A fully automatic PCB circuit board warpage detection machine

Abstract

The present invention relates to the field of PCB circuit boards, and in particular to a fully automatic warpage detection machine for PCB circuit boards. The machine comprises a material storage component, on the top of which a material picking component is installed; in the present invention, the distances between several relative groups of pressure buffer blocks are fixed, so when the PCB circuit board warps, the distances between the relative pressure buffer blocks will change, thereby improving the effect of preliminary detection, and then the two groups of pressure buffer blocks are driven to slowly move toward each other on the outer wall of the PCB circuit board. When different warpage conditions occur, the sliding rod is driven to squeeze the compression spring in the sleeve tube, thereby avoiding the problem of structural damage caused by the squeezing process through buffering. When the compression spring senses pressure, it exerts a rebound force on the pressure sensor, thereby judging the degree of warpage, and observing the data changes of the scale structure at any time, thereby assisting in the warpage detection work, thereby improving the working effect of the fully automatic detection machine.

Description

[0001] This application is a divisional application of the application filed on September 20, 2024, with application number 202411315458.6 and invention name “A fully automatic detection machine for PCB circuit board warpage and its detection method”. Technical Field

[0002] The invention belongs to the technical field of PCB circuit boards, and in particular relates to a fully automatic detection machine for warpage of PCB circuit boards. Background Art

[0003] The names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum base board, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board, etc.

[0004] After searching, in the prior art, Chinese patent publication number: CN221464571U, publication date: 2024-08-02, discloses an automatic PCB circuit board warpage testing machine, including a test frame, a servo motor is installed on the test frame, the output end of the servo motor is connected to a driving wheel through a rotating shaft, the surface of the driving wheel is connected to a driven wheel through a belt, and the center of the surface of the driving wheel and the driven wheel are connected to a screw body through a rotating shaft; the above embodiment has the advantages of convenient detection operation and fast speed.

[0005] However, the device still has the following defects:

[0006] PCB circuit boards have irregular shapes and different degrees of warping. If only a single image detection method is used, the circuit board warping detection work will be limited, thereby reducing the working effect of the fully automatic detection machine. Summary of the Invention

[0007] To address the above issues, the present invention provides a fully automatic PCB warpage detection machine. The machine comprises a material storage assembly, a material retrieving assembly mounted on top of the material storage assembly, a detection assembly mounted on the material retrieving assembly, two sets of compatible components symmetrically mounted on the material storage assembly, and an auxiliary component mounted on each set of compatible components.

[0008] The compatible component includes several groups of sleeves, one end of a group of compression springs is installed on the inner wall of one side of each group of sleeves, the other end of each group of compression springs is installed on a group of sliding rods, a group of pressure sensors is installed at the junction of each group of sliding rods and compression springs, a group of scale structures is installed on the outer wall of each group of sliding rods, and a group of pressure buffer blocks is installed on one side wall of each group of sliding rods;

[0009] When the PCB circuit board warps, the distance between the relative pressure relief blocks will change.

[0010] Furthermore, the material storage assembly includes a working base plate, a support frame is arranged directly above the working base plate, two groups of support frames are symmetrically installed at the top edge of the working base plate, the top of each group of support frames is installed on the bottom of the support frame, and a storage box is installed on the top of the working base plate.

[0011] Furthermore, the material picking assembly includes a first fixed plate, the bottom of the first fixed plate is installed on the top of the support frame, a first electric slide is installed on one side wall of the first fixed plate, a first disc is transmission-connected to the output end of the first electric slide, a first motor is installed on the bottom of the first disc, a rectangular plate is transmission-connected to the output end of the first motor, an auxiliary ring is installed on the outer wall of the rectangular plate, two groups of fixed tubes are symmetrically installed on the bottom of the first disc, and a second disc is installed on the bottom of the fixed tube.

[0012] Furthermore, a first electric push rod is installed on the bottom of the second disc, a vacuum box is installed on the bottom of the first electric push rod, a vacuum suction cup is connected to the bottom of the vacuum box, and a vacuum pump is installed on the outer wall of the vacuum box.

[0013] Furthermore, the detection component includes a second electric slide, the top of the second electric slide is installed on the bottom of the auxiliary ring, the output end of the second electric slide is transmission-connected to a second electric push rod, the output end of the second electric push rod is installed with a second fixed plate, a second motor is installed on one side wall of the second fixed plate, the output end of the second motor is transmission-connected to a third fixed plate, and a warpage optical detection camera is installed on the bottom of the third fixed plate.

[0014] Furthermore, the compatible component also includes a third motor, one end of each group of the third motors is mounted on the inner wall of the support frame, the output end of each group of the third motors is transmission-connected to a group of fourth fixed plates, one side wall of each group of the fourth fixed plates is provided with a group of sliding cavities, two groups of threaded rods are rotatably connected in each group of the sliding cavities, each group of the threaded rods is threadedly connected to a group of sliding blocks, a group of first connecting plates is mounted on one side wall of each group of the sliding blocks, and one end of each group of the sleeves is mounted on one side wall of the first connecting plate.

[0015] Furthermore, a group of first electromagnetic blocks are installed on one side wall of each group of the pressure relief blocks, and a group of clamping holes are opened on one side wall of each group of the pressure relief blocks.

[0016] Furthermore, the auxiliary component includes a second connecting plate, and two groups of sleeve shells are symmetrically installed on both side walls of each group of the second connecting plates, and a group of sliding columns are movably sleeved in each group of the sleeve shells, and a group of sleeve rings are installed on one side wall of each group of the sliding columns, and the inner wall of each group of the sleeve rings is sleeved on the outer wall of one group of sleeve tubes, and a group of third connecting plates are installed on the outer wall of each group of the sleeve rings, and a group of third electric push rods are installed on one side wall of each group of the third connecting plates, and a group of second electromagnetic blocks are installed on the output end of each group of the third electric push rods, and the first electromagnetic block is magnetically connected to the second electromagnetic block.

[0017] Furthermore, a group of third electromagnetic blocks are installed on the outer wall of each group of the second connecting plates, a group of fourth electromagnetic blocks are magnetically connected to each group of the third electromagnetic blocks, a group of fourth connecting plates are installed at one end of each group of the fourth electromagnetic blocks, two groups of fourth electric push rods are symmetrically installed on both side walls of each group of the fourth connecting plates, a group of card tubes are installed on the output end of each group of the fourth electric push rods, the card tubes are movably connected to the card holes, and a group of height limit plates are installed on the outer wall of each group of the fourth connecting plates.

[0018] A detection method for a fully automatic PCB warpage detection machine, the detection method comprising:

[0019] Place the PCB circuit boards in the storage assembly one by one for testing;

[0020] Start the material picking component to limit the adsorption of the PCB circuit board;

[0021] The compression spring starts to rebound after sensing the loss of pressure, driving the two sets of pressure relief blocks to contact the outer wall of the PCB.

[0022] The sliding rod squeezes the compression spring in the sleeve, and the compression spring exerts a rebound force on the pressure sensor when it senses pressure;

[0023] The sliding rod slides in the sleeve and drives the scale structure data to change;

[0024] Start the auxiliary components to detect the PCB circuit board.

[0025] The beneficial effects of the present invention are:

[0026] 1. The distances between several relative groups of pressure relief blocks are fixed. Therefore, when the PCB circuit board warps, the distances between the relative pressure relief blocks will change, which is used to improve the effect of the initial detection. Subsequently, the two groups of pressure relief blocks are driven to slowly move toward each other on the outer wall of the PCB circuit board. When different warping conditions occur, the sliding rod will be driven to squeeze the compression spring in the sleeve, and the problem of structural damage caused by the squeezing process can be avoided through buffering. When the compression spring senses pressure, it will exert rebound force on the pressure sensor to judge the degree of warping. The data changes of the scale structure can be observed at any time to assist in the detection of warping, thereby improving the working effect of the fully automatic detection machine.

[0027] 2. When it is necessary to detect the warping of the entire edge of the PCB circuit board, the third electric push rod is started to drive the pressure buffer block to move to the specified position relative to the fourth connecting plate, and then the fourth electric push rod is started to push the card tube and the card hole for active engagement, and then the magnetic connection between the third and fourth electromagnetic blocks is disengaged. Then, the two sets of pressure buffer blocks drive the fourth connecting plate to perform the warping detection work on the entire edge of the PCB circuit board. When the warped edge of the PCB circuit board contacts the height limit plate, the vacuum suction cup drives the PCB circuit board to be recovered, thereby improving the compatibility effect of the PCB circuit board warping detection.

[0028] 3. Start the second electric slide to drive the warp optical detection camera to move parallel, and then start the second motor during the movement to drive the warp optical detection camera to perform rotation detection. In order to increase the detection range, start the first motor to drive the rectangular plate to rotate, and the rectangular plate in turn drives the auxiliary ring to rotate. The auxiliary ring drives the warp optical detection camera to perform rotation detection while rotating. When the rectangular plate touches the fixed tube during the rotation, it starts to rotate in the opposite direction, which expands the detection range and improves the accuracy of the detection.

[0029] 4. The PCB circuit boards that need to be automatically tested for warpage are placed in the storage box in turn for testing. The first electric slide is started to drive the vacuum suction cup to move to the top of the storage box. Then the first electric push rod is started to push the vacuum suction cup down into the storage box to adsorb the center end of the PCB circuit board. In order to improve the adsorption effect, the vacuum pump is started to evacuate the air in the vacuum box, and then the space between the vacuum suction cup and the PCB circuit board is evacuated, thereby improving the adsorption and material removal effect of the device.

[0030] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 It shows a schematic structural diagram of a fully automatic inspection machine according to an embodiment of the present invention;

[0033] Figure 2 A schematic structural diagram of a material storage assembly according to an embodiment of the present invention is shown;

[0034] Figure 3 It shows a schematic structural diagram of a material taking assembly according to an embodiment of the present invention;

[0035] Figure 4 A schematic structural diagram of a detection component according to an embodiment of the present invention is shown;

[0036] Figure 5 It shows a schematic diagram of the compatible component structure according to an embodiment of the present invention;

[0037] Figure 6 shows a schematic cross-sectional view of a fourth fixing plate according to an embodiment of the present invention;

[0038] Figure 7 A schematic cross-sectional view of a sleeve according to an embodiment of the present invention is shown;

[0039] Figure 8 A schematic structural diagram of an auxiliary component according to an embodiment of the present invention is shown.

[0040] In the figure: 1. Material storage component; 101. Working base plate; 102. Support frame; 103. Support frame; 104. Material storage box; 2. Material picking component; 201. First fixed plate; 202. First electric slide; 203. First disc; 204. First motor; 205. Auxiliary ring; 206. Fixed tube; 207. Second disc; 208. First electric push rod; 209. Vacuum box; 210. Vacuum suction cup; 211. Vacuum pump; 3. Detection component; 301. Second electric slide; 302. Second electric push rod; 303. Second fixed plate; 304. Second motor; 305. Third fixed plate; 306. Warpage optical detection camera; 4. Compatible component; 401. Third motor; 402. Fourth Fixed plate; 403, threaded rod; 404, sliding cavity; 405, sliding block; 406, first connecting plate; 407, fourth motor; 408, socket tube; 409, compression spring; 410, sliding rod; 411, pressure sensor; 412, scale structure; 413, pressure buffer block; 414, first electromagnetic block; 415, snap-in hole; 5, auxiliary component; 501, second connecting plate; 502, socket shell; 503, sliding column; 504, socket ring; 505, third connecting plate; 506, third electric push rod; 507, second electromagnetic block; 508, third electromagnetic block; 509, fourth electromagnetic block; 510, fourth connecting plate; 511, fourth electric push rod; 512, snap-in tube; 513, height limit plate. DETAILED DESCRIPTION

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0042] The embodiment of the present invention provides a fully automatic PCB circuit board warpage detection machine. It includes a storage component 1, illustratively, as Figure 1 As shown, a material taking component 2 is installed on the top of the material storage component 1, a detection component 3 is installed on the material taking component 2, two groups of compatible components 4 are symmetrically installed on the material storage component 1, and each group of compatible components 4 is installed on a group of auxiliary components 5.

[0043] For example, Figure 2As shown, the material storage assembly 1 includes a working base plate 101, a support frame 103 is arranged directly above the working base plate 101, two groups of support frames 102 are symmetrically installed at the top edge of the working base plate 101, the top of each group of support frames 102 is installed on the bottom of the support frame 103, and a storage box 104 is installed on the top of the working base plate 101.

[0044] For example, Figure 3 As shown, the material picking component 2 includes a first fixed plate 201, the bottom of the first fixed plate 201 is installed on the top of the support frame 103, a first electric slide 202 is installed on one side wall of the first fixed plate 201, the output end of the first electric slide 202 is transmission-connected with a first disc 203, the bottom of the first disc 203 is installed with a first motor 204, the output end of the first motor 204 is transmission-connected with a rectangular plate, an auxiliary ring 205 is installed on the outer wall of the rectangular plate, two groups of fixed tubes 206 are symmetrically installed on the bottom of the first disc 203, a second disc 207 is installed on the bottom of the fixed tube 206, a first electric push rod 208 is installed on the bottom of the second disc 207, a vacuum box 209 is installed on the bottom of the first electric push rod 208, the bottom of the vacuum box 209 is connected to a vacuum suction cup 210, and a vacuum pump 211 is installed on the outer wall of the vacuum box 209.

[0045] The PCB circuit boards that need to be automatically tested for warpage are placed in the storage box 104 for testing in turn, and the first electric slide 202 is started to drive the vacuum suction cup 210 to move to the top of the storage box 104. Then the first electric push rod 208 is started to push the vacuum suction cup 210 down into the storage box 104 to adsorb the center end of the PCB circuit board. In order to improve the adsorption effect, the vacuum pump 211 is started to evacuate the air in the vacuum box 209, and then the space between the vacuum suction cup 210 and the PCB circuit board is evacuated, thereby improving the adsorption and material collection effect of the device.

[0046] For example, Figure 4 As shown, the detection component 3 includes a second electric slide 301, the top of the second electric slide 301 is installed on the bottom of the auxiliary ring 205, the output end of the second electric slide 301 is transmission-connected to a second electric push rod 302, the output end of the second electric push rod 302 is installed with a second fixed plate 303, a second motor 304 is installed on one side wall of the second fixed plate 303, the output end of the second motor 304 is transmission-connected to a third fixed plate 305, and the bottom of the third fixed plate 305 is installed with a warpage optical detection camera 306.

[0047] When the PCB circuit board is undergoing warpage detection, the second electric push rod 302 is started to drive the warpage optical detection camera 306 to move to the top of the PCB circuit board for detection. In order to improve the flexibility of detection, the second electric slide 301 is started to drive the warpage optical detection camera to move parallel, and then the second motor 304 is started during the movement to drive the warpage optical detection camera 306 to rotate. In order to increase the detection range, the first motor 204 is started to drive the rectangular plate to rotate, and the rectangular plate in turn drives the auxiliary ring 205 to rotate. The auxiliary ring 205 drives the warpage optical detection camera 306 to perform rotation detection while rotating. When the rectangular plate touches the fixed tube 206 during rotation, it starts to rotate in the opposite direction, which expands the detection range while improving the accuracy of the detection.

[0048] For example, Figure 5 、 Figure 6 and Figure 7 As shown, the compatible component 4 includes a third motor 401, one end of each group of the third motors 401 is mounted on the inner wall of the support frame 103, and the output end of each group of the third motors 401 is transmission-connected to a group of fourth fixed plates 402, and a group of sliding cavities 404 are opened on one side wall of each group of the fourth fixed plates 402, and two groups of threaded rods 403 are rotatably connected in each group of the sliding cavities 404, and a partition block is connected between the two groups of the threaded rods 403, and the thread directions of the two groups of threaded rods 403 are opposite, and the central axes are located on the same straight line, and each group of the threaded rods 403 is threadedly connected to a group of sliding blocks 405, and each group of the sliding blocks 405 is slidably connected in the sliding cavity 404, and a group of first connecting plates 406 is installed on one side wall of each group of the sliding blocks 405, and a group of fourth motors 407 is installed on one inner wall of one side of each group of the fourth fixed plates 402. The output end of the motor 407 is transmission-connected to one of the groups of threaded rods 403, and a group of sleeves 408 are installed on one side wall of each group of the first connecting plates 406, and one end of a group of compression springs 409 are installed on the inner wall of one side of each group of the sleeves 408, and a group of sliding rods 410 are installed on the other end of each group of the compression springs 409, and the outer wall of each group of the sliding rods 410 is slidably connected to the inner wall of the sleeve 408, and a group of pressure sensors 411 are installed at the junction of each group of the sliding rods 410 and the compression springs 409, and a group of scale structures 412 are installed on the outer wall of each group of the sliding rods 410, and a group of pressure-absorbing blocks 413 are installed on one side wall of each group of the sliding rods 410, and a group of first electromagnetic blocks 414 are installed on one side wall of each group of the pressure-absorbing blocks 413, and a group of snap-in holes 415 are opened on one side wall of each group of the pressure-absorbing blocks 413.

[0049] Before the vacuum suction cup 210 takes the material, the third electric push rod 506 is first started to drive the second electromagnetic block 507 to be magnetically connected with the first electromagnetic block 414, and then the third electric push rod 506 is started to drive the first electromagnetic block 414 to move in the direction close to the sleeve tube 408. During its movement, the sliding rod 410 is driven to slide in the sleeve tube 408 to squeeze the compression spring 409. When the vacuum suction cup 210 drives the PCB circuit board to rise to the specified height, the first electromagnetic block 414 is disengaged from the magnetic connection with the second electromagnetic block 507. When the compression spring 409 senses that the pressure disappears, it begins to rebound. During its rebound process, it drives the two groups of buffer blocks 413 to contact the outer wall of the PCB circuit board. Since the distance between the relative groups of buffer blocks 413 is fixed, when the PCB circuit board warps, the relative buffer blocks 413 will be pressed against the outer wall of the PCB circuit board. The distance between the pressure blocks 413 changes to improve the effect of the preliminary detection, and then the fourth motor 407 is started to drive the threaded rod 403 to rotate, and the threaded rod 403 drives the sliding block 405 to slide in the sliding cavity 404, thereby driving the two groups of first connecting plates 406 to move toward each other. When they move toward each other, they drive the two groups of buffer blocks 413 to move slowly on the outer wall of the PCB circuit board. When different warping conditions occur, the sliding rod 410 will be driven to squeeze the compression spring 409 in the sleeve 408, and the problem of structural damage caused by the extrusion process is avoided by buffering. When the compression spring 409 senses pressure, it will exert a rebound force on the pressure sensor 411 to judge the degree of warping, and while the sliding rod 410 slides in the sleeve 408, it drives the data of the scale structure 412 to change, so as to assist in detecting warping.

[0050] For example, Figure 8As shown, the auxiliary component 5 includes a second connecting plate 501, and two groups of sleeve shells 502 are symmetrically installed on the two side walls of each group of the second connecting plates 501. A group of sliding columns 503 are movably sleeved in each group of the sleeve shells 502. A group of sleeve rings 504 are installed on one side wall of each group of the sliding columns 503. The inner wall of each group of the sleeve rings 504 is sleeved on the outer wall of one group of sleeve tubes 408. A group of third connecting plates 505 is installed on the outer wall of each group of the sleeve rings 504. A group of third electric push rods 506 are installed on one side wall of each group of the third connecting plates 505. A group of second electromagnetic blocks 506 are installed on the output end of each group of the third electric push rods 506. 7. The first electromagnetic block 414 is magnetically connected to the second electromagnetic block 507. A group of third electromagnetic blocks 508 are installed on the outer wall of each group of the second connecting plates 501. Each group of the third electromagnetic blocks 508 is magnetically connected to a group of fourth electromagnetic blocks 509. A group of fourth connecting plates 510 is installed at one end of each group of the fourth electromagnetic blocks 509. Two groups of fourth electric push rods 511 are symmetrically installed on the two side walls of each group of the fourth connecting plates 510. A group of card tubes 512 are installed on the output end of each group of the fourth electric push rods 511. The card tubes 512 are movably connected to the card holes 415. A group of height limiting plates 513 are installed on the outer wall of each group of the fourth connecting plates 510.

[0051] When the fourth motor 407 drives the first connecting plate 406 to move, it also drives the sliding column 503 to move in the socket shell 502, avoiding structural damage. When it is necessary to detect the warping of the entire edge of the PCB circuit board, the third electric push rod 506 is started to drive the pressure buffer block 413 to move to a specified position relative to the fourth connecting plate 510, and then the fourth electric push rod 511 is started to push the card tube 512 to movably engage with the card hole 415, and then the magnetic connection between the third electromagnetic block 508 and the fourth electromagnetic block 509 is disengaged, and then the four connecting plate 510 is driven by the two groups of pressure buffer blocks 413 to perform the whole-edge warping detection on the PCB circuit board. When the warped edge of the PCB circuit board contacts the height limit plate 513, the vacuum suction cup 210 drives the PCB circuit board to be recovered, thereby improving the compatibility effect of the PCB circuit board warping detection.

[0052] The distance between the relative groups of pressure-absorbing blocks 413 is fixed, so when the PCB circuit board warps, the distance between the relative pressure-absorbing blocks 413 will change, so as to improve the effect of the preliminary detection, and then the two groups of pressure-absorbing blocks 413 will be driven to slowly move toward each other on the outer wall of the PCB circuit board. When different warping conditions occur, the sliding rod 410 will be driven to squeeze the compression spring 409 in the sleeve 408, and the problem of structural damage caused by the squeezing process can be avoided through buffering. When the compression spring 409 senses pressure, it will exert a rebound force on the pressure sensor 411 to judge the degree of warping. The data changes of the scale structure 412 can be observed at any time to assist in detecting warping, thereby improving the working effect of the fully automatic detection machine.

[0053] When it is necessary to detect the warping of the entire edge of the PCB circuit board, the third electric push rod 506 is started to drive the pressure buffer block 413 to move to a specified position relative to the fourth connecting plate 510, and then the fourth electric push rod 511 is started to push the card tube 512 to engage with the card hole 415 for movability, and then the magnetic connection between the third electromagnetic block 508 and the fourth electromagnetic block 509 is disengaged, and then the two groups of pressure buffer blocks 413 are used to drive the fourth connecting plate 510 to perform the warping detection work on the entire edge of the PCB circuit board. When the warped edge of the PCB circuit board contacts the height limit plate 513, the vacuum suction cup 210 drives the PCB circuit board to be recovered, thereby improving the compatibility effect of the PCB circuit board warping detection.

[0054] Start the second electric slide 301 to drive the warp optical detection camera to move parallel, then start the second motor 304 during the movement to drive the warp optical detection camera 306 to perform rotation detection. In order to increase the detection range, start the first motor 204 to drive the rectangular plate to rotate, and the rectangular plate in turn drives the auxiliary ring 205 to rotate. The auxiliary ring 205 drives the warp optical detection camera 306 to perform rotation detection while rotating. When the rectangular plate touches the fixed tube 206 during the rotation, it starts to rotate in the opposite direction, which expands the detection range and improves the accuracy of the detection.

[0055] The PCB circuit boards that need to undergo fully automatic warpage detection are placed in the storage box 104 for detection in turn, and the first electric slide 202 is started to drive the vacuum suction cup 210 to move to the top of the storage box 104, and then the first electric push rod 208 is started to push the vacuum suction cup 210 down into the storage box 104 to adsorb the center end of the PCB circuit board. In order to improve the adsorption effect, the vacuum pump 211 is started to evacuate the air in the vacuum box 209, and then the space between the vacuum suction cup 210 and the PCB circuit board is evacuated, thereby improving the adsorption and material collection effect of the device.

[0056] Based on the above-mentioned fully automatic PCB circuit board warpage detection machine, an embodiment of the present invention further proposes a detection method of the fully automatic PCB circuit board warpage detection machine. Exemplarily, the detection method includes:

[0057] Place the PCB circuit boards in the storage box one by one to be tested, start the first electric slide to drive the vacuum suction cup to move to the top of the storage box;

[0058] Start the first electric push rod to push the vacuum suction cup down into the storage box to absorb the center end of the PCB circuit board;

[0059] Start the vacuum pump to evacuate the air in the vacuum box, and then evacuate the space between the vacuum suction cup and the PCB circuit board;

[0060] The third electric push rod is started to drive the second electromagnetic block to be magnetically connected with the first electromagnetic block, and the third electric push rod is then started to drive the first electromagnetic block to move toward the sleeve;

[0061] Drive the sliding rod to slide in the sleeve to squeeze the compression spring;

[0062] The compression spring starts to rebound after sensing the loss of pressure, driving the two sets of pressure relief blocks to contact the outer wall of the PCB.

[0063] The distances between several groups of relative pressure relief blocks are fixed. When the PCB circuit board warps, the distances between the relative pressure relief blocks will change.

[0064] Start the fourth motor to drive the two sets of pressure relief blocks to move slowly on the outer wall of the PCB circuit board;

[0065] The sliding rod is driven to squeeze the compression spring in the sleeve. When the compression spring senses pressure, it exerts rebound force on the pressure sensor.

[0066] The sliding rod slides in the sleeve and drives the scale structure data to change;

[0067] The fourth motor drives the sliding column to move in the sleeve housing;

[0068] The third electric push rod is started to drive the pressure relief block to move to a designated position relative to the fourth connecting plate, and the fourth electric push rod is then started to push the clamping tube and the clamping hole for active clamping connection;

[0069] The magnetic connection between the third and fourth electromagnetic blocks is disconnected, and the two sets of pressure relief blocks drive the fourth connecting plate to perform edge warpage detection on the PCB.

[0070] When the warped edge of the PCB contacts the height limit plate, the PCB is driven by the vacuum suction cup for recovery.

[0071] Start the second electric push rod to drive the warpage optical inspection camera to move directly above the PCB circuit board for inspection;

[0072] Start the second electric slide to drive the warpage optical detection camera to move parallely, and then start the second motor to drive the warpage optical detection camera to rotate;

[0073] The first motor is started to drive the rectangular plate to rotate, and then drives the auxiliary ring to rotate. While the auxiliary ring rotates, it drives the warpage optical detection camera to perform rotation detection.

[0074] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fully automatic PCB circuit board warpage detection machine, comprising a material storage component (1), characterized in that: The material storage component (1) comprises a working base plate (101), a support frame (103) is provided just above the working base plate (101), two groups of support frames (102) are symmetrically installed at the top edge of the working base plate (101), the top of each group of support frames (102) is installed on the bottom of the support frame (103), a material storage box (104) is installed on the top of the working base plate (101), a material taking component (2) is installed on the top of the material storage component (1), a detection component (3) is installed on the material taking component (2), two groups of compatible components (4) are symmetrically installed on the material storage component (1), and each group of compatible components (4) is installed on a group of auxiliary components (5); The compatible component (4) includes a plurality of sets of sleeves (408), one end of a set of compression springs (409) is mounted on the inner wall of one side of each set of sleeves (408), a set of sliding rods (410) is mounted on the other end of each set of compression springs (409), a set of pressure sensors (411) are mounted on the junction of each set of sliding rods (410) and compression springs (409), a set of scale structures (412) are mounted on the outer wall of each set of sliding rods (410), and a set of pressure buffer blocks (413) are mounted on one side wall of each set of sliding rods (410); When the PCB circuit board warps, the distance between the relative pressure relief blocks (413) will change; The detection component (3) includes a second electric slide (301), the top of the second electric slide (301) is installed on the bottom of the auxiliary ring (205), the output end of the second electric slide (301) is connected to a second electric push rod (302), the output end of the second electric push rod (302) is installed with a second fixed plate (303), a second motor (304) is installed on a side wall of the second fixed plate (303), the output end of the second motor (304) is connected to a third fixed plate (305), and the bottom of the third fixed plate (305) is installed with a warpage optical detection camera (306); The compatible component (4) further comprises a third motor (401), one end of each group of the third motors (401) is mounted on the inner wall of the support frame (103), the output end of each group of the third motors (401) is connected to a group of fourth fixed plates (402) in a transmission manner, a group of sliding cavities (404) is provided on a side wall of each group of the fourth fixed plates (402), two groups of threaded rods (403) are rotatably connected in each group of the sliding cavities (404), a partition block is connected between the two groups of the threaded rods (403), the thread directions of the two groups of the threaded rods (403) are opposite, and the central axes are located on the same straight line, each group of the threaded rods (403) is threadedly connected to a group of sliding blocks (405), a group of first connecting plates (406) is mounted on a side wall of each group of the sliding blocks (405), and one end of each group of the sleeves (408) is mounted on a side wall of the first connecting plate (406); A group of first electromagnetic blocks (414) is installed on one side wall of each group of the pressure-reducing blocks (413), and a group of clamping holes (415) is opened on one side wall of each group of the pressure-reducing blocks (413); The auxiliary component (5) includes a second connecting plate (501), two sets of sleeve shells (502) are symmetrically installed on both side walls of each set of the second connecting plates (501), a set of sliding columns (503) are movably sleeved in each set of the sleeve shells (502), a set of sleeve rings (504) are installed on one side wall of each set of the sliding columns (503), the inner wall of each set of the sleeve rings (504) is sleeved on the outer wall of one set of the sleeve tubes (408), a set of third connecting plates (505) are installed on the outer wall of each set of the sleeve rings (504), a set of third electric push rods (506) are installed on one side wall of each set of the third connecting plates (505), a set of second electromagnetic blocks (507) are installed on the output end of each set of the third electric push rods (506), and the first electromagnetic block (414) is magnetically connected to the second electromagnetic block (507).

2. The fully automatic PCB warpage detection machine according to claim 1, characterized in that: A group of third electromagnetic blocks (508) are installed on the outer wall of each group of the second connecting plates (501), a group of fourth electromagnetic blocks (509) are magnetically connected to each group of the third electromagnetic blocks (508), a group of fourth connecting plates (510) are installed at one end of each group of the fourth electromagnetic blocks (509), two groups of fourth electric push rods (511) are symmetrically installed on both side walls of each group of the fourth connecting plates (510), a group of card pipes (512) are installed on the output end of each group of the fourth electric push rods (511), and the card pipes (512) are movably connected to the card holes (415), and a group of height limiting plates (513) are installed on the outer wall of each group of the fourth connecting plates (510).

3. The fully automatic PCB warpage detection machine according to claim 1, characterized in that: The material taking component (2) includes a first fixed plate (201), the bottom of the first fixed plate (201) is installed on the top of the support frame (103), a first electric slide (202) is installed on a side wall of the first fixed plate (201), the output end of the first electric slide (202) is connected to a first disc (203), a first motor (204) is installed on the bottom of the first disc (203), the output end of the first motor (204) is connected to a rectangular plate, an auxiliary ring (205) is installed on the outer wall of the rectangular plate, two groups of fixed tubes (206) are symmetrically installed on the bottom of the first disc (203), and a second disc (207) is installed on the bottom of the fixed tube (206).

4. The fully automatic PCB warpage detection machine according to claim 3, characterized in that: A first electric push rod (208) is installed on the bottom of the second disc (207), a vacuum box (209) is installed on the bottom of the first electric push rod (208), a vacuum suction cup (210) is connected to the bottom of the vacuum box (209), and a vacuum pump (211) is installed on the outer wall of the vacuum box (209).

Images