A semiconductor chip thinning and grinding device and grinding process

Abstract

The present invention relates to the technical field of semiconductor chip packaging grinding discs, specifically to a semiconductor chip thinning and grinding equipment and grinding process, comprising a swing mechanism, a pedestal, a stabilizing frame, a grinding mechanism and a grinding table, the swing mechanism comprising a motor, a turntable and a swing frame, the motor is fixedly mounted on the upper surface of the pedestal, the turntable is fixedly connected to the output end of the motor, a rotating rod is rotated on the upper surface of the turntable, the rotating rod is eccentrically arranged, one end of the swing frame is fixedly connected to the upper end of the rotating rod, the grinding mechanism is mounted on the other end of the swing frame, the stabilizing frame comprises a stabilizing rod and two brackets, the two brackets are respectively arranged on the left and right sides of the swing frame, the stabilizing rod slides between the two brackets in the horizontal front-back direction, the swing frame and the stabilizing rod are slidably connected in the horizontal left-right direction, and a multi-directional clamping mechanism for clamping a substrate is provided in the grinding table. The problem that the chip may be damaged in the process of thinning and grinding the chip using the current grinding equipment is solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip packaging grinding sheets, and in particular to a semiconductor chip thinning grinding device and a grinding process. Background Art

[0002] Wafer thinning is an important step in the semiconductor device manufacturing process. Its main function is to thin the silicon material so that the chip can be processed and packaged, and it can also improve the performance and reliability of the chip. This process includes the selection of suitable wafers, grinding, cleaning, flatness measurement and inspection, etc.

[0003] In the process of thinning and grinding chips using current grinding equipment, damage may be caused to the chip surface, such as indentations, slip marks, etc. The chip may also become brittle or bend due to mechanical stress. In addition, if the thinning and grinding process is not properly controlled, it may also lead to uneven chip thickness, affecting the consistency of devices in the entire batch of wafers. Summary of the invention

[0004] The present invention provides a semiconductor chip thinning and grinding device and a grinding process, which solves the problem that the chip may be damaged during the process of thinning and grinding the chip using the current grinding device.

[0005] To achieve the above-mentioned purpose, the present invention provides a semiconductor chip thinning and grinding device and a grinding process, comprising a swing mechanism, a platform, a stabilizing frame, a grinding mechanism and a grinding table;

[0006] The swing mechanism comprises a motor 1, a turntable 1 and a swing frame;

[0007] The motor 1 is fixedly mounted on the upper surface of the base 1, the turntable 1 is fixedly connected to the output end of the motor 1, a rotating rod is rotatably arranged on the upper surface of the turntable 1, and the rotating rod is eccentrically arranged;

[0008] One end of the swing frame is fixedly connected to the upper end of the rotating rod, the grinding mechanism is installed at the other end of the swing frame, and the grinding table is arranged below the grinding mechanism;

[0009] The stabilizing frame comprises a stabilizing rod and two brackets, the two brackets are respectively arranged on the left and right sides of the swing frame, the stabilizing rod slides between the two brackets along the horizontal front-back direction, and the swing frame is slidably connected with the stabilizing rod along the horizontal left-right direction;

[0010] The grinding table is provided with a multi-directional clamping mechanism for clamping the substrate.

[0011] Preferably, the swing frame includes an upper swing rod and a lower swing rod;

[0012] The fixed end of the lower swing rod is fixed to the upper end of the rotating rod, a connecting column is fixed to the upper surface of the fixed end of the lower swing rod, and the fixed end of the upper swing rod is fixedly connected to the upper end of the connecting column;

[0013] A support rod is fixed between the upper swing rod and the lower swing rod, and the support rod is slidably connected with the stabilizing rod along the horizontal left-right direction.

[0014] Preferably, a slide rod is fixed to the lower surface of the free end of the upper swing rod, the slide rod is perpendicular to the upper swing rod, and the grinding mechanism slides on the lower surface of the slide rod in a horizontal left-right direction.

[0015] Preferably, the grinding mechanism comprises a moving rod, a lifter, a grinding motor and a grinding disc;

[0016] One end of the moving rod slides on the lower surface of the slide rod, and the lifter is fixed on the lower surface of the other end of the moving rod;

[0017] The grinding motor is fixed at the output end of the lifter, and the grinding disc is fixedly connected to the output end of the grinding motor.

[0018] Preferably, it also includes a second pedestal and a push-pull driving mechanism capable of driving the moving rod to slide;

[0019] A second turntable is rotatably arranged on the upper surface of the second pedestal, and the push-pull driving mechanism is installed on the upper surface of the second turntable. The push-pull driving mechanism is eccentrically arranged.

[0020] Preferably, the push-pull driving mechanism comprises a synchronous connecting rod, a push-pull rod, a fixing ring, a second motor and a third turntable;

[0021] The fixing ring is fixed on the upper surface of the second rotating disk, the fixing ring is eccentrically arranged, and the second motor is fixed in the fixing ring;

[0022] The turntable 3 is fixed to the output end of the motor 2, one end of the push-pull rod rotates on the upper surface of the turntable 3, one end of the push-pull rod connected to the turntable 3 is eccentrically arranged, and the other end of the push-pull rod is rotatably connected to the sliding end of the moving rod;

[0023] One end of the synchronous connecting rod is fixedly connected to the free end of the lower swing rod, and the other end of the synchronous connecting rod is fixed with a swivel, and the swivel is rotatably connected to the fixed ring.

[0024] Preferably, the grinding table is a thin-walled cavity structure, and the grinding table is a cube;

[0025] The top wall of the grinding table is provided with four sliding holes, each of which corresponds to four sides of the top wall of the grinding table, and the sliding holes are perpendicular to the edge of the top wall of the grinding table;

[0026] A mounting plate is arranged inside the grinding table.

[0027] Preferably, the multi-directional clamping mechanism comprises a multi-directional push-pull mechanism, two clamping assemblies 1 and two clamping assemblies 2, the two clamping assemblies 1 slide on the left and right sides of the multi-directional push-pull mechanism respectively, and the two clamping assemblies 2 slide on the front and rear sides of the multi-directional clamping mechanism respectively;

[0028] The multi-directional push-pull mechanism comprises a multi-directional slide seat and a multi-directional push-pull frame;

[0029] The multi-directional slide seat comprises a slide plate 1 and two slide plates 2, the slide plate 2 is L-shaped, the vertical parts of the two slide plates 2 are respectively fixed to the two sides of the slide plate 1, the slide plate 2 is staggered up and down with the slide plate 1, the slide plate 2 is higher than the slide plate 1, the slide plate 1 is fixed to the upper surface of the mounting plate, and the two slide plates 2 and the slide plate 1 form a cross shape;

[0030] The multi-directional push-pull frame includes a rotating column, a driving rod 1, a driving rod 2 and a connecting rod, the driving rod 1 and the driving rod 2 are respectively provided with two, the two driving rods 1 and the two driving rods 2 are fixed to the circumferential side of the rotating column, the axes of the two driving rods 1 coincide, the axes of the two driving rods 2 coincide, the driving rod 1 is perpendicular to the axes of the driving rod 2, the driving rod 1 is located at the upper end of the rotating column, the driving rod 2 is located at the lower end of the rotating column, four connecting rods are provided, and one end of the four connecting rods is rotatably connected to the free ends of the two driving rods 1 and the free ends of the two driving rods 2 respectively.

[0031] Preferably, the clamping assembly 1 comprises a clamping arm 1 and a clamping plate 1;

[0032] The clamping arm 1 is arranged vertically, the lower end of the clamping arm 1 slides on the upper surface of the slide plate 1 and is rotatably connected to the free end of the connecting rod, and the clamping plate 1 is fixed to the upper end of the clamping arm 1;

[0033] The second clamping assembly comprises a second clamping arm and a second clamping plate;

[0034] The second clamping arm is vertically arranged, the lower end of the second clamping arm slides on the upper surface of the second slide plate and is rotatably connected to the free end of the connecting rod, and the second clamping plate is fixed to the upper end of the second clamping arm;

[0035] The clamping plate 1 and the clamping plate 2 are both arranged on the upper surface of the grinding table, the two clamping arms 1 and the two clamping arms 2 correspond to the four sliding holes respectively, and the upper ends of the two clamping arms 1 and the upper ends of the two clamping arms 2 slide in the corresponding sliding holes respectively;

[0036] Both ends of the clamping plate 1 are provided with slots;

[0037] Both ends of the second clamping plate are provided with insert blocks;

[0038] A forward and reverse motor is installed in the bottom wall of the grinding table, and the output shaft of the forward and reverse motor passes through the mounting plate and the slide plate 1. The output shaft of the forward and reverse motor rotates relative to the mounting plate and the slide plate 1, and the rotating column is fixedly connected to the output shaft of the forward and reverse motor.

[0039] The grinding process of the semiconductor chip thinning and grinding equipment comprises the following steps:

[0040] S1: first fix the substrate on the grinding table through a multi-directional clamping mechanism;

[0041] S2: placing a plurality of wafers on the substrate, with the backside of the wafers facing upward;

[0042] S3: starting the grinding mechanism;

[0043] S4: starting the motor 1 to make the grinding mechanism rotate around the multiple wafers and grind the multiple wafers at the same time;

[0044] S5: After the wafer is ground, take out the wafer.

[0045] The present invention has the following beneficial effects:

[0046] 1. The grinding disc in the grinding equipment rotates around the substrate and the wafer, so that the grinding disc will not completely press the wafer for grinding, which makes the bottom surface of the grinding disc and the back of the wafer always in an incomplete contact state. The contact point between the bottom surface of the grinding disc and the back of the wafer is always in a changing state, which avoids the stress concentration phenomenon of the grinding disc on the wafer, causing the wafer to crack or bend. At the same time, the grinding range of the grinding disc is increased, and multiple wafers can be ground at one time, which improves the grinding efficiency of the wafer;

[0047] 2. The stabilizing frame can make the swing frame swing stably, preventing the swing frame from rotating around the axis of the rotating rod, thereby affecting the grinding efficiency;

[0048] 3. When the moving rod slides from the end of the slide rod away from the pedestal 2 to the end close to the pedestal 2, the reciprocating distance of the grinding disc in the left and right directions is extended, thereby further increasing the grinding range of the grinding disc, and further increasing the number of wafers ground at one time, further improving the grinding efficiency. At the same time, since the grinding disc continuously changes the trajectory of the reciprocating rotation, it can reduce the situation of missed grinding and improve the grinding quality of the wafer;

[0049] 4. The two clamping plates 1 and 2 in the grinding equipment can realize synchronous movement and stably fix the substrate to prevent the substrate from slipping and affecting the grinding efficiency. At the same time, the insert block cooperates with the slot to make the clamping plate 1 and the clamping plate 2 clamp the substrate more stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a schematic diagram of the overall structure of the semiconductor chip thinning and grinding equipment according to the present invention;

[0051] Figure 2 It is a structural schematic diagram of the swing mechanism in the semiconductor chip thinning and grinding equipment of the present invention;

[0052] Figure 3 It is a schematic diagram of the connection between the push-pull driving mechanism and the grinding mechanism in the semiconductor chip thinning and grinding equipment of the present invention;

[0053] Figure 4 for Figure 3 A in the enlarged view;

[0054] Figure 5 It is a schematic diagram of the connection between the moving rod and the slide rod and the push-pull rod in the semiconductor chip thinning and grinding equipment of the present invention;

[0055] Figure 6 It is a schematic structural diagram of a grinding table in the semiconductor chip thinning and grinding equipment of the present invention;

[0056] Figure 7 It is a schematic diagram of the internal structure of the grinding table in the semiconductor chip thinning and grinding equipment of the present invention;

[0057] Figure 8 for Figure 7 The enlarged view of point B in the figure;

[0058] Fig. 9 It is a schematic diagram of the bottom structure inside the grinding table of the semiconductor chip thinning and grinding equipment of the present invention;

[0059] Fig.10 It is a structural schematic diagram of the multi-directional clamping mechanism in the semiconductor chip thinning and grinding equipment of the present invention;

[0060] Fig.11It is a schematic structural diagram of a multi-directional push-pull frame in the semiconductor chip thinning and grinding equipment of the present invention;

[0061] Fig.12 The figure is a schematic diagram of the installation of the substrate in the semiconductor chip thinning and grinding equipment described in the present invention.

[0062] In the figure, 1 is a pedestal; 2 is a swing mechanism; 21 is a motor; 22 is a turntable; 23 is a rotating rod; 24 is an upper swing rod; 25 is a lower swing rod; 26 is a connecting column; 27 is a support rod; 28 is a slide rod; 3 is a grinding table; 31 is a sliding hole; 32 is a mounting plate; 4 is a pedestal; 41 is a turntable; 5 is a grinding mechanism; 51 is a moving rod; 52 is a lifter; 53 is a grinding motor; 54 is a grinding disc; 6 is a push-pull driving mechanism; 61 is a synchronous connecting rod; 62 is a push-pull rod; 63 is a motor; 64 is a fixed ring; 65 is a rotating ring; 66 is a turntable; ;7. Stabilizing frame;71. Bracket;72. Stabilizing rod;8. Clamping assembly one;81. Clamping arm one;82. Clamping plate one;821. Slot;9. Clamping assembly two;91. Clamping arm two;92. Clamping plate two;921. Insert block;100. Multi-directional push-pull mechanism;110. Multi-directional slide seat;111. Slide plate one;112. Slide plate two;120. Multi-directional push-pull frame;121. Rotating column;122. Driving rod one;123. Driving rod two;124. Connecting rod;200. Forward and reverse motor;300. Base plate;301. Placement slot. DETAILED DESCRIPTION

[0063] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0064] The present invention provides a semiconductor chip thinning and grinding device, such as Figure 1 and Figure 2 As shown, it includes a swing mechanism 2, a base 1, a stabilizing frame 7, a grinding mechanism 5 and a grinding table 3. The swing mechanism 2 includes a motor 21, a turntable 22 and a swing frame. The motor 21 is fixedly mounted on the upper surface of the base 1, the turntable 22 is fixedly connected to the output end of the motor 21, a rotating rod 23 is rotatably arranged on the upper surface of the turntable 22, the rotating rod 23 is eccentrically arranged, one end of the swing frame is fixedly connected to the upper end of the rotating rod 23, the grinding mechanism 5 is installed at the other end of the swing frame, the grinding table 3 is arranged below the grinding mechanism 5, the stabilizing frame 7 includes a stabilizing rod 72 and two brackets 71, the two brackets 71 are respectively arranged on the left and right sides of the swing frame, the stabilizing rod 72 slides between the two brackets 71 along the horizontal front and rear direction, the swing frame and the stabilizing rod 72 are slidably connected along the horizontal left and right directions, and a multi-directional clamping mechanism for clamping the substrate 300 is provided in the grinding table 3.

[0065] like Figure 2As shown, the swing frame includes an upper swing rod 24 and a lower swing rod 25, the fixed end of the lower swing rod 25 is fixed to the upper end of the rotating rod 23, a connecting column 26 is fixed to the upper surface of the fixed end of the lower swing rod 25, the fixed end of the upper swing rod 24 is fixedly connected to the upper end of the connecting column 26, a support rod 27 is fixed between the upper swing rod 24 and the lower swing rod 25, and the support rod 27 is connected to the stabilizing rod 72 in a horizontal left-right sliding direction.

[0066] like Figure 1 and Figure 2 As shown, the bracket 71 is inverted U-shaped, and the stabilizing rod 72 slides between the horizontal parts of the two brackets 71 along the horizontal front-to-back direction.

[0067] like Figure 3 As shown, a slide rod 28 is fixed to the lower surface of the free end of the upper swing rod 24, the slide rod 28 is perpendicular to the upper swing rod 24, and the grinding mechanism 5 slides on the lower surface of the slide rod 28 in the horizontal left and right direction.

[0068] like Figure 3 As shown, the grinding mechanism 5 includes a moving rod 51, a lifter 52, a grinding motor 53 and a grinding disc 54. One end of the moving rod 51 slides on the lower surface of the slide rod 28, and the lifter 52 is fixed on the lower surface of the other end of the moving rod 51. The lifter 52 adopts a hydraulic cylinder or a pneumatic cylinder. The output end of the lifter 52 faces downward, the grinding motor 53 is fixed on the output end of the lifter 52, and the grinding disc 54 is fixedly connected to the output end of the grinding motor 53.

[0069] like Figure 3 As shown, it also includes a base 2 4 and a push-pull driving mechanism 6 capable of driving the moving rod 51 to slide;

[0070] A turntable 41 is rotatably provided on the upper surface of the pedestal 4 , and a push-pull driving mechanism 6 is installed on the upper surface of the turntable 41 . The push-pull driving mechanism 6 is eccentrically arranged.

[0071] like Figure 3 , Figure 4 and Figure 5 As shown, the push-pull drive mechanism 6 includes a synchronous connecting rod 61, a push-pull rod 62, a fixed ring 64, a motor two 63 and a turntable three 66. The fixed ring 64 is fixed on the upper surface of the turntable two 41, and the fixed ring 64 is eccentrically arranged. The motor two 63 is fixed in the fixed ring 64. The turntable three 66 is fixed at the output end of the motor two 63. One end of the push-pull rod 62 rotates on the upper surface of the turntable three 66. The end of the push-pull rod 62 connected to the turntable three 66 is eccentrically arranged. The other end of the push-pull rod 62 is rotatably connected to the sliding end of the moving rod 51. One end of the synchronous connecting rod 61 is fixedly connected to the free end of the lower swing rod 25. The other end of the synchronous connecting rod 61 is fixed with a swivel 65, and the swivel 65 is rotatably connected to the fixed ring 64.

[0072] When grinding the wafer, the grinding motor 53 is started, and the grinding motor 53 and the grinding disc 54 are lowered by the lifter 52, so that the lower surface of the grinding disc 54 contacts the back side of the wafer, and then the motor 1 21 and the motor 2 63 are started, the motor 1 21 drives the turntable 1 22 to rotate, the turntable 1 22 drives the rotating rod 23 to rotate around the axis of the turntable 1 22, the rotating rod 23 drives the lower swing rod 25 to rotate, the lower swing rod 25 drives the upper swing rod 24 to rotate through the connecting column 26, the support rod 27 slides in the left and right direction relative to the stabilizing rod 72, and the support rod 27 The stabilizing rod 72 is driven to slide in the front-rear direction, and the stabilizing frame 7 can make the swing frame swing stably to prevent the swing frame from rotating around the axis of the rotating rod 23, thereby affecting the grinding efficiency. The upper swing rod 24 drives the slide rod 28 and the grinding mechanism 5 to rotate. At the same time, the lower swing rod 25 drives the motor 2 63 to rotate synchronously around the center of the turntable 2 41 through the synchronous connecting rod 61. The fixed ring 64 and the rotating ring 65 rotate relatively. Since the grinding disc 54 rotates around the substrate 300 and the wafer, the grinding disc 54 will not completely press the wafer for grinding. The bottom surface of the grinding disc 54 and the back surface of the wafer are always in an incomplete contact state, and the contact point between the bottom surface of the grinding disc 54 and the back surface of the wafer is always in a changing state, which avoids the stress concentration phenomenon caused by the grinding disc 54 on the wafer, causing the wafer to crack or bend. At the same time, the grinding range of the grinding disc 54 is increased, and multiple wafers can be ground at one time, thereby improving the grinding efficiency of the wafer. The motor 2 63 drives the turntable 3 66 to rotate, and the turntable 3 66 drives one end of the push-pull rod 62 to rotate around the center of the turntable 3 66, and the other end of the push-pull rod 62 drives The moving rod 51 slides on the bottom surface of the slide rod 28, and the grinding disc 54 also moves therewith. In this way, when the moving rod 51 slides from the end of the slide rod 28 away from the base 24 to the end close to the base 24, the reciprocating movement distance of the grinding disc 54 in the left and right directions is extended, thereby further increasing the grinding range of the grinding disc 54, which can further increase the number of wafers ground at one time and further improve the grinding efficiency. At the same time, since the grinding disc 54 constantly changes the trajectory of the reciprocating rotation, it can reduce the situation of missed grinding and improve the grinding quality of the wafer.

[0073] like Figure 6 and Figure 7 As shown, the grinding table 3 is a thin-walled cavity structure, and the grinding table 3 is a cube. Four sliding holes 31 are opened on the top wall of the grinding table 3, each sliding hole 31 corresponds to the four sides of the top wall of the grinding table 3, and the sliding hole 31 is perpendicular to the edge of the top wall of the grinding table 3. A mounting plate 32 is provided inside the grinding table 3.

[0074] like Figure 7 As shown, the multi-directional clamping mechanism includes a multi-directional push-pull mechanism 100, two clamping assemblies 1 8 and two clamping assemblies 2 9. The two clamping assemblies 1 8 slide on the left and right sides of the multi-directional push-pull mechanism 100 respectively, and the two clamping assemblies 2 9 slide on the front and rear sides of the multi-directional clamping mechanism respectively.

[0075] like Fig.10 and Fig.11 As shown, the multi-directional push-pull mechanism 100 includes a multi-directional slide seat 110 and a multi-directional push-pull frame 120;

[0076] The multi-directional slide seat 110 includes a slide plate 111 and two slide plates 112. The slide plates 112 are L-shaped. The vertical parts of the two slide plates 112 are respectively fixed to the two sides of the slide plate 111. The slide plates 112 and 111 are staggered up and down. The slide plates 112 are higher than the slide plates 111. The slide plates 111 are fixed to the upper surface of the mounting plate 32. The two slide plates 112 and the slide plates 111 form a cross.

[0077] like Fig.11 As shown, the multi-directional push-pull frame 120 includes a rotating column 121, a driving rod 122, a driving rod 123 and a connecting rod 124. There are two driving rods 122 and two driving rods 123 respectively. The two driving rods 122 and the two driving rods 123 are fixed to the peripheral side of the rotating column 121, the axes of the two driving rods 122 coincide, the axes of the two driving rods 123 coincide, the driving rod 122 is perpendicular to the axes of the driving rod 2 123, the driving rod 122 is located at the upper end of the rotating column 121, the driving rod 2 123 is located at the lower end of the rotating column 121, and there are four connecting rods 124, and one end of the four connecting rods 124 is rotatably connected to the free ends of the two driving rods 122 and the free ends of the two driving rods 2 123 respectively.

[0078] like Figure 7 As shown, there is space between the two slideway plates 112 and the two sides of the driving rod 123 .

[0079] like Figure 7 As shown, the clamping assembly 8 includes a clamping arm 81 and a clamping plate 82. The clamping arm 81 is vertically arranged, and the lower end of the clamping arm 81 slides on the upper surface of the slide plate 111 and is rotatably connected to the free end of the connecting rod 124. The clamping plate 82 is fixed to the upper end of the clamping arm 81.

[0080] like Figure 7 As shown, the clamping assembly 2 9 includes a clamping arm 2 91 and a clamping plate 2 92. The clamping arm 2 91 is vertically arranged, and the lower end of the clamping arm 2 91 slides on the upper surface of the slide plate 2 112 and is rotatably connected to the free end of the connecting rod 124. The clamping plate 2 92 is fixed to the upper end of the clamping arm 2 91.

[0081] like Figure 6 and Figure 7As shown, the clamping plate 1 82 and the clamping plate 2 92 are both arranged on the upper surface of the grinding table 3, the two clamping arms 1 81 and the two clamping arms 2 91 correspond to the four sliding holes 31 respectively, and the upper ends of the two clamping arms 1 81 and the upper ends of the two clamping arms 2 91 slide in the corresponding sliding holes 31 respectively.

[0082] like Figure 8 As shown, both ends of the clamping plate 82 are provided with slots 821;

[0083] Insert blocks 921 are provided at both ends of the second clamping plate 92 .

[0084] like Fig. 9 As shown, a forward and reverse motor 200 is installed in the bottom wall of the grinding table 3, and the output shaft of the forward and reverse motor 200 passes through the mounting plate 32 and the slide plate 111. The output shaft of the forward and reverse motor 200 rotates relative to the mounting plate 32 and the slide plate 111, and the rotating column 121 is fixedly connected to the output shaft of the forward and reverse motor 200.

[0085] Start the forward and reverse motor 200, which drives the multi-directional push-pull frame 120 to rotate, and drives the driving rod 122 and the driving rod 2 123 to rotate. The driving rod 1 122 and the driving rod 2 123 respectively drive one end of the corresponding connecting rod 124 to rotate. At this time, the four connecting rods 124 are respectively in a broken line shape with the corresponding driving rod 1 122 and the driving rod 2 123. The other ends of the four connecting rods 124 respectively pull the corresponding clamping arm 1 81 and the clamping arm 2 91 back to the axial direction of the rotating column 121. The clamping arm 1 81 and the clamping arm 2 91 respectively drive the clamping plate 1 82 and the clamping plate 2 92 to slide inward to fix the base plate 300. At this time, the plug block 921 is embedded in the slot 821. In this way, the two clamping plates 1 82 and the two clamping plates 2 92 can move synchronously, and the substrate 300 can be stably fixed to prevent the substrate 300 from slipping and affecting the grinding efficiency. At the same time, the plug block 921 cooperates with the slot 821 to make the clamping plates 1 82 and the clamping plates 2 92 clamp the substrate 300 more stably.

[0086] like Fig.12 As shown, a plurality of placement grooves 301 for fixing wafers are formed on the upper surface of the substrate 300 .

[0087] The grinding process of the semiconductor chip thinning and grinding equipment proposed in this application includes the following steps:

[0088] S1: first fix the substrate 300 on the grinding table 3 through a multi-directional clamping mechanism;

[0089] S2: placing a plurality of wafers on the substrate 300 with the backside of the wafer facing upward;

[0090] S3: Start the grinding mechanism 5;

[0091] S4: starting the motor 21 to make the grinding mechanism 5 rotate around the multiple wafers and grind the multiple wafers at the same time;

[0092] S5: After the wafer is ground, take out the wafer.

[0093] According to the present invention, when grinding a wafer, the grinding motor 53 is started, and the grinding motor 53 and the grinding disc 54 are lowered by the lifter 52, so that the lower surface of the grinding disc 54 contacts the back of the wafer, and then the motor 1 21 and the motor 2 63 are started, the motor 1 21 drives the turntable 1 22 to rotate, the turntable 1 22 drives the rotating rod 23 to rotate around the axis of the turntable 1 22, the rotating rod 23 drives the lower swing rod 25 to rotate, the lower swing rod 25 drives the upper swing rod 24 to rotate through the connecting column 26, and the support rod 27 slides in the left and right direction relative to the stabilizing rod 72 At the same time, the support rod 27 drives the stabilizing rod 72 to slide in the front-rear direction, the upper swing rod 24 drives the slide rod 28 and the grinding mechanism 5 to rotate, and at the same time, the lower swing rod 25 drives the motor 2 63 to rotate synchronously around the center of the turntable 2 41 through the synchronous connecting rod 61, the fixed ring 64 and the rotating ring 65 rotate relatively, the motor 2 63 drives the turntable 3 66 to rotate, the turntable 3 66 drives one end of the push-pull rod 62 to rotate around the center of the turntable 3 66, and the other end of the push-pull rod 62 drives the moving rod 51 to slide on the bottom surface of the slide rod 28, and the grinding disc 54 also moves accordingly;

[0094] Start the forward and reverse motor 200, which drives the multi-directional push-pull frame 120 to rotate, and drives the driving rod 122 and the driving rod 2 123 to rotate. The driving rod 1 122 and the driving rod 2 123 respectively drive one end of the corresponding connecting rod 124 to rotate. At this time, the four connecting rods 124 are respectively in a broken line shape with the corresponding driving rod 1 122 and the driving rod 2 123. The other ends of the four connecting rods 124 respectively pull the corresponding clamping arm 1 81 and the clamping arm 2 91 back to the axial direction of the rotating column 121. The clamping arm 1 81 and the clamping arm 2 91 respectively drive the clamping plate 1 82 and the clamping plate 2 92 to slide inward to fix the base plate 300. At this time, the plug block 921 is embedded in the slot 821 to complete the fixation of the base plate 300.

[0095] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A semiconductor chip thinning and grinding device, characterized in that: It comprises a swing mechanism (2), a base (1), a stabilizing frame (7), a grinding mechanism (5) and a grinding table (3); The swing mechanism (2) comprises a motor (21), a turntable (22) and a swing frame; The motor 1 (21) is fixedly mounted on the upper surface of the pedestal 1 (1), the turntable 1 (22) is fixedly connected to the output end of the motor 1 (21), a rotating rod (23) is rotatably arranged on the upper surface of the turntable 1 (22), and the rotating rod (23) is eccentrically arranged; One end of the swing frame is fixedly connected to the upper end of the rotating rod (23), the grinding mechanism (5) is installed at the other end of the swing frame, and the grinding table (3) is arranged below the grinding mechanism (5); The stabilizing frame (7) comprises a stabilizing rod (72) and two brackets (71), the two brackets (71) are respectively arranged on the left and right sides of the swing frame, the stabilizing rod (72) slides between the two brackets (71) along the horizontal front-back direction, and the swing frame is slidably connected to the stabilizing rod (72) along the horizontal left-right direction; The grinding table (3) is provided with a multi-directional clamping mechanism for clamping the substrate (300); The swing frame comprises an upper swing rod (24) and a lower swing rod (25); The fixed end of the lower swing rod (25) is fixed to the upper end of the rotating rod (23), a connecting column (26) is fixed to the upper surface of the fixed end of the lower swing rod (25), and the fixed end of the upper swing rod (24) is fixedly connected to the upper end of the connecting column (26); A support rod (27) is fixed between the upper swing rod (24) and the lower swing rod (25), and the support rod (27) is slidably connected to the stabilizing rod (72) in a horizontal left-right direction; A slide rod (28) is fixed to the lower surface of the free end of the upper swing rod (24), the slide rod (28) is perpendicular to the upper swing rod (24), and the grinding mechanism (5) slides on the lower surface of the slide rod (28) in a horizontal left-right direction.

2. The semiconductor chip thinning and grinding equipment according to claim 1, characterized in that: The grinding mechanism (5) comprises a moving rod (51), a lifter (52), a grinding motor (53) and a grinding disc (54); One end of the moving rod (51) slides on the lower surface of the slide rod (28), and the lifter (52) is fixed on the lower surface of the other end of the moving rod (51); The grinding motor (53) is fixed to the output end of the lifter (52), and the grinding disc (54) is fixedly connected to the output end of the grinding motor (53).

3. The semiconductor chip thinning and grinding equipment according to claim 2, characterized in that: It also includes a second pedestal (4) and a push-pull driving mechanism (6) capable of driving the moving rod (51) to slide; A second turntable (41) is rotatably mounted on the upper surface of the second pedestal (4), and the push-pull drive mechanism (6) is mounted on the upper surface of the second turntable (41). The push-pull drive mechanism (6) is eccentrically arranged.

4. The semiconductor chip thinning and grinding equipment according to claim 3, characterized in that: The push-pull driving mechanism (6) comprises a synchronous connecting rod (61), a push-pull rod (62), a fixing ring (64), a second motor (63) and a third rotating disk (66); The fixing ring (64) is fixed on the upper surface of the second rotating disk (41), the fixing ring (64) is eccentrically arranged, and the second motor (63) is fixed inside the fixing ring (64); The turntable three (66) is fixed to the output end of the motor two (63), one end of the push-pull rod (62) rotates on the upper surface of the turntable three (66), one end of the push-pull rod (62) connected to the turntable three (66) is eccentrically arranged, and the other end of the push-pull rod (62) is rotatably connected to the sliding end of the moving rod (51); One end of the synchronous connecting rod (61) is fixedly connected to the free end of the lower swing rod (25), and a rotating ring (65) is fixed to the other end of the synchronous connecting rod (61), and the rotating ring (65) is rotatably connected to the fixed ring (64).

5. The semiconductor chip thinning and grinding equipment according to claim 1, characterized in that: The grinding table (3) is a thin-walled cavity structure, and the grinding table (3) is a cube; The top wall of the grinding table (3) is provided with four sliding holes (31), each of the sliding holes (31) corresponds to four sides of the top wall of the grinding table (3), and the sliding holes (31) are perpendicular to the edge of the top wall of the grinding table (3); The grinding table (3) is provided with a mounting plate (32); The multi-directional clamping mechanism comprises a multi-directional push-pull mechanism (100), two clamping assemblies one (8) and two clamping assemblies two (9), the two clamping assemblies one (8) respectively slide on the left and right sides of the multi-directional push-pull mechanism (100), and the two clamping assemblies two (9) respectively slide on the front and rear sides of the multi-directional clamping mechanism; The multi-directional push-pull mechanism (100) comprises a multi-directional slide seat (110) and a multi-directional push-pull frame (120); The multi-directional slide seat (110) comprises a slide plate 1 (111) and two slide plates 2 (112), the slide plate 2 (112) is L-shaped, the vertical parts of the two slide plates 2 (112) are respectively fixed to the two sides of the slide plate 1 (111), the slide plate 2 (112) and the slide plate 1 (111) are staggered up and down, the slide plate 2 (112) is higher than the slide plate 1 (111), the slide plate 1 (111) is fixed on the upper surface of the mounting plate (32), and the two slide plates 2 (112) and the slide plate 1 (111) form a cross shape; The multi-directional push-pull frame (120) comprises a rotating column (121), a driving rod 1 (122), a driving rod 2 (123) and a connecting rod (124), wherein two driving rods 1 (122) and two driving rods 2 (123) are respectively provided, and the two driving rods 1 (122) and the two driving rods 2 (123) are both fixed to the peripheral side surface of the rotating column (121), the axes of the two driving rods 1 (122) coincide, and the two driving rods 2 (123) are connected to each other. The axes of the driving rod 1 (122) and the driving rod 2 (123) coincide with each other, the axes of the driving rod 1 (122) and the driving rod 2 (123) are perpendicular, the driving rod 1 (122) is located at the upper end of the rotating column (121), the driving rod 2 (123) is located at the lower end of the rotating column (121), four connecting rods (124) are provided, and one end of the four connecting rods (124) is respectively rotatably connected to the free ends of the two driving rods 1 (122) and the free ends of the two driving rods 2 (123); The clamping assembly (8) comprises a clamping arm (81) and a clamping plate (82); The clamping arm (81) is arranged vertically, the lower end of the clamping arm (81) slides on the upper surface of the slide plate (111) and is rotatably connected to the free end of the connecting rod (124), and the clamping plate (82) is fixed to the upper end of the clamping arm (81); The clamping assembly 2 (9) comprises a clamping arm 2 (91) and a clamping plate 2 (92); The second clamping arm (91) is arranged vertically, the lower end of the second clamping arm (91) slides on the upper surface of the second slide plate (112) and is rotatably connected to the free end of the connecting rod (124), and the second clamping plate (92) is fixed to the upper end of the second clamping arm (91); The clamping plate 1 (82) and the clamping plate 2 (92) are both arranged on the upper surface of the grinding table (3), the two clamping arms 1 (81) and the two clamping arms 2 (91) respectively correspond to the four sliding holes (31), and the upper ends of the two clamping arms 1 (81) and the upper ends of the two clamping arms 2 (91) respectively slide in the corresponding sliding holes (31); Both ends of the clamping plate 1 (82) are provided with slots (821); Both ends of the second clamping plate (92) are provided with insert blocks (921); A forward and reverse motor (200) is installed in the bottom wall of the grinding table (3); the output shaft of the forward and reverse motor (200) passes through the mounting plate (32) and the slide plate one (111); the output shaft of the forward and reverse motor (200) rotates relative to the mounting plate (32) and the slide plate one (111); and the rotating column (121) is fixedly connected to the output shaft of the forward and reverse motor (200).

6. A grinding process of a semiconductor chip thinning and grinding device according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1: firstly fix the substrate (300) on the grinding table (3) by means of a multi-directional clamping mechanism; S2: placing a plurality of wafers on the substrate (300), with the back sides of the wafers facing upwards; S3: starting the grinding mechanism (5); S4: starting the motor 1 (21) to make the grinding mechanism (5) rotate around the multiple wafers and grind the multiple wafers at the same time; S5: After the wafer is ground, take out the wafer.

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