A transfer type low temperature plasma material processing apparatus

Abstract

This invention provides a transfer-type low-temperature plasma material processing device, comprising a plasma generator, a material fixing and conveying device, an atmosphere supply device, and a water cooling device. The plasma generator includes a first high-voltage electrode tube and a second high-voltage electrode tube spaced apart, with two sets of high-voltage power supplies providing bipolar high-voltage electricity to the two high-voltage electrode tubes. The material fixing and conveying device and the plasma generator are movable relative to each other. When the electrode plates move away from the plasma generator, low-temperature plasma is generated between the bipolar electrode components. When the electrode plates and the plasma generator are vertically distributed, the low-temperature plasma is transferred from between the bipolar electrode components to the surface of the material to be processed for surface treatment. The water cooling device is used to cool the electrode tubes, and the atmosphere supply device is used to provide an atmosphere to generate directional free radicals. This device has a simple structure, uniform plasma generation and transfer, does not require frequent power switching during processing, has a low processing temperature, and is highly practical.

Description

Technical fields:

[0001] This invention belongs to the field of low-temperature plasma material processing technology, and specifically relates to a transfer-type low-temperature plasma material processing device. Background technology:

[0002] Touchscreens, as an important interactive input device, have been widely used in various fields. Flexible touchscreens, compared to traditional rigid touchscreens, offer greater flexibility, better drop resistance, lower power consumption, and a wider viewing angle, making them promising for use in smartphones, tablets, wearable devices, and various other emerging devices. In the lamination process of flexible touchscreens, PET material is used as an intermediate or protective layer, providing a certain level of transparency and rigidity without affecting the touchscreen's display performance. Furthermore, PET material can be combined with other materials to improve the overall performance and user experience of the touchscreen.

[0003] In the production process of touchscreens, optical adhesives are used to bond the various layers of materials together to form a whole. PET material undergoes a series of processing and bonding processes to ensure a tight bond with other components of the touchscreen (such as the glass substrate and conductive layers). During this process, the PET material needs surface treatment to improve its adhesion properties. PET material has a relatively low initial surface energy; currently, low-temperature plasma methods are commonly used to modify the material's surface, increasing its surface energy and enhancing its bonding strength.

[0004] Currently used PET materials are not pure PET. To meet the performance requirements of various touchscreens, more and more functional composite PET materials are emerging, with lower surface energy and greater processing difficulty. The initial surface energy of conventional PET materials is about 40-44 dynes / cm, while that of composite PET materials is as low as 34 dynes / cm. To meet more stringent requirements for weather resistance, density, and uniformity, the requirements after processing are even higher, typically requiring a surface energy ≥50 dynes / cm to meet lamination requirements. Furthermore, more and more processes now include testing requirements for water droplet contact angles, requiring that the water droplet contact angle of each specification must be <45°. In some lamination processes, PET film cannot be processed in roll form; it must be cut into individual sheets using a rotary cutter. Since sheets have no tensile strength, they are easily warped during processing due to temperature variations. In addition, the process usually involves double or multiple layers of material, each with different thermal shrinkage properties, making them even more sensitive to temperature. Furthermore, constrained by the on-site production line, the PET sheet base plate must be a metal plate with fine pores for sheet adsorption and feeding. It also needs to accommodate the fixed base plate of large panels. Since the size of the material to be processed differs from the size of the base plate, it is impossible to achieve the ideal dual-dielectric barrier uniform discharge structure when using plasma treatment. The uniformity and density of the processed material are significantly affected. On the one hand, the low-voltage base plate cannot always be present in the low-voltage discharge area, and the high and low-voltage discharge structure is intermittent during material transfer, requiring constant switching. The high power consumption at startup significantly shortens the power supply life and affects the stability of the initial and final stages of treatment. On the other hand, when the area of ​​processed material varies, areas with material resemble a dual-dielectric barrier discharge mode, exhibiting a fine filament discharge that is relatively uniform. Areas without material exhibit a single-dielectric barrier discharge mode, a streamer discharge with thicker discharge filaments, resulting in inconsistent discharge uniformity and poor parameter control. Conventional roll and sheet DBD plasma modification equipment cannot meet the current stringent process requirements.

[0005] To address the above issues, it is necessary to develop a high-efficiency low-temperature plasma sheet processing device that offers better processing uniformity, eliminates the need for frequent power switching during processing, operates at a low processing temperature, and is less affected by single or dual dielectrics. Summary of the Invention:

[0006] The purpose of this invention is to provide a transfer-type low-temperature plasma material processing device.

[0007] The present invention adopts the following technical solution:

[0008] This invention provides a transfer-type low-temperature plasma material processing device, comprising a plasma generating device and a material fixing and conveying device. The plasma generating device is connected to a bipolar high-voltage power supply system and includes a bipolar electrode assembly. The bipolar electrode assembly includes a first high-voltage electrode tube and a second high-voltage electrode tube spaced apart. The first power supply and the second power supply of the bipolar high-voltage power supply system are respectively connected to the first high-voltage electrode tube and the second high-voltage electrode tube to provide bipolar high-voltage electricity to the bipolar electrode assembly. The material fixing and conveying device is movable relative to the plasma generating device. The material fixing and conveying device includes an electrode plate, and the material to be processed is loaded on the side of the electrode plate facing the plasma generating device. When the electrode plate moves away from the plasma generating device, low-temperature plasma is generated between the first high-voltage electrode tube and the second high-voltage electrode tube. When the electrode plate and the plasma generating device are vertically distributed, the low-temperature plasma is transferred from between the bipolar electrode assemblies to the surface of the material to be processed, becoming plasma for material surface treatment.

[0009] Furthermore, an atmosphere supply device is also provided; the atmosphere supply device includes a gas supply device and several sets of gas delivery pipes; the gas inlet end of the gas delivery pipe is connected to the gas supply device, the gas outlet end corresponds to the position of the plasma generator, and the gas outlet of the gas delivery pipe flows between the bipolar electrode assembly and the material fixing and conveying device.

[0010] Furthermore, a flow equalization plate is also provided; the flow equalization plate is distributed between the gas transmission pipeline and the bipolar electrode assembly, and the flow equalization plate is provided with a number of evenly distributed flow equalization holes.

[0011] Furthermore, the gas supply device includes a gas generator / cylinder, a pressure gauge, a flow meter, a solenoid valve, a gas pipe, and a gas pipe connector; the gas generator / cylinder is connected to the gas transmission pipeline through the gas pipe and gas pipe connector; the pressure gauge, flow meter, and solenoid valve are installed on the gas generator / cylinder.

[0012] Furthermore, a water cooling device is also provided, which includes a water supply device, a water delivery pipe, and a circulating water tank; in the bipolar electrode assembly, the first high-voltage electrode tube and the second high-voltage electrode tube are installed in opposite directions, and water pipe joints are respectively provided at both ends of the first high-voltage electrode tube and the second high-voltage electrode tube, and each group of first high-voltage electrode tubes and second high-voltage electrode tubes are connected in series end to end through the water delivery pipe; the water supply device is connected to the high-voltage end of the first electrode tube, the circulating water tank is connected to the low-voltage end of the last electrode tube, and the circulating water tank is connected to the water supply device.

[0013] Furthermore, the water supply device includes a water pump and a deionized water machine; the water pump is connected to the circulating water tank, the water pump outlet is connected to the deionized water machine, and the pure water outlet of the deionized water machine is connected to the water pipe connector of the electrode tube; the circulating water tank is equipped with water level monitoring equipment and temperature monitoring equipment, and is automatically replenished and drained by the tap water pipe.

[0014] Furthermore, a cover and an insulating frame are also provided; the insulating frame is fixedly installed inside the cover and includes a top plate and two side support plates; the bipolar electrode assembly is fixed between the two sets of support plates; the flow equalizer is fixedly installed between the two sets of support plates and is distributed between the gas pipeline and the bipolar electrode assembly.

[0015] Furthermore, a partition is fixedly installed between the two sets of support plates, with both ends of the partition being fixedly connected to the two sets of support plates respectively, and the partition is distributed above the flow equalization plate; the partition is provided with through holes corresponding to the number and position of the gas transmission pipes, and the gas transmission pipes pass through the corresponding through holes and extend to the flow equalization plate.

[0016] Furthermore, two sets of power supply mounting plates are fixedly installed on the side wall of the housing, respectively fixing the first power supply and the second power supply; the first power supply is connected to the high-voltage end of the first high-voltage electrode tube through an energized copper sheet, and the second power supply is connected to the high-voltage end of the second high-voltage electrode tube through an energized copper sheet.

[0017] Furthermore, the first and second high-voltage electrode tubes have the same structure, both including: a ceramic tube, a metal electrode, two sets of inner aluminum-lined tubes, two sets of sealing gaskets, two sets of clamping sleeves, and two sets of sealing plugs; the metal electrode is disposed inside the ceramic tube, and the two sets of inner aluminum-lined tubes are symmetrically fixed on both sides of the metal electrode; the sealing gaskets and clamping sleeves are disposed between the inner aluminum-lined tubes and the ceramic tube, with the clamping sleeves distributed on the outside of the sealing gaskets; the two sets of sealing plugs are respectively inserted into both ends of the first / second high-voltage electrode tube and clamped and fixed with the clamping sleeves; the end of the inner aluminum-lined tube away from the metal electrode passes through the sealing plug and is fixedly connected to the water pipe joint; the high-voltage end of the first / second high-voltage electrode tube is provided with a high-voltage connector.

[0018] The beneficial effects of this invention are:

[0019] (1) In this invention, the sheet conveying device and the plasma generating device can move relative to each other. The plasma generating device can be moved to different material-to-be-treated fixed conveying devices as needed to process and modify the material-to-be-treated attached to the electrode plate. It is easy to operate and highly practical.

[0020] (2) In this invention, the plasma generator is a bipolar electrode assembly. When the material fixing and conveying device is away from the plasma generator, discharge occurs between the first high-voltage electrode tube and the second high-voltage electrode tube. When the material fixing and conveying device and the plasma generator are distributed vertically, low-temperature plasma is transferred from between the bipolar electrode assemblies to the surface of the material to be treated, becoming plasma for material surface treatment, thus performing plasma treatment on the product surface. After the electrode plate is removed, the low-temperature plasma is transferred back between the first high-voltage electrode tube and the second high-voltage electrode tube. This bipolar electrode discharge structure has advantages such as low single-polar high voltage, high bipolar high voltage, stable discharge, and good treatment effect, and does not require frequent switching on and off.

[0021] (3) The present invention is equipped with a water cooling device, which can dissipate heat from the high voltage electrode tube and avoid the deformation of the processed material due to excessive temperature.

[0022] (4) The present invention provides a cover and an insulating frame to support the plasma generator, atmosphere supply device and water cooling device. The structure is compact and easy to move. Attached image description:

[0023] Figure 1 This is a cross-sectional view of an embodiment of the present invention;

[0024] Figure 2 This is an internal distribution diagram of an embodiment of the present invention;

[0025] Figure 3 This is a cross-sectional view of the high-voltage electrode tube according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the plasma generator installation according to an embodiment of the present invention;

[0027] Figure 5 This is a bottom view of an embodiment of the present invention;

[0028] Figure 6 This is a comparison diagram of the water droplet contact angle of the material before and after treatment;

[0029] Figure 7 This is a schematic diagram of the plasma when the material fixing and conveying device carrying the material to be processed has not reached below the bipolar electrode according to the present invention.

[0030] Figure 8 This is a schematic diagram of the plasma when the material fixing and conveying device carrying the material to be processed reaches below the bipolar electrode.

[0031] Figure 9 This is a schematic diagram of the plasma when the material fixing and conveying device carrying the material to be processed of the present invention has completely reached below the bipolar electrode;

[0032] Figure 10This is a schematic diagram of the plasma as the material fixing and conveying device carrying the material to be processed gradually moves away from below the bipolar electrode according to the present invention.

[0033] The labels in the attached diagram are:

[0034] 1. First high-voltage electrode tube; 2. Second high-voltage electrode tube; 3. First power supply; 4. Second power supply; 5. Gas transmission pipeline; 6. Flow equalization plate; 7. Cover; 8. Insulating frame; 9. Support plate; 10. Partition plate; 11. Ceramic tube; 12. Metal electrode; 13. Aluminum-lined tube; 14. Sealing gasket; 15. Compression sleeve; 16. Sealing plug; 17. Water pipe joint; 18. High-pressure joint; 19. Material fixing and conveying device; 20. Material to be processed. Detailed implementation method:

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0036] Example 1

[0037] Reference Figures 1-5 This embodiment provides a transfer-type low-temperature plasma material processing device, including a plasma generator and a material fixing and conveying device.

[0038] The plasma generator is connected to a bipolar high-voltage power supply system and includes a bipolar electrode assembly. The bipolar electrode assembly comprises six sets of electrode tubes, including three sets of first high-voltage electrode tubes 1 and three sets of second high-voltage electrode tubes 2 (equidistantly distributed, with a spacing of 1–3 mm). The first power supply 3 and the second power supply 4 of the bipolar high-voltage power supply system are respectively connected to the high-voltage connectors of the first high-voltage electrode tubes 1 and the second high-voltage electrode tubes 2, providing bipolar high-voltage electricity to the bipolar electrode assembly. The first power supply 3 and the second power supply 4 are a positive high-voltage power supply and a negative high-voltage power supply, respectively.

[0039] The material fixing and conveying device is a mechanism that provides movement for the material to be processed. It can move relative to the plasma generator. The material fixing and conveying device includes an electrode plate, and the material to be processed is loaded on the side of the electrode plate facing the plasma generator.

[0040] When the electrode plate is moved away from the plasma generator, discharge occurs between the first high-voltage electrode tube 1 and the second high-voltage electrode tube 2. When the electrode plate is positioned vertically relative to the plasma generator, low-temperature plasma transfers from between the bipolar electrode assemblies to the surface of the material to be treated, becoming plasma for surface treatment of the product. After the electrode plate is removed, the low-temperature plasma transfers back between the first high-voltage electrode tube 1 and the second high-voltage electrode tube 2. This bipolar electrode discharge structure has advantages such as low unipolar high voltage, high bipolar high voltage, stable discharge, and good treatment effect.

[0041] In this embodiment, the material fixing and conveying device can reliably and repeatedly move the material to be processed at a certain speed to the vicinity of the bipolar high-voltage electrode tube of the plasma generator and then move away, thereby achieving surface treatment of the product. Generally, a linear track or conveyor belt can be used as the material fixing and conveying device.

[0042] The principle of this device:

[0043] Figures 7-10 This indicates the relative movement process between the plasma generator and the material fixing and conveying device, with the arrow indicating the direction of movement of the material fixing and conveying device.

[0044] like Figure 7 As shown, when the material-fixing and conveying device (equivalent to 0 potential) carrying the material to be processed does not reach below the bipolar electrodes, plasma is generated only in parallel pairs between the bipolar electrodes. In the figure, V1 and V2 are excitation electric fields with opposite phases, and at this moment the bipolar electrode impedance is equivalent to Z1.

[0045] like Figure 8 As shown, when the material fixing and conveying device (equivalent to 0 potential) carrying the material to be processed gradually moves to the area below the bipolar electrode, the plasma gradually transfers from between the bipolar electrodes to the material, thereby achieving the purpose of processing the material.

[0046] like Figure 9 As shown, when the material fixing and conveying device (equivalent to 0 potential) carrying the material to be processed reaches completely below the bipolar electrode, plasma is generated only between the bipolar electrode and the electrode plate of the material fixing and conveying device, allowing for surface treatment of the material. In the figure, V1 and V2 are excitation electric fields with opposite phases. At this moment, the bipolar electrode impedance is equivalent to Z2. When |V1|=|V2|, Z2=Z1 / n, where n is the number of electrodes.

[0047] like Figure 10 As shown, when the material fixing and conveying device (equivalent to 0 potential) carrying the material to be processed gradually leaves the area below the bipolar electrode, the plasma gradually transfers from between the bipolar electrode and the electrode plate of the material fixing and conveying device back to between the bipolar electrodes.

[0048] Example 2

[0049] The main structure of this embodiment is the same as that of embodiment 1, except that an atmosphere supply device is also provided in this embodiment.

[0050] Specifically, refer to Figures 1-2 The atmosphere supply device includes a gas supply device and nine gas pipelines 5 with the same flow rate, which are evenly distributed. The inlet end of each gas pipeline 5 is connected to the gas supply device, and the outlet end corresponds to the position of the plasma generator. The gas outlet of the gas pipeline 5 flows between the bipolar electrode assembly and the material fixing and conveying device.

[0051] In this embodiment, a flow equalization plate 6 is also provided. The flow equalization plate 6 is distributed between the gas supply pipe 5 and the bipolar electrode assembly, and the flow equalization plate 6 is provided with a plurality of evenly distributed flow equalization holes. After the gas in the gas supply pipe 5 passes through the flow equalization plate 6 with densely distributed small holes, the input atmosphere becomes uniform and stable, thereby evenly distributing the external input atmosphere on the plane of the high-voltage motor tube and stably ejecting it.

[0052] In this embodiment, the gas supply device includes a nitrogen generator / nitrogen cylinder, a pressure gauge, a flow meter, a solenoid valve, a gas pipe, and a gas pipe connector. The gas generator / cylinder is connected to the gas supply pipeline 5 via the gas pipe and gas pipe connector. The pressure gauge, flow meter, and solenoid valve are installed on the gas generator / cylinder. The gas source is connected to the gas supply pipeline 5 after passing through the pressure gauge, flow meter, and solenoid valve, and finally flows between the bipolar electrode assembly and the material fixing and conveying device. The gas pressure is maintained at 0.5–1.2 MPa, and the flow rate is determined according to the actual electrode size. Assuming a width of 600 mm, the flow rate needs to be 300–600 L / min.

[0053] Example 3

[0054] The main structure of this embodiment is the same as that of embodiment 2, except that a water cooling device is also provided in this embodiment.

[0055] Specifically, refer to Figures 1-2 The water cooling device includes a water supply device, a water delivery pipe, and a circulating water tank. In the bipolar electrode assembly, the first high-voltage electrode tube 1 and the second high-voltage electrode tube 2 are installed in opposite directions. Water pipe joints are respectively provided at both ends of the first high-voltage electrode tube 1 and the second high-voltage electrode tube 2. Each set of first high-voltage electrode tubes 1 and second high-voltage electrode tubes 2 are connected in series through the water delivery pipe to form a series cooling water circuit. The water supply device is connected to the high-pressure end inlet of the first electrode tube, and the circulating water tank is connected to the low-pressure end outlet of the last electrode tube. The circulating water tank is connected to the water supply device.

[0056] In this embodiment, the water supply device includes a water pump and a deionized water machine. The water pump is connected to a circulating water tank, and its outlet is connected to the deionized water machine. The pure water outlet of the deionized water machine is connected to the inlet of the internal cooling pipe of the high-voltage electrode tube via a water pipe connector. The circulating water tank is equipped with water level monitoring equipment and temperature monitoring equipment, and is automatically replenished and drained by the tap water pipe. The system water temperature is controlled at <= 55℃, and the tank size and deionized water machine specifications can be calculated based on electrode size, power, and other indicators.

[0057] Example 4

[0058] The main structure of this embodiment is the same as that of embodiment 3, except that: this embodiment also includes a cover 7 and an insulating frame 8.

[0059] Specifically, refer to Figures 1-2 and Figure 4 The insulating frame 8 is fixedly installed inside the housing 7, including a top plate and two side support plates 9; the bipolar electrode assembly is fixed between the two sets of support plates 9; the flow equalizing plate 6 is fixedly installed between the two sets of support plates 9, and the flow equalizing plate 6 is distributed between the gas pipeline 5 and the bipolar electrode assembly.

[0060] In this embodiment, a partition 10 is fixedly provided between the two sets of support plates 9. The two ends of the partition 10 are fixedly connected to the two sets of support plates 9 respectively, and the partition 10 is distributed above the flow equalization plate 6. The partition 10 is provided with through holes corresponding to the number and position of the gas transmission pipes 5. The gas transmission pipes 5 pass through the corresponding through holes and extend to the flow equalization plate 6.

[0061] In this embodiment, two sets of power supply mounting plates are fixedly installed on the side wall of the cover 7, respectively fixing the first power supply 3 and the second power supply 4. The first power supply 3 is connected to the high-voltage end of the first high-voltage electrode tube 1 through a energized copper sheet, and the second power supply 4 is connected to the high-voltage end of the second high-voltage electrode tube 2 through a energized copper sheet.

[0062] Example 5

[0063] The main structure of this embodiment is the same as that of embodiment 4, except that the structure of the first high-voltage electrode tube 1 and the second high-voltage electrode tube 2 is defined in this embodiment.

[0064] Specifically, refer to Figure 3 The first high-voltage electrode tube 1 and the second high-voltage electrode tube 2 have the same structure, both including: ceramic tube 11 (outer diameter 25mm), metal electrode 12 (stainless steel spring), two sets of inner aluminum lined tubes 13, two sets of sealing gaskets 14, two sets of clamping sleeves 15 and two sets of sealing plugs 16.

[0065] The metal electrode 12 is disposed inside the ceramic tube 11, and two sets of inner aluminum tubes 13 are symmetrically fixed on both sides of the metal electrode 12. The sealing gasket 14 and the clamping sleeve 15 are disposed between the inner aluminum tube 13 and the ceramic tube 11, with the clamping sleeve 15 distributed outside the sealing gasket 14. The two sets of sealing plugs 16 are respectively inserted into the two ends of the first high-voltage electrode tube 1 / second high-voltage electrode tube 2 and clamped and fixed with the clamping sleeve 15. The end of the inner aluminum tube 13 away from the metal electrode 12 passes through the sealing plug 16 and is fixedly connected to the water pipe connector 17. A high-voltage connector 18 is provided at the high-voltage end sealing plug 16 of the first high-voltage electrode tube 1 / second high-voltage electrode tube 2. Therefore, the entire high-voltage electrode tube can, on the one hand, connect high voltage at the high-voltage end to provide high voltage electricity to the metal electrode inside the ceramic tube; on the other hand, water pipes can be connected to the sealing plugs at both ends to form a water circuit for cooling water to enter and exit.

[0066] The length of the high-voltage electrode tube is determined by the width of the product to be processed, and the length of its metal electrode needs to be about 20mm longer than the width of the product to be processed. When several high-voltage electrode tubes are arranged side by side with equal spacing and opposite directions, the inlet and outlet of each electrode are connected end to end with a flexible hose to form a cooling water channel connected in series by the high-voltage electrodes.

[0067] The application program for this device is:

[0068] The water-cooling device is activated in advance to provide cooling water to the high-voltage electrode tubes. Then, a discharge atmosphere is introduced into the plasma reactor. The gas flow is evenly ejected from the gaps between the parallel high-voltage electrode tubes, forming a discharge atmosphere. At this time, the bipolar high-voltage power supply system inputs bipolar high-voltage energy into the plasma reactor. A stable plasma discharge phenomenon is generated between the parallel high-voltage electrode tubes of different poles in the bipolar electrode assembly. Simultaneously, the input atmosphere forms directional free radicals.

[0069] When the material fixing and conveying device moves the material to be processed to the vicinity of the high-voltage electrode tube, the plasma between the high-voltage electrode tubes is transferred to the surface of the material to be processed, thereby performing process gas plasma treatment on the surface of the material to be processed.

[0070] After the material fixing and conveying device removes the material to be processed, the plasma is transferred back between the high-voltage electrode tubes.

[0071] In automatic mode, repeat the above steps in sequence. If there is any abnormal water flow, air pressure or airflow, an alarm will be triggered. The one-button shutdown will first turn off the power, then cut off the gas, and finally cut off the water.

[0072] After testing, this device was found to be effective for processing PET functional films. The power supply voltage was 380V, the operating current was controlled at ≤5.0A, the processing speed was required to be 2-5m / min, and the processing temperature was <45℃. Distilled water was used to detect the water droplet contact angle. Figure 6 As shown, the water droplet contact angle of the treated PET functional film is less than 45°, which meets the treatment requirements of PET functional film.

[0073] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should be considered within the scope of protection of the present invention.

Claims

1. A transfer-type low-temperature plasma material processing device, characterized in that, Includes plasma generators and material fixing and conveying devices; The plasma generator is connected to a bipolar high-voltage power supply system and includes a bipolar electrode assembly. The bipolar electrode assembly includes a first high-voltage electrode tube (1) and a second high-voltage electrode tube (2) spaced apart. The first power supply (3) and the second power supply (4) of the bipolar high-voltage power supply system are respectively connected to the first high-voltage electrode tube (1) and the second high-voltage electrode tube (2) to provide bipolar high-voltage power to the bipolar electrode assembly. The material fixing and conveying device and the plasma generating device are movable relative to each other. The material fixing and conveying device includes an electrode plate, and the material to be processed is loaded on the side of the electrode plate facing the plasma generating device. When the electrode plate is far away from the plasma generator, low-temperature plasma is generated between the first high-voltage electrode tube (1) and the second high-voltage electrode tube (2). When the electrode plate and the plasma generator are distributed vertically, the low-temperature plasma is transferred from between the bipolar electrode components to the surface of the material to be treated, and becomes plasma for material surface treatment. The first high-voltage electrode tube (1) and the second high-voltage electrode tube (2) have the same structure, both including: a ceramic tube (11), a metal electrode (12), two sets of inner aluminum-lined tubes (13), two sets of sealing gaskets (14), two sets of clamping sleeves (15), and two sets of sealing plugs (16); the metal electrode (12) is disposed inside the ceramic tube (11), and the two sets of inner aluminum-lined tubes (13) are symmetrically fixed on both sides of the metal electrode (12); the sealing gaskets (14) and clamping sleeves (15) are disposed between the inner aluminum-lined tubes (13) and the ceramic tube (11). Between the ceramic tubes (11), and the clamping sleeves (15) are distributed on the outside of the sealing gaskets (14); the two sets of sealing plugs (16) are respectively inserted into the two ends of the first high-voltage electrode tube (1) / second high-voltage electrode tube (2) and clamped and fixed with the clamping sleeves (15); the end of the inner aluminum tube (13) away from the metal electrode (12) passes through the sealing plugs (16) and is fixedly connected to the water pipe joint (17); the high-voltage end of the first high-voltage electrode tube (1) / second high-voltage electrode tube (2) is provided with a high-voltage connector (18).

2. The transfer-type low-temperature plasma material processing device according to claim 1, characterized in that, It is also equipped with an atmosphere supply system; The atmosphere supply device includes a gas supply device and several sets of gas transmission pipelines (5); The gas inlet of the gas pipeline (5) is connected to the gas supply device, and the outlet corresponds to the position of the plasma generator. The gas outlet of the gas pipeline (5) flows between the bipolar electrode assembly and the material fixing and conveying device.

3. The transfer-type low-temperature plasma material processing device according to claim 2, characterized in that, It is also equipped with a flow equalization plate (6); The flow equalization plate (6) is distributed between the gas transmission pipe (5) and the bipolar electrode assembly, and the flow equalization plate (6) is provided with a number of evenly distributed flow equalization holes.

4. The transfer-type low-temperature plasma material processing device according to claim 2, characterized in that, The gas supply device includes a gas generator / cylinder, pressure gauge, flow meter, solenoid valve, gas pipe and gas pipe connector; The gas generator / cylinder is connected to the gas pipeline (5) via a gas pipe and a gas pipe connector; The pressure gauge, flow meter, and solenoid valve are installed on the gas generator / gas cylinder.

5. The transfer-type low-temperature plasma material processing device according to claim 1, characterized in that, It is also equipped with a water cooling device, which includes a water supply device, a water delivery pipe and a circulating water tank; In the bipolar electrode assembly, the first high-voltage electrode tube (1) and the second high-voltage electrode tube (2) are installed in opposite directions. Water pipe joints are provided at both ends of the first high-voltage electrode tube (1) and the second high-voltage electrode tube (2). Each set of first high-voltage electrode tubes (1) and second high-voltage electrode tubes (2) are connected in series through water pipes. The water supply device is connected to the high-pressure end of the first electrode tube, the circulating water tank is connected to the low-pressure end of the last electrode tube, and the circulating water tank is connected to the water supply device.

6. The transfer-type low-temperature plasma material processing device according to claim 5, characterized in that, The water supply device includes a water pump and a deionized water machine; The water pump is connected to the circulating water tank, the water pump outlet is connected to the deionized water machine, and the pure water outlet of the deionized water machine is connected to the water pipe connector of the electrode tube. The circulating water tank is equipped with water level monitoring equipment and temperature monitoring equipment, and is automatically replenished and drained by tap water pipes.

7. The transfer-type low-temperature plasma material processing device according to claim 3, characterized in that, It is also equipped with a cover (7) and an insulating frame (8); The insulating frame (8) is fixedly installed inside the housing (7), including a top plate and two side support plates (9); the bipolar electrode assembly is fixed between the two sets of support plates (9); The flow equalization plate (6) is fixedly installed between the two sets of support plates (9), and the flow equalization plate (6) is distributed between the gas pipeline (5) and the bipolar electrode assembly.

8. The transfer-type low-temperature plasma material processing device according to claim 7, characterized in that, A partition (10) is fixedly provided between the two sets of support plates (9). The two ends of the partition (10) are fixedly connected to the two sets of support plates (9) respectively, and the partition (10) is distributed above the flow equalization plate (6). The partition (10) is provided with through holes corresponding to the number and position of the gas transmission pipes (5). The gas transmission pipes (5) pass through the corresponding through holes and extend to the flow equalization plate (6).

9. The transfer-type low-temperature plasma material processing device according to claim 7, characterized in that, The side wall of the cover (7) is fixedly provided with two sets of power supply mounting plates, which respectively fix the first power supply (3) and the second power supply (4); the first power supply (3) is connected to the high-voltage end of the first high-voltage electrode tube (1) through a energized copper sheet, and the second power supply (4) is connected to the high-voltage end of the second high-voltage electrode tube (2) through a energized copper sheet.

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