An automated semiconductor grinding equipment

Abstract

The present invention provides an automated semiconductor grinding device, including a transfer channel; grinding components symmetrically arranged at both ends of the transfer channel, and the two groups of grinding components are used to grind and thin the two sides of the wafer respectively; a flushing component horizontally and slidably installed on the top of the base, and the flushing component is used to seal and remove the residual liquid on the upper surface of the wafer to facilitate subsequent film covering; a crystal ring with a wafer clamped and positioned inside, a film blocking layer is attached to one side of the crystal ring, the area of the film blocking layer is larger than that of the crystal ring, and four groups of insertion plates are arranged in an annular array on the outer wall of the crystal ring; a conveying track; a material transfer component; a thickness detection component; a film covering component; a film tearing component; in the present invention, the cutting fluid and cutting impurities can be pumped out to the cutting fluid recovery tank in real time, realizing the rapid recovery of the cutting fluid and making the operation site cleaner; the flushing component is provided to spray water to clean the cutting fluid after the upper surface grinding is completed, facilitating subsequent turnover; and the wafer can be automatically subjected to film covering and turning-over treatment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor grinding equipment, and particularly relates to an automated semiconductor grinding equipment. Background Art

[0002] Wafer silicon grinding and thinning is a key process step in the semiconductor manufacturing process. Its main purpose is to reduce the thickness of the silicon wafer to a specific size requirement. In semiconductor chip manufacturing, the initial thickness of the silicon wafer may exceed the actual chip manufacturing requirements due to factors such as the growth process, and it is necessary to precisely control the thickness of the silicon wafer through grinding and thinning; the grinding machine is the main equipment, which usually includes a grinding disk and a carrier for carrying the silicon wafer;

[0003] After one side of the wafer silicon is ground, it needs to be turned over and ground on the other side, so that the wafer silicon can be thinned and double-sided polished. However, there are the following deficiencies in the current double-sided grinding and thinning work:

[0004] 1. After one side is ground, the worker needs to remove the crystal ring - cover with a new film - tear off the old film. The whole operation is cumbersome and the time for preparing for turning the surface is long;

[0005] 2. After single-sided grinding, before laminating the film, it is necessary to rinse the wafer in the cleaning chamber first, and the transfer cleaning process will further extend the grinding time. Summary of the Invention

[0006] In view of the deficiencies of the prior art, the present invention provides an automated semiconductor grinding equipment, which solves the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0008] An automated semiconductor grinding equipment includes a transfer channel;

[0009] Grinding assemblies, which are symmetrically arranged at both ends of the transfer channel, and the two groups of grinding assemblies are used to grind and thin the two sides of the wafer respectively; the grinding assembly includes a main box body, a liftable grinding disk is installed at the top inside the main box body, a lower seat body is arranged at the bottom inside the main box body, a support plate is arranged in the middle of the surface of the lower seat body, a restraint assembly and a liquid spraying pipe are installed at the top of the support plate, a cutting fluid recovery tank is installed outside the main box body, the side of the restraint assembly is communicated with the cutting fluid recovery tank, and the outlet end of the cutting fluid recovery tank is communicated with the liquid spraying pipe;

[0010] A rinsing assembly, which is horizontally slidably installed on the top of the base, and the rinsing assembly is used to seal and remove the residual liquid on the upper surface of the wafer for subsequent film laminating;

[0011] A crystal ring, with a wafer held and positioned inside it. A shielding film is attached to one side of the crystal ring, and the area of the shielding film is larger than that of the crystal ring. Four groups of insertion plates are arranged in an annular array on the outer wall of the crystal ring;

[0012] A conveying track, symmetrically arranged inside the transfer channel. The processing area is between the two conveying tracks. Along the conveying direction, the processing area successively includes a loading position, a first processing position, a second processing position, a third processing position, and an unloading position. Multiple groups of clamping components are arranged on the outer wall of the conveying track, and the clamping components are cooperatively docked with the insertion plates of the crystal ring;

[0013] A material transfer component, installed at the loading position inside the transfer channel. The material transfer component is used to transfer the wafer in one grinding component to the conveying track and then transfer the wafer to another grinding component;

[0014] A thickness detection component, installed at the first processing position in the processing area. The thickness detection component is used to detect the thickness of the wafer and output the unqualified wafers;

[0015] A film covering component, installed at the second processing position in the processing area. The film covering component is used to cover the shielding film on the upper surface of the crystal ring;

[0016] A film tearing component, installed at the third processing position in the processing area. The film tearing component is used to tear off the used shielding film on the crystal ring.

[0017] Further, the flushing component includes a cutting fluid cleaning agent storage tank, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is arranged on the inner side surface of the main box body. The inner end of the second driving rod is vertically slidably inserted into the vertical guide rail. The second driving rod is horizontally arranged. The output end of the second driving rod is connected to the horizontally arranged sealing cover. The opening of the sealing cover faces downward. A liquid spraying head is arranged on the inner side surface of the sealing cover. Two air jet plates are symmetrically and slidably arranged at the top inside the sealing cover. The cutting fluid cleaning agent storage tank is arranged on the outer wall of the main box body, and the cutting fluid cleaning agent storage tank is communicated with the sealing cover through a conduit; when flushing the wafer, the sealing cover is hermetically docked on the crystal ring to form a closed cleaning cavity; the liquid spraying head discharges the cutting fluid cleaning agent obliquely downward to flush the wafer, and the cutting fluid cleaning agent inside the sealing cover is intermittently pumped out; the two air jet plates move horizontally in opposite directions to air-dry the wafer.

[0018] Further, the restraint component includes a restraint frame and a first driving rod. The restraint frame is annular, arranged on the surface of the lower seat body, spaced outside the support plate, and a liquid guiding cavity is left between the restraint frame and the support plate. The outer wall of the restraint frame is symmetrically installed with the first driving rod, and the inner end of the first driving rod is provided with a first rectangular insertion tube, which is cooperatively inserted into the insertion plate; the side part of the restraint frame is communicated with the cutting fluid recovery tank through a liquid pumping pump.

[0019] Further, a cleaning ring is rotatably sleeved on the outer wall of the pallet. The cleaning ring is arranged at the bottom of the first rectangular insertion tube. A cleaning plate is connected to the outer wall of the cleaning ring. A first motor for driving the cleaning ring to rotate is installed inside the pallet. The cleaning plate is used to push the liquid and impurities in the liquid guide cavity to the inlet of the liquid extraction pump.

[0020] Further, the clamping assembly includes a base, a third driving rod, and a second motor. The bases are symmetrically arranged on two groups of conveying tracks. A third driving rod is rotatably installed inside each base, and a second motor is installed at the rotation connection. The output end of the third driving rod is connected to a second rectangular insertion tube, and the second rectangular insertion tube is in mating plug connection with the insertion plate; the second motor is used to drive the third driving rod to rotate self, so as to change the orientation of the wafer.

[0021] Further, the material transfer assembly includes a first horizontal guide rail, which is arranged on the inner top surface of the transfer channel. A hanging plate is vertically slidably installed on the bottom surface of the first horizontal guide rail. A second horizontal guide rail is slidably arranged at the bottom end of the hanging plate. A rack is arranged on the surface of the second horizontal guide rail. A third motor for driving the second horizontal guide rail to translate is arranged on the side wall at the bottom end of the hanging plate. A fourth motor is slidably installed on the bottom surface of the second horizontal guide rail. The output end of the fourth motor is connected to a double-headed screw seat. Fifth driving rods are symmetrically slidably installed at the bottom of the double-headed screw seat. A third rectangular insertion tube is arranged at the bottom end of the fifth driving rod, and the third rectangular insertion tube is in mating plug connection with the insertion plate.

[0022] Further, the thickness detection assembly includes a top frame body, a bottom frame body, thickness measurement probes, and a reference plate. The top frame body is arranged on the top of the conveying track. Multiple groups of thickness measurement probes are arranged on the bottom surface of the top frame body. The bottom frame body is arranged at the bottom of the conveying track. Multiple groups of reference plates are arranged on the surface of the bottom frame body, and each group of reference plates corresponds to a group of thickness measurement probes.

[0023] Further, the two ends of the bottom frame body are rotatably connected to vertical plates, and a fifth motor is installed at the rotation connection. Suction holes are formed on the surface of the reference plate. A waste box is arranged on the bottom surface of the transfer channel. Vertical sliding rails are symmetrically arranged on the inner wall of the waste box. The bottom end of the vertical plate is slidably embedded in the vertical sliding rail.

[0024] Further, the film covering assembly includes a film releasing wheel, a film winding wheel, a recycling wheel, a cutting knife, a top plate, and a bottom plate. Sixth driving rods are installed at both ends of the bottom surface of the top plate. The bottom ends of the two groups of sixth driving rods are respectively connected to the film releasing wheel and the film winding wheel. A recycling wheel is installed on the side of the film releasing wheel. A seventh driving rod is arranged in the middle of the bottom surface of the top plate, and the bottom end of the seventh driving rod is connected to the cutting knife. An eighth driving rod is vertically arranged on the top surface of the bottom plate, and a contact ring frame is arranged at the top end of the eighth driving rod. The contact ring frame is relatively attached to the outside of the crystal ring. A protective belt is wound outside the film releasing wheel, and a release paper is covered on the bottom surface of the protective belt. The recycling wheel is used to wind the release paper; the cutting knife is used to cut out a film stop on the protective belt, and an adhesive layer is arranged on the film stop.

[0025] Further, the film tearing assembly includes a suspension plate, a fourth driving rod is vertically provided on the bottom surface of the suspension plate, the bottom end of the fourth driving rod is connected to a third horizontal guide rail, and a film tearing jaw is slidably mounted on the bottom surface of the third horizontal guide rail. The film tearing jaw is used to clamp the outer extension of the front end of the used film stopper.

[0026] The present invention provides an automated semiconductor grinding device. Compared with the prior art, it has the following beneficial effects:

[0027] 1. Four groups of insertion plates are provided on the outer wall of the crystal ring, which can facilitate the turnover and positioning of the crystal ring at each station;

[0028] 2. During the grinding process, the cutting fluid can be enclosed by the constraint assembly, and then the cutting fluid and cutting impurities can be pumped out to the cutting fluid recovery tank in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner;

[0029] 3. The flushing assembly is provided to spray water to clean the cutting fluid after the upper surface grinding is completed, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint assembly and avoid polluting the repeatedly used cutting fluid;

[0030] 4. In order to improve the double-sided grinding efficiency, a transfer channel is designed between two groups of grinding assemblies. After the wafer is ground and thinned in one group of grinding assemblies, the transfer assembly can automatically grab the wafer and enter the conveying track, so as to realize the automatic blanking of the wafer; the film covering assembly can make a film stopper and cover it on the top of the crystal ring. After the film covering is completed, the crystal ring can rotate, so that the newly covered film stopper is placed below the wafer to stop the wafer, and the old film stopper is placed above; subsequently, the film tearing assembly can directly tear off the old film located above. In this way, the automatic turning and film changing are completed. Finally, the transfer assembly transfers the wafer to the next group of grinding assemblies. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 Shows a schematic side cross-sectional structure of the automated semiconductor grinding device of the present invention;

[0033] Figure 2 Shows a schematic distribution structure of the sealing cover and the constraint assembly of the present invention;

[0034] Figure 3 Shows a schematic top cross-sectional structure of the constraint frame of the present invention;

[0035] Figure 4 Shows a schematic diagram of the sealing cover connection structure of the present invention;

[0036] Figure 5 Shows a schematic diagram of the material transfer component structure of the present invention;

[0037] Figure 6 Shows a schematic cross-sectional structure diagram at the thickness detection component of the present invention;

[0038] Figure 7 Shows a schematic diagram of the distribution structure of the reference plate of the present invention;

[0039] Figure 8 Shows a schematic side cross-sectional structure diagram of the film coating component of the present invention;

[0040] Figure 9 Shows a schematic surface structure diagram of the film blocking member of the present invention;

[0041] Figure 10 Shows a schematic side cross-sectional structure diagram of the film tearing component of the present invention;

[0042] As shown in the figure: 1. Grinding component, 11. Main box body, 12. Grinding disc, 13. Lower seat body, 131. Support plate, 14. Constraint component, 141. Constraint frame, 142. First driving rod, 143. First rectangular insertion tube, 15. Liquid spraying pipe, 16. Cutting fluid recovery tank, 17. Cleaning ring, 171. Cleaning plate, 172. First motor, 2. Flushing component, 21. Vertical guide rail, 22. Second driving rod, 23. Sealing cover, 231. Liquid spraying head, 232. Air jet plate, 24. Cutting fluid cleaning agent storage tank, 3. Transfer channel, 31. Conveyor track, 4. Clamping component, 41. Base, 42. Third driving rod, 43. Second motor, 44. Second rectangular insertion tube, 5. Material transfer component, 51. First horizontal guide rail, 52. Hanging plate, 53. Second horizontal guide rail, 531. Rack, 54. Third motor, 55. Fourth motor, 56. Double-headed screw seat, 57. Fifth driving rod, 58. Third rectangular insertion tube, 6. Thickness detection component, 61. Top frame body, 62. Thickness measurement probe, 63. Bottom frame body, 64. Reference plate, 641. Adsorption hole, 65. Vertical plate, 66. Fifth motor, 67. Waste box, 68. Vertical slide rail, 7. Film coating component, 71. Top plate, 72. Sixth driving rod, 73. Film releasing wheel, 74. Film winding wheel, 75. Recovery wheel, 76. Seventh driving rod, 77. Circumferential cutting knife, 78. Eighth driving rod, 79. Contact ring frame, 8. Protective belt, 81. Film blocking member, 82. Adhesive layer, 9. Film tearing component, 91. Hanging plate, 92. Fourth driving rod, 93. Third horizontal guide rail, 94. Film tearing jaw, 9a. Crystal ring, 91a. Insertion plate, 9b. Wafer. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0044] To solve the technical problems in the background art, the following is an automated semiconductor grinding device:

[0045] Combined with Figures 1 - 10 As shown, an automated semiconductor grinding device provided by the present invention includes a transfer channel 3;

[0046] A grinding assembly 1, which is symmetrically arranged at both ends of the transfer channel 3. The two sets of grinding assemblies 1 are used to grind and thin the two sides of the wafer respectively; the grinding assembly 1 includes a main box body 11. An elevating grinding disc 12 is installed at the top inside the main box body 11. A lower seat body 13 is provided at the bottom inside the main box body 11. A support plate 131 is provided in the middle of the surface of the lower seat body 13. A restraint assembly 14 and a liquid spraying pipe 15 are installed on the top of the support plate 131. A cutting fluid recovery box 16 is installed outside the main box body 11. The side of the restraint assembly 14 communicates with the cutting fluid recovery box 16, and the outlet end of the cutting fluid recovery box 16 communicates with the liquid spraying pipe 15;

[0047] A flushing assembly 2, which is slidably installed inside the main box body 11. The flushing assembly 2 is used to remove the residual liquid on the upper surface of the wafer to facilitate subsequent film coating;

[0048] A crystal ring 9a, inside which a wafer 9b is clamped and positioned. A retaining film 81 is attached to one side of the crystal ring. The area of the retaining film 81 is larger than the area of the crystal ring. Four groups of insertion plates 91a are arranged in an annular array on the outer wall of the crystal ring;

[0049] Conveyor tracks 31, which are symmetrically arranged inside the transfer channel 3. The processing area is between the two sets of conveyor tracks 31. The processing area is successively the loading position, the first processing position, the second processing position, the third processing position, and the unloading position along the conveying direction. A plurality of clamping assemblies 4 are provided on the outer wall of the conveyor track 31. The clamping assemblies 4 are cooperatively docked with the insertion plates of the crystal ring;

[0050] A material transfer assembly 5, which is installed at the loading position inside the transfer channel 3. The material transfer assembly 5 is used to transfer the wafer in one set of grinding assemblies 1 to the conveyor track 31, and then transfer the wafer to the other set of grinding assemblies 1;

[0051] A thickness detection assembly 6, which is installed at the first processing position in the processing area. The thickness detection assembly 6 is used to detect the thickness of the wafer and output the unqualified wafers;

[0052] The film laminating assembly 7 is installed at the second processing position in the processing area. The film laminating assembly 7 is used to cover the film 81 on the upper surface of the crystal ring.

[0053] The film tearing assembly 9 is installed at the third processing position in the processing area. The film tearing assembly 9 is used to tear off the used film 81 on the crystal ring.

[0054] In the above solution:

[0055] 1. Four groups of insertion plates are provided on the outer wall of the crystal ring, which can facilitate the turnover and positioning of the crystal ring at each working position.

[0056] 2. During the grinding process, the cutting fluid can be enclosed by the constraint assembly, and then the cutting fluid and cutting impurities can be pumped out to the cutting fluid recovery tank in real time, realizing the rapid recovery of the cutting fluid and making the working site cleaner.

[0057] 3. The flushing assembly is provided to spray and clean the cutting fluid after the upper surface grinding is completed, which is convenient for subsequent turnover. At the same time, the cleaning process is a closed operation, which can prevent the cutting fluid cleaning agent from entering the constraint assembly and avoid polluting the repeatedly used cutting fluid.

[0058] 4. In order to improve the double-sided grinding efficiency, the transfer channel is designed between the two grinding assemblies. After the wafer is ground and thinned in one grinding assembly, the transfer component can automatically grab the wafer and enter the conveying track, so as to realize the automatic blanking of the wafer. The film laminating assembly can make a film and cover it on the top of the crystal ring. After the film lamination is completed, the crystal ring can rotate, so that the newly laminated film is placed under the wafer to stop the wafer, while the old film is placed on the top. Subsequently, the film tearing assembly can directly tear off the old film on the top. In this way, the automatic flipping and film changing are completed. Finally, the transfer component transfers the wafer to the next grinding assembly.

[0059] In this embodiment, the flushing assembly 2 includes a cutting fluid cleaning agent storage tank 24, a sealing cover 23, a second driving rod 22, and a vertical guide rail 21. The vertical guide rail 21 is arranged on the inner side of the main box body 11. The inner end of the second driving rod 22 is vertically and slidably embedded in the vertical guide rail 21. The second driving rod 22 is horizontally arranged. The output end of the second driving rod 22 is connected to the horizontally arranged sealing cover 23. The opening of the sealing cover 23 faces downward. A liquid spraying head 231 is arranged on the inner side of the sealing cover 23. Two air jet plates 232 are symmetrically and slidably arranged on the inner top of the sealing cover 23. The cutting fluid cleaning agent storage tank 24 is arranged on the outer wall of the main box body 11. The cutting fluid cleaning agent storage tank 24 is communicated with the sealing cover 23 through a conduit. When flushing the wafer, the sealing cover 23 is hermetically docked on the crystal ring to form a closed cleaning cavity. The liquid spraying head 231 discharges the cutting fluid cleaning agent obliquely downward to flush the wafer, and the cutting fluid cleaning agent in the sealing cover 23 is intermittently pumped out. The two air jet plates 232 move horizontally in opposite directions to air-dry the wafer.

[0060] In the above solution: during sealed cleaning, the second driving rod drives the sealing cover to move above the crystal ring, and then the second driving rod descends along the vertical guide rail, so that the sealing cover is hermetically attached above the crystal ring; then the liquid spraying heads on the side work first, and the cutting fluid cleaning agent is sprayed onto the wafer to clean the cutting fluid. Various liquids gather in the sealing cover and will not splash out. Then the pump body pumps out the mixed liquid in the sealing cover. After pumping out is completed, the two sets of air jet plates slide outwards synchronously, which can exhaust air downwards to dry the wafer. The air flow is evenly distributed and the drying effect is good.

[0061] In this embodiment, the constraint assembly 14 includes a constraint frame 141 and a first driving rod 142. The constraint frame 141 is annular. The constraint frame 141 is arranged on the surface of the lower seat body 13. The constraint frame 141 is spaced outside the support plate 131. A liquid guiding cavity is left between the constraint frame 141 and the support plate 131. The outer walls of the constraint frame 141 are symmetrically installed with first driving rods 142. The inner ends of the first driving rods 142 are provided with first rectangular insertion tubes 143, and the first rectangular insertion tubes 143 are fitted and inserted on the insertion plates; the side part of the constraint frame 141 is connected to the cutting fluid recovery tank 16 through a liquid extraction pump.

[0062] In the above solution: after the crystal ring is placed on the support plate, the first driving rod drives the first rectangular insertion tube to move inwards, and the first rectangular insertion tube is inserted on the insertion plate. In this way, the crystal ring can be clamped and positioned, effectively ensuring the stability of the crystal ring and the wafer during the grinding process; the constraint frame can also surround the cutting fluid, preventing the cutting fluid from flowing into the equipment, reducing the pollution area and facilitating cleaning.

[0063] In this embodiment, a cleaning ring 17 is rotatably sleeved on the outer wall of the support plate 131. The outer wall of the cleaning ring 17 is connected with a cleaning plate 171. The cleaning ring is arranged at the bottom of the first rectangular insertion tube. A first motor 172 for driving the cleaning ring 17 to rotate is installed inside the support plate 131. The cleaning plate 171 is used to push the liquid and impurities in the liquid guiding cavity to the inlet of the liquid extraction pump.

[0064] In the above solution tracking: when the liquid extraction pump extracts the cutting fluid, impurities will accumulate in the liquid guiding cavity and cannot be completely cleaned. In order to completely clean the impurities, the first motor can drive the cleaning ring to rotate, thereby driving the cleaning plate to rotate in the liquid guiding cavity, which can push the impurities and liquid to the outlet of the constraint frame and can be immediately extracted by the liquid extraction pump to achieve full cleaning.

[0065] In this embodiment, the clamping assembly 4 includes a base 41, a third driving rod 42, and a second motor 43. The bases 41 are symmetrically arranged on the two sets of conveying tracks 31. A third driving rod 42 is rotatably installed inside each base 41, and a second motor 43 is installed at the rotation connection. The output end of the third driving rod 42 is connected with a second rectangular insertion tube 44, and the second rectangular insertion tube 44 is fitted and inserted with the insertion plate; the second motor 43 is used to drive the third driving rod 42 to rotate self - sufficiently to change the orientation of the wafer.

[0066] In the above solution: After the crystal ring is placed on the conveying track, in order to ensure the stable conveying of the crystal ring and make a cooperative action, a clamping assembly is provided; the third driving rod can drive the second rectangular insertion tube to be inserted on the other two groups of insertion plates to achieve clamping and material taking. When it is necessary to turn over and tear the film, the second motor drives the third driving rod to rotate.

[0067] In this embodiment, the material transfer assembly 5 includes a first horizontal guide rail 51, the first horizontal guide rail 51 is arranged on the inner top surface of the transfer channel 3, a hanging plate 52 is vertically and slidably installed on the bottom surface of the first horizontal guide rail 51, a second horizontal guide rail 53 is slidably arranged at the bottom end of the hanging plate 52, a rack 531 is arranged on the surface of the second horizontal guide rail 53, a third motor 54 for driving the second horizontal guide rail 53 to translate is arranged on the side wall of the bottom end of the hanging plate 52, a fourth motor 55 is slidably installed on the bottom surface of the second horizontal guide rail 53, the output end of the fourth motor 55 is connected to a double-headed screw seat 56, fifth driving rods 57 are symmetrically and slidably installed at the bottom of the double-headed screw seat 56, a third rectangular insertion tube 58 is arranged at the bottom end of the fifth driving rod 57, and the third rectangular insertion tube 58 is in fit connection with the insertion plate.

[0068] In the above solution: The material transfer assembly is designed as a three-stage translation structure to meet the needs of loading and unloading of two groups of grinding assemblies. The hanging plate moves along the first horizontal guide rail, the third motor can drive the second horizontal guide rail for secondary horizontal movement, the fourth motor can perform tertiary horizontal movement along the second horizontal guide rail, the fourth motor can drive the double-headed screw seat to rotate to switch the third rectangular insertion tube to be docked with any two groups of insertion plates, and the fifth driving rod can drive the third rectangular insertion tube to descend, and then the fifth driving rod moves synchronously along the double-headed screw seat to achieve the docking of the crystal ring.

[0069] In this embodiment, the thickness detection assembly 6 includes a top frame body 61, a bottom frame body 63, thickness detection probes 62 and a reference plate 64. The top frame body 61 is arranged on the top of the conveying track 31, multiple groups of thickness detection probes 62 are arranged on the bottom surface of the top frame body 61, the bottom frame body 63 is arranged at the bottom of the conveying track 31, multiple groups of reference plates 64 are arranged on the surface of the bottom frame body 63, and each group of reference plates 64 corresponds to a group of thickness detection probes 62.

[0070] In the above solution: The ground wafer is conveyed by the clamping assembly to below the thickness detection probes. During the passing process, multiple groups of thickness detection probes can linearly fit and detect on the surface of the wafer to achieve multi-point comprehensive detection, so as to quickly judge whether the thickness of the wafer is qualified without separate detection. The reference plate can be used as the adjustment basis for the side head probe.

[0071] In this embodiment, the two ends of the base frame 63 are rotatably connected to the vertical plates 65 and a fifth motor 66 is installed at the rotating connection. Adsorption holes 641 are provided on the surface of the reference plate 64. A waste box 67 is provided on the bottom surface of the transfer channel 3. The inner wall of the waste box 67 is symmetrically provided with vertical slide rails 68. The bottom end of the vertical plate 65 is slidably embedded in the vertical slide rail 68.

[0072] In the above scheme: when the thickness of a wafer is detected to be unqualified, the adsorption hole can adsorb and position the wafer from the bottom, and then the clamping assembly is unlocked, the vertical plate moves downward along the vertical slide rail, and the fifth motor drives the wafer to rotate so that the reference plate is located above. Subsequently, the vertical plate continues to descend, causing the wafer to fall into the waste box. After placement, the adsorption hole no longer adsorbs.

[0073] The top of the eighth drive rod 78 is provided with a resistance ring frame 79, which is relatively fitted to the outside of the wafer ring. The outside of the film-releasing wheel 73 is wound with a protective tape 8, and the bottom surface of the protective tape 8 is coated with release paper. The recovery wheel 75 is used to roll up the release paper; the ring cutter 77 is used to open a blocking film 81 on the protective tape 8, and the blocking film 81 is provided with a glue layer 82.

[0074] In the above scheme: during lamination, the film-releasing wheel releases the protective tape, the release paper is rolled up on the recovery wheel, and the new protective tape is placed above the wafer ring. The sixth driving rod drives the film-releasing wheel and the film-recovering wheel to descend, and the eighth driving rod drives the contact ring frame to move upward. The contact ring frame is placed on the outside of the wafer ring, and the adhesive layer of the protective tape is bonded to the wafer ring. Then the seventh driving rod drives the circular cutter to move downward and contact the contact ring frame, and the circular cutter cuts a circular barrier film in the protective tape.

[0075] In this embodiment, the film tearing assembly 9 includes a hanging plate 91, and a fourth driving rod 92 is vertically provided on the bottom surface of the hanging plate 91. The bottom end of the fourth driving rod 92 is connected to the third horizontal guide rail 93. The bottom surface of the third horizontal guide rail 93 is slidably installed with a film tearing clamp 94, which is used to clamp the front end protruding part of the used blocking film 81.

[0076] In the above solution, when tearing the film, the film tearing claw clamps the front end protruding part of the blocking film, and then the fourth driving rod drives the film tearing claw to move upward, and the fourth driving rod then moves along the third transverse guide rail to tear off the blocking film.

[0077] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0078] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automated semiconductor grinding device, characterized in that, Including: Transfer channel; Grinding assemblies, symmetrically arranged at both ends of the transfer channel, and the two sets of grinding assemblies are used to grind and thin the two sides of the wafer respectively; The grinding assembly includes a main box body. At the inner top of the main box body, a liftable grinding disc is installed. At the inner bottom of the main box body, a lower seat body is provided. In the middle of the surface of the lower seat body, a support plate is provided. At the top of the support plate, a restraint assembly and a liquid spraying pipe are installed. On the outer side of the main box body, a cutting fluid recovery tank is installed. The side part of the restraint assembly is communicated with the cutting fluid recovery tank, and the outlet end of the cutting fluid recovery tank is communicated with the liquid spraying pipe; Flushing assembly, slidably installed inside the main box body, and the flushing assembly is used to seal and remove the residual liquid on the upper surface of the wafer for subsequent film coating; Crystal ring, with a wafer clamped and positioned inside it. A blocking film is attached to one side of the crystal ring. The area of the blocking film is larger than that of the crystal ring. Four groups of insertion plates are arranged in an annular array on the outer wall of the crystal ring; Conveyor tracks, symmetrically arranged inside the transfer channel. The area between the two sets of conveyor tracks is the processing area. The processing area, along the conveying direction, is successively the loading position, the first processing position, the second processing position, the third processing position, and the unloading position. On the outer wall of the conveyor track, multiple sets of clamping assemblies are provided, and the clamping assemblies are cooperatively docked with the insertion plates of the crystal ring; Material transfer assembly, installed at the loading position inside the transfer channel, and the material transfer assembly is used to transfer the wafer in one set of grinding assemblies to the conveyor track and then transfer the wafer to the other set of grinding assemblies; Thickness detection assembly, installed at the first processing position in the processing area, and the thickness detection assembly is used to detect the thickness of the wafer and output unqualified wafers; Film coating assembly, installed at the second processing position in the processing area, and the film coating assembly is used to cover the blocking film on the upper surface of the crystal ring; Film tearing assembly, installed at the third processing position in the processing area, and the film tearing assembly is used to tear off the used blocking film on the crystal ring.

2. An automated semiconductor grinding device according to claim 1, characterized in that: The flushing assembly includes a cutting fluid cleaning agent storage tank, a sealing cover, a second driving rod, and a vertical guide rail. The vertical guide rail is arranged on the inner side surface of the main box body. The inner end of the second driving rod is vertically and slidably inserted into the vertical guide rail. The second driving rod is horizontally arranged. The output end of the second driving rod is connected to the horizontally arranged sealing cover. The opening of the sealing cover faces downward. On the inner side surface of the sealing cover, a liquid spraying head is provided. On the inner top of the sealing cover, two jet plates are symmetrically and slidably arranged. The cutting fluid cleaning agent storage tank is arranged on the outer wall of the main box body. The cutting fluid cleaning agent storage tank is communicated with the sealing cover through a conduit; when flushing the wafer, the sealing cover is hermetically docked on the crystal ring to form a closed cleaning cavity; the liquid spraying head discharges the cutting fluid cleaning agent obliquely downward to flush the wafer, and the cutting fluid cleaning agent in the sealing cover is intermittently pumped out; the two jet plates move horizontally in opposite directions to air-dry the wafer.

3. An automated semiconductor grinding device according to claim 2, characterized in that: The restraint assembly includes a restraint frame and a first driving rod. The restraint frame is annular, arranged on the surface of the lower seat body, spaced outside the support plate, and a liquid guiding cavity is left between the restraint frame and the support plate. On the outer wall of the restraint frame, the first driving rods are symmetrically installed. At the inner end of the first driving rod, a first rectangular insertion tube is provided, and the first rectangular insertion tube is cooperatively inserted into the insertion plate; the side part of the restraint frame is communicated with the cutting fluid recovery tank through a liquid extraction pump.

4. An automated semiconductor grinding device according to claim 3, characterized in that: The clamping assembly includes a base, a third driving rod, and a second motor. The bases are symmetrically arranged on two sets of conveying tracks. Inside each base, a third driving rod is rotatably installed, and a second motor is installed at the rotation connection. The output end of the third driving rod is connected to a second rectangular insertion tube, and the second rectangular insertion tube is inserted and matched with the insertion plate; the second motor is used to drive the third driving rod to rotate self - to change the orientation of the wafer.

5. An automated semiconductor grinding device according to claim 4, characterized in that: The material transfer assembly includes a first horizontal guide rail, which is arranged on the inner top surface of the transfer channel. A hanging plate is vertically slidably installed on the bottom surface of the first horizontal guide rail. A second horizontal guide rail is slidably arranged at the bottom end of the hanging plate. A rack is arranged on the surface of the second horizontal guide rail. A third motor for driving the second horizontal guide rail to translate is arranged on the bottom side wall of the hanging plate. A fourth motor is slidably installed on the bottom surface of the second horizontal guide rail. The output end of the fourth motor is connected to a double - headed screw seat. Fifth driving rods are symmetrically slidably installed at the bottom of the double - headed screw seat. A third rectangular insertion tube is arranged at the bottom end of the fifth driving rod, and the third rectangular insertion tube is inserted and matched with the insertion plate.

6. An automated semiconductor grinding device according to claim 5, characterized in that: The thickness detection assembly includes a top frame body, a bottom frame body, thickness measurement probes, and reference plates. The top frame body is arranged on the top of the conveying track. Multiple groups of thickness measurement probes are arranged on the bottom surface of the top frame body. The bottom frame body is arranged at the bottom of the conveying track. Multiple groups of reference plates are arranged on the surface of the bottom frame body, and each group of reference plates corresponds to a group of thickness measurement probes.

7. An automated semiconductor grinding device according to claim 6, characterized in that: Both ends of the bottom frame body are rotatably connected to vertical plates, and a fifth motor is installed at the rotation connection. Suction holes are opened on the surface of the reference plate. A waste box is arranged on the bottom surface of the transfer channel. Vertical slide rails are symmetrically arranged on the inner wall of the waste box. The bottom end of the vertical plate is slidably embedded in the vertical slide rail.

8. An automated semiconductor grinding device according to claim 7, characterized in that: The film - covering assembly includes a film - releasing wheel, a film - winding wheel, a recycling wheel, a cutting knife, a top plate, and a bottom plate. Sixth driving rods are installed at both ends of the bottom surface of the top plate. The bottom ends of the two groups of sixth driving rods are respectively connected to the film - releasing wheel and the film - winding wheel. A recycling wheel is installed on the side of the film - releasing wheel. A seventh driving rod is arranged in the middle of the bottom surface of the top plate, and the bottom end of the seventh driving rod is connected to the cutting knife. An eighth driving rod is vertically arranged on the top surface of the bottom plate, and a contact ring frame is arranged at the top end of the eighth driving rod. The contact ring frame is relatively attached to the outside of the crystal ring. A protective belt is wound outside the film - releasing wheel, and a release paper is laminated on the bottom surface of the protective belt. The recycling wheel is used to wind the release paper; the cutting knife is used to cut out a film - blocking portion on the protective belt, and an adhesive layer is arranged on the film - blocking portion.

9. An automated semiconductor grinding device according to claim 8, characterized in that: The film - tearing assembly includes a hanging plate. A fourth driving rod is vertically arranged on the bottom surface of the hanging plate. The bottom end of the fourth driving rod is connected to a third horizontal guide rail. A film - tearing jaw is slidably installed on the bottom surface of the third horizontal guide rail. The film - tearing jaw is used to clamp the front - end extension of the used film - blocking portion.

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