Chip clamping device

By designing an adjustable chip clamping device, the problem that the chip fixing device in the prior art is only suitable for chips of specific sizes is solved, and the function of adapting to chips of different specifications is realized, reducing production costs and improving working efficiency.

CN119566457APending Publication Date: 2025-03-07HOSIN GLOBAL ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510017658.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-06
Publication Date
2025-03-07

AI Technical Summary

Technical Problem

The existing chip fixtures are only suitable for chips of specific sizes and cannot be used for chip testing of different specifications. They have high production costs, low working efficiency, and easy chip displacement.

Method used

A chip clamping device is designed, including a circuit board, a connection part, a support part and a clamping part. By adjusting the distance between the connection part and the support part, it corresponds to the positioning hole of the circuit board, and clamps the chip through the clamping part to adapt to chips of different specifications.

Benefits of technology

This device can be used with different circuit boards and chips of different specifications, reducing production costs, improving work efficiency and preventing chip displacement.

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Abstract

The invention relates to a chip clamping device comprising a circuit board provided with a plurality of positioning holes; the connecting part is provided with a first adjusting assembly; the plurality of supporting parts correspond to the positioning holes respectively; and the plurality of clamping parts are respectively arranged on the corresponding supporting parts, and the clamping parts are used for clamping chips. The circuit board clamping device is provided with the connecting parts, the supporting parts and the clamping parts, the distance between the connecting parts is adjusted by adjusting the first adjusting assembly, the connecting parts are connected with the supporting parts, the distance between the supporting parts can be adjusted by adjusting the connecting parts, the supporting parts and positioning holes formed in a circuit board can be positioned, and a chip is clamped through the clamping parts. The distance between the supporting parts can be adjusted according to the distance of the positioning holes in the circuit board, so that the supporting device can be suitable for different circuit boards and use scenes of chips of different specifications, a fixing device is replaced, the production cost is reduced, the working efficiency is improved, and meanwhile, the phenomenon of chip displacement can be prevented.
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Description

Technical Field

[0001] The present invention relates to the field of memory technology, and more particularly to a chip clamping device. Background Art

[0002] In the current chip testing process, chip fixtures are usually used to ensure the stability of the chip during the testing phase. Such fixtures have a significant effect in preventing chip displacement and ensuring test accuracy. However, existing fixtures can only be applied to chips of a specific size and cannot be applied to use scenarios where chips of different specifications need to be tested, which greatly limits the production of chips. When multiple chip fixtures are used to test chips of different specifications, the production cost will be higher.

[0003] In addition, the position of the chip can be marked on the circuit board and then placed; however, when placing the chip to the pre-marked position, the operator needs to manually align it, which wastes a lot of time, and using a hot air gun to blow air after welding can easily cause the chip to shift. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the existing fixing device is only suitable for chips of a specific size and cannot be used in the scenario of testing chips of different specifications. The production cost is high. When the chip is placed at a pre-set position on the circuit board, the working efficiency is low and the chip is easily displaced. In view of the above-mentioned defects of the prior art, a chip clamping device is provided.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A chip clamping device is constructed, wherein: a circuit board is provided with a plurality of positioning holes; a connecting portion is provided with a first adjusting component, and the first adjusting component is used to adjust the distance of the connecting portion; a plurality of supporting portions, a plurality of the supporting portions are respectively connected to the connecting portion, and a plurality of the supporting portions respectively correspond to the positioning holes and are used to be respectively inserted into the corresponding positioning holes; a plurality of clamping portions, a plurality of the clamping portions are respectively arranged on the corresponding supporting portions, and the clamping portions are used to clamp the chip.

[0007] Furthermore, a plurality of the supporting parts are respectively provided with a second adjusting component, and the second adjusting component is used to adjust the distance between the clamping parts.

[0008] Furthermore, the second adjustment component includes a pushing component and a push rod, the push rod is horizontally and vertically arranged on one side of the clamping portion, and the pushing component is used to adjust the tightness of the push rod.

[0009] Furthermore, a chamber is provided in the support portion, the push rod is provided in the chamber, and the clamping portion and the pushing assembly respectively pass through the chamber.

[0010] Furthermore, when the pushing assembly abuts against the push rod, the push rod abuts against the clamping portion to fix the clamping portion.

[0011] Furthermore, the pushing assembly includes a body, a fixing portion and a fixing member, the body is connected to the fixing portion, the fixing member is threadedly arranged with the fixing portion, and is used to adjust the tightness of the body.

[0012] Furthermore, a first inclined surface is provided on a side of the main body facing the push rod, and the push rod is provided with a second inclined surface corresponding to the first inclined surface.

[0013] Furthermore, the clamping portion includes a first clamping block and a second clamping block, an angle is provided between the first clamping block and the second clamping block, and the angle corresponds to a corner of the chip.

[0014] Furthermore, the clamping portion is provided with a locking portion and a locking member, the locking portion is provided with a thread, the locking member is provided with a threaded hole corresponding to the thread, and the locking member is transmitted with the locking portion to fix or unlock the clamping portion.

[0015] Furthermore, the first adjustment component includes an adjustment member and a plurality of mounting members, the mounting members are arranged corresponding to the connecting portion, and the adjustment member and the mounting members are provided with a threaded transmission connection.

[0016] The beneficial effects of the present invention are: a connecting part, a plurality of supporting parts and a clamping part are provided, the distance between the connecting parts is adjusted by adjusting the first adjusting component, the connecting parts are respectively connected to the supporting parts, and the distance between the supporting parts can be adjusted by adjusting the connecting parts, so that the supporting parts can be positioned with the positioning holes provided on the circuit board, and the chip can be clamped by the clamping part. The distance between the supporting parts can be adjusted according to the distance of the positioning holes on the circuit board, and can be applied to different circuit boards and can adapt to the use scenarios of chips of different specifications, replace the fixing device, reduce production costs, improve work efficiency, and prevent chip displacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work:

[0018] Figure 1is an overall structural diagram of a chip clamping device in one embodiment of the present invention;

[0019] Figure 2 is a three-dimensional schematic diagram of a chip clamping device in one embodiment of the present invention from another angle;

[0020] Figure 3 is a schematic right side view of a chip clamping device in one embodiment of the present invention;

[0021] Figure 4 The present invention Figure 3 Schematic cross-sectional view at AA in the middle;

[0022] Figure 5 is a three-dimensional schematic diagram of a clamping portion in one embodiment of the present invention;

[0023] Figure 6 It is a three-dimensional schematic diagram of a first adjustment component in one embodiment of the present invention.

[0024] Explanation of reference numerals: circuit board 1, positioning hole 101, connecting portion 2, first adjusting component 201, supporting portion 3, clamping portion 4, column 310, movable portion 202, first connecting portion 203, second connecting portion 204, first supporting portion 301, second supporting portion 302, second adjusting component 401, pushing component 402, push rod 403, chamber 303, main body 404, fixing portion 405, fixing member 406, first inclined surface 407, second inclined surface 408, first clamping block 409, second clamping block 410, angle β, locking portion 411, adjusting member 205, mounting member 206, placement hole 207, placement column 208, positioning area 102. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the following will be described clearly and completely in combination with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are partial embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present invention.

[0026] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] The present application is described in detail with reference to the schematic diagram. When describing the embodiments of the present application in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection claimed in this application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0028] When placing the chip in a pre-marked position, the operator needs to align it manually, which wastes a lot of time and reduces work efficiency. In addition, the chip is prone to displacement when the hot air blower is blowing.

[0029] Please refer to Figure 1 In one embodiment of the present application, a chip clamping device is proposed, including a circuit board 1, the circuit board 1 is provided with a plurality of positioning holes 101; a connecting part 2, the connecting part 2 is provided with a first adjustment component 201, and the first adjustment component 201 is used to adjust the distance of the connecting part 2; a plurality of supporting parts 3, the plurality of supporting parts 3 are respectively connected to the connecting part 2, and the plurality of supporting parts 3 are respectively corresponding to the positioning holes 101, and are used to be respectively inserted into the corresponding positioning holes 101; a plurality of clamping parts 4, the plurality of clamping parts 4 are respectively arranged on the corresponding supporting parts 3, and the clamping parts 4 are used to clamp the chip. The present application is provided with a connecting part 2, a supporting part 3 and a clamping part 4, by adjusting the distance between the supporting parts 3 by adjusting the first adjustment component 201, the supporting parts 3 can be positioned with the positioning holes 101 provided on the circuit board 1, and by adjusting the second adjustment component 401, the clamping part 4 can clamp the chip; the clamping part 4 can be adjusted according to the size of the chip to adapt to the use scenarios of chips of different specifications, reduce production costs, improve work efficiency, and prevent chip displacement.

[0030] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0031] like Figure 1As shown, in this embodiment, the circuit board 1 is provided with a plurality of positioning holes 101. In actual situations, the positioning holes 101 are formed during the preparation process of the circuit board 1, or they may be reserved spaces formed during the preparation process of the circuit board 1 and formed by a drilling process. The formed positioning holes 101 may be used to install a fixing device.

[0032] This embodiment also includes a connecting part 2, a plurality of supporting parts 3 and a clamping part 4. The connecting part 2 is provided with a first adjusting component 201, and one end of the connecting part 2 is respectively connected to the corresponding supporting parts 3, and the plurality of supporting parts 3 are respectively provided with corresponding clamping parts 4, wherein the first adjusting component 201 can adjust the connecting part 2, drive the connecting part 2 to move, thereby drive the plurality of supporting parts 3 to move, so that the plurality of supporting parts 3 correspond to the positioning holes 101 respectively, and pass through or are fixed on the positioning holes 101, and then the chip is placed in the clamping part 4, and the operator can solder the chip to the test board using only a hot air gun.

[0033] like Figure 1 As shown, the support part 3 includes a main body and a column, one end of the main body is connected to the connecting part 2, and the other end of the main body is provided with a column, the diameter of the column corresponds to the diameter of the positioning hole 101, and the column is inserted into the positioning hole 101 to form a support between the column and the positioning hole 101. When several support parts 3 are respectively inserted into the corresponding positioning holes 101, the several support parts 3 and the connecting part 2 are vertically fixed in the horizontal direction to prevent the connecting part 2 and the several support parts 3 from excessively tilting or tipping over, so that the several clamping parts 4 can stably clamp the chip.

[0034] like Figure 2 As shown, the connecting part 2 includes a movable part 202, a plurality of connecting parts 2 and a first adjusting component 201. The movable part 202 is a retractable sleeve structure. The plurality of connecting parts 2 are respectively connected to the movable part 202. The first adjusting component 201 can evenly adjust the retraction of the movable part 202 to ensure that the plurality of clamping parts 4 can limit the chip.

[0035] In one example, reference Figure 2 As shown, the connecting part 2 includes a movable part 202, a first connecting part 203, and a second connecting part 204. The first connecting part 203 and the second connecting part 204 are respectively connected to the movable part 202. The first adjusting component 201 passes through the first connecting part 203 and the second connecting part 204 respectively. The first connecting part 203 is connected to the first supporting part 301, and the second connecting part 204 is connected to the second supporting part 302. According to the adjustment of the first adjusting component 201, the movable part 202 is driven to extend and retract, and the first supporting part 301 and the second supporting part 302 are driven to move. The ends of the first supporting part 301 and the second supporting part 302 that are not connected to the connecting part 2 are set corresponding to the positioning hole 101, and pass through or are fixed in the positioning hole 101.

[0036] In specific implementation, by adjusting the first adjustment component 201, the movable part 202 can be extended and retracted, and the distance between the first connection part 203 and the second connection part 204 can be adjusted, thereby adjusting the distance between the first support part 301 and the second support part 302 to adapt to positioning holes 101 of different sizes. The chip can be limited by replacing the fixing device, and can adapt to positioning holes 101 of different sizes, effectively reducing production costs.

[0037] Since the positioning hole 101 designed by the manufacturer is of a fixed size, the position of the positioning hole 101 and the chip size may change according to different test conditions. Figure 1 As shown, the bottom of the support part 3 is vertically arranged with the circuit board 1, and the diameter of the bottom of the support part 3 is the same as the aperture of the positioning frame. At this time, after the support part 3 is inserted into the positioning hole 101, it can form support without the support of the operator, which can improve the welding efficiency of the operator. In another specific embodiment, three support parts 3 are provided, which can further improve the stability of the support part 3 and facilitate the operator to place the chip and perform welding operations.

[0038] In one embodiment, a plurality of support portions 3 are respectively provided with a second adjustment component 401 , and the second adjustment component 401 is used to adjust the distance of the clamping portion 4 .

[0039] In this embodiment, if Figure 1 As shown, the second adjustment component 401 is arranged corresponding to the clamping part 4, and the clamping part 4 is fixed or released by adjusting the second adjustment component 401. First, the second adjustment component 401 is adjusted to release the clamping part 4, and then the clamping part 4 is moved to make the clamping part 4 correspond to the chip size, and the second adjustment component 401 is adjusted again to fix the clamping part 4, so that the clamping part 4 can clamp chips of different sizes.

[0040] In one embodiment, the second adjustment component 401 includes a pushing component 402 and a push rod 403 . The push rod 403 is horizontally and vertically arranged on one side of the clamping portion 4 . The pushing component 402 is used to adjust the tightness of the push rod 403 .

[0041] Specifically, Figure 4 As shown, the second adjustment component 401 includes a pushing component 402 and a push rod 403, and the push rod 403 is vertically arranged at the top of the clamping part 4. After adjusting the position of the clamping part 4, after applying force to the pushing component 402, the pushing component 402 can abut against the top of the push rod 403. At this time, the pushing component 402 is fixed to the push rod 403, and the other end of the push rod 403 abuts against the clamping part 4, thereby fixing the clamping part 4. After removing the force applied to the pushing component 402, the pushing component 402 is pushed to move the pushing component 402 away from the push rod 403. At this time, the clamping part 4 is released from being fixed, and the distance of the clamping part 4 can be adjusted again.

[0042] In one embodiment, a chamber 303 is disposed in the support portion 3 , a push rod 403 is disposed in the chamber 303 , and the clamping portion 4 and the pushing assembly 402 pass through the chamber 303 respectively.

[0043] Specifically, Figure 4 As shown, each support part 3 is provided with a chamber 303, and each chamber 303 is provided with a push rod 403, which can move in the chamber 303 to fix or release the clamping part 4. The clamping part 4 and the pushing component 402 pass through the chamber 303, respectively, and the clamping part 4 can move horizontally in the chamber 303 to adjust the distance between the clamping parts 4, so as to clamp chips of different sizes. The pushing component 402 can move in the chamber 303 to abut against the push rod 403 or move away from the push rod 403.

[0044] In one embodiment, when the pushing assembly 402 abuts against the push rod 403 , the push rod 403 abuts against the clamping portion 4 to fix the clamping portion 4 .

[0045] Specifically, if Figure 4 As shown, when the push assembly 402 is pushed, the push assembly 402 will move horizontally in the chamber 303. When the push assembly 402 is pushed to abut against the ejector pin 403, the other end of the ejector pin 403 will abut against the clamping portion 4. At this time, the ejector pin 403, the push assembly 402 and the clamping portion 4 are respectively fixed in the chamber 303 and can clamp the chip. When the push assembly 402 is moved away from the ejector pin 403, the fixation of the ejector pin 403 is released, and the fixation of the ejector pin 403 to the clamping portion 4 is released. At this time, the clamping portion 4 can move in the chamber 303.

[0046] In one embodiment, the pushing assembly 402 includes a body 404 , a fixing portion 405 and a fixing member 406 . The body 404 is connected to the fixing portion 405 . The fixing member 406 is threadedly arranged with the fixing portion 405 and is used to adjust the tightness of the body 404 .

[0047] like Figure 3 and Figure 4 As shown, specifically, each pushing assembly 402 includes a body 404, a fixing portion 405 and a fixing member 406. The body 404 is connected to the fixing portion 405, and can be integrally formed or detachably connected. The fixing portion 405 is provided with a thread on the side facing outward, and the fixing member 406 is provided with a threaded hole corresponding to the thread, which can cooperate with the fixing portion 405 to adjust the tightness of the body 404. In a specific embodiment, the fixing portion 405 is provided with a thread, and the fixing member 406 is a nut, and the fixing and unlocking of the body 404 are achieved by the cooperation between the threaded nut.

[0048] In one embodiment, a first inclined surface 407 is provided on a side of the body 404 facing the top rod 403 , and a second inclined surface 408 corresponding to the first inclined surface 407 is provided on the top rod 403 .

[0049] like Figure 4 As shown, specifically, the body 404 is provided with a first inclined surface 407 on the side facing the push rod 403, and the push rod 403 is provided with a second inclined surface 408 corresponding to the first inclined surface 107. When the pushing assembly 402 is pushed to make the first inclined surface 407 of the body 404 abut against the second inclined surface 408 of the push rod 403, and then the fixing member 406 is tightened, at this time, the body 404 and the push rod 403 can be fixed, and the clamping part 4 is fixed under the action of the push rod 403. When it is necessary to adjust the position of the clamping part 4, the fixing member 405 is rotated to release the fixing of the fixing member 406 to the body 404. Then, the body 404 is moved away from the fixing member 406, so that the first inclined surface 407 is away from the second inclined surface 408 provided on the push rod 403, so as to release the restriction of the push rod 403 on the clamping part 4.

[0050] By abutting and matching between the inclined surfaces, the push rod 403 can be prevented from sliding and displacing, and the clamping part 4 can be better fixed. And by the threaded matching between the body 404 and the fixing member 406. The functions of precise adjustment and stable locking can be realized, and the structure is compact, the space occupied is small, and quick unlocking and locking can be realized, and the operation efficiency is improved, and the second adjustment component 401 is prevented from being set on the clamping part 4, and the second adjustment component 401 is abutted against the circuit board 1, which causes the inconvenience of the operation of the second adjustment component 401. Therefore, the scheme of setting this embodiment can be applicable to the working scene where the space for welding chips is limited and frequent adjustment is required, and the circuit board 1 is avoided from being accidentally touched, which affects the adjustment of the second adjustment component 401.

[0051] In one embodiment, the clamping portion 4 includes a first clamping block 409 and a second clamping block 410 , and an angle β is defined between the first clamping block 409 and the second clamping block 410 , and the angle β corresponds to the corner of the chip.

[0052] like Figure 5 As shown, specifically, an angle β is formed between the first clamping block 409 and the second clamping block 410, and the angle β is set corresponding to the corner of the chip. In a specific embodiment, the corner of the chip is a right angle, and at this time, the angle β is 90° to fit the edge of the chip and stably clamp the chip.

[0053] like Figure 1As shown, specifically, a plurality of clamping parts 4 are respectively arranged on the left support part 3 and the right support part 3, the clamping part 4 on the left support part 3 is arranged toward the right support part 3, and the clamping part 4 on the right support part 3 is arranged toward the left support part 3. In a specific embodiment, the first clamping block 409 and the second clamping block 410 may be provided with grooves, which can clamp the chip in the grooves, and can clamp the chip more stably to prevent it from falling.

[0054] In one embodiment, the clamping portion 4 is provided with a locking portion 411 and a locking member, the locking portion 411 is provided with threads, the locking member is provided with threaded holes corresponding to the threads, and the locking member transmits with the locking portion to fix or unlock the clamping portion 4 .

[0055] like Figure 5 As shown, specifically, a locking portion 411 is provided at the end of the clamping portion 4. In a specific embodiment, the locking portion 411 is transmitted with a locking member, the locking portion 411 is a thread, and the locking member is a nut. After the clamping portion 4 is placed on the supporting portion 3, the clamping portion 4 is fixed or unlocked by rotating the locking member.

[0056] More specifically, the locking member is rotated so that the locking member abuts against the surface of the support portion 3, and at this time, the clamping portion 4 is fixed. The locking member is then rotated in the opposite direction so that the locking member is away from the support portion 3, and at this time, the clamping portion 4 can move horizontally in the support portion 3 to adapt to chips of different specifications.

[0057] In one embodiment, the first adjustment assembly 201 includes an adjustment member 205 and a plurality of mounting members 206 . The mounting members 206 are arranged corresponding to the connecting portion 2 . The adjustment member 205 and the mounting members 206 are provided with a threaded transmission connection to drive the supporting portions 3 to move closer to or farther from each other.

[0058] like Figure 6 As shown, specifically, a plurality of mounting members 206 are respectively arranged corresponding to a plurality of supporting parts 3 and fixed on the corresponding supporting parts 3. When the adjusting member 205 and the mounting member 206 are in transmission, the supporting parts 3 will move along with the mounting member 206. The adjusting member 205 is provided with threads on both sides, and the mounting member 206 is provided with threaded holes corresponding to the threads. When the adjusting member 205 is rotated, the mounting member 206 is displaced under the transmission of the adjusting member 205, driving the supporting parts 3 to move closer to or farther from each other. More specifically, the supporting parts 3 can move closer to or farther from each other by setting the threads in a forward or reverse direction.

[0059] In one embodiment, the support portion 3 is provided with placement holes 207 , and the mounting members 206 are respectively located in the placement holes 207 .

[0060] like Figure 6As shown, specifically, the support portion 3 is respectively provided with placement holes 207 , and placement columns 208 are respectively provided on both sides of the mounting member 206 , and the placement columns 207 respectively penetrate the placement holes 207 to fix the mounting member 206 on the support portion 3 .

[0061] In one embodiment, the circuit board 1 is provided with a positioning area 102 , and the clamping portion 4 is disposed corresponding to the positioning area 102 .

[0062] like Figure 1 As shown, specifically, a positioning area 102 is pre-set on the circuit board 1, and the positioning area 102 can be a positioning frame or a positioning corner. After the support part 3 is placed on the circuit board 1, the clamping part 4 is aligned with the positioning area 102 by adjusting the second adjustment component 401, and then the chip is clamped to improve the positioning efficiency, so that the chip can be quickly aligned with the pad of the circuit board 1.

[0063] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment, since it is basically similar to the structural embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the structural embodiment.

[0064] The above is a specific implementation of the present application. It should be understood that the above embodiments are only used to illustrate the technical solution of the present application, rather than to limit it; although the present application is described in detail with reference to the above embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip clamping device, characterized in that: include: A circuit board, wherein the circuit board is provided with a plurality of positioning holes; A connecting portion, wherein the connecting portion is provided with a first adjusting component, and the first adjusting component is used to adjust the distance of the connecting portion; A plurality of supporting parts, wherein the plurality of supporting parts are respectively connected to the connecting parts, and the plurality of supporting parts respectively correspond to the positioning holes and are used to be respectively inserted into the corresponding positioning holes; A plurality of clamping parts are respectively arranged on the corresponding supporting parts, and the clamping parts are used to clamp the chip.

2. The chip clamping device according to claim 1, characterized in that: A plurality of the support parts are respectively provided with a second adjustment component, and the second adjustment component is used to adjust the distance of the clamping parts.

3. The chip clamping device according to claim 2, characterized in that: The second adjustment component includes a pushing component and a push rod. The push rod is horizontally and vertically arranged on one side of the clamping part. The pushing component is used to adjust the tightness of the push rod.

4. The chip clamping device according to claim 3, characterized in that: The supporting portion is provided with a chamber, the ejector rod is provided in the chamber, and the clamping portion and the pushing assembly respectively penetrate the chamber.

5. The chip clamping device according to claim 4, characterized in that: When the pushing assembly abuts against the push rod, the push rod abuts against the clamping portion to fix the clamping portion.

6. The chip clamping device according to claim 3, characterized in that: The pushing assembly comprises a body, a fixing portion and a fixing member, wherein the body is connected to the fixing portion, and the fixing member is threadedly arranged with the fixing portion and is used to adjust the tightness of the body.

7. The chip clamping device according to claim 6, characterized in that: A first inclined surface is provided on one side of the main body facing the push rod, and a second inclined surface corresponding to the first inclined surface is provided on the push rod.

8. The chip clamping device according to claim 1, characterized in that: The clamping portion includes a first clamping block and a second clamping block, an angle is arranged between the first clamping block and the second clamping block, and the angle corresponds to the corner of the chip.

9. The chip clamping device according to claim 2, characterized in that: The clamping portion is provided with a locking portion and a locking member, the locking portion is provided with a thread, the locking member is provided with a threaded hole corresponding to the thread, and the locking member is transmitted with the locking portion to fix or unlock the clamping portion.

10. The chip clamping device according to claim 1, characterized in that: The first adjustment assembly includes an adjustment member and a plurality of mounting members, the mounting members are arranged corresponding to the connecting portion, and the adjustment member is connected to the mounting member through a threaded transmission.