A recycling system and method for a photovoltaic module

Abstract

The present application relates to a recycling system and method for photovoltaic modules, belonging to the technical field of photovoltaic module recycling, and includes S1, disassembly. First, the photovoltaic module is disassembled to separate the aluminum frame, junction box, and glass-silicon composite board; S2, cutting. The two sides of the glass-silicon composite board are cut simultaneously; S3, separation. The EVA layer in the glass-silicon composite board obtained in S2 is dissolved by a chemical solvent, and at the same time, the glass and silicon wafers are separated to obtain glass sheets and silicon wafers of the same size; S4. By detecting the light transmittance of the silicon wafers, those with better light transmittance are classified into one category for recycling, and those with poor light transmittance are classified into one category for recycling. The silicon wafers with better light transmittance are glass and silicon wafers after physical wear, and the silicon wafers with poorer light transmittance are silicon wafers that can be directly recycled as circuit boards. The present application has the effects of improving the recycling efficiency of photovoltaic modules, saving the cost of intermediate recycling treatment, and facilitating the direct recycling of silicon wafers.

Description

Technical Field

[0001] This application relates to the technical field of photovoltaic module recycling, and in particular to a recycling system and method for photovoltaic modules. Background Art

[0002] Currently, a photovoltaic module refers to an integrated device formed by encapsulating and internally connecting multiple single-crystalline / multi-crystalline silicon cells in series and parallel, which can convert solar energy into direct current electricity. It is one of the most critical components in a photovoltaic power generation system, responsible for converting light energy into electrical energy. With the rapid development of photovoltaic power generation technology and industry in China, photovoltaic panels have been widely used across the country. In recent years, China's newly installed and cumulative installed capacity have ranked first for many consecutive years. However, when the photovoltaic panels exceed their useful life, the discarded photovoltaic modules will generate corresponding solid waste. Due to the environmental advantages of photovoltaic power generation, the photovoltaic industry will enter a new round of rapid development period, and the resulting waste will also increase accordingly.

[0003] Common photovoltaic modules include solar cells, photovoltaic backsheets, photovoltaic frames, photovoltaic solder tapes, glass sheets, EVA, and junction boxes. The photovoltaic modules may be damaged due to factors such as calcification on the glass surface, degradation of the encapsulation performance, internal de-soldering, and strong light exposure, thus requiring replacement. Since the discarded photovoltaic modules contain many recyclable materials, such as glass, plastic sheets, solar panels, aluminum frames, and some precious metals.

[0004] A patent with publication number CN118950220A discloses a photovoltaic cell module recycling system and recycling method, including a crushing device and a feeding device. The feeding device is arranged at the feeding port of the crushing device and is adapted to push the photovoltaic cell module into the crushing device for crushing the photovoltaic cell module. The feeding device includes a first drive shaft, at least one row of pushing blocks, and a plurality of pushing mechanisms. The first drive shaft is rotatably connected to the crushing device. The pushing blocks in the same row are equidistantly arranged on the outer wall of the first drive shaft along the axial direction of the first drive shaft, and the pushing mechanisms correspond to the pushing blocks. The pushing structure is rotatably arranged at the end of the pushing block away from the first drive shaft. When the first drive shaft rotates, the pushing mechanism contacts the inner wall of the feeding port of the crushing device. Due to the blocking of the inner wall of the feeding port on the rotating block, the rotation direction of the pushing mechanism is opposite to the rotation direction of the first drive shaft. Then, when the pushing mechanism resets, the photovoltaic cell module on the clamping column of the pushing block is disengaged.

[0005] In view of the related technologies described above, when recycling photovoltaic modules through the above-mentioned equipment, the photovoltaic panels and glass plates are completely crushed by a crushing component to obtain granular waste materials. Subsequently, through melting and forming and slicing, they are recycled as circuit boards and optical components. Since the purity of the silicon wafers in conventional photovoltaic modules is relatively high, when recycling them as circuit boards and optical components, only the silicon wafer parts that are not physically damaged and not chemically damaged need to be recycled. After surface cleaning and cutting into appropriate sizes, they can be recycled. If they are crushed again and recycled, the intermediate processing efficiency is relatively low, and the cost of intermediate recycling processing is increased. Summary of the Invention

[0006] In order to improve the recycling efficiency of photovoltaic modules, save the cost of intermediate recycling processing, and facilitate the direct recycling of silicon wafers, the present application provides a system and method for recycling photovoltaic modules.

[0007] The system and method for recycling photovoltaic modules provided by the present application adopt the following technical solutions:

[0008] A system and method for recycling photovoltaic modules includes the following steps:

[0009] S1, Disassembly: First, disassemble the photovoltaic module to separate the aluminum frame, junction box, and glass-silicon composite board. The aluminum frame and junction box are directly recycled.

[0010] S2, Cutting: Simultaneously cut both sides of the glass-silicon composite board into sheets of a fixed size.

[0011] S3, Separation: Dissolve the EVA layer in the glass-silicon composite board obtained in S2 through a chemical solvent, and simultaneously separate the glass and the silicon wafer to obtain glass sheets and silicon wafers of the same size.

[0012] S4, Through the transmittance detection of the silicon wafers, those with better transmittance are classified into one category for recycling, and those with poor transmittance are classified into one category for recycling. Those with better transmittance are the glass and the silicon wafers after physical wear, and those with poorer transmittance are the silicon wafers that can be directly recycled as circuit boards.

[0013] By adopting the above technical solution, first, after disassembling the solar panel, the aluminum frame and junction box, which can be directly recycled, are separated, and the glass-silicon composite board is left for recycling. When recycling the glass-silicon, by cutting and separating the composite board, the efficiency of dissolving the EVA layer in the subsequent process is improved, thereby improving the efficiency of separating the glass-silicon in the subsequent process. At the same time, after cutting the composite board into a fixed size, when recycling it as a circuit board later, the subsequent re-cutting process is reduced, thereby improving the recycling efficiency when recycling it as a circuit board later.

[0014] At the same time, after cutting the composite board into a fixed size, it is convenient for the subsequent chemical agent to penetrate and dissolve the EVA layer in the composite board, thereby improving the dissolution efficiency of the EVA layer and reducing the separation time of the glass-silicon in the subsequent process.

[0015] This application also provides a recycling system for photovoltaic modules, including a frame, a workbench arranged on the frame, a cutting component, a separation component and a detection component arranged on the frame and extending along the length direction of the frame; the cutting component is used for cutting the glass-silicon composite board, and the cutting component includes a first adsorbent arranged on the frame for adsorbing the glass, a second adsorbent for adsorbing the silicon wafer, a scribing knife for scribing and cutting the glass, and a cutting piece for cutting the silicon wafer; adsorption holes are formed in both the first adsorbent and the second adsorbent, and negative pressure components are arranged on both the first adsorbent and the second adsorbent, and the negative pressure components provide negative pressure towards the adsorption holes. The first adsorbent includes four first adsorption blocks spliced in sequence, and a cutting groove for the scribing knife to pass through is left between adjacent adsorption blocks. The first cutting groove surrounded by the four first adsorption blocks is in a "cross" shape; the second adsorbent also includes four second adsorption blocks spliced in sequence, and an abutting groove for abutting and cutting the silicon wafer is left between adjacent second adsorption blocks. An abutting block is arranged in the abutting groove in a lifting manner. The first adsorption block is movably attached to the glass surface, the second adsorption block is movably attached to the silicon wafer surface, and both the first adsorption block and the second adsorption block are arranged on the frame in a lifting manner. A driving component for synchronously driving the first adsorption block, the second adsorption block and the scribing knife is also arranged on the frame; when the first adsorption block abuts against the second adsorption block and descends, at this time, the driving component drives the scribing knife to slide along the sliding direction of the cutting groove to scribe and cut the glass surface, and the abutting block abuts against the silicon wafer surface.

[0016] By adopting the above technical solution, when recycling the composite board, first place the composite board on the workbench, and control the first adsorption block to descend through the driving component until the first adsorption block abuts tightly against the glass side and presses the silicon wafer side of the composite board tightly against the second adsorption block.

[0017] Then, the first adsorption block and the second adsorption block are respectively used to adsorb the glass side and the silicon wafer side of the composite board. Under the action of the negative pressure component, negative pressure is generated in both the first adsorption block and the second adsorption block to stably adsorb the composite board. During the process of the driving component driving the first adsorption block to descend and slide, the sliding driving of the scribing knife is realized, so that the scribing knife slides along the glass surface to scribe and cut the glass surface.

[0018] During the process of the second adsorption block descending and sliding under the pressing action of the first adsorption block, it gradually approaches the abutting block until the abutting block protrudes from the abutting groove. Since the surface of the glass has been scribed, under the pressing action of the abutting block, the composite board is divided along the cutting groove and the abutting groove, thereby cutting the composite board.

[0019] And because the common size of photovoltaic modules is 2000mm×1000mm, while the sizes of silicon wafers in common circuit boards are 4 inches (100mm), 6 inches (150mm), 8 inches (200mm), and 12 inches (300mm), so after cutting the photovoltaic module, it is convenient to recycle the silicon wafers in the photovoltaic module according to the silicon wafers of different sizes of circuit boards, reducing the steps of reforming the corresponding size silicon wafers after pyrolysis, thereby improving the recycling efficiency of photovoltaic modules.

[0020] Optionally, the separation component includes a water washing pool arranged on the frame and a liquid storage pool communicated with the water washing pool. A chemical solvent for dissolving EVA is stored in the liquid storage pool. The second adsorption block is movably located in the water washing pool. When the second adsorption block descends into the water washing pool, the liquid storage pool pumps the chemical solvent into the water washing pool;

[0021] A lifting plate is slidably arranged on the water washing pool. A circulation hole is opened on the inner wall of the water washing pool. A piston plate is slidably arranged in the liquid storage pool. And a circulation pipe corresponding to and communicated with the circulation hole is communicated on the liquid storage pool. The piston plate is attached to the inner wall of the liquid storage pool. The lifting plate is attached to the inner wall of the water washing pool;

[0022] When the lifting plate slides towards the bottom wall of the water washing pool, the piston plate moves towards the direction close to the circulation hole;

[0023] When the lifting plate slides away from the bottom wall of the water washing pool, the piston plate moves away from the circulation hole.

[0024] By adopting the above technical solution, since the chemical solvents used to dissolve the EVA layer are usually organic solvents, such solvents often have high volatility. Therefore, they cannot be continuously exposed to the air. When the piston plate moves downward with the first adsorption block fitting against the second adsorption block, the second adsorption block presses against the lifting plate and moves downward, so that the piston plate moves towards the direction close to the flow hole, and then pumps the chemical solvent in the liquid storage tank into the water washing tank, realizing the water washing of the composite plate after cutting in the water washing tank and dissolving the EVA layer.

[0025] After the dissolution is completed, the second adsorption block rises. At this time, during the rising process of the lifting plate, the piston plate is driven to move away from the flow hole, so as to recover and absorb the chemical solvent in the water washing tank into the liquid storage tank for reuse, which is convenient for repeated use in the next water washing. At this time, after the water washing is completed, if the chemical agent continues to stay in the water washing tank, it is easy to cause the volatilization and waste of the chemical agent. Through the above setting, the volatilization of the chemical agent is reduced, thus saving the chemical agent. At the same time, since the silicon wafer and the glass need to be separated after the dissolution of the EVA layer, and after the separation, the silicon wafer and the glass wafer need to be removed from the first adsorption block and the second adsorption block. At this time, the continuously volatilized chemical agent is easy to affect the health of the technicians. After the chemical agent is recovered, it not only achieves the effect of saving the agent but also improves the health of the working environment of the technicians.

[0026] Optionally, a fixed frame is arranged in a lifting manner on the frame. The fixed frame is fixedly connected to the four first adsorption blocks. A first rotating lead screw and a second rotating lead screw are rotatably arranged on the fixed frame. The first rotating lead screw and the second rotating lead screw are arranged vertically. And there are four scribing knives. The four scribing knives correspond to the four cutting grooves one by one. And two scribing knives in the same extending direction are threadedly assembled on the first rotating lead screw, and the other two scribing knives are threadedly assembled on the second rotating lead screw. The first rotating lead screw and the second rotating lead screw are symmetrically provided with external threads with opposite threads and the same pitch. And a synchronizing member for synchronously rotating the first rotating lead screw and the second rotating lead screw when the first adsorption block is lifted and adjusted is further arranged on the fixed frame.

[0027] By adopting the above technical solution, when the first adsorption block descends to fit against the surface of the glass plate, during the process of the first adsorption block pressing against the second adsorption block and descending, under the action of the synchronizing member, the first rotating lead screw and the second rotating lead screw rotate synchronously. Since the first rotating lead screw and the second rotating lead screw are both provided with external threads with opposite threads and the same pitch, when the first rotating lead screw rotates, the two scribing knives on the first rotating lead screw move in opposite directions, so that the scribing knives slide along the cutting grooves to cut the surface of the glass plate, which is convenient for subsequent cutting of the glass plate.

[0028] The cross-shaped cutting grooves and abutting grooves provided facilitate the cutting and separation of the composite board.

[0029] Optionally, the synchronizing member includes a first worm coaxially arranged on the first rotating lead screw and a first worm gear coaxially arranged on the second rotating lead screw. A fixed rack is provided on the frame, and a fixed gear is provided on the end side of the first rotating lead screw. The fixed rack meshes with the fixed gear.

[0030] By adopting the above technical solution, when the first adsorption block descends, the fixed rack on the first adsorption block descends to a position meshing with the fixed rack. At this time, the fixed rack is set to drive the fixed gear to rotate. When the fixed gear rotates, it drives the first rotating lead screw to rotate, thereby driving the first worm and the first worm gear to rotate, so that the first rotating lead screw and the second rotating lead screw rotate synchronously, thereby realizing the sliding adjustment of the two groups of scribing knives.

[0031] Optionally, the negative pressure member includes an adsorption disc provided at the adsorption hole. A negative pressure block is slidably arranged at the center of the adsorption disc. The adsorption disc is attached to the surface of the silicon wafer / glass. The negative pressure block is movably attached to the inner surface of the adsorption disc, and a linkage member for sliding adjustment of the negative pressure block is further provided on the frame.

[0032] By adopting the above technical solution, when the first adsorption block is attached to the glass surface and the second adsorption block is attached to the silicon wafer surface, at this time, the linkage member is set to make the negative pressure block on the first adsorption block move towards the surface away from the first adsorption block, and the negative pressure block on the second adsorption block move towards the surface away from the second adsorption block, so that the adsorption disc stably adsorbs the surface of the glass, facilitating the subsequent adsorption of the glass and the silicon wafer.

[0033] Optionally, the linkage member includes a linkage gear provided on the first adsorption block. A first linkage rack is slidably arranged on the first adsorption block, and a second linkage rack is slidably arranged on the second adsorption block. Both the first linkage rack and the second linkage rack mesh with the linkage gear. A power gear is coaxially arranged on the linkage gear. A power rack is provided on the frame. The power rack meshes with the power gear. A limiting member for limiting the second adsorption block is further provided on the frame.

[0034] By adopting the above technical solution, during the process of the first adsorption block pressing against the second adsorption block and descending, at this time, the power rack on the frame meshes with the power gear to rotate, thereby driving the power gear to rotate. The power gear and the linkage gear are coaxial, so as to drive the linkage gear to rotate. During the rotation of the linkage gear, it drives the sliding of the first linkage rack and the second linkage rack, thereby realizing the sliding of the negative pressure blocks on the first adsorption block and the second adsorption block, realizing the negative pressure inside the adsorption disc, and realizing the stable adsorption between the adsorption disc and the surface of the glass plate and between the adsorption disc and the surface of the silicon wafer.

[0035] During the subsequent ascending process of the first adsorption block, the provided limiting member limits the second adsorption block, restricting the ascent of the second adsorption block. At this time, the first adsorption block adsorbs to the glass, and the second adsorption block adsorbs to the silicon wafer. Therefore, during the ascending process of the first adsorption block, the washed composite plate is separated from the glass and the silicon wafer.

[0036] Optionally, the limiting member includes a limiting block elastically and slidably arranged on the frame. A limiting groove is formed on the side wall of the first adsorption block. The limiting block is movably clamped with the limiting groove, and the side wall of the limiting block is inclined. The inclined side of the limiting block is movably attached and pressed against the side wall of the first adsorption block. And when the first adsorption block slides to a height higher than that of the water washing tank, an unlocking member for unlocking the limiting block is provided on the frame.

[0037] By adopting the above technical solution, during the descending process of the second adsorption block, the second adsorption block descends along the inclined side of the limiting block, causing the limiting block to sink into the frame. Until the second adsorption block descends to a position where the limiting groove corresponds to the limiting block, at this time, the limiting block automatically inserts into the limiting groove under the action of the elastic restoring force. Under the clamping action of the limiting block, the position of the first adsorption block is limited, thereby realizing the separation of the first adsorption block and the second adsorption block.

[0038] At the same time, through the provided unlocking member, when the first adsorption block slides to a height higher than that of the water washing tank, at this time, the unlocking member unlocks the limiting block, so that the limiting block sinks into the frame. At this time, the limiting block releases the limit on the second adsorption block. Since the second adsorption block is elastically and slidably arranged in the water washing tank, under the action of the elastic restoring force, the second adsorption block slides in the direction away from the water washing tank, transmitting the cut and separated silicon wafer upward. At the same time, during the upward movement of the second adsorption block, at this time, the power gear rises to a position meshing with the power rack, thereby driving the power gear and the linkage gear to rotate, slidingly adjusting the negative pressure block, and further realizing the pressure relief operation of the adsorption disc on the second adsorption block. After the second adsorption block lifts the silicon wafer out of the water washing tank, it is convenient for relevant technicians to take out the silicon wafer, thus facilitating the subsequent light transmission detection operation.

[0039] Optionally, the linkage gear is in the form of a semi-gear, and the linkage gear meshes with either the first linkage rack or the second linkage rack movably;

[0040] When the second adsorption block descends to the position where the power gear meshes with the power rack, at this time, the linkage gear meshes with the first linkage rack.

[0041] By adopting the above technical solution, during the process of the first adsorption block pressing against the second adsorption block and descending, when the power gear descends to the position where it meshes with the power rack, since the linkage gear is in the form of a semi-gear, at this time, the linkage gear meshes with the first linkage rack. When the power rack drives the power gear to rotate, the first linkage rack slides, so that the suction cup on the first adsorption block maintains negative pressure, thereby stably adsorbing the glass plate. During the process of the second adsorption block continuing to descend, the linkage gear rotates to the position where it meshes with the second linkage rack. At this time, the rotation of the linkage gear drives the second linkage rack to slide, so as to realize the negative pressure in the suction cup on the second adsorption block, and stably adsorb the silicon wafer. Thus, after the eva layer is dissolved subsequently, the separation of the silicon wafer and the glass sheet is realized.

[0042] Since the linkage gear is arranged on the second adsorption block at this time, during the process of the first adsorption block ascending, at this time, due to the second adsorption block not ascending under the action of the limiting member, at this time, the power gear does not ascend to the position where it meshes with the power rack, so the power gear does not rotate. Therefore, at this time, the negative pressure in the suction cups on the second adsorption block and the first adsorption block does not generate pressure relief, thus generating stable adsorption, and thus realizing the stable separation of the glass and the silicon wafer.

[0043] In summary, the present application includes at least one of the following beneficial technical effects:

[0044] 1. By first disassembling the photovoltaic module and then cutting it, it is convenient to recycle according to the sizes of silicon wafers required for different circuit boards, reducing the steps of re-thermal cracking and forming the silicon wafers, thereby improving the recycling efficiency;

[0045] 2. Through the first adsorption block and the second adsorption block arranged in a lifting manner, the scribing knife slidably arranged relative to the first adsorption block, and the abutting block slidably arranged relative to the second adsorption block, different cutting methods are adopted according to the different characteristics of the glass and the silicon wafer. After scribing the glass, the abutting block presses against the silicon wafer, so as to realize the cutting of the glass-silicon wafer composite board. Since the cutting of the composite board by the abutting block is carried out in a chemical agent, in the liquid, the surface tension of the glass changes, which is convenient for cutting and not easy to break, thereby improving the cutting accuracy and cutting integrity;

[0046] 3. Before putting the cut composite board into the water washing tank to dissolve the EVA layer, by means of the provided suction disc and the negative pressure block slidably arranged on the suction disc, the negative pressure block is adjusted so that the first suction block and the second suction block respectively adsorb the glass and the silicon wafer, which facilitates the separation of the glass and the silicon wafer after the EVA layer is dissolved subsequently. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic diagram of the overall structure of a photovoltaic module recycling system in an initial state according to an embodiment of the present application;

[0048] Figure 2 is a schematic diagram of the connection structure of the separation component and the cutting component;

[0049] Figure 3 is Figure 2 an enlarged schematic diagram of part A in

[0050] Figure 4 is Figure 2 an enlarged schematic diagram of part B in

[0051] Figure 5 is a schematic diagram of the connection structure of the first suction block;

[0052] Figure 6 is a schematic diagram of the connection structure of the second suction block;

[0053] Figure 7 is a schematic diagram of the connection structure when the first suction block and the second suction block clamp the composite board;

[0054] Figure 8 is a schematic diagram of the overall structure of a photovoltaic module recycling system in an initial state from another perspective;

[0055] Figure 9 is a schematic diagram of the connection structure of the scribing knife.

[0056] Reference numerals: 1, frame; 11, workbench; 12, glass; 13, silicon wafer; 2, cutting assembly; 21, first adsorption block; 22, second adsorption block; 23, scribing knife; 24, cutting member; 241, abutting block; 25, cutting groove; 26, abutting groove; 27, driving member; 271, first rotating lead screw; 272, second rotating lead screw; 28, synchronizing member; 281, first worm; 282, first worm gear; 283, fixed gear; 284, fixed rack; 29, fixed frame; 3, separating assembly; 31, water washing tank; 32, liquid storage tank; 33, lifting plate; 34, piston plate; 35, through hole; 4, negative pressure member; 41, adsorption hole; 42, adsorption disc; 43, negative pressure block; 44, linkage member; 441, linkage gear; 442, first linkage rack; 443, second linkage rack; 444, power gear; 445, power rack; 45, limiting member; 451, limiting block; 452, limiting groove; 453, limiting spring; 46, unlocking member; 461, unlocking block; 462, adjusting block; 5, mounting block; 51, mounting hole; 52, mounting spring; 53, mounting rod. Detailed implementation mode

[0057] The following is a further detailed description of the present application in conjunction with the attached Figures 1-9 drawings.

[0058] The embodiment of the present application first discloses a method for recycling photovoltaic modules, including the following steps: S1, disassembly. First, disassemble the photovoltaic module to separate the aluminum frame, junction box, and glass 12-silicon wafer 13 composite board. The aluminum frame and junction box are directly recycled.

[0059] S2, cutting. Cut both sides of the glass 12-silicon wafer 13 composite board simultaneously into sheets of a fixed size.

[0060] S3, separation. Dissolve the eva layer in the middle of the glass 12-silicon wafer 13 composite board obtained in S2 through a chemical solvent, and at the same time separate the glass 12 and the silicon wafer 13 to obtain glass 12 sheets and silicon wafers 13 of the same size.

[0061] S4, by detecting the light transmittance of the silicon wafer 13, classify those with better light transmittance into one category for recycling, and those with poor light transmittance into one category for recycling. Those with better light transmittance are the glass 12 and the silicon wafer 13 after physical wear, and those with poorer light transmittance are the silicon wafers 13 that can be directly recycled as circuit boards.

[0062] At the same time, the present application also provides a photovoltaic module recycling system for recycling photovoltaic modules. Refer to Figure 1, A recycling system for photovoltaic modules includes a vertically fixed rack 1. A workbench 11 is fixedly connected to the middle of the rack 1. Along the height direction of the rack 1, a cutting assembly 2 for cutting a glass 12-silicon wafer 13 composite board and a separating assembly 3 for separating the composite board are provided on the rack 1.

[0063] Refer to Figures 1-5 , The cutting assembly 2 includes a first adsorbent and a second adsorbent that are arranged in a lifting manner on the rack 1. The first adsorbent and the second adsorbent are arranged opposite to each other, and the sliding directions of the first adsorbent and the second adsorbent are both consistent with the height direction of the rack 1. The first adsorbent includes four first adsorption blocks 21 that are spliced into a square. A cutting groove 25 is left between adjacent first adsorption blocks 21, and the cutting grooves 25 between the four first adsorption blocks 21 enclose a "cross" shape. A fixing frame 29 is arranged on the rack 1 in a lifting manner. The fixing frame 29 is fixedly connected to the four first adsorption blocks 21, and a lifting cylinder for driving the lifting of the fixing frame 29 is provided on the positive side. At the same time, a scribing knife 23 is slidably arranged on the fixing frame 29. There are four scribing knives 23, and the four scribing knives 23 correspond to the four cutting grooves 25, and the end sides of the four scribing knives 23 are in contact with the surface of the glass 12.

[0064] The second adsorbent includes a second adsorption block 22 that is slidably arranged on the workbench 11. There are four second adsorption blocks 22, and the four second adsorption blocks 22 enclose a square shape. A cutting groove 25 is left between the four second adsorption blocks 22, and the cutting groove 25 is in a "cross" shape. A cutting member 24 for cutting the silicon wafer 13 is further provided on the workbench 11. The cutting member 24 is an abutting block 241 arranged on the workbench 11, and the abutting block 241 corresponds to the cutting groove 25. When the second adsorption block 22 descends, the abutting block 241 protrudes out of the cutting groove 25. A driving member 27 for synchronously driving the first adsorption block 21, the second adsorption block 22, and the scribing knife 23 is further provided on the rack 1.

[0065] Refer to Figure 1 and Figure 2, the driving member 27 includes a first rotating lead screw 271 and a second rotating lead screw 272 rotatably arranged on the fixing frame 29. The first rotating lead screw 271 is consistent with the transverse extension direction of the cutting groove 25, and the second rotating lead screw 272 is consistent with the longitudinal extension direction of the cutting groove 25. The first rotating lead screw 271 and the second rotating lead screw 272 are arranged perpendicular to each other. The four scribing knives 23 are divided into two groups along the transverse extension direction and the longitudinal extension direction of the cutting groove 25. The first rotating lead screw 271 and the second rotating lead screw 272 are symmetrically provided with external threads with the same pitch and opposite threads. Two scribing knives 23 in one group are symmetrically arranged on the first rotating lead screw 271 by threads, and two scribing knives 23 in the other group are symmetrically arranged on the second rotating lead screw 272 by threads. And a synchronizing member 28 for synchronously rotating and driving the first rotating lead screw 271 and the second rotating lead screw 272 when the first adsorption block 21 descends is further provided on the frame 1.

[0066] The synchronizing member 28 includes a first worm 281 coaxially arranged with the first rotating lead screw 271 and a first worm wheel 282 coaxially arranged with the second rotating lead screw 272. The first worm 281 is engaged with the first worm wheel 282. A fixed rack 284 is fixedly connected to the frame 1. A fixed gear 283 is coaxially fixed on the first rotating lead screw 271. And the fixed rack 284 is engaged with the fixed gear 283.

[0067] Referring to Figure 2 , a receiving groove is formed in the middle of the workbench 11. The separating assembly 3 is embedded with a water washing pool 31 in the receiving groove and a liquid storage pool 32 fixed in the workbench 11. A chemical agent for dissolving eva is stored in the liquid storage pool 32. The chemical agent in this application is acetone. In other embodiments, the chemical agent can be one of ethanol, tetrahydrofuran, dichloromethane, dimethylformamide, etc.

[0068] At the same time, a lifting plate 33 is slidably arranged in the water washing pool 31. The lifting plate 33 is located at the bottom side of the first adsorption block 21, and the lifting plate 33 is movably attached to the inner peripheral wall of the water washing pool 31. And a circulation hole 35 is formed in the side wall of the water washing pool 31. A lifting plate 33 is slidably arranged on the water washing pool 31, a piston plate 34 is slidably arranged in the liquid storage pool 32, and a circulation pipe corresponding to and communicating with the circulation hole 35 is communicated with the liquid storage pool 32. The piston plate 34 is attached to the inner wall of the liquid storage pool 32, and the lifting plate 33 is attached to the inner wall of the water washing pool 31; when the lifting plate 33 slides towards the bottom wall of the water washing pool 31, the piston plate 34 moves towards the direction close to the circulation hole 35; when the lifting plate 33 slides away from the bottom wall of the water washing pool 31, the piston plate 34 moves away from the circulation hole 35.

[0069] Since the chemical solvents used to dissolve the EVA layer are usually organic solvents, such solvents often have high volatility. Therefore, they cannot be continuously exposed to the air. When the piston plate 34 moves downward as the first adsorption block 21 fits against the second adsorption block 22, the second adsorption block 22 presses against the lifting plate 33 and moves downward, causing the piston plate 34 to move towards the direction close to the flow hole 35. As a result, the chemical solvent in the liquid storage tank 32 is pumped into the water washing tank 31 to wash the cut composite board in the water washing tank 31 and dissolve the EVA layer.

[0070] After the dissolution is completed, the second adsorption block 22 rises. During the rising process of the lifting plate 33 at this time, the piston plate 34 is driven to move away from the flow hole 35, thereby recovering and sucking the chemical solvent in the water washing tank 31 into the liquid storage tank 32 for reuse.

[0071] Refer to Figure 4 、 Figure 5 and Figure 6 In order to separate the silicon wafer 13 and the glass 12 plate after dissolving the EVA layer in the water washing tank 31, adsorption holes 41 are provided on both the first adsorption block 21 and the second adsorption block 22. Negative pressure members 4 for generating negative pressure in the adsorption holes 41 are provided on both the first adsorption block 21 and the second adsorption block 22. The negative pressure member 4 includes an adsorption disc 42 fixed to the first adsorption block 21 and the second adsorption block 22. The adsorption disc 42 on the first adsorption block 21 is in contact with the surface of the glass 12, and the adsorption disc 42 on the second adsorption block 22 is in contact with the surface of the silicon wafer 13. The adsorption hole 41 is located at the center of the adsorption disc 42. The adsorption disc 42 is disc-shaped, and in this application, the adsorption disc 42 is made of a soft material that cannot be dissolved by organic solvents. The material of the adsorption disc 42 can be one or more of polytetrafluoroethylene, polyvinyl chloride, silicone, etc.

[0072] A negative pressure block 43 is also slidably provided at the adsorption hole 41 of the adsorption disc 42. The sliding direction of the negative pressure block 43 is consistent with the height direction of the frame 1. The negative pressure block 43 is in movable contact with the inner wall of the adsorption disc 42. The frame 1 is also provided with a linkage member 44 for synchronously sliding and adjusting the negative pressure blocks 43 on the first adsorption block 21 and the second adsorption block 22.

[0073] The linkage member 44 includes a linkage gear 441 rotatably provided on the second adsorption block 22. A first linkage rack 442 is slidably provided on the first adsorption block 21, and a second linkage rack 443 is slidably provided on the second adsorption block 22. The first linkage rack 442 is connected to the negative pressure block 43 on the first adsorption block 21, and the second linkage rack 443 is connected to the negative pressure block 43 on the second adsorption block 22. Both the first linkage rack 442 and the second linkage rack 443 are engaged with the linkage gear 441.

[0074] Meanwhile, a power gear 444 is coaxially provided on the first adsorption block 21 with the linkage gear 441. A power rack 445 is provided on the frame 1, and the power rack 445 meshes with the power gear 444. At the same time, the linkage gear 441 is in the form of a semi-gear, and the linkage gear 441 selectively meshes with the first linkage rack 442 or the second linkage rack 443. When the first adsorption block 21 descends to the position where the power gear 444 meshes with the power rack 445, the linkage gear 441 rotates to the position where it meshes with the first linkage rack 442. When the linkage gear 441 rotates to the position where it disengages from the first linkage rack 442, at this time, the linkage gear 441 meshes with the second linkage rack 443.

[0075] Thus, during the process of the first adsorption block 21 pressing against the second adsorption block 22 and descending, at this time, the power rack 445 on the frame 1 meshes with the power gear 444 to drive the power gear 444 to rotate. Since the power gear 444 is coaxially arranged with the linkage gear 441, the linkage gear 441 is driven to rotate. During the rotation of the linkage gear 441, the sliding of the first linkage rack 442 and the second linkage rack 443 is driven, thereby realizing the sliding of the negative pressure blocks 43 on the first adsorption block 21 and the second adsorption block 22, realizing the negative pressure inside the suction disc 42, and realizing the stable adsorption between the surface of the suction disc 42 and the glass 12 plate and between the surface of the suction disc 42 and the silicon wafer 13.

[0076] Refer to Figure 7 and Figure 8 In order to facilitate the subsequent separation operation of the silicon wafer 13 and the glass 12, a limiting member 45 for limiting the second adsorption block 22 is further provided in the water washing tank 31. During the ascending process of the first adsorption block 21, the provided limiting member 45 limits the second adsorption block 22 to prevent it from ascending. At this time, the first adsorption block 21 adsorbs the glass 12, and the second adsorption block 22 adsorbs the silicon wafer 13. Thus, during the ascending process of the first adsorption block 21, the washed composite plate is separated into the glass 12 and the silicon wafer 13.

[0077] An embedding groove is formed on the lifting plate 33, and the second adsorption block 22 is movably located in the embedding groove. The limiting member 45 includes a limiting block 451 slidably arranged on the inner side wall of the embedding groove. A limiting groove 452 is formed on the outer side wall of the second adsorption block 22. The limiting block 451 is movably inserted and engaged with the limiting groove 452, and a limiting spring 453 is fixedly connected to the limiting block 451. One end of the limiting spring 453 is fixedly connected to the inner wall of the embedding groove. The top side of the limiting block 451 is inclined, and the inclined side of the limiting block 451 is movably attached and pressed against the side wall of the first adsorption block 21. At the same time, an unlocking member 46 for unlocking the limiting block 451 is further provided on the frame 1.

[0078] Refer to Figure 7, the unlocking member 46 includes an unlocking block 461 slidably disposed within the frame 1. The unlocking block 461 is elastically slidably disposed within the side wall of the water washing tank 31. The sliding direction of the unlocking block 461 is consistent with the width direction of the water washing tank 31. The limiting block 451 is slidably disposed on the unlocking block 461, and the sliding direction of the limiting block 451 is consistent with the height direction of the unlocking block 461. At the same time, an adjusting block 462 is further provided on the unlocking block 461. One end of the adjusting block 462 is movably located within the water washing tank 31. The end side of the adjusting block 462 located within the water washing tank 31 is spherical. The spherical side of the adjusting block 462 is in close contact with the side wall of the first adsorption block 21.

[0079] When the first adsorption block 21 slides to a height higher than that of the water washing tank 31, at this time, the first adsorption block 21 presses against the adjusting block 462, causing the adjusting block 462 to slide towards the inner side wall direction of the water washing tank 31 that is submerged. The adjusting block 462 drives the limiting block 451 to slide, thereby unlocking the limiting block 451, so that the limiting block 451 is submerged into the lifting plate 33. At this time, the limiting block 451 releases the limit on the second adsorption block 22. Since the second adsorption block 22 is elastically slidably disposed within the water washing tank 31, under the action of the elastic restoring force, the second adsorption block 22 slides towards the outside direction of the water washing tank 31, transmitting the cut and separated silicon wafer 13 upwards. At the same time, during the upward movement of the second adsorption block 22, at this time, the driving gear 444 rises to a position meshed with the driving rack 445, thereby driving the driving gear 444 and the linkage gear 441 to rotate, slidingly adjusting the negative pressure block 43, and further realizing the pressure relief operation of the suction cup 42 on the second adsorption block 22. After the second adsorption block 22 lifts the silicon wafer 13 out of the water washing tank 31, it is convenient for relevant technicians to take out the silicon wafer 13, thereby facilitating subsequent light transmission detection operations.

[0080] At the same time, it should be considered that when the abutting block 241 needs to press against the silicon wafer 13 for cutting, in order to avoid the abutting of the abutting block 241 against the scribing knife 23, which affects the cutting accuracy of the scribing knife 23, referring to Figure 9 , mounting blocks 5 are threadedly assembled on both the first rotating lead screw 271 and the second rotating lead screw 272. The scribing knife 23 is elastically disposed within the mounting block 5. A mounting spring 52 is fixedly connected to the side of the scribing knife 23 away from the surface of the glass 12. A mounting hole 51 is formed on the scribing knife 23. A mounting rod 53 is provided on the fixed frame 29. The mounting rod 53 movably passes through the mounting hole 51, and the length of the mounting rod 53 is shorter than the stroke of the scribing knife 23. When the first adsorption block 21 descends to the position where the abutting block 241 is located within the abutting groove 26, at this time, the scribing knife 23 slides to the outermost side position under the sliding of the mounting block 5. At this time, the scribing knife 23 has no limit of the mounting rod 53, so it can slide relative to the mounting block 5, thereby reducing the collision and wear with the scribing knife 23 during subsequent abutting cutting.

[0081] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereby. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A photovoltaic module recycling system, characterized in that: It comprises a frame (1), a workbench (11) arranged on the frame (1), a cutting component (2) arranged on the frame (1) and extending along the length direction of the frame (1), a separation component (3) and a detection component; The cutting component (2) is used to cut a glass (12)-silicon wafer (13) composite plate, and comprises a first adsorption member arranged on the frame (1) for adsorbing the glass (12), a second adsorption member for adsorbing the silicon wafer (13), a scribing knife (23) for scribing and cutting the glass (12), and a cutting member (24) for cutting the silicon wafer (13); The first adsorption member and the second adsorption member are both provided with adsorption holes (41), and the first adsorption member and the second adsorption member are both provided with negative pressure members (4), and the negative pressure members (4) provide negative pressure toward the adsorption hole (41); the first adsorption member comprises four first adsorption blocks (21) connected in sequence, and cutting grooves (25) for the scribing knife (23) to pass through are left between adjacent first adsorption blocks (21); the first cutting grooves (25) surrounded by the four first adsorption blocks (21) are in the shape of a "cross"; The second adsorption component also comprises four second adsorption blocks (22) which are spliced ​​in sequence, and an abutment groove (26) for abutting and cutting the silicon wafer (13) is left between adjacent second adsorption blocks (22), and an abutment block (241) is arranged in a lifting manner in the abutment groove (26); the first adsorption block (21) is movably attached to the surface of the glass (12), and the second adsorption block (22) is movably attached to the surface of the silicon wafer (13), and the first adsorption block (21) and the second adsorption block (22) are both arranged in a lifting manner on the frame (1), and the frame (1) is also provided with a driving component (27) for synchronously driving the first adsorption block (21), the second adsorption block (22) and the scribing knife (23); When the first adsorption block (21) is pressed against the second adsorption block (22) and descends, the driving member (27) drives the scribing knife (23) to slide along the sliding direction of the cutting groove (25) to scribing and cutting the surface of the glass (12), and the abutment block (241) is pressed against the surface of the silicon wafer (13); The separation component (3) comprises a water washing tank (31) arranged on the frame (1) and a liquid storage tank (32) connected to the water washing tank (31); a chemical solvent for dissolving the EVA layer is stored in the liquid storage tank (32); the second adsorption block (22) is movably located in the water washing tank (31); when the second adsorption block (22) descends into the water washing tank (31), the liquid storage tank (32) pumps the chemical solvent into the water washing tank (31); A lifting plate (33) is slidably provided on the water washing tank (31), a circulation hole (35) is provided on the inner wall of the water washing tank (31), a piston plate (34) is slidably provided in the liquid storage tank (32), and a circulation pipe corresponding to the circulation hole (35) is provided on the liquid storage tank (32), the piston plate (34) is in contact with the inner wall of the liquid storage tank (32), and the lifting plate (33) is in contact with the inner wall of the water washing tank (31); When the lifting plate (33) slides toward the bottom wall of the water washing tank (31), the piston plate (34) moves toward a direction close to the circulation hole (35); When the lifting plate (33) slides away from the bottom wall of the water washing tank (31), the piston plate (34) moves in a direction away from the circulation hole (35); The frame (1) is provided with a fixed frame (29) in a lifting manner, the fixed frame (29) is fixedly connected to the four first adsorption blocks (21), the fixed frame (29) is rotatably provided with a first rotating screw rod (271) and a second rotating screw rod (272), the first rotating screw rod (271) and the second rotating screw rod (272) are arranged vertically, and four scribing knives (23) are provided, the four scribing knives (23) correspond to the four cutting grooves (25) one by one, and two scribing knives (23) in the same extension direction are arranged on the same cutting groove (25). 23) are threadedly assembled on the first rotating screw (271), and the other two scribing knives (23) are threadedly assembled on the second rotating screw (272), the first rotating screw (271) and the second rotating screw (272) are symmetrically provided with external threads with opposite threads and the same pitch, and the fixing frame (29) is also provided with a synchronizing member (28) for synchronously rotating the first rotating screw (271) and the second rotating screw (272) when the first adsorption block (21) is raised and lowered; The recycling system is applied to a photovoltaic module recycling method, comprising the following steps: S1, disassembly, first disassembling the photovoltaic module to separate the aluminum frame, the junction box, and the glass (12)-silicon wafer (13) composite board, and directly recycling the aluminum frame and the junction box; S2, cutting, cutting both sides of the glass (12)-silicon wafer (13) composite plate simultaneously into sheets of fixed size; S3, separation, dissolving the EVA layer in the middle of the glass (12)-silicon wafer (13) composite plate obtained in S2 by using a chemical solvent, and separating the glass (12) and the silicon wafer (13) at the same time, to obtain glass (12) sheets and silicon wafer (13) of the same size; S4, by testing the transmittance of the silicon wafer (13), the ones with better transmittance are classified into one category for recycling, and the ones with poor transmittance are classified into another category for recycling. The ones with better transmittance are glass (12) and silicon wafers (13) after physical wear, and the ones with poor transmittance are silicon wafers (13) that can be directly recycled as circuit substrates.

2. A photovoltaic module recycling system according to claim 1, characterized in that: The synchronous member (28) comprises a first bevel gear coaxially arranged on the first rotating screw (271) and a second bevel gear coaxially arranged on the second rotating screw (272); a fixed rack (284) is provided on the frame (1); a fixed gear (283) is provided on the end side of the first rotating screw (271); and the fixed rack (284) is meshed with the fixed gear (283).

3. A photovoltaic module recycling system according to claim 2, characterized in that: The negative pressure member (4) comprises a suction plate arranged at the suction hole (41), a negative pressure block (43) being slidably arranged at the center of the suction plate, the suction plate being in contact with the surface of the silicon wafer (13) / glass (12), the negative pressure block (43) being movably in contact with the inner surface of the suction plate, and a linkage member (44) for slidingly adjusting the negative pressure block (43) is also provided on the frame (1).

4. A photovoltaic module recycling system according to claim 3, characterized in that: The linkage member (44) comprises a linkage gear (441) provided on the second adsorption block (22); a first linkage rack (442) is slidably provided on the first adsorption block (21); a second linkage rack (443) is slidably provided on the second adsorption block (22); the first linkage rack (442) and the second linkage rack (443) are both meshed with the linkage gear (441); a power gear (444) is coaxially provided on the linkage gear (441); a power rack (445) is provided on the frame (1); the power rack (445) is meshed with the power gear (444); and a limiting member (45) for limiting the second adsorption block (22) is also provided on the frame (1).

5. A photovoltaic module recycling system according to claim 4, characterized in that: The limiting member (45) comprises a limiting block (451) elastically slidably arranged on the frame (1); a limiting groove (452) is provided on the side wall of the first adsorption block (21); the limiting block (451) is movably engaged with the limiting groove (452); the side wall of the limiting block (451) is inclined; the inclined side of the limiting block (451) is movably fitted and tightly pressed against the side wall of the first adsorption block (21); and when the first adsorption block (21) slides to a height higher than the washing tank (31), an unlocking member (46) for unlocking the limiting block (451) is provided on the frame (1).

6. A photovoltaic module recycling system according to claim 5, characterized in that: The linkage gear (441) is in the form of a half gear, and the linkage gear (441) is movably meshed with either the first linkage rack (442) or the second linkage rack (443); When the second adsorption block (22) descends to a position where the power gear (444) meshes with the power rack (445), the linkage gear (441) meshes with the first linkage rack (442).

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