Processing method of packaging substrate and microphone input interface substrate

Abstract

The invention discloses a processing method of a packaging substrate and a microphone input interface substrate, and the method comprises the steps: providing a substrate, drilling a sound hole in the substrate, and obtaining the substrate with the sound hole; performing first-time chemical copper deposition treatment on the substrate with the sound hole to obtain a substrate after the first-time chemical copper deposition treatment; drilling a blind hole in the substrate after the first chemical copper deposition treatment to obtain a substrate with a sound hole and the blind hole; cleaning the substrate with the sound hole and the blind hole by using plasma so as to remove the resin in the blind hole; performing secondary chemical copper deposition treatment on the substrate with the sound hole and the blind hole to obtain a substrate after the secondary chemical copper deposition treatment; the problem that the glass fiber of the microphone input interface substrate is prominent is solved.

Description

Technical Field

[0001] The present invention relates to the field of substrate processing, and in particular to a processing method of a packaging substrate and a microphone input interface substrate. Background Art

[0002] At present, with the upgrading of products such as headphones, and the public's requirements for the comfort and sound quality of headphones, customers have increasingly stringent requirements for microphone input interface substrates, and the sound hole is the key to the sound quality of the microphone input interface substrate, and the quality of the sound hole directly affects the sound quality. However, in the actual production process of the microphone input interface substrate, the sound hole has a large diameter. After drilling the sound hole, the glass fiber and resin on the hole wall are more easily corroded by cleaning solutions such as chemicals, and the glass fiber is easily exposed and remains on the hole wall. It is also difficult to remove the glass fiber, resulting in a more prominent glass fiber problem at the sound hole of the substrate. Summary of the invention

[0003] The embodiment of the present invention provides a processing method of a packaging substrate and a microphone input interface substrate to solve the problem of glass fiber protrusion of the microphone input interface substrate.

[0004] In a first aspect, a processing method of a packaging substrate is provided, the processing method comprising: Providing a substrate, drilling an acoustic hole on the substrate to obtain a substrate having the acoustic hole; Performing a first chemical copper deposition treatment on the substrate having the acoustic holes to obtain a substrate after the first chemical copper deposition treatment; Drilling blind holes on the substrate after the first chemical copper deposition treatment to obtain a substrate with acoustic holes and blind holes; Cleaning the substrate having the acoustic holes and the blind holes by using plasma to remove the resin in the blind holes; The substrate with the acoustic holes and the blind holes is subjected to a second chemical copper deposition treatment to obtain a substrate subjected to the second chemical copper deposition treatment.

[0005] Optionally, the processing method further includes: Performing electroplating treatment on the substrate after the second chemical copper deposition treatment to obtain an electroplated substrate; A circuit layer is prepared on the substrate after the electroplating treatment to obtain a packaging substrate with a circuit layer.

[0006] Optionally, after the first chemical copper plating treatment and the second chemical copper plating treatment, the thickness of the copper plating layer in the acoustic via is consistent with the thickness of the copper plating layer in the blind hole.

[0007] Optionally, after the first chemical copper plating treatment, the thickness of the copper plating layer in the acoustic hole is in the range of 0.8-1.2 um.

[0008] Optionally, after the second chemical copper plating treatment, the thickness of the copper plating layer in the blind hole is in the range of 0.8-1.2 um.

[0009] Optionally, a mechanical drill is used to drill an acoustic hole on the substrate to obtain the substrate having the acoustic hole.

[0010] Optionally, the aperture of the acoustic hole ranges from 0.15 to 0.3 mm.

[0011] Optionally, a laser drill is used to drill blind holes on the substrate after the first chemical copper deposition treatment to obtain a substrate with acoustic holes and blind holes.

[0012] Optionally, preparing a circuit layer on the electroplated substrate to obtain a packaging substrate having a circuit layer includes: Performing pattern transfer on the electroplated substrate to form a circuit layer on the substrate; The substrate is exposed, developed, etched and stripped to obtain a packaging substrate with a circuit layer.

[0013] In a second aspect, a microphone input interface substrate is provided. The microphone input interface substrate is prepared according to the processing method described in the first aspect.

[0014] The processing method of the above-mentioned packaging substrate and the microphone input interface substrate are optimized in the process flow of the packaging substrate, that is, on the basis of not changing the original drilling sequence, a chemical copper deposition processing step is added after the sound hole processing and before the blind hole processing, so that a layer of chemical copper is deposited on the sound hole, and then the blind hole is drilled, and then the blind hole is cleaned with a solution. Because of the protection of chemical copper, the sound hole will not be attacked, thereby avoiding the problem of protruding glass fiber at the sound hole after solution cleaning. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0015] Figure 1 It is a flow chart of a processing method of a packaging substrate in one embodiment of the present invention. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0018] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0019] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0020] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0021] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0022] In one embodiment, a processing method for a packaging substrate is provided, which is applicable to a packaging substrate with both acoustic holes and blind holes, such as a microphone input interface substrate and other non-metallic acoustic hole substrates. Figure 1 As shown, the processing method includes: S101, providing a substrate, and drilling an acoustic hole on the substrate to obtain a substrate having an acoustic hole; The sound hole is a through hole of a microphone input connector (ie, MIC) substrate, and is used to penetrate the upper surface and the lower surface of the substrate.

[0023] S102, performing a first chemical copper deposition treatment on the substrate having the acoustic holes to obtain a substrate after the first chemical copper deposition treatment; Among them, the first chemical copper plating treatment refers to the use of palladium to catalyze formaldehyde to reduce copper ions into copper elements adsorbed on the substrate to form a copper conductive layer.

[0024] After drilling the acoustic hole, a layer of chemical copper with a thickness of about 1 μm is deposited on the acoustic hole by the chemical copper deposition method in this step. Because of the protection of the chemical copper, the acoustic hole on the substrate will not be corroded by the solution in the subsequent steps.

[0025] S103, drilling blind holes on the substrate after the first chemical copper plating treatment to obtain a substrate with acoustic holes and blind holes; Among them, a blind via refers to a conductive hole that is set between connection layers on a substrate but does not penetrate the entire board.

[0026] S104, using plasma to clean the substrate having the acoustic holes and the blind holes to remove the resin in the blind holes; Among them, plasma cleaning, also known as Plasma cleaning, refers to an ionized gaseous substance composed of positive and negative ions produced by the ionization of atoms and atomic groups that have been deprived of some of their electrons.

[0027] In this step, plasma is used to clean the resin in the blind hole to prevent resin residue in the hole. Since copper plating has been performed in the acoustic hole in step S102, the cleaning solution and the inner wall of the acoustic hole are separated by the formed chemical copper layer, so that plasma cleaning will not cause the glass fiber in the acoustic hole to protrude.

[0028] S105 , performing a second chemical copper deposition treatment on the substrate having the acoustic holes and the blind holes to obtain a substrate after the second chemical copper deposition treatment.

[0029] Among them, after the second chemical copper plating treatment, a chemical copper layer of a certain thickness is generated in the blind hole of the substrate, and since the first chemical copper plating treatment has been carried out in the acoustic hole in step S102, the second chemical copper plating treatment will not increase the thickness of the chemical copper layer in the acoustic hole, that is, after two chemical copper plating treatments, the thickness of the chemical copper layer in the blind hole and the thickness of the chemical copper layer in the acoustic hole remain consistent.

[0030] The processing method of this embodiment optimizes the process flow of the microphone input interface substrate, that is, without changing the original drilling sequence, a chemical copper deposition step is added after the sound hole processing and before the blind hole processing, so that a layer of chemical copper is deposited on the sound hole, and then the blind hole is drilled, and then the blind hole is cleaned with a solution. Since the sound hole is protected by chemical copper, it will not be attacked, thereby avoiding the problem of protruding glass fiber at the sound hole after solution cleaning.

[0031] It should be noted that in the prior art, there is a post-drilling method to improve the problem of glass fiber protrusion. The solution is to drill the blind hole first, then perform electroplating to fill the hole, and then drill the sound hole, or drill the sound hole after completing the graphics and solder mask, which is the so-called post-drilling. The disadvantage of this method is that it is easy to cause alignment problems. That is, after the blind hole is drilled, the substrate undergoes expansion and contraction deformation due to the electroplating, graphics, solder mask and other processes. If the sound hole is drilled again, alignment deviation will occur, resulting in deviation of the hole drilling. Compared with the prior art, the processing method of the present invention can not only prevent the cleaning solution used to clean the blind hole from attacking the resin and glass fiber in the sound hole, but also avoid the problems of plate alignment deviation and hole drilling deviation caused by post-drilling and other methods.

[0032] In one embodiment, the processing method further comprises: Performing electroplating treatment on the substrate after the second chemical copper deposition treatment to obtain an electroplated substrate; A circuit layer is prepared on the substrate after the electroplating treatment to obtain a packaging substrate with a circuit layer.

[0033] The metal used for electroplating the substrate is at least one of copper, aluminum and iron, preferably copper.

[0034] The processing method of this embodiment obtains a packaging substrate of a microphone input interface with both acoustic and blind holes, and the product does not have the problem of glass fiber protrusion.

[0035] In one embodiment, after the first chemical copper plating process and the second chemical copper plating process, the thickness of the copper plating layer in the acoustic via is consistent with the thickness of the copper plating layer in the blind via.

[0036] Among them, since the first chemical copper plating process has been carried out in the acoustic hole in step S102, the second chemical copper plating process will not increase the thickness of the chemical copper layer in the acoustic hole. After the two chemical copper plating processes, the thickness of the chemical copper layer in the blind hole and the thickness of the chemical copper layer in the acoustic hole can be basically consistent.

[0037] In order to ensure that the thickness of the chemical copper layer in the blind hole and the thickness of the chemical copper layer in the acoustic hole are consistent after two chemical copper deposition treatments, the thickness of the copper layer in the first chemical copper deposition treatment can be controlled to be slightly smaller than the thickness of the copper layer in the second chemical copper deposition treatment. For example, the thickness of the copper layer in the acoustic hole in the first chemical copper deposition treatment can be controlled to be 1um, and the thickness of the copper layer in the blind hole in the second chemical copper deposition treatment can be controlled to be 1.2um. In this way, even if the thickness of the copper layer in the acoustic hole is slightly increased after the second chemical copper deposition treatment, the overall copper layer thickness in the acoustic hole can be made consistent with the copper layer thickness in the blind hole.

[0038] In one embodiment, after the first chemical copper plating process, the thickness of the copper plating layer in the acoustic hole is in the range of 0.8-1.2 um.

[0039] Among them, after the first chemical copper deposition treatment, the thickness of the copper deposition layer in the acoustic hole can be controlled to be 0.8um, 0.9um, 1um, 1.1um, 1.2um, etc.

[0040] In one embodiment, after the second chemical copper plating treatment, the thickness of the copper plating layer in the blind hole is in the range of 0.8-1.2 um.

[0041] Similarly, after the second chemical copper plating treatment, the copper plating layer thickness in the acoustic hole can also be controlled to be 0.8um, 0.9um, 1um, 1.1um, 1.2um, etc. Preferably, the copper plating layer thickness in the acoustic hole controlled by the first chemical copper plating treatment can be 0.1-0.2um less than the copper plating layer thickness in the blind hole controlled by the second chemical copper plating treatment, so as to make the copper plating layer thickness in the overall acoustic hole consistent with the copper plating layer thickness in the blind hole.

[0042] In one embodiment, a mechanical drill is used to drill an acoustic hole on the substrate to obtain the substrate having the acoustic hole.

[0043] The tool used for mechanical drilling is a physical drill bit, which performs cutting processing on the substrate through rotation, feeding and other actions, and the aperture range of the acoustic hole drilled through the upper and lower surfaces of the substrate by the mechanical drill is 0.1-0.4mm. Preferably, the aperture range of the acoustic hole can be 0.15-0.3mm.

[0044] In this embodiment, a mechanical drill is used to drill the sound holes on the substrate, which is easy to operate and has high flexibility.

[0045] In one embodiment, a laser drill is used to drill blind holes on the substrate after the first chemical copper deposition treatment to obtain a substrate with acoustic holes and blind holes.

[0046] Among them, laser drilling is to use a high-energy laser to locally heat the substrate and spray a high-temperature airflow into the hole to achieve the drilling effect. In this embodiment, a laser drill is used to form a blind hole on the substrate, and holes of any shape, size, and number can be drilled, and can be processed in hard media, with a wide range of applications.

[0047] In one embodiment, preparing a circuit layer on the substrate after the electroplating treatment to obtain a packaging substrate having a circuit layer includes: Performing pattern transfer on the electroplated substrate to form a circuit layer on the substrate; The substrate is exposed, developed, etched and stripped to obtain a packaging substrate with a circuit layer.

[0048] The pattern transfer includes: using the copper foil of the positive film substrate to etch the outer pattern according to the conventional method. The specific process flow is grinding, film rolling, exposure and development. The film rolling process can use 2.0mil dry film; then, the outer pattern is subjected to automatic optical inspection (AOI) according to the conventional process to check whether the outer pattern circuit has open circuit, short circuit, incomplete etching and other problems.

[0049] In one embodiment, a microphone input interface substrate is provided. The microphone input interface substrate is prepared according to the processing method mentioned in any of the previous embodiments, and the microphone input interface substrate prepared by the processing method adopts an additional chemical copper deposition method to deposit a layer of chemical copper of about 1 μm on the sound hole to prevent the cleaning solution from attacking the resin of the sound hole during the cleaning process of the blind hole, causing the protrusion of glass fiber, without affecting the cleaning of the blind hole.

[0050] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for processing a packaging substrate, characterized in that: The processing method comprises: Providing a substrate, drilling an acoustic hole on the substrate to obtain a substrate having an acoustic hole; Performing a first chemical copper deposition treatment on the substrate having the acoustic holes to obtain a substrate after the first chemical copper deposition treatment; Drilling blind holes on the substrate after the first chemical copper deposition treatment to obtain a substrate with acoustic holes and blind holes; Cleaning the substrate having the acoustic holes and the blind holes by using plasma to remove the resin in the blind holes; The substrate with the acoustic holes and the blind holes is subjected to a second chemical copper deposition treatment to obtain a substrate subjected to the second chemical copper deposition treatment.

2. The processing method according to claim 1, characterized in that: The processing method also includes: Performing electroplating on the substrate after the second chemical copper deposition treatment to obtain an electroplated substrate; A circuit layer is prepared on the substrate after the electroplating treatment to obtain a packaging substrate with a circuit layer.

3. The processing method according to claim 1, characterized in that: After the first chemical copper plating process and the second chemical copper plating process, the thickness of the copper plating layer in the acoustic via is consistent with the thickness of the copper plating layer in the blind via.

4. The processing method according to claim 1 or 3, characterized in that: After the first chemical copper plating treatment, the thickness of the copper plating layer in the acoustic hole is in the range of 0.8-1.2 um.

5. The processing method according to claim 1 or 3, characterized in that: After the second chemical copper plating treatment, the thickness of the copper plating layer in the blind hole is in the range of 0.8-1.2 um.

6. The processing method according to claim 1, characterized in that: A mechanical drill is used to drill an acoustic hole on the substrate to obtain the substrate with the acoustic hole.

7. The processing method according to claim 6, characterized in that: The aperture of the acoustic hole ranges from 0.15 to 0.3 mm.

8. The processing method according to claim 1, characterized in that: A laser drill is used to drill blind holes on the substrate after the first chemical copper deposition treatment to obtain a substrate with acoustic holes and blind holes.

9. The processing method according to claim 1, characterized in that: Preparing a circuit layer on the electroplated substrate to obtain a packaging substrate having a circuit layer includes: Performing pattern transfer on the electroplated substrate to form a circuit layer on the substrate; The substrate is exposed, developed, etched and stripped to obtain a packaging substrate with a circuit layer.

10. A microphone input interface substrate, characterized in that: The microphone input interface substrate is prepared according to the processing method according to any one of claims 1 to 9.

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