Sensor having package with sensor die
By utilizing a sealed accommodation space defined by a housing with multiple ports and a substrate in the pressure sensor, the positioning and connection of the sensor die is simplified, the manufacturing complexity problem in the prior art is solved, and a more efficient manufacturing process is achieved.
Patent Information
- Application Number
- CN202411205229.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-01
- Filing Date
- 2024-08-30
- Publication Date
- 2025-03-04
AI Technical Summary
During the manufacturing process, existing pressure sensors need to form extensive channels in the housing to position two axially opposite diaphragms, resulting in complex manufacturing.
Using a housing having a body and a plurality of ports, a plurality of diaphragms disposed in the port, and the sensor die is arranged in a sealed accommodation space partially defined by the substrate through a package of the substrate and the sensor die, simplifying the manufacturing process of the sensor.
By simplifying the positioning and connection of the sensor die, the manufacturing complexity of the sensor is reduced and manufacturing efficiency is improved.
Smart Images
Figure CN119555266A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a sensor, and more particularly, to a sensor having a package having a substrate and a sensor die attached to the substrate. Background Art
[0002] A sensor, such as a pressure sensor, typically has a housing and a diaphragm attached to the housing. Oil is disposed in a channel of the housing, and a sensor die is disposed in the oil in the housing. When external pressure is applied to the diaphragm, the diaphragm deflects, transferring the external pressure to the oil surrounding the die, which applies the same external pressure to the die. The die deflects according to the external pressure to generate an electrical signal representing the external pressure.
[0003] This type of pressure sensor typically has two diaphragms to transmit two external pressures to the die, allowing the die to measure the pressure difference between the two external pressures. However, the two diaphragms are typically axially opposed to each other, which requires a large channel to be formed in the housing to transmit the correct pressure to the die. Positioning the diaphragms in an axially opposed arrangement, and positioning the die within the housing, complicates the manufacture of the sensor. Summary of the invention
[0004] A sensor includes a housing having a body and a plurality of ports, a plurality of diaphragms each disposed in one of the ports, and a package having a substrate and a sensor die attached to the substrate. The body has a first face and an opposing second face. The port extends from the first face of the body. The substrate is attached to the second face of the body, and the sensor die is disposed in a sealed receiving space partially defined by the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The present invention will now be described by way of example with reference to the accompanying drawings, in which:
[0006] Figure 1 is a perspective view of a sensor according to an embodiment;
[0007] Figure 2 yes Figure 1 A partially exploded perspective view of a sensor;
[0008] Figure 3 yes Figure 1 A cross-sectional side view of a sensor;
[0009] Figure 4 is a perspective view of a sensor according to another embodiment;
[0010] Figure 5 yes Figure 4 a cross-sectional side view of a sensor; and
[0011] Figure 6is a perspective view of a sensor according to another embodiment. DETAILED DESCRIPTION
[0012] Exemplary embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings, wherein the same reference numerals represent the same elements. However, the present disclosure may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will convey the concepts of the present disclosure to those skilled in the art. In addition, in the following detailed description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may also be implemented without these specific details.
[0013] In all the drawings, for the sake of clarity of the drawings, only one of the multiple identical elements is marked in the drawings, but the detailed description of the elements herein is equally applicable to each of the identically appearing elements in the drawings. Throughout the specification, directional descriptors such as "height direction", "longitudinal direction" and "width direction" are used. These descriptors are only for the clarity of description and for distinguishing between various directions. These directional descriptors do not imply or require any particular orientation of the disclosed elements.
[0014] Figure 1-3 The sensor 10 according to the embodiment is shown in FIG. The sensor 10 includes a housing 100 , a plurality of diaphragms 200 disposed in the housing 100 , and a package 400 attached to the housing 100 .
[0015] The housing 100 includes a main body 110. Figure 1-3 As shown, the body 110 has a first face 112 and a second face 114 opposite to the first face 112 in the height direction H. The body 110 has a plurality of recesses 116 in the second face 114 and a plurality of cavities 118 in the second face 114. In the embodiment shown, the cavities 118 extend further into the second face 114 than the recesses 116 in the height direction H. In the embodiment shown, the body 110 has an approximately rectangular shape; in other embodiments, the body 110 may have different polygonal shapes.
[0016] like Figure 3 As shown, the housing 100 has a plurality of channels 120 extending through the body 110. Each of the channels 120 extends through the body 110 from the first face 112 in the height direction H. The channels 120 include a pair of first channels 122 positioned closer to the center of the body 110 in the longitudinal direction L perpendicular to the height direction H and a pair of second channels 124 positioned closer to the outside of the body 110 in the longitudinal direction L. The first channels 122 terminate on the second face 114 of the body 110, and as shown in FIG. Figure 2 and Figure 3 As shown, each first channel 122 is surrounded by one of the recesses 116 on the second face 114. The second channels 124 terminate at one end in a cavity 118 extending into the second face 114 of the body 110 and communicate with the cavity 118.
[0017] like Figure 1-3 As shown, the housing 100 has a plurality of ports 130 extending from the first face 112 of the body 110. The ports 130 include a first port 132 and a second port 134, which are separated from each other along the longitudinal direction L and define discrete ports 132, 134 protruding from the body 110 in the height direction H. The channels 120 are in communication with the ports 130, and ends of one of the first channels 122 and one of the second channels 124 opposite to the second face 114 lead to each of the ports 132, 134.
[0018] In the illustrated embodiment, the housing 100 is integrally formed as a single piece of metal material. In another embodiment, the housing 100 may be formed of multiple parts and assembled together to form the elements of the housing 100 described above. In other embodiments, the housing 100 may be formed of a conductive material other than metal, or may be formed of a non-conductive material such as ceramic or plastic.
[0019] like Figure 3 As shown, the diaphragm 200 is disposed in the port 130 of the housing 100. Each of the diaphragms 200 is formed of an elastically flexible material. The elastically flexible material of the diaphragm 200 can be a thin metal material, such as stainless steel, or can be other conductive or non-conductive flexible materials capable of transmitting force, as described in more detail below. The diaphragm 200 can be a planar element, or, as in the illustrated embodiment, can have a corrugated cross-sectional shape. The diaphragm 200 includes a first diaphragm 210 disposed in the first port 132 and a second diaphragm 220 disposed in the second port 134. The diaphragms 210, 220 can be attached to the ports 132, 134 by welding or by any other form of attachment. The diaphragms 200 are coplanar with each other in the plane P.
[0020] like Figure 1-3 As shown, the package 400 includes a substrate 410, a sensor die 420 attached to the substrate 410, and a cover 440 attached to the substrate 410. The cover 440 and the substrate 410 define a sealed accommodation space 450 in which the sensor die 420 is disposed. For convenience of explaining the sealed accommodation space 450 of the package 400, the cover 440 is Figure 2 and Figure 3 Although shown as translucent in FIG. 4 , cover 440 is a solid, opaque member.
[0021] exist Figure 1-3 In the illustrated embodiment, the substrate 410 is a hybrid ceramic circuit or a printed circuit board, which includes a plurality of contact pads 412 and a plurality of traces 414 that electrically connect the contact pads 412 to the sensor die 420. In the illustrated embodiment, the contact pads 412 are arranged along the substrate 410 in a width direction W that is perpendicular to the height direction H and the longitudinal direction L. In the illustrated embodiment, as shown in FIG. Figure 3 As shown, the substrate 410 has a plurality of substrate channels 416 extending along a height direction H through the substrate 410 .
[0022] like Figure 2 and Figure 3 As shown, the sensor die 420 is attached to the substrate 410 and is disposed in the sealed accommodation space 450. In the illustrated embodiment, the sensor die 420 is a MEMS pressure sensor and has a membrane 422 that is elastically deflectable according to pressure. In one embodiment, the membrane 422 is deflectable according to the pressure on the opposite side of the membrane 422 and is a differential pressure sensor. In another embodiment, the membrane 422 is deflectable according to the pressure on one side of the membrane 422 and is an absolute pressure sensor. In another embodiment, the sensor die 420 has a pair of membranes 422, one of which is used as a differential pressure sensor and one of which is used as an absolute pressure sensor. The sensor die 420 is attached to the substrate 410 above one of the substrate channels 416.
[0023] exist Figure 2 and Figure 3 In the illustrated embodiment, the sensor package 400 has an integrated circuit 430, such as an application specific integrated circuit (ASIC), attached to the substrate 410 and electrically connected to the sensor die 420 and the contact pads 412 via traces 414. The integrated circuit 430 is positioned with the sensor die 420 in a sealed receiving space 450. The integrated circuit 430 processes the electrical output signal from the sensor die 420 to determine the differential pressure and / or absolute pressure sensed by the sensor die 420.
[0024] Figure 1-3 The cover 440 shown in FIG. 4 is attached to the substrate 410 to create a sealed containment space 450. The cover 440 may be formed of a ceramic material, a metal material, a plastic material, or any combination thereof. The cover 440 may be attached to the substrate 410 by any method that defines and fluid-tightly seals the sealed containment space 450 at the interface between the cover 440 and the substrate 410, such as an adhesive such as epoxy, solder, brazing, or welding. In the position where the cover 440 is attached to the substrate 410 to create the sealed containment space 450, as shown in FIG. Figure 1 and Figure 2 As shown, the contact pad 412 of the substrate 410 is located outside the sealed receiving space 450 .
[0025] To assemble the sensor 10, the package 400 is attached to the housing 100, as shown in FIG. Figure 1-3 The substrate 410 of the package 400 is attached to the second side 114 of the body 110 by an adhesive (e.g., epoxy, solder, brazing, or welding). The material attaching the substrate 410 to the second side 114 can be positioned in the recess 116 of the second side 114. When the substrate 410 is attached to the second side 114, as shown in FIG. Figure 3 As shown, the substrate channels 416 are each aligned with and communicate with one of the first channels 122 along the height direction H. The cover 440 attached to the substrate 410 as described above is disposed on a side of the substrate 410 opposite to the second face 114.
[0026] With the package 400 attached to the housing 100, the sensor 10 is filled with the oil 700. The oil 700 is inserted at the cavity 118 in the second face 114 and fills the second channel 124, fills the ports 132, 134 where the oil 700 is held by the diaphragms 210, 220, and fills the first channel 122 that communicates with the second channel 124 through the ports 132, 134, as shown in FIG. Figure 3 As shown. The oil 700 also flows through the first channel 122 and through the substrate channel 416 into the sealed containment space 450, thereby filling the sealed containment space 450 around the sensor die 420 and the integrated circuit 430. When the oil 700 is positioned in the ports 132, 134, the channels 122, 124, and the sealed containment space 450, a channel seal 800 is disposed in each cavity 118 to close the second channel 124 and contain the oil 700 in the sensor 10. In an embodiment, the channel seal 800 is a glass material that forms a glass-metal bond with the housing 100. In other embodiments, a different incompressible liquid may be used instead of the oil 700.
[0027] During the use of the sensor 10 to measure pressure, the sensor 10 is exposed to, for example, a first pressure R1 and a second pressure R2. Figure 3As shown. A first pressure R1 acts on the first diaphragm 210 in the first port 132. The first diaphragm 210 deflects in proportion to the first pressure R1, and accordingly transfers the first pressure R1 to the oil 700 in the first channel 122 and the substrate channel 416 connected to the first channel 122. The oil 700 in the substrate channel 416 connected to the first port 132 applies the first pressure R1 on the first side of the membrane 422 of the sensor die 420. A second pressure R2 acts on the second diaphragm 220 in the second port 134. The second diaphragm 220 deflects in proportion to the second pressure R2, and accordingly transfers the second pressure R2 to the oil 700 in the first channel 122 connected to the second port 134, and to the sealed accommodation space 450 through one of the substrate channels 416. The oil 700 in the sealed accommodation space 450 applies the second pressure R2 on the second side of the membrane 422 of the sensor die 420.
[0028] In an embodiment, the membrane 422 deflects according to the pressure difference between the first pressure R1 and the second pressure R2. The deflection of the membrane 422 generates an electrical signal representing the pressure difference on the opposite side of the membrane 422. In another embodiment, the membrane 422 may alternatively or additionally deflect according to the first pressure R1 on only one side of the membrane 422, thereby generating an electrical signal representing the absolute pressure. The electrical signal can be output from the sensor 10 to the outside by the integrated circuit 430 connected to the sensor die 420 and through the contact pad 412 on the substrate 410.
[0029] Figure 4 and Figure 5 FIG. 1 shows a sensor 10 according to another embodiment. The same reference numerals denote the same elements, and the same elements will be mainly described in detail. Figure 1-3 The differences between the embodiments shown in .
[0030] exist Figure 4 and Figure 5 In the housing 100 of the embodiment shown, the main body 110 does not have Figure 2 The embodiment of the recess 116 has only a pair of cavities 118 extending into the second face 114, such as Figure 5 shown. Figure 4 and Figure 5 The channels 120 in the embodiment include only first channels 122 extending in the height direction H, each of the first channels 122 connecting between one of the ports 132 , 134 and one of the cavities 118 .
[0031] according to Figure 4 and Figure 5The sensor 10 of the embodiment has a package 500 including a pair of substrates 510, each substrate 510 having a sensor die 520, 530 attached to the substrate 510. The substrates 510 each have a base 512 and a flange 514 extending from the base 512. The substrates 510 each have a plurality of substrate channels 516 extending through the substrate 510 along a height direction H. Figure 4 and Figure 5 In the embodiment of the present invention, each of the substrates 510 is a solid material without circuits, such as a ceramic material, a metal material, a plastic material, or any combination thereof.
[0032] The sensor dies 520, 530 are each attached to a base 512 of one of the substrates 510, such as Figure 5 As shown. Each of the sensor dies 520, 530 in the illustrated embodiment is a MEMS pressure sensor and has a membrane 522, 532 that can be elastically deflected according to pressure. In the illustrated embodiment, the first sensor die 520 has a first membrane 522 that can be deflected according to the pressure on the opposite side of the first membrane 522 and is a differential pressure sensor. In the illustrated embodiment, the second sensor die 530 has a second membrane 532 that can be deflected according to the pressure on one side of the membrane and is an absolute pressure sensor. In other embodiments, the sensor dies 520, 530 can be positioned in a manner opposite to the illustrated embodiment, or both membranes 522, 532 can be on one die 520, 530.
[0033] The package 500 has a plurality of pins 550 extending through the substrate channel 516 of each substrate 510 and electrically connected to the first sensor die 510 or the second sensor die 530. Figure 5 As shown, pins 550 are only positioned in some substrate channels 516 of each substrate 510. Pins 550 are each a conductive material that can transmit electrical signals output by sensor dies 510, 530. Pins 550 are sealed in substrate channels 516 by sealing material 560. In one embodiment, sealing material 560 is a glass material that forms a glass-metal bond with substrate 510. In other embodiments, sealing material 560 can be any other material capable of sealing conductive pins 550 in substrate channels 516.
[0034] like Figure 5As shown, to attach the package 500 to the housing 100, each of the substrates 510 is positioned over one of the cavities 118 on the second face 114 of the body 110, wherein the flange 514 is disposed on the second face 114 and the base 512 extends into the cavity 118. The flange 514 is attached to the second face 114 to fix the substrate 510 to the housing 100 with an adhesive (e.g., epoxy, solder, brazing, or welding). Each of the substrates 510 forms a sealed receiving space 570 with the body 110, and the sealed receiving space 570 is defined in each cavity 118. Each of the sensor dies 520, 530 is positioned in one of the sealed receiving spaces 570.
[0035] The package 500 includes a tube 540, such as Figure 4 and 5 As shown, tube 540 has a pair of opposing ends, each end being located in one of substrate channels 516 of one of substrates 510. Tube 540 is sealed to each of substrates 510 by sealing material 560. Tube 540 fluidly connects a sealed receiving space 570 formed by one of substrates 510 to sensor die 520 on another of substrates 510.
[0036] like Figure 4 and Figure 5 As shown, with the package 500 attached to the housing 100, the sensor 10 is filled with oil 700. The oil 700 is inserted at one of the substrate channels 516 of each substrate 510 that does not have the pin 550 or the tube 540, and fills the sealed accommodation space 570. The oil 700 flows from the sealed accommodation space 570 through the channel 120 of the housing 100 and enters the port 130, where the oil 700 is retained by the diaphragm 200. The oil 700 also fills the tube 540 from one of the sealed accommodation spaces 570. When the oil 700 has been filled, the channel seal 800 is set in one of the substrate channels 516 for inserting the oil 700, and the oil 700 is contained in the sensor 10. In other embodiments, a different incompressible liquid may be used instead of the oil 700.
[0037] In use Figure 4 and Figure 5During the process of measuring pressure by the sensor 10 of the present invention, the first diaphragm 210 deflects in proportion to the first pressure R1, and accordingly transmits the first pressure R1 through one of the channels 120 to a sealed accommodation space in the sealed accommodation space 570 having the first sensor die 520, thereby applying the first pressure R1 on the first side of the first film 522 of the first sensor die 520. The second pressure R2 acts on the second diaphragm 220 in the second port 134, the second diaphragm 220 deflects in proportion to the second pressure R2, and the second pressure R2 is transmitted through one of the channels 120 to a sealed accommodation space in the sealed accommodation space 570 having the second sensor die 530. The second pressure R2 in the sealed accommodation space 570 acts on one side of the second film 532 of the second sensor die 530. The second pressure R2 is also transmitted through the tube 540 and acts on the second side of the first film 522 of the first sensor die 520.
[0038] exist Figure 4 and Figure 5 In the embodiment of the present invention, the first film 522 is deflected according to the pressure difference between the first pressure R1 and the second pressure R2. The deflection of the first film 522 generates an electrical signal, which represents the pressure difference in the sealed accommodation space 570 acting on the opposite sides of the first film 522. The second film 532 is deflected according to the second pressure R2 on one side of the second film 532, thereby generating an electrical signal representing the absolute pressure in one of the sealed accommodation spaces 570. The electrical signals of the two second tube cores 520 and 530 are output from the sensor 10 to the outside through the transmission along the pin 550.
[0039] Figure 6 FIG. 1 shows a sensor 10 according to another embodiment. The same reference numerals denote the same elements, and the same elements will be mainly described in detail. Figure 1-3 For the sake of clarity of the drawings, Figure 1-3 The package 400 of the embodiment of Figure 6 Schematically shown in FIG. 1 , but with the same Figure 1-3 Same structural details and locations as described.
[0040] according to Figure 6 The sensor 10 of the embodiment has a third port 136 in the housing 100 and a third diaphragm 230 disposed in the third port 136, similar to the above. The third port 236 has another set of channels 120, including the first channel 122 and the second channel 124 described above, which are connected to the third port 136 and communicate with the second face 114 of the body 110.
[0041] like Figure 6As shown, the sensor 10 has another package 600 disposed on the second face 114 above the first channel 122 connected to the third port 136. The package 600 has a substrate 610, a sensor die 620 disposed on the substrate 610, and a plurality of sidewalls 630 extending from the substrate 610 around the sensor die 620. The substrate 610 and the sidewalls 630 define a sealed receiving space 632, which is filled with a gel 634 surrounding the sensor die 620.
[0042] In use Figure 6 During the sensor 10 of the package 400, the sensor die 420 senses the differential pressure and / or absolute pressure of the pressures R1 and R2 as described above. As described above, the third pressure R3 acting on the third diaphragm 230 is transmitted to the sensor die 620 through the oil, through the first channel 122 and the substrate channel 612 of the substrate 610. The third pressure R3 deflects one side of the diaphragm 622 of the sensor die 620, and the sensor die 620 can measure the absolute pressure of the third pressure R3.
[0043] according to Figure 6 The sensor 10 of the embodiment of can also have a temperature probe 900 positioned in the housing 100 and extending from the housing 100. The temperature probe 900 (such as a thermocouple) can measure the temperature near the sensor 10, and the temperature measurement can be used to improve the accuracy of the pressure signal output by the sensor 10.
[0044] In accordance with Figure 1-6 In the sensor 10 of the embodiment shown in FIG. 1 , the use of a package 400, 500, 600 containing a sensor die 420, 520, 530, 620 on a substrate 410, 510, 610 and the attachment of the package 400, 500, 600 to a housing 100 simplifies the manufacture of the sensor 10 by simplifying the positioning of the sensor die 420, 520, 530, 620 and the connection to the oil 700. In addition, positioning the integrated circuit 430 in the oil 700 close to the sensor die 420 improves signal processing.
Claims
1. A sensor (10), comprising: A housing (100) having a body (110) and a plurality of ports (130), wherein the body (110) has a first face (112) and an opposite second face (114), and the ports (130) extend from the first face (112) of the body (110); a plurality of diaphragms (200), each diaphragm disposed in one of the ports (130); as well as A package (400, 500, 600) comprising a substrate (410, 510, 610) and a sensor die (420, 520, 530, 620) attached to the substrate (410, 510, 610), wherein the substrate (410, 510, 610) is attached to the second surface (114) of the body (110), and the sensor die (420, 520, 530, 620) is disposed in a sealed accommodation space (450, 570, 632) partially defined by the substrate (410, 510, 610).
2. The sensor (10) according to claim 1, wherein: The diaphragms (200) are coplanar with each other.
3. The sensor (10) according to claim 1, wherein: The package (400) has a cover (440) which is attached to the substrate (410) on a side of the substrate (410) opposite to the second surface (114) of the body (110), and the cover (440) and the substrate (410) define the sealed accommodation space (450).
4. The sensor (10) according to claim 3, wherein: The body (110) has a plurality of channels (120) extending through the body (110), the channels (120) being in communication with the port (130), and the substrate (410) has a plurality of substrate channels (416) extending through the substrate (410), the channels (120) of the body (110) including a plurality of first channels (122) in communication with the substrate channels (416).
5. The sensor (10) according to claim 4, wherein: The sensor die (420) is positioned over one of the substrate channels (416), the sensor die (420) having a deflectable membrane (422).
6. The sensor (10) according to claim 4, wherein: The body (110) has a plurality of cavities (118) extending into the second surface (114), the channel (120) of the body (110) includes a plurality of second channels (124) communicating with the cavities (118), and the sensor further includes a channel seal (800) disposed in each of the cavities (118) and closing the second channels (124).
7. The sensor (10) according to claim 4, wherein: The package (400) has an integrated circuit (430) which is disposed in the sealed accommodation space (450) and connected to the sensor die (420).
8. The sensor (10) according to claim 1, wherein: Oil (700) is contained in the port (130) and in the sealed containing space (450, 570, 632).
9. The sensor (10) according to claim 1, wherein: The body (110) has a cavity (118) extending into the second face (114), the substrate (510) is attached to the second face (114) above the cavity (118), and the sealed accommodation space (570) is defined by the substrate (510) and the body (110).
10. The sensor (10) according to claim 9, wherein: The base plate (510) has a base (512) and a flange (514) extending from the base (512), the flange (514) being attached to the second face (114) of the body (110), and the base (512) extending into the cavity (118).
11. The sensor (10) according to claim 9, wherein: The body (110) has a channel (120) extending through the body (110) and connecting one of the ports (130) with the sealed accommodation space (570).
12. The sensor (10) according to claim 9, wherein: The package (500) has a plurality of pins (550) extending through the substrate (510) and electrically connected to the sensor dies (520, 530).
13. The sensor (10) according to claim 9, wherein: The cavity (118) is one of a plurality of cavities (118) extending into the second surface (114), and the substrate (510) is one of a plurality of substrates (510) of the package (500), each of the substrates (510) being attached to the second surface (114) above one of the cavities (118) to define a plurality of sealed receiving spaces (570), and also including a tube (540) extending between the substrates (510).
14. The sensor (10) according to claim 13, wherein: The package (500) has a pair of sensor dies (520, 530), each sensor die is attached to one of the substrates (510), a first sensor die (530) of the sensor dies (520, 530) measures the absolute pressure in one of the sealed containing spaces (570), and a second sensor die (520) of the sensor dies (520, 530) measures the pressure difference between the sealed containing spaces (570).
15. The sensor according to claim 1, wherein: The package (600) has a plurality of side walls (630) extending from the substrate (610) to define the sealed receiving space (632), and a gel (634) disposed in the sealed receiving space (632) around the sensor die (620).