Electronic equipment

By setting a snap structure between the laser focus assembly of the electronic device and the camera decorative circle to limit their spacing, the problem that changes in the distance between the laser lamp and the camera lens affect the laser focus performance, and higher laser focus performance and photo quality are achieved.

CN119562155AActive Publication Date: 2025-03-04VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
CN202411695355.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-25
Publication Date
2025-03-04
Estimated Expiration
2044-11-25

AI Technical Summary

Technical Problem

Among existing electronic devices, the distance between the laser lamp and the camera lens varies greatly, affecting the laser focus performance of the electronic devices.

Method used

By providing at least one first snap and a second snap between the laser focus assembly and the camera decorative ring and fitting each second snap to a first snap, the distance between the laser focus assembly and the camera decorative ring is limited to ensure that it is within a reasonable range.

Benefits of technology

By limiting the distance between the laser focus component and the camera decorative circle, the laser focus performance of electronic devices is improved, ensuring higher quality of the photos taken.

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Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a laser focusing assembly and a camera decoration ring which are arranged in a spaced mode, at least one first buckle is arranged on the side, close to the camera decoration ring, of the laser focusing assembly, at least one second buckle is arranged on the side, close to the laser focusing assembly, of the camera decoration ring, and the first buckle and the second buckle are arranged on the side, close to the laser focusing assembly, of the camera decoration ring. And each second buckle is buckled with one first buckle.
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Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In order to improve the photo quality of electronic devices, a laser focus component can be installed in the electronic device. The laser focus component detects the distance between the camera of the electronic device and the object to be photographed, so that the camera can focus accurately, thereby taking higher quality photos.

[0003] The laser focusing component includes a laser lamp. The emitting end of the laser lamp emits a light beam, which passes through the emitting hole on the camera lens and reaches the object being photographed. After being reflected by the object, the reflected light beam passes through the receiving hole of the camera lens and reaches the receiving end of the laser lamp.

[0004] However, in existing electronic devices, the laser light is usually connected to the mainboard bracket, and the camera lens is connected to the battery cover assembly, which causes a large change in the distance between the laser light and the camera lens, affecting the laser focusing performance of the electronic device. Summary of the invention

[0005] The present application discloses an electronic device to solve or at least partially solve the problem in the prior art that the distance between the laser light and the camera lens varies greatly, affecting the laser focusing performance of the electronic device.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] The present application discloses an electronic device, which includes a laser focusing assembly and a camera decorative ring arranged at intervals, wherein at least one first buckle is provided on a side of the laser focusing assembly close to the camera decorative ring, and at least one second buckle is provided on a side of the camera decorative ring close to the laser focusing assembly, and each of the second buckles is buckled with one of the first buckles.

[0008] The electronic device disclosed in the present application includes a laser focus assembly and a camera decorative ring, the laser focus assembly and the camera decorative ring are arranged at intervals, at least one first buckle is arranged on a side of the laser focus assembly close to the camera decorative ring, at least one second buckle is arranged on a side of the camera decorative ring close to the laser focus assembly, and each second buckle is buckled with a first buckle. The distance between the laser focus assembly and the camera decorative ring is limited by the second buckle and the first buckle to ensure that the distance between the laser focus assembly and the camera decorative ring is within a reasonable range, thereby improving the laser focus performance of the electronic device.

[0009] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 Indicates the explosion of the electronic device described in the embodiment of the present application Figure 1 ;

[0012] Figure 2 A rear view of the electronic device according to an embodiment of the present application is shown;

[0013] Figure 3 express Figure 2 A cross-sectional view of the electronic device at AA;

[0014] Figure 4 express Figure 3 The enlarged view of point B in the middle;

[0015] Figure 5 Indicates the explosion of the electronic device described in the embodiment of the present application Figure 2 ;

[0016] Figure 6 A schematic diagram showing the structure of the first bracket in an embodiment of the present application;

[0017] Figure 7 A top view of the first bracket in an embodiment of the present application is shown;

[0018] Figure 8 It shows a front view of the first bracket in the embodiment of the present application;

[0019] Fig. 9 A side view of the first bracket in an embodiment of the present application is shown;

[0020] Fig.10 express Figure 5 A partial enlarged view of the electronic device at position C;

[0021] Fig.11 A schematic diagram showing a partial structure of an electronic device described in an embodiment of the present application;

[0022] Fig.12 express Fig.10 A partial enlarged view of the electronic device at F;

[0023] Fig.13 express Fig.10 A cross-sectional view of the electronic device at DD;

[0024] Fig.14 express Fig.10 A cross-sectional view of the electronic device at the EE;

[0025] Fig.15 A schematic diagram showing a partial structure of an electronic device before the battery cover is removed;

[0026] Fig.16 A schematic diagram showing the partial structure of an electronic device after the battery cover is removed.

[0027] Reference numerals:

[0028] 10: laser focus assembly; 11: first bracket; 111: first buckle; 111a: first chamfer; 112: first groove; 113: positioning column; 12: laser lamp assembly; 121: first positioning hole; 122: flexible circuit board; 123: laser lamp; 124: flexible circuit board reinforcement; 125: reinforcement double-sided adhesive; 126: first adhesive layer;

[0029] 20: camera decorative ring; 21: second buckle; 211: second chamfer; 22: second positioning hole; 23: camera lens; 231: transmitting hole; 232: receiving hole;

[0030] 30: mainboard bracket; 31: second groove; 32: third buckle; 33: blocking portion;

[0031] 40: battery cover;

[0032] 50: frame;

[0033] L1: first gap; L2: second gap; L3: first distance; L4: second distance. DETAILED DESCRIPTION

[0034] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0035] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0036] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] like Figures 1 to 16 As shown, an embodiment of the present application discloses an electronic device, which includes a laser focusing assembly 10 and a camera decorative ring 20 that are arranged at intervals, wherein at least one first buckle 111 is provided on a side of the laser focusing assembly 10 close to the camera decorative ring 20, and at least one second buckle 21 is provided on a side of the camera decorative ring 20 close to the laser focusing assembly 10, and each second buckle 21 is buckled with a first buckle 111.

[0039] The embodiment of the present application discloses an electronic device, which can be a mobile phone, a tablet computer, or other electronic devices. In the embodiment of the present application, there are no excessive restrictions on the specific type of the electronic device, and any electronic device with a camera function can be used.

[0040] The following will take a mobile phone as an example to explain the present application.

[0041] like Figures 1 to 16 As shown, the electronic device disclosed in the embodiment of the present application includes a laser focus assembly 10 and a camera decorative ring 20, and the laser focus assembly 10 and the camera decorative ring 20 are arranged at intervals. Exemplarily, along the thickness direction of the electronic device, the laser focus assembly 10 and the camera decorative ring 20 are arranged at intervals.

[0042] It should be noted that the laser focusing assembly 10 in the embodiment of the present application includes a laser lamp 123, and the camera decorative ring 20 includes a camera lens 23. It can be understood that the laser lamp 123 and the camera lens 23 are spaced apart along the thickness direction of the electronic device. The laser lamp 123 has a transmitting end and a receiving end, and the transmitting end and the receiving end are spaced apart on the laser focusing assembly 10. The camera lens 23 is provided with a transmitting hole 231 and a receiving hole 232, and the transmitting hole 231 and the transmitting end are arranged opposite to each other, and the receiving hole 232 and the receiving end are arranged opposite to each other. Among them, the light beam emitted by the transmitting end can pass through the transmitting hole 231 to reach the surface of the photographed object, and after being reflected by the photographed object, the emitted light beam passes through the receiving hole 232 to reach the receiving end.

[0043] In the embodiment of the present application, at least one first buckle 111 is provided on the side of the laser focus assembly 10 close to the camera decorative ring 20, and at least one second buckle 21 is provided on the side of the camera decorative ring 20 close to the laser focus assembly 10, and each second buckle 21 is buckled into a first buckle 111. The gap between the laser focus assembly 10 and the camera decorative ring 20 is limited by the first buckle 111 and the second buckle 21, so as to ensure the size of the gap between the laser focus assembly 10 and the camera decorative ring 20, thereby improving the laser focus performance of the electronic device.

[0044] Exemplarily, the gap between the transmitting end and the transmitting hole 231 and the gap between the receiving end and the receiving hole 232 can be limited by the first buckle 111 and the second buckle 21, so that the gap between the transmitting end and the transmitting hole 231 and the gap between the receiving end and the receiving hole 232 are greater than or equal to 0.2 mm and less than or equal to 0.6 mm. For example, the gap between the transmitting end and the transmitting hole 231 is 0.3 mm, and the gap between the receiving end and the receiving hole 232 is 0.3 mm.

[0045] It should be noted that, in the embodiment of the present application, there is no limitation on the number of the first buckle 111 and the second buckle 21. In actual applications, technicians can set the number of the first buckle 111 and the second buckle 21 as needed.

[0046] Exemplarily, the first buckle 111 may include two, the two first buckles 111 are spaced apart on the side of the laser focusing assembly 10 close to the camera decorative ring 20, and the second buckle 21 also includes two, the two second buckles 21 are spaced apart on the side of the camera decorative ring 20 close to the laser focusing assembly 10, and each second buckle 21 is arranged corresponding to a first buckle 111 so that each second buckle 21 can be buckled into a first buckle 111.

[0047] When the electronic device is a mobile phone, the camera decorative ring 20 is installed on the battery cover 40 of the mobile phone. During the installation of the electronic device, the battery cover 40 can be pressed down to make the second buckle 21 buckle with the corresponding first buckle 111, so that the camera decorative ring 20 is connected to the laser focus assembly 10, and the distance between the camera decorative ring 20 and the laser focus assembly 10 can be limited by the second buckle 21 and the first buckle 111.

[0048] The electronic device disclosed in the embodiment of the present application includes a laser focus assembly 10 and a camera decorative ring 20, which are arranged at intervals, and at least one first buckle 111 is arranged on the side of the laser focus assembly 10 close to the camera decorative ring 20, and at least one second buckle 21 is arranged on the side of the camera decorative ring 20 close to the laser focus assembly 10, and each second buckle 21 is buckled with a first buckle 111. The distance between the laser focus assembly 10 and the camera decorative ring 20 is limited by the second buckle 21 and the first buckle 111 to ensure that the distance between the laser focus assembly 10 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focus performance of the electronic device.

[0049] Alternatively, if Figures 5 to 9 As shown, the laser focusing assembly 10 in the embodiment of the present application includes a first bracket 11 and a laser light assembly 12, wherein a first groove 112 is provided on the first bracket 11, and the laser light assembly 12 is embedded in the first groove 112; the first buckle 111 is provided on a side of the first bracket 11 close to the camera decorative ring 20.

[0050] like Figures 5 to 9 As shown, the laser focusing assembly 10 in the embodiment of the present application includes a first bracket 11 and a laser light assembly 12. The first bracket 11 is also called a laser light bracket, and the first bracket 11 is used to support the laser light assembly 12. The first bracket 11 is provided with a first groove 112, and the laser light assembly 12 is embedded in the first groove 112.

[0051] Exemplarily, the laser light assembly 12 in the embodiment of the present application may include a flexible circuit board 122 and a laser light 123. Among them, a flexible circuit board reinforcement 124 is connected to the bottom of the flexible circuit board 122, and the strength of the flexible circuit board 122 is improved by the flexible circuit board reinforcement 124. The flexible circuit board reinforcement 124 is bonded to the first groove 112 of the first bracket 11 through a reinforcing double-sided adhesive 125 to fix the flexible circuit board 122 and the first bracket 11 together, and the flexible circuit board 122 is supported by the first bracket 11. The laser light 123 is connected to the top of the flexible circuit board 122, that is, the laser light 123 is connected to the side of the flexible circuit board 122 away from the first bracket 11, so that the laser light 123 is located on the side close to the camera decorative ring 20.

[0052] It should be noted that the first bracket 11 in the embodiment of the present application can be made of plastic material or other materials. In the embodiment of the present application, there are no excessive restrictions on the specific material of the first bracket 11. In actual applications, technicians can choose according to needs.

[0053] The laser focusing assembly 10 in the embodiment of the present application includes a first bracket 11 and a laser light assembly 12. A first groove 112 is provided in the first bracket 11, and the laser light assembly 12 is embedded in the first groove 112 to fix and support the laser light assembly 12 through the first bracket 11.

[0054] Furthermore, in the embodiment of the present application, a first buckle 111 is provided on one side of the first bracket 11 close to the camera decorative ring 20, and the first buckle 111 is buckled with the second buckle 21. The distance between the laser light assembly 12 and the camera decorative ring 20 is limited by the second buckle 21 and the first buckle 111 to ensure that the distance between the laser light assembly 12 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focusing performance of the electronic device.

[0055] Alternatively, if Figures 5 to 14 As shown, in the embodiment of the present application, at least one positioning column 113 is provided on the first bracket 11, at least one first positioning hole 121 is provided on the laser light assembly 12, and at least one second positioning hole 22 is provided on the camera decorative ring 20; the positioning column 113 is passed through the first positioning hole 121, and at least partially passed through the second positioning hole 22.

[0056] like Figures 5 to 14 As shown, in the embodiment of the present application, at least one positioning column 113 is provided on the first bracket 11, at least one first positioning hole 121 is provided on the laser light assembly 12, and at least one second positioning hole 22 is provided on the camera decorative ring 20. In addition, one positioning column 113 is provided corresponding to one first positioning hole 121 and one second positioning hole 22. One positioning column 113 is inserted into the corresponding first positioning hole 121, and at least partially inserted into the corresponding second positioning hole 22. The relative positions of the first bracket 11, the laser light assembly 12, and the camera decorative ring 20 are fixed by the positioning column 113, the first positioning hole 121, and the second positioning hole 22, so as to buckle the first buckle 111 with the second buckle 21.

[0057] For example, two positioning posts 113 may be provided on one side of the first bracket 11 close to the camera decorative ring 20, and the two positioning posts 113 are arranged at intervals. Two first positioning holes 121 are provided on the laser light assembly 12, and each first positioning hole 121 is provided corresponding to a positioning post 113. Two second positioning holes 22 are provided on the camera decorative ring 20, and each second positioning hole 22 is provided corresponding to a first positioning hole 121. Each positioning post 113 can be inserted into the corresponding first positioning hole 121 and the corresponding second positioning hole 22.

[0058] It should be noted that in the embodiment of the present application, there is no limitation on the specific number of the positioning posts 113, the first positioning holes 121 and the second positioning holes 22. In actual applications, technicians can set the specific number of the positioning posts 113, the first positioning holes 121 and the second positioning holes 22 as needed.

[0059] Optionally, the positioning column 113, the first buckle 111 and the first bracket 11 in the embodiment of the present application are integrally formed. By integrally forming the positioning column 113, the first buckle 111 and the first bracket 11, it is helpful to improve the reliability of the first bracket 11. Furthermore, through the above configuration, the production process of the first bracket 11 can also be simplified, and the production cost of the first bracket 11 can be reduced.

[0060] It should be noted that the positioning column 113, the first buckle 111 and the first bracket 11 in the embodiment of the present application can be integrally formed by injection molding. Of course, other methods can also be used to integrally form the positioning column 113, the first buckle 111 and the first bracket 11. This application does not make specific restrictions on this. In actual applications, technicians can choose according to needs.

[0061] Optionally, the first buckle 111 in the embodiment of the present application includes a plurality of first buckles 111 , which are spaced around the first groove 112 ; the second buckle 21 also includes a plurality of second buckles 21 , and each second buckle 21 is disposed opposite to a first buckle 111 .

[0062] In the embodiment of the present application, a plurality of first buckles 111 may be arranged at intervals around the first groove 112. Exemplarily, the first groove 112 may be a square groove, and four first buckles 111 may be arranged, each of which is arranged at a position close to one side of the first groove 112. The number of second buckles 21 arranged is the same as that of the first buckles 111, so that each first buckle 111 can be buckled with a second buckle 21, and the distance between the laser focus assembly 10 and the camera decorative ring 20 is limited by the plurality of second buckles 21 and the plurality of first buckles 111, so as to ensure that the distance between the laser focus assembly 10 and the camera decorative ring 20 is within a reasonable range, thereby improving the laser focus performance of the electronic device.

[0063] Optionally, the laser light assembly 12 in the embodiment of the present application includes a flexible circuit board 122 and a laser light 123 , the flexible circuit board 122 is at least partially embedded in the first groove 112 , and the laser light 123 is connected to a side of the flexible circuit board 122 close to the camera decorative ring 20 .

[0064] The laser light assembly 12 in the embodiment of the present application includes a flexible circuit board 122 and a laser light 123. The flexible circuit board 122 is embedded in the first groove 112 of the first bracket 11, and the laser light 123 is connected to the side of the flexible circuit board 122 close to the camera decorative ring 20 so as to fix the flexible circuit board 122 and the laser light 123 through the first bracket 11.

[0065] It should be noted that if Fig.12 As shown, the first positioning hole 121 in the embodiment of the present application is set on the flexible circuit board 122, and the first positioning hole 121 and the laser light 123 are staggered to avoid interference between the positioning column 113 and the laser light 123 after passing through the first positioning hole 121.

[0066] Optionally, in the embodiment of the present application, a first chamfer 111 a is provided on the first buckle 111 , and a second chamfer 211 is provided on the second buckle 21 , and the second chamfer 211 is snap-fitted with the first chamfer 111 a .

[0067] In the embodiment of the present application, a first chamfer 111a is provided on the first buckle 111, and a second chamfer 211 is provided on the second buckle 21, and the second chamfer 211 and the first chamfer 111a are engaged with each other. The second chamfer 211 and the first chamfer 111a are provided to facilitate the disassembly and assembly between the first buckle 111 and the second buckle 21.

[0068] It should be noted that the first chamfer 111a in the embodiment of the present application can be a circular chamfer or other types of chamfers. Similarly, the second chamfer 211 in the embodiment of the present application can be a circular chamfer or other types of chamfers. In the embodiment of the present application, there are no excessive restrictions on the specific types of the first chamfer 111a and the second chamfer 211. In actual applications, technicians can set them as needed.

[0069] Alternatively, if Figure 5 and Fig.10 As shown, the electronic device disclosed in the embodiment of the present application further includes a mainboard bracket 30 , wherein a second groove 31 is provided on the mainboard bracket 30 , and the first bracket 11 is embedded in the second groove 31 .

[0070] like Figure 5 and Fig.10As shown, the electronic device disclosed in the embodiment of the present application further includes a mainboard bracket 30, which is installed in the frame 50 of the electronic device and connected to the frame 50 of the electronic device. Along the thickness direction of the electronic device, the mainboard bracket 30, the laser focus assembly 10 and the camera decorative ring 20 are arranged in sequence, and a second groove 31 is provided on one side of the mainboard bracket 30 close to the laser focus assembly 10, and the first bracket 11 of the laser focus assembly 10 is embedded in the second groove 31, so as to position and fix the first bracket 11 of the laser focus assembly 10 through the mainboard bracket 10.

[0071] Illustratively, in the embodiment of the present application, the first bracket 11 can be adhered to the bottom wall of the second groove 31 by double-sided tape.

[0072] Of course, the above is only an individual implementation of the first bracket 11 of the laser focusing assembly 10 connected to the second groove 31, and is not intended to be a limitation of the embodiments of the present application. In actual applications, technicians can also set the specific method of connecting the first bracket 11 of the laser focusing assembly 10 to the second groove 31 as needed.

[0073] Optionally, the electronic device disclosed in the embodiment of the present application also includes a first adhesive layer 126, which is bonded between the second groove 31 and the first bracket 11, wherein the bonding force of the first adhesive layer 126 bonded to one side of the second groove 31 is less than the bonding force of the first adhesive layer 126 bonded to one side of the first bracket 11.

[0074] The first adhesive layer 126 in the embodiment of the present application has a first surface and a second surface that are arranged opposite to each other, and the first adhesive layer 126 is bonded to the second groove 31 and the first bracket 11. The first surface of the first adhesive layer 126 is bonded to the second groove 31, and the second surface of the first adhesive layer 126 is bonded to the first bracket 11.

[0075] The first adhesive layer 126 in the embodiment of the present application is a strong and weak double-sided adhesive, and the bonding strength of the first surface is less than the bonding strength of the second surface. That is to say, the second surface with stronger bonding force in the strong and weak double-sided adhesive is bonded to the first bracket 11, and the first surface with weaker bonding force is bonded to the second groove 31. Through the above arrangement, the first buckle 111 can overcome the bonding force of the first adhesive layer 126 and smoothly snap on the second buckle 21. Furthermore, through the above arrangement, during the disassembly and assembly of the electronic device, opening the battery cover 40 will not take away the laser focus assembly 10, so as to facilitate the disassembly and assembly of the electronic device. Optionally, as Figures 14 to 16 As shown, in the embodiment of the present application, at least one third buckle 32 is arranged at a position of the mainboard bracket 30 close to the second groove 31 , and the third buckle 32 is arranged on a side of the mainboard bracket 30 close to the camera decorative ring 20 , and the third buckle 32 is used to buckle with the laser focusing assembly 10 .

[0076] like Figures 14 to 16 As shown, in the embodiment of the present application, at least one third buckle 32 is provided on the side of the mainboard bracket 30 close to the laser focus assembly 10, and the third buckle 32 is provided near the second groove 31. The third buckle 32 is buckled with the laser focus assembly 10 to avoid damage to the flexible circuit board 122 during the disassembly of the electronic device. Furthermore, the above arrangement also helps to reduce the length of the flexible circuit board 122 and reduce the space occupied by the laser focus assembly 10.

[0077] like Fig.15 As shown, before the electronic device is disassembled, since the camera decorative ring 20 is connected to the battery cover 40 of the electronic device, the laser focusing assembly 10 is buckled to the second buckle 21 of the camera decorative ring 20 through the first buckle 111.

[0078] like Fig.16 As shown, during the disassembly of the electronic device, when the camera decorative ring 20 is uncovered, since the first buckle 111 is buckled with the second buckle 21, as the camera decorative ring 20 is uncovered, the distance between the laser focus assembly 10 and the third buckle 32 becomes smaller. When the distance is equal to zero, that is, the third buckle 32 can clamp the laser focus assembly 10, so as to separate the first buckle 111 and the second buckle 21.

[0079] Furthermore, during the disassembly process, since the third clip 32 can clamp the laser focusing assembly 10, the laser focusing assembly 10 can still be embedded in the second groove 31 of the mainboard bracket 30, thereby helping to maintain the state of the flexible circuit board 122 unchanged, so as to achieve the purpose of not increasing the length of the flexible circuit board 122 and avoiding damage to the flexible circuit board 122 during the disassembly process.

[0080] It should be noted that in the embodiment of the present application, there are no excessive restrictions on the specific number of the third buckles 32. In actual applications, technicians can set the specific number of the third buckles 32 as needed.

[0081] Exemplarily, two third buckles 32 can be provided, and the two third buckles 32 are spaced apart and arranged on one side of the mainboard bracket 30 close to the camera decorative ring 20 , and the two third buckles 32 are both arranged at a position of the mainboard bracket 30 close to the second groove 31 .

[0082] Alternatively, if Fig.11 As shown, in the embodiment of the present application, a blocking portion 33 is further provided at a position of the mainboard bracket 30 close to the second groove 31 , and the blocking portion 33 and the third buckle 32 are provided on the same side of the mainboard bracket 30 .

[0083] like Fig.11As shown, in the embodiment of the present application, a blocking portion 33 is arranged on the side of the mainboard bracket 30 close to the camera decorative ring 20, and the blocking portion 33 is arranged at a position of the mainboard bracket 30 close to the second groove 31, that is, the blocking portion 33 and the third buckle 32 are arranged on the same side of the mainboard bracket 30.

[0084] In the embodiment of the present application, a blocking portion 33 is provided at a position of the mainboard bracket 30 close to the second groove 31 , and the first bracket 11 is limited by the blocking portion 33 so that the first bracket 11 can be embedded in the second groove 31 .

[0085] It should be noted that the blocking portion 33 in the embodiment of the present application may include multiple sections, and the multiple sections of the blocking portion 33 are arranged at intervals and are all arranged at a position of the mainboard bracket 30 close to the second groove 31.

[0086] Of course, in the embodiment of the present application, there are no excessive restrictions on the specific structure and specific number of the blocking portion 33. In actual applications, technicians can set it as needed.

[0087] The following is a brief description of the assembly process of the electronic device disclosed in the embodiment of the present application.

[0088] During the assembly of the electronic device, the camera lens 23 can be firstly bonded to the camera decorative ring by double-sided adhesive to form the camera decorative ring 20. Then the camera decorative ring 20 can be bonded to the battery cover 40 by double-sided adhesive to form a battery cover assembly.

[0089] Secondly, the laser light assembly 12 is adhered to the first groove 112 of the first bracket 11 by double-sided tape, so that the laser light assembly 12 is embedded in the first groove 112 .

[0090] Next, assemble the main circuit board into the frame 50, install the mainboard bracket 30 into the frame 50, connect the laser light board-to-board connector and the corresponding board-to-board connector on the main circuit board. Tighten the main circuit board and the mainboard bracket 30 with screws so that both the main circuit board and the mainboard bracket 30 are fixed in the frame 50.

[0091] Finally, the battery cover assembly is covered on the frame 50 so that the first buckle 111 is buckled on the second buckle 21 .

[0092] An embodiment of the present application discloses an electronic device, which includes a laser focusing assembly and a camera decorative ring arranged at intervals, wherein at least one first buckle is provided on a side of the laser focusing assembly close to the camera decorative ring, and at least one second buckle is provided on a side of the camera decorative ring close to the laser focusing assembly, and each of the second buckles is buckled with one of the first buckles.

[0093] The electronic device disclosed in the embodiment of the present application includes a laser focus assembly and a camera decorative ring, the laser focus assembly and the camera decorative ring are arranged at intervals, at least one first buckle is arranged on the side of the laser focus assembly close to the camera decorative ring, at least one second buckle is arranged on the side of the camera decorative ring close to the laser focus assembly, and each second buckle is buckled with a first buckle. The distance between the laser focus assembly and the camera decorative ring is limited by the second buckle and the first buckle to ensure that the distance between the laser focus assembly and the camera decorative ring is within a reasonable range, thereby improving the laser focus performance of the electronic device.

[0094] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0095] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: It comprises a laser focusing assembly (10) and a camera decorative ring (20) which are arranged at intervals, wherein: At least one first buckle (111) is provided on a side of the laser focusing assembly (10) close to the camera decorative ring (20), and at least one second buckle (21) is provided on a side of the camera decorative ring (20) close to the laser focusing assembly (10), and each of the second buckles (21) is buckled with one of the first buckles (111).

2. The electronic device according to claim 1, characterized in that: The laser focusing assembly (10) comprises a first bracket (11) and a laser light assembly (12), wherein: The first bracket (11) is provided with a first groove (112), and the laser light assembly (12) is embedded in the first groove (112); The first buckle (111) is arranged on a side of the first bracket (11) close to the camera decorative ring (20).

3. The electronic device according to claim 2, characterized in that: The first bracket (11) is provided with at least one positioning column (113), the laser light assembly (12) is provided with at least one first positioning hole (121), and the camera decorative ring (20) is provided with at least one second positioning hole (22); The positioning column (113) is inserted into the first positioning hole (121), and at least partially inserted into the second positioning hole (22).

4. The electronic device according to claim 3, characterized in that: The positioning column (113), the first buckle (111) and the first bracket (11) are integrally formed.

5. The electronic device according to claim 2, characterized in that: The first buckle (111) comprises a plurality of first buckles (111), and the plurality of first buckles (111) are arranged at intervals around the first groove (112); The second buckles (21) also include a plurality of them, and each of the second buckles (21) is arranged opposite to one of the first buckles (111).

6. The electronic device according to claim 1, characterized in that: The first buckle (111) is provided with a first chamfer (111a), and the second buckle (21) is provided with a second chamfer (211), and the second chamfer (211) is engaged with the first chamfer (111a).

7. The electronic device according to claim 2, characterized in that: The laser lamp assembly (12) comprises a flexible circuit board (122) and a laser lamp (123). The flexible circuit board (122) is at least partially embedded in the first groove (112), and the laser light (123) is connected to a side of the flexible circuit board (122) close to the camera decorative ring (20).

8. The electronic device according to claim 2, characterized in that: The electronic device further comprises a mainboard bracket (30), wherein: The mainboard bracket (30) is provided with a second groove (31), and the first bracket (11) is embedded in the second groove (31).

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a first adhesive layer (126), wherein the first adhesive layer (126) is bonded between the second groove (31) and the first bracket (11); The bonding force of the first adhesive layer (126) bonded to one side of the second groove (31) is smaller than the bonding force of the first adhesive layer (126) bonded to one side of the first bracket (11).

10. The electronic device according to claim 8, characterized in that: At least one third buckle (32) is provided at a position of the mainboard bracket (30) close to the second groove (31); the third buckle (32) is provided on a side of the mainboard bracket (30) close to the camera decorative ring (20); and the third buckle (32) is buckled with the laser focusing assembly (10).

Citation Information

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