A chip PD automated test fixture

Abstract

The present invention provides a chip PD automated test fixture, comprising a communication unit main body assembly, a test docking assembly mounted on top of the communication unit main body assembly, a floating head assembly mounted above the test docking assembly, the communication unit main body assembly being mounted to a test chip sorter via the test docking assembly, and a feed trolley assembly and a discharge trolley being provided on both sides of the test chip sorter. Beneficial effects of the present invention: This test fixture can be applied to the semiconductor automation industry, capable of automated testing of high-power and high-voltage chips, and capable of suppressing discharge during chip PD testing. Furthermore, it can improve test efficiency according to market needs, has a more compact structure, can significantly reduce costs, avoid operator injuries, and achieve a fully automated test process. Furthermore, this test fixture can also develop towards a higher level of automation, safety, intelligence, and high efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip PD testing, and in particular relates to a chip PD automatic testing fixture. Background Art

[0002] Currently, chip PD testing refers to testing high-power chips in a high-voltage environment. Because of this high-voltage environment, chip PD testing may cause discharge. Chip PD testing is performed to ensure stable performance after extended operation. However, with increasingly stringent chip testing environment requirements, implementation becomes increasingly challenging. Existing chip PD testing equipment cannot be integrated with automated equipment, leading to issues such as an inability to implement automated testing, inability to suppress discharge during chip PD testing, inability to perform batch testing during high-voltage chip testing, and only single-chip testing. Furthermore, the inability to maintain inflation pressure requires manual material changes, resulting in low efficiency and safety. Summary of the Invention

[0003] In view of this, the present invention aims to provide a chip PD automated test fixture to solve at least one of the problems existing in the above-mentioned prior art.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0005] A chip PD automated test fixture includes a contact unit main body component, a test docking component is installed on the top of the contact unit main body component, a floating head component is installed above the test docking component, and the contact unit main body component is installed on a test chip sorting machine through the test docking component. A feeding trolley assembly and a discharging trolley are respectively provided on both sides of the test chip sorting machine;

[0006] The main assembly of the communication unit includes a unit main metal frame, a unit main ventilation plate, a chip test socket, a docking assembly locating pin, a nested locating pin, a hard limit block, a nested sealing ring, a pad block, a docking assembly sealing ring and a test socket sealing ring. The unit main metal frame is installed on the surface of the unit main metal frame, and the docking assembly locating pin and the docking assembly sealing ring are installed on one side of the unit main ventilation plate respectively. The unit main ventilation plate is also installed with a nested locating pin and a hard limit block, and the nested locating pin passes through the hard limit block and is installed to the floating head assembly. A nested sealing ring is installed above the hard limit block, a pad block is installed below the unit main metal frame, a chip test socket is installed on one side of the unit main metal frame, and a test socket sealing ring is installed on the chip test socket.

[0007] Furthermore, the communication unit main body assembly also includes a gasket body and a gasket body, and a gasket sealing ring and a gasket body are provided at the connection between the nested positioning pin and the hard limit block.

[0008] Furthermore, a vent is provided on the ventilation plate of the unit body, and an internal air path of the ventilation plate is also provided on the ventilation plate of the unit body.

[0009] Furthermore, an air interface sealing ring is installed on the chip test socket, and the chip test socket is also provided with an air outlet, which is used to cooperate with the floating head assembly.

[0010] Furthermore, a dovetail groove is provided on the hard limit block, and the dovetail groove is used in conjunction with the nested sealing ring. A boss structure is also provided on one side of the hard limit block.

[0011] Furthermore, the floating head assembly includes a tube leg pressing block, a positioning sleeve, a suction rod, a sealing ring 1, a sealing ring 2 and a suction cup. A positioning sleeve is installed on the lower surface of the tube leg pressing block, and a suction rod and a suction cup are also provided below the tube leg pressing block. Sealing ring 1 and sealing ring 2 are also installed inside the tube leg pressing block.

[0012] Furthermore, a plurality of air holes are provided on the tube leg pressing block, and after the pressure-maintaining air comes out of the air outlet, it is blown onto the test chip through the air holes to allow air to flow.

[0013] Compared with the existing technology, the chip PD automated test fixture described in the present invention has the following advantages:

[0014] The chip PD automated test fixture described in the present invention can be used in the semiconductor automation industry. It can perform automated testing on high-power and high-voltage chips, suppress discharge during chip PD testing, and improve test efficiency according to market needs. It has a more compact structure, significantly reduces costs, avoids operator injuries, and realizes a fully automated testing process. In addition, the test fixture can also develop towards higher levels of automation, safety, intelligence, and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which constitute part of the present invention, are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of the test fixture according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the main components of the communication unit according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic top view of the main assembly of the communication unit according to an embodiment of the present invention;

[0019] Figure 4This is a schematic diagram of the connection between the floating head assembly and the chip test socket according to an embodiment of the present invention;

[0020] Figure 5 A schematic diagram of a floating head assembly according to an embodiment of the present invention;

[0021] Figure 6 This is a schematic diagram of the connection between the floating head assembly and the feed trolley assembly according to an embodiment of the present invention;

[0022] Figure 7 This is a schematic diagram of the test position relationship according to an embodiment of the present invention;

[0023] Figure 8 This is a schematic diagram of the test state coordination according to an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] 100. Communication unit main assembly; 101. Unit main metal frame; 102. Unit main vent plate; 1021. Vent; 1022. Vent plate internal air path; 103. Chip test socket; 1031. Air interface seal; 1032. Air outlet; 104. Docking assembly locating pin; 105. Nesting locating pin; 106. Gasket seal; 107. Gasket body; 108. Hard stop; 1081. Dovetail groove; 1082. Boss structure; 109. Nested sealing ring; 110. Heightening block; 111. Sealing ring of docking assembly; 112. Sealing ring of test socket; 200. Floating head assembly; 201. Tube leg pressure block; 2011. Air hole; 202. Positioning sleeve; 203. Suction rod; 204. Sealing ring 1; 205. Sealing ring 2; 206. Suction cup; 300. Feeding trolley assembly; 400. Discharging trolley; 500. Test docking assembly. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0028] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0029] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0030] like Figures 1 to 8 As shown, a chip PD automated test fixture includes a communication unit main body (CUH) assembly 100. A test docking assembly 500 is installed on the top of the communication unit main body assembly 100. A floating head assembly 200 is installed above the test docking assembly 500. The communication unit main body assembly 100 is installed on a test chip sorting machine through the test docking assembly 500. The test chip sorting machine is provided with an infeed trolley assembly 300 and an outfeed trolley 400 on both sides.

[0031] The contact unit main assembly 100 includes a unit main metal frame 101, a unit main ventilation plate 102, a chip test socket 103, a docking assembly positioning pin 104, a nesting positioning pin 105, a gasket seal 106, a gasket body 107, a hard limit block (Hard 108, a nested sealing ring 109, a spacer block 110, a docking assembly sealing ring 111 and a test socket sealing ring 112; the unit main body ventilation plate 102 is installed on the surface of the unit main body metal outer frame 101; a docking assembly locating pin 104 and a docking assembly sealing ring 111 are respectively installed on one side of the unit main body ventilation plate 102; a nested locating pin 105 and a hard stop block 108 are also installed on the unit main body ventilation plate 102; the nested locating pin 105 passes through the hard stop block 108 and is installed to the floating head assembly 200; a gasket sealing ring 106 and a gasket body 107 are provided at the connection between the nested locating pin 105 and the hard stop block 108; a nested sealing ring 109 is installed above the hard stop block 108; a spacer block 110 is installed below the unit main body metal outer frame 101; a chip test socket 103 is installed on one side of the unit main body metal outer frame 101; and a test socket sealing ring 112 is installed on the chip test socket 103. This test fixture requires high-power transmission conditions when testing the PD of some chips, that is, it is necessary to increase the voltage to increase the power. After the high voltage is increased, an arc will be generated, which threatens the product itself. To solve this problem, the present invention adopts high-voltage-resistant materials and multiple ingenious structures to provide a stable, efficient and safe testing environment, realize automated testing, replace manual automatic material replacement, and can also suppress the discharge phenomenon of chip PD testing, realize the pressure maintenance function under the high-voltage test environment of the chip, and protect electronic devices from breakdown.

[0032] In a preferred embodiment of the present invention, the unit main body ventilation plate 102 is provided with a ventilation port 1021, and the unit main body ventilation plate 102 is also provided with an internal ventilation plate air passage 1022. Figure 3 As shown, the vent 1021 and the internal air path 1022 of the vent plate are structural details of the unit main body vent plate 102. The vent 1021 is responsible for connecting the air path with the chip test socket 103. The internal air path 1022 of the vent plate is provided inside the unit main body vent plate 102.

[0033] In a preferred embodiment of the present invention, an air interface sealing ring 1031 is installed on the chip test socket 103 , and the chip test socket 103 is further provided with an air outlet 1032 , which is used to cooperate with the floating head assembly 200 .

[0034] In a preferred embodiment of the present invention, the hard stop block 108 is provided with a dovetail groove 1081, which is used in conjunction with the nested sealing ring 109. A boss structure 1082 is also provided on one side of the hard stop block 108. In this embodiment, Figure 8As shown, dovetail groove 1081 and boss structure 1082 illustrate the structural details of hard stop block 108. Dovetail groove 1081 utilizes a dovetail groove structure. When floating head assembly 200 contacts hard stop block 108 and nested seal ring 109, pressure is applied to nested seal ring 109. The outer diameter of nested seal ring 109 is squeezed by dovetail groove 1081, while the inner diameter deforms due to compression of nested seal ring 109, effectively preventing nested seal ring 109 from falling off and wearing. Boss structure 1082 is used to prevent arcing during chip PD testing, which can lead current through gasket body 107 and affect operators or equipment.

[0035] In a preferred embodiment of the present invention, the floating head assembly 200 includes a tube leg pressing block 201, a positioning sleeve 202, a suction rod 203, a sealing ring 1 204, a sealing ring 205 and a suction cup 206. The positioning sleeve 202 is installed on the lower surface of the tube leg pressing block 201, and a suction rod 203 and a suction cup 206 are also provided below the tube leg pressing block 201. The inside of the tube leg pressing block 201 is also installed with a sealing ring 1 204 and a sealing ring 205.

[0036] In a preferred embodiment of the present invention, the tube leg pressing block 201 is provided with a plurality of air holes 2011. Figure 4 As shown, there are air holes 2011 punched on the leg clamp 201 aligned with the chip legs. During the chip PD test, the pressure-maintaining gas flows out from the outlet 1032 and blows into the chip (IC) surface through the air holes 2011, ensuring that the internal air is in a circulating state during the test and preventing arcing during the PD high voltage test.

[0037] In a preferred embodiment of the present invention, Figure 6 As shown, the floating head assembly 200 cooperates with the shuttle assembly, and the feed trolley assembly 300 and the discharge trolley 400 have the same structure.

[0038] In a preferred embodiment of the present invention, Figure 7 As shown, the contact unit main body assembly 100 is fixed on the test chip handler (Handler) through the test docking assembly 500. The test chip handler (Handler) provides inflation pressure. During testing, the floating head assembly 200 provides downward pressure.

[0039] Example 1

[0040] When the chip test handler (Handler) tests the chip, it is necessary to design a corresponding fixture according to the chip. The local invention mainly performs PD (Power-Delivery) test on the chip, that is, power transmission test, such as Figure 1As shown in the figure, there are five components, which constitute a complete test fixture, referred to as PD test fixture.

[0041] like Figure 1 As shown, the contact unit main assembly 100 is the CUH (Contact Unit Holder), also known as the docking unit, responsible for connecting the chip test handler (handler) and the tester. The floating head assembly 200 is the floating head assembly (Nest), responsible for transporting chips (ICs) and providing test pressure. The input shuttle assembly 300 is the input shuttle assembly, and the output shuttle assembly 400 is the output shuttle assembly (output shuttle). The input shuttle assembly 300 and the output shuttle assembly 400 have the same structure and are collectively referred to as the shuttle, responsible for transporting chips (ICs). The test docking assembly 500 is used to connect the CUH to the chip test handler to achieve automated testing.

[0042] like Figure 2 As shown, the unit body metal frame 101 is responsible for resisting deformation caused by the downward pressure test of the floating head assembly 200, the unit body vent plate 102 is responsible for providing test conditions and transmitting the air pressure required for the test to the test area of ​​each chip test socket 103, the docking assembly locating pin 104 is responsible for positioning with the test docking assembly 500, the nested locating pin 105 is responsible for positioning with the locating sleeve 202, the gasket sealing ring 106 ensures that when the number of gasket bodies 107 is adjusted, the hard limit block 108 and the unit body vent plate 102 can be installed to achieve a sealed state, the nested sealing ring 109 ensures that there is no air leakage when the floating head assembly 200 and the hard limit block 108 contact, and the height of the spacer block 110 is consistent with the thickness of the chip test socket 103 to ensure that the circuit test board (PCB) will not be deformed or damaged during the test. The circuit test board (PCB) is connected to the bottom of the chip test socket 103 and remains sealed. The docking assembly sealing ring 111 ensures that the unit body vent plate 102 and the test docking assembly 500 are sealed when installed, and the test socket sealing ring 112 ensures that the chip test socket 103 and the unit body vent plate 102 are sealed when installed;

[0043] like Figure 7 As shown, when the chip test handler (handler) is inflated, the unit's main vent plate 102 transmits air pressure to the vent port 1021. The chip test socket 103 then transmits the air pressure from the vent port 1021 to the outlet port 1032 of the chip test socket 103. After the air is routed through the unit's main vent plate 102, the gas flows out. When the floating head assembly 200 is pressed downward, a sealed space is formed within the recess of the chip test socket 103. During testing, a sealed space is formed. As gas is filled into this sealed space, the higher the gas pressure, the better the discharge suppression effect.

[0044] Specifically, the following problems are likely to occur during the discharge phenomenon:

[0045] The discharge phenomenon generated during high-voltage chip testing may cause the surrounding air to ionize and form plasma, which may interfere with the accuracy of the test signal and affect the accurate evaluation of chip performance.

[0046] If the heat generated by discharge cannot be dissipated in time, it may cause local overheating, causing thermal damage to the chip, affecting its reliability and lifespan, and may even directly cause chip damage.

[0047] Continuous discharge may also cause electromagnetic interference to the test equipment, affecting the normal operation and measurement accuracy of the equipment, and in the long run may also shorten the service life of the equipment.

[0048] Therefore, the filling of gas and the control of pressure in this embodiment can play the following roles:

[0049] Improved heat dissipation: Filling the chip with a suitable gas and maintaining a certain pressure can enhance the gas's thermal conductivity, helping to dissipate the heat generated by the discharge more quickly and reducing the risk of localized chip overheating. For example, helium has excellent thermal conductivity and, under a certain pressure, can effectively remove heat and maintain the chip temperature within a reasonable range.

[0050] Reducing discharge energy: Appropriate gas pressure can change the gas's insulation properties and electron migration characteristics. For example, filling with sulfur hexafluoride (SF6) gas at high pressure has strong insulation properties, which can inhibit the occurrence of discharge, reduce discharge energy, and minimize the impact on the chip and test environment.

[0051] Stabilize the test environment: By controlling the gas pressure in a confined space, the electric field distribution in the space can be stabilized, reducing electric field fluctuations caused by factors such as air flow, making the test environment more stable and improving the repeatability and accuracy of test results.

[0052] like Figures 4 and 5 As shown, during installation, the air interface seal 1031 mates with the vent 1021, directing air to the outlet 1032 and onto the chip (IC) testing area. The leg clamp 201 is used to position the chip and restrain its legs. The positioning sleeve 202 is responsible for positioning the chip during transport and loading and unloading, and for positioning the chip with the communication unit main assembly 100 during testing. The suction rod 203 and suction cup 206 are responsible for sucking the chip (IC). After exiting the outlet 1032, the air is blown onto the chip (IC) surface through the air hole 2011, ensuring internal air circulation during testing.

[0053] like Figure 6As shown, the floating head assembly 200 is in a coordinated state when picking up materials from the feed trolley assembly 300. The feed trolley assembly 300 transfers the chip to the designated position. The floating head assembly 200 moves to the picking position and turns on the vacuum. The suction cup 206 adsorbs the chip (IC) on the suction rod 203 and moves to the test area. After the test is completed, the floating head assembly 200 places the chip in the discharge trolley 400 for transportation.

[0054] like Figure 7 As shown, the communication unit main body component 100 is installed on the chip test handler (Handler) through the test docking component 500. After the floating head component 200 takes the chip (IC) from the feed trolley component 300, it moves to the top of the communication unit main body component 100 to prepare for testing.

[0055] like Figure 8 As shown, sealing ring 1 204 and sealing ring 205 ensure a hermetic seal within floating head assembly 200. During testing, floating head assembly 200 moves downward, applying downward pressure until it inserts the chip into chip test socket 103 and contacts the hard stop 108 and nested sealing ring 109, achieving a seal. The chip test handler (handler) then inflates the test docking assembly 500 to maintain pressure. This creates a stable and uniform pressure within the test area of ​​each chip test socket 103, protecting the components from the high-voltage test environment during PD testing. After testing, floating head assembly 200 moves the test chip (IC) to the unloading cart 400, completing the testing process.

[0056] This test fixture greatly improves chip testing efficiency, realizes pressure maintenance function, and avoids injuries during operation. This test fixture can replace manual labor, can efficiently and automatically change materials, and can also solve chip PD testing and testing problems in high voltage environments.

[0057] This test fixture can be used in the semiconductor automation industry and can perform automated testing on high-power and high-voltage chips. In addition, it can improve test efficiency according to market needs, has a more compact structure, can greatly reduce costs, and realize a fully automated test process. In addition, this test fixture can also develop towards a higher level of automation, safety, intelligence and high efficiency.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip PD automated test fixture, characterized by: The invention comprises a communication unit main body component (100), a test docking component (500) is installed on the top of the communication unit main body component (100), a floating head component (200) is installed above the test docking component (500), the communication unit main body component (100) is installed on a test chip sorting machine through the test docking component (500), and a feeding trolley component (300) and a discharging trolley (400) are respectively provided on both sides of the test chip sorting machine; The communication unit main body component (100) comprises a unit main body metal outer frame (101), a unit main body ventilation plate (102), a chip test socket (103), a docking component positioning pin (104), a nesting positioning pin (105), a hard limit block (108), a nesting sealing ring (109), a padding block (110), a docking component sealing ring (111) and a test socket sealing ring (112); the unit main body ventilation plate (102) is mounted on the surface of the unit main body metal outer frame (101), and the docking component positioning pins (104) are mounted on one side of the unit main body ventilation plate (102). 4) and a docking assembly sealing ring (111), a nested positioning pin (105) and a hard stop block (108) are also installed on the unit main body vent plate (102), and the nested positioning pin (105) passes through the hard stop block (108) and is installed on the floating head assembly (200), a nested sealing ring (109) is installed above the hard stop block (108), a pad block (110) is installed below the unit main body metal frame (101), a chip test socket (103) is installed on one side of the unit main body metal frame (101), and a test socket sealing ring (112) is installed on the chip test socket (103); A boss structure (1082) is also provided on one side of the hard limit block (108), and the boss structure (1082) is used to lead the current out of the arc generated during the PD test of the blocking chip through the gasket body (107); The chip test socket (103) is also provided with an air outlet (1032). The floating head assembly (200) includes a tube leg pressing block (201). The tube leg pressing block (201) is provided with a plurality of air holes (2011). After the pressure-maintaining air comes out of the air outlet (1032), it is blown onto the test chip through the air holes (2011) to allow air to flow. When the chip test sorting machine is inflated, the unit main body vent plate (102) transmits the air pressure to the vent (1021). At this time, The chip test socket (103) transmits the air pressure of the vent (1021) to the air outlet (1032) of the chip test socket (103), and the gas flows out from the air path after passing through the unit body vent plate (102). When the floating head assembly (200) is pressed down, a closed space is formed in the groove of the chip test socket (103); that is, during testing, a closed space is formed and gas is filled into the closed space. The greater the gas pressure, the better the effect of suppressing the discharge phenomenon.

2. The chip PD automated test fixture according to claim 1, characterized in that: The communication unit main assembly (100) further comprises a gasket sealing ring (106) and a gasket body (107), and the gasket sealing ring (106) and the gasket body (107) are provided at the connection between the nested positioning pin (105) and the hard limit block (108).

3. The chip PD automated test fixture according to claim 1, characterized in that: The unit main body ventilation plate (102) is provided with a ventilation port (1021), and the unit main body ventilation plate (102) is also provided with an internal air passage (1022) of the ventilation plate.

4. The chip PD automated test fixture according to claim 1, characterized in that: An air interface sealing ring (1031) is installed on the chip test socket (103), and the air outlet (1032) is used to cooperate with the floating head assembly (200).

5. The chip PD automated test fixture according to claim 1, characterized in that: The hard limit block (108) is provided with a dovetail groove (1081), which is used in conjunction with the nested sealing ring (109).

6. The chip PD automated test fixture according to claim 4, characterized in that: The floating head assembly (200) comprises a tube leg pressing block (201), a positioning sleeve (202), a suction rod (203), a sealing ring 1 (204), a sealing ring 2 (205) and a suction cup (206); the positioning sleeve (202) is installed on the lower surface of the tube leg pressing block (201); a suction rod (203) and a suction cup (206) are further provided below the tube leg pressing block (201); and a sealing ring 1 (204) and a sealing ring 2 (205) are further installed inside the tube leg pressing block (201).

Images