Carrier Base Transfer Method and Semiconductor Processing System

Abstract

The present application provides a method for transporting a carrier base and a semiconductor processing system. The semiconductor processing system includes a transfer device, a buffer chamber, a main control device, and at least two process chambers. A buffer device with an adjustable carrier area size is provided in the buffer chamber. In the method for transporting the carrier base, the main control device obtains and determines, based on the information of at least one process chamber received, the process chamber that needs to execute the step of transferring the carrier base out; the main control device controls the transfer device to transfer the carrier base in the process chamber to the buffer chamber, and the main control device obtains and controls the buffer device to adjust the size of the carrier area according to the received size information of the carrier base so as to be adapted to the size of the carrier base; the main control device controls the transfer device to place the carrier base on the buffer device with the carrier area size adjusted, so that the transfer of carrier bases of different sizes is centralized on one production line, and the same buffer device can accommodate carrier bases of different sizes, improving the storage flexibility and utilization rate of each buffer device.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a method for transporting a carrier base and a semiconductor processing system. Background Art

[0002] As an important component for carrying objects to be processed (such as wafers), the carrier base plays a key role in the semiconductor manufacturing process. After the wafer is carried on the carrier base, it is transferred into the process chamber to complete process flows such as chemical vapor deposition processes. After the process flow is completed, the carrier base or the base carrying the coated wafer needs to be transferred to the transfer chamber for caching to cool down and be prepared for subsequent use or for taking out the coated wafer.

[0003] Currently, some semiconductor processing systems are provided with multiple process chambers that can accommodate carrier bases of different sizes. Carrier bases of different sizes carry wafers of different sizes or the same size but different quantities of wafers, so as to achieve parallel processing of multiple quantities or multiple sizes of wafers in the semiconductor processing system.

[0004] In terms of caching the carrier base or the base carrying the coated wafer, the prior art usually provides multiple caching devices to separately store carrier bases of specific sizes or bases carrying coated wafers. Although this method can achieve the storage of carrier bases of different sizes, it requires a large number of caching devices, increasing the space occupancy, and there may be a situation where the transfer chamber for accommodating a carrier base of one size is idle, but for a carrier base of another size, especially when its size is smaller than the aforementioned carrier base of one size, there may be no corresponding caching device available, reducing the utilization rate of the space. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a method for transporting a carrier base and a semiconductor processing system, which can concentrate the transfer processes of carrier bases of different sizes on one production line for processing, and the same caching device can accommodate carrier bases of different sizes, improving the storage flexibility and utilization rate of each caching device.

[0006] In a first aspect, the method for transporting a carrier base provided by the present application includes:

[0007] S0. Provide a semiconductor processing system;

[0008] The semiconductor processing system at least includes a transfer device, a transfer chamber, at least two process chambers, and a main control device; a caching device for placing the carrier base and capable of adjusting the size of the loading area is provided in the transfer chamber; each process chamber contains a carrier base, and at least some of the carrier bases contained in the process chambers have different sizes. Each process chamber is provided with a vision device for obtaining the size information of the carrier base, and the main control device is communicatively connected to each process chamber, the transfer device, and the caching device;

[0009] S1. The main control device obtains information of at least one process chamber and determines, based on the obtained information, the process chamber that needs to execute the step of transferring the susceptor out;

[0010] S2. The main control device controls the transfer device to transfer the susceptor in the process chamber to the transfer chamber. The main control device obtains and controls, according to the received size information of the susceptor, the buffer device to adjust the size of the loading area to match the size of the susceptor;

[0011] S3. The main control device controls the transfer device to place the susceptor on the buffer device whose loading area size has been adjusted.

[0012] In a second aspect, the semiconductor processing system provided by the present application includes a transfer device, a transfer chamber, at least two process chambers, and a main control device; a buffer device for placing the susceptor and capable of adjusting the size of the loading area is arranged inside the transfer chamber; the sizes of the susceptors accommodated in at least some of the process chambers are different, and the main control device is communicatively connected to each process chamber, the transfer device, and the buffer device.

[0013] The semiconductor processing system provided by the present application is used to execute the foregoing susceptor transfer method.

[0014] Optionally, the buffer device includes a plurality of linear displacement mechanisms distributed radially, each linear displacement mechanism is slidably provided with a support seat, and the buffer device further includes a driving mechanism communicatively connected to the main control device and connected to each support seat.

[0015] Optionally, in step S2, the step in which the main control device obtains and controls, according to the size information of the susceptor, the buffer device to adjust the size of the loading area includes: the main control device issues a loading area size adjustment instruction to the driving mechanism according to the size information of the susceptor, and the driving mechanism drives at least one support seat to slide along the extension direction of the corresponding linear displacement mechanism in response to the loading area size adjustment instruction until the tops of the support seats enclose a loading area for placing the susceptor.

[0016] Optionally, the buffer device includes a positioning device communicatively connected to the main control device.

[0017] Optionally, in step S2, the step in which the main control device issues a loading area size adjustment instruction to the driving mechanism according to the size information of the susceptor includes: the positioning device obtains and sends the position information of each support seat to the main control device; the main control device issues a loading area size adjustment instruction to the driving mechanism according to the position information of each support seat and the size information of the susceptor.

[0018] Optionally, the main control device stores a first load lower limit threshold and a load difference subtraction threshold range. The buffer device includes a number of linear displacement mechanisms distributed radially. Each linear displacement mechanism is slidably provided with a support base. Each support base is a liftable support base and is provided with a load sensing device communicatively connected to the main control device.

[0019] Optionally, in step S3, the steps for the main control device to control the transfer device to place the load-bearing base to be transferred on the buffer device with the load-bearing area size adjusted are as follows:

[0020] S31. The main control device controls the transfer device to place the load-bearing base on the buffer device with the load-bearing area size adjusted, and enables the transfer device to maintain a holding relationship with the load-bearing base;

[0021] S32. The main control device obtains and judges according to the load values sent by each load sensing device that the load value of each support base is greater than or equal to the first load lower limit threshold, and the difference between the load values of any two support bases is within the load difference subtraction threshold range;

[0022] S33. The main control device controls the transfer device to release the holding relationship with the load-bearing base.

[0023] Optionally, the main control device also stores a second load lower limit threshold smaller than the first load lower limit threshold, and the second load lower limit threshold is not lower than 5% of the first load lower limit threshold.

[0024] Optionally, after step S31 is executed, the main control device obtains and judges according to each load value that the load values of M support bases are greater than or equal to the second load lower limit threshold and less than the first load lower limit threshold, and the load values of the remaining support bases are greater than or equal to the first load lower limit threshold. Then step S33 is executed, and then the main control device performs fine lifting and lowering adjustment on the M support bases until step S32 is satisfied.

[0025] Optionally, M is an integer greater than or equal to 1 and less than the number of support bases.

[0026] Optionally, after step S31 is executed, the main control device obtains and judges according to each received load value that the load value of at least one support base is less than the second load lower limit threshold, then controls the transfer device to carry the load-bearing base away from the transfer room, and then the main control device performs lifting and lowering adjustment on at least one support base.

[0027] Optionally, the support base includes a lifting body and a support body movably sleeved around the lifting body. Each lifting body is provided with a load sensing device. Each lifting body is communicatively connected to the main control device, and the heights of each support body are the same.

[0028] Optionally, the step of the main control device adjusting the lifting of at least one support base includes: the main control device controls the lifting of each lifting body on the buffer device until the height of each lifting body is the same as that of the corresponding support body or is received in the corresponding support body.

[0029] Optionally, at least one transfer buffer chamber is provided in the transfer chamber, the buffer device is arranged in the transfer buffer chamber, the buffer device includes a plurality of linear displacement mechanisms distributed radially, and each linear displacement mechanism is slidably provided with a liftable support base, and the main control device is communicatively connected to each support base.

[0030] Optionally, after step S3 is executed, the main control device controls each support base to rise synchronously so that each support base rises to a set upper limit position to prevent the transfer device holding the carrier base from entering the space between the upper limit position and the inner top wall of the transfer buffer chamber.

[0031] Optionally, the semiconductor processing system further includes a plurality of vision devices communicatively connected to the main control device and arranged in each process chamber.

[0032] Optionally, in step S1, the steps for the main control device to obtain and determine the process chamber that needs to execute the step of transferring out the carrier base based on the information of at least one process chamber received include: the main control device obtains the image information in the process chamber through the vision device in the process chamber; when the main control device determines that there is no carrier base accommodated in the process chamber based on the image information obtained by the vision device, it is determined that the process chamber is the process chamber that needs to transfer in the carrier base.

[0033] Optionally, the semiconductor processing system further includes a pre-processing chamber and a handling device, and the handling device is provided with a buffer device communicatively connected to the main control device.

[0034] Optionally, before executing step S1, the following steps are further included:

[0035] S01. The main control device obtains and determines the process chamber that needs to transfer in the carrier base based on the information of the transfer device or the information of at least one process chamber received;

[0036] S02. The main control device obtains and controls the buffer device provided on the handling device to adjust the size of the loading area based on the size information of the carrier base that can be accommodated in the process chamber that needs to transfer in the carrier base;

[0037] S03. Place the carrier base adapted to the size of the loading area on the handling device on the corresponding loading area;

[0038] S04. The main control device controls the handling device to transport the carrier base to the pre-processing chamber;

[0039] Compared with the prior art, the beneficial effects of the present application at least include the following.

[0040] In the method for transporting a carrier base and the semiconductor processing system of the present application, the semiconductor processing system includes a transfer device, a transfer chamber, and at least two process chambers. A buffer device for placing the carrier base and capable of adjusting the size of the loading area is provided in the transfer chamber. The sizes of the carrier bases accommodated in at least some of the process chambers are different. After the main control device determines the process chamber that needs to execute the step of transferring the carrier base out based on the information of at least one process chamber received, it controls the buffer device to correspondingly adjust the size of the loading area, and controls the transfer device to transfer the carrier base to the transfer chamber and place it on the buffer device with the adjusted loading area size, so as to integrate the transfer processes of carrier bases of different sizes on one production line, reduce the number of production lines, and reduce the space occupation and equipment cost expenditure.

[0041] At the same time, since the buffer device in the transfer chamber can adjust the size of the loading area, when facing the buffer requirements of carrier bases of different sizes, it is possible to control the buffer device to make an adaptive adjustment to the size of the loading area, improving the storage flexibility and utilization rate of the buffer device. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0043] Figure 1 It is a schematic flowchart of a method for transporting a carrier base shown in an embodiment of the present application;

[0044] Figure 2 It is a schematic diagram of the composition of a semiconductor processing system shown in an embodiment of the present application;

[0045] Figure 3 It is a schematic diagram of the structure of a process chamber shown in an embodiment of the present application;

[0046] Figure 4 It is a three-dimensional structure diagram of a buffer device shown in an embodiment of the present application;

[0047] Figure 5 For Figure 4 The top view of the buffer device shown;

[0048] Figure 6 For Figure 4 The schematic diagram of the working state where the size of the loading area of the buffer device shown becomes larger;

[0049] Figure 7 For Figure 4Schematic diagram of the working state where the size of the bearing area of the cache device shown decreases;

[0050] Figure 8 Structural diagram of a cache device with a positioning device shown in an embodiment of the present application;

[0051] Figure 9 Schematic structural diagram of a transfer chamber with multiple transfer cache chambers shown in an embodiment of the present application;

[0052] Figure 10 Top view structural diagram of a transfer chamber with multiple transfer cache chambers shown in an embodiment of the present application;

[0053] Figure 11 Schematic diagram of the working state of a semiconductor processing system with a shipping device shown in an embodiment of the present application;

[0054] Figure 12 Schematic diagram of a working state of a transfer device and a transfer chamber shown in an embodiment of the present application;

[0055] Figure 13 Another schematic diagram of the working state of a transfer device and a transfer chamber shown in an embodiment of the present application.

[0056] Reference numerals in the figure are as follows: 1, transfer device; 11, clamping device; 2, transfer chamber; 201, transfer cache chamber; 3, process chamber; 31, gas injection device; 32, heating device; 33, rotation device; 34, isolation device; 35, exhaust device; 4, vision device; 5, main control device; 6, pre-treatment chamber; 7, shipping device; 100, cache device; 101, linear displacement mechanism; 102, support base; 1021, lifting body; 1022, support body; 103, positioning device; S, bearing area; 01, bearing base; 02, wafer. Detailed implementation manners

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.

[0058] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents the selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0059] The embodiments of the present application provide a method for transporting a carrier base and a semiconductor processing system. The technical solutions of the present application will be described in detail below with reference to the accompanying drawings of the specification.

[0060] Embodiment 1

[0061] As Figure 2 shown, this embodiment provides a semiconductor processing system, including a transfer device 1, a transfer chamber 2, a process chamber 3, and a main control device 5. The number of process chambers 3 is 2. Among them, a buffer device 100 for placing a carrier base and capable of adjusting the size of the loading area is arranged inside the transfer chamber 2. The sizes of the carrier bases accommodated in at least some of the process chambers 3 are different, and the main control device 5 is communicatively connected to each of the process chambers 3, the transfer device 1, and the buffer device 100.

[0062] In the semiconductor processing system of this embodiment, a buffer device 100 with an adjustable loading area is arranged in the transfer chamber 2. Therefore, in the face of the buffer requirements for carrier bases 01 of different sizes, the size of the loading area of the buffer device 100 can be adaptively adjusted to carry carrier bases 01 of different sizes.

[0063] In one embodiment, the number of buffer devices 100 in the transfer chamber 2 is 1. When the carrier base 01 to be transferred in a process chamber 3 is transferred to the buffer device 100 and cooled to room temperature, the carrier base 01 is transferred out of the transfer chamber 2. At this time, the size of the loading area of the buffer device 100 is adapted to the carrier base 01. When a carrier base 01 to be transferred with a different size in another process chamber 3 needs to be transferred to the buffer device 100, since the loading area of the buffer device 100 can be flexibly adjusted, adjusting the size of the loading area of the buffer device 100 can enable the buffer device 100 to still be used to buffer the carrier base 01 with a different size transferred out of another process chamber 3, so that the buffer device 100 is fully utilized, and the buffering flexibility for carrier bases 01 of different sizes is improved.

[0064] In another embodiment, as Figure 2 shown, the number of buffer devices 100 in the transfer chamber 2 is multiple, which further improves the buffering capacity of the transfer chamber 2. Moreover, since the size of the loading area of the empty buffer device 100 can be adaptively adjusted according to the size of the carrier base to be transferred, the buffer device 100 has more flexible adaptability and the utilization rate is improved.

[0065] At the same time, the buffer device 100 with an adjustable loading area, in cooperation with the transfer device 1 and the main control device 5, can integrate the transfer processes of carrier bases of different sizes on one production line, reducing the number of production lines, space occupation, and equipment cost expenditure, reducing the idle rate of the buffer device 100, and improving the utilization rate.

[0066] In this embodiment, as Figure 2 shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the carrier base 01 with an adjustable clamping size. The transfer device 1 clamps the carrier base 01 through the clamping device 11 to realize the transfer of the carrier base 01. For example, the clamping device 11 may include two relatively arranged clamping arms and a driving structure. The driving structure may be one or a combination of a motor, a servo, a linear module, a cylinder, a linkage mechanism, etc. By the driving structure, the distance between the two clamping arms can be increased or decreased, changing the clamping size of the clamping device 11, so as to be suitable for clamping carrier bases of different sizes. The specific implementation means are conventional technical means in the art. In other embodiments, the transfer device 1 may also transfer the carrier base 01 in a supporting manner, and the specific implementation means are conventional technical means in the art.

[0067] Carrier bases 01 with different sizes carry wafers 02 with different sizes, or carry the same-sized wafers 02 but with different quantities. In this embodiment, as Figure 2 shown, the number of process chambers 3 is two, and the carrier bases 01 accommodated in the two process chambers 3 have different sizes respectively. In some embodiments, the number of process chambers 3 is at least two, and the sizes of the carrier bases 01 accommodated in at least some of the process chambers 3 are different, which can be specifically selected according to process requirements, facilitating the parallel processing of multiple quantities or multiple sizes of wafers 02 and improving production capacity.

[0068] In some embodiments, a vision device 4 is provided in each process chamber 3. The main control device 5 is communicatively connected to the vision device 4. The vision device 4 is used to acquire and feed back the image information in the process chamber 3 to the main control device 5, so that the main control device 5 can acquire the size information of the carrier base 01 in the process chamber 3 or determine whether there is a carrier base 01 in the process chamber 3.

[0069] In some embodiments, the vision device 4 may at least include a camera. The camera takes an image of the carrier base 01 to be transferred and sends it to the main control device 5, and the main control device 5 analyzes the image to obtain the size information of the carrier base 01. Alternatively, the vision device 4 may include a camera and a vision processing device. The vision processing device 4 has independent image processing capabilities. It can analyze the pictures taken by the camera, calculate the size information of the carrier base 01, and then send the size information of the carrier base 01 to the main control device 5.

[0070] In this embodiment, the main control device 5 may be a programmable logic controller (PLC), an industrial personal computer (IPC), a single-board computer (SBC), an embedded system, a digital signal processor (DSP), a field programmable gate array (FPGA), a microcontroller (MCU), a cloud server, etc.

[0071] In this embodiment, a load sensing device for sensing the mass of the object carried on the buffer device 100 may be provided in the transfer chamber 2, and the load sensing device is communicatively connected to the main control device 5. Among them, the main control device 5 determines whether the carrying base has been placed on the corresponding buffer device 100 in the transfer chamber 2 based on the load information fed back by the load sensing device, and can achieve stable support. Specifically, the load sensing device may be a load cell.

[0072] In this embodiment, as Figure 4 and Figure 5 shown, the buffer device 100 may include linear displacement mechanisms 101 radially distributed around a central position O, and at least one support base 102 that can slide and change its position is installed on each linear displacement mechanism 101. The buffer device 100 further includes a driving mechanism (not labeled in the figure) communicatively connected to the main control device 5, and the buffer device 100 controls the driving mechanism to work to change the position of the support base 102 on the linear displacement mechanism 101.

[0073] As Figure 5 shown, the bearing plane formed by enclosing the top surfaces of the support bases 102 on all the linear displacement mechanisms 101 is the bearing area S (this bearing area S includes at least part of the top surfaces of each support base 102). As Figure 6 shown, when the support bases 102 on all the linear displacement mechanisms 101 move away from the central position O, the size of the bearing area S becomes larger. As Figure 7 shown, when moving closer to the central position O, the size of the bearing area S becomes smaller. When the carrying base 01 is placed on the bearing area S, the top surfaces of each support base 102 are in surface contact with the bottom surface of the carrying base 01 to achieve a stable supporting effect.

[0074] In some embodiments, the main control device 5 controls the positions, movement directions, and movement distances of each support base 102 on the linear displacement mechanism 101 to be consistent, that is, each support base 102 is synchronously adjusted on the linear displacement mechanism 101.

[0075] In other embodiments, according to the size data of the carrying base 01 to be transferred, the support bases 102 that need to be adjusted are selectively adjusted, and the movement directions and movement distances of these support bases 102 are controlled, so that the enclosed bearing area S can stably support the carrying base 01.

[0076] In this embodiment, the linear displacement mechanism 101 may be a lead screw module or a timing belt module. At this time, the driving mechanism may be a servo motor that drives the lead screw module, the timing belt module, etc. to work. The driving mechanism drives the linear displacement mechanism 101 to work, so that the support base 102 installed on the linear displacement mechanism 101 is displaced to change its position.

[0077] In this embodiment, the linear displacement mechanism 101 can also be a guide rail. The support base 102 can be provided with a chute, and the support base 102 is installed on the guide rail through the cooperation of the chute and the guide rail. The driving mechanism can include a motor and a walking wheel driven by the motor. The driving mechanism is installed on the support base 102, and the walking wheel contacts the guide rail or the surface near the guide rail. By controlling the rotation of the walking wheel with the motor, the support base 102 can be made to slide along the guide rail to change its position.

[0078] In this embodiment, as Figure 8 shown, the buffer device 100 can further include a position measuring device 103. The position measuring device 103 is arranged beside each linear displacement mechanism 101 and is used to detect the position of the support base 102 on the linear displacement mechanism 101. The position measuring device 103 is communicatively connected to the main control device 5; the main control device 5 determines whether the size of the loading area is suitable for the size of the loading base to be transferred through the position signal fed back by the position measuring device 103. The position measuring device 103 can be, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0079] In this embodiment, as Figure 9 and Figure 10 shown, the transfer chamber 2 can be provided with a plurality of transfer buffer chambers 201, and a buffer device 100 can be arranged in each transfer buffer chamber 201.

[0080] In some embodiments, the number of buffer devices 100 in each transfer buffer chamber 201 is at least 2. The buffer devices 100 in the same transfer buffer chamber 201 can be arranged horizontally or vertically.

[0081] In this embodiment, as Figure 9 shown, the transfer buffer chambers 201 in the transfer chamber 2 can be arranged vertically. Alternatively, as Figure 12 shown, the transfer buffer chambers 201 in the transfer chamber 2 can be arranged in the same planar space.

[0082] Since the transfer chamber 2 has a plurality of transfer buffer chambers 201, and a buffer device 100 is arranged in each transfer buffer chamber 201, it is possible to cache loading bases 01 of multiple sizes in the same transfer chamber 2.

[0083] In this embodiment, as Figure 11 shown, the semiconductor processing system can further include a pre-processing chamber 6. After the loading base 01 that has been cleaned and purged enters the pre-processing chamber 6 to load wafers, the main control device 5 controls the transfer device 1 to transfer it to the process chamber that needs to transfer the loading base.

[0084] In some embodiments, as Figure 11As shown, the semiconductor processing system further includes a handling device 7. The handling device 7 includes a buffer device 100 with an adjustable load area, which facilitates the transfer of different-sized carrier bases to the pre-treatment chamber 6 on the same production line. The main control device 5 adjusts the load area of the buffer device 100 provided in the handling device 7 according to the size information of the carrier base required to be transferred into the process chamber 3, so as to carry the corresponding carrier base. The corresponding carrier base 01 outside the handling device 7 is placed on the load area of the buffer device 100 provided in the handling device 7 through manual or mechanical control.

[0085] In some embodiments, the pre-treatment chamber 6 can also be used to clean and purge the carrier base 01. After the carrier base 01 is cleaned and purged in the pre-treatment chamber 6, a clean wafer is placed on the carrier base 01. Since the buffer device 100 supports the carrier base 01 through the load area S, most of the surface of the carrier base 01 is exposed, improving the effect of cleaning and purging.

[0086] In some embodiments, after loading the wafer 02 on the cleaned and purged carrier base 01, the carrier base 01 can be transported into the pre-treatment chamber 6 by the handling device 7. In this case, the carrier base 01 is a base carrying the wafer 02.

[0087] In this embodiment, as Figure 12 and Figure 13 shown, the buffer device 100 of the semiconductor processing system can be configured as a liftable buffer device. For example, each support base 102 includes a lifting body 1021 and a support body 1022. The support body 1022 is movably sleeved outside the lifting body 1021 around the lifting body 1021. The support body 1022 is installed on the linear displacement mechanism 101 in a form that can slide to change its position. Each lifting body 1021 is communicatively connected to the main control device 5, and the top of the lifting body 1021 is used to support the carrier base 01. The main control device 5 controls the lifting body 1021 to perform a lifting motion relative to the support body 1022.

[0088] In some embodiments, the lifting body 1021 is provided with a load sensing device.

[0089] Embodiment 2

[0090] The embodiment of the present application provides a method for transferring a carrier base, which is implemented by using the semiconductor processing system in Embodiment 1.

[0091] Referring to Figure 1 , the method for transferring a carrier base in this embodiment at least includes:

[0092] S1. The main control device obtains and judges, based on the information of at least one process chamber received, the process chamber that needs to execute the carrier base transfer-out step;

[0093] S2. The main control device controls the transfer device to transfer the carrier base in the process chamber to the transfer chamber, and the main control device obtains and controls the buffer device to adjust the size of the loading area according to the received size information of the carrier base so as to adapt to the size of the carrier base;

[0094] S3. The main control device controls the transfer device to place the carrier base on the buffer device whose loading area size has been adjusted.

[0095] In step S1 of this embodiment, referring to Figure 2 , when the processing process of the current wafer 02 in the process chamber 3 ends, the process chamber 3 sends process information to the main control device 5 to indicate that the process flow (such as chemical vapor deposition process) of the current wafer 02 in the process chamber 3 has ended, and it is necessary to perform the step of transferring the carrier base to be transferred (i.e., the carrier base carrying the substrate and having a semiconductor material layer deposited on the substrate) to the transfer chamber 2.

[0096] Specifically, referring to Figure 2 and Figure 3 , the process chamber 3 is provided with a gas injection device 31, a heating device 32, a pressure control device (not labeled in the figure), an exhaust device 35, a rotation device 33 and an isolation device 34, all of which are communicatively connected to the main control device 5. The main control device 5 pre-stores process program information. The carrier base 01 is disposed on the rotation device 33 in the process chamber 3, the heating device 32 is disposed below the carrier base 01, the gas injection device 31 is disposed at the top of the process chamber 3 and faces the surface of the carrier base 01 carrying the substrate, and the exhaust device 35 is disposed at the bottom of the process chamber 3. The main control device 5 controls the isolation device 34 to close according to the process program information, the heating device 32 generates heat to make the temperature in the process chamber 3 meet the process temperature requirement, controls the pressure control device (not labeled in the figure) and the exhaust device (not labeled in the figure) to make the pressure in the process chamber 3 meet the process pressure requirement, controls the gas injection device 31 to provide the type, flow rate, etc. of process gas into the process chamber 3 to cause a chemical vapor deposition reaction on the surface of the substrate, and controls the rotation device 33 to drive the substrate to rotate to grow a semiconductor material layer that meets the process requirements. After the chemical vapor deposition reaction ends, the main control device 5 controls the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the process chamber 3, controls the rotation device 33 to gradually decelerate to a stop state and then move axially in the process chamber 3 to a suitable position to facilitate the subsequent transfer device 1 in the process chamber 3 to transfer the carrier base 01, and makes the pressure difference inside and outside the process chamber 3 meet the transfer requirement (such as the pressure in the process chamber 3 is the same as the pressure in the area where the transfer device 1 is located) by controlling the pressure control device and the exhaust device 35, and then controls the isolation device 34 to be in an open state.

[0097] In some embodiments, a vision device 4 may be provided in each process chamber 3. The main control device 5 is communicatively connected to the vision device 4.

[0098] After the main control device 5 receives the process information indicating that the current wafer processing in the process chamber 3 has ended and determines that the step of transferring the carrier base 01 to be transferred to the transfer chamber 2 needs to be executed, the main control device 5 obtains the base size information of the carrier base 01 to be transferred through the vision device 4 in the process chamber 3. Specifically, after the main control device 5 determines that the isolation device 34 is in the open state, it confirms that the carrier base 01 needs to be transferred out of the corresponding process chamber 3. In this case, the carrier base 01 is the carrier base carrying the coated wafer.

[0099] In some embodiments, after the main control device 5 determines that the isolation device 34 is in the open state, it can also first control the mechanism for wafer picking to enter the corresponding process chamber 3 to perform the wafer picking operation on the wafer 02, and then confirm that the carrier base 01 needs to be transferred out of the corresponding process chamber 3.

[0100] In step S2 of the carrier base transfer method of this embodiment, the main control device 5 controls the empty buffer device 100 in the transfer chamber 2 to adjust the size of the carrying area to match the size of the carrier base 01 to be transferred in the process chamber 3 based on the carrier base size information. Specifically, in some embodiments, referring to Figure 2 , the main control device 5 receives the base size information obtained and sent by the vision device 4 in the process chamber 3 and generates a control signal. The main control device 5 sends the control signal to an empty buffer device 100 in the transfer chamber 2 to adjust the size of the carrying area of the buffer device 100 to match the size of the carrier base 01 to be transferred, so that the buffer device 100 can stably carry the corresponding carrier base 01. In other embodiments, the main control device 5 pre-stores the size information of the carrier bases 01 that each process chamber 3 can accommodate, that is, the corresponding relationship between the process chamber and the carrier base size information. When the main control device 5 determines the process chamber 3 that needs to execute the step of transferring the carrier base 01 through step S1, it obtains the carrier base size information after comparison in the pre-stored corresponding relationship between the process chamber and the carrier base size information.

[0101] In one embodiment, the "adjusting the size of the carrying area of the buffer device 100 to match the size of the carrier base 01 to be transferred" means that the main control device 5 obtains the bottom surface size information of the carrier base 01 to be transferred, and adjusts the size of the carrying area S of the buffer device 100 (as Figure 5 shown) according to this size information, so that the size of the carrying area S is less than or equal to the bottom surface size of the carrier base 01 to achieve stable carrying.

[0102] In this embodiment, as Figures 4 to 7As shown, the buffer device 100 may include a number of linear displacement mechanisms 101 distributed radially, and each linear displacement mechanism 101 is slidably provided with a support base 102. The buffer device 100 further includes a driving mechanism (not shown in the figure) communicatively connected to the main control device 5. Therefore, in step S2, the steps for the main control device 5 to obtain and control the buffer device 100 to adjust the size of the bearing area according to the received size information of the bearing base 01 to be adapted to the size of the bearing base 01 include:

[0103] The main control device 5 issues a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base. The driving mechanism drives at least one support base 102 to slide along the extension direction of the corresponding linear displacement mechanism 101 in response to the bearing area size adjustment instruction until the tops of the support bases 102 enclose a bearing area for placing the bearing base.

[0104] In some embodiments, as Figure 8 shown, the buffer device 100 may include a positioning device 103 communicatively connected to the main control device 5, and a positioning device 103 is provided beside each linear displacement mechanism 101. Therefore, in step S2, the steps for the main control device 5 to issue a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base may include:

[0105] The positioning device 103 obtains and sends the position information of each support base 102 to the main control device 5;

[0106] The main control device 5 issues a bearing area size adjustment instruction to the driving mechanism according to the position information of each support base 102 and the size information of the bearing base.

[0107] In this embodiment, a load sensing device may be provided on each support base 102, and the load sensing device is communicatively connected to the main control device 5. The main control device 5 pre-stores a first load lower limit threshold and a load difference subtraction threshold range. In step S3, the steps for the main control device 5 to control the transfer device 1 to place the bearing base 01 on the buffer device 100 with the adjusted bearing area size include:

[0108] S31. The main control device 5 controls the transfer device 1 to place the bearing base 01 on the buffer device 100 with the adjusted bearing area size and maintains a holding relationship between the transfer device 1 and the bearing base 01;

[0109] S32. The main control device 5 obtains the load values sent by each load sensing device, and determines that the load values of each support base are greater than the first load lower limit threshold and the difference between any two load values is within the load difference subtraction threshold range;

[0110] S33. The main control device 5 controls the transfer device 1 to release the holding relationship with the bearing base.

[0111] In step S33 of this embodiment, after the main control device 5 controls the transfer device 1 to release the holding relationship with the carrying base, it then controls the transfer device 1 to move away from the transfer room 2.

[0112] Since each support base 102 of the buffer device 100 of this application involves height adjustment in the height direction and size adjustment of the bearing area in the plane direction, to further ensure that after the main control device 5 controls the transfer device 1 to transfer the carrying base 01 to the bearing area, the bearing area can achieve stable support for the carrying base 01. In step S31 of this application, after the main control device 5 controls the transfer device 1 to place the carrying base 01 to be transferred on the buffer device 100 with the bearing area size adjusted, the transfer device 1 also maintains the holding relationship with the carrying base 01. Equivalent to holding the carrying base 01 through the transfer device 1 to form a target bearing position relationship on the buffer device 100, and judging whether the bearing area meets the condition of stable support for the carrying base 01 in the case of S31 through step S32.

[0113] In some embodiments, the first load lower limit threshold N0 is obtained by measuring the carrying base 01 with the smallest weight carried by the buffer device 100, that is: after the carrying base 01 with the smallest weight is stably placed on the buffer device 100, the weight values carried by each support base 102.

[0114] In some embodiments, the first load lower limit threshold N0 is related to the weight of the carrying base 01 held by the transfer device 1. Corresponding relationship data of the carrying base 01 that each process chamber 3 can accommodate, its weight, and the first load lower limit threshold N0 is pre-stored in the main control device 5. After the main control device 5 judges the information of the carrying base 01 accommodated in the corresponding process chamber 3 that needs to transfer out the carrying base 01 through step S2, the first load lower limit threshold N0 is obtained from the corresponding relationship data according to this information.

[0115] In some embodiments, a load sensing device is provided on the transfer device 1, which can acquire and feedback the weight of the clamped carrying base 01 to the main control device 5. The main control device 5 acquires and obtains the corresponding first load lower limit threshold according to the weight of the carrying base 01 sent by the transfer device 1 and the pre-stored corresponding relationship data between the weight of the carrying base and the first load lower limit threshold.

[0116] To reduce or avoid the unstable center of gravity of the carrying base 01 due to the excessive height difference between the support bases 102, after the main control device 5 controls the transfer device 1 to place the carrying base 01 to be transferred on the buffer device 100 with the bearing area size adjusted through step S31 and maintains the holding relationship with the carrying base 01, step S32 is executed to judge the first load lower limit threshold and the load difference subtraction threshold range to ensure the stable center of gravity of the carrying base 01 after step S33 is executed. Specifically, refer to Figure 4, the first load lower limit thresholds of the four support bases 102 are all N0 and their heights are the same. When the load-bearing base 01 is stably supported by each support base 102, the loads borne by the support bases 102 are N1, N2, N3, and N4, and N1, N2, N3, and N4 are all greater than or equal to N0, and the difference in the load-bearing values of any two support bases, such as (N1 - N2), (N4 - N1), etc. are all within the load difference reduction threshold range, then it is considered that the load-bearing area plays a role in stably supporting the load-bearing base 01.

[0117] Furthermore, the stable support of the load-bearing base 01 by each support base 102 is the result of the combined action of each support base 102, and the bottom surface of the load-bearing base 01 is not completely flat in some cases. Therefore, it is more time-saving, safe, and reliable to judge and adjust the combined action of each support base 102 to stably support the load-bearing base 01 by the load-bearing values.

[0118] In some embodiments, the main control device 5 further stores a second lower load threshold that is less than the first lower load threshold, and the second lower load threshold is not lower than 5% of the first lower load threshold. After step S31 is completed, the main control device 5 obtains and determines, based on each load value, that the load values of the M support seats 102 are greater than or equal to the second lower load threshold and less than the first lower load threshold, and the load values of the remaining support seats 102 are greater than or equal to the first lower load threshold, then step S33 is executed. Then, the main control device 5 performs fine lifting and lowering adjustment on the M support seats 102 until step S32 is satisfied, where M is an integer greater than or equal to 1 and less than the number of support seats. Since the load values of all the support seats 102 are greater than or equal to the second lower load threshold, and the second lower load threshold is not lower than 5% of the first lower load threshold, it indicates that a load-bearing relationship is formed between each support seat 102 and the bottom surface of the load-bearing base 01. There will be no risk that the load-bearing base 01 will fall due to the mismatch between the load-bearing area and the size of the bottom surface of the load-bearing base 01 when it is placed towards the load-bearing area, or the risk of slipping due to significant unevenness after placement. In this case, only the support seats 102 with load values greater than or equal to the second lower load threshold and less than the first lower load threshold need to be adjusted. Therefore, the transfer device 1 can be made to release the holding relationship with the load-bearing base 01 through step S33. At this time, the load-bearing base 01 can be supported by each support seat and will not fall. In this case, for further facilitating the stable support of the load-bearing base 01, the main control device 5 performs fine lifting and lowering adjustment until the main control device 5 determines that the load-bearing values of the support seats 102 meet the requirements of step S32. The fine lifting and lowering adjustment can use the height of one support seat 102 with a load value greater than the first lower load threshold as the reference height, and sequentially adjust the heights of the M support seats 102 to be adjusted. In some embodiments, the height adjustment order of the support seats 102 is based on the diagonal principle. For example, taking the height of one support seat 102 (denoted as the first support seat) as the reference, the next support seat 102 to be adjusted is the support seat that is in a diagonal relationship with the first support seat. In some embodiments, during the process of fine adjustment of the target support seat 102, appropriate step-by-step control can be performed, that is, adjusting a part of the height each time, which is more conducive to the stable placement of the load-bearing base 01 without slipping during the fine adjustment process.

[0119] In some embodiments, after step S31 is completed, when the main control device 5 obtains and judges according to the load-bearing values of the support seats 102 received that the load-bearing value of at least one support seat 102 is less than the second lower load-bearing threshold, it controls the transfer device 1 to maintain the holding relationship with the bearing base 01, and controls the transfer device 1 to move away from the transfer room 2 together with the bearing base 01. Then, the main control device 5 adjusts the height of at least one support seat 102. When the main control device 5 judges that the load-bearing value of a support seat 102 is less than the second lower load-bearing threshold, it indicates that the bearing relationship between the support seat 102 and the bearing base is not strong or there is no contact relationship, which easily causes the bearing base 01 to have the risk of falling from the bearing area due to unstable support. In this case, if the bearing base 01 is placed first and then the height is directly adjusted, it is easy for the bearing base 01 to be unable to be stably supported on the bearing area.

[0120] In some embodiments, the support seat 102 includes a lifting body 1021 and a support body 1022 movably sleeved around the lifting body 1021. The heights of the support bodies 1022 are the same. Each lifting body 1021 is provided with a load-bearing sensing device, and each lifting body 1021 is communicatively connected to the main control device 5. The steps for the main control device 5 to adjust the height of at least one support seat 102 include: the main control device 5 controls the lifting of each lifting body 1021 on the buffer device 100 until the heights of the lifting bodies 1021 are the same as those of the corresponding support bodies 1022. In another embodiment, the steps for the main control device 5 to adjust the height of at least one support seat 102 include: the main control device 5 controls the lifting of each lifting body 1021 on the buffer device 100 until each lifting body 1021 is received in the corresponding support body 1022, so that the bearing base 01 can be stably supported by the support bodies 1022 with the same height. Compared with the scheme of readjusting the heights of the lifting bodies 1021 to be the same, the above control method does not need to judge whether the heights of the lifting bodies 1021 are the same, which is more time-saving for realizing the stable support of the bearing base 01.

[0121] In some embodiments, the lifting body 1021 is provided with a load-bearing sensing device. When the top surfaces of the lifting bodies 1021 are flush with the top surfaces of the corresponding support bodies 1022, the transfer device 1 holds the bearing base 01 again and places it on the bearing area surrounded by the support seats 102. The main control device 5 can also detect the load-bearing conditions of the support seats 102, so as to further judge and confirm whether the top surfaces of the lifting bodies 1021 are flush with the top surfaces of the corresponding support bodies 1022 or whether each lifting body 1021 is received in the corresponding support body 1022, so as to further ensure the judgment accuracy.

[0122] In one embodiment, as Figure 9 or Figure 10As shown, at least one transfer buffer chamber 201 is provided in the transfer chamber 2, and the buffer device 100 is arranged in the transfer buffer chamber 201. As Figure 12 and Figure 13 shown, after step S3 is completed, the main control device 5 controls each support base 102 to rise synchronously so that each support base 102 rises to the set upper limit position to prevent the transfer device 1 holding the carrier base 01 from entering the space between the upper limit position and the inner top wall of the transfer buffer chamber 201.

[0123] Among them, as Figure 13 shown, after each support base 102 rises synchronously to the set upper limit position, the height of the empty space above the carrier base 01 can prevent the transfer device 1 holding another carrier base 01 from entering again, thereby preventing the problem of stacked trays that occurs when the transfer device 1 holds another carrier base 01 and enters this empty space and stacks the held carrier base 01 on the carrier base 01 already placed in the loading area.

[0124] In this embodiment, as Figure 2 shown, the transfer device 1 may include a clamping device 11 for clamping the side wall of the carrier base 01 and having an adjustable clamping size. Therefore, in step S3, the step in which the main control device 5 controls the transfer device 1 to transfer the carrier base in the process chamber 3 to the transfer chamber 2 may include: the main control device 5 obtains and controls the clamping device 11 to adjust the clamping size to match the size of the carrier base 01 to be transferred according to the received size information of the carrier base, and then controls the clamping device 11 to clamp the carrier base 01 to be transferred and transfer it to the transfer chamber 2.

[0125] In this embodiment, as Figure 11 shown, the semiconductor processing system may further include a pre-processing chamber 6 and a consignment device 7, and the consignment device 7 is provided with a buffer device 100.

[0126] In some embodiments, the pre-processing chamber 6, the transfer chamber 2 and the process chamber 3 are arranged around the transfer device 1.

[0127] In some embodiments, before performing step S1, the following steps are further included:

[0128] S01. The main control device 5 obtains and judges the process chamber 3 that needs to transfer the carrier base 01 according to the received information of the transfer device 1 or the information of at least one process chamber 3;

[0129] S02. The main control device 5 obtains and controls the buffer device 100 provided in the consignment device 7 to adjust the size of the corresponding loading area according to the received size information of the carrier base that can be accommodated by a process chamber to be transferred.

[0130] S03. Place the bearing base 01 adapted to the size of the bearing area on the transfer device on the corresponding bearing area;

[0131] S04. The main control device 5 controls the transfer device 7 to transport the bearing base 01 to the pre-treatment chamber 6.

[0132] In some embodiments, after step S04 is completed, place the wafer on the bearing base 01 in the pre-treatment chamber 6, and then the main control device 5 controls the transfer device 1 to transfer the bearing base 01 loaded with the wafer to the corresponding process chamber 3.

[0133] In some more specific embodiments, the transfer device 7 is a movable tray, such as a tray provided with a robotic arm.

[0134] In some specific embodiments, the pre-treatment chamber 6 is a glove box.

[0135] In step S01 of some embodiments, after the main control device 5 controls the transfer device 1 to move the bearing base 01 in the process chamber 3 out of the process chamber 3, it will receive the corresponding information fed back by the transfer device 1. The main control device 5 judges that the process chamber 3 needs to transfer in the bearing base 01 according to the corresponding information fed back by the transfer device 1.

[0136] In some embodiments, each process chamber 3 is provided with a vision device 4. In step S01, the main control device 5 judges the process chamber 3 that needs to transfer in the bearing base 01 according to the information sent by the vision device 4 of each process chamber 3. Specifically, after the transfer device 1 transfers the bearing base in the process chamber 3 out, the main control device 5 obtains the image information in the process chamber 3 through the vision device 4 in the process chamber 3; when the main control device 5 judges that there is no bearing base accommodated in the process chamber 3 according to the image information obtained by the vision device 4, it judges that the process chamber 3 is the process chamber 3 that needs to transfer in the bearing base.

[0137] In some embodiments, the main control device 5 can judge the process chamber 3 that needs to transfer in the bearing base 01 according to the time node when controlling the gas injection device 31 to inject an inert purge gas (such as nitrogen) into the corresponding process chamber 3 and controlling the rotation device 33 to gradually decelerate to a stop state and then move axially in the process chamber 3 to a suitable position, or according to the time node when controlling the pressure control device and the exhaust device 35 to make the pressure difference inside and outside the process chamber 3 meet the transfer requirements, that is, in the case where the bearing base 01 in the process chamber 3 has not been transferred out, judging in advance according to the process rhythm that the process chamber 3 needs to transfer in other bearing bases 01 later can make the time node of the subsequent execution of transferring the bearing base 01 out of the process chamber 3 coincide with or be not much different from the time node when the aforementioned S04 is completed, improving the efficiency. The specific judgment node can be reasonably set according to the efficiency requirements of the process for processing different batches of materials.

[0138] In step S02 of some embodiments, the main control device 5 pre-stores the size information of the susceptor 01 that each process chamber 3 can accommodate, that is, the corresponding relationship between the process chamber and the susceptor size information. After the main control device 5 determines the process chamber 3 that needs to transfer the susceptor 01 through step S01, the corresponding susceptor size information is obtained after comparison in the pre-stored corresponding relationship between the process chamber and the susceptor size information.

[0139] In step S03 of some embodiments, the main control device 5 controls the transfer device 1 to place the susceptor 01 to be transferred on the buffer device 100 whose load area size has been adjusted by the consignment device 7. The transfer device 1 that executes step S03 and the transfer device 1 that executes steps S2 and S3 can be the same transfer device or different transfer devices. The specific selection is necessary for the efficiency of the semiconductor processing system production line.

[0140] In step S04 of some embodiments, the main control device 5 controls the consignment device 7 to carry the susceptor 01 into the pre-treatment chamber 6.

[0141] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for conveying a bearing base, characterized in that: include: S0. Provide semiconductor processing system; The semiconductor processing system comprises at least a transfer device, a transfer chamber, at least two process chambers and a main control device; The transfer chamber is provided with a cache device for placing a bearing base and having an adjustable bearing area size; each of the process chambers contains a bearing base, and at least some of the process chambers contain bearing bases of different sizes, and the main control device is connected to each of the process chambers, the transfer device, and the cache device for communication; S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber; S2, the main control device controls the transfer device to transfer the carrying base in the process chamber to the transfer chamber, and the main control device obtains and controls the cache device to adjust the size of the carrying area to match the size of the carrying base according to the received size information of the carrying base; S3, the main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted; The main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range, and the cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, each of the support seats is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device; In step S3, the main control device controls the transfer device to place the bearing base on the cache device with the bearing area size adjusted, including: S31, the main control device controls the transfer device to place the carrying base on the cache device with the adjusted carrying area size, and enables the transfer device to maintain a holding relationship with the carrying base; S32, the main control device obtains and determines, based on the load-bearing values ​​sent by each load-bearing sensor device, that the load-bearing value of each support seat is greater than or equal to the first load-bearing lower limit threshold, and the difference between the load-bearing values ​​of any two support seats is within the range of the load-bearing difference minus the threshold; S33, the main control device controls the transfer device to release the holding relationship with the carrying base.

2. The method for transporting a carrier base according to claim 1, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats; In step S2, the main control device acquires and controls the cache device to adjust the size of the bearing area to match the size of the bearing base according to the received size information of the bearing base, including: The main control device sends a bearing area size adjustment instruction to the driving mechanism based on the size information of the bearing base. In response to the bearing area size adjustment instruction, the driving mechanism drives at least one of the support seats to slide along the extension direction corresponding to the linear displacement mechanism until the top of each support seat forms a bearing area for placing the bearing base.

3. The method for transporting a bearing base according to claim 2, characterized in that: The cache device includes a positioning device that is communicatively connected to the main control device; In step S2, the main control device sends a bearing area size adjustment instruction to the driving mechanism according to the size information of the bearing base, including: The positioning device obtains and sends the position information of each support seat to the main control device; The main control device sends the bearing area size adjustment instruction to the driving mechanism according to the position information of each of the support seats and the size information of the bearing base.

4. The method for transporting a carrier base according to claim 1, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on each of the load-bearing values, that the load-bearing values ​​of the M support seats are greater than or equal to the second load-bearing lower limit threshold and less than the first load-bearing lower limit threshold, and the load-bearing values ​​of the remaining support seats are greater than or equal to the first load-bearing lower limit threshold, and executes the step S33. Then the main control device performs micro-motion lifting and lowering adjustments on the M support seats until the step S32 is satisfied; wherein M is an integer greater than or equal to 1 and less than the number of support seats.

5. The method for transporting a carrier base according to claim 1, characterized in that: The main control device further stores a second load-bearing lower limit threshold value which is less than the first load-bearing lower limit threshold value, and the second load-bearing lower limit threshold value is not less than 5% of the first load-bearing lower limit threshold value; After the step S31 is executed, the main control device obtains and determines, based on the received load-bearing values, that the load-bearing value of at least one of the support seats is less than the second load-bearing lower limit threshold, and then controls the transfer device to carry the supporting base away from the transfer room, and then the main control device raises and lowers at least one of the support seats.

6. The method for transporting a carrier base according to claim 5, characterized in that: The support seat comprises a lifting body and a supporting body movably mounted around the lifting body, the heights of the supporting bodies are consistent, each lifting body is provided with the load-bearing sensor device, and each lifting body is connected to the main control device for communication; The step of the main control device adjusting the lifting and lowering of at least one of the support bases comprises: The main control device controls the lifting of each lifting body on the cache device until each lifting body is consistent in height with the corresponding supporting body or is accommodated in the corresponding supporting body.

7. The method for transporting a carrier base according to claim 1, characterized in that: At least one transfer cache cavity is arranged in the transfer chamber, the cache device is arranged in the transfer cache cavity, the cache device comprises a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a liftable support seat, and the main control device is communicatively connected to each of the support seats; After step S3 is executed, the main control device controls each of the support bases to rise synchronously so that each of the support bases rises to a set upper limit position to prevent the transfer device holding the supporting base from entering the space between the upper limit position and the inner top wall of the transfer cache cavity.

8. The method for transporting a carrier base according to claim 1, characterized in that: The semiconductor processing system further includes a pre-processing chamber and a shipping device, wherein the shipping device is provided with the cache device which is communicatively connected to the main control device; Before executing step S1, the following steps are also included: S01, the main control device obtains and determines the process chamber that needs to be transferred to the supporting base according to the received information of the transfer device or the information of at least one of the process chambers; S02, the main control device obtains and controls the buffer device provided in the shipping device to adjust the size of the corresponding carrying area according to the size information of the carrying base that can be accommodated by the process chamber to which the carrying base is to be transferred; S03, placing the bearing base matched with the size of the bearing area on the shipping device on the corresponding bearing area; S04: The main control device controls the shipping device to transport the supporting base into the pre-processing chamber.

9. The method for transporting a carrier base according to claim 1, characterized in that: Also included are a plurality of visual devices that are communicatively connected to the main control device and are disposed in each of the process chambers; In step S1, the main control device obtains and determines the process chamber that needs to perform the step of transferring the carrier base out through the received information of at least one process chamber, including: The main control device acquires image information in the process chamber through the visual device in the process chamber; When the main control device determines that the process chamber does not contain a carrier base based on the image information obtained by the visual device, the main control device determines that the process chamber is the process chamber that needs to be transferred into the carrier base.

10. A semiconductor processing system, characterized in that: The semiconductor processing system comprises a transfer device, a transfer chamber, at least two process chambers and a main control device; a cache device for placing a bearing base and having an adjustable bearing area size is arranged inside the transfer chamber; the bearing bases accommodated in at least some of the process chambers have different sizes, and the main control device is in communication connection with each of the process chambers, the transfer device and the cache device; The main control device stores a first load-bearing lower limit threshold and a load-bearing difference threshold range. The cache device includes a plurality of radially distributed linear displacement mechanisms. Each of the linear displacement mechanisms is slidably provided with a support seat. Each of the support seats is a liftable support seat and is provided with a load-bearing sensor device that is communicatively connected to the main control device.

11. The semiconductor processing system according to claim 10, characterized in that: The cache device includes a plurality of linear displacement mechanisms distributed radially, each of the linear displacement mechanisms is slidably provided with a support seat, and the cache device also includes a driving mechanism that is communicatively connected to the main control device and connected to each of the support seats.

12. The semiconductor processing system according to claim 10, wherein: The cache device includes a positioning device that is communicatively connected to the main control device.

13. The semiconductor processing system according to claim 10, wherein: Each of the process chambers is provided with a visual device that is communicatively connected to the main control device.

14. The semiconductor processing system according to claim 11, wherein: The support seat includes a lifting body and a supporting body movably mounted around the lifting body. Each lifting body is provided with a load-bearing sensor device, and each lifting body is communicatively connected with the main control device.

15. The semiconductor processing system according to claim 10, wherein: It also includes at least one shipping device, which is provided with at least one cache device that is communicatively connected to the main control device.

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