A solder nozzle structure and soldering system for wave soldering

Abstract

This invention relates to the field of wave soldering equipment components, specifically a solder nozzle structure and welding system for wave soldering. It includes a vertically arranged first side plate, a second side plate, and two sets of parallel end plates. The first and second side plates are fixedly connected between the two sets of end plates, and an adjusting plate is rotatably connected between the two sets of end plates. After the molten solder moves to a certain position on the guide plate, it falls into the corresponding collection box. When the amount of molten solder in the collection box reaches a certain level, the collection box moves downward, driving the drive structure. When the drive structure is working, it drives the first and second filter plates to move. During movement, the first and second filter plates are cleaned by a cleaning structure, thus ensuring the filtration effect of the first and second filter plates on the molten solder and guaranteeing the amount of molten solder output during subsequent solder joint welding, improving work efficiency and ease of use.

Description

Technical Field

[0001] This invention relates to the field of wave soldering equipment components, specifically to a solder nozzle structure and welding system for wave soldering. Background Technology

[0002] The soldering of circuit boards often requires the use of wave soldering furnaces. Wave soldering is a process in which molten liquid solder is pumped to form a solder wave of a specific shape on the surface of the solder bath. The circuit board with the inserted components is placed on the conveyor chain and passes through the solder wave at a specific angle and a certain immersion depth to achieve the solder joint soldering.

[0003] Existing wave soldering nozzles are prone to filter clogging due to oxides after prolonged use, requiring periodic disassembly and cleaning, which reduces work efficiency. At the same time, cleaning the filter board is necessary to ensure soldering quality. Therefore, a new soldering nozzle structure for wave soldering is proposed to facilitate the cleaning of the filter board inside the soldering nozzle and improve work efficiency. Summary of the Invention

[0004] To address the problems in the prior art, this invention provides a solder nozzle structure and welding system for wave soldering, which facilitates the cleaning of the filter plate inside the solder nozzle and improves work efficiency.

[0005] The technical solution adopted by this invention to solve its technical problem is a solder nozzle structure for wave soldering, including a vertically arranged first side plate, a second side plate, and two sets of parallel end plates. The first side plate and the second side plate are fixedly connected between the two sets of end plates, and an adjusting plate is rotatably connected between the two sets of end plates. A horizontally arranged guide plate is fixedly connected to the top of the first side plate and the second side plate. A movable filter structure for filtering solder is provided between the first side plate and the second side plate. A material collection structure is provided on the side of the first side plate and the second side plate that is far apart from each other. A driving structure is provided below the material collection structure to drive the movable filter structure to move. A cleaning structure is provided on the side of the first side plate and the second side plate that is far apart from each other to clean the movable filter structure.

[0006] As a further optimization of the present invention, the movable filter structure includes a first slot that runs through the first side plate and the second side plate. A first filter plate that is horizontally arranged is slidably connected in the first slot. A first groove is provided on the lower surface of both ends of the first filter plate. A first tooth structure that is horizontally arranged is provided in the first groove. The first tooth structure meshes with the drive structure for transmission.

[0007] As a further optimization of the present invention, the movable filter structure further includes a second slot that runs through the first side plate and the second side plate. The second slot is located below the first slot. A horizontally arranged second filter plate is slidably connected in the second slot. A second groove is provided on the upper surface of both ends of the second filter plate. A horizontally arranged second tooth structure is provided in the second groove. The second tooth structure meshes with the drive structure for transmission.

[0008] As a further optimization of the present invention, each of the material collection structures includes an upward-opening material collection box. The two sets of material collection boxes are vertically slidably connected to the side of the first side plate and the second side plate respectively, which are far away from each other. A horizontally arranged support plate is fixedly connected to one side of each of the first side plate and the second side plate. The support plate is located below the material collection box. A vertically arranged rack is fixedly connected to both ends of the bottom of the material collection box. A positioning hole corresponding to the rack is provided on the upper part of the support plate. The lower end of the rack passes through the positioning hole. A return spring is fixedly connected between the support plate and the bottom of the material collection box. The rack is located in the middle of the return spring. The rack meshes with the drive structure for transmission.

[0009] The inner bottom of the collection box is provided with several sets of liquid outlet holes, each with a sealing plug. The bottom of the sealing plug is provided with a positioning groove. Several sets of top rods corresponding to the sealing plugs are fixedly connected to the upper surface of the support plate. The top rods are tapered, and the upper end of the top rods corresponds to the positioning groove.

[0010] As a further optimization of the present invention, the drive structure includes two sets of first gears, which mesh with racks for transmission. A rotating shaft is fixedly connected to one side of each first gear. Two sets of connecting rods are connected to the sides of the first and second side plates that are far apart from each other. One end of the rotating shaft is rotatably connected to the connecting rods, and the other end of the rotating shaft is fixedly connected to a second gear. The second gear meshes with the first gear structure and the second gear structure for transmission.

[0011] As a further optimization of the present invention, the cleaning structure includes a first cleaning plate disposed on one side of the first slot and a second cleaning plate disposed on one side of the second slot. The first side plate and the second side plate are both connected to the first cleaning plate and the second cleaning plate by support rods. The upper end of the first cleaning plate is in sliding contact with the lower surface of the first filter plate, and the upper end of the second cleaning plate is in sliding contact with the lower surface of the second filter plate.

[0012] As a further optimization of the present invention, the first side plate and the second side plate are provided with a locking structure on the side near the collection box. The locking structure includes a plurality of first pin grooves and a plurality of second pin grooves. The first pin groove is located above the second pin groove. A first pin rod is slidably connected in the first pin groove. A first ball is installed at the end of the first pin rod near the collection box. A first compression spring is fixedly connected between the first pin rod and the inner wall of the first pin groove. A second pin rod is slidably connected in the second pin groove. A second ball is installed at the end of the second pin rod near the collection box. A second compression spring is fixedly connected between the second pin rod and the inner wall of the second pin groove.

[0013] The material collection box is provided with several sets of locking grooves on the side near the locking structure. The first ball is initially located in the locking groove, and the second ball is located in the locking groove after the material collection box moves down.

[0014] As a further optimization of the present invention, the mesh diameter of the first filter plate is smaller than that of the second filter plate.

[0015] A welding system comprising the solder nozzle structure described above for wave soldering.

[0016] The beneficial effects of this invention are:

[0017] (1) The solder nozzle structure for wave soldering described in this invention allows the molten solder to fall into the corresponding collection box after moving to a certain position on the guide plate. When the amount of molten solder in the collection box reaches a certain amount, the collection box moves down to drive the drive structure. When the drive structure works, it drives the first filter plate and the second filter plate to move. When the first filter plate and the second filter plate move, the cleaning structure cleans the first filter plate and the second filter plate to ensure the filtration effect of the first filter plate and the second filter plate on the molten solder. At the same time, it ensures the amount of molten solder output when soldering the joints, thereby improving work efficiency and ease of use. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is an isometric view of the present invention;

[0020] Figure 2 This is a side view of the present invention;

[0021] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0022] Figure 4 for Figure 3 A magnified structural diagram of region A;

[0023] Figure 5This is a schematic diagram of the driving structure of the present invention;

[0024] Figure 6 for Figure 5 A magnified structural diagram of region B;

[0025] Figure 7 This is a cross-sectional view of the cleaning structure of the present invention;

[0026] Figure 8 for Figure 7 A magnified structural diagram of region C;

[0027] Figure 9 for Figure 7 A schematic diagram of the enlarged structure of region D;

[0028] In the diagram: 1. First side plate; 2. Second side plate; 3. End plate; 4. Adjusting plate; 5. Guide plate; 6. First slot; 7. First filter plate; 8. First tooth structure; 9. Second slot; 10. Second filter plate; 11. Second tooth structure; 12. Collection box; 13. Support plate; 14. Rack; 15. Positioning hole; 16. Return spring; 17. Liquid outlet; 18. Sealing plug; 19. Positioning groove; 20. Top rod; 21. First gear; 22. Rotating shaft; 23. Connecting rod; 24. Second gear; 25. First cleaning plate; 26. Second cleaning plate; 27. Support rod; 28. First pin groove; 29. ​​First pin; 30. First ball; 31. First compression spring; 32. Second pin groove; 33. Second pin; 34. Second ball; 35. Second compression spring; 36. Locking groove. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0030] To facilitate cleaning of the filter plate inside the solder nozzle and improve work efficiency, as one embodiment of the present invention, such as... Figure 1 , Figure 2 , Figure 3As shown, the solder nozzle structure for wave soldering according to the present invention includes a vertically arranged first side plate 1, a second side plate 2, and two sets of parallel end plates 3. The first side plate 1 and the second side plate 2 are fixedly connected between the two sets of end plates 3. An adjusting plate 4 is rotatably connected between the two sets of end plates 3. A horizontally arranged guide plate 5 is fixedly connected to the top of the first side plate 1 and the second side plate 2. A movable filter structure for filtering solder is provided between the first side plate 1 and the second side plate 2. A material collection structure is provided on the side of the first side plate 1 and the second side plate 2 that is far apart from each other. A driving structure is provided below the material collection structure. The driving structure is used to drive the movable filter structure to move. A cleaning structure is provided on the side of the first side plate 1 and the second side plate 2 that is far apart from each other. The cleaning structure is used to clean the movable filter structure.

[0031] When in use, when it is necessary to solder the components, the electric pump delivers the molten solder to the first side plate 1 and the second side plate 2. The moving filter structure filters the oxide impurities contained in the molten solder. When the molten solder reaches a certain amount, it will overflow from the top of the first side plate 1 and the second side plate 2. At the same time, the guide plate 5 makes the molten solder form a solder wave peak, and the solder wave peak is used to solder the components.

[0032] After the molten solder moves to a certain position on the guide plate 5, it will fall and land in the corresponding collection structure. When the amount of molten solder in the collection structure reaches a certain amount, the collection structure moves down and drives the drive structure to work. When the drive structure works, it drives the moving filter structure to move. When the moving filter structure moves, it relies on the cleaning structure to clean the moving filter structure, thereby ensuring the filtration effect of the moving filter structure on the molten solder.

[0033] After the collecting structure moves down to a certain position, the molten solder inside the collecting structure will be discharged and fall into the molten solder pool. After the molten solder inside the collecting structure is discharged, the collecting structure resets and moves upward again to drive the driving structure to work. When the driving structure works, it drives the moving filter structure to reset and move. This makes it easier to clean the moving filter structure during the soldering process of the components, avoid clogging of the moving filter structure, ensure the amount of molten solder output during subsequent soldering, improve work efficiency and ease of use.

[0034] To facilitate cleaning of the first filter plate 7, for example, such as Figure 1 , Figure 3 , Figure 4 , Figure 7As shown, the present invention also includes a movable filter structure comprising a first slot 6 that extends through the first side plate 1 and the second side plate 2, a first filter plate 7 that is slidably connected in the first slot 6, a first groove on the lower surface of both ends of the first filter plate 7, a first tooth structure 8 that is slidably provided in the first groove, and the first tooth structure 8 engaging with the drive structure for transmission.

[0035] When in use, when it is necessary to solder the components, the electric pump delivers the molten solder to the first side plate 1 and the second side plate 2. The first filter plate 7 filters the oxide impurities contained in the molten solder. After filtration, the molten solder forms a solder wave peak through the guide plate 5, and then solders the components.

[0036] When the amount of molten tin in the collecting structure reaches a certain amount, the collecting structure moves down and drives the driving structure to work. When the driving structure works, it meshes with the first tooth structure 8 to drive the first filter plate 7 to move. When the first filter plate 7 moves, the cleaning structure cleans the lower surface of the first filter plate 7, which facilitates the cleaning of the first filter plate 7.

[0037] After the molten solder in the collecting structure is discharged, the collecting structure resets and moves upward, driving the drive structure to work. The drive structure meshes with the first tooth structure 8 to drive the first filter plate 7 to reset and move. When the first filter plate 7 resets and moves, the cleaning structure cleans the lower surface of the first filter plate 7, thereby further improving the cleaning effect of the first filter plate 7 and ensuring the amount of molten solder discharged from the first filter plate 7 during subsequent soldering.

[0038] When the first filter plate 7 moves, the impurities falling on the surface of the first filter plate 7 can be cleaned through the first slot 6.

[0039] To facilitate cleaning of the second filter plate 10, for example, such as Figure 1 , Figure 3 , Figure 4 , Figure 7 As shown, the present invention also includes a second slot 9 through the first side plate 1 and the second side plate 2, the second slot 9 being located below the first slot 6, a horizontally arranged second filter plate 10 being slidably connected in the second slot 9, the upper surfaces of both ends of the second filter plate 10 being provided with a second groove, a horizontally arranged second tooth structure 11 being provided in the second groove, the second tooth structure 11 being meshed with the drive structure for transmission.

[0040] When in use, when it is necessary to solder the components, the electric pump delivers the molten solder to the first side plate 1 and the second side plate 2. First, the second filter plate 10 filters the oxide impurities contained in the molten solder. After the second filter plate 10 has finished filtering, the first filter plate 7 performs a second filtration of the molten solder, thereby improving the filtration effect of the moving filter structure and further ensuring the stability and soldering effect of the molten solder on the components.

[0041] When the amount of molten tin in the collecting structure reaches a certain amount, the collecting structure moves down and drives the driving structure to work. When the driving structure works, it meshes with the first tooth structure 8 and the second tooth structure 11 and drives the first filter plate 7 and the second filter plate 10 to move. When the second filter plate 10 moves, the cleaning structure cleans the lower surface of the second filter plate 10, so as to facilitate the cleaning of the second filter plate 10.

[0042] After the molten tin in the collecting structure is discharged, the collecting structure resets and moves upward, driving the drive structure to work. The drive structure meshes with the second tooth structure 11 to drive the second filter plate 10 to reset and move. When the second filter plate 10 resets and moves, the cleaning structure cleans the lower surface of the second filter plate 10, thereby further improving the cleaning effect of the second filter plate 10 and ensuring the amount of molten tin discharged from the second filter plate 10 during subsequent soldering.

[0043] When the second filter plate 10 moves, the impurities that fall on the upper surface of the second filter plate 10 can be cleaned through the second slot 9.

[0044] For example, such as Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 As shown, the present invention also includes the following: each of the material collection structures includes an upward-opening material collection box 12; the two sets of material collection boxes 12 are vertically slidably connected to the side of the first side plate 1 and the second side plate 2 respectively, which are far from each other; a horizontally arranged support plate 13 is fixedly connected to one side of the first side plate 1 and the second side plate 2; the support plate 13 is located below the material collection box 12; vertically arranged racks 14 are fixedly connected to both ends of the bottom of the material collection box 12; a positioning hole 15 corresponding to the rack 14 is provided above the support plate 13; the lower end of the rack 14 passes through the positioning hole 15; a return spring 16 is fixedly connected between the support plate 13 and the bottom of the material collection box 12; the rack 14 is located in the middle of the return spring 16; and the rack 14 meshes with the drive structure for transmission.

[0045] The inner bottom of the collection box 12 is provided with several sets of liquid outlet holes 17, and a sealing plug 18 is provided in the liquid outlet hole 17. The bottom of the sealing plug 18 is provided with a positioning groove 19. Several sets of top rods 20 corresponding to the sealing plugs 18 are fixedly connected to the upper surface of the support plate 13. The top rods 20 are tapered, and the upper end of the top rods 20 corresponds to the positioning grooves 19.

[0046] When in use, after the molten solder moves to a certain position on the guide plate 5, it will fall into the corresponding collection box 12. When the amount of molten solder in the collection box 12 reaches a certain amount, the collection box 12 moves down and drives the rack 14 to move down synchronously. When the rack 14 moves down, it meshes with the drive structure to drive the first filter plate 7 and the second filter plate 10 to move, thereby facilitating the cleaning of the first filter plate 7 and the second filter plate 10.

[0047] When the collection box 12 moves down, it squeezes the return spring 16. At the same time, after the collection box 12 moves down to a certain position, the bottom of the collection box 12 contacts the support plate 13. Meanwhile, the top rod 20 squeezes the positioning groove 19 of the sealing plug 18, causing the sealing plug 18 to move up. At this time, the molten solder in the collection box 12 will be discharged through the outlet hole 17. After the molten solder in the collection box 12 is discharged, the return spring 16 drives the collection box 12 to reset and move up to the initial state, so as to facilitate the subsequent cleaning of the moving filter structure.

[0048] To facilitate the movement of the first filter plate 7 and the second filter plate 10, for example, as shown... Figure 2 , Figure 5 , Figure 6 As shown, the present invention also includes two sets of first gears 21 in each of the drive structures. The first gears 21 mesh with the rack 14 for transmission. A rotating shaft 22 is fixedly connected to one side of each of the first gears 21. Two sets of connecting rods 23 are connected to the sides of the first side plate 1 and the second side plate 2 that are far apart from each other. One end of the rotating shaft 22 is rotatably connected to the connecting rod 23. The other end of the rotating shaft 22 is fixedly connected to a second gear 24. The second gear 24 meshes with the first tooth structure 8 and the second tooth structure 11 for transmission.

[0049] When in use, when the amount of molten solder in the collection box 12 reaches a certain amount, the collection box 12 moves down and drives the rack 14 to move down synchronously. When the rack 14 moves down, it meshes with the first gear 21 for transmission. When the first gear 21 rotates, it drives the second gear 24 to rotate through the rotating shaft 22. When the second gear 24 rotates, it meshes with the first tooth structure 8 and the second tooth structure 11 for transmission, and drives the first filter plate 7 and the second filter plate 10 to move. The cleaning structure cleans the first filter plate 7 and the second filter plate 10 to ensure the stability of subsequent component soldering.

[0050] After the molten tin in the collection box 12 is discharged, the collection box 12 and the rack 14 are driven to reset and move upward by the action of the reset spring 16. When the rack 14 resets and moves upward, it meshes with the first gear 21 again, thereby driving the first filter plate 7 and the second filter plate 10 to reset and move back to the initial state.

[0051] For example, such as Figure 7 , Figure 8 , Figure 9 As shown, the present invention also includes a cleaning structure comprising a first cleaning plate 25 disposed on one side of the first slot 6 and a second cleaning plate 26 disposed on one side of the second slot 9. The first side plate 1 and the second side plate 2 are both connected to the first cleaning plate 25 and the second cleaning plate 26 by support rods 27. The upper end of the first cleaning plate 25 is in sliding contact with the lower surface of the first filter plate 7, and the upper end of the second cleaning plate 26 is in sliding contact with the lower surface of the second filter plate 10.

[0052] When in use, when the second gear 24 rotates, it meshes with the first gear structure 8 and the second gear structure 11 to drive the first filter plate 7 and the second filter plate 10 to move. The lower surface of the first filter plate 7 is cleaned by two sets of first cleaning plates 25, and the lower surface of the second filter plate 10 is cleaned by two sets of second cleaning plates 26. The stability of the first cleaning plate 25 and the second cleaning plate 26 can be improved by the support rod 27.

[0053] To ensure the stability of the collection box 12, for example, such as Figure 1 , Figure 7 , Figure 8 As shown, the present invention further includes a locking structure on the side of the first side plate 1 and the second side plate 2 near the material collection box 12. The locking structure includes several sets of first pin grooves 28 and several sets of second pin grooves 32. The first pin groove 28 is located above the second pin groove 32. A first pin rod 29 is slidably connected in the first pin groove 28. A first ball bearing 30 is installed at the end of the first pin rod 29 near the material collection box 12. A first compression spring 31 is fixedly connected between the first pin rod 29 and the inner wall of the first pin groove 28. A second pin rod 33 is slidably connected in the second pin groove 32. A second ball bearing 34 is installed at the end of the second pin rod 33 near the material collection box 12. A second compression spring 35 is fixedly connected between the second pin rod 33 and the inner wall of the second pin groove 32.

[0054] The material collection box 12 is provided with several sets of locking grooves 36 on the side near the locking structure. The first ball 30 is initially located in the locking groove 36, and the second ball 34 is located in the locking groove 36 after the material collection box 12 moves down.

[0055] In use, when the amount of molten solder in the collection box 12 reaches a certain level, the first ball 30 disengages from the locking groove 36. At the same time, as the collection box 12 moves down to a certain position, the collection box 12 and the second ball 34 come into contact and press against the second pin 33 and the second compression spring 35. As the collection box 12 continues to move down, the second ball 34 aligns with the locking groove 36 of the collection box 12. At this time, the second compression spring 35 and the second pin 33 drive the second ball 34 to move into the locking groove 36, thereby ensuring the stability of the collection box 12 and facilitating the discharge of the molten solder in the collection box 12.

[0056] After the molten solder is discharged, the return spring 16 drives the collection box 12 to reset and move upward. At the same time, the second ball 34 disengages from the locking groove 36. When the collection box 12 is reset to the initial state, the first ball 30 is once again located in the locking groove 36, thereby ensuring the stability of the collection box 12 so that the molten solder can be collected again in the future.

[0057] For example, the present invention further includes a mesh size of the first filter plate 7 that is smaller than the mesh size of the second filter plate 10.

[0058] During use, the molten solder is filtered once by the second filter plate 10. After the first filtration, the molten solder passes through the first filter plate 7 and is filtered a second time by the first filter plate 7. This ensures the amount of molten solder that flows out when soldering the components and ensures the soldering effect.

[0059] A welding system comprising the solder nozzle structure described above for wave soldering.

[0060] When this invention is in use, when it is necessary to solder the components, the electric pump delivers the molten solder to the first side plate 1 and the second side plate 2. First, the second filter plate 10 filters the oxide impurities contained in the molten solder. After the second filter plate 10 has completed filtration, the first filter plate 7 performs a second filtration on the molten solder, thereby improving the filtration effect of the moving filter structure and further ensuring the stability and soldering effect of the molten solder on the components.

[0061] When the molten solder reaches a certain amount, it will overflow from the top of the first side plate 1 and the second side plate 2. At the same time, the guide plate 5 will help the molten solder to form a solder wave peak, and the solder wave peak will be used to solder the components.

[0062] After the molten solder moves to a certain position on the guide plate 5, it falls into the corresponding collection box 12. When the amount of molten solder in the collection box 12 reaches a certain amount, the first ball 30 disengages from the locking groove 36. At the same time, the collection box 12 moves down and drives the rack 14 to move down synchronously. When the rack 14 moves down, it meshes with the first gear 21. When the first gear 21 rotates, it drives the second gear 24 to rotate through the rotating shaft 22. When the second gear 24 rotates, it meshes with the first tooth structure 8 and the second tooth structure 11, and drives the first filter plate 7 and the second filter plate 10 to move. The lower surface of the first filter plate 7 is cleaned by two sets of first cleaning plates 25, and the lower surface of the second filter plate 10 is cleaned by two sets of second cleaning plates 26, so as to ensure the stability of subsequent component soldering.

[0063] As the components move, the electric pump operates intermittently, creating solder peaks to facilitate the soldering process. After each group of components is soldered, the electric pump stops. At this point, when the molten solder in the collection box 12 is discharged, the return spring 16 drives the collection box 12 and rack 14 to return to their original positions. When the rack 14 returns to its original position, it meshes with the first gear 21 again, thereby driving the first filter plate 7 and the second filter plate 10 to return to their initial positions. Simultaneously, the second ball 34 disengages from the locking groove 36. After the collection box 12 returns to its initial position, the first ball 30 returns to the locking groove 36, ensuring the stability of the collection box 12 and facilitating the subsequent collection of molten solder.

[0064] The descriptions of "specific examples" or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A solder nozzle structure for wave soldering, comprising a vertically arranged first side plate, a second side plate, and two sets of parallel end plates, wherein the first side plate and the second side plate are fixedly connected between the two sets of end plates, an adjusting plate is rotatably connected between the two sets of end plates, and a horizontally arranged guide plate is fixedly connected to the top of each of the first side plate and the second side plate, characterized in that, A movable filter structure for filtering solder is provided between the first side plate and the second side plate. A material collection structure is provided on the side of the first side plate and the second side plate that is far apart from each other. A driving structure is provided below the material collection structure. The driving structure is used to drive the movable filter structure to move. A cleaning structure is provided on the side of the first side plate and the second side plate that is far apart from each other. The cleaning structure is used to clean the movable filter structure. The movable filter structure includes a first slot that runs through the first side plate and the second side plate. A first filter plate that is horizontally arranged is slidably connected in the first slot. The lower surfaces of both ends of the first filter plate are provided with first grooves. A first tooth structure that is horizontally arranged is provided in the first groove. The first tooth structure meshes with the drive structure for transmission. The movable filter structure also includes a second slot that runs through the first side plate and the second side plate. The second slot is located below the first slot. A horizontally arranged second filter plate is slidably connected in the second slot. The upper surfaces of both ends of the second filter plate are provided with second grooves. A horizontally arranged second tooth structure is provided in the second groove. The second tooth structure meshes with the drive structure for transmission. Each of the material collection structures includes an upward-opening material collection box. Two sets of material collection boxes are vertically slidably connected to the side of the first side plate and the second side plate respectively, away from each other. A horizontally arranged support plate is fixedly connected to one side of each of the first and second side plates. The support plate is located below the material collection box. Vertically arranged racks are fixedly connected to both ends of the bottom of the material collection box. The upper part of the support plate is provided with positioning holes corresponding to the racks. The lower end of the rack passes through the positioning holes. A return spring is fixedly connected between the support plate and the bottom of the material collection box. The rack is located in the middle of the return spring. The rack meshes with the drive structure for transmission. The inner bottom of the collection box is provided with several sets of liquid outlet holes, each with a sealing plug. The bottom of the sealing plug is provided with a positioning groove. Several sets of top rods corresponding to the sealing plugs are fixedly connected to the upper surface of the support plate. The top rods are tapered, and the upper end of the top rods corresponds to the positioning groove. The cleaning structure includes a first cleaning plate disposed on one side of the first slot and a second cleaning plate disposed on one side of the second slot. Both the first side plate and the second side plate are provided with a locking structure on the side near the collection box. When the amount of molten tin in the material collection structure reaches a certain level, the material collection structure moves downward and drives the drive structure to work; after the molten tin in the material collection structure is discharged, the material collection structure resets and moves upward, while simultaneously driving the drive structure to work.

2. The solder nozzle structure for wave soldering according to claim 1, characterized in that, Each drive structure includes two sets of first gears, which mesh with racks for transmission. A rotating shaft is fixedly connected to one side of each first gear. Two sets of connecting rods are connected to the opposite sides of the first and second side plates. One end of the rotating shaft is rotatably connected to the connecting rods, and the other end of the rotating shaft is fixedly connected to a second gear. The second gear meshes with the first and second gear structures for transmission.

3. The solder nozzle structure for wave soldering according to claim 2, characterized in that, Both the first side plate and the second side plate are connected to the first cleaning plate and the second cleaning plate via support rods. The upper end of the first cleaning plate is in sliding contact with the lower surface of the first filter plate, and the upper end of the second cleaning plate is in sliding contact with the lower surface of the second filter plate.

4. The solder nozzle structure for wave soldering according to claim 3, characterized in that, The locking structure includes several sets of first pin slots and several sets of second pin slots. The first pin slot is located above the second pin slot. A first pin rod is slidably connected in the first pin slot. A first ball is installed at the end of the first pin rod near the collection box. A first compression spring is fixedly connected between the first pin rod and the inner wall of the first pin slot. A second pin rod is slidably connected in the second pin slot. A second ball is installed at the end of the second pin rod near the collection box. A second compression spring is fixedly connected between the second pin rod and the inner wall of the second pin slot. The material collection box is provided with several sets of locking grooves on the side near the locking structure. The first ball is initially located in the locking groove, and the second ball is located in the locking groove after the material collection box moves down.

5. The solder nozzle structure for wave soldering according to claim 4, characterized in that, The mesh size of the first filter plate is smaller than that of the second filter plate.

6. A welding system, characterized in that, The welding system includes the solder nozzle structure for wave soldering as described in claim 1.

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