the equipment.

[0161] Cutting process

[0162] The starting roller reciprocated the diamond wire at a speed of 10m / s, and the cutting fluid was supplied in the traditional way. However, due to the inability to effectively solve the problem of liquid carryover during the cutting process, the diamond wire wore rapidly and broke frequently.

[0163] After cutting is completed

[0164] The device was stopped and the silicon wafer was removed. Obvious scratches were found on the surface of the silicon wafer, and the surface roughness was 1.2 μm. The recording device was operated for 180 minutes, and the amount of diamond wire used was 18% more than that in Example 1.

[0165] By comparing Example 1 and Example 2 with Comparative Example 1 and Comparative Example 2, it can be seen that the equipment, method and control system of the present invention have significant advantages in silicon wafer cutting quality, cutting efficiency, diamond wire usage, etc., and effectively solve the problems existing in the prior art mentioned in the background technology.

[0166] The embodiment of the present application also provides a computer-readable storage medium having a computer program stored thereon, which implements a system as described in any one of the first aspects above when executed by the processor 102. If the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0167] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention. For those skilled in the art, it is obvious that the present application is not limited to the details of the above-mentioned exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A method for using diamond wire for silicon wafer cutting, characterized in that: The following steps are involved: S1. Install the silicon material on the silicon material feeding device and set the silicon material feeding speed; S2. Start the shaft roller to make the diamond wire reciprocate; S3. The cutting liquid is pumped from the cutting liquid auxiliary tank through the cutting liquid inlet to the cutting liquid main tank, and the cutting liquid reaches the cutting area through the 1mm gap in the diamond wire mesh at the cutting liquid main tank; S4. Start the ultrasonic device so that the cutting fluid is dispersed and penetrates into the cutting area under the action of ultrasound; S5. During the cutting process, the cutting fluid lubricates, cools, and drains the cutting area. The silicon material feeding device feeds the silicon material at a set speed, and the diamond wire continuously reciprocates to cut. The debris and excess cutting fluid generated by the cutting flow back to the cutting fluid auxiliary tank through the cutting fluid return tank, realizing the recycling of the cutting fluid. The base material of the diamond wire is a tungsten wire busbar with a specification of 26-33 μm, a coating thickness of 2-3 μm, and 50-200 diamond particles on the diamond wire.

2. The method for using diamond wire for silicon wafer cutting according to claim 1, wherein: During the equipment preparation stage, it also includes an inspection of the movement status of the shaft rollers and the distribution of the diamond wire mesh, as well as an inspection of the tightness of the cutting fluid system pipeline connections.

3. The method for using diamond wire for silicon wafer cutting according to claim 1, wherein: After cutting is completed, the silicon wafer is visually inspected and various data of the cutting process are recorded, including cutting parameters, equipment operation data, and silicon wafer quality data.

4. A control system for diamond wire sawing silicon wafers, characterized by: The control logic steps include: User interaction step: Provides a human-computer interaction interface to receive user-input cutting parameters, including silicon material feed speed, shaft roller reciprocating motion frequency, ultrasonic power, and cutting fluid initial flow rate. It also displays the real-time operating status of the equipment, cutting process monitoring data, and system prompt information, and verifies the legitimacy of the input parameters. Data collection steps: By connecting to sensors at key locations on the equipment, real-time data on diamond wire tension, cutting fluid temperature, pressure, flow, and silicon material feed position are collected. The collected data is then pre-processed, including filtering, amplification, analog-to-digital conversion, and validity checks. Control algorithm steps: The control algorithm is selected according to the cutting process requirements and equipment operating characteristics. The collected real-time data is used as input, and the algorithm calculates and generates control signals to adjust the reciprocating speed of the roller, the feed speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump. It also has an adaptive adjustment function. Equipment driving steps: amplify and convert the control signal to drive the shaft roller motor, silicon material feeding motor, ultrasonic generator, and cutting liquid extraction pump motor to perform corresponding actions. At the same time, the equipment operation status is monitored in real time. When a fault occurs, the power supply is cut off and an alarm is issued; Data storage and analysis steps: store cutting process data and equipment operation history data, and use data analysis algorithms to explore data patterns and potential problems; Remote communication steps: realize data communication with remote monitoring center or other equipment through communication interface, upload real-time data, equipment status and alarm information, receive remote control instructions and parameter update information, The control algorithms in the control algorithm step include PID control algorithm and fuzzy control algorithm.

5. The control system for diamond wire sawing of silicon wafers according to claim 4, characterized in that: The data analysis algorithm in the data storage and analysis step is used to analyze silicon wafer quality data under different cutting parameter combinations to find the optimal parameter settings, and to perform trend analysis on equipment operation data to predict equipment failures.

6. The control system for diamond wire sawing of silicon wafers according to claim 4, characterized in that: The communication interface in the remote communication step includes an Ethernet communication interface or a wireless communication module, and the wireless communication module includes Wi-Fi, 4G / 5G.

7. The control system for diamond wire sawing of silicon wafers according to claim 4, characterized in that: The monitoring of the equipment operating status in the equipment driving step includes monitoring of motor speed, current and voltage.

8. The control system for diamond wire sawing of silicon wafers according to claim 4, characterized in that: If the parameter validity verification in the user interaction step finds an error or exceeds the range, a prompt box will pop up to inform the operator to make corrections.

Images