A semiconductor clamping and soldering device for brushing solder paste on the surface of a chip

Abstract

The present invention belongs to the technical field of semiconductor sandwich soldering, and particularly relates to a semiconductor sandwich soldering device for brushing solder paste on the surface of a chip, which includes a frame, a track sheet passing mechanism, a solder paste brushing mechanism, a punching die mechanism, a bonding head mechanism, an upper vision mechanism, a reel feeding mechanism and a lower vision mechanism; the reel feeding mechanism is arranged on one side wall of the frame, the track sheet passing mechanism is arranged on the top of the frame, the solder paste brushing mechanism and the upper vision mechanism are both arranged on one side of the track sheet passing mechanism, the bonding head mechanism is arranged at one end of the track sheet passing mechanism, and after being connected to a lead frame through the entrance of the track sheet passing mechanism and entering the device, during the process of being continuously clamped by a clamping jaw in the track of the track sheet passing mechanism, brushing solder paste, die punching Clip, mounting Clip on the lead frame and vision inspection are sequentially completed, improving the brushing process and improving both the position accuracy of the solder paste on the chip surface and the consistency accuracy of the solder paste size.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor sandwich soldering, and particularly relates to a semiconductor sandwich soldering device for brushing solder paste on the surface of a chip. Background Art

[0002] At present, the sandwich soldering devices on the market only have the dispensing function (dispensing solder paste). After the semiconductor device lead frame (Leadframe) is loaded with chips, it is necessary to apply solder paste (or silver paste) on the upper surface of the chips, and then mount the Clip on the chip surface.

[0003] Since semiconductor device frames are generally integrated designs, hundreds of products are arranged in an array on one frame. The dispensing function module can only dispense 1-2 products at a time, which means that each frame requires dozens or even hundreds of times to complete all dispensing operations. This results in the following common deficiencies in the sandwich soldering devices on the market:

[0004] 1. Conducting hundreds of dispensing operations on each frame will surely make the dispensing module the bottleneck of the UPH of the entire sandwich soldering device, and it is difficult to meet the increasingly high UPH requirements of customers;

[0005] 2. Each frame needs to conduct dozens to hundreds of dispensing operations, and there are problems with the position accuracy of the glue dots and the consistency accuracy of the glue dot sizes. Summary of the Invention

[0006] In view of the above problems, the present invention provides a semiconductor sandwich soldering device for brushing solder paste on the surface of a chip, including a frame, a track film passing mechanism, a solder paste brushing mechanism, a die punching mechanism, a bonding head mechanism, an upper vision mechanism, a reel feeding mechanism, and a lower vision mechanism; the reel feeding mechanism is arranged on one side wall of the frame, the track film passing mechanism is arranged on the top of the frame, the solder paste brushing mechanism and the upper vision mechanism are both arranged on one side of the track film passing mechanism, the bonding head mechanism is arranged at one end of the track film passing mechanism, the die punching mechanism is arranged on the track film passing mechanism and on the side away from the upper vision mechanism, and the lower vision mechanism is embedded and installed on the top of the frame.

[0007] After the entrance of the track film passing mechanism is connected to the lead frame and enters the device, during the continuous clamping by the clamping jaws in the track of the track film passing mechanism, the operations of brushing solder paste, die punching the Clip with a die, mounting the Clip on the lead frame, and vision inspection are sequentially completed.

[0008] Further, the track film passing mechanism includes a rear track film passing rail and a front track film passing rail; the rear track film passing rail and the front track film passing rail are arranged at the same horizontal level, and both ends of the rear track film passing rail and the front track film passing rail coincide.

[0009] Further, a first base is provided at the bottom of the post-track and the pre-track near the central axis, and a second base is provided at one end of the bottom of the post-track and the pre-track.

[0010] Further, a linear slide rail is provided at the top of the post-track. A first cover plate bracket and a second cover plate bracket are provided at the top of the linear slide rail. A first linear motor stator is provided at the top of the first cover plate bracket, and a plurality of groups of second linear motor stators are arranged horizontally on one side of the first linear motor stator.

[0011] Further, the output ends of the plurality of groups of second linear motor stators are respectively connected to a first jaw, a second jaw, a third jaw, a fourth jaw, and a fifth jaw in a transmission manner. The bottoms of the first jaw, the second jaw, the third jaw, the fourth jaw, and the fifth jaw are slidably and fittingly connected along the radial direction of the linear slide rail.

[0012] Further, a first product bracket, a second product bracket, a third product bracket, and a fourth product bracket are arranged horizontally at the top of the pre-track, and the fourth product bracket is located on one side close to the second base.

[0013] Further, three groups of jaw seats are provided on one side wall of the pre-track, and a first jaw, a second jaw, and a third jaw are sequentially arranged in the three groups of jaw seats. A post-track adjustment part is provided between the post-track and the pre-track. A discharge sensor is embedded and installed at the top of the pre-track and on one side close to the second base.

[0014] Further, a feeding sensor is provided at the top of the pre-track and on the side far from the discharge sensor. A feeding port is formed on the outer wall of the pre-track and on the side close to the feeding sensor. A feeding positioning part is provided in the feeding port, and a feeding flattening machine part is provided on the feeding positioning part.

[0015] Further, the bonding head mechanism includes a bonding head air circuit part and a BH beam; the bonding head air circuit part is clamped at the top of the BH beam, and a first bonding head stator is provided between the BH beam and the bonding head air circuit part. A third cover plate bracket is provided at one end of the BH beam, and a fourth cover plate bracket is provided at the other end of the BH beam. An X-Y axis part is fixedly connected to one side of the bottom of the BH beam.

[0016] Further, the output end of the X-Y axis part is drivingly connected to the Y-Z axis part, and a small soldering head part is drivingly connected to the Y-Z axis part. One end of the bottom of the BH beam is fixedly connected to the BH front column, and one side of the bottom of the BH beam close to the third cover plate bracket is fixedly connected to the BH front column. A first bonder slider is arranged at the top of the Y-Z axis part. One side of the bottom of the BH beam close to the fourth cover plate bracket is fixedly connected to the BH rear seat, and the bottom of the BH rear seat is fixedly connected to the rear base.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. After being connected to the lead frame at the entrance of the track film passing mechanism and entering the device, during the process of being continuously clamped by the clamping jaws in the track of the track film passing mechanism, solder paste brushing, die punching of Clip, mounting Clip on the lead frame, and visual inspection are sequentially completed, improving the glue brushing process, improving the positional accuracy of the solder paste on the chip surface, and at the same time improving the consistency accuracy of the solder paste size;

[0019] 2. By arranging the unwinding mechanism inside the frame, multiple clamping and soldering devices can be used in series. Using multiple clamping and soldering devices in series can improve the efficiency of mounting Clip or realize the function of mounting different models of Clip on the lead frame;

[0020] 3. Through the upper vision mechanism, the position of the product is photographed and analyzed. After data processing, the die punching mechanism punches off the chip. The bonder mechanism drives the "X-Y axis part", "Y-Z axis part", and "small soldering head part" to move to the punching die through the program. Subsequently, the "bonder air path part" drives vacuum adsorption of the jumper wire. Then, after the "small soldering head part" moves upward and feeds along the X-Y axis part to above the product, the "small soldering head part" feeds downward, places the jumper wire on the product, closes the vacuum, and blows positive pressure while returning to the origin; repeating this process improves the adjustment efficiency of the soldering head moving along the XYZ axis and enhances the compatibility with the upper and lower vision mechanisms.

[0021] Other features and advantages of the present invention will be described in the subsequent description, and, in part, will become obvious from the description or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures pointed out in the description, claims, and drawings. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1Shows the structural explosion diagram of the semiconductor sandwich welding device according to an embodiment of the present invention;

[0024] Figure 2 Shows the structural explosion diagram of the track chip passing mechanism according to an embodiment of the present invention;

[0025] Figure 3 Shows the structural explosion diagram of the bonding head mechanism according to an embodiment of the present invention;

[0026] Figure 4 Shows the structural explosion diagram of the X-Y axis part according to an embodiment of the present invention;

[0027] Figure 5 Shows the structural explosion diagram of the Y-Z axis part according to an embodiment of the present invention;

[0028] Figure 6 Shows the structural explosion diagram of the small welding head part according to an embodiment of the present invention.

[0029] In the figure: 1. Frame; 2. Film passing mechanism for track; 21. First jaw; 22. Second jaw; 23. Third jaw; 24. Fourth jaw; 25. Fifth jaw; 26. Stator of first linear motor; 27. Stator of second linear motor; 28. Linear slide rail; 29. First cover plate bracket; 210. Second cover plate bracket; 211. First product bracket; 212. Second product bracket; 213. Third product bracket; 214. Fourth product bracket; 215. Rear rail of film passing for track; 216. Front rail of film passing for track; 217. Feeding sensor; 218. Feeding positioning part; 219. First pressing jaw; 220. Second pressing jaw; 221. Third pressing jaw; 222. First base; 223. Second base; 224. Feeding flattening machine part; 225. Discharging sensor; 226. Rear rail adjusting part; 3. Solder paste brushing mechanism; 4. Die punching mechanism; 5. Bonding head mechanism; 51. Air circuit part of bonding head; 52. First bonding head stator; 53. Third cover plate bracket; 54. BH beam; 55. X-Y axis part; 551. Slide rail bottom plate; 552. X-axis slide rail; 553. Y-direction reading head; 554. Second bonding head stator; 555. First Y-axis slide rail; 556. Motor seat; 557. Second bonding head mover; 56. BH front column; 57. Fourth cover plate bracket; 58. First bonding head mover; 59. BH rear seat; 510. Y-Z axis part; 5101. Z moving plate; 5102. Z-direction reading head; 5103. Second Y-axis slide rail; 5104. Z stator bottom plate; 5105. X-direction reading head; 511. Small soldering head part; 5111. First motor; 5112. T-axis origin induction piece; 5113. First synchronous pulley; 5114. Y-direction adjusting plate; 5115. Z-axis guide rail mounting plate; 5116. Z-axis guide rail seat; 5117. Second motor; 5118. Second synchronous pulley; 5119. Z-axis crossed roller guide rail; 51110. Nozzle mounting plate; 51111. Photoelectric sensor; 51112. Nozzle; 51113. Pick-and-place head origin; 512. Rear base; 6. Upper vision mechanism; 7. Unwinding mechanism; 8. Lower vision mechanism. Detailed implementation mode

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] An embodiment of the present invention provides a semiconductor clamping and soldering device for brushing solder paste on the surface of a chip, including a frame 1, a track sheet passing mechanism 2, a solder paste brushing mechanism 3, a die punching mechanism 4, a bonding head mechanism 5, an upper vision mechanism 6, a reel feeding mechanism 7, and a lower vision mechanism 8; Exemplarily, as Figure 1 shown.

[0032] The reel feeding mechanism 7 is arranged on one side wall of the frame 1, the track sheet passing mechanism 2 is arranged on the top of the frame 1, the solder paste brushing mechanism 3 and the upper vision mechanism 6 are both arranged on one side of the track sheet passing mechanism 2, the bonding head mechanism 5 is arranged at one end of the track sheet passing mechanism 2, the die punching mechanism 4 is arranged on the track sheet passing mechanism 2 and on the side far from the upper vision mechanism 6, the lower vision mechanism 8 is embedded and installed on the top of the frame 1, and the lower vision mechanism 8 is vertically arranged with the upper vision mechanism 6.

[0033] Specifically, the entrance of the track sheet passing mechanism 2 is connected to the lead frame and then enters the device. During the process of being continuously clamped by the clamping jaws in the track of the track sheet passing mechanism 2, brushing solder paste, die punching Clip by the die, mounting Clip on the lead frame, and vision inspection are sequentially completed. After the process, the lead frame is pushed out of the track and enters the reflow oven.

[0034] The track sheet passing mechanism 2 includes a track sheet passing rear rail 215 and a track sheet passing front rail 216; Exemplarily, as Figure 2 shown.

[0035] The track sheet passing rear rail 215 and the track sheet passing front rail 216 are arranged at the same horizontal level, and both ends of the track sheet passing rear rail 215 and the track sheet passing front rail 216 coincide. At the bottom of the track sheet passing rear rail 215 and the track sheet passing front rail 216 and near the central axis, a first base 222 is arranged, and at one end of the bottom of the track sheet passing rear rail 215 and the track sheet passing front rail 216, a second base 223 is arranged;

[0036] On the top of the track sheet passing rear rail 215, a linear slide rail 28 is arranged. On the top of the linear slide rail 28, a first cover plate support 29 and a second cover plate support 210 are arranged. On the top of the first cover plate support 29, a first linear motor stator 26 is arranged, and on one side of the first linear motor stator 26 at the same horizontal level, several groups of second linear motor stators 27 are arranged. The output ends of several groups of the second linear motor stators 27 are all drivingly connected to a first clamping jaw 21, a second clamping jaw 22, a third clamping jaw 23, a fourth clamping jaw 24, and a fifth clamping jaw 25. The bottoms of the first clamping jaw 21, the second clamping jaw 22, the third clamping jaw 23, the fourth clamping jaw 24, and the fifth clamping jaw 25 are all slidably and fittingly connected along the radial direction of the linear slide rail 28;

[0037] At the top of the front rail 216 of the track for passing the film, a first product bracket 211, a second product bracket 212, a third product bracket 213 and a fourth product bracket 214 are arranged at the same level. The fourth product bracket 214 is located on the side close to the second base 223. On one side wall of the front rail 216 of the track for passing the film, three groups of claw seats are arranged, and a first claw 219, a second claw 220 and a third claw 221 are sequentially arranged in the three groups of claw seats. A rear rail adjustment part 226 is arranged between the rear rail 215 of the track for passing the film and the front rail 216 of the track for passing the film. An outfeed sensor 225 is embedded and installed at the top of the front rail 216 of the track for passing the film and on the side close to the second base 223. A feeding sensor 217 is arranged at the top of the front rail 216 of the track for passing the film and on the side far from the outfeed sensor 225. An inlet is formed on the outer wall of the front rail 216 of the track for passing the film and on the side close to the feeding sensor 217. A feeding positioning part 218 is arranged in the inlet, and a feeding flattening machine part 224 is arranged on the feeding positioning part 218.

[0038] Specifically, the rear rail 215 of the track for passing the film is driven by a driving element of the "rear rail adjustment part 226" to run in the Y-axis direction, so that the track widths of the rear rail 215 of the track for passing the film and the front rail 216 of the track for passing the film are the same as the product width. Then the product enters the Index mechanism;

[0039] The product receives a signal through the "feeding sensor 217", and the driving element drives the upper claw of the "first gripper 21" to close downward to clamp the product frame and move in the X-axis direction. During the movement, the "first product bracket 211" supports the center of the product to prevent the product from falling due to the center of gravity;

[0040] After reaching the dispensing position, that is, the anvil one of the Tooling mechanism, the suction holes in the anvil one are firmly adsorbed to the product frame by using a vacuum pump. At the same time, the "first claw 219" is driven downward by an air circuit to fix the frame. Then the left dispensing of the dispensing mechanism starts to run to dispense glue to the product;

[0041] After the glue dispensing is completed, the upper claw of the "second gripper 22" is driven to close to clamp the product frame. The "first gripper 21" releases the gripper and returns to the origin. The "second gripper 22" feeds in the X-axis direction and proceeds to the next processing. During the process, the "second product bracket 212" supports the center of the product to prevent the product from falling due to the center of gravity;

[0042] After reaching the dispensing position, the anvil two of the Tooling mechanism tightly adsorbs the product frame by vacuum. At the same time, the "second claw 220" is driven downward by an air circuit to fix the frame, and the right dispensing starts to run;

[0043] After the dispensing is completed, the upper jaw of the "third clamping jaw 23" is driven to close and clamp the product frame, the "second clamping jaw 22" releases the clamping jaw and returns to the origin, and the "third clamping jaw 23" moves in the X-axis direction for the next step of processing. During the process, the "third product bracket 213" supports the center of the product to prevent the center of gravity of the product from falling;

[0044] When it reaches the chopping board 3 of the tooling mechanism, the "third pressing claw 221" is driven by the air circuit to press down the fixed frame while vacuum adsorption, and the suction nozzle of the bundling mechanism 5 adsorbs the jumper through vacuum adsorption and assembles the jumper with the product;

[0045] After the assembly is completed, the upper jaw of the "fourth clamping jaw 24" is driven to close and clamp the product frame, the "third clamping jaw 23" releases the clamping jaw and returns to the origin, and the "fifth clamping jaw 25" moves in the X-axis direction. During this process, the "third product bracket 213" supports the center of the product to prevent the center of gravity of the product from falling;

[0046] After the specified distance, the "fourth clamping jaw 24" returns to the origin; the "fifth clamping jaw 25" takes over the "fourth clamping jaw 24" to clamp the product and push it to the OVEN mechanism for the next step of processing. After the specified distance, the "fifth clamping jaw 25" returns to the origin; the pushing mechanism pushes the product frame through the "discharging sensor 225" into the OVEN mechanism;

[0047] At this point, the product's processing in the Index mechanism is completed, and this cycle repeats.

[0048] The bungee mechanism 5 includes a bungee air path portion 51 and a BH beam 54; for example, Figure 3 shown.

[0049] The bang head air path part 51 is clamped on the top of the BH beam 54, and a first bang head stator 52 is arranged between the BH beam 54 and the bang head air path part 51, a third cover plate bracket 53 is arranged at one end of the BH beam 54, and a fourth cover plate bracket 57 is arranged at the other end of the BH beam 54, an XY axis part 55 is fixedly connected to one side of the bottom of the BH beam 54, and the output end of the XY axis part 55 is transmission-connected to the YZ axis part 510, and the YZ axis part 510 The upper transmission is connected with a small welding head 511, one end of the bottom of the BH beam 54 is fixedly connected with a BH front column 56, the bottom of the BH beam 54 and one side close to the third cover plate bracket 53 is fixedly connected with the BH front column 56, the top of the YZ axis portion 510 is provided with a first welding head mover 58, the bottom of the BH beam 54 and one side close to the fourth cover plate bracket 57 is fixedly connected with a BH rear seat 59, and the bottom of the BH rear seat 59 is fixedly connected with a rear base 512.

[0050] Specifically, when the product is fed to the anvil three by the Index mechanism, the upper vision mechanism 6 takes pictures and analyzes the position of the product. After data processing, the die punching mechanism punches off the chip. The bonding head mechanism drives the "X-Y axis part 55", "Y-Z axis part 510" and "small soldering head part 511" to move to the punching die through the program. Subsequently, the "bonding head air circuit part 51" drives the vacuum to adsorb the jumper wire. After that, the "small soldering head part 511" moves upward and then feeds along the X-Y axis part 55 to above the product. The "small soldering head part 511" feeds downward, places the jumper wire on the product, closes the vacuum, and blows positive pressure while returning to the origin; and so on.

[0051] The X-Y axis part 55 includes a slide rail bottom plate 551 and a motor base 556; Exemplarily, as Figure 4 shown.

[0052] On one side wall of the slide rail bottom plate 551, two groups of X-axis slide rails 552 are provided. On one side of the bottom of the slide rail bottom plate 551, a Y-direction read head 553 is provided. The motor base 556 is of an open structure, and at the bottom end of the inner wall of the motor base 556, a second bonding head stator 554 is provided. On both sides of the second bonding head stator 554, first Y-axis slide rails 555 are provided. The bottom of the slide rail bottom plate 551 is slidably connected to the tops of the two groups of first Y-axis slide rails 555. At the bottom end of the inner wall of the motor base 556, a second bonding head mover 557 is also provided, and the second bonding head mover 557 is located on one side of the first Y-axis slide rail 555.

[0053] The Y-Z axis part 510 includes a Z moving plate 5101; Exemplarily, as Figure 5 shown.

[0054] At one end of the Z moving plate 5101, a Z-direction read head 5102 is provided. The bottom of the Z moving plate 5101 is slidably and fittingly connected to two groups of second Y-axis slide rails 5103. The bottoms of the two groups of second Y-axis slide rails 5103 are fixedly connected to a Z stator bottom plate 5104. On the outer wall of the Z stator bottom plate 5104 and near one side of the Z-direction read head 5102, an X-direction read head 5105 is provided.

[0055] The small soldering head part 511 includes a Z-axis guide rail mounting plate 5115 and a nozzle 51112; Exemplarily, as Figure 6 shown.

[0056] The inner wall of the Z-axis guide rail mounting plate 5115 is provided with a Z-axis guide rail seat 5116, and both side walls of the Z-axis guide rail seat 5116 are provided with Z-axis cross roller guide rails 5119, and two groups of the Z-axis cross roller guide rails 5119 are both fitted and connected to the inner wall of the Z-axis guide rail mounting plate 5115, and the top of the Z-axis guide rail seat 5116 is rotatably connected to the second synchronous wheel 5118, and the top of the Z-axis guide rail mounting plate 5115 and one side thereof horizontally to the second synchronous wheel 5118 is rotatably connected to the first synchronous wheel 5113, and the first synchronous wheel 5113 and the second synchronous wheel 5118 are sleeved with belts, and the top of the first synchronous wheel 5113 is clamped with a T-axis origin sensing sheet 5112, and the Z-axis guide rail mounting plate 5115 A Y-axis adjustment plate 5114 is fixedly connected to one side wall of the Y-axis adjustment plate 5114, and a first motor 5111 is fixedly connected to one side wall of the Y-axis adjustment plate 5114, and the output end of the first motor 5111 is transmission-connected to the top of the first synchronous wheel 5113, a nozzle mounting plate 51110 is provided at the bottom of the Z-axis guide seat 5116, and the nozzle mounting plate 51110 is open-type, and a second motor 5117 is embedded and installed at the nozzle on one side of the nozzle mounting plate 51110, a photoelectric sensor 51111 is provided on one side wall of the nozzle 51112, and a pick-and-place head origin 51113 is provided on the top of the nozzle 51112, and the nozzle 51112 is embedded and installed at the nozzle on the other side of the nozzle mounting plate 51110.

[0057] The semiconductor clamping device for brushing solder paste on the chip surface proposed by the embodiment of the present invention has the following working principle:

[0058] After passing through the lead frame and entering the sheet track, it is clamped by the first clamping claw 21 and moved to the position of the positioning sensor for positioning;

[0059] After positioning, the first clamping jaw 21 clamps the lead frame and hands it over to the second clamping jaw 22, and the first clamping jaw 21 retreats to the entrance of the track to wait for the next lead frame. The second clamping jaw 22 holds the lead frame and runs to the glue brushing station. The second clamping jaw 22 retreats to the position where it is connected to the first clamping jaw 21 and waits, while the glue brushing mechanism brushes glue on the lead frame;

[0060] After the lead frame is glued, the third clamp 23 comes over to clamp the lead frame and moves to the Clip mounting position to wait for Clip mounting;

[0061] The Clip on the Clip material strip is punched out by the punching die mechanism 4, and the Clip welding head of the bonding head mechanism 5 absorbs the punched out Clip and moves it to the detection position of the lower visual mechanism 8 and the Clip mounting position in turn to complete the Clip detection and Clip mounting work;

[0062] Before each placement, the upper visual mechanism 6 completes the detection of the position and size of the solder paste dots on the surface of the chip on the lead frame;

[0063] After mounting, the upper visual mechanism 6 completes the detection of the position and angle of the Clip after mounting;

[0064] The unwinding mechanism 7 is responsible for supplying the Clip material strip to the punching die mechanism and recovering the interlayer paper of the Clip material roll;

[0065] During the mounting process, the third clamping jaw 23 and the fourth clamping jaw 24 are connected once, and after the connection, the third clamping jaw 23 returns to the connecting position with the second clamping jaw 22 and waits;

[0066] The third clamping jaw 23 is responsible for mounting the front half of the Clip on the lead frame, and the fourth clamping jaw 24 is responsible for mounting the rear half of the Clip on the lead frame;

[0067] After all Clips are mounted on the lead frame, the fourth clamp 24 hands the lead frame to the fifth clamp 25 and then returns to the junction with the third clamp 23 to wait. The fifth clamp 25 holds the lead frame and runs it to the end of the film track. Finally, the push-out mechanism pushes the lead frame out of the film track and into the track of the next machine reflow furnace.

[0068] That is to say, all the processes of the clamping welding equipment are completed.

[0069] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor clamping device for brushing solder paste on the chip surface, characterized in that: The invention comprises a frame (1), a track film feeding mechanism (2), a solder paste brushing mechanism (3), a die mechanism (4), a header mechanism (5), an upper visual mechanism (6), a reeling mechanism (7) and a lower visual mechanism (8); the reeling mechanism (7) is arranged on a side wall of the frame (1), the track film feeding mechanism (2) is arranged on the top of the frame (1), the solder paste brushing mechanism (3) and the upper visual mechanism (6) are both arranged on one side of the track film feeding mechanism (2), the header mechanism (5) is arranged at one end of the track film feeding mechanism (2), the die mechanism (4) is arranged on a side of the track film feeding mechanism (2) away from the upper visual mechanism (6), and the lower visual mechanism (8) is embedded and installed on the top of the frame (1); The entrance of the track film feeding mechanism (2) is connected to the lead frame and then enters the device. In the process of being continuously clamped by the clamping claws in the track of the track film feeding mechanism (2), solder paste brushing, die cutting Clip, Clip mounting to the lead frame and visual inspection are completed in sequence; The bungee mechanism (5) comprises a bungee air path portion (51) and a BH beam (54); the bungee air path portion (51) is clamped on the top of the BH beam (54), and a first bungee stator (52) is arranged between the BH beam (54) and the bungee air path portion (51); a first cover plate bracket (53) is arranged at one end of the BH beam (54), and a second cover plate bracket (57) is arranged at the other end of the BH beam (54); and an XY axis portion (55) is fixedly connected to one side of the bottom of the BH beam (54); The output end of the XY axis portion (55) is transmission-connected to the YZ axis portion (510), and the YZ axis portion (510) is transmission-connected to a small welding head portion (511); one end of the bottom of the BH beam (54) is fixedly connected to a BH front column (56); the bottom of the BH beam (54) and one side close to the first cover plate bracket (53) are fixedly connected to the BH front column (56); the top of the YZ axis portion (510) is provided with a first welding head mover (58); the bottom of the BH beam (54) and one side close to the second cover plate bracket (57) are fixedly connected to a BH rear seat (59); the bottom of the BH rear seat (59) is fixedly connected to a rear base (512).

2. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 1, characterized in that: The track film-advancing mechanism (2) comprises a track film-advancing rear rail (215) and a track film-advancing front rail (216); the track film-advancing rear rail (215) and the track film-advancing front rail (216) are arranged at the same level, and both ends of the track film-advancing rear rail (215) and the track film-advancing front rail (216) overlap.

3. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 2, characterized in that: A first base (222) is provided at the bottom of the track film-passing rear rail (215) and the track film-passing front rail (216) and close to the central axis, and a second base (223) is provided at one end of the bottom of the track film-passing rear rail (215) and the track film-passing front rail (216).

4. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 3, characterized in that: A linear slide rail (28) is arranged on the top of the track sheet rear rail (215), a first cover plate bracket (29) and a second cover plate bracket (210) are arranged on the top of the linear slide rail (28), a first linear motor stator (26) is arranged on the top of the first cover plate bracket (29), and a plurality of groups of second linear motor stators (27) are arranged at the same level on one side of the first linear motor stator (26).

5. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 4, characterized in that: The output ends of the plurality of groups of the second linear motor stators (27) are all drivingly connected to the first clamp (21), the second clamp (22), the third clamp (23), the fourth clamp (24) and the fifth clamp (25); the bottoms of the first clamp (21), the second clamp (22), the third clamp (23), the fourth clamp (24) and the fifth clamp (25) are all slidably connected along the radial direction of the linear guide rail (28).

6. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 5, characterized in that: A first product bracket (211), a second product bracket (212), a third product bracket (213) and a fourth product bracket (214) are arranged at the same level on the top of the track film-transferring front rail (216), and the fourth product bracket (214) is located on a side close to the second base (223).

7. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 6, characterized in that: A side wall of the track film front rail (216) is provided with three groups of pressure claw seats, and the three groups of pressure claw seats are provided with a first pressure claw (219), a second pressure claw (220) and a third pressure claw (221) in sequence, a rear rail adjustment portion (226) is provided between the track film rear rail (215) and the track film front rail (216), and a discharge sensor (225) is embedded and installed at the top of the track film front rail (216) and on one side close to the second base (223).

8. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 7, characterized in that: A feeding sensor (217) is arranged at the top of the track film front rail (216) and at a side away from the material discharging sensor (225), and a feeding port is opened on the outer wall of the track film front rail (216) and at a side close to the feeding sensor (217), a feeding positioning part (218) is arranged in the feeding port, and a feeding pusher part (224) is arranged on the feeding positioning part (218).

Images