Automatic semiconductor grinding equipment

Abstract

The invention provides automatic semiconductor grinding equipment. The automatic semiconductor grinding equipment comprises a transfer channel; the grinding assemblies are symmetrically arranged at the two ends of the transfer channel, and the two grinding assemblies are used for grinding and thickening the two faces of the wafer correspondingly; the flushing assembly is horizontally and slidably mounted at the top of the lower base, and the flushing assembly is used for removing residual liquid on the upper surface of the wafer in a closed mode so as to facilitate subsequent film covering; a wafer is clamped and positioned in the wafer ring, a baffle film is attached to one surface of the wafer ring, the area of the baffle film is larger than that of the wafer ring, and four groups of insertion plates distributed in an annular array are arranged on the outer wall of the wafer ring; a conveying track; a material moving assembly; a thickness detection assembly; a film covering assembly; a film tearing assembly; cutting fluid and cutting impurities can be pumped out to the cutting fluid recycling box in real time, rapid recycling of the cutting fluid is achieved, and a working site is cleaner; the flushing assembly can spray water to clean the cutting fluid after the upper surface is ground, so that subsequent turnover is facilitated; and the wafer can be automatically coated and turned over.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor polishing equipment, and in particular to an automated semiconductor polishing equipment. Background Art

[0002] Wafer grinding and thinning is a key process step in the semiconductor manufacturing process. Its main purpose is to reduce the thickness of the silicon wafer to a specific size requirement. In semiconductor chip manufacturing, the initial thickness of the silicon wafer may exceed the actual chip manufacturing requirements due to factors such as the growth process. Grinding and thinning are required to accurately control the thickness of the silicon wafer; the grinder is the main equipment, usually including a grinding disc and a carrier for the silicon wafer;

[0003] After grinding one side of the silicon wafer, it needs to be turned over and grind the other side, so that the silicon wafer can be reduced in thickness and double-sided polished. However, the current double-sided grinding and thickness reduction work has the following shortcomings:

[0004] 1. After one side is ground, workers need to remove the wafer ring, apply a new film, and tear off the old film. The entire operation is cumbersome and takes a long time to prepare for the face change.

[0005] 2. After single-sided grinding and before lamination, the wafer needs to be rinsed in the cleaning chamber. The transfer cleaning process will further extend the grinding time. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides an automated semiconductor polishing device that solves the problems mentioned in the background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] An automated semiconductor polishing device includes a transfer channel;

[0009] The grinding components are symmetrically arranged at both ends of the transfer channel, and the two groups of grinding components are used to grind and reduce the thickness of the two sides of the wafer respectively; the grinding components include a main box body, a lifting grinding disc is installed on the top of the main box body, the bottom of the main box body is arranged on the lower seat body, a support plate is arranged in the middle of the surface of the lower seat body, a restraint component and a liquid spray pipe are installed on the top of the support plate, a cutting fluid recovery box is installed on the outside of the main box body, the side of the restraint component is connected to the cutting fluid recovery box, and the outlet end of the cutting fluid recovery box is connected to the liquid spray pipe;

[0010] A flushing assembly is horizontally slidably mounted on the top of the lower base, and is used to seal and remove residual liquid on the upper surface of the wafer for subsequent lamination;

[0011] A wafer ring is provided inside which a wafer is clamped and positioned. A baffle is applied to one side of the wafer ring. The area of ​​the baffle is larger than that of the wafer ring. The outer wall of the wafer ring is provided with four groups of plug-ins distributed in a circular array.

[0012] The conveying track is symmetrically arranged inside the transfer channel. The processing area is between the two sets of conveying tracks. The processing area is the loading position, the first processing position, the second processing position, the third processing position and the unloading position in the conveying direction. The outer wall of the conveying track is provided with multiple groups of clamping components, and the clamping components are matched with the plug-in plate of the wafer ring.

[0013] A material transfer assembly is installed at the internal loading position of the transfer channel, and is used to transfer the wafers in one group of grinding assemblies to the conveying track, and then transfer the wafers to another group of grinding assemblies;

[0014] A thickness detection component is installed at the first processing position of the processing area, and the thickness detection component is used to detect the thickness of the wafer and output unqualified wafers;

[0015] A film covering assembly is installed at the second processing position of the processing area, and the film covering assembly is used to cover the barrier film on the upper surface of the wafer ring;

[0016] The film tearing assembly is installed at the third processing position of the processing area, and is used to tear off the used blocking film on the wafer ring.

[0017] Furthermore, the flushing component includes a cutting fluid cleaning agent storage box, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is arranged on the inner side of the main box body, the inner end of the second driving rod is vertically slid and embedded in the vertical guide rail, the second driving rod is horizontally arranged, and the output end of the second driving rod is connected to the horizontally arranged sealing cover, the opening of the sealing cover faces downward, a spray head is provided on the inner side of the sealing cover, and a jet plate is symmetrically slidably provided on the inner top of the sealing cover. The cutting fluid cleaning agent storage box is arranged on the outer wall of the main box body, and the cutting fluid cleaning agent storage box is connected to the sealing cover through a conduit; when flushing the wafer, the sealing cover is sealed and docked on the wafer ring to form a closed cleaning chamber; the spray head is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted; the two groups of jet plates move horizontally in different directions to air-dry the wafer.

[0018] Furthermore, the constraint assembly includes a constraint frame and a first driving rod. The constraint frame is annular and is arranged on the surface of the lower base. The constraint frame is spaced outside the support plate. A liquid guide cavity is reserved between the constraint frame and the support plate. The first driving rod is symmetrically installed on the outer wall of the constraint frame. The inner end of the first driving rod is provided with a first rectangular insert, which is inserted into the insert plate; the side of the constraint frame is connected to the cutting fluid recovery tank through a liquid pump.

[0019] Furthermore, a cleaning ring is rotatably mounted on the outer wall of the support plate, the cleaning ring is arranged at the bottom of the first rectangular insert, the outer wall of the cleaning ring is connected to a cleaning plate, a first motor for driving the cleaning ring to rotate is installed inside the support plate, and the cleaning plate is used to push the liquid and impurities in the liquid guide cavity to the inlet of the liquid pump.

[0020] Furthermore, the clamping assembly includes a base, a third driving rod, and a second motor. The base is symmetrically arranged on two groups of conveying rails. A third driving rod is rotatably installed inside each group of bases and a second motor is installed at the rotating connection. The output end of the third driving rod is connected to the second rectangular plug, and the second rectangular plug is plugged into the plug plate; the second motor is used to drive the third driving rod to rotate so as to change the orientation of the wafer.

[0021] Furthermore, the material moving assembly includes a first transverse guide rail, which is arranged on the inner top surface of the transfer channel, a hanging plate is vertically slidably installed on the bottom surface of the first transverse guide rail, a second transverse guide rail is slidably installed on the bottom end of the hanging plate, a rack is provided on the surface of the second transverse guide rail, a third motor for driving the second transverse guide rail to translate is provided on the bottom side wall of the hanging plate, a fourth motor is slidably installed on the bottom surface of the second transverse guide rail, the output end of the fourth motor is connected to a double-headed screw seat, a fifth driving rod is symmetrically slidably installed on the bottom of the double-headed screw seat, a third rectangular insert is provided on the bottom end of the fifth driving rod, and the third rectangular insert is plugged into the insert plate.

[0022] Furthermore, the thickness detection assembly includes a top frame, a bottom frame, a thickness measuring probe and a reference plate. The top frame is arranged at the top of the conveying track, and a plurality of sets of thickness measuring probes are arranged on the bottom surface of the top frame. The bottom frame is arranged at the bottom of the conveying track, and a plurality of sets of reference plates are arranged on the surface of the bottom frame, and each set of reference plates corresponds to a set of thickness measuring probes.

[0023] Furthermore, the two ends of the base frame are rotatably connected to the vertical plates and a fifth motor is installed at the rotating connection. Adsorption holes are opened on the surface of the reference plate, a waste box is provided on the bottom surface of the transfer channel, and vertical slide rails are symmetrically provided on the inner wall of the waste box. The bottom end of the vertical plate is slidably embedded in the vertical slide rail.

[0024] Furthermore, the coating assembly includes a film unwinding wheel, a film collecting wheel, a recovery wheel, a circular cutter, a top plate and a bottom plate, sixth driving rods are installed at both ends of the bottom surface of the top plate, the bottom ends of two groups of sixth driving rods are respectively connected to the film unwinding wheel and the film collecting wheel, the recovery wheel is installed on the side of the film unwinding wheel, a seventh driving rod is provided in the middle of the bottom surface of the top plate, the bottom end of the seventh driving rod is connected to the circular cutter, an eighth driving rod is vertically provided on the top surface of the bottom plate, a resistance ring frame is provided at the top end of the eighth driving rod, the resistance ring frame is relatively attached to the outside of the wafer ring, the outside of the film unwinding wheel is rolled up with a protective belt, the bottom surface of the protective belt is coated with release paper, the recovery wheel is used to roll up the release paper; the circular cutter is used to open a blocking film on the protective belt, and the blocking film is provided with a glue layer.

[0025] Furthermore, the film tearing assembly includes a hanging plate, a fourth driving rod is vertically provided on the bottom surface of the hanging plate, the bottom end of the fourth driving rod is connected to the third transverse guide rail, and a film tearing claw is slidably installed on the bottom surface of the third transverse guide rail, and the film tearing claw is used to clamp the front end protruding part of the used blocking film.

[0026] The present invention provides an automated semiconductor polishing device. Compared with the prior art, it has the following beneficial effects:

[0027] 1. The outer wall of the wafer ring is equipped with four sets of plug-ins, which can facilitate the turnover and positioning of the wafer ring at each station;

[0028] 2. During the grinding process, the cutting fluid can be sealed by the restraining component, and then the cutting fluid and cutting impurities can be drawn out to the cutting fluid recovery box in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner;

[0029] 3. After the upper surface is ground, the flushing component can be set up to spray water to clean the cutting fluid, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint component and avoid contaminating the repeatedly used cutting fluid;

[0030] 4. In order to improve the efficiency of double-sided grinding, a transfer channel is designed to be located between the two groups of grinding components. After the wafer is ground and thickened in one group of grinding components, the material moving component can automatically grab the wafer and put it into the conveying track, thus realizing automatic unloading of the wafer; the film covering component can be used to make a blocking film and cover the top of the wafer ring. After the film covering is completed, the wafer ring can rotate so that the newly covered blocking film is placed under the wafer to stop the wafer, and the old blocking film is placed on top; the subsequent film tearing component can directly tear off the old film on the top, thus completing the automatic flipping and film changing. Finally, the material moving component transfers the wafer to the next group of grinding components. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of the side cross-section structure of the automated semiconductor polishing equipment of the present invention is shown;

[0033] Figure 2 A schematic diagram of the distribution structure of the sealing cover and the restraining assembly of the present invention is shown;

[0034] Figure 3 A schematic diagram of a top cross-sectional structure of a constraint frame of the present invention is shown;

[0035] Figure 4 A schematic diagram of the sealing cover connection structure of the present invention is shown;

[0036] Figure 5 The schematic diagram of the material transfer assembly structure of the present invention is shown;

[0037] Figure 6 A schematic diagram of the cross-sectional structure of the thickness detection assembly of the present invention is shown;

[0038] Figure 7 A schematic diagram of the reference plate distribution structure of the present invention is shown;

[0039] Figure 8 A schematic diagram of the side cross-sectional structure of the film covering assembly of the present invention is shown;

[0040] Fig. 9 A schematic diagram of the surface structure of the barrier film of the present invention is shown;

[0041] Fig.10 A schematic diagram of the side cross-sectional structure of the film tearing assembly of the present invention is shown;

[0042] As shown in the figure: 1. Grinding assembly, 11. Main box, 12. Grinding disc, 13. Lower seat, 131. Support plate, 14. Constraint assembly, 141. Constraint frame, 142. First drive rod, 143. First rectangular insert, 15. Spray pipe, 16. Cutting fluid recovery box, 17. Cleaning ring, 171. Cleaning plate, 172. First motor, 2. Flushing assembly, 21. Vertical guide rail, 22. Second drive rod, 23. Sealing cover, 231. Spray head, 232. Jet plate, 24. Cutting fluid cleaning agent storage box, 3. Transfer channel, 31. Conveying track, 4. Clamping assembly, 41. Base, 42. Third drive rod, 43. Second motor, 44. Second rectangular insert, 5. Material moving assembly, 51. First horizontal guide rail, 52. Hanging plate, 53. Second horizontal guide rail, 531. Rack, 5 4. The third motor, 55. The fourth motor, 56. The double-headed screw seat, 57. The fifth driving rod, 58. The third rectangular insert, 6. The thickness detection assembly, 61. The top frame, 62. The thickness measuring probe, 63. The bottom frame, 64. The reference plate, 641. The adsorption hole, 65. The vertical plate, 66. The fifth motor, 67. The waste box, 68. The vertical slide rail, 7. The film coating assembly, 71. The top plate, 72. The sixth driving rod, 73. The film placing wheel, 74. The film collecting wheel, 75. The recovery wheel, 76. The seventh driving rod, 77. The ring cutter, 78. The eighth driving rod, 79. The contact ring frame, 8. The protective belt, 81. The blocking film, 82. The adhesive layer, 9. The film tearing assembly, 91. The hanging plate, 92. The fourth driving rod, 93. The third horizontal guide rail, 94. The film tearing clamp, 9a. The wafer ring, 91a. The insert plate, 9b. The wafer. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] In order to solve the technical problems in the background technology, the following automated semiconductor polishing equipment is provided:

[0045] Combination Figure 1-Figure 10 As shown, an automated semiconductor polishing device provided by the present invention includes a transfer channel 3;

[0046] The grinding assembly 1 is symmetrically arranged at both ends of the transfer channel 3, and the two groups of grinding assemblies 1 are used to grind and thicken the two sides of the wafer respectively; the grinding assembly 1 includes a main box body 11, a lifting grinding disc 12 is installed on the top of the main box body 11, the bottom of the main box body 11 is arranged on the lower seat body 13, a support plate 131 is arranged in the middle of the surface of the lower seat body 13, a restraining assembly 14 and a liquid spraying pipe 15 are installed on the top of the support plate 131, a cutting fluid recovery box 16 is installed on the outside of the main box body 11, the side of the restraining assembly 14 is connected to the cutting fluid recovery box 16, and the outlet end of the cutting fluid recovery box 16 is connected to the liquid spraying pipe 15;

[0047] A flushing assembly 2 is horizontally slidably mounted on the top of the lower base 41, and is used to remove residual liquid on the upper surface of the wafer for subsequent coating;

[0048] A wafer ring 9a is provided inside which a wafer 9b is clamped and positioned. A blocking film 81 is applied to one side of the wafer ring. The area of ​​the blocking film 81 is larger than that of the wafer ring. The outer wall of the wafer ring is provided with four groups of plug-ins 91a distributed in a circular array.

[0049] The conveying tracks 31 are symmetrically arranged inside the transfer channel 3. The processing area is between the two sets of conveying tracks 31. The processing area is sequentially divided into a loading position, a first processing position, a second processing position, a third processing position and a unloading position along the conveying direction. The outer wall of the conveying track 31 is provided with multiple groups of clamping components 4, and the clamping components 4 are matched and docked with the insert plate of the wafer ring;

[0050] The material transfer assembly 5 is installed at the internal loading position of the transfer channel 3. The material transfer assembly 5 is used to transfer the wafers in one group of grinding assemblies 1 to the conveying track 31, and then transfer the wafers to another group of grinding assemblies 1;

[0051] A thickness detection component 6 is installed at the first processing position of the processing area, and the thickness detection component 6 is used to detect the thickness of the wafer and output unqualified wafers;

[0052] The film covering assembly 7 is installed at the second processing position of the processing area, and the film covering assembly 7 is used to cover the blocking film 81 on the upper surface of the wafer ring;

[0053] The film tearing assembly 9 is installed at the third processing position of the processing area. The film tearing assembly 9 is used to tear off the used blocking film 81 on the wafer ring.

[0054] In the above scheme:

[0055] 1. The outer wall of the wafer ring is equipped with four sets of plug-ins, which can facilitate the turnover and positioning of the wafer ring at each station;

[0056] 2. During the grinding process, the cutting fluid can be sealed by the restraining component, and then the cutting fluid and cutting impurities can be drawn out to the cutting fluid recovery box in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner;

[0057] 3. After the upper surface is ground, the flushing component can be set up to spray water to clean the cutting fluid, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint component and avoid contaminating the repeatedly used cutting fluid;

[0058] 4. In order to improve the efficiency of double-sided grinding, a transfer channel is designed to be located between the two groups of grinding components. After the wafer is ground and thickened in one group of grinding components, the material moving component can automatically grab the wafer and put it into the conveying track, thus realizing automatic unloading of the wafer; the film covering component can be used to make a blocking film and cover the top of the wafer ring. After the film covering is completed, the wafer ring can rotate so that the newly covered blocking film is placed under the wafer to stop the wafer, and the old blocking film is placed on top; the subsequent film tearing component can directly tear off the old film on the top, thus completing the automatic flipping and film changing. Finally, the material moving component transfers the wafer to the next group of grinding components.

[0059] In this embodiment, the flushing component 2 includes a cutting fluid cleaning agent storage box 24, a sealing cover 23, a second driving rod 22, and a vertical guide rail 21. The vertical guide rail 21 is arranged on the inner side of the main box body 11, and the inner end of the second driving rod 22 is vertically slid and embedded in the vertical guide rail 21. The second driving rod 22 is arranged horizontally, and the output end of the second driving rod 22 is connected to the horizontally arranged sealing cover 23. The opening of the sealing cover 23 faces downward, and a spray head 231 is provided on the inner side of the sealing cover 23. The inner top of the sealing cover 23 is symmetrically slidably provided with a jet plate 232. The cutting fluid cleaning agent storage box 24 is arranged on the outer wall of the main box body 11, and the cutting fluid cleaning agent storage box 24 is connected to the sealing cover 23 through a conduit; when flushing the wafer, the sealing cover 23 is sealed and docked on the wafer ring to form a closed cleaning chamber; the spray head 231 is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover 23 is intermittently extracted; the two groups of jet plates 232 move horizontally in different directions to air-dry the wafer.

[0060] In the above scheme: during the sealing and cleaning, the second driving rod drives the sealing cover to move to the top of the wafer ring, and then the second driving rod descends along the vertical guide rail, so that the sealing cover is sealed and fitted above the wafer ring; then the side spray head works first, and the cutting fluid cleaning agent is sprayed onto the wafer to clean the cutting fluid. Various liquids gather in the sealing cover and will not splash out. Then the pump body extracts the mixed liquid in the sealing cover. After the extraction is completed, the two sets of jet plates slide outward synchronously, which can exhaust air downward to dry the wafer. The airflow is evenly distributed and the drying effect is good.

[0061] In this embodiment, the constraint assembly 14 includes a constraint frame 141 and a first driving rod 142. The constraint frame 141 is annular and is arranged on the surface of the lower base 41. The constraint frame 141 is spaced outside the support plate 131. A liquid guide cavity is reserved between the constraint frame 141 and the support plate 131. The first driving rod 142 is symmetrically installed on the outer wall of the constraint frame 141. The inner end of the first driving rod 142 is provided with a first rectangular insert 143, and the first rectangular insert 143 is inserted into the insert plate; the side of the constraint frame 141 is connected to the cutting fluid recovery tank 16 through a liquid pump.

[0062] In the above scheme: after the wafer ring is placed on the support plate, the first driving rod drives the first rectangular insert to move inward, and the first rectangular insert is inserted into the insert plate, so that the wafer ring can be clamped and positioned, effectively ensuring the stability of the wafer ring and wafer during the grinding process; the constraint frame can also enclose the cutting fluid to prevent the cutting fluid from flowing into the equipment, reduce the contaminated area, and facilitate cleaning.

[0063] In this embodiment, a cleaning ring 17 is rotatably mounted on the outer wall of the support plate 131, and the outer wall of the cleaning ring 17 is connected to a cleaning plate 171. The cleaning ring is arranged at the bottom of the first rectangular insert, and a first motor 172 for driving the cleaning ring 17 to rotate is installed inside the support plate 131. The cleaning plate 171 is used to push the liquid and impurities in the liquid guide cavity to the inlet of the liquid pump.

[0064] Tracking of the above solution: When the liquid pump extracts the cutting fluid, impurities will accumulate in the liquid guide cavity and cannot be completely cleaned. In order to completely clean the impurities, the first motor can drive the cleaning ring to rotate, and then drive the cleaning plate to rotate in the liquid guide cavity, which can push the impurities and liquid to the outlet of the constraint frame and can be immediately extracted by the liquid pump to achieve sufficient cleaning.

[0065] In this embodiment, the clamping assembly 4 includes a base 41, a third driving rod 42, and a second motor 43. The base 41 is symmetrically arranged on two groups of conveying rails 31. The third driving rod 42 is rotatably installed inside each group of bases 41, and a second motor 43 is installed at the rotating connection. The output end of the third driving rod 42 is connected to the second rectangular plug 44, and the second rectangular plug 44 is plugged into the plug plate; the second motor 43 is used to drive the third driving rod 42 to rotate so as to change the orientation of the wafer.

[0066] In the above scheme: after the wafer ring is placed on the conveying track, a clamping assembly is provided to ensure stable conveying of the wafer ring and to perform coordinated actions; the third driving rod can drive the second rectangular insert to be inserted into the other two sets of insert plates to achieve clamping and material picking. When it is necessary to turn over and tear the film, the second motor can drive the third driving rod to rotate.

[0067] In this embodiment, the material moving assembly 5 includes a first transverse guide rail 51, which is arranged on the inner top surface of the transfer channel 3. A hanging plate 52 is vertically slidably installed on the bottom surface of the first transverse guide rail 51, and a second transverse guide rail 53 is slidably installed on the bottom end of the hanging plate 52. A rack 531 is provided on the surface of the second transverse guide rail 53, and a third motor 54 for driving the second transverse guide rail 53 to translate is provided on the bottom end side wall of the hanging plate 52. A fourth motor 55 is slidably installed on the bottom surface of the second transverse guide rail 53, and the output end of the fourth motor 55 is connected to a double-headed screw seat 56. A fifth driving rod 57 is symmetrically slidably installed on the bottom of the double-headed screw seat 56. A third rectangular insert 58 is provided at the bottom end of the fifth driving rod 57, and the third rectangular insert 58 is plugged into the insert plate.

[0068] In the above scheme: the material moving assembly is designed as a three-stage translation structure to meet the needs of loading and unloading of two groups of grinding assemblies. The hanging plate moves along the first transverse guide rail, the third motor can drive the second transverse guide rail to perform secondary transverse movement, the fourth motor can perform tertiary transverse movement along the second transverse guide rail, the fourth motor can drive the double-headed screw seat to rotate, so as to switch the third rectangular insert to dock with any two groups of insert plates, the fifth drive rod can drive the third rectangular insert to descend, and then the fifth drive rod moves synchronously along the double-headed screw seat to realize wafer ring docking.

[0069] In this embodiment, the thickness detection assembly 6 includes a top frame body 61, a bottom frame body 63, a thickness measuring probe 62 and a reference plate 64. The top frame body 61 is arranged at the top of the conveying track 31, and a plurality of sets of thickness measuring probes 62 are arranged on the bottom surface of the top frame body 61. The bottom frame body 63 is arranged at the bottom of the conveying track 31, and a plurality of sets of reference plates 64 are arranged on the surface of the bottom frame body 63, and each set of reference plates 64 corresponds to a set of thickness measuring probes 62.

[0070] In the above scheme: the ground wafer is transported to the bottom of the thickness gauge probe by the clamping assembly. During the passing process, multiple sets of thickness gauge probes can perform linear fitting detection on the surface of the wafer to achieve multi-point comprehensive detection, so as to quickly determine whether the thickness of the wafer is qualified. There is no need for separate detection, and the reference plate can be used as the basis for adjusting the side head probe.

[0071] In this embodiment, both ends of the base frame 63 are rotatably connected to the vertical plates 65 and a fifth motor 66 is installed at the rotatable connection. Adsorption holes 641 are provided on the surface of the reference plate 64. A waste box 67 is provided on the bottom surface of the transfer channel 3. Vertical slide rails 68 are symmetrically provided on the inner wall of the waste box 67. The bottom end of the vertical plate 65 is slidably embedded in the vertical slide rail 68.

[0072] In the above scheme: when a wafer is detected to have unqualified thickness, the adsorption hole can adsorb and position the wafer from the bottom, and then the clamping assembly is unlocked, the vertical plate moves downward along the vertical slide rail, and the fifth motor drives the wafer to rotate so that the reference plate is located at the top. Subsequently, the vertical plate continues to descend, so that the wafer falls into the waste box. After placement, the adsorption hole no longer adsorbs.

[0073] In this embodiment, the coating assembly 7 includes a film placing wheel 73, a film collecting wheel 74, a recovery wheel 75, a circular cutter 77, a top plate 71 and a bottom plate. Sixth driving rods 72 are installed at both ends of the bottom surface of the top plate 71, and the bottom ends of the two groups of sixth driving rods 72 are respectively connected to the film placing wheel 73 and the film collecting wheel 74. The side of the film placing wheel 73 is installed with a recovery wheel 75. A seventh driving rod 76 is provided in the middle of the bottom surface of the top plate 71, and the bottom end of the seventh driving rod 76 is connected to the circular cutter 77. An eighth driving rod 78 is vertically provided on the top surface of the bottom plate, and a resistance ring frame 79 is provided at the top end of the eighth driving rod 78. The resistance ring frame 79 is relatively attached to the outside of the wafer ring. The outside of the film placing wheel 73 is rolled up with a protective tape 8, and the bottom surface of the protective tape 8 is coated with release paper. The recovery wheel 75 is used to roll up the release paper; the circular cutter 77 is used to open a blocking film 81 on the protective tape 8, and the blocking film 81 is provided with a glue layer 82.

[0074] In the above scheme: during lamination, the film-releasing wheel releases the protective tape, the release paper is rolled up on the recovery wheel, a new protective tape is placed above the wafer ring, the sixth driving rod drives the film-releasing wheel and the film-recovering wheel to descend, the eighth driving rod drives the contact ring frame to move upward, the contact ring frame is placed on the outside of the wafer ring, the adhesive layer of the protective tape is bonded to the wafer ring, and then the seventh driving rod drives the ring cutter to move downward and contact with the contact ring frame, and the ring cutter cuts a circular barrier film in the protective tape.

[0075] In this embodiment, the film tearing assembly 9 includes a hanging plate 91, and a fourth driving rod 92 is vertically provided on the bottom surface of the hanging plate 91. The bottom end of the fourth driving rod 92 is connected to a third horizontal guide rail 93. A film tearing clamp 94 is slidably installed on the bottom surface of the third horizontal guide rail 93. The film tearing clamp 94 is used to clamp the front end protruding part of the used blocking film 81.

[0076] In the above scheme: when tearing the film, the film tearing claw clamps the front end extension of the blocking film, and then the fourth driving rod drives the film tearing claw to move upward, and the fourth driving rod moves along the third transverse guide rail to tear off the blocking film.

[0077] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0078] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automated semiconductor polishing device, characterized in that: include: Transit channel; Grinding components are symmetrically arranged at both ends of the transfer channel, and two sets of grinding components are used to grind and reduce the thickness of the two sides of the wafer respectively; The grinding assembly includes a main box body, a lifting grinding disc is installed on the top of the main box body, the bottom of the main box body is arranged on the lower seat body, a support plate is arranged in the middle of the surface of the lower seat body, a restraint assembly and a liquid spray pipe are installed on the top of the support plate, a cutting fluid recovery box is installed on the outside of the main box body, the side of the restraint assembly is connected to the cutting fluid recovery box, and the outlet end of the cutting fluid recovery box is connected to the liquid spray pipe; A flushing assembly is horizontally slidably mounted on the top of the lower base, and is used to seal and remove residual liquid on the upper surface of the wafer for subsequent lamination; A wafer ring is provided inside which a wafer is clamped and positioned. A baffle is applied to one side of the wafer ring. The area of ​​the baffle is larger than that of the wafer ring. The outer wall of the wafer ring is provided with four groups of plug-ins distributed in a circular array. The conveying track is symmetrically arranged inside the transfer channel. The processing area is between the two sets of conveying tracks. The processing area is the loading position, the first processing position, the second processing position, the third processing position and the unloading position in the conveying direction. The outer wall of the conveying track is provided with multiple groups of clamping components, and the clamping components are matched with the plug-in plate of the wafer ring. A material transfer assembly is installed at the internal loading position of the transfer channel, and is used to transfer the wafers in one group of grinding assemblies to the conveying track, and then transfer the wafers to another group of grinding assemblies; A thickness detection component is installed at the first processing position of the processing area, and the thickness detection component is used to detect the thickness of the wafer and output unqualified wafers; A film covering assembly is installed at the second processing position of the processing area, and the film covering assembly is used to cover the barrier film on the upper surface of the wafer ring; The film tearing assembly is installed at the third processing position of the processing area, and is used to tear off the used blocking film on the wafer ring.

2. The automated semiconductor polishing equipment according to claim 1, characterized in that: The flushing component includes a cutting fluid cleaning agent storage box, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is arranged on the inner side of the main box body. The inner end of the second driving rod slides vertically and is embedded in the vertical guide rail. The second driving rod is arranged horizontally. The output end of the second driving rod is connected to the horizontally arranged sealing cover. The opening of the sealing cover faces downward. A liquid spray head is arranged on the inner side of the sealing cover. A jet plate is symmetrically slidably arranged on the inner top of the sealing cover. The cutting fluid cleaning agent storage box is arranged on the outer wall of the main box body. The cutting fluid cleaning agent storage box is connected to the sealing cover through a conduit. When flushing the wafer, the sealing cover is sealed and docked on the wafer ring to form a closed cleaning chamber. The liquid spray head is tilted downward to discharge the cutting fluid cleaning agent to flush the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently extracted. The two groups of jet plates move horizontally in different directions to air-dry the wafer.

3. The automated semiconductor polishing equipment according to claim 2, characterized in that: The constraint assembly includes a constraint frame and a first driving rod. The constraint frame is annular and is arranged on the surface of the lower base. The constraint frame is spaced outside the support plate. A liquid guide cavity is reserved between the constraint frame and the support plate. The first driving rod is symmetrically installed on the outer wall of the constraint frame. The inner end of the first driving rod is provided with a first rectangular insert, which is inserted into the insert plate in cooperation. The side of the constraint frame is connected to the cutting fluid recovery tank through a liquid pump.

4. The automated semiconductor polishing equipment according to claim 3, characterized in that: The outer wall of the support plate is rotatably sleeved with a cleaning ring, which is arranged at the bottom of the first rectangular insert, the outer wall of the cleaning ring is connected to the cleaning plate, and the interior of the support plate is equipped with a first motor that drives the cleaning ring to rotate, and the cleaning plate is used to push the liquid and impurities in the liquid guide cavity to the inlet of the liquid pump.

5. The automated semiconductor polishing equipment according to claim 4, characterized in that: The clamping assembly includes a base, a third driving rod, and a second motor. The base is symmetrically arranged on two groups of conveying rails. The third driving rod is rotatably installed inside each group of bases and the second motor is installed at the rotating connection. The output end of the third driving rod is connected to the second rectangular plug, and the second rectangular plug is plugged into the plug plate; the second motor is used to drive the third driving rod to rotate so as to change the orientation of the wafer.

6. The automated semiconductor polishing equipment according to claim 5, characterized in that: The material moving assembly includes a first transverse guide rail, which is arranged on the inner top surface of the transfer channel, a hanging plate is vertically slidably installed on the bottom surface of the first transverse guide rail, a second transverse guide rail is slidably installed on the bottom end of the hanging plate, a rack is provided on the surface of the second transverse guide rail, a third motor for driving the second transverse guide rail to translate is provided on the bottom side wall of the hanging plate, a fourth motor is slidably installed on the bottom surface of the second transverse guide rail, the output end of the fourth motor is connected to a double-headed screw seat, a fifth driving rod is symmetrically slidably installed on the bottom of the double-headed screw seat, a third rectangular insert is provided on the bottom end of the fifth driving rod, and the third rectangular insert is plugged into the insert plate.

7. The automated semiconductor polishing equipment according to claim 6, characterized in that: The thickness detection assembly includes a top frame, a bottom frame, a thickness measuring probe and a reference plate. The top frame is arranged at the top of the conveying track, and a plurality of sets of thickness measuring probes are arranged on the bottom surface of the top frame. The bottom frame is arranged at the bottom of the conveying track, and a plurality of sets of reference plates are arranged on the surface of the bottom frame, and each set of reference plates corresponds to a set of thickness measuring probes.

8. The automated semiconductor polishing equipment according to claim 7, characterized in that: The two ends of the bottom frame are rotatably connected to the vertical plates and a fifth motor is installed at the rotating connection. Adsorption holes are opened on the surface of the reference plate, a waste box is provided on the bottom surface of the transfer channel, and vertical slide rails are symmetrically provided on the inner wall of the waste box. The bottom end of the vertical plate is slidably embedded in the vertical slide rail.

9. The automated semiconductor polishing equipment according to claim 8, characterized in that: The coating assembly includes a film placing wheel, a film collecting wheel, a recovery wheel, a circular cutter, a top plate and a bottom plate, sixth driving rods are installed at both ends of the bottom surface of the top plate, the bottom ends of two groups of sixth driving rods are respectively connected to the film placing wheel and the film collecting wheel, the recovery wheel is installed on the side of the film placing wheel, a seventh driving rod is provided at the middle part of the bottom surface of the top plate, the bottom end of the seventh driving rod is connected to the circular cutter, an eighth driving rod is vertically provided on the top surface of the bottom plate, a resistance ring frame is provided at the top end of the eighth driving rod, the resistance ring frame is relatively attached to the outside of the wafer ring, the outside of the film placing wheel is rolled up with a protective belt, the bottom surface of the protective belt is coated with release paper, the recovery wheel is used for rolling up the release paper; the circular cutter is used for opening a blocking film on the protective belt, and a glue layer is provided on the blocking film.

10. The automated semiconductor polishing equipment according to claim 9, characterized in that: The film tearing assembly includes a hanging plate, a fourth driving rod is vertically arranged on the bottom surface of the hanging plate, the bottom end of the fourth driving rod is connected to the third transverse guide rail, and a film tearing clamp is slidably installed on the bottom surface of the third transverse guide rail, and the film tearing clamp is used to clamp the front end protruding part of the used blocking film.

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