Drilling Method, System, and Storage Medium for Multilayer Printed Circuit Board

Abstract

The present invention discloses a drilling method, system, and storage medium for a multi-layer circuit board, relating to the technical field of circuit board drilling. The method includes: a feeding mechanism conveys the multi-layer circuit board to a drilling machine, and a manipulator places the multi-layer circuit board on a working platform; an X-RAY detection device obtains the spacing test values of the deviation measurement target points of each inner core board, and calculates the expansion and contraction values of each inner core board; according to the expansion and contraction values of each inner core board, calculates the average expansion and contraction value of the multi-layer circuit board; according to the average expansion and contraction value, sets a drill tape coefficient; according to the drill tape coefficient, the drilling machine determines a test drill tape and performs drilling until there is no drilling deviation; according to the final drill tape coefficient, determines the drilling drill tape, and the drilling machine drills the multi-layer circuit board according to the drilling drill tape. According to the drilling method for the multi-layer circuit board of the embodiment of the present invention, the drilling efficiency can be improved, and the first board of the trial drilling can be prevented from being scrapped due to drilling deviation, thereby reducing costs.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board drilling, and in particular to a drilling method, system, and storage medium for multi-layer circuit boards. Background Art

[0002] During the production process of multi-layer circuit boards, due to the effects of processes such as lamination, the problem of expansion and contraction will inevitably occur. When drilling multi-layer circuit boards, in order to avoid the problem of drilling deviation and scrapping caused by the excessive expansion and contraction value of the circuit board, it is necessary to first detect the expansion and contraction value of the circuit board, and then after the operator calculates the drill tape coefficient, input the drill tape coefficient into the drilling machine to drill the circuit board. At the same time, when starting to drill, it is necessary to first trial drill a first board, and then remove the drilled circuit board from the drilling machine, check the drilling situation, and after confirming that the drilling is okay, then drill the remaining circuit boards. If the drilling of the first board is unqualified, it can only be scrapped and the drill tape needs to be modified and trial drilled again. Using this method, not only is the drilling efficiency low, but also it will cause waste of circuit boards, which is not conducive to cost reduction. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a drilling method, system, and storage medium for multi-layer circuit boards, which can improve the drilling efficiency and avoid the scrapping of the first trial-drilled board due to drilling deviation, thereby reducing costs.

[0004] On the one hand, a drilling method for multi-layer circuit boards according to an embodiment of the present invention is applied to a drilling system. The drilling system includes a loading mechanism, a drilling machine, and a manipulator. The loading mechanism places multiple multi-layer circuit boards. The multi-layer circuit boards include multiple inner core boards. Test frames are arranged around the inner core boards. Test target areas are arranged at the four corners of the test frames. Each test target area includes multiple rows of trial drill holes. At least one of the trial drill holes in each test target area is provided with a deviation measurement target point. The drilling machine is provided with a working platform and an X-RAY detection device.

[0005] The method includes:

[0006] The loading mechanism transfers the multi-layer circuit board to the drilling machine, and the manipulator places the multi-layer circuit board on the working platform.

[0007] The X-RAY detection device obtains the pitch test value of the deviation measurement target points of each inner core board, and calculates the expansion and contraction value of each inner core board according to the pitch test value and the pitch preset value.

[0008] Calculate the average expansion and contraction value of the multi-layer circuit board according to the expansion and contraction value of each inner core board.

[0009] Set the drill tape coefficient according to the average expansion and contraction value;

[0010] According to the drill tape coefficient, the drilling machine determines the test drill tape of the first row of the test drill holes and drills. After drilling, the X-RAY detection device is used to detect whether the drill is off-target;

[0011] If there is a situation where the drill is off-target, update the drill tape coefficient according to the degree of deviation. The drilling machine determines the test drill tape of the next row of the test drill holes according to the updated drill tape coefficient and drills. Repeat this process until there is no situation where the drill is off-target;

[0012] Determine the drilling drill tape according to the final drill tape coefficient. The drilling machine drills the multi-layer circuit board according to the drilling drill tape.

[0013] According to some embodiments of the present invention, the step that the X-RAY detection device obtains the spacing test value of the deviation measurement target points of each layer of the inner core board and calculates the expansion and contraction value of each layer of the inner core board according to the spacing test value and the preset spacing value includes:

[0014] The X-RAY detection device obtains the first spacing test value of two deviation measurement target points of each layer of the inner core board on the same X-axis and the second spacing test value of two deviation measurement target points of each layer of the inner core board on the same Y-axis;

[0015] Obtain the first preset spacing value of two deviation measurement target points of each layer of the inner core board on the same X-axis and the second preset spacing value of two deviation measurement target points of each layer of the inner core board on the same Y-axis;

[0016] Obtain the first expansion and contraction value of each layer of the inner core board according to the first spacing test value and the first preset spacing value;

[0017] Obtain the second expansion and contraction value of each layer of the inner core board according to the second spacing test value and the second preset spacing value.

[0018] According to some embodiments of the present invention, the step of setting the drill tape coefficient according to the average expansion and contraction value includes:

[0019] When the average expansion and contraction value is less than the first preset value, set the drill tape coefficient to 1;

[0020] When the average expansion and contraction value is greater than the first preset value and less than the second preset value, set the drill tape coefficient to the first value; the first value is the ratio of the average of the spacing test values of all the inner core boards to the preset spacing value;

[0021] When the average expansion and contraction value is greater than the second preset value and less than the third preset value, set the drill belt coefficient to a second value; the second value is the ratio of the sum or difference of the spacing preset value and the average expansion and contraction value to the spacing preset value.

[0022] When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is given.

[0023] According to some embodiments of the present invention, the working platform is provided with a plurality of working positions, and a corresponding laser marking device is respectively arranged above each working position. A moving device and an image recognition device are also arranged above the working positions. A plurality of drill bits corresponding to the plurality of working positions are arranged on the moving device, and an adjustment device is arranged on the periphery of each working position; after the step of determining the drilling drill belt according to the final drill belt coefficient and the drilling machine drilling the multi-layer circuit board according to the drilling drill belt, the following steps are further included:

[0024] The manipulator places a plurality of the multi-layer circuit boards on the corresponding working positions;

[0025] The multi-layer circuit board is positioned by the image recognition device, and the position of the multi-layer circuit board is adjusted by the adjustment device;

[0026] The moving device drives the plurality of drill bits to move, so that the plurality of drill bits drill the multi-layer circuit boards on each working position respectively according to the drilling drill belt;

[0027] The X-RAY detection device is used to detect whether the multi-layer circuit board is drilled off, and the laser marking device is used to mark the multi-layer circuit board that is drilled off;

[0028] When the number of the multi-layer circuit boards that are drilled off exceeds the fourth preset value, the drilling machine stops drilling.

[0029] According to some embodiments of the present invention, the adjustment device includes a first cylinder, a second cylinder, a third cylinder and a fourth cylinder arranged around the working position. The output shaft of the first cylinder is connected with a first positioning block, the output shaft of the second cylinder is connected with a second positioning block, the output shaft of the third cylinder is connected with a third positioning block, and the output shaft of the fourth cylinder is connected with a fourth positioning block.

[0030] According to some embodiments of the present invention, a first drill bit box, a second drill bit box and a first detection device are arranged beside each of the working positions, a second detection device is arranged on the drill, and a plurality of drill bits are placed in the first drill bit box; the step of the moving device driving a plurality of the drills to move so that the plurality of drills drill the multi-layer circuit boards at each of the working positions according to the drilling tape includes:

[0031] The moving device drives the drill to move to the first drill bit box to grab the drill bit, and the first detection device detects the size of the drill bit;

[0032] When the first detection device detects that the size of the drill bit meets the requirements, the moving device drives a plurality of the drills to move so that the plurality of drills drill the multi-layer circuit boards at each of the working positions according to the drilling tape;

[0033] When the number of drilling times of the drill bit reaches a preset number, or when the second detection device detects that the size of the drill bit does not meet the requirements, the moving device drives the drill to place the drill bit into the second drill bit box and replace a new drill bit in the first drill bit box.

[0034] According to some embodiments of the present invention, the loading mechanism includes a carrier, an adsorption device, a driving device, a flipping device and a conveying device, and a receiving platform is arranged on one side of the drilling machine close to the conveying device; the step of the loading mechanism conveying the multi-layer circuit board to the drilling machine and the manipulator placing the multi-layer circuit board on the working platform includes:

[0035] Place a plurality of the multi-layer circuit boards on the carrier;

[0036] The driving device drives the carrier to approach the adsorption device;

[0037] The adsorption device adsorbs the multi-layer circuit boards on the carrier;

[0038] The flipping device drives the multi-layer circuit boards on the adsorption device to flip onto the conveying device, and the conveying device conveys the multi-layer circuit boards to the receiving platform;

[0039] The manipulator places the multi-layer circuit boards on the receiving platform on the working platform.

[0040] According to some embodiments of the present invention, the conveying device includes a body and a conveyor belt. The conveyor belt is disposed on the surface of the body, and an installation cavity is formed between the bottom of the conveyor belt and the body; the carrier includes a support base and a support backrest. One side of the support base close to the conveying device is disposed in the installation cavity, and the bottom of the support backrest is disposed on the surface of the side of the support base away from the conveying device. The surface of the support base is used to place the multilayer circuit board, and the support backrest is used to support the multilayer circuit board; the adsorption device is disposed between the carrier and the conveying device, and the adsorption device includes a plurality of suction cups and a telescopic member for driving the suction cups to approach or move away from the carrier; the flipping device includes a rotating rod and a rotating plate. The rotating rod is disposed on one side of the body close to the carrier, the rotating plate is connected to the rotating rod, and barbs are disposed at the bottom of the rotating plate. The rotating rod is used to drive the rotating plate to rotate.

[0041] On the other hand, a drilling system for a multilayer circuit board according to an embodiment of the present invention includes: a loading mechanism, a drilling machine, and a manipulator. The drilling system is used to execute the drilling method for the multilayer circuit board described in the above embodiments.

[0042] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions, and the computer-executable instructions are used to cause a computer to execute the drilling method for the multilayer circuit board described in the above embodiments.

[0043] The drilling method, system, and storage medium for a multilayer circuit board according to an embodiment of the present invention have at least the following beneficial effects: When drilling a multilayer circuit board, the loading mechanism loads the multilayer circuit board, and the manipulator places the multilayer circuit board on the working platform, realizing automatic loading of the multilayer circuit board. Compared with manual loading, the loading efficiency can be improved. By providing an X-RAY detection device on the drilling machine, the deviation measurement target points of the inner core board of the multilayer circuit board can be detected, so as to obtain the expansion and contraction values, and the drill tape coefficient is calculated according to the expansion and contraction values. After setting the drill tape coefficient, it is also necessary to perform a trial drill on the test drill hole according to the test drill tape to verify whether the drill tape coefficient is correct. Only after determining that the drill tape coefficient is accurate will the multilayer circuit board be formally drilled to avoid the occurrence of drilling deviation. If the drill tape coefficient is inaccurate, the drill tape coefficient needs to be adjusted. Since the trial drill is performed on the test frame, and the test frame does not include the functional circuit of the multilayer circuit board, the test frame can be removed after the multilayer circuit board is processed. Therefore, during the process of verifying whether the drill tape coefficient is correct, the multilayer circuit board will not be scrapped, thus reducing costs.

[0044] The additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the present invention. Brief Description of the Drawings

[0045] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0046] Figure 1 is a schematic structural diagram of a drilling system according to an embodiment of the present invention;

[0047] Figure 2 is a schematic structural diagram of a multilayer printed circuit board according to an embodiment of the present invention;

[0048] Figure 3 is a flowchart of steps of a drilling method for a multilayer printed circuit board according to an embodiment of the present invention;

[0049] Figure 4 is a schematic structural diagram of a drilling machine according to an embodiment of the present invention;

[0050] Figure 5 is Figure 4 an enlarged schematic diagram of part A of;

[0051] Figure 6 is a schematic structural diagram of a loading mechanism according to an embodiment of the present invention;

[0052] Figure 7 is a schematic structural diagram of a rotating plate according to an embodiment of the present invention. Detailed Embodiments

[0053] The embodiments of the present invention are described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. For the step numbers in the following embodiments, they are only set for the convenience of description and explanation, and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0054] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0055] In the description, claims and drawings of the present invention, terms such as "first", "second", "third" and "fourth" are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices.

[0056] Reference to "embodiment" in the present invention means that a specific feature, structure or characteristic described in connection with the embodiment may be included in at least one embodiment of the present invention. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0057] During the production process of a multilayer printed circuit board, due to the action of processes such as lamination, the problem of expansion and contraction will inevitably occur. When drilling a multilayer printed circuit board, in order to avoid the problem of drilling deviation and scrapping caused by the excessive expansion and contraction value of the printed circuit board, it is necessary to first detect the expansion and contraction value of the printed circuit board, and then, after the staff calculates the drill tape coefficient, input the drill tape coefficient into the drilling machine, so as to drill the printed circuit board. At the same time, when starting to drill, it is necessary to first drill a first board for trial, and then remove the drilled printed circuit board from the drilling machine, check the drilling situation, and after confirming that the drilling is okay, then drill the remaining printed circuit boards. If the drilling of the first board is unqualified, it can only be scrapped and the drill tape needs to be modified and tried again. Using this method, not only is the drilling efficiency low, but also it will cause waste of printed circuit boards, which is not conducive to cost reduction.

[0058] To this end, the embodiments of the present invention provide a drilling method, system and storage medium for a multilayer circuit board. When drilling a multilayer circuit board, a feeding mechanism feeds the multilayer circuit board, and a manipulator places the multilayer circuit board on a working platform, realizing automatic feeding of the multilayer circuit board. Compared with manual feeding, the feeding efficiency can be improved. By setting an X-RAY detection device on the drilling machine, the deviation measurement targets of the inner core board of the multilayer circuit board can be detected, so as to obtain the expansion and contraction values, and the drilling tape coefficient is calculated according to the expansion and contraction values. After setting the drilling tape coefficient, it is also necessary to perform a trial drill on the test drill hole according to the test drilling tape to verify whether the drilling tape coefficient is correct. Only after determining that the drilling tape coefficient is accurate will the multilayer circuit board be formally drilled to avoid the occurrence of drilling deviation. If the drilling tape coefficient is inaccurate, the drilling tape coefficient needs to be adjusted. Since the trial drill hole is performed on the test frame, and the test frame does not include the functional circuits of the multilayer circuit board, the test frame can be removed after the multilayer circuit board is processed. Therefore, during the process of verifying whether the drilling tape coefficient is correct, it will not cause the scrapping of the multilayer circuit board, thereby reducing costs.

[0059] The following will describe in detail the drilling method, system and storage medium for a multilayer circuit board according to the embodiments of the present invention with reference to the accompanying drawings.

[0060] On the one hand, the embodiments of the present invention propose a drilling method for a multilayer circuit board, which is applied to a drilling system, such as Figure 1 shown, the drilling system includes a feeding mechanism 100, a drilling machine 200 and a manipulator 300. The feeding mechanism 100 is provided with a plurality of multilayer circuit boards 400, such as Figure 2 shown, the multilayer circuit board 400 includes a plurality of inner core boards 401. Test frames 410 are arranged around the inner core boards 401. Test target areas 420 are arranged at the four corners of the test frames 410. Each test target area 420 includes multiple rows of trial drill holes 430. At least one trial drill hole 430 in each test target area 420 is provided with a deviation measurement target 440; such as Figure 4 shown, the drilling machine 200 is provided with a working platform 220 and an X-RAY detection device (not shown in the figure). Such as Figure 3 shown, the drilling method for the multilayer circuit board includes the following steps:

[0061] Step S100: The feeding mechanism 100 transfers the multilayer circuit board 400 to the drilling machine 200, and the manipulator 300 places the multilayer circuit board 400 on the working platform 220;

[0062] Step S200: The X-RAY detection device obtains the distance test value of the deviation measurement target 440 of each inner core board 401, and calculates the expansion and contraction value of each inner core board 401 according to the distance test value and the distance preset value;

[0063] Step S300: Calculate the average expansion and contraction value of the multi-layer circuit board 400 based on the expansion and contraction values of each inner core board 401.

[0064] Step S400: Set the drill tape coefficient according to the average expansion and contraction value.

[0065] Step S500: According to the drill tape coefficient, the drilling machine determines the test drill tape of the first row of test drill holes 430 and drills. After drilling, use the X-RAY detection device to detect whether there is drilling deviation.

[0066] Step S600: If there is a situation of drilling deviation, update the drill tape coefficient according to the degree of drilling deviation. The drilling machine 200 determines the test drill tape of the next row of test drill holes 430 according to the updated drill tape coefficient and drills. Repeat this process until there is no situation of drilling deviation.

[0067] Step S700: Determine the drilling drill tape according to the final drill tape coefficient, and the drilling machine 200 drills the multi-layer circuit board 400 according to the drilling drill tape.

[0068] Specifically, as Figure 6 shown, in some embodiments of the present invention, the loading mechanism 100 includes a carrier 110, an adsorption device 120, a driving device, a flipping device 130 and a conveying device 140; wherein, the carrier 110 is used to place the multi-layer circuit board 400, the adsorption device 120 is disposed opposite to the carrier 110 and is used to adsorb the multi-layer circuit board 400 on the carrier 110, the driving device is used to drive the carrier 110 to move so that the carrier 110 approaches or moves away from the adsorption device 120, and the flipping device 130 is used to drive the multi-layer circuit board 400 on the adsorption device 120 to flip; as Figure 4 shown, a receiving platform 260 is disposed on one side of the drilling machine 200 close to the conveying device 140, and the conveying device 140 is used to receive the flipped multi-layer circuit board 400 and convey the multi-layer circuit board 400 to the receiving platform 260. In this example, the above-mentioned step S100: The loading mechanism 100 conveys the multi-layer circuit board 400 to the drilling machine 200, and the manipulator 300 places the multi-layer circuit board 400 on the working platform 220, specifically including the following five steps:

[0069] Step S110: Place a plurality of multi-layer circuit boards 400 on the carrier 110.

[0070] Step S120: The driving device drives the carrier 110 to approach the adsorption device 120.

[0071] Step S130: The adsorption device 120 adsorbs the multi-layer circuit boards 400 on the carrier 110.

[0072] Step S140: The flipping device 130 drives the multi-layer circuit board 400 on the adsorption device 120 to flip onto the conveying device 140, and the conveying device 140 conveys the multi-layer circuit board 400 to the receiving platform 260;

[0073] Step S150: The manipulator 300 places the multi-layer circuit board 400 on the receiving platform 260 on the working platform 220.

[0074] Specifically, when loading the multi-layer circuit board 400, a plurality of multi-layer circuit boards 400 are placed on the carrier 110 together. Then, the driving device drives the entire carrier 110 and the multi-layer circuit boards 400 on the carrier 110 to move towards the adsorption device 120 together. When the distance between the carrier 110 and the adsorption device 120 is close enough, the adsorption device 120 adsorbs the outermost multi-layer circuit board 400 on the carrier 110. At this time, the flipping device 130 receives the multi-layer circuit board 400 adsorbed by the adsorption device 120. At the same time, the adsorption device 120 releases the multi-layer circuit board 400, and then the flipping device 130 flips the multi-layer circuit board 400, so that the multi-layer circuit board 400 changes from being placed vertically to being placed horizontally, and then the conveying device 140 receives the multi-layer circuit board 400, thereby conveying the multi-layer circuit board 400 to the receiving platform 260, so that the manipulator 300 transfers the multi-layer circuit board 400 from the receiving platform 260 to the working platform 220. Through this loading mechanism 100, automatic loading of the multi-layer circuit board 400 can be achieved, and the multi-layer circuit board 400 can be continuously and automatically conveyed, without the need for staff to load the multi-layer circuit boards 400 one by one, thereby improving production efficiency and reducing labor costs.

[0075] Further, as Figure 6 and Figure 7As shown, in some embodiments of the present invention, the conveying device 140 includes a body 141 and a conveyor belt 142. The conveyor belt 142 is disposed on the surface of the body 141, and an installation cavity 143 is formed between the bottom of the conveyor belt 142 and the body 141; the carrier 110 includes a support base 111 and a support backrest 112. One side of the support base 111 close to the conveying device 140 is disposed in the installation cavity 143, and the bottom of the support backrest 112 is disposed on the surface of the side of the support base 111 away from the conveying device 140. The surface of the support base 111 is used for placing multiple circuit boards 400, and the support backrest 112 is used for supporting the multiple circuit boards 400; the adsorption device 120 is disposed between the carrier 110 and the conveying device 140. The adsorption device 120 includes a plurality of suction cups 121 and a telescopic member 122 for driving the suction cups 121 to approach or move away from the carrier 110; the flipping device 130 includes a rotating rod 131 and a rotating plate 132. The rotating rod 131 is disposed on the side of the body 141 close to the carrier 110, the rotating plate 132 is connected to the rotating rod 131, and a barb 133 is disposed at the bottom of the rotating plate 132. The rotating rod 131 is used for driving the rotating plate 132 to rotate. Specifically, when loading the multiple circuit boards 400, place the multiple circuit boards 400 on the support base 111 and make the multiple circuit boards 400 lean against the support backrest 112 to prevent the multiple circuit boards 400 from falling. Then, when the driving device drives the carrier 110 to approach the adsorption device 120 to a certain distance, the telescopic member 122 drives the suction cups 121 to extend a certain distance in the direction of the carrier 110, so that the suction cups 121 contact the outermost multiple circuit board 400 of the carrier 110. After adsorbing the multiple circuit board 400, the telescopic member 122 drives the suction cups 121 to reset, thereby obtaining a multiple circuit board 400 from the carrier 110. Among them, the telescopic member 122 can adopt devices such as a cylinder. When the suction cups 121 adsorb the outermost multiple circuit board 400 of the carrier 110 and the telescopic member 122 drives the suction cups 121 to reset, at this time, the multiple circuit board 400 adsorbed on the suction cups 121 is exactly placed on the barb 133 of the rotating plate 132. After supporting the multiple circuit board 400 through the barb 133, the suction cups 121 release the multiple circuit board 400. Subsequently, the rotating rod 131 rotates, driving the rotating plate 132 to flip, so that the multiple circuit board 400 is changed from a vertical placement to a horizontal placement and is placed on the conveyor belt 142. The conveyor belt 142 conveys the multiple circuit board 400 to the receiving platform 260, and then the manipulator 300 places the multiple circuit board 400 on the receiving platform 260 onto the working platform 220. It should be noted that the driving device can adopt a screw transmission component or a cylinder pushing component, etc. The driving device can be disposed in the installation cavity 143 of the body 141 and connected to the carrier 110, and drives the carrier 110 to approach or move away from the adsorption device 120 through structures such as a screw transmission component or a cylinder pushing component.Alternatively, the driving device can also be arranged on the side of the carrier 110 away from the adsorption device 120, and the carrier 110 is driven to move by pushing the support backrest 112.

[0076] After the multi-layer circuit board 400 is placed on the working platform 220, the X-RAY detection device will detect the spacing test value of the deviation measurement target points 440 of each inner core board, and calculate the expansion and contraction value of each inner core board according to the spacing test value and the preset spacing value. Specifically, the above step S200 includes the following four steps:

[0077] Step S210: The X-RAY detection device obtains the first spacing test value of two deviation measurement target points 440 of each inner core board 401 located on the same X-axis, and the second spacing test value of two deviation measurement target points 440 located on the same Y-axis;

[0078] Step S220: Obtain the first preset spacing value of two deviation measurement target points 440 of each inner core board 401 located on the same X-axis, and the second preset spacing value of two deviation measurement target points 440 located on the same Y-axis;

[0079] Step S230: Obtain the first expansion and contraction value of each inner core board 401 according to the first spacing test value and the first preset spacing value;

[0080] Step S240: Obtain the second expansion and contraction value of each inner core board 401 according to the second spacing test value and the second preset spacing value.

[0081] As Figure 2 shown, the inner core board 401 is provided with four deviation measurement target points 440, which are respectively located in the four test target areas 420 of the inner core board 401. The X-RAY detection device will detect the spacing between two deviation measurement target points 440 on the same horizontal line in the X-axis direction to obtain the first spacing test value. At the same time, the X-RAY detection device will detect the spacing between two deviation measurement target points 440 on the same vertical line in the Y-axis direction to obtain the second spacing test value. When setting the four deviation measurement target points 440, the spacing of the four deviation measurement target points 440 is preset. Among them, the initial spacing of two deviation measurement target points on the same horizontal line in the X-axis direction is the first preset spacing value; the initial spacing of two deviation measurement target points 440 on the same vertical line in the Y-axis direction is the second preset spacing value. According to the first spacing test value and the first preset spacing value, it can be known that the first expansion and contraction value of the nth layer of the inner core board is Q1n = , where the total number of layers of the inner core board is N, D1n represents the first spacing test value of the nth layer of the inner core board, 1 ≤ n ≤ N, d1 represents the first preset spacing value, and the second expansion and contraction value of the nth layer of the inner core board is Q2n = , where D2n represents the second pitch test value of the inner core board of the nth layer, and d2 represents the second pitch preset value. After obtaining the first expansion and contraction value and the second expansion and contraction value of each layer of the inner core board, the average expansion and contraction value of the multi-layer circuit board 400 (including the first average expansion and contraction value and the second average expansion and contraction value) can be calculated. Among them, the first average expansion and contraction value is S1 = , and the second average expansion and contraction value is S2 = .

[0082] After obtaining the average expansion and contraction value of the multi-layer circuit board 400, the drill tape coefficient is set according to the average expansion and contraction value. Specifically, the above step S400 includes the following four steps:

[0083] Step S410: When the average expansion and contraction value is less than the first preset value, set the drill tape coefficient to 1;

[0084] Step S420: When the average expansion and contraction value is greater than the first preset value and less than the second preset value, set the drill tape coefficient to the first value; the first value is the ratio of the average of the pitch test values of all inner core boards 401 to the pitch preset value;

[0085] Step S430: When the average expansion and contraction value is greater than the second preset value and less than the third preset value, set the drill tape coefficient to the second value; the second value is the ratio of the pitch preset value plus or minus the average expansion and contraction value to the pitch preset value;

[0086] Step S440: When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is given.

[0087] Specifically, when the average expansion and contraction value is less than the first preset value, it indicates that the expansion and contraction of the multi-layer circuit board 400 is relatively slight and basically does not affect the drilling accuracy. At this time, the drill tape coefficient is set to 1, that is, the original preset drill tape remains unchanged. When the average expansion and contraction value is greater than the first preset value and less than the second preset value, if drilling is performed according to the original drill tape at this time, the situation of drilling deviation will occur. Therefore, it is necessary to set the drill tape coefficient to the first value to compensate for the deviation caused by the expansion and contraction. Among them, the first value is the ratio of the average of the pitch test values of all inner core boards to the pitch preset value. The first value includes the first value in the X-axis direction and the first value in the Y-axis direction. The first value in the X-axis direction is X1 = , and the first value in the Y-axis direction is Y1 = When the average expansion and contraction value is greater than the second preset value and less than the third preset value, the expansion and contraction situation is relatively serious at this time, and the drill tape coefficient needs to be set to the second value to compensate for the deviation caused by expansion and contraction. The second value is the ratio of the sum of the distance preset value plus or minus the average expansion and contraction value (when the sum of the differences between the distance test values of all inner core boards and the distance preset value is positive, here it is plus the average expansion and contraction value, and when it is negative, it is minus the average expansion and contraction value) to the distance preset value. The second value includes the second value in the X-axis direction and the second value in the Y-axis direction. The second value in the X-axis direction is X2 = , and the second value in the Y-axis direction is Y1 = , where A is the average expansion and contraction value. When the average expansion and contraction value is greater than the third preset value, it indicates that the expansion and contraction of the multilayer circuit board 400 is abnormal, and an abnormal alarm needs to be given to prompt the staff to check whether there are problems in the production process of the multilayer circuit board 400. It should be noted that the first preset value, the second preset value, and the third preset value can be set according to actual needs, such as set to 2 mil, 4 mil, 6 mil, etc., and the specific values are not limited here.

[0088] After determining the drill tape coefficient, the drilling machine 200 determines the test drill tape for the first row of test drill holes 430 and drills. After drilling, it is detected by the X-RAY detection device whether there is drilling deviation. It should be noted that the drilling machine 200 is pre-set with multiple test drill tapes for test drilling and drilling drill tapes for actual drilling. Each test drill tape corresponds to a row of test drill holes 430 in the test target area 420. If there is drilling deviation after drilling, the drill tape coefficient is updated according to the degree of drilling deviation. The specific update method is to multiply the drill tape coefficient by the adjustment coefficient, where the adjustment coefficient is the ratio of the actual drilling coordinates of the test drill holes 430 minus the theoretical coordinates to the theoretical coordinates. Then, the drilling machine 200 determines the test drill tape for the second row of test drill holes 430 and drills according to the updated drill tape coefficient, and repeats this process until there is no drilling deviation, and the final drill tape coefficient is obtained. The final drill tape coefficient is set as the drill tape coefficient of the drilling drill tape, and the drilling machine 200 drills the multilayer circuit board 400 according to the drilling drill tape.

[0089] According to the drilling method of a multi-layer circuit board according to an embodiment of the present invention, when drilling the multi-layer circuit board 400, the feeding mechanism 100 feeds the multi-layer circuit board 400, and the manipulator 300 places the multi-layer circuit board 400 on the working platform 220, realizing the automatic feeding of the multi-layer circuit board 400. Compared with manual feeding, the feeding efficiency can be improved. By setting an X-RAY detection device on the drilling machine 200, the deviation measurement target points of the inner core board of the multi-layer circuit board 400 can be detected, so as to obtain the expansion and contraction values, and the drilling tape coefficient can be calculated according to the expansion and contraction values. After setting the drilling tape coefficient, it is also necessary to perform trial drilling according to the trial drilling tape to verify whether the drilling tape coefficient is correct. Only after determining that the drilling tape coefficient is accurate will the multi-layer circuit board 400 be formally drilled to avoid the occurrence of drilling deviation. If the drilling tape coefficient is inaccurate, the drilling tape coefficient still needs to be adjusted. Since the trial drilling is performed on the test frame 410, and the test frame 410 does not include the functional circuits of the multi-layer circuit board 400, the test frame can be removed after the multi-layer circuit board 400 is processed. Therefore, during the process of verifying whether the drilling tape coefficient is correct, the multi-layer circuit board 400 will not be scrapped, thus reducing the cost.

[0090] As Figure 4 shown, the working platform 220 is provided with a plurality of working positions 221, and corresponding laser marking devices (not shown in the figure) are respectively arranged above each working position 221. Moreover, a moving device 240 and an image recognition device (not shown in the figure) are also arranged above the working position 221. A plurality of drill bits 250 corresponding to the plurality of working positions 221 are arranged on the moving device 240, and an adjusting device 230 is arranged on the periphery of each working position 221. The drilling method of the multi-layer circuit board according to the embodiment of the present invention further includes the following five steps:

[0091] Step S800: The manipulator 300 places a plurality of multi-layer circuit boards 400 on the corresponding working positions 221;

[0092] Step S900: The multi-layer circuit board 400 is positioned through the image recognition device, and the position of the multi-layer circuit board 400 is adjusted through the adjusting device 230;

[0093] Step S1000: The moving device 240 drives the plurality of drill bits 250 to move, so that the plurality of drill bits 250 drill the multi-layer circuit board 400 on each working position 221 according to the drilling tape respectively;

[0094] Step S1100: It is detected through the X-RAY detection device whether the multi-layer circuit board 400 is drilled off, and the multi-layer circuit board 400 drilled off is marked through the laser marking device;

[0095] Step S1200: When the number of multi-layer circuit boards 400 drilled off exceeds the fourth preset value, the drilling machine 200 stops drilling.

[0096] Specifically, after determining the final drilling drill tape, batch drilling of the multilayer circuit board 400 is started. During batch drilling, the multilayer circuit board 400 is sequentially conveyed to the receiving platform 260 through the feeding mechanism 100, and then the manipulator 300 places the multilayer circuit board 400 on the receiving platform 260 onto the corresponding working position 221. The multilayer circuit board 400 is positioned through the image recognition device, and then the position of the multilayer circuit board 400 is adjusted through the adjusting device 230 to ensure the accurate position of the multilayer circuit board 400, so as to improve the subsequent drilling accuracy. As Figure 4 shown, in some embodiments of the present invention, the adjusting device 230 includes a first cylinder 232, a second cylinder 234, a third cylinder 236, and a fourth cylinder (not shown in the figure) arranged around the working position 221. The output shaft of the first cylinder 232 is connected to a first positioning block 231, the output shaft of the second cylinder 234 is connected to a second positioning block 233, the output shaft of the third cylinder 236 is connected to a third positioning block 235, and the output shaft of the fourth cylinder is connected to a fourth positioning block. After the manipulator 300 places the multilayer circuit board 400 on the working position 221, the first cylinder 232, the second cylinder 234, the third cylinder 236, and the fourth cylinder push the first positioning block 231, the second positioning block 233, the third positioning block 235, and the fourth positioning block to clamp the multilayer circuit board 400, realizing the positioning of the multilayer circuit board 400. Then, the moving device 240 drives a plurality of drill bits 250 to move, so that the plurality of drill bits 250 drill the multilayer circuit board 400 on each working position 221 according to the drilling drill tape. It should be noted that the moving device 240 includes an X-axis moving mechanism, a Y-axis moving mechanism, and a Z-axis moving mechanism, and can drive the drill bit 250 to move in the XYZ three-axis directions. After drilling, it is also necessary to detect whether the multilayer circuit board 400 is drilled off by the X-RAY detection device. If the situation of drilling off occurs, it is also necessary to mark the multilayer circuit board 400 with drilling off through the laser marking device, so as to scrap the multilayer circuit board 400 with drilling off subsequently and avoid the outflow of defective products. When the number of multilayer circuit boards 400 with drilling off is large and exceeds the fourth preset value, the drilling machine 200 stops drilling. After the staff eliminates the abnormality or readjusts the drilling drill tape, subsequent drilling is carried out to avoid a large number of scraps. The fourth preset value can be set according to actual needs.

[0097] Further, as Figure 5As shown, in some embodiments of the present invention, a first drill bit box 270, a second drill bit box 280, and a first detection device 291 are provided beside each working position 221. There is a second detection device (not shown in the figure) on the drill 250. A plurality of drill bits 290 are placed in the first drill bit box 270. The above step S1000: The moving device 240 drives the plurality of drills 250 to move, so that the plurality of drills 250 drill the multi-layer circuit boards 400 on each working position 221 according to the drilling tape, includes the following three steps:

[0098] Step S1001: The moving device 240 drives the drill 250 to move to the first drill bit box 270 to grab the drill bit 290, and the first detection device 291 detects the size of the drill bit 290;

[0099] Step S1002: When the first detection device 291 detects that the size of the drill bit 290 meets the requirements, the moving device 240 drives the plurality of drills 250 to move, so that the plurality of drills 250 drill the multi-layer circuit boards 400 on each working position 221 according to the drilling tape;

[0100] Step S1003: When the number of drilling times of the drill bit 290 reaches the preset number of times, or when the second detection device detects that the size of the drill bit 290 does not meet the requirements, the moving device 240 drives the drill 250 to place the drill bit 290 into the second drill bit box 280 and replace a new drill bit 290 in the first drill bit box 270.

[0101] It should be noted that in order to ensure that the grabbed drill bit 290 meets the requirements of drilling, after the drill holder 250 grabs the drill bit 290, the drill bit 290 needs to be moved to the first detection device 291 first to detect whether the size of the drill bit 290 meets the drilling requirements. After confirming that the size of the drill bit 290 meets the requirements, the drill bit 290 will be used for drilling. If it is detected that the size of the drill bit 290 does not meet the requirements, the drill bit 290 will be placed in the second drill bit box 280, and a new drill bit 290 will be grabbed from the first drill bit box 270 again to avoid using a defective drill bit 290. At the same time, since the drill bit 290 will be worn to a certain extent during the drilling of the multi-layer circuit board 400 using the drill bit 290, the drill bit 290 has a certain service life. Therefore, the present application also detects the wear degree of the drill bit 290 used for drilling in real time through the second detection device located on the drill holder 250. When the number of drilling times of the drill bit 290 reaches the preset number of times, or when the second detection device detects that the wear degree of the drill bit 290 reaches the preset degree, the drill bit 290 will be scrapped. The drill holder 250 will put the drill bit 290 back into the second drill bit box 280, grab a new drill bit 290 from the first drill bit box 270 again, and repeat the above operations. By setting the first detection device 291 and the second detection device, it is ensured that the size of the drill bit 290 meets the requirements, thereby improving the accuracy of drilling. It should be noted that multiple drill bits 290 with different sizes are provided in the first drill bit box 270 to meet the drilling requirements of through holes with different sizes of the multi-layer circuit board 400.

[0102] On the other hand, an embodiment of the present invention also provides a drilling system for a multi-layer circuit board, as Figure 1 shown. The drilling system includes a feeding mechanism 100, a drilling machine 200, and a manipulator 300. The drilling system is used to implement the drilling method for the multi-layer circuit board described in the above embodiments.

[0103] It should be noted that the content in the above method embodiments is applicable to the present system embodiment. The functions specifically implemented in this embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0104] On the other hand, an embodiment of the present invention also provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, it implements the above-mentioned drilling method for the multi-layer circuit board.

[0105] The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include memories remotely located relative to the processor, and these remote memories can be connected to the processor through a network. Examples of the above networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated. They can be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the objectives of the solution of this embodiment.

[0106] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any one of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Additionally, although various exemplary specific implementations and architectures have been described in accordance with embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary specific implementations and architectures described herein are also within the scope of the present disclosure.

[0107] Certain aspects of the present disclosure have been described above with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments. It should be understood that one or more blocks in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented respectively by executing computer-executable program instructions. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not need to be executed at all. Additionally, additional components and / or operations beyond those shown in the blocks of the block diagrams and flowcharts may exist in certain embodiments.

[0108] Therefore, the blocks in the block diagrams and flowcharts support combinations of devices for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction means for performing the specified functions. It should also be understood that each block in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented by a dedicated hardware computer system that performs a specific function, element, or step, or a combination of dedicated hardware and computer instructions.

[0109] The program modules, application programs, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, upon execution, cause at least a portion of the functions described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0110] Software components can be encoded in any of a variety of programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted to executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language that can be ported across multiple architectures. Software components including higher-level programming languages may need to be converted to an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, software components containing instructions in one of the above examples of programming languages may be executed directly by the operating system or other software components without first being converted into another form.

[0111] Software components can be stored as files or other data storage constructs. Software components with similar types or related functions can be stored together in, for example, a specific directory, folder, or library. Software components can be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0112] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those of ordinary skill in the art to which the present invention pertains.

Claims

1. A drilling method for a multi-layer circuit board, characterized in that, Applied to a drilling system, the drilling system includes a feeding mechanism, a drilling machine and a manipulator. The feeding mechanism places a plurality of multi-layer circuit boards. The multi-layer circuit boards include a plurality of inner core boards. Test frames are arranged around the inner core boards. Test target areas are arranged at the four corners of the test frames. Each test target area includes multiple rows of test drill holes. At least one of the test drill holes in each test target area is provided with a deviation measurement target point. The drilling machine is provided with a working platform and an X-RAY detection device; The method includes: The feeding mechanism conveys the multi-layer circuit board to the drilling machine, and the manipulator places the multi-layer circuit board on the working platform; The X-RAY detection device obtains the spacing test value of the deviation measurement target points of each inner core board, and calculates the expansion and contraction value of each inner core board according to the spacing test value and the preset spacing value; Calculate the average expansion and contraction value of the multi-layer circuit board according to the expansion and contraction value of each inner core board; Set the drill tape coefficient according to the average expansion and contraction value; According to the drill tape coefficient, the drilling machine determines the test drill tape of the first row of the test drill holes and drills. After drilling, the X-RAY detection device detects whether there is drilling deviation; If there is a situation of drilling deviation, update the drill tape coefficient according to the degree of drilling deviation. The drilling machine determines the test drill tape of the next row of the test drill holes according to the updated drill tape coefficient and drills. Repeat this process until there is no situation of drilling deviation; Determine the drilling drill tape according to the final drill tape coefficient, and the drilling machine drills the multi-layer circuit board according to the drilling drill tape; The step of setting the drill tape coefficient according to the average expansion and contraction value includes: When the average expansion and contraction value is less than the first preset value, set the drill tape coefficient to 1; When the average expansion and contraction value is greater than the first preset value and less than the second preset value, set the drill tape coefficient to a first value. The first value is the ratio of the average value of the spacing test values of all the inner core boards to the preset spacing value; When the average expansion and contraction value is greater than the second preset value and less than the third preset value, set the drill tape coefficient to a second value. The second value is the ratio of the preset spacing value plus or minus the average expansion and contraction value to the preset spacing value; When the average expansion and contraction value is greater than the third preset value, an abnormal alarm is given.

2. The drilling method of the multi-layer circuit board according to claim 1, characterized in that, The step that the X-RAY detection device obtains the spacing test value of the deviation measurement target points of each inner core board and calculates the expansion and contraction value of each inner core board according to the spacing test value and the preset spacing value includes: The X-RAY detection device obtains the first spacing test value of two deviation measurement target points of each inner core board located on the same X axis and the second spacing test value of two deviation measurement target points of each inner core board located on the same Y axis; Obtain the first preset spacing value of two deviation measurement target points of each inner core board located on the same X axis and the second preset spacing value of two deviation measurement target points of each inner core board located on the same Y axis; Obtain the first expansion and contraction value of each layer of the inner core board according to the first spacing test value and the first preset spacing value; Obtain the second expansion and contraction value of each layer of the inner core board according to the second spacing test value and the second preset spacing value.

3. The drilling method of the multi-layer circuit board according to claim 1, characterized in that, The working platform is provided with a plurality of working positions, and corresponding laser marking devices are respectively arranged above each working position. A moving device and an image recognition device are also arranged above the working position. A plurality of drill bits corresponding to the plurality of working positions are arranged on the moving device, and an adjustment device is arranged on the periphery of each working position; after the step of determining the drilling drill tape according to the final drill tape coefficient and the drilling machine drilling the multi-layer circuit board according to the drilling drill tape, the method further includes: The manipulator places the plurality of multi-layer circuit boards at the corresponding working positions; Position the multi-layer circuit board through the image recognition device and adjust the position of the multi-layer circuit board through the adjustment device; The moving device drives the plurality of drill bits to move, so that the plurality of drill bits drill the multi-layer circuit boards at each working position respectively according to the drilling drill tape; Detect whether the multi-layer circuit board is drilled off by the X-RAY detection device, and mark the multi-layer circuit board drilled off by the laser marking device; When the number of multi-layer circuit boards drilled off exceeds the fourth preset value, the drilling machine stops drilling.

4. The drilling method of the multi-layer circuit board according to claim 3, wherein The adjustment device includes a first cylinder, a second cylinder, a third cylinder and a fourth cylinder arranged around the working position. The output shaft of the first cylinder is connected with a first positioning block, the output shaft of the second cylinder is connected with a second positioning block, the output shaft of the third cylinder is connected with a third positioning block, and the output shaft of the fourth cylinder is connected with a fourth positioning block.

5. The drilling method of the multi-layer circuit board according to claim 3, wherein, A first drill bit box, a second drill bit box and a first detection device are arranged beside each working position, a second detection device is arranged on the drill bit, and a plurality of drill bits are placed in the first drill bit box; the step of the moving device driving the plurality of drill bits to move so that the plurality of drill bits drill the multi-layer circuit boards at each working position respectively according to the drilling drill tape includes: The moving device drives the drill bit to move to the first drill bit box to grab the drill bit, and detects the size of the drill bit through the first detection device; When the first detection device detects that the size of the drill bit meets the requirements, the moving device drives the plurality of drill bits to move, so that the plurality of drill bits drill the multi-layer circuit boards at each working position respectively according to the drilling drill tape; When the drilling times of the drill bit reach the preset times, or when the second detection device detects that the size of the drill bit does not meet the requirements, the moving device drives the drill bit to place the drill bit into the second drill bit box and replace a new drill bit in the first drill bit box.

6. The drilling method of the multi-layer circuit board according to claim 1, characterized in that, The feeding mechanism includes a carrier, an adsorption device, a driving device, a flipping device and a conveying device, and a receiving platform is arranged on one side of the drilling machine close to the conveying device; The feeding mechanism conveys the multi-layer circuit board to the drilling machine. The step of the manipulator placing the multi-layer circuit board on the working platform includes: Placing a plurality of the multi-layer circuit boards on the carrier; The driving device drives the carrier close to the adsorption device; The adsorption device adsorbs the multi-layer circuit boards on the carrier; The flipping device drives the multi-layer circuit boards on the adsorption device to flip onto the conveying device, and the conveying device conveys the multi-layer circuit boards to the receiving platform; The manipulator places the multi-layer circuit boards on the receiving platform on the working platform.

7. The drilling method of the multi-layer circuit board according to claim 6, characterized in that, The conveying device includes a machine body and a conveyor belt. The conveyor belt is arranged on the surface of the machine body, and an installation cavity is formed between the bottom of the conveyor belt and the machine body; the carrier includes a support base and a support backrest. One side of the support base close to the conveying device is arranged in the installation cavity, and the bottom of the support backrest is arranged on the surface of the side of the support base away from the conveying device. The surface of the support base is used for placing the multi-layer circuit boards, and the support backrest is used for supporting the multi-layer circuit boards; The adsorption device is arranged between the carrier and the conveying device. The adsorption device includes a plurality of suction cups and a telescopic member for driving the suction cups to approach or move away from the carrier; the flipping device includes a rotating rod and a rotating plate. The rotating rod is arranged on one side of the machine body close to the carrier, the rotating plate is connected to the rotating rod, and barbs are arranged at the bottom of the rotating plate. The rotating rod is used for driving the rotating plate to rotate.

8. A drilling system for a multi-layer circuit board, characterized in that, Including: A feeding mechanism, a drilling machine and a manipulator. The drilling system is used to execute the drilling method of the multi-layer circuit board according to any one of claims 1-7.

9. A storage medium, characterized in that, The storage medium stores computer-executable instructions for causing a computer to execute the drilling method of the multi-layer circuit board according to any one of claims 1-7.

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