An adjustable fast constant force encapsulation bonding mechanism

Abstract

The present application discloses an adjustable rapid constant-force encapsulation bonding mechanism, which relates to the technical field of semiconductor packaging. It includes a mechanism main body; a bonding head body is movably installed in the mechanism main body along a first straight line direction; both sides of the bonding head body in a second straight line direction perpendicular to the first straight line direction are connected to the mechanism main body through a negative stiffness structure and a linear positive stiffness structure respectively; the linear positive stiffness structure is connected to the guiding head of a flexible guiding mechanism; a sliding table mechanism is installed on the mechanism main body; the sliding table body of the sliding table mechanism is connected to the guiding heads on both sides through a connecting rod mechanism; the connecting rod mechanism is used to convert the displacement of the sliding table body in the first straight line direction into the displacement of the guiding head in the second straight line direction; a threaded adjusting member is movably installed on the mechanism main body; the threaded adjusting member is used to adjust the displacement of the bonding head body in the first straight line direction by rotating itself. The mechanism designed in the present application has the function of quickly entering the constant-force range and can simultaneously adjust the output of different constant forces.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to an adjustable rapid constant-force packaging bonding mechanism. Background Art

[0002] Packaging bonding is a core link in the semiconductor packaging process. It involves connecting a chip to a substrate (such as a lead frame or a PCB board) through specific technologies to achieve electrical connection and provide physical support. This technology is widely used in the manufacturing of various semiconductor devices, including integrated circuits (ICs), microprocessors (MPUs), memories, etc. With the continuous progress of semiconductor technology, packaging bonding technology is also constantly innovating and improving to meet the growing demand for semiconductor device manufacturing and achieve the goals of higher density, higher performance, and lower power consumption.

[0003] The process of packaging bonding usually includes several steps such as chip preparation, substrate preparation, bonding operation, and quality inspection. However, 40% of the packaging bonding failures are related to chip damage and poor solder ball deformation during the bonding operation. As shown in the schematic diagram a in Figure 1 , during the bonding operation, the bonding head (100) applies pressure to the chip (101), causing the solder ball (102) on the chip (101) to deform and form a connection with the substrate (103) on the base (104).

[0004] As the number of I / O ports of the chip (101) increases, the pitch between the solder balls (102) becomes smaller and smaller. When the bonding force is too large, the solder balls may be overly deformed, exceeding their corresponding substrate areas, resulting in short circuits between the solder balls (as shown in the schematic diagram c in Figure 1 ); in addition, too large a bonding force may also cause the solder balls to break (as shown in the schematic diagram d in Figure 1 ); on the contrary, too small a bonding force will result in insufficient deformation of the solder balls, making it impossible for the solder balls and the substrate to form an effective connection (as shown in the schematic diagram f in Figure 1 ). The above situations will all affect the quality of packaging bonding. Therefore, whether the bonding force is too large or too small will lead to the failure of packaging bonding. Ultimately, controlling the magnitude of the bonding force during the bonding operation is the key to the success of packaging bonding (the schematic diagram b in Figure 1 is a schematic diagram of good packaging bonding).

[0005] Therefore, there is an urgent need to provide a solution to solve the above problems and requirements. Summary of the Invention

[0006] In view of this, the purpose of this application is to provide an adjustable rapid constant-force packaging bonding mechanism, which has the function of quickly entering the constant-force range and can adjust the output of different constant forces to meet the requirements of different bonding forces for packaging bonding.

[0007] To achieve the above technical objectives, the present application provides an adjustable fast constant force encapsulation and bonding mechanism, including a mechanism main body;

[0008] A bonding head body is movably installed in the mechanism main body along a first straight line direction;

[0009] One end of the bonding head body in the first straight line direction extends out of the mechanism main body;

[0010] Both sides of the bonding head body in a second straight line direction perpendicular to the first straight line direction are respectively connected to the mechanism main body through a negative stiffness structure;

[0011] Both sides of the bonding head body in the second straight line direction are also respectively connected to a flexible guiding mechanism through a linear positive stiffness structure;

[0012] The flexible guiding mechanism has a guiding head capable of displacing in the second straight line direction;

[0013] The guiding head is connected to the linear positive stiffness structure through the connecting block;

[0014] A sliding table mechanism is installed on the mechanism main body;

[0015] The sliding table body of the sliding table mechanism is slidably adjustable along the first straight line direction;

[0016] The sliding table body is connected to the flexible guiding mechanism through a connecting rod mechanism and is connected to the linear positive stiffness structure through the connecting blocks located on both sides of the bonding head body;

[0017] The connecting rod mechanism is used to convert the displacement of the sliding table body in the first straight line direction into the displacement of the guiding head in the second straight line direction;

[0018] A through hole is provided in the mechanism main body along the first straight line direction;

[0019] A threaded adjusting member is movably installed on the through hole;

[0020] The other end of the bonding head body in the first straight line direction is provided with a threaded hole for inserting and thread - fitting the threaded section of the threaded adjusting member;

[0021] The threaded adjusting member is used to adjust the displacement of the bonding head body in the first straight line direction by rotating itself.

[0022] Furthermore, two cavities are sequentially provided in the mechanism main body along the first straight line direction;

[0023] One end of the bonding head body passes through one of the cavities and extends into the other cavity;

[0024] One of the cavities is used to accommodate the linear positive stiffness structure;

[0025] The other cavity is used to accommodate the negative stiffness structure.

[0026] Further, the through hole communicates with the other cavity, and includes a first hole section and a second hole section coaxially communicating with the first hole section;

[0027] The diameter of the first hole section is larger than that of the second hole section, and is used to accommodate the head of the threaded adjusting member;

[0028] The threaded section of the threaded adjusting member passes through the second hole section.

[0029] Further, a mounting plate is fixed on the mechanism main body;

[0030] The sliding table mechanism is mounted on the mounting plate.

[0031] Further, the connecting rod mechanism includes two connecting rod assemblies;

[0032] The linear positive stiffness structures located on both sides of the bonding head body are respectively connected to the sliding table body through the connecting rod assemblies;

[0033] The connecting rod assembly includes a first connecting rod and a second connecting rod;

[0034] One end of the first connecting rod is rotatably connected to the sliding table body, and the other end is rotatably connected to the guiding head;

[0035] One end of the second connecting rod is rotatably connected to the first connecting rod and is located between the two rotating ends of the first connecting rod;

[0036] The other end of the second connecting rod is rotatably connected to the mechanism main body;

[0037] The rotation center lines of one ends of the two first connecting rods are coaxial;

[0038] The rotation center lines of the other ends of the two second connecting rods are coaxial.

[0039] Further, the sliding table mechanism is a manual sliding table.

[0040] Further, the flexible guiding mechanism includes two guiding fixing blocks, at least one guiding beam and one guiding head;

[0041] The two guiding fixing blocks are fixedly arranged on the mechanism main body at intervals along the first straight line direction;

[0042] At least one guiding beam is fixed between the two guiding fixing blocks along the first straight line direction;

[0043] The guiding head is fixed on the guiding beam;

[0044] The connecting block connects the guiding head and the linear positive stiffness structure.

[0045] Further, the negative stiffness structure is an inclined beam structure.

[0046] Further, the linear positive stiffness structure is a broken line beam structure.

[0047] Further, a plurality of mounting holes are provided on the mechanism main body.

[0048] It can be seen from the above technical solutions that the adjustable fast constant force encapsulation bonding mechanism designed in this application has the following beneficial effects:

[0049] 1. The bonding head body is respectively connected with a negative stiffness structure and a linear positive stiffness structure in the second linear direction, so as to realize the parallel connection of the negative stiffness structure and the linear positive stiffness structure to form a constant force mechanism.

[0050] 2. The threaded adjusting member is used in cooperation with the threaded hole of the bonding head body to adjust the displacement of the bonding head body in the first linear direction, thereby realizing the pre-tightening of the constant force mechanism in advance, enabling it to have the function of quickly entering the constant force range, shortening the time for the constant force mechanism to enter its constant force range, and effectively improving the working efficiency of the constant force mechanism.

[0051] 3. By moving the sliding table body, the guiding head of the flexible guiding mechanism can be driven by the link mechanism to move, and then the linear positive stiffness structure 32 can be driven to move, so as to realize the adjustable constant force to meet different usage requirements. Compared with the method of driving a piezoelectric ceramic (PZT) to adjust the output constant force, the adjustment process is effectively simplified, and the efficiency of constant force adjustment is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0053] Figure 1 It is a schematic diagram of the bonding model for encapsulation bonding provided in the present application;

[0054] Figure 2 It is a three-dimensional view of an adjustable fast constant force encapsulation bonding mechanism provided in the present application;

[0055] Figure 3Schematic diagram of the first partial structure of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0056] Figure 4 Schematic diagram corresponding to the structure, simplified model and force-displacement curve of the negative stiffness part of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0057] Figure 5 Schematic diagram corresponding to the structure, simplified model and force-displacement curve of the linear positive stiffness part of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0058] Figure 6 Schematic diagram corresponding to the structure, simplified model and force-displacement curve composed of the negative stiffness part and the linear positive stiffness part of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0059] Figure 7 Schematic model diagram of the pre-tightening process of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0060] Figure 8 Comparison diagram of the constant-force curves before and after pre-tightening of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0061] Figure 9 Schematic diagram of the second partial structure of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0062] Figure 10 Schematic model diagram of adjusting the constant force of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0063] Figure 11 Schematic diagram of the principle of adjusting the constant force of an adjustable rapid constant-force encapsulation and bonding mechanism provided in this application;

[0064] Figure 2 Wherein: 1. Mechanism main body; 11. Through hole; 12. Cavity; 13. Mounting hole; 2. Bonding head body; 21. Threaded hole; 31. Negative stiffness structure; 32. Linear positive stiffness structure; 4. Flexible guiding mechanism; 41. Guiding fixing block; 42. Guiding beam; 43. Guiding head; 44. Connecting block; 5. Slide table mechanism; 51. Slide table body; 52. Lead screw assembly; 6. Linkage mechanism; 61. First link; 62. Second link; 7. Mounting plate. Detailed implementation manners

[0065] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the embodiments of the present application.

[0066] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0067] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0068] The embodiments of the present application disclose an adjustable fast constant force encapsulation bonding mechanism.

[0069] Please refer to Figure 2 and Figure 3 One embodiment of an adjustable fast constant force encapsulation bonding mechanism provided in the embodiments of the present application includes:

[0070] Mechanism main body 1.

[0071] A bonding head body 2 is movably installed in the mechanism main body 1 along a first straight line direction, and the first straight line direction refers to the preset bonding movement direction of the bonding head body 2. For Figure 2 example, it can refer to the vertical straight line direction.

[0072] One end of the bonding head body 2 in the first straight line direction extends out of the mechanism main body 1, and the end extending out of the mechanism main body 1 is used to contact the chip for bonding operation on the chip.

[0073] The two sides of the bonding head body 2 in the second linear direction perpendicular to the first linear direction are respectively connected to the mechanism body 1 through the negative stiffness structure 31; the negative stiffness structure 31 is a special mechanical structure in which, when subjected to an external force, the relationship between the displacement generated in a section and the force shows a negative correlation, rather than a positive correlation between displacement and force as in a conventional positive stiffness structure. During the entire displacement process, the stiffness coefficient k < 0 in a section of displacement ( Figure 4 the middle section in c).

[0074] Figure 4 The schematic diagram a in [ ] is the structural schematic diagram of the negative stiffness part of this application, Figure 4 The schematic diagram b in [ ] is the corresponding model schematic diagram, Figure 4 The schematic diagram c in [ ] is the corresponding force F / displacement x curve diagram.

[0075] The two sides of the bonding head body 2 in the second linear direction are also respectively connected to the flexible guiding mechanism 4 through the linear positive stiffness structure 32; the linear positive stiffness structure 32 refers to a structure in which, within the elastic range, the force applied to the structure and the generated displacement show a linear relationship and the stiffness is positive. Stiffness is the ability of a structure to resist deformation. For the linear positive stiffness structure 32, its force-displacement relationship can be described by Hooke's law, that is, F = kx, where F is the external force applied to the structure, x is the displacement generated by the structure, k is the stiffness coefficient, and k > 0.

[0076] Figure 5 The schematic diagram a in [ ] is the structural schematic diagram of the linear positive stiffness part of this application, Figure 5 The schematic diagram b in [ ] is the corresponding model schematic diagram, Figure 5 The schematic diagram c in [ ] is the corresponding force F / displacement x curve diagram.

[0077] As Figure 6 shown, a constant force mechanism can be obtained after the negative stiffness structure 31 and the linear positive stiffness structure 32 are connected in parallel. Among them Figure 6 The schematic diagram a in [ ] is the structural schematic diagram of the combination of the negative stiffness structure 31 and the linear positive stiffness structure 32 of this application, Figure 6 The schematic diagram b in [ ] is the corresponding model schematic diagram, Figure 6 The c in [ ] is the corresponding force F / displacement x curve diagram.

[0078] The flexible guiding mechanism 4 has a guiding head 43 that can displace in the second linear direction, and the guiding head 43 is connected to the linear positive stiffness structure 32 through a connecting block 44.

[0079] The slider mechanism 5 is installed on the mechanism main body 1, and the slider body 51 of the slider mechanism 5 is slidably adjustable along the first linear direction. The slider body 51 is connected to the flexible guiding mechanism 4 through the connecting rod mechanism 6, and is connected to the linear positive stiffness structure 32 through the connecting blocks 44 located on both sides of the bonding head body 2; the connecting rod mechanism 6 is used to convert the displacement of the slider body 51 in the first linear direction into the displacement of the guiding head 43 in the second linear direction.

[0080] The mechanism main body 1 is provided with a through hole 11 along the first linear direction, and a threaded adjusting member (not shown in the figure) is movably installed on the through hole 11; the bonding head body 2 is provided with a threaded hole 21 for inserting and threadedly mating with the threaded section of the threaded adjusting member at the other end in the first linear direction; the threaded adjusting member is used to adjust the displacement of the bonding head body 2 in the first linear direction by rotating itself.

[0081] The threaded adjusting member can be a screw, a bolt, or other threaded structural members with a head and a threaded rod section, and there is no specific limitation. When the threaded adjusting member is turned, since the threaded adjusting member itself does not move due to contact and abutment with the mechanism main body 1, the threaded fit between the threaded adjusting member and the threaded hole 21 can be converted into the displacement of the bonding head body 2 in the upward direction in the first linear direction (such as Figure 3 the direction of the input displacement x), so as to realize the displacement adjustment of the bonding head body 2 and achieve the pre-tightening purpose. When continuing to input an upward displacement (such as Figure 3 the direction of the input displacement x) in the first linear direction, the threaded adjusting member will move together with the bonding head body 2.

[0082] The working principle of the quick constant force of this application: as Figure 7 and Figure 8 shown, before the constant force mechanism is pre-tightened, the constant force mechanism needs to pass through a distance of Δx (millimeter level) to enter the constant force range s; by adjusting the threaded member to pre-tighten the bonding head body 2, the constant force mechanism is pre-tightened by Δx in advance, so that the constant force mechanism is directly at the constant force point A. After that, the constant force mechanism only needs to pass through a distance of Δx' (micrometer level) to directly enter the constant force range s, effectively shortening the time for the constant force mechanism to enter the constant force range.

[0083] The working principle of adjusting the constant force of this application: as Figure 9 and Figure 10 shown, adjust the slider body 51 to move up and down. The displacement generated by the slider body 51 is transmitted to the flexible guiding mechanism 4 through the connecting rod mechanism 6, and the flexible guiding mechanism 4 is connected to the linear positive stiffness structure 32 of the constant force mechanism through the connecting block 44, so that the displacements generated by the two parts are the same. Finally, the displacement of the slider body 51 is transmitted to the linear positive stiffness structure 32 of the constant force mechanism, so as to adjust the output force of the constant force mechanism to meet the different bonding force requirements in the packaging and bonding process.

[0084] AsFigure 11 As shown in the figure, when the adjusting slide body 51 generates a downward displacement, the displacement is transmitted to the linear positive stiffness structure 32 of the constant force mechanism through the link mechanism 6, the flexible guiding mechanism 4 and the connecting block 44. At this time, the linear positive stiffness structure 32 generates a deformation of ΔN compared with that before adjustment, and its output force increases by ΔF. Then the output constant force of the constant force mechanism also increases by ΔF correspondingly, thus realizing the adjustment of the constant force.

[0085] The adjustable fast constant force encapsulation and bonding mechanism designed in this application has the following beneficial effects:

[0086] 1. The bonding head body 2 is respectively connected with a negative stiffness structure 31 and a linear positive stiffness structure 32 in the second straight line direction, so that the negative stiffness structure 31 and the linear positive stiffness structure 32 are connected in parallel to form a constant force mechanism.

[0087] 2. The threaded adjusting member is used to cooperate with the threaded hole 21 of the bonding head body 2 to adjust the displacement of the bonding head body 2 in the first straight line direction, thereby realizing the pre-tightening of the constant force mechanism in advance, enabling it to have the function of quickly entering the constant force range (fast constant force), shortening the time for the constant force mechanism to enter its constant force range, and effectively improving the working efficiency of the constant force mechanism.

[0088] 3. By moving the slide body 51, the guiding head 43 of the flexible guiding mechanism 4 can be driven to move through the link mechanism 6, and then the linear positive stiffness structure 32 can be driven to move, thereby realizing the adjustable constant force to meet different usage requirements (improving the usage flexibility). Moreover, compared with the conventional method of driving a piezoelectric ceramic (PZT) to adjust the output constant force, the adjustment process is effectively simplified, and the efficiency of constant force adjustment is greatly improved.

[0089] The above is the first embodiment of an adjustable fast constant force encapsulation and bonding mechanism provided by this application. The following is the second embodiment of an adjustable fast constant force encapsulation and bonding mechanism provided by this application. For details, please refer to Figures 2 to 11 .

[0090] Based on the solution of the first embodiment above:

[0091] Furthermore, as Figure 3 shown, two cavities 12 are sequentially arranged in the mechanism main body 1 along the first straight line direction; one end of the bonding head body 2 passes through one of the cavities 12 and extends into the other cavity 12; one of the cavities 12 is used to accommodate the linear positive stiffness structure 32; the other cavity 12 is used to accommodate the negative stiffness structure 31.

[0092] As Figure 3As shown, the mechanism main body 1 can be a box structure, with a partition beam arranged in the middle to divide the internal space into two cavities 12. The upper cavity 12 can be used to accommodate the negative stiffness structure 31, while the lower cavity 12 can be used to accommodate the linear positive stiffness structure 32.

[0093] Furthermore, as Figure 3 shown, the through hole 11 communicates with another cavity 12, including a first hole section and a second hole section coaxially connected to the first hole section; the diameter of the first hole section is larger than that of the second hole section, which is used to accommodate the head of the threaded adjusting part; the threaded section of the threaded adjusting part passes through the second hole section.

[0094] By adopting a counterbore design, the head of the threaded adjusting part can be hidden, making the overall structure more compact and with better aesthetics.

[0095] Furthermore, as Figure 2 shown, a mounting plate 7 is fixed on the mechanism main body 1. The mounting plate 7 can be detachably mounted on the front of the mechanism main body 1 through fasteners such as bolts, and specific restrictions are not made.

[0096] Similarly, the slide table mechanism 5 can be detachably mounted on the mounting plate 7 through fasteners such as bolts.

[0097] In addition, it should be noted that a spacer is provided between the mounting plate 7 and the mechanism main body 1. By setting the spacer, it is ensured that the mounting plate does not contact the linear positive stiffness structure 32 and the negative stiffness structure 31, avoiding friction and affecting the use of the linear positive stiffness structure 32 and the negative stiffness structure 31.

[0098] Furthermore, as Figure 2 and Figure 9 shown, the link mechanism 6 includes two link components; the guide heads 43 on both sides of the bonding head body 2 are respectively connected to the slide table body 51 through the link components.

[0099] The link component includes a first link 61 and a second link 62; one end of the first link 61 is rotatably connected to the slide table body 51, and the other end is rotatably connected to the guide head 43; one end of the second link 62 is rotatably connected to the first link 61 and is located between the two rotating ends of the first link 61; the other end of the second link 62 is rotatably connected to the mechanism main body 1; the rotation center lines of one ends of the two first links 61 are coaxial; the rotation center lines of the other ends of the two second links 62 are coaxial.

[0100] The rotating connection ends of the first link 61 and the second link 62 are all rotatably connected through rotating pairs. Taking the mounting plate 7 as an example, the second link 62 is rotatably mounted on the mounting plate 7.

[0101] Further, for the design of the sliding table mechanism 5, it is a design for an existing sliding table module, such as a manual sliding table. More specifically, it can be a manual lead screw sliding table, including a sliding table body 51 and a lead screw assembly 52 for adjusting the sliding table body 51.

[0102] Further, for the design of the flexible guiding mechanism 4, as Figure 2 and Figure 9 shown, it includes two guiding fixing blocks 41, at least one guiding beam 42, and a guiding head 43.

[0103] The two guiding fixing blocks 41 are fixedly spaced along the first straight line direction on the mechanism main body 1; at least one guiding beam 42 is fixed between the two guiding fixing blocks 41 along the first straight line direction; the guiding head 43 is fixed on the guiding beam 42; the connecting block 44 connects the guiding head 43 and the linear positive stiffness structure 32.

[0104] In this application, the guiding beam 42 is designed to be two, and the connecting block 44 can be detachably connected to the guiding head 43 and the linear positive stiffness structure 32 through fasteners such as bolts.

[0105] Further, as Figure 3 shown, the negative stiffness structure 31 can be an inclined beam structure, or other structures that meet the negative stiffness characteristics.

[0106] The number of the inclined beam structures in this application can be variably designed according to needs. For example, in this application, two inclined beams are respectively arranged on both sides of the bonding head body 2, and one end of the inclined beam connecting the bonding head body 2 is relatively located below the other end of the inclined beam connecting the mechanism main body 1.

[0107] Further, as Figure 3 shown, the linear positive stiffness structure 32 can be a broken line beam structure, or other structures that meet the linear positive stiffness characteristics.

[0108] Further, a number of mounting holes 13 are provided on the mechanism main body 1. The mounting holes 13 can be bolt holes, and through these mounting holes 13, the mechanism main body 1 can be mounted on other devices to play a role in mounting and fixing.

[0109] The above has introduced in detail an adjustable fast constant force encapsulation bonding mechanism provided by this application. For those of ordinary skill in the art, according to the idea of the embodiments of this application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. An adjustable fast constant force packaging bonding mechanism, characterized in that: Including institutional entities (1); A bonding head body (2) is movably mounted in the mechanism body (1) along a first straight line direction; The bonding head body (2) extends out of the mechanism body (1) at one end of the first straight line direction; The bonding head body (2) is connected to the mechanism body (1) via negative stiffness structures (31) on both sides in a second straight line direction perpendicular to the first straight line direction; The bonding head body (2) is also connected to a flexible guide mechanism (4) on both sides in the second straight line direction via a linear positive stiffness structure (32); The flexible guide mechanism (4) has a guide head (43) capable of displacement in a second linear direction; The guide head (43) is connected to the linear positive stiffness structure (32) via a connecting block (44); A slide mechanism (5) is installed on the mechanism body (1); The slide body (51) of the slide mechanism (5) is slidably adjustable along the first straight line direction; The slide body (51) is connected to the flexible guide mechanism (4) via a connecting rod mechanism (6), and is connected to the linear positive stiffness structure (32) via the connecting blocks (44) located on both sides of the bonding head body (2); The connecting rod mechanism (6) is used to convert the displacement of the slide body (51) in the first straight line direction into the displacement of the guide head (43) in the second straight line direction; The mechanism body (1) is provided with a through hole (11) along the first straight line direction; A threaded adjustment member is movably mounted on the through hole (11); The bonding head body (2) is provided with a threaded hole (21) at the other end of the first straight line direction for the threaded section of the threaded adjustment member to be inserted and threadedly matched; The threaded adjustment member is used to adjust the displacement of the bonding head body (2) in the first straight line direction by rotating itself.

2. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: Two cavities (12) are sequentially arranged in the mechanism body (1) along a first straight line direction; One end of the bonding head body (2) passes through one of the cavities (12) and extends into the other cavity (12); One of the cavities (12) is used to accommodate the linear positive stiffness structure (32); The other cavity (12) is used to accommodate the negative stiffness structure (31).

3. The adjustable fast constant force packaging bonding mechanism according to claim 2, characterized in that: The through hole (11) is connected to another cavity (12), and comprises a first hole segment and a second hole segment coaxially connected to the first hole segment; The first hole section has a diameter larger than that of the second hole section and is used to accommodate the head of the threaded adjusting member; The second hole section is for the threaded section of the threaded adjusting member to pass through.

4. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: A mounting plate (7) is fixed on the mechanism body (1); The slide mechanism (5) is mounted on the mounting plate (7).

5. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The connecting rod mechanism (6) comprises two connecting rod assemblies; The linear positive stiffness structures (32) located on both sides of the bonding head body (2) are connected to the slide body (51) via the connecting rod assembly in a one-to-one correspondence; The connecting rod assembly comprises a first connecting rod (61) and a second connecting rod (62); One end of the first connecting rod (61) is rotatably connected to the slide body (51), and the other end is rotatably connected to the guide head (43); One end of the second connecting rod (62) is rotatably connected to the first connecting rod (61) and is located between the two rotating ends of the first connecting rod (61); The other end of the second connecting rod (62) is rotatably connected to the mechanism body (1); The rotation center lines of one end of the two first connecting rods (61) are coaxial; The rotation center lines of the other ends of the two second connecting rods (62) are coaxial.

6. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The slide mechanism (5) is a manual slide.

7. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The flexible guide mechanism (4) comprises two guide fixing blocks (41), at least one guide beam (42) and a guide head (43); The two guide fixing blocks (41) are fixed on the mechanism body (1) at intervals along the first straight line direction; At least one guide beam (42) is fixed between the two guide fixing blocks (41) along the first straight line direction; The guide head (43) is fixed on the guide beam (42); The connecting block (44) connects the guide head (43) and the linear positive stiffness structure (32).

8. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The negative rigidity structure (31) is an inclined beam structure.

9. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The linear positive rigidity structure (32) is a broken line beam structure.

10. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The mechanism body (1) is provided with a plurality of mounting holes (13).

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